Automobile power generation regulator fixed by mixed glue

Abstract

The invention relates to an automobile power generation regulator fixed through mixed glue, and belongs to the technical field of power generation regulators, a circuit board assembly is pasted on a heat dissipation plate through the mixed glue, the circuit board assembly comprises an electronic component and a circuit board, and the electronic component is pasted on the circuit board through the mixed glue; a bare chip or a bonding pad on a circuit board is mutually connected with a plastic support insert terminal through routing ultrasonic bonding of a plurality of metal wires, electronic components are arranged on the circuit board through a conductive silver adhesive and spacing ball bonding process, effective electrical connection is achieved, and the requirement for environmental protection is met compared with lead solder paste; compared with lead-free solder paste, tin whiskers, tin cracks and other defects are reduced. Filler or spacing balls can be added into the conductive silver adhesive / heat dissipation adhesive to be uniformly mixed, so that the consistency of the mounting thickness of electronic components can be ensured, the uniformity of the quality of a regulator product is ensured, and the reliability of the product is improved.

Description

Technical Field

[0001] The invention relates to the technical field of power generation regulators, in particular to a mixed glue fixed automobile power generation regulator. Background Art

[0002] The automobile generator is the main power source of the automobile. Its function is to supply power to all electrical devices (except the starter) and charge the battery when the engine is running normally (above idling speed). The regulator is an indispensable part of the generator, which mainly plays the role of voltage regulation and voltage stabilization. However, at present, solder wire is used in the regulator to electrically connect the mechanical components and metal leads on the electrical hardware. In recent years, the automotive industry has requirements for environmental protection and lead-free, and lead-free solder wire has begun to be introduced into the production and application of regulators.

[0003] Since lead-free solder wire does not contain Pb, the welding reliability is much lower than that of lead-containing solder. To a large extent, defects such as cold solder joints and tin whiskers will occur, which will cause a high production defect rate and a substantial increase in production costs. In addition, the installation position of the regulator on the generator is close to the heat source, and the application temperature is high. The reliability of soldering during service is particularly critical. In particular, after the introduction of lead-free solder paste, the effective dielectric film on the surface of the electronic material will dissolve into the solder paste, and defects such as tin whiskers and tin cracks are prone to appear on the surface of the components, which can easily lead to the failure of automotive regulator products. Due to the necessity of welding, tin wire needs to be added with flux. The regulator product in a small space cannot be completely volatilized, causing the glue material to be poisoned and unable to solidify. The production of manual solder wire is limited by the operator, and the manual operation is inefficient, costly, and inconsistent. There are many links in the automated soldering process, including tin wire picking, heating, soldering, and tin wire cutting. The complex process makes the production efficiency low, and the space of the soldering equipment is limited, which is not suitable for the automated production of regulators in small spaces. Summary of the invention

[0004] The present invention aims to solve the above technical problems and provides an automobile power generation regulator fixed by mixed glue.

[0005] In order to solve the above technical problems, the technical solution provided by the present invention is:

[0006] A mixed glue fixed automobile power generation regulator, comprising a plastic bracket and a heat sink, a circuit board assembly and a metal wire on the plastic bracket;

[0007] The circuit board assembly is pasted on the heat sink by mixed glue, the circuit board assembly includes electronic components and a circuit board, and the electronic components are mounted on the circuit board by mixed glue;

[0008] The mixed glue is composed of conductive silver glue or heat dissipation adhesive and filler;

[0009] The filler is a spacer ball, and the spacer ball is made of plastic or glass;

[0010] The soldering pads on the bare chip or circuit board and the terminals of the plastic bracket insert are connected to each other through ultrasonic bonding of a plurality of metal wires.

[0011] Preferably, the spacer balls account for more than 75% of the mounting surface.

[0012] Preferably, the conductive silver paste and filler are used for connecting electronic components to circuit boards.

