High-voltage solid-state soft starter based on modular heat dissipation structure

Abstract

The application discloses a high-voltage solid-state soft starting device based on a modular heat dissipation structure and relates to the technical field of high-voltage solid-state soft starting devices.The high-voltage solid-state soft starting device comprises a case and a heat dissipation assembly, the case is symmetrically provided with mounting grooves on both sides, the heat dissipation assembly is arranged in the mounting grooves, and the heat dissipation assembly comprises a base, a flow-through hole, heat dissipation fins, a cavity, a heat dissipation fan, a limiting block, a return spring, a pressing plate and a limiting groove.The base is arranged in the mounting groove, and the surface of the base is provided with the flow-through hole.In use, the modular heat dissipation structure can be disassembled and assembled according to needs, the heat dissipation efficiency of the device is ensured, the device is prevented from being unstable in operation due to excessively high temperature, and when the heat dissipation structure is not installed, the flow of the cooling liquid at the installation position is not affected, the heat dissipation structure can be stably fixed when the heat dissipation structure is installed, and the installation position can be shielded when the heat dissipation structure is not installed, so that dust is prevented from entering and being difficult to clean.

Description

Technical Field

[0001] This invention relates to the field of high-voltage solid-state soft starter technology, specifically a high-voltage solid-state soft starter based on a modular heat dissipation structure. Background Technology

[0002] High-voltage solid-state soft starters achieve smooth starting of motors and mechanical loads by employing technologies such as voltage reduction or frequency conversion, thereby reducing starting current. Conventional high-voltage solid-state soft starters use semi-controlled thyristors and an AC-AC voltage regulation method; their output voltage can be adjusted, but the frequency cannot. The starting output torque is relatively small, while the starting current is relatively large, making them suitable for medium to light loads.

[0003] Existing high-voltage solid-state soft starters have heat dissipation structures that are difficult to disassemble and install. Furthermore, during operation, the operating power of the heat dissipation structure can only be adjusted according to the operating temperature of the device. Once the operating power of the heat dissipation structure reaches its maximum, the heat dissipation efficiency cannot be increased further.

[0004] Therefore, in view of this, we studied and improved the existing structure and its shortcomings, and proposed a high-voltage solid-state soft starter based on a modular heat dissipation structure. Summary of the Invention

[0005] The purpose of this invention is to provide a high-voltage solid-state soft starter based on a modular heat dissipation structure to solve the problems mentioned in the background art.

[0006] To achieve the above objectives, the present invention provides the following technical solution: a high-voltage solid-state soft starter based on a modular heat dissipation structure, comprising a chassis and a heat dissipation assembly. The chassis has symmetrically arranged mounting slots on both sides, and the heat dissipation assembly is disposed within the mounting slots. The heat dissipation assembly includes a base, flow holes, heat sinks, a cavity, a cooling fan, a limiting block, a return spring, a pressure plate, and a limiting groove. The mounting slot contains a base with flow holes on its surface. Heat sinks are connected to the surface of the base, and cavities are formed between the heat sinks. A cooling fan is connected within the cavity. Limiting blocks are symmetrically arranged on one side of the heat sinks, and a return spring is connected to the inner side of each limiting block. The other end of the return spring is connected to a pressure plate, and limiting grooves are symmetrically arranged on both sides of the pressure plate.

[0007] Furthermore, the heat sinks are evenly distributed on the base, and the width of the heat sink in the middle of the base is greater than that of the heat sinks on both sides of the base. The pressure plate is elastically connected to the limiting block through a reset spring, and the pressure plate is slidably connected to the limiting block through a limiting groove.

[0008] Furthermore, a transfer chamber is provided on one side of the chassis, and cooling pipes are provided on both sides of the transfer chamber. A cabinet door is provided on the front side of the chassis. The cooling pipes are equidistant from the transfer chamber, and the flow holes are connected to the cooling pipes.

[0009] Furthermore, a liquid storage chamber is provided on the other side of the chassis, and a circulation pump is connected to one side of the liquid storage chamber. A diversion channel is provided on the rear side of the chassis, and a heat absorption pipe is provided on one side of the diversion channel. The heat absorption pipe is connected to the transfer chamber. The circulation pump is connected to the diversion channel through a pipe. The heat absorption pipes are equidistantly distributed about the diversion channel.

