Golden finger manufacturing method and circuit board

Abstract

The invention relates to the technical field of printed circuit board manufacturing, and discloses a golden finger manufacturing method and a circuit board, and the golden finger manufacturing method comprises the steps: providing a substrate which is provided with a conductive circuit and a golden finger to be plated, and the golden finger comprises a reserved segment and a removed segment; the substrate is subjected to electrogilding treatment, so that the reserved section is covered with a nickel-gold plating layer; carrying out roughening treatment on the substrate; a solder mask layer is arranged on the substrate, the conductive circuit is covered with the solder mask layer, the solder mask layer is provided with a first window, and the golden fingers are exposed out of the first window; and removing the removal section. According to the golden finger manufacturing method and the circuit board provided by the invention, the problem that segmented golden fingers manufactured in related technologies are easy to collapse at segmented positions can be improved.

Description

Technical Field

[0001] The present application relates to the technical field of printed circuit board manufacturing, and in particular to a gold finger manufacturing method and a circuit board. Background Art

[0002] The optical transceiver module (abbreviated as "optical module") is one of the important components of fiber-optic communication. It is composed of optoelectronic devices, functional circuits and optical interfaces. Its function is "photoelectric conversion". The sending end of the optical module converts the electrical signal into an optical signal, and then transmits it through the optical fiber. The receiving end converts the optical signal into an electrical signal. The gold fingers of the optical module circuit board are needed for signal connection, so the gold fingers are required to have good conductivity, wear resistance, oxidation resistance and corrosion resistance.

[0003] Segmented gold fingers are discontinuous gold fingers. Different from long and short gold fingers, segmented gold fingers are rectangular pads of different lengths, but their front ends are disconnected. When a circuit board has segmented gold fingers, the existing production process is generally: film pasting, gold finger plating, film stripping, film exposure, development etching and solder mask. The gold finger guide lines and gold finger segment positions are etched at one time before solder mask. However, the segmented gold fingers produced by this production process are prone to collapse at the segmented position, affecting the quality of the circuit board. Summary of the invention

[0004] The present application provides a gold finger manufacturing method and a circuit board, which can improve the problem that the segmented gold fingers manufactured in the related art are prone to collapse at the segmented positions.

[0005] In a first aspect, an embodiment of the present application provides a method for making a gold finger, comprising:

[0006] Providing a substrate, wherein the substrate is provided with a conductive circuit and a gold finger to be plated, wherein the gold finger comprises a retaining section and a removing section;

[0007] Performing electroplating gold treatment on the substrate so that the reserved section is covered with a nickel-gold plating layer;

[0008] performing a roughening treatment on the substrate;

[0009] A solder mask is provided on the substrate, the solder mask covers the conductive circuit, the solder mask has a first window, and the first window exposes the gold finger;

[0010] The removal segment is removed.

[0011] In some embodiments, before the substrate is subjected to the gold electroplating treatment, a first film is attached to the removal section; after the substrate is subjected to the gold electroplating treatment, the first film is removed.

[0012] In some embodiments, the substrate is provided with an electrical conductor, the electrical conductor is located on the side of the gold finger away from the edge of the substrate, and the electrical conductor is connected to the gold finger and is electrically conductive; when the substrate is subjected to gold electroplating, the gold finger is energized through the electrical conductor; before the substrate is subjected to roughening treatment, the electrical conductor is removed.

[0013] In some embodiments, removing the electrical conductor comprises:

[0014] A second film is attached to the substrate, wherein the second film covers the conductive line and the gold finger, and the second film has a second window exposing the electrical conductor;

[0015] etching away the electrical conductor;

[0016] The second film is removed.

[0017] In some embodiments, the second film is a photosensitive film, and attaching the second film on the substrate comprises:

[0018] A photosensitive film is attached to the substrate, wherein the photosensitive film covers the gold finger and the conductive circuit;

[0019] performing exposure processing on the photosensitive film corresponding to the gold finger and the photosensitive film corresponding to the conductive circuit;

[0020] The photosensitive film corresponding to the electrical conductor is removed by developing to form the second window.

[0021] In some embodiments, the electrical conductor is located between the conductive circuit and the gold finger, and the electrical conductor is connected to and electrically conductive with the conductive circuit. When the substrate is subjected to gold electroplating, the gold finger is energized through the conductive circuit and the electrical conductor.