[0013] Preferably, the heat dissipation adhesive and filler are used for connecting the circuit board assembly with the heat dissipation plate.

[0014] Preferably, the mounting pressure is 14-24N, and the holding time is 1-2s.

[0015] Preferably, the conductive silver paste or heat dissipation adhesive and filler are put into a fixture of a mixer and mixed evenly at a speed of 800-1600r and a time of 40-80s.

[0016] Preferably, there should be at least 3 spacer balls at the bottom of the pad.

[0017] Preferably, the metal wire is an aluminum wire or a copper wire with a thickness of 50-500 μm.

[0018] After adopting the above structure, the present invention has the following advantages:

[0019] 1. By using conductive silver glue and spacer ball bonding process to attach electronic components to the circuit board, effective electrical connection is achieved. Compared with lead solder paste, it meets environmental protection requirements; compared with lead-free solder paste, it reduces defects such as tin whiskers and tin cracks.

[0020] 2. Fillers or spacer balls can be added to the conductive silver glue / heat dissipation adhesive and mixed evenly to ensure the consistency of the mounting thickness of electronic components, ensure the uniformity of the quality of the regulator products, and improve the reliability of the products. Since the price of glue materials (especially silver glue) is relatively high, the amount needs to be effectively controlled. Adding fillers can also reduce the amount of silver glue used and reduce material costs.

[0021] 3. The plastic bracket is connected to the circuit board assembly through the ultrasonic wire bonding automated production process, which reduces the electrical connection space of the internal structure, realizes the electrical function of the vehicle power regulator, and improves the degree of automation of production. Compared with the existing soldering production process, the production efficiency is significantly improved. In addition, the consistency of wire bonding is high and the reliability is also improved.

[0022] The above summary is for illustrative purposes only and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments and features described above, further aspects, embodiments and features of the present invention will be readily apparent by reference to the accompanying drawings and the following detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or technical descriptions will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0024] Figure 1 is an exploded view of the present invention;

[0025] Figure 2 It is a schematic diagram of the structure of the present invention;

[0026] Figure 3 It is a schematic diagram of the installation of electronic components of the present invention;

[0027] Figure 4 It is a process flow chart of the present invention.

[0028] As shown in the figure: 1. Plastic bracket; 2. Heat sink; 3. Electronic components; 4. Circuit board; 5. Metal wire; 6. Spacer ball. DETAILED DESCRIPTION

[0029] The embodiments of the present application are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and cannot be understood as limiting the present application.

[0030] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0031] The present invention is further described in detail below in conjunction with the full text.

[0032] Combined with Figure 1-Figure 3, a mixed glue fixed automobile power regulator, comprising a plastic bracket 1 and a heat sink 2, a circuit board assembly and a metal wire 5 on the plastic bracket 1;

[0033] The circuit board assembly is pasted on the heat sink 2 by mixed glue, and the circuit board assembly includes electronic components 3 and circuit boards 4. The electronic components 3 are pasted on the circuit boards 4 by mixed glue;

[0034] The mixed glue is composed of conductive silver glue or heat dissipation adhesive and filler;

[0035] The filler is a spacer ball 6, and the spacer ball 6 is made of plastic or glass;

[0036] The bare chip or the pads on the circuit board 4 are connected to the insert terminals of the plastic bracket 1 by ultrasonic bonding using a plurality of metal wires 5 .

[0037] In the production process of the regulator circuit board assembly, an appropriate amount of silver glue is printed on the corresponding bonding area of ​​the circuit board to bond the electronic components 3 to the circuit board 4, especially the key electronic component chips, and then heated and cured to assemble into a circuit board assembly to achieve the electrical performance of the key hardware. The mixed glue can also be used to ensure the high consistency of component mounting. The conductive silver glue and filler are used to connect the electronic components 3 to the circuit board 4, and the heat dissipation adhesive and filler are used to connect the circuit board assembly to the heat sink 2.