[0010] Furthermore, a connecting assembly is provided in the mounting slot. The connecting assembly includes a sleeve, a connecting spring, a base, and a heat-absorbing block. The sleeve is connected in the mounting slot, and the connecting spring is connected to the outside of the sleeve. The base is connected to one side of the connecting spring, and the heat-absorbing block is connected to the middle of the connecting spring side of the base.

[0011] Furthermore, the connecting assembly also includes a through groove, a sliding groove, a valve groove, and a sealing groove. The chassis has a through groove in the middle and sliding grooves are symmetrically opened at the four corners of the chassis. The through groove has a valve groove in the middle and sealing grooves are opened on both sides of the through groove.

[0012] Furthermore, the connecting assembly also includes a movable spring, a base plate, a sealing plate, and a valve plate. The movable spring is connected to the inner side of the sleeve, and the other end of the movable spring is connected to the base plate. The sealing plates are symmetrically connected to both sides of the base plate, and the valve plate is connected to the middle of the base plate.

[0013] Furthermore, the chassis is elastically connected to the mounting groove via a connecting spring, and the chassis is slidably connected to the chassis via the mounting groove. The through groove is connected to the cooling pipe, and the valve plate and the sealing plate are respectively connected to the through groove via the valve groove and the sealing groove. The base plate is elastically connected to the chassis via a moving spring, and the chassis is slidably connected to the sleeve via a sliding groove.

[0014] Furthermore, the mounting groove is symmetrically provided with fixing grooves on both sides, and fixing springs are symmetrically connected in the fixing grooves. The other end of the fixing spring is connected to a fixing plate, and the surface of the fixing plate is provided with an inclined surface.

[0015] Furthermore, the fixing plates are tightly fitted together, and the fixing plates are elastically connected to the fixing grooves via fixing springs. The fixing plates are slidably connected to the mounting grooves via fixing grooves, and the fixing plates are engaged with the base via heat sinks.

[0016] This invention provides a high-voltage solid-state soft starter based on a modular heat dissipation structure, which has the following advantages: During use, the modular heat dissipation structure can be disassembled and assembled as needed, ensuring the heat dissipation efficiency of the device and preventing unstable operation due to excessive temperature inside the device. Moreover, when the heat dissipation structure is not installed, it will not affect the flow of coolant at the installation point. When the heat dissipation structure is installed, it can be firmly fixed, and when not installed, the installation point can be shielded to prevent dust from entering and being difficult to clean.

[0017] 1. In use, this invention allows for convenient installation of the heat dissipation components as needed. During installation, simply insert the base into the mounting slot for automatic fixation. After fixation, the flow hole connects to the cooling pipe, ensuring unobstructed flow of coolant. During operation, the circulating pump draws coolant from the storage chamber and sends it into the distribution tank. The coolant then flows from the heat absorption pipe into the transfer chamber, absorbing heat transferred to the rear of the chassis via the heat absorption pipe. After entering the transfer chamber, the coolant can flow back to the storage chamber via the cooling pipe. During this return flow, the heat sink can absorb the coolant flowing through the flow hole via the base. The liquid absorbs heat, while the cooling fan blows the heat away, accelerating the heat dissipation of the heat sink and ensuring its heat absorption efficiency. When the temperature inside the chassis is too high, in addition to increasing the operating power of the cooling fan, new heat dissipation components can be installed in other empty mounting slots to improve the overall heat dissipation efficiency. This prevents the cooling fan from reaching its maximum power and still being unable to dissipate heat in time, which could lead to excessively high temperatures inside the chassis and cause device failure. In summary, the modular heat dissipation structure allows for disassembly and assembly as needed, ensuring the device's heat dissipation efficiency and preventing instability caused by excessively high temperatures.