[0022] In some embodiments, the roughening treatment of the substrate includes: using a super-roughening solution to clean the substrate.

[0023] In some embodiments, the step of providing a solder mask on the substrate includes:

[0024] Printing solder resist ink on the substrate, wherein the solder resist ink covers the gold fingers and the conductive circuit;

[0025] Expose the solder resist ink corresponding to the conductive circuit;

[0026] Using a developing method to remove the solder mask ink corresponding to the gold finger to form the first opening;

[0027] The solder resist ink is cured.

[0028] In some embodiments, removing the removal segment comprises:

[0029] A third film is attached to the substrate, the third film covers the nickel-gold plating layer and the conductive circuit, and the third film has a third window exposing the removal section;

[0030] etching away the removal segment;

[0031] The third film is removed.

[0032] In a second aspect, an embodiment of the present application provides a circuit board, comprising a gold finger processed using the gold finger manufacturing method as described in the first aspect.

[0033] The gold finger manufacturing method provided in the embodiment of the present application has the beneficial effect that: since the substrate is first subjected to electroplating gold so that the retained section of the gold finger is covered with a nickel-gold plating layer, and then the substrate is roughened, and a solder mask is provided on the substrate, and finally the removal section of the gold finger is removed, it can effectively avoid the problem in the related art that the nickel at the retained section end of the gold finger and its corresponding nickel-gold plating is corroded by the super-roughening solution, thereby causing the gold of the nickel-gold plating corresponding to the retained section end to collapse, thereby affecting the subsequent normal use of the gold finger.

[0034] The beneficial effects of the circuit board provided in the present application compared with the prior art can be referred to the description of the beneficial effects of the gold finger manufacturing method provided in the present application compared with the prior art, which will not be repeated here. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0036] Figure 1 This is a flow chart of a method for making a gold finger in one of the embodiments of the present application;

[0037] Figure 2 is a top view of a substrate in one of the embodiments of the present application;

[0038] Figure 3 Yes Figure 1 Schematic diagram of the substrate being subjected to electroplating gold treatment;

[0039] Figure 4 Yes Figure 3 A schematic diagram of electrical conductors on the substrate shown;

[0040] Figure 5 is Figure 4 A schematic diagram of providing a solder mask on a substrate shown;

[0041] Figure 6 Yes Figure 5 Schematic diagram of the removal section of the gold finger on the substrate shown.

[0042] The meanings of the marks in the figure are:

[0043] 100. Substrate;

[0044] 10. Gold finger; 11. Retained segment; 12. Removed segment; 20. Electrical conductor; 30. Conductive circuit; 40. Nickel-gold plating; 50. Solder mask. DETAILED DESCRIPTION

[0045] In order to make the purpose, technical solution and advantages of the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0046] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0047] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0048] References to "one embodiment", "some embodiments" or "an embodiment" described in the specification of the present application mean that a particular feature, structure or characteristic described in conjunction with the embodiment is included in one or more embodiments of the present application. Thus, the phrases "in one embodiment", "in some embodiments", "in some other embodiments", "in some other embodiments", etc., which appear at different places in the specification, do not necessarily refer to the same embodiment, but mean "one or more but not all embodiments", unless otherwise specifically emphasized in other ways. In addition, in one or more embodiments, particular features, structures or characteristics may be combined in any suitable manner.

[0049] In order to illustrate the technical solution of the present application, a description is given below with reference to specific drawings and embodiments.

[0050] The optical transceiver module (abbreviated as "optical module") is one of the important components of fiber-optic communication. It is composed of optoelectronic devices, functional circuits and optical interfaces. Its function is "photoelectric conversion". The sending end of the optical module converts the electrical signal into an optical signal, and then transmits it through the optical fiber. The receiving end converts the optical signal into an electrical signal. The gold fingers of the optical module circuit board are needed for signal connection, so the gold fingers are required to have good conductivity, wear resistance, oxidation resistance and corrosion resistance.

[0051] Segmented gold fingers are discontinuous gold fingers. Different from long and short gold fingers, segmented gold fingers are rectangular pads of different lengths, but their front ends are disconnected. When a circuit board has segmented gold fingers, the existing production process is generally: film pasting, gold finger plating, film stripping, film pasting exposure, development etching and solder mask. The gold finger guide lines and gold finger segment positions are etched at one time before solder mask.

