Circuit board AOI one-flow production process

Abstract

The invention discloses a circuit board AOI (automatic optical inspection) one-flow production process, which comprises the following steps of: after a circuit is manufactured on a production board, carrying out appearance scanning on the continuously produced production boards one by one by using online AOI, synchronously processing image data obtained by scanning when one-flow production is carried out in a subsequent process, and judging whether the appearance of each production board is qualified or not; and when the production board arrives at the laser marking machine, processing data are provided to the laser marking machine on time (JIT), and the laser marking machine carries out laser marking on the unqualified production board and then conveys the unqualified production board to the next production process. According to the method disclosed by the invention, the unqualified production board is not subjected to maintenance treatment, but is normally subjected to subsequent production flow manufacturing like the qualified production board, so that the purpose of punctualized production is achieved, the production efficiency is improved, and the carrying waste, the stock waste and the scratch risk are reduced.

Description

Technical Field

[0001] The invention relates to the technical field of printed circuit board manufacturing, and in particular to a one-flow production process for circuit board AOI. Background Art

[0002] Printed circuit board (PCB), also known as printed circuit board, printed circuit board, or printed board for short, with the rapid development and popularization of intelligent electronic products, and the continuous development towards thinness and high density, the production and quality requirements of PCB are getting higher and higher, and the PCB wiring is getting denser and denser, which makes the appearance requirements of PCB boards continue to increase. During the production process of printed circuit boards, affected by factors such as production process and circuit board transportation environment, printed circuit gaps, open circuits, residual copper and other problems may occur, resulting in PCBs not being able to work properly. Therefore, AOI inspection of PCB boards is required during the production process of printed circuit boards in order to check defective PCBs, repair and scrap the defective parts, analyze the causes of defects, improve processes, improve PCB quality and reduce scrap rates.

[0003] AOI (Automated Optical Inspection) is a means of achieving automatic inspection through optical system imaging.

[0004] At present, the detection of product defects in the PCB production process usually uses AOI (Automated Optical Inspection) automatic optical inspection and VRS (Verification and Repair Status) manual repair. The process flow is as follows: the PCB board after production is scanned by AOI and then collected by the board collecting machine, and then manually transferred to the inspection area, put on the machine for VRS inspection, and finally manually transferred to browning or solder mask pre-treatment for subsequent processing. The above process has multiple steps of manual handling, manual inspection, and repair, which has slow inspection speed, low work efficiency, and high labor cost, which is not conducive to the just-in-time production and one-flow production of PCB boards.

[0005] Just In Time (JIT) is a production management method. Its core idea is to produce the required products and parts in the required quantity at the required time and place, so as to prevent overproduction, eliminate ineffective labor and waste, and achieve the goal of achieving maximum output with minimum input.

[0006] One-flow production refers to the entire manufacturing process from input to finished product output, in which products are always in a state of non-stagnation, non-pile-up, non-overtaking, and flow one by one in a rhythmic manner. Its meaning includes: after each process completes a product, it flows to the next process immediately; the number of work-in-progress between processes does not exceed the temporary storage number of the previous process; the movement of products is uninterrupted, does not exceed, and does not lag behind; the production process, inspection process and transportation process are integrated.

[0007] The existing AO I inspection, re-inspection, repair and scrapping are independent, and the order is:

[0008] 1. Inner layer circuit-AO I-VRS-scrap treatment-browning-pressing;

[0009] 2. Outer layer circuit-AO I-VRS-scrap treatment-solder mask pre-treatment-solder mask processing.

[0010] The above two AOI front and back processing methods for inner and outer layer lines cannot form continuous production. Because unqualified boards need to be repaired, AOI inspection and VRS are offline. AOI and VRS equipment are not connected to the production line, resulting in the need to collect and store boards between equipment in each independent process, which will cause many scratches and increase the difficulty of management; independent equipment needs to be thoroughly washed and dried before processing, which increases water and energy consumption; there is no rhythm between the equipment, which is not conducive to assembly line production and affects production efficiency.

