Wireless data communication through VI sensor and RF generator in plasma processing chamber

Abstract

Embodiments disclosed herein include a diagnostic substrate. In one embodiment, the diagnostic substrate comprises: a substrate; and a sensor, which is arranged on the substrate. In one embodiment, the diagnostic substrate further includes a communication module on the substrate, the communication module communicatively coupled to the sensor. In one embodiment, the communication module comprises: an output antenna; a switch coupled to the output antenna; and a signal source, the signal source being coupled to the switch.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims the benefit of U.S. Patent Application No. 18 / 220,020, filed on July 10, 2023, which claims the benefit of U.S. Provisional Application No. 63 / 412,278, filed on September 30, 2022, the entire contents of which are incorporated herein by reference. Technical Field

[0003] Embodiments relate to the field of semiconductor manufacturing, and in particular to wireless communication architectures for uploading and downloading information from sensors in semiconductor tools. Background Art

[0004] Instrumented substrates have been developed to monitor processing conditions within a chamber. For example, an instrumented substrate may include temperature sensors, pressure sensors, electrical sensors (e.g., plasma condition sensors), etc. In many cases, data collected by the instrumented substrate is stored in a memory provided on the instrumented substrate. After processing, the instrumented substrate may be removed from the chamber and the collected data may be downloaded to an external device for data processing, analysis, etc.

[0005] However, real-time data communication between instrumented substrates and external devices is a superior solution. Unfortunately, the strong electromagnetic fields present in the chamber often induce radio interference and block wireless communication links. Summary of the invention

[0006] Embodiments disclosed herein include a diagnostic substrate. In one embodiment, the diagnostic substrate includes: a substrate; and a sensor, the sensor being on the substrate. In one embodiment, the diagnostic substrate further includes: a communication module, the communication module being on the substrate, the communication module being communicatively coupled to the sensor. In one embodiment, the communication module includes: an output antenna; a switch, the switch being coupled to the output antenna; and a signal source, the signal source being coupled to the switch.

[0007] Embodiments disclosed herein may also include a diagnostic substrate, including: a substrate; and a sensor, the sensor being on the substrate. In one embodiment, the diagnostic substrate further includes: a communication module, the communication module being on the substrate, the communication module being communicatively coupled to the sensor. In one embodiment, the communication module includes: an input antenna, wherein the input antenna is configured to collect modulated data; a demodulator, the demodulator being coupled to the input antenna; and a controller, wherein the controller is configured to control the sensor.

[0008] Embodiments disclosed herein may also include a plasma processing tool. In one embodiment, the plasma processing tool includes: a chamber configured to contain a plasma; and an RF generator coupled to the chamber, wherein power from the RF generator is configured to couple into one or more gases in the chamber to form the plasma. The plasma processing tool further includes: a voltage-current (VI) sensor, the VI sensor between the RF generator and the chamber; and a diagnostic substrate, the diagnostic substrate within the chamber. In one embodiment, the diagnostic substrate includes: a substrate; a sensor, the sensor on the substrate; and a communication module coupled to the sensor, wherein the communication module is configured to wirelessly communicate with a device outside the chamber using a carrier signal at a carrier frequency, the carrier frequency being an integer multiple of the frequency of the plasma. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figure 1 is a cross-sectional view of a plasma chamber with an RF generator and a VI sensor according to one embodiment.

[0010] Figure 2A is a schematic diagram of an instrumented substrate having a communication module configured to download data from the instrumented substrate to an external device according to one embodiment.

[0011] Figure 2B is a schematic diagram of an instrumented substrate having a communication module that includes only an output antenna according to one embodiment.

[0012] Figure 3 is a cross-sectional view of a plasma chamber having a first RF generator coupled to a chuck and a second RF generator coupled to a showerhead according to one embodiment.

[0013] Figure 4 is a schematic diagram of an instrumented substrate having a communication module configured to upload data from an external device according to one embodiment.