[0038] The spacer balls 6 account for more than 75% of the mounting surface. Through reasonable proportions, appropriate fillers are added to the conductive silver glue / heat dissipation adhesive. Spacer balls 6 made of different materials such as glass beads, plastic balls, etc. with similar sizes can be designed according to the product height. The added spacer balls 6 account for at least 75% of the mounting surface.

[0039] When the present invention is specifically implemented, Figure 4 The mixed glue is placed on the heat sink 2 on the plastic bracket, and the circuit board assembly is bonded to the heat sink 2 by applying pressure, and heated and cured to form a semi-finished product. When pressed, the spacer balls in the glue ensure the consistency of the circuit board mounting height.

[0040] Silver glue and filler are used to connect electronic components 3 with circuit boards 4. By directly bonding key electronic components 3 to circuit boards 4 on plastic brackets through a mixture of silver glue and filler, electrical performance is achieved while ensuring chip mounting consistency.

[0041] The pads on the bare chip or circuit board 4 are connected to the terminals of the plastic bracket insert by ultrasonic bonding using multiple metal wires 5. The metal wires can use 2-20 mil (50-500 μm) aluminum wire or copper wire. The electrical connection space is effectively reduced, and the possibility of adverse failures caused by soldering materials such as tin whiskers and tin cracks is effectively avoided, thereby improving the reliability of product quality.

[0042] The mounting pressure is 14-24N and the holding time is 1-2s.

[0043] The conductive silver glue or heat dissipation adhesive and filler are put into the fixture of the mixer and mixed evenly, with a speed of 800-1600r and a time of 40-80s.

[0044] There should be at least 3 spacer balls at the bottom of the pad.

[0045] As the metal wire, an aluminum wire or a copper wire of 50-500 μm is used.

[0046] Add appropriate spacer balls 6 to the conductive silver glue / heat dissipation adhesive. Under pressure, the spacer balls 6 are dispersed into a layer with the liquid glue to ensure the effective bonding height of the mounted parts, which is conducive to the consistency of wire bonding. First, design spacer balls 6 with similar diameters according to the product height requirements; combine theoretical calculations (calculation steps - convenient for data support) to confirm the ratio of conductive silver glue / heat dissipation adhesive and spacer balls 6; to ensure the consistency of the wire bonding plane, it is necessary to ensure that there are at least 3 spacer balls 6 at the bottom of the wire bonding pad. Considering the glue application, the added spacer 6 accounts for at least 75% of the mounting surface. According to the total mass of the mass volume density equal to the weight of the spacer balls plus the glue, determine the ratio of the glue and the spacer balls 6.

[0047] Add the corresponding mass of material into the hose and put it into the mixer for mixing. By controlling the speed (800-1600) and time (40-80s), the uniformity of the mixing can be ensured. Heat will be generated during the mixing process, and the mixing can be divided into multiple stages, and the process should be refrigerated.

[0048] By directly bonding the key electronic component chip / circuit board 4 to the heat sink 2 on the plastic bracket through the mixed glue, the mounting consistency is ensured. Through automated production, while achieving electrical performance, the production efficiency can be effectively improved, the possibility of the protective glue material not being able to solidify can be avoided, and the product yield can be improved.

[0049] The pads of the bare chip or circuit board are connected to the terminals of the plastic bracket insert by ultrasonic bonding of multiple metal wires 5, and electrical connection is achieved through the formation of metal compounds, which effectively avoids the possibility of adverse failures caused by tin whiskers and tin cracks, thereby improving the reliability of product quality and meeting the environmental protection and lead-free requirements of the product.