[0052] In this production process, a nickel-gold plating layer will be covered on the surface of the gold finger when the gold finger is gold-plated. Subsequently, part of the gold finger is etched away to obtain segmented gold fingers, and then the circuit board is subjected to solder mask production. Because the circuit board needs to be roughened and micro-etched during the solder mask production process, the nickel of the nickel-gold plating at the segmented position of the gold finger will also be corroded by the super-roughening solution, causing the gold of the remaining nickel-gold plating to collapse, which will affect the subsequent insertion and removal of the gold finger, and easily cause problems such as short circuits, thereby affecting the quality of the circuit board.

[0053] In view of this, the present application provides a gold finger manufacturing method and a circuit board. Since the substrate is first subjected to gold electroplating treatment so that the retained section of the gold finger is covered with a nickel-gold plating layer, and then the substrate is roughened, and a solder mask is provided on the substrate, and finally the removal section of the gold finger is removed, it can effectively avoid the problem in the related technology that the nickel of the retained section end of the gold finger and its corresponding nickel-gold plating is corroded by the super-roughening solution, which in turn causes the gold of the nickel-gold plating corresponding to the retained section end to collapse, thereby affecting the subsequent normal use of the gold finger.

[0054] Please refer to Figures 1 to 6 In a first aspect, an embodiment of the present application provides a method for manufacturing a gold finger 10, comprising:

[0055] S100 : providing a substrate 100 , on which a conductive circuit 30 and a gold finger 10 to be plated are disposed, and the gold finger 10 includes a retaining section 11 and a removing section 12 .

[0056] Specifically, the gold finger 10 and the conductive circuit 30 may be located on the same side of the substrate 100, and a plurality of gold fingers 10 may be provided. The gold finger 10 to be plated is the gold finger 10 that has not been subjected to electroplating gold and has not been covered with the nickel-gold plating layer 40. The reserved section 11 and the removed section 12 are different parts of the gold finger 10. For the same gold finger 10, a plurality of reserved sections 11 may be provided, and one or more removed sections 12 may be provided. The removed section 12 is located between two adjacent reserved sections 11. Part of the reserved section 11 may be connected to the circuit inside the substrate 100 through the via hole inside the substrate 100 and be electrically conductive, and part of the reserved section 11 may be conductive with the circuit on the surface of the substrate 100. The conductive circuit 30 may include a copper circuit, etc.

[0057] S200 : performing electro-gold plating on the substrate 100 , so that the reserved section 11 is covered with a nickel-gold plating layer 40 .

[0058] Specifically, the nickel-gold plating layer 40 may include nickel and gold. The removed section 12 is not covered with the nickel-gold plating layer 40 .

[0059] S300 : performing a roughening treatment on the substrate 100 .

[0060] Specifically, the entire substrate 100 can be roughened using an ultra-roughening solution, which micro-etches the surface of the substrate 100 and the conductive circuit 30, and can subsequently enhance the bonding strength between the surface of the substrate 100 and the conductive circuit 30 and the solder mask 50. The ultra-roughening solution will also micro-etch the gold finger 10, but since the removal section 12 does not cover the nickel-gold plating layer 40, and the removal section 12 has not been removed at this time, the ultra-roughening solution will not erode the nickel of the corresponding nickel-gold plating layer 40 at the end where the retention section 11 is connected to the removal section 12, so the gold of the nickel-gold plating layer 40 will not collapse.

[0061] S400 : a solder mask layer 50 is disposed on the substrate 100 , the solder mask layer 50 covers the conductive circuit 30 , and the solder mask layer 50 has a first opening, and the first opening exposes the gold finger 10 .

[0062] Specifically, a solder mask 50 may be disposed on the substrate 100, but the solder mask 50 does not cover the gold finger 10. The first opening may expose the entire region where the gold finger 10 is located.

[0063] It should be noted that the substrate 100 may also be provided with a conductive pad electrically connected to the conductive circuit 30 , and the solder mask 50 does not cover the conductive pad.