[0018] 2. In this invention, when the heat dissipation component is not installed, the coolant can flow through the through groove in the cooling pipe. When the heat dissipation component is installed, as the base slides in, it first presses the base plate to slide within the mounting groove and compresses the moving spring, causing the base plate to fit tightly against the chassis. At this time, the valve plate and sealing plate engage with the through groove through the valve groove and sealing groove respectively, sealing the through groove and preventing coolant leakage when the chassis moves. After the base plate and chassis are in contact, the base can press the chassis to slide within the mounting groove and compress the connecting spring. The sleeve can restrict the chassis through the sliding groove, preventing the chassis from shifting during movement. After the heat dissipation component is installed, the chassis stops moving, and the heat absorption block is tightly attached to the chassis. The heat inside the mounting slot is absorbed by the chassis sidewalls and transferred to the base via the chassis and base plate, ultimately dissipating to the outside, further improving overall heat dissipation efficiency. When the heat dissipation components are removed, the chassis and base plate can spring back to their original positions under the action of connecting springs and return springs, thus ensuring normal flow of coolant and preventing coolant leakage. The sleeve can restrict the chassis to prevent excessive rebound, which could cause the through slot to fail to accurately align with the cooling pipes. In summary, when the heat dissipation components are not installed, the flow of coolant at the installation point is not affected. When the heat dissipation components are installed and after installation, not only can coolant leakage be prevented, but heat dissipation inside the chassis can also be accelerated.

[0019] 3. When the heat dissipation component is not installed, the fixing plate can seal the mounting slot, preventing dust from entering and becoming difficult to clean. When the heat dissipation component is installed, as the base is pushed in, the base is pressed into the fixing slot by the inclined surface of the fixing plate, compressing the fixing spring. Once the flow hole connects with the cooling pipe, the fixing plate rebounds under the action of the fixing spring. The rebound force of the connecting spring and the moving spring is transferred to the base through the chassis and base plate. Combined with the fixing plate's restraint on the base by the heat sink fins, the base can be firmly fixed in the mounting slot. The heat on the heat sink fins on both sides of the base can be transferred to the pressure plate through the fixing plate and dissipated to the outside with the operation of the cooling fan. When disassembling the heat dissipation component, simply press the pressure plate to apply force to the fixing plate, thereby pressing it into the fixing slot. In addition to the restriction of the base by the fixing plate, the base can be ejected from the mounting slot by the rebound force of the connecting spring and the moving spring, thus completing the disassembly of the heat dissipation component. After the base is removed from the mounting slot, the fixing plate rebounds and resets under the action of the fixing spring, sealing the mounting slot again and blocking the base plate to prevent excessive rebound of the base plate, which could cause coolant to flow out of the sealing slot and valve slot, resulting in leakage. After the base is disassembled, the pressure plate can rebound to its original position under the action of the reset spring, avoiding obstruction of the next installation. The limit block can restrict the pressure plate through the limit slot to prevent the pressure plate from tilting during movement. In summary, when installing the heat dissipation component, it can automatically and securely fix the heat dissipation component. When not installed, it can also cover the mounting slot to prevent dust from entering the mounting slot and making it difficult to clean. Attached Figure Description

[0020] Figure 1 This is a three-dimensional cross-sectional view of the high-voltage solid-state soft starter based on a modular heat dissipation structure according to the present invention.

[0021] Figure 2 This is a three-dimensional exploded cross-sectional view of the heat dissipation component of a high-voltage solid-state soft starter based on a modular heat dissipation structure according to the present invention.

[0022] Figure 3 This is a schematic diagram of the overall three-dimensional structure of a high-voltage solid-state soft starter based on a modular heat dissipation structure according to the present invention.

[0023] Figure 4 This is a three-dimensional exploded cross-sectional view of the chassis of a high-voltage solid-state soft starter device based on a modular heat dissipation structure according to the present invention.

[0024] Figure 5 This is a three-dimensional exploded cross-sectional view of the connecting components of a high-voltage solid-state soft starter device based on a modular heat dissipation structure according to the present invention.

[0025] Figure 6This is a cross-sectional perspective view of the connection component of the heat dissipation assembly of a high-voltage solid-state soft starter device based on a modular heat dissipation structure according to the present invention.