[0014] Figure 5A is a schematic diagram of an instrumented substrate having a communication module configured to communicate data between the instrumented substrate and an external device according to one embodiment.

[0015] Figure 5B is a schematic diagram of an instrumented substrate having a communication module configured to communicate data between the instrumented substrate and an external device according to additional embodiments.

[0016] Figure 6 Illustrated is a block diagram of an exemplary computer system that may be used in conjunction with a processing tool according to one embodiment. DETAILED DESCRIPTION

[0017] The system described herein includes a wireless communication architecture for uploading and downloading information from sensors in semiconductor tools. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the embodiments. It is apparent to one of ordinary skill in the art that the embodiments can be practiced without these specific details. In other cases, well-known aspects are not described in detail to avoid unnecessarily obscuring the embodiments. In addition, it should be understood that the various embodiments shown in the drawings are exemplary representations and are not necessarily drawn to scale.

[0018] As described above, instrumented substrates are currently limited in their ability to wirelessly communicate with external devices. Therefore, instrumented substrates typically store data on onboard memory and retrieve the data from the memory after processing is complete and the instrumented substrate is removed from the plasma chamber. However, wireless communication is a superior data transfer mechanism and allows real-time data analysis and processing. Unfortunately, the strong electromagnetic fields within a plasma chamber induce interference and can make traditional wireless communication protocols (e.g., WiFi, Bluetooth, etc.) inappropriate or inaccurate.

[0019] Accordingly, embodiments disclosed herein include wireless communication solutions that use the RF signal used to induce the plasma or (a small modulated variation of) the plasma itself as a carrier for a data signal to / from an instrumented substrate. In a first embodiment, data is downloaded wirelessly from the instrumented substrate. In such an embodiment, a signal source (e.g., a clock or signal multiplier) provides a signal having a frequency significantly different from the RF signal. For example, the signal may be an order of magnitude higher than the RF signal. The high frequency signal is then modulated using a modulator and / or switch coupled to an output antenna. When the output antenna is turned on / off, the impedance changes. This impedance change can be detected by a capacitive or inductive RF pickup sensor connected to the RF feed line. Demodulation of the signal can then be performed to extract the data transmitted by the instrumented substrate.

[0020] Embodiments may also allow data to be uploaded to the instrumented substrate. Data upload is accomplished by mixing a high frequency modulation into the RF generator. The high frequency modulation may be at least one order of magnitude higher than the frequency of the RF signal. An input antenna on the instrumented substrate may be configured to receive the high frequency modulation. A demodulator on the instrumented substrate may then be used to extract the data for use by a controller on the instrumented substrate.

[0021] As used herein, an instrumented substrate may refer to a substrate that includes one or more sensors. The substrate may have a form factor of a typical substrate processed in a plasma chamber. For example, the substrate may have a wafer form factor (e.g., 150 mm, 200 mm, 300 mm, 450 mm, etc.). However, it should be understood that other form factors (including non-circular form factors) may also be used for instrumented substrates. One or more sensors may be distributed across the substrate surface to provide spatial data collection. In one embodiment, the sensor may include any type of sensor. For example, the sensor may include a pressure sensor, a temperature sensor, an electrical sensor (e.g., for detecting one or more plasma processing conditions), an optical sensor, etc.

[0022] Reference now Figure 1 , a cross-sectional view of a plasma processing tool 100 according to one embodiment is shown. In one embodiment, the plasma processing tool 100 may include a chamber 101. The chamber 101 may be adapted to contain a plasma 140. For example, the chamber 101 may be a vacuum chamber. Exhaust ports, pumps, etc. that enable low pressure operation are omitted to more clearly illustrate certain portions of the embodiment.

[0023] In one embodiment, the chamber 101 may include a pedestal or chuck 120. The chuck 120 may include a mechanism for holding a substrate, such as the instrumented substrate 150. For example, the chuck 120 may be an electrostatic chuck (ESC). The chuck 120 may also include gas lines to provide backside gas flow and / or heating and cooling solutions to control the temperature of the instrumented substrate 150. A showerhead 110 or the like may be provided opposite the chuck 120. The showerhead 110 may be configured to flow one or more process gases, inert gases, into the chamber.