[0064] For example, a solder resist ink covering the gold finger 10 and the conductive circuit 30 can be printed on the entire substrate 100, and then the solder resist ink corresponding to the conductive circuit 30 can be exposed, and then the solder resist ink corresponding to the gold finger 10 can be removed by developing to form a first window, and then the solder resist ink corresponding to the conductive pad can be removed by developing.

[0065] Alternatively, the screen printing method is adopted, and the screen corresponding to the position of the gold finger 10 and the conductive pad is sealed with photosensitive paste. When printing, the area where the gold finger 10 is located is not covered with solder mask ink to form a first window, and the area where the conductive pad is located is also not covered with solder mask ink.

[0066] S500: Remove the removal segment 12.

[0067] Specifically, the removal segment 12 can be removed by etching, and after the removal segment 12 is removed, the segmented gold finger 10 is obtained.

[0068] The method for manufacturing the gold finger 10 provided in the embodiment of the present application first performs gold electroplating on the substrate 100 so that the retained section 11 of the gold finger 10 is covered with a nickel-gold plating layer 40, and then the substrate 100 is roughened, and a solder mask 50 is provided on the substrate 100, and finally the removal section 12 of the gold finger 10 is removed. Therefore, the problem that the nickel at the end of the retained section 11 of the gold finger 10 and the corresponding nickel-gold plating layer 40 is corroded by the super-roughening solution in the related art can be effectively avoided, thereby causing the gold of the nickel-gold plating layer 40 corresponding to the end of the retained section 11 to collapse, thereby affecting the subsequent normal use of the gold finger 10.

[0069] Before the substrate 100 is subjected to the gold electroplating treatment, a first film is attached to the removal section 12 ; after the substrate 100 is subjected to the gold electroplating treatment, the first film is removed.

[0070] By adopting the above solution, it is possible to avoid removing the nickel-gold plating layer 40 covering the segment 12 when the substrate 100 is electroplated with gold.

[0071] Optionally, the first film may be a photosensitive film, such as a dry film or a wet film, etc. The first film may be attached to the substrate 100, the first film covering the reserved section 11 and the removal section 12, and then the first film corresponding to the removal section 12 is exposed, and other positions are not exposed, the exposure energy is 8 grids to 9 grids, and then the first film corresponding to the reserved section 11 is removed by developing, and the substrate 100 is subjected to electroplating gold treatment, and then the first film is removed by film stripping.

[0072] It should be noted that the first film may be a gold-resistant dry film, which has excellent anti-plating performance compared to ordinary dry films, and prevents the occurrence of infiltration during the gold electroplating process. Before attaching the first film to the substrate 100, the substrate 100 may be inspected by AOI (Automated Optical Inspection) to confirm whether there is any abnormality on its surface, and then the surface of the substrate 100 may be cleaned.

[0073] Please refer to Figures 1 to 6In this embodiment, the substrate 100 is provided with an electric conductor 20, which is located on the side of the gold finger 10 away from the board edge of the substrate 100, and the electric conductor 20 is connected to the gold finger 10 and is electrically conductive; when the substrate 100 is subjected to electroplating gold processing, the gold finger 10 is energized through the electric conductor 20; before the substrate 100 is subjected to roughening processing, the electric conductor 20 is removed.

[0074] By adopting the above solution, the plugging and unplugging performance of the gold finger 10 can be improved, and the gold finger 10 can be energized through the electrical conductor 20, so that when the substrate 100 is electroplated with gold, the reserved section 11 can be covered with the nickel-gold plating layer 40.

[0075] It should be noted that when the gold finger 10 is plugged in or out of another connector, the end of the gold finger 10 facing the board edge of the substrate 100 contacts the connector first, so this end is required to have good electrical conductivity, wear resistance, oxidation resistance and corrosion resistance. If the electrical conductor 20 is connected to the side of the gold finger 10 facing the board edge of the substrate 100, after the electrical conductor 20 is subsequently removed, the nickel-gold plating 40 cannot completely cover the end of the gold finger 10 facing the board edge of the substrate 100. In the embodiment of the present application, the electrical conductor 20 is arranged on the side of the board edge of the gold finger 10 away from the substrate 100, which can ensure that the nickel-gold plating 40 completely covers the end of the gold finger 10 facing the board edge of the substrate 100, so that this end has good electrical conductivity, wear resistance, oxidation resistance and corrosion resistance.