[0011] Secondly, in the existing two-dimensional AOI inspection, in order to ensure product quality and reduce product quality problems, AOI equipment will adopt very strict judgment standards, resulting in more false positives; in response to this situation, manual re-judgment is often used, specifically, at least one person is required on each device to manually re-judgment to ensure product quality while reducing the manufacturing cost increase caused by strict judgment. However, due to the large workload and long time of manual re-judgment, it is easy to make misjudgments due to fatigue, thus affecting product production quality. Summary of the invention

[0012] In view of the above-mentioned existing technical defects, the present invention provides a one-flow production process for circuit boards AOI, in which production boards that fail AOI detection are not repaired, but are subjected to subsequent production processes as normal like qualified production boards, thereby achieving the purpose of both performing AOI inspection on products and enabling one-flow continuous production without stopping the assembly line, thereby improving production efficiency.

[0013] In order to solve the above technical problems, the present invention provides a one-flow production process of circuit board AO I, comprising the following steps:

[0014] S1. After making the circuit on the production board, use the online AOI to scan the appearance of the continuously produced production boards one by one to obtain the image data of each production board;

[0015] After S2 and AO I scanning, the production board directly enters the inner layer browning or outer layer solder mask pre-treatment process for processing;

[0016] S3, while the production and processing is being carried out in step S2, the image data scanned in step S1 is processed to determine whether the appearance of each produced board is qualified;

[0017] S4, conveying the production boards processed in step S2 to the laser marking machine one by one. When the production boards arrive at the laser marking machine, the data processed in step S3 arrives at the laser marking machine synchronously and on time. The laser marking machine performs laser marking or non-marking according to the result of the scanned data processing;

[0018] The products flow in steps S1, S2, and S4 according to a one-stream production method.

[0019] Furthermore, in step S3, the image data processing process includes: comparing each scanned image with a qualified CAM standard image as an initial AOI judgment to determine whether each image is qualified, and then determining whether the appearance of the production board corresponding to each image is qualified.

[0020] Furthermore, in step S3, the image data processing process also includes: after the AOI initial judgment, using the pre-trained AI detection model to perform AI re-judgment on the unqualified images obtained after the AOI initial judgment, and statistically analyzing the appearance defects of the unqualified images for manual re-judgment, so as to detect, identify and filter out the false points existing in the AI ​​initial judgment, and feed back the results of the manual re-judgment to the AI ​​detection model and the laser marking machine respectively, so as to train the AI ​​detection model to obtain a new AI detection model and serve as the final judgment basis for the laser marking machine to perform laser marking operations.

[0021] Furthermore, in step S4, the laser marking machine performs laser ablation processing on at least one defective point on the corresponding unqualified production board according to the result of manual re-judgment. The laser ablation processing is a marking processing, which burns out the circuit at the defective point to form an open circuit; while the qualified production board directly passes through the laser marking machine and is conveyed to the next production process without any marking operation.

[0022] Furthermore, the AI ​​detection model is trained based on multiple production boards and manual re-judgment results of each production board.

[0023] Furthermore, when the produced board is an inner layer board, the online AOI, browning line and laser marking machine are connected in sequence to form a flow production line.

[0024] Furthermore, after step S4, the following steps are also included:

[0025] S5. The inner layer board, the prepreg sheet and the outer copper foil are sequentially stacked and pressed together as required to form a multilayer board.

[0026] Furthermore, when the production board is an outer layer board or a double-sided board, the online AOI, the solder mask pre-treatment line and the laser marking machine are connected in sequence to form a streamlined production line.

[0027] Furthermore, after step S4, the following steps are also included:

[0028] S5. Make solder mask on the production board.