[0024] In one embodiment, the chuck 120 may be coupled to an RF generator 121. The RF generator 121 provides power that is coupled into the chamber 101 in order to ignite and sustain the plasma 140. Typically, the RF generator 121 operates at a frequency of approximately 13 MHz (e.g., 13.56 MHz). In one embodiment, a match (not shown) may be provided between the RF generator 121 and the chuck 120. In addition, a VI sensor 123 may be provided between the chuck 120 and the RF generator 121. The VI sensor 123 may be configured to detect a modulated signal generated by the instrumented substrate 150. The processing for generating the modulated signal is described in more detail below. A demodulator 124 may be coupled to the VI sensor to extract data from the modulated signal from the instrumented substrate 150. In one embodiment, a high frequency (HF) modulator 122 may also be coupled to the RF generator 121. The HF modulator 122 may be used to upload data to the instrumented substrate 150, as will be described in more detail below.

[0025] Reference now Figure 2A and Figure 2B , shows a pair of schematic diagrams of an instrumented substrate 250 configured to download data from the instrumented substrate 250 to an external source according to one embodiment.

[0026] Reference now Figure 2A , shows a schematic diagram of an instrumented substrate 250 with a communication module 260 according to one embodiment. In one embodiment, the communication module 260 can be communicatively coupled to a sensor 252. Although a single sensor 252 is shown, it should be understood that any number of sensors 252 can be provided on the instrumented substrate 250 and communicatively coupled to the communication module 260. The sensor 252 can be a temperature sensor, a pressure sensor, a plasma property sensor, an optical sensor, etc. In one embodiment, data from the sensor 252 is wirelessly communicated to an external device using the communication module 260.

[0027] In one embodiment, the communication module 260 may include an input antenna 253. The input antenna 253 may be configured to detect the RF frequency and phase used to generate the plasma 140. For example, the input antenna 253 may be configured to detect frequencies around 13 MHz. The input antenna 253 may be any antenna configuration. For example, the input antenna 253 may be a coil antenna, etc.

[0028] The input antenna 253 may be coupled to a frequency generator 254. In the case of a multiplier, the frequency generator 254 multiplies the frequency of the signal detected by the input antenna 253. For example, the multiplier may multiply the frequency by an integer multiple. In some embodiments, the multiplier may increase the frequency by an order of magnitude or more. The multiplier may be implemented by any suitable circuitry and components, such as a diode, a varactor, a microelectromechanical system (MEMS), a phase-locked loop (PLL), etc.

[0029] In one embodiment, the frequency generator 254 may be coupled to the modulator / switch 255. That is, the signal from the frequency generator 254 is provided to the modulator / switch 255. The signal from the frequency generator 254 is used as a carrier signal, and the modulator / switch 255 modulates the carrier signal so as to mix the data from the sensor 252 onto the carrier signal. The modulator / switch 255 may use any suitable modulation scheme. For example, the modulation may include ASK modulation, PSK modulation, BPSK modulation, or FSK modulation. In some embodiments, a single modulation channel is used. In other embodiments, two or more modulation channels may be used to increase the bandwidth of data transmission.

[0030] In one embodiment, the modulator / switch 255 is coupled to the output antenna 256. The output antenna 256 is turned on / off by the modulator / switch 255. When the output antenna 256 is turned on, there is a first impedance, and when the output antenna 256 is turned off, there is a second impedance different from the first impedance. The switching of impedance can then be detected by the VI sensor 123 of the plasma processing tool 100. The demodulator 124 can then demodulate the signal to extract data. The output antenna 256 can be any antenna topology. For example, the antenna can be a coil antenna.