[0076] Wherein, removing the electrical conductor 20 comprises:

[0077] First, a second film is attached to the substrate 100 , the second film covers the conductive circuit 30 and the gold finger 10 , and the second film has a second window exposing the electrical conductor 20 .

[0078] Next, the electrical conductors 20 are removed by etching.

[0079] Finally, the second film is removed.

[0080] By adopting the above solution, the second film can be used to protect the conductive circuit 30 and the gold finger 10, so as to avoid damage to the conductive circuit 30 and the gold finger 10 when the electrical conductor 20 is subsequently etched away.

[0081] Optionally, the second film is a photosensitive film, and the photosensitive film may be a dry film or a wet film, etc. Attaching the second film on the substrate 100 includes:

[0082] First, a photosensitive film is attached to the substrate 100 , and the photosensitive film covers the gold fingers 10 and the conductive circuits 30 .

[0083] Next, the photosensitive film corresponding to the gold finger 10 and the photosensitive film corresponding to the conductive circuit 30 are exposed.

[0084] Finally, the photosensitive film corresponding to the conductive line 20 is removed by developing to form a second window.

[0085] Such a configuration makes it easier to attach the second film covering the conductive circuit 30 and the gold finger 10 to the substrate 100 .

[0086] It should be noted that the second film can be removed by film stripping. After the second film is removed, the board surface of the substrate 100 can be inspected by AOI to see if there is any abnormality and whether the second film has been completely removed.

[0087] Optionally, the electrical conductor 20 is located between the conductive circuit 30 and the gold finger 10 , and the electrical conductor 20 and the conductive circuit 30 are connected and electrically conductive. When the substrate 100 is subjected to electroplating gold, the gold finger 10 is energized through the conductive circuit 30 and the electrical conductor 20 .

[0088] Such arrangement facilitates powering on the gold finger 10 .

[0089] Optionally, the substrate 100 is subjected to a roughening treatment, including: cleaning the substrate 100 with an ultra-roughening solution.

[0090] Such a configuration can better micro-etch the board surface of the substrate 100 and the conductive circuit 30 , and can subsequently enhance the bonding strength between the board surface of the substrate 100 and the conductive circuit 30 and the solder mask 50 .

[0091] Please refer to Figures 1 to 6 In this embodiment, a solder mask 50 is provided on the substrate 100, including:

[0092] First, solder resist ink is printed on the substrate 100 , and the solder resist ink covers the gold fingers 10 and the conductive circuits 30 .

[0093] Specifically, solder resist ink may be printed on the entire substrate 100 .

[0094] Next, the solder resist ink corresponding to the conductive circuit 30 is exposed.

[0095] Next, the solder resist ink corresponding to the gold finger 10 is removed by developing to form a first opening.

[0096] Specifically, the solder resist ink in the areas where the solder resist layer 50 needs to be covered is retained, and the areas where it is not needed are developed and removed, and the solder resist characters can be printed on the substrate 100 at the same time.

[0097] Finally, the solder resist ink is cured.

[0098] Specifically, the solder resist characters can be cured at high temperature.

[0099] By adopting the above solution, the solder mask layer 50 can be disposed on the substrate 100 , and the solder mask layer 50 can be prevented from covering the gold finger 10 .

[0100] Optionally, removing the removal section 12 comprises:

[0101] First, a third film is attached to the substrate 100 , the third film covers the Ni-Au plating layer 40 and the conductive circuit 30 , and the third film has a third window exposing the removed section 12 .

[0102] Next, the removal section 12 is etched away.

[0103] Finally, the third film is removed.

[0104] By adopting the above solution, the third film can be used to protect the conductive circuit 30 and the gold finger 10, so as to avoid damage to the nickel-gold plating layer 40 and the conductive circuit 30 when etching and removing the removal section 12.

[0105] Optionally, the third film may be a photosensitive film, such as a dry film or a wet film. The third film may be first attached to the substrate 100, the third film covering the removal section 12, the nickel-gold plating layer 40 and the conductive circuit 30, and then the third film corresponding to the nickel-gold plating layer 40 and the conductive circuit 30 is exposed, and then the third film corresponding to the removal section 12 is removed by developing, and finally the third film is removed by film stripping. After the third film is removed, the board surface of the substrate 100 may be checked by AOI to see if there is any abnormality and whether the third film is completely removed.