[0029] Compared with the prior art, the present invention has the following beneficial effects:

[0030] In the present invention, after the circuit is made on the production board and in the process of being forwarded through the production line, the online AOI is directly used on the production line to perform appearance scanning on the continuously produced production boards one by one to obtain image data of each production board, and then the production board enters the inner layer browning or outer layer solder mask pre-treatment process for processing, and the image data obtained by the previous scan is processed at the same time. When the production board completes the inner layer browning or outer layer solder mask pre-treatment and reaches the laser marking machine of the next process, the processed data synchronously and punctually arrives at the laser marking machine, and the laser marking machine performs marking or non-marking processing according to the result of the scan data processing to distinguish qualified and unqualified products. The continuous production method eliminates the inventory, transportation, water washing and drying processes during AOI inspection and VRS repair, so as to achieve the purpose of not only performing AOI inspection on the product, but also making the assembly line non-stop to form a flow of just-in-time production, reducing the scratch problem caused by operators and manual operation, improving production efficiency and product quality, reducing the residence time of the product in a single process, reducing the difficulty of management, and reducing the waste of resources in intermediate water washing and energy consumption in drying after online production.

[0031] Secondly, by applying AI image recognition technology to defect image detection, AI technology is used to continuously learn defects identified manually, screen out repeated false points in advance, reduce the workload of operators and reduce the number of operators.

[0032] In addition, a processing step (such as inner layer browning step or solder mask pre-treatment step) is added between the online AO ​​I and the laser marking machine, so that there is a certain time difference between the online AO ​​I and the laser marking machine, so as to allow AI to identify and manually identify the false points of defects in the image data for more than 5 minutes, maintain the rhythm of online production, and avoid downtime and waiting problems. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Figure 1 This is a process flow chart when one flow is used in the inner layer circuit in Example 1;

[0034] Figure 2 This is a process flow chart of Example 2 when one flow is used in the outer layer line. DETAILED DESCRIPTION

[0035] In order to more fully understand the technical content of the present invention, the technical solution of the present invention will be further introduced and illustrated in conjunction with specific embodiments below.

[0036] Example 1

[0037] A method for manufacturing a circuit board shown in this embodiment includes the following processing steps in sequence:

[0038] (1) Cutting: Cut the core board according to the size of the panel 520mm×620mm. The core board is the inner layer board. The thickness of the core board is 0.5mm, and the thickness of the copper layer on both surfaces of the core board is 0.5oz.

[0039] (2) Inner layer circuit production (negative film process): Inner layer pattern transfer, use a vertical coating machine to coat the photosensitive film, the film thickness of the photosensitive film is controlled to 8μm, and a fully automatic exposure machine is used to complete the exposure of the inner layer circuit with a 5-6 grid exposure ruler (21 grid exposure ruler). After development, the inner layer circuit pattern is formed; inner layer etching, the core board after exposure and development is etched to etch the inner layer circuit, and the inner layer line width is measured to be 3mi l.

[0040] (3) Inner layer AOI scanning: Use online AOI to perform appearance scans on the continuously produced core boards one by one to obtain image data for each produced board.

[0041] (4) Browning: The core board is browned.

[0042] (5) Data processing: While the core board is being browned, the image data scanned in step (3) is processed to detect and identify whether the inner layer circuit of each core board has defects such as open circuit, gap, incomplete etching, short circuit, etc., and then determine whether the appearance of each core board is qualified. The specific process of image data processing is as follows:

[0043] a. Compare each scanned image with a qualified CAM standard image as an initial AOI judgment to determine whether each image is qualified, and then determine whether the appearance of the core board corresponding to each image is qualified;