[0031] Reference now Figure 2B , shows a schematic diagram of an instrumented substrate 250 according to an additional embodiment. In one embodiment, in addition to the communication module 260, Figure 2B The instrumented substrate 250 in Figure 2A The instrumented substrate 250 in FIG. Figure 2B The communication module 260 in 250 includes only the output antenna 256, rather than having both the input antenna 253 and the output antenna 256. The input antenna 253 can be omitted when the RF frequency is a known quantity. For example, RF plasmas typically operate at 13.56 MHz. In such an embodiment, the source 254 can be set to a frequency substantially higher than the known frequency. For example, the source 254 can be a clock with a frequency set to over 100 MHz. The signal from the source 254 can then be used as a carrier signal modulated by the modulator / switch 255. The output antenna 256 switches on / off and induces an impedance change that can be detected by the VI sensor 123 of the plasma processing tool.

[0032] Reference now Figure 3 , shows a cross-sectional view of a plasma processing tool 300 according to one embodiment. In one embodiment, the plasma processing tool 300 can be substantially similar to the plasma processing tool 100 described above, except for another RF generator 321B coupled to the showerhead 310. That is, the plasma processing tool 300 can include a chamber 301, a chuck 320, a plasma 340, and a showerhead 310. A first RF generator 321A, a first VI sensor and chamber match 323A, a first demodulator 324A, and a first HF modulator 322A can be coupled to the chuck 320. Similarly, a second RF generator 321B, a second VI sensor 323B, a second demodulator 324B, and a second HF modulator 322B can be coupled to the showerhead.

[0033] That is, embodiments are not limited to a single RF frequency. In some embodiments, different RF frequencies may be used for the first RF generator 321A and the second RF generator 321B. Different frequencies may be used as a communication path to download data from the instrumented substrate 350 (or upload data to the instrumented substrate 350).

[0034] Reference now Figure 4 , shows a schematic diagram of an instrumented substrate 450 according to one embodiment. In one embodiment, the instrumented substrate 450 includes a sensor 452 coupled to a communication module 460. Although a single sensor 452 is shown, it should be understood that any number of sensors 452 may be coupled to the communication module 460. The sensor 452 may include a temperature sensor, a pressure sensor, a plasma property sensor, an optical sensor, or any other sensor type.

[0035] In one embodiment, the communication module 460 can be configured to upload data to the instrumented substrate 450. For example, an external device can provide instructions to the instrumented substrate 450 to control one or more sensors 452. In a particular embodiment, the communication module 460 includes an input antenna 459, a demodulator 458, and a controller 457 (e.g., a microcontroller unit (MCU)).

[0036] In one embodiment, the input antenna 459 is configured to pick up the modulated EM field generated by the RF generator via the suction cup. The carrier signal can be the RF frequency of the plasma (or a multiple of the RF frequency), and the modulated signal can be at a higher or lower frequency. For example, the carrier signal can be an order of magnitude higher or lower than the RF frequency. Providing the modulated signal at a frequency away from the RF frequency allows the signal to propagate into the chamber without negatively affecting the plasma performance. In one embodiment, the modulated signal can be added to the RF frequency by an HF modulator similar to the HF modulators 122 and 322 described in more detail above. The modulated signal can be provided into the chamber at a power less than the power of the RF frequency used for the plasma. The input antenna 459 can be any antenna architecture, such as a coil, etc.

[0037] After the modulated signal is received by the input antenna 459, the modulated signal is sent to the demodulator 458. The demodulator 458 is configured to extract data from the modulated signal. In one embodiment, the data may then be provided to the controller 457. The controller 457 may store the data in a memory (not shown) or use the data as instructions for controlling one or more sensors 452 on the instrumented substrate 450.

[0038] Reference now Figure 5A and 5B , shows a schematic diagram of an instrumented substrate 550 having a communication module 560 according to one embodiment. As will be understood by one of ordinary skill in the art, the instrumented substrate 550 may include a communication module 560 that allows bidirectional communication between the instrumented substrate 550 and external devices.