[0106] Among them, after removing the third film, conventional post-processes such as gong plate, electrical testing, FQC (Final Quality Control, shipment inspection), FQA (Factory Quality Assurance, factory quality assurance) and packaging can be continued.

[0107] In a second aspect, an embodiment of the present application provides a circuit board, including a gold finger 10 processed by the gold finger 10 manufacturing method of the first aspect.

[0108] In the circuit board provided in the embodiment of the present application, since the substrate 100 is first subjected to electroplating gold treatment when manufacturing the gold finger 10, so that the retained section 11 of the gold finger 10 is covered with the nickel-gold plating layer 40, and then the substrate 100 is roughened, and a solder mask 50 is provided on the substrate 100, and finally the removal section 12 of the gold finger 10 is removed, the problem that the nickel at the end of the retained section 11 of the gold finger 10 and the corresponding nickel-gold plating layer 40 is corroded by the super-roughening solution in the related art can be effectively avoided, thereby causing the gold of the nickel-gold plating layer 40 corresponding to the end of the retained section 11 to collapse, thereby affecting the subsequent normal use of the gold finger 10.

[0109] The above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application, and should all be included in the protection scope of the present application.

Claims

1. A method for making a gold finger, characterized in that: include: Providing a substrate, wherein the substrate is provided with a conductive circuit and a gold finger to be plated, wherein the gold finger comprises a retaining section and a removing section; Performing electroplating gold treatment on the substrate so that the reserved section is covered with a nickel-gold plating layer; performing a roughening treatment on the substrate; A solder mask is provided on the substrate, the solder mask covers the conductive circuit, the solder mask has a first window, and the first window exposes the gold finger; The removal segment is removed.

2. The method for making a gold finger according to claim 1, characterized in that: Before the gold electroplating treatment is performed on the substrate, a first film is attached to the removal section; after the gold electroplating treatment is performed on the substrate, the first film is removed.

3. The method for making a gold finger according to claim 1, characterized in that: The substrate is provided with an electric conductor, which is located on a side of the gold finger away from the edge of the substrate, and is connected to the gold finger and electrically conductive; when the substrate is subjected to electroplating gold treatment, the gold finger is energized through the electric conductor; before the substrate is subjected to roughening treatment, the electric conductor is removed.

4. The method for making a gold finger according to claim 3, characterized in that: The removing of the electrical conductor comprises: A second film is attached to the substrate, wherein the second film covers the conductive line and the gold finger, and the second film has a second window exposing the electrical conductor; etching away the electrical conductor; The second film is removed.

5. The method for making a gold finger according to claim 4, characterized in that: The second film is a photosensitive film, and the second film is attached to the substrate, comprising: A photosensitive film is attached to the substrate, wherein the photosensitive film covers the gold finger and the conductive circuit; performing exposure processing on the photosensitive film corresponding to the gold finger and the photosensitive film corresponding to the conductive circuit; The photosensitive film corresponding to the electrical conductor is removed by developing to form the second window.

6. The method for making a gold finger according to claim 3, characterized in that: The electric wire is located between the conductive circuit and the gold finger, and the electric wire is connected to the conductive circuit and is electrically conductive. When the substrate is subjected to gold electroplating, the gold finger is energized through the conductive circuit and the electric wire.

7. The method for making a gold finger according to claim 1, characterized in that: The roughening treatment of the substrate includes: using a super-roughening solution to clean the substrate.

8. The method for making a gold finger according to any one of claims 1 to 7, characterized in that: The step of providing a solder mask on the substrate comprises: Printing solder resist ink on the substrate, wherein the solder resist ink covers the gold fingers and the conductive circuit; Expose the solder mask ink corresponding to the conductive circuit; Using a developing method to remove the solder mask ink corresponding to the gold finger to form the first opening; The solder resist ink is cured.

9. The method for making a gold finger according to any one of claims 1 to 7, characterized in that: The removing the removal segment comprises: A third film is attached to the substrate, the third film covers the nickel-gold plating layer and the conductive circuit, and the third film has a third window exposing the removal section; etching away the removal segment; The third film is removed.

10. A circuit board, characterized in that: It includes a gold finger processed by the gold finger manufacturing method according to any one of claims 1 to 9.

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