[0044] b. The unqualified images obtained after the initial AOI judgment are transmitted to the background server, and the pre-trained AI detection model is used in the background server to perform AI re-judgment on the unqualified images obtained after the initial AOI judgment, and the appearance defects of the unqualified images are counted for manual re-judgment, so as to detect and filter out the false points (i.e., incorrectly judged points) existing in the AI ​​initial judgment, so as to identify the true defect points, and then the results of the manual re-judgment are fed back to the AI ​​detection model and the laser marking machine of the next process respectively, as the final judgment basis for the laser marking machine to perform laser marking operations. The AI ​​detection model receives the results of the manual re-judgment and trains the AI ​​detection model through AI learning technology to obtain a new AI detection model, that is, AI recognition learns from manual recognition, and intelligently identifies and processes defects, so as to continuously improve the AI ​​detection model, improve the detection results during AI re-judgment, reduce the false point rate (i.e., error rate) during AI re-judgment, and further reduce the workload of manual re-judgment in the later stage.

[0045] Among them, the pre-trained AI detection model is trained based on multiple production boards and manual re-inspection results of each production board, that is, AOI images with various defect problems after manual re-inspection are imported into the AI ​​image recognition program and trained using AI learning technology to obtain the AI ​​detection model.

[0046] AI image recognition technology and AI learning technology are both conventional AI technologies currently available; AI learning refers to the process by which artificial intelligence systems learn and improve through algorithms and data. AI learning can be divided into different methods and techniques, such as supervised learning, unsupervised learning, reinforcement learning, and deep learning.

[0047] For the application of AI recognition technology in AOI inspection, please refer to the previously disclosed Chinese patent "CN 118537290A" and the contents recorded in the literature "On the Application of AI Technology in AOI (Author: Zhong Guanqi and Wu Tianxin)" and "Application of AI Technology in PCB Industry (Author: Xie Xunwei, Ji and Chen Kaiwen)".

[0048] In the above, a browning process is added between the online AO ​​I and the laser marking machine, so that there is a certain time difference between the online AO ​​I and the laser marking machine (generally more than 5 minutes), so as to leave more than 5 minutes for AI recognition and manual recognition of false defect points, maintain the rhythm of online production, and avoid downtime and waiting problems.

[0049] (6) Laser marking: The core boards that have passed the inner layer AOI inspection are transported to the laser marking machine one by one. The core boards that have passed the appearance AOI inspection directly pass through the laser marking machine and are transported to the next production process without any marking operation. The core boards that have failed the appearance AOI inspection enter the laser marking machine, are laser marked by the laser marking machine, and are then transported to the next production process (i.e., the pressing process) to serve as marking points for the scrapping of the production board in the later stage. Thus, all core boards (including qualified and unqualified ones) are processed in the subsequent continuous process, and the unqualified boards are removed and scrapped in the subsequent electrical testing or molding process. With the improvement of production process technology and equipment, the number of defective products and scrapped products detected by AOI and VRS is getting smaller and smaller. Generally, the defective rate is within 10%, and the scrap rate is within 3%. In addition, as customer requirements become higher and higher, repairs are not allowed, and AOI is not allowed to be carried out. Defective products after inspection are only scrapped. Therefore, the method of this embodiment only performs laser marking of scrapping in a continuous production line without any repair process, thereby achieving the purpose of continuous production without stopping the assembly line.

[0050] Specifically, the laser marking machine performs laser ablation processing on at least one defective point on the corresponding unqualified core board according to the manual review results received. The laser ablation processing is the marking processing, which burns out the inner layer circuit at the defective point to form a short circuit. In this way, the circuit board with the inner layer short circuit can be identified by electrical testing at a later stage, and it can be removed and scrapped; the qualified core board directly passes through the laser marking machine and is transported to the next production process without any marking processing and operation.

[0051] The inner layer circuit etching line, online AOI, browning line and laser marking machine are connected in sequence to form a streamlined production line. Through the above method, the inner layer circuit of the core board can be inspected by AOI, and the assembly line can be kept running to form a streamlined just-in-time production.

[0052] The background server installed with the AI ​​detection model is connected to the online AIO or laser marking machine through wired or wireless network for data transmission.

[0053] (7) Lamination: The core board, prepreg and outer copper foil are laminated in sequence as required to form a laminated board, and then the laminated board is laminated in a vacuum laminator under appropriate lamination conditions according to the Tg of the board to form a production board.