[0026] In the diagram: 1. Chassis; 2. Mounting slot; 3. Heat dissipation assembly; 301. Base; 302. Flow hole; 303. Heat sink; 304. Cavity; 305. Cooling fan; 306. Limiting block; 307. Return spring; 308. Pressure plate; 309. Limiting groove; 4. Transfer chamber; 5. Cooling pipe; 6. Cabinet door; 7. Liquid storage chamber; 8. Circulating pump; 9. Diverter groove; 10. Heat absorption pipe; 11. Connecting assembly; 1101. Sleeve; 1102. Connecting spring; 1103. Chassis; 1104. Heat absorption block; 1105. Through groove; 1106. Slide groove; 1107. Valve groove; 1108. Sealing groove; 1109. Moving spring; 1110. Base plate; 1111. Sealing plate; 1112. Valve plate; 12. Fixing groove; 13. Fixing spring; 14. Fixing plate. Detailed Implementation

[0027] Please see Figures 1 to 6 The present invention provides a technical solution: a high-voltage solid-state soft starter based on a modular heat dissipation structure, comprising a chassis 1 and a heat dissipation component 3. The chassis 1 has symmetrically arranged mounting slots 2 on both sides. The heat dissipation component 3 is disposed within the mounting slots 2. The heat dissipation component 3 includes a base 301, a flow hole 302, a heat sink 303, a cavity 304, a cooling fan 305, a limiting block 306, a return spring 307, a pressure plate 308, and a limiting groove 309. The mounting slot 2 contains the base 301, and the surface of the base 301 has a flow hole 302. The surface of the base 301 is connected to the heat sink 303, and a cavity 304 is provided between the heat sinks 303. A cooling fan 305 is connected within the cavity 304. A limiting block 306 is symmetrically arranged on one side of the heat sink 303, and a return spring 307 is connected to the inner side of the limiting block 306. The other end of the return spring 307 is connected to the pressure plate 308, and limiting grooves 309 are symmetrically arranged on both sides of the pressure plate 308.

[0028] Please see Figures 1 to 4Heat sinks 303 are evenly distributed on the base 301, and the width of the heat sink 303 in the middle of the base 301 is greater than that of the heat sinks 303 on both sides of the base 301. The pressure plate 308 is elastically connected to the limiting block 306 through the return spring 307, and the pressure plate 308 is slidably connected to the limiting block 306 through the limiting groove 309. A transfer chamber 4 is provided on one side of the chassis 1, and cooling pipes 5 are provided on both sides of the transfer chamber 4. A cabinet door 6 is provided on the front side of the chassis 1. The cooling pipes 5 are evenly distributed about the transfer chamber 4, and the flow holes 302 are connected to the cooling pipes 5. A liquid storage chamber 7 is provided on the other side of the chassis 1, and a circulation pump 8 is connected to one side of the liquid storage chamber 7. A diversion channel is provided on the rear side of the chassis 1. The distribution groove 9 has a heat absorption pipe 10 on one side, which is connected to the transfer chamber 4. The circulation pump 8 is connected to the distribution groove 9 through a pipe. The heat absorption pipes 10 are equidistantly distributed about the distribution groove 9. The mounting groove 2 has symmetrically opened fixing grooves 12 on both sides, and fixing springs 13 are symmetrically connected in the fixing grooves 12. The other end of the fixing springs 13 is connected to a fixing plate 14, and the surface of the fixing plate 14 is provided with an inclined surface. The fixing plates 14 are tightly fitted together, and the fixing plates 14 are elastically connected to the fixing grooves 12 through the fixing springs 13. The fixing plates 14 are slidably connected to the mounting groove 2 through the fixing grooves 12, and the fixing plates 14 are engaged with the base 301 through the heat sink 303.