[0039] Reference now Figure 5A, shows a schematic diagram of an instrumented substrate 550 according to one embodiment. In one embodiment, the instrumented substrate 550 may include a sensor 552 coupled to a communication module 560. In one embodiment, the sensor 552 may be a single sensor 552, or there may be multiple sensors 552 coupled to the communication module 560. The sensor 552 may include a temperature sensor, a pressure sensor, a plasma property sensor, an optical sensor, etc.

[0040] In one embodiment, the communication module 560 may include a transmission line and a reception line. In one embodiment, the reception line includes an input antenna 559, a demodulator 558, and a controller 557. The input antenna 559 is configured to receive a modulated signal mixed with an RF frequency. The modulated signal may be at a frequency at least one order of magnitude higher or lower than the RF frequency. The modulated signal may contain data used by the controller 557 to control one or more sensors 552 on the instrumented substrate 550. After the input antenna 559 receives the modulated signal, the demodulator 558 demodulates the signal and provides the extracted data to the controller 557.

[0041] In one embodiment, the transmission line may include an input antenna 553, a signal source 554, a modulator / switch 555, and an output antenna 556. In some embodiments, the input antenna 552 picks up the RF frequency of the plasma. The signal source 554 then uses the RF frequency to generate a carrier frequency. For example, the signal source 554 may be a multiplier that multiplies the RF frequency by an integer multiple. In some embodiments, the signal source 554 may multiply the RF frequency so that it is at least one order of magnitude higher than the RF frequency.

[0042] The carrier signal is then transmitted to the modulator / switch 555, which uses one or more modulation schemes / channels to add a data stream (e.g., data from one or more sensors 552) to the carrier signal. The modulator / switch 555 can cause the output antenna 556 to turn on / off, or directly turn on / off the input antenna 553, turning 553 into an output antenna. The output antenna 556 (or 553) provides a first impedance when turned on and a second (different) impedance when turned off. The change in impedance can be detected by a VI sensor (e.g., VI sensor 123 or 323) of the plasma processing tool, and the signal can be demodulated by a demodulator (e.g., demodulator 124 or 324) to extract data for use by an external source.

[0043] Reference now Figure 5B , shows a schematic diagram of an instrumented substrate 550 according to an additional embodiment. As shown, except for the transmission line, the instrumented substrate 550 is substantially similar to Figure 5AThe instrumented substrate 550 in FIG. 5 is a schematic diagram of an embodiment of the present invention. The transmission line starts at a signal source 554 without an input antenna 553. For example, the signal source 554 can be a clock. The signal source 554 can be set to a frequency known to be different from the RF frequency. For example, RF plasmas typically operate at 13.56 MHz, so the clock of the signal source 554 can be set to produce a carrier signal of 100 MHz or higher.

[0044] The carrier signal is then transmitted to the modulator / switch 555, which adds a data stream (e.g., data from one or more sensors 552) to the carrier signal using one or more modulation schemes / channels. The modulator / switch 555 can cause the output antenna 556 to be turned on / off. The output antenna 556 provides a first impedance when turned on and a second (different) impedance when turned off. The change in impedance can be detected by a VI sensor (e.g., VI sensor 123 or 323) of the plasma processing tool, and the signal can be demodulated by a demodulator (e.g., demodulator 124 or 324) to extract data for use by an external source

[0045] Reference now Figure 6 , a block diagram of an exemplary computer system 600 of a processing tool according to one embodiment is shown. In one embodiment, the computer system 600 is coupled to and controls the processing in the processing tool. The computer system 600 can be connected (e.g., networked) to other machines in a local area network (LAN), an intranet, an extranet, or the Internet. The computer system 600 can operate in the capacity of a server or client machine in a client-server network environment, or as a peer machine in a peer-to-peer (or distributed) network environment. The computer system 600 can be a personal computer (PC), a tablet computer, a set-top box (STB), a personal digital assistant (PDA), a mobile phone, a network appliance, a server, a network router, a switch or a bridge, or any machine capable of executing an instruction set (sequentially or otherwise) to specify the action to be taken by the machine. In addition, although only a single machine is illustrated for the computer system 600, the term "machine" should also be deemed to include a set of any machines (e.g., computers) that execute an instruction set (or multiple instruction sets) individually or jointly to perform any one or more methods described herein.