[0054] (8) Drilling: Based on the existing drilling technology, drilling processing is performed on the production board according to the design requirements.

[0055] (9) Copper plating: A thin layer of copper is deposited on the board surface and hole wall by chemical copper plating. The backlight test is level 10, and the thickness of the copper plating in the hole is 0.5μm.

[0056] (10) Full-board electroplating: Full-board electroplating is performed at a current density of 18 ASF for 120 min to thicken the copper layer on the hole and the board surface.

[0057] (11) Production of outer circuits (negative film process): Transfer of outer layer graphics. After affixing dry film on the production board, use a fully automatic exposure machine and negative film circuit film to complete the exposure of the outer layer circuit with a 5-7 grid exposure ruler (21 grid exposure ruler). After development, the outer layer circuit graphics are formed on the production board; outer layer etching. Etch the outer layer circuit on the production board after exposure and development. The outer layer line width is measured to be 3mil; outer layer AOI. Use an automatic optical inspection system to detect whether the outer layer circuit has defects such as open circuit, gap, incomplete etching, short circuit, etc. by comparing with CAM data.

[0058] (12) Pre-solder mask treatment: Perform solder mask pre-treatment on the production board.

[0059] (13) Solder mask and silk screen characters: After silk screen printing solder mask ink on the surface of the production board, it is sequentially processed through pre-curing, exposure, development and heat curing to solidify the solder mask ink into a solder mask layer; specifically, the solder mask ink and the characters on the top surface are added with "UL mark", so that a layer is coated on the circuits and substrates that do not need to be soldered to prevent bridging between circuits during soldering, provide a permanent electrical environment and chemical corrosion resistance, and at the same time beautify the appearance.

[0060] (14) Surface treatment (nickel-gold immersion): The copper surface of the pad at the solder mask opening is chemically treated to uniformly deposit nickel and gold layers of a certain required thickness. The nickel layer thickness is 3-5 μm; the gold layer thickness is 0.05-0.1 μm.

[0061] (15) Electrical test: Test the electrical conductivity of the finished board. The test method used for this board is: flying probe test; the production boards with inner layer broken circuits after laser marking are removed and scrapped.

[0062] (16) Molding: According to the existing technology and the design requirements, the circuit board is manufactured with a shape tolerance of + / -0.05mm.

[0063] (17) FQC: Inspect the appearance of the circuit board according to the customer's acceptance standards and our inspection standards. If there are any defects, repair them in time to ensure that we provide customers with excellent quality control.

[0064] (18) FQA: Re-test the circuit board’s appearance, hole copper thickness, dielectric layer thickness, green oil thickness, inner layer copper thickness, etc. to see if they meet customer requirements.

[0065] (19) Packaging: According to the packaging method and packaging quantity required by the customer, the circuit boards are sealed and packed with desiccant and humidity card before shipment.

[0066] Example 2

[0067] The manufacturing method of a circuit board shown in this embodiment is basically the same as that of Embodiment 1, except that steps (11) to (19) are as follows:

[0068] (11) Production of outer layer circuit (negative film process): Transfer of outer layer pattern. After affixing dry film on the production board, use a fully automatic exposure machine and negative film circuit film to complete the exposure of the outer layer circuit with a 5-7 grid exposure ruler (21 grid exposure ruler). After development, the outer layer circuit pattern is formed on the production board; outer layer etching. Etch the outer layer circuit out of the production board after exposure and development. The outer layer line width is measured to be 3mil. The production board is the outer layer board or double-sided board.

[0069] (12) Outer layer AOI: Use online AOI to scan the appearance of the continuously produced production boards one by one to obtain image data of each production board.