[0029] The specific operation is as follows: During use, the heat dissipation component 3 can be conveniently installed as needed. During installation, simply insert the base 301 into the mounting slot 2 to automatically fix it. After fixing, the flow hole 302 can be connected to the cooling pipe 5 to maintain the smooth flow of coolant. During the operation of the device, the circulation pump 8 draws the coolant from the storage chamber 7 and sends it into the distribution tank 9. The coolant can then flow from the heat absorption pipe 10 into the transfer chamber 4. During the flow, the heat absorption pipe 10 absorbs the heat transferred to the rear of the chassis 1. After entering the transfer chamber 4, the coolant can flow back to the storage chamber 7 from the cooling pipe 5. During the return flow, the heat sink 303 can absorb the heat from the coolant flowing through the flow hole 302 through the base 301. The cooling fan 305 absorbs heat and blows it away, accelerating the heat dissipation of the heat sink 303 and ensuring its heat absorption efficiency. When the temperature inside the chassis 1 is too high, in addition to increasing the operating power of the cooling fan 305, new heat dissipation components 3 can be installed in other empty mounting slots 2 to improve overall heat dissipation efficiency. This prevents the cooling fan 305 from reaching its maximum power and still failing to dissipate heat in time, thus avoiding overheating inside the chassis 1 and causing device malfunction. In summary, the modular heat dissipation structure allows for disassembly and assembly as needed, ensuring the device's heat dissipation efficiency and preventing instability due to overheating. When no heat dissipation component 3 is installed, the mounting plate 14 can support the mounting slot 2. To prevent dust from entering the mounting slot 2 and making it difficult to clean, the base 301 is sealed during installation of the heat dissipation component 3. As the base 301 is pushed in, it is pressed into the mounting slot 12 by the inclined surface of the fixing plate 14, compressing the fixing spring 13. When the flow hole 302 connects to the cooling pipe 5, the fixing plate 14 rebounds under the action of the fixing spring 13. The rebound force of the connecting spring 1102 and the moving spring 1109 is transmitted to the base 301 through the chassis 1103 and the base plate 1110. Combined with the fixing plate 14's restriction of the base 301 by the heat sink 303, the base 301 is firmly fixed in the mounting slot 2. The heat from the heat sink 303 on both sides of the base 301 is transferred to the pressure plate 308 through the fixing plate 14, and then further transferred by the cooling fan 30. The heat dissipation of heat sink 3 is emitted to the outside. When disassembling heat sink 3, simply press the pressure plate 308 to apply force to the fixing plate 14, thereby pressing it into the fixing groove 12. This releases the fixing plate 14 from the base 301, allowing the base 301 to be ejected from the mounting groove 2 under the rebound force of the connecting spring 1102 and the moving spring 1109, thus completing the disassembly of heat sink 3. After the base 301 is removed from the mounting groove 2, the fixing plate 14 rebounds and resets under the action of the fixing spring 13, sealing the mounting groove 2 again and blocking the base plate 1110. This prevents the base plate 1110 from rebounding too much, which could cause coolant to flow out of the sealing groove 1108 and valve groove 1107 into the through groove 1105, causing leakage. After the base 301 is disassembled...The pressure plate 308 can spring back to its original position under the action of the return spring 307, avoiding obstruction of the next installation. The limiting block 306 can restrict the pressure plate 308 through the limiting groove 309, preventing the pressure plate 308 from tilting during movement. In summary, when installing the heat dissipation component 3, it can automatically and securely fix the heat dissipation component 3. When not installed, it can also cover the mounting groove 2 to prevent dust from entering and becoming difficult to clean.

[0030] Please see Figure 1 and Figures 5 to 6 A connecting assembly 11 is provided in the mounting groove 2. The connecting assembly 11 includes a sleeve 1101, a connecting spring 1102, a base 1103, and a heat-absorbing block 1104. The sleeve 1101 is connected in the mounting groove 2, and the connecting spring 1102 is connected to the outside of the sleeve 1101. The base 1103 is connected to one side of the connecting spring 1102, and the heat-absorbing block 1104 is connected to the middle of one side of the base 1103. The connecting assembly 11 also includes a through groove 1105, a sliding groove 1106, a valve groove 1107, and a sealing groove 1108. The through groove 1105 is provided in the middle of the base 1103, and the sliding grooves 1106 are symmetrically opened at the four corners of the base 1103. The valve groove 1107 is opened in the middle of the through groove 1105, and the sealing grooves 1108 are opened on both sides of the through groove 1105. The connecting assembly 11 also includes a movable spring 1. 109, base plate 1110, sealing plate 1111 and valve plate 1112, a movable spring 1109 is connected to the inner side of sleeve 1101, and the other end of the movable spring 1109 is connected to base plate 1110. Sealing plates 1111 are symmetrically connected to both sides of base plate 1110, and valve plate 1112 is connected to the middle of base plate 1110. Chassis 1103 is elastically connected to mounting groove 2 through connecting spring 1102, and chassis 1103 is slidably connected to chassis 1 through mounting groove 2. Through groove 1105 is connected to cooling pipe 5, and valve plate 1112 and sealing plate 1111 are respectively connected to through groove 1105 through valve groove 1107 and sealing groove 1108. Base plate 1110 is elastically connected to chassis 1103 through movable spring 1109, and chassis 1103 is slidably connected to sleeve 1101 through sliding groove 1106.