[0046] The computer system 600 may include a computer program product, or software 622, a non-transitory machine-readable medium having instructions stored thereon, which may be used to program the computer system 600 (or other electronic device) to perform processing according to an embodiment. A machine-readable medium includes any mechanism for storing or transmitting information in a form readable by a machine (e.g., a computer). For example, a machine-readable (e.g., computer-readable) medium includes a machine-readable (e.g., computer) storage medium (e.g., read-only memory ("ROM"), random access memory ("RAM"), magnetic disk storage medium, optical storage medium, flash memory device, etc.), a machine-readable (e.g., computer) transmission medium (electrical, optical, acoustic or other form of propagated signals (e.g., infrared light signals, digital signals, etc.)), etc.

[0047] In one embodiment, the computer system 600 includes a system processor 602, a main memory 604 (e.g., read-only memory (ROM), flash memory, dynamic random access memory (DRAM) such as synchronous DRAM (SDRAM) or Rambus DRAM (RDRAM)), etc.), a static memory 606 (e.g., flash memory, static random access memory (SRAM), etc.), and an auxiliary memory 618 (e.g., a data storage device), which communicate with each other via a bus 630.

[0048] The system processor 602 represents one or more general-purpose processing devices, such as a microsystem processor, a central processing unit, etc. More specifically, the system processor may be a complex instruction set computing (CISC) microsystem processor, a reduced instruction set computing (RISC) microsystem processor, a very long instruction word (VLIW) microsystem processor, a system processor that implements other instruction sets, or a system processor that implements a combination of instruction sets. The system processor 602 may also be one or more special-purpose processing devices, such as an application-specific integrated circuit (ASIC), a field programmable gate array (FPGA), a digital signal system processor (DSP), a network system processor, etc. The system processor 602 is configured to execute processing logic 626 for performing the operations described herein.

[0049] The computer system 600 may further include a system network interface device 608 for communicating with other devices or machines. The computer system 600 may also include an image display unit 610 (e.g., a liquid crystal display (LCD), a light emitting diode display (LED), or a cathode ray tube (CRT)), an alphanumeric input device 612 (e.g., a keyboard), a cursor control device 614 (e.g., a mouse), and a signal generating device 616 (e.g., a speaker).

[0050] The secondary memory 618 may include a machine-accessible storage medium 632 (or more specifically, a computer-readable storage medium) on which is stored one or more sets of instructions (e.g., software 622) that implement any one or more of the methods or functions described herein. The software 622 may also reside, in whole or in part, within the main memory 604 and / or within the system processor 602 during execution by the computer system 600, the main memory 604 and the system processor 602 also constituting machine-readable storage media. The software 622 may further be transmitted or received over the network 620 via the system network interface device 608. In one embodiment, the network interface device 608 may operate using RF coupling, optical coupling, acoustic coupling, or inductive coupling.

[0051] Although the machine-accessible storage medium 632 is shown as a single medium in the exemplary embodiment, the term "machine-readable storage medium" should be construed to include a single medium or multiple media (e.g., a centralized or distributed database and / or associated caches and servers) storing one or more sets of instructions. The term "machine-readable storage medium" should also be construed to include any medium capable of storing or encoding a set of instructions for execution by a machine and causing the machine to perform any one or more methods. Accordingly, the term "machine-readable storage medium" should be construed to include, but not limited to, solid-state memories, and optical and magnetic media.

[0052] In the foregoing specification, specific exemplary embodiments have been described. It will be apparent that various modifications may be made thereto without departing from the scope of the following claims. Accordingly, the specification and drawings are to be regarded in an illustrative rather than a restrictive sense.

Claims

1. A diagnostic substrate, comprising: substrate; a sensor, the sensor being on the substrate; as well as a communication module, the communication module being on the substrate, the communication module being communicatively coupled to the sensor, wherein the communication module comprises: Output antenna; a switch coupled to the output antenna; and A signal source is coupled to the switch.