[0050] Embodiment 1:

[0051] Conductive silver glue and spacer balls are selected, and the corresponding conductive silver glue and spacer balls are added to the rubber tube, and mixed in the fixture of the mixer. The uniformity of the mixed glue is ensured by controlling the speed of 800r and the time of 40s. Heat is generated during the mixing process, and the mixing is divided into multiple stages, and the process is refrigerated. By taking an appropriate amount of silver glue and printing it on the corresponding bonding area of ​​the circuit board, the electronic component 3 is bonded to the circuit board 4. The mounting pressure is 14N, the pressure holding time is 1s, and the proportion of the spacer ball 6 is 80%, ensuring the consistency of the height of the component mounting.

[0052] Embodiment 2:

[0053] Select heat dissipation adhesive and spacer balls, add corresponding conductive silver glue and spacer balls into the rubber tube, put them into the fixture of the mixer for mixing, control the speed of 1200r and time of 60s, the proportion of spacer balls 6 is 78%, the uniformity of the mixed glue is ensured, heat is generated during the mixing process, and the mixing is carried out in multiple stages, and the process is refrigerated, the circuit board 4 is directly bonded to the heat sink 2 on the plastic bracket through the mixed glue, and the pads of the bare chip or circuit board are connected to the terminals of the plastic bracket insert by ultrasonic bonding through multiple 50-500μm copper wires, and electrical connection is achieved through the formation of metal compounds, which effectively avoids the possibility of adverse failures caused by tin wire materials such as tin whiskers and tin cracks, improves the reliability of product quality, meets the environmental protection and lead-free requirements of the product, ensures the consistency of mounting, and through automated production, while achieving electrical performance, it can effectively improve production efficiency, avoid the possibility of adverse effects of the protective glue material that cannot be cured, and improve the yield of the product.

[0054] The present invention and its embodiments are described above, and such description is not restrictive. What is shown in the full text is only one of the embodiments of the present invention, and the actual structure is not limited thereto. In short, if ordinary technicians in the field are inspired by it, without departing from the purpose of the invention, they can design a structure and embodiment similar to the technical solution without creativity, which should belong to the protection scope of the present invention.

Claims

1. A mixed glue fixed automobile power generation regulator, characterized in that: It comprises a plastic bracket (1), a heat sink (2), a circuit board assembly and a metal wire (5) on the plastic bracket (1); The circuit board assembly is adhered to the heat sink (2) by means of mixed glue, the circuit board assembly comprises electronic components (3) and a circuit board (4), and the electronic components (3) are mounted on the circuit board (4) by means of mixed glue; The mixed glue is composed of conductive silver glue or heat dissipation adhesive and filler; The filler is a spacer ball (6), and the spacer ball (6) is made of plastic or glass; The soldering pads on the bare chip or circuit board (4) and the insert terminals of the plastic bracket (1) are connected to each other by ultrasonic bonding using a plurality of the metal wires (5).

2. According to the mixed glue fixed automobile power generation regulator of claim 1, it is characterized by: The spacer balls (6) account for more than 75% of the mounting surface.

3. According to the mixed glue fixed automobile power generation regulator of claim 1, it is characterized by: The conductive silver glue and filler are used for connecting the electronic components (3) and the circuit board (4).

4. According to the mixed glue fixed automobile power generation regulator of claim 1, it is characterized by: The heat dissipation adhesive and filler are used for connecting the circuit board assembly and the heat dissipation plate (2).

5. According to the mixed glue fixed automobile power generation regulator of claim 1, it is characterized by: The mounting pressure is 14-24N, and the holding time is 1-2s.

6. The automobile power generation regulator fixed by mixed glue according to claim 1, characterized in that: The conductive silver glue or heat dissipation adhesive and filler are put into a fixture of a mixer and mixed evenly at a speed of 800-1600r and a time of 40-80s.

7. The automobile power generation regulator fixed by mixed glue according to claim 1, characterized in that: The bottom of the pad needs to have at least 3 spacer balls (6).

8. The automobile power regulator with a wire bonding structure combined with a spacer ball (6) and a glue-mixed fixed structure according to claim 1, characterized in that: The metal wire (5) uses an aluminum wire or a copper wire with a thickness of 50-500 μm.

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