[0031] The specific operation is as follows: When the heat dissipation component 3 is not installed, the coolant can flow through the through groove 1105 in the cooling pipe 5. When the heat dissipation component 3 is installed, as the base 301 slides in, the base 301 first presses the base plate 1110 to slide in the mounting groove 2 and compresses the moving spring 1109, so that the base plate 1110 and the chassis 1103 are tightly fitted. At this time, the valve plate 1112 and the sealing plate 1111 respectively pass through the valve groove 1107 and the sealing groove 1108 to the through groove 5. The slot 1105 engages, sealing the through slot 1105 to prevent coolant leakage when the chassis 1103 moves. After the base plate 1110 is attached to the chassis 1103, the base 301 can press the chassis 1103 to slide within the mounting slot 2 and compress the connecting spring 1102. The sleeve 1101 can restrict the chassis 1103 through the sliding groove 1106 to prevent the chassis 1103 from shifting during movement. (The text abruptly ends here, likely due to an incomplete sentence or missing information.) After installation, the chassis 1103 stops moving, and the heat-absorbing block 1104 is pressed tightly against the inner wall of the mounting slot 2. The heat inside the chassis 1 is absorbed through the side wall of the chassis 1 and transferred to the base 301 through the chassis 1103 and the base plate 1110, and finally dissipated to the outside, further improving the overall heat dissipation efficiency. When the heat dissipation component 3 is removed, the chassis 1103 and the base plate 1110 can also spring back to their original positions under the action of the connecting spring 1102 and the return spring 307, thereby ensuring the normal flow of coolant and preventing coolant leakage. The sleeve 1101 can restrict the chassis 1103 to prevent the chassis 1103 from springing back too much and causing the through slot 1105 to fail to accurately connect with the cooling pipe 5. In summary, when the heat dissipation component 3 is not installed, it will not affect the flow of coolant at the installation point. When the heat dissipation component 3 is installed and after installation, it can not only prevent coolant leakage, but also accelerate the dissipation of heat inside the chassis 1.