[0070] (13) Solder mask pre-treatment: Perform solder mask pre-treatment on the production board; add a solder mask pre-treatment process before the laser marking machine, so that there is a certain time difference between the online AOI and the laser marking machine (generally more than 5 minutes), so as to leave more than 5 minutes for AI recognition and manual recognition of false defects, maintain the rhythm of online production, and avoid downtime and waiting.

[0071] (14) Data processing: While the production boards are undergoing solder mask pre-treatment, the image data scanned in step (12) is processed simultaneously to detect and identify whether the outer layer circuits of each production board have defects such as open circuits, gaps, incomplete etching, short circuits, etc., and then determine whether the appearance of each production board is qualified. The image data processing process adopts the same processing method as in step (5) of Example 1, and the outer layer AOI image is subjected to AI re-evaluation and manual re-evaluation. The specific process is detailed in step (5) of Example 1 and will not be repeated here.

[0072] (15) Laser marking: The production boards that have passed the outer layer AOI inspection are transported to the laser marking machine one by one. The production boards that have passed the appearance AOI inspection directly pass through the laser marking machine and are transported to the next production process without any marking operation. After the production boards that have failed the appearance AOI inspection enter the laser marking machine, they are laser marked by the laser marking machine and then transported to the next production process (i.e., the solder mask production process) to serve as marking points for the production boards when they are scrapped later. In this way, all production boards (including qualified and unqualified ones) are subjected to the subsequent continuous process production, and the unqualified boards can be removed and scrapped in the subsequent electrical testing or molding process.

[0073] Specifically, the laser marking machine performs laser ablation processing on at least one defective point on the corresponding unqualified core board according to the manual re-inspection results received. The laser ablation processing is the marking processing, which burns out the outer layer circuit at the defective point to form a short circuit. In this way, the circuit board with the outer layer short circuit can be identified through electrical testing at a later stage, and it can be removed and scrapped; while the qualified production board directly passes through the laser marking machine and is transported to the next production process without any marking processing and operation.

[0074] The outer layer circuit etching line, online AOI, solder mask pre-treatment line and laser marking machine are connected in sequence to form a streamlined production line. Through the above method, AOI inspection can be performed on the inner layer circuits of the core board and the outer layer circuits of the production board, and the purpose of forming a streamlined just-in-time production can be achieved without stopping the assembly line.

[0075] (16) Solder mask and silk screen characters: After the solder mask ink is silk screen printed on the surface of the production board, it is sequentially subjected to pre-curing, exposure, development and thermal curing treatments to solidify the solder mask ink into a solder mask layer; specifically, a "UL mark" is added to the solder mask ink on the TOP surface and the characters on the TOP surface, thereby coating a layer on the circuits and substrates that do not require soldering to prevent bridging between circuits during soldering, provide a permanent electrical environment and resist chemical corrosion, and at the same time beautify the appearance.

[0076] (17) Surface treatment (nickel-gold immersion): The copper surface of the pad at the solder mask opening is chemically treated to evenly deposit a nickel layer and a gold layer of a certain required thickness. The nickel layer thickness is 3-5 μm; the gold layer thickness is 0.05-0.1 μm.

[0077] (18) Electrical testing: Testing the electrical conductivity of the finished board. The test method used for this board is: flying probe test; the production boards with inner and / or outer layer breaks after laser marking are removed and scrapped.

[0078] (19) Molding: According to the existing technology and the design requirements, the circuit board is manufactured with a shape tolerance of + / -0.05mm.

[0079] (20) FQC: Inspect the appearance of the circuit board according to the customer's acceptance standards and our inspection standards. If there are any defects, repair them in time to ensure that we provide customers with excellent quality control.

[0080] (21) FQA: Re-test the circuit board’s appearance, hole copper thickness, dielectric layer thickness, green oil thickness, inner layer copper thickness, etc. to see if they meet customer requirements.

[0081] (22) Packaging: According to the packaging method and packaging quantity required by the customer, the circuit boards are sealed and packed with desiccant and humidity card before shipment.