[0032] In summary, this high-voltage solid-state soft starter based on a modular heat dissipation structure allows the mounting plate 14 to seal the mounting slot 2 when the heat dissipation component 3 is not installed, preventing dust from entering the mounting slot 2 and making it difficult to clean. Coolant can flow through the cooling pipe 5 via the through-slot 1105. During operation, the circulating pump 8 draws coolant from the storage chamber 7 and sends it into the distribution tank 9. The coolant can then flow from the heat absorption pipe 10 into the transfer chamber 4. During this flow, the heat absorption pipe 10 absorbs the heat transferred to the rear of the chassis 1. After entering the transfer chamber 4, the coolant can flow back to the storage chamber 7 via the cooling pipe 5. During this return flow, the heat sink 303 can absorb heat from the coolant flowing through the flow hole 302 via the base 301. Meanwhile, the operation of the cooling fan 305 can blow away heat, accelerate the heat dissipation of the heat sink 303, and ensure the heat absorption efficiency of the heat sink 303. When the temperature inside the chassis 1 is too high, in addition to increasing the operating power of the cooling fan 305, new heat dissipation components 3 can also be installed in other empty mounting slots 2 to improve the overall heat dissipation efficiency. This prevents the cooling fan 305 from reaching its maximum power and still being unable to dissipate heat in time, which could lead to excessively high temperatures inside the chassis 1 and cause device malfunction. During installation, simply insert the base 301 into the mounting slot 2 to automatically fix it in place. After fixing, the flow hole 302 can be connected to the cooling pipe 5 to maintain smooth flow of coolant. During installation, as the base 301 is pushed in, the base... 301 can be pressed into the fixing groove 12 by the inclined surface of the fixing plate 14 and the fixing spring 13 is compressed. At the same time, the base 301 first presses the base plate 1110 to slide in the mounting groove 2 and compresses the moving spring 1109, so that the base plate 1110 and the chassis 1103 are tightly fitted. At this time, the valve plate 1112 and the sealing plate 1111 are respectively engaged with the through groove 1105 through the valve groove 1107 and the sealing groove 1108, sealing the through groove 1105 to prevent coolant leakage when the chassis 1103 moves. After the base plate 1110 and the chassis 1103 are fitted, the base 301 can press the chassis 1103 to slide in the mounting groove 2 by the base plate 1110 and compress the connecting spring 1102. The sleeve 1101 can slide on the chassis 1103 through the sliding groove 1106. 03. To prevent the chassis 1103 from shifting during movement, once the flow hole 302 is connected to the cooling pipe 5, the fixing plate 14 can rebound under the action of the fixing spring 13. The rebound force of the connecting spring 1102 and the moving spring 1109 is transmitted to the base 301 through the chassis 1103 and the base plate 1110. With the fixing plate 14 restricting the base 301 through the heat sink 303, the base 301 can be firmly fixed in the mounting slot 2. The heat on the heat sink 303 on both sides of the base 301 can be transferred to the pressure plate 308 through the fixing plate 14 and dissipated to the outside as the cooling fan 305 runs. After the heat dissipation component 3 is installed, the chassis 1103 stops moving, and the heat absorption block 1104 is tightly attached to the inner wall of the mounting slot 2.The heat inside the chassis 1 is absorbed through the side wall of the chassis 1 and transferred to the base 301 via the chassis 1103 and base plate 1110, and finally dissipated to the outside, further improving the overall heat dissipation efficiency. When disassembling the heat dissipation component 3, simply press the pressure plate 308, which applies force to the fixing plate 14, pressing it into the fixing groove 12 and releasing the fixing plate 14 from the base 301. The chassis 1103 and base plate 1110 can spring back to their original positions under the action of the connecting spring 1102 and the return spring 307, thereby ensuring the normal flow of coolant and preventing coolant leakage. The sleeve 1101 can restrict the chassis 1103 to prevent the chassis 1103 from springing back too much, which would cause the through groove 1105 to fail to accurately align with the cooling pipe 5. The base 301 can also be ejected from the mounting slot 2 under the rebound force of the connecting spring 1102 and the moving spring 1109, thus completing the disassembly of the heat dissipation component 3. After the base 301 is removed from the mounting slot 2, the fixing plate 14 rebounds and resets under the action of the fixing spring 13, sealing the mounting slot 2 again and blocking the bottom plate 1110 to prevent excessive rebound of the bottom plate 1110, which could cause coolant to flow out of the sealing slot 1108 and valve slot 1107 into the through slot 1105, resulting in leakage. After the base 301 is disassembled, the pressure plate 308 can rebound to its original position under the action of the reset spring 307, avoiding obstruction of the next installation. The limiting block 306 can restrict the pressure plate 308 through the limiting slot 309 to prevent the pressure plate 308 from tilting during movement.

[0033] The embodiments of the present invention are given for illustrative and descriptive purposes only, and are not intended to be exhaustive or to limit the invention to the forms disclosed. Many modifications and variations will be apparent to those skilled in the art. The embodiments were chosen and described in order to better illustrate the principles and practical application of the invention, and to enable those skilled in the art to understand the invention and to design various embodiments with various modifications suitable for a particular purpose.

Claims

1. A high-voltage solid-state soft starter based on a modular heat dissipation structure, characterized in that, The device includes a chassis (1) and a heat dissipation assembly (3). The chassis (1) has symmetrical mounting slots (2) on both sides. The heat dissipation assembly (3) is disposed within the mounting slots (2). The heat dissipation assembly (3) includes a base (301), a flow hole (302), a heat sink (303), a cavity (304), a cooling fan (305), a limiting block (306), a reset spring (307), a pressure plate (308), and a limiting groove (309). The mounting slot (2) contains a base (301), and the surface of the base (301) has a flow hole (302). 1) A heat sink (303) is connected to the surface, and a cavity (304) is provided between the heat sinks (303). A cooling fan (305) is connected inside the cavity (304). A limit block (306) is symmetrically provided on one side of the heat sink (303), and a return spring (307) is connected inside the limit block (306). A pressure plate (308) is connected to the other end of the return spring (307), and limit grooves (309) are symmetrically provided on both sides of the pressure plate (308). A transfer chamber (4) is provided on one side of the chassis (1), and cooling pipes (5) are provided on both sides of the transfer chamber (4). The front of the chassis (1) is provided with a cabinet door (6). The cooling pipes (5) are equidistantly distributed about the transfer chamber (4), and the flow holes (302) are connected to the cooling pipes (5). The other side of the chassis (1) is provided with a liquid storage chamber (7), and a circulation pump (8) is connected to one side of the liquid storage chamber (7). The rear of the chassis (1) is provided with a diversion channel (9), and a heat absorption pipe (10) is provided on one side of the diversion channel (9). The heat absorption pipe (10) is connected to the transfer chamber (4). The circulation pump (8) is connected to the diversion channel (9) through a pipe. The heat absorption pipe (10) is equidistant about the diversion channel (9). The mounting groove (2) is symmetrically provided with fixing grooves (12) on both sides, and fixing springs (13) are symmetrically connected in the fixing grooves (12). The other end of the fixing springs (13) is connected to a fixing plate (14), and the surface of the fixing plate (14) is provided with an inclined surface. The fixing plates (14) are tightly fitted together, and the fixing plates (14) are elastically connected to the fixing grooves (12) through the fixing springs (13). The fixing plates (14) are slidably connected to the mounting groove (2) through the fixing grooves (12), and the fixing plates (14) are engaged and connected to the base (301) through the heat sink (303).

2. The high-voltage solid-state soft starter based on a modular heat dissipation structure according to claim 1, characterized in that, The heat sinks (303) are evenly distributed on the base (301), and the width of the heat sink (303) in the middle of the base (301) is greater than that of the heat sinks (303) on both sides of the base (301). The pressure plate (308) is elastically connected to the limiting block (306) through the reset spring (307), and the pressure plate (308) is engaged and slidably connected to the limiting block (306) through the limiting groove (309).

3. The high-voltage solid-state soft starter based on a modular heat dissipation structure according to claim 2, characterized in that, The mounting groove (2) is provided with a connecting assembly (11). The connecting assembly (11) includes a sleeve (1101), a connecting spring (1102), a chassis (1103), and a heat-absorbing block (1104). The sleeve (1101) is connected in the mounting groove (2), and the connecting spring (1102) is connected to the outside of the sleeve (1101). The chassis (1103) is connected to one side of the connecting spring (1102), and the heat-absorbing block (1104) is connected to the middle of one side of the chassis (1103).

4. The high-voltage solid-state soft starter based on a modular heat dissipation structure according to claim 3, characterized in that, The connecting assembly (11) further includes a through groove (1105), a sliding groove (1106), a valve groove (1107), and a sealing groove (1108). The chassis (1103) has a through groove (1105) in the middle and sliding grooves (1106) are symmetrically opened at the four corners of the chassis (1103). The through groove (1105) has a valve groove (1107) in the middle and sealing grooves (1108) are opened on both sides of the through groove (1105).

5. A high-voltage solid-state soft starter based on a modular heat dissipation structure according to claim 4, characterized in that, The connecting assembly (11) further includes a movable spring (1109), a base plate (1110), a sealing plate (1111), and a valve plate (1112). The movable spring (1109) is connected to the inner side of the sleeve (1101), and the other end of the movable spring (1109) is connected to the base plate (1110). The sealing plates (1111) are symmetrically connected to both sides of the base plate (1110), and the valve plate (1112) is connected to the middle of the base plate (1110).

6. The high-voltage solid-state soft starter based on a modular heat dissipation structure according to claim 5, characterized in that, The chassis (1103) is elastically connected to the mounting groove (2) via a connecting spring (1102), and the chassis (1103) is slidably connected to the chassis (1) via the mounting groove (2). The through groove (1105) is connected to the cooling pipe (5), and the valve plate (1112) and the sealing plate (1111) are respectively connected to the through groove (1105) via the valve groove (1107) and the sealing groove (1108). The base plate (1110) is elastically connected to the chassis (1103) via a moving spring (1109), and the chassis (1103) is slidably connected to the sleeve (1101) via the sliding groove (1106).

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