[0082] Example 3

[0083] The manufacturing method of a circuit board shown in this embodiment is basically the same as that of Example 2, except that: in this embodiment, only the AOI scanning image data of the outer layer circuit is subjected to the AI ​​recognition and manual recognition judgment process, while the inner layer AOI adopts the existing conventional AOI detection, and does not perform the AI ​​recognition and manual recognition judgment process.

[0084] The technical solutions provided by the embodiments of the present invention are introduced in detail above. Specific examples are used herein to illustrate the principles and implementation methods of the embodiments of the present invention. The description of the above embodiments is only applicable to help understand the principles of the embodiments of the present invention. At the same time, for those skilled in the art, according to the embodiments of the present invention, there will be changes in the specific implementation methods and application scopes. In summary, the content of this specification should not be understood as limiting the present invention.

Claims

1. A one-flow production process for circuit board AOI, characterized in that: The following steps are involved: S1. After making the circuit on the production board, use the online AOI to scan the appearance of the continuously produced production boards one by one to obtain the image data of each production board; S2. After AOI scanning, the production board directly enters the inner layer browning or outer layer solder mask pre-treatment process for processing; S3, while the production and processing is being carried out in step S2, the image data scanned in step S1 is processed to determine whether the appearance of each produced board is qualified; S4, conveying the production boards processed in step S2 to the laser marking machine one by one. When the production boards arrive at the laser marking machine, the data processed in step S3 arrives at the laser marking machine synchronously and on time. The laser marking machine performs laser marking or non-marking according to the result of the scanned data processing; The products flow in steps S1, S2, and S4 according to a one-stream production method.

2. The one-flow production process of circuit board AOI according to claim 1, characterized in that: In step S3, the image data processing process includes: comparing each scanned image with a qualified CAM standard image as an initial AOI judgment to determine whether each image is qualified, and then determining whether the appearance of the production board corresponding to each image is qualified.

3. The one-flow production process of circuit board AOI according to claim 2, characterized in that: In step S3, the image data processing process also includes: after the AOI initial judgment, the unqualified images obtained after the AOI initial judgment are subjected to AI re-judgment by using the pre-trained AI detection model, and the appearance defects of the unqualified images are statistically analyzed for manual re-judgment, so as to detect, identify and filter out the false points existing in the AI ​​initial judgment, and the results of the manual re-judgment are fed back to the AI ​​detection model and the laser marking machine respectively, so as to train the AI ​​detection model to obtain a new AI detection model and serve as the final judgment basis for the laser marking machine to perform laser marking operations.

4. The one-flow production process of circuit board AOI according to claim 3, characterized in that: In step S4, the laser marking machine performs laser ablation processing on at least one defective point on the corresponding unqualified production board according to the result of manual review. The laser ablation processing is the marking processing, which burns out the circuit at the defective point to form an open circuit. The qualified production board directly passes through the laser marking machine and is transported to the next production process without any marking operation.

5. The one-flow production process of circuit board AOI according to claim 3, characterized in that: The AI ​​detection model is trained based on multiple production boards and manual re-inspection results of each production board.

6. The one-flow production process for circuit board AOI according to any one of claims 1 to 5, characterized in that: When the production board is an inner layer board, the online AOI, browning line and laser marking machine are connected in sequence to form a streamlined production line.

7. The one-flow production process of circuit board AOI according to claim 6, characterized in that: The step S4 further includes the following steps: S5. The inner layer board, the prepreg sheet and the outer copper foil are sequentially stacked and pressed together as required to form a multilayer board.

8. The one-flow production process for circuit board AOI according to any one of claims 1 to 5, characterized in that: When the production board is an outer layer board or a double-sided board, the online AOI, solder mask pre-treatment line and laser marking machine are connected in sequence to form a streamlined production line.

9. The one-flow production process of circuit board AOI according to claim 8, characterized in that: The step S4 further includes the following steps: S5. Make a solder mask layer on the production board.

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