2. The diagnostic substrate of claim 1, wherein the communication module further comprises: an input antenna coupled to the signal source, wherein the input antenna is configured to obtain a frequency of the plasma by detecting a change in an electromagnetic field near the substrate, and wherein the signal source is a signal multiplier that multiplies the frequency of the plasma by an integer multiple.

3. The diagnostic substrate of claim 2, wherein the signal multiplier comprises one or more of: a diode, a varactor diode, a microelectromechanical system (MEMS) device, and a phase locked loop (PLL).

4. The diagnostic substrate of claim 1, wherein the signal source is a clock that generates a frequency different from a plasma frequency.

5. The diagnostic substrate of claim 1, wherein the sensor is a temperature sensor, a pressure sensor, a voltage / bias sensor, an optical sensor, or a plasma sensor for detecting one or more of electrons, ions, free radicals.

6. The diagnostic substrate of claim 5, wherein the sensor is one sensor of a plurality of sensors.

7. The diagnostic substrate of claim 1, wherein the communication module has a first impedance when the switch is open and has a second impedance when the switch is closed.

8. The diagnostic substrate of claim 7, wherein the switch operates at a frequency related to the signal source.

9. The diagnostic substrate of claim 8, wherein the switching frequency is modulated using ASK modulation, PSK modulation, BPSK modulation, or FSK modulation.

10. The diagnostic substrate of claim 1, wherein the communication module is configured to download information from the diagnostic substrate to an external device via modulation of the impedance through switching of the switch.

11. A diagnostic substrate, comprising: substrate; a sensor, the sensor being on the substrate; as well as a communication module, the communication module being on the substrate, the communication module being communicatively coupled to the sensor, wherein the communication module comprises: an input antenna, wherein the input antenna is configured to collect the modulated data; a demodulator coupled to the input antenna; and A controller, wherein the controller is configured to control the sensor.

12. The diagnostic substrate of claim 11, wherein the input antenna is a high frequency antenna configured to pick up a frequency different from a plasma frequency.

13. The diagnostic substrate of claim 11, wherein the transmission of the modulated data is performed at a power level lower than the plasma power.

14. The diagnostic substrate of claim 11, wherein the modulated data is provided at a carrier frequency delivered from the chamber RF generator, wherein the carrier frequency is at least an order of magnitude higher or lower than a plasma frequency.

15. The diagnostic substrate of claim 11, wherein the carrier frequency is a frequency of a plasma used to process the diagnostic substrate.

16. The diagnostic substrate of claim 11, wherein the communication module is configured to read data from an external RF generator by demodulating a signal from the input antenna.

17. A plasma processing tool comprising: a chamber configured to contain a plasma; an RF generator coupled to the chamber, wherein power from the RF generator is configured to be coupled into one or more gases in the chamber to form the plasma; a voltage-current (VI) sensor between the RF generator and the chamber; as well as a diagnostic substrate within the chamber, wherein the diagnostic substrate comprises: substrate; a sensor on the substrate; and A communication module is coupled to the sensor, wherein the communication module is configured to wirelessly communicate with a device outside the chamber using a carrier signal at a carrier frequency that is an integer multiple of a frequency of the plasma.

18. The plasma processing tool of claim 17, wherein the communications module comprises: an input antenna, wherein the input antenna is configured to detect the frequency of the plasma; a signal multiplier coupled to the input antenna; a switch coupled to the signal multiplier; as well as An output antenna is coupled to the switch, and wherein switching the switch on and off causes an impedance change detectable by the VI sensor.

19. The plasma processing tool of claim 17, wherein the communications module comprises: an input antenna, wherein the input antenna is configured to collect data from modulation of an RF signal used to form the plasma; a demodulator coupled to the input antenna; as well as A controller, wherein the controller is configured to control the sensor.

20. The plasma processing tool of claim 17, wherein the communication module is configured to upload data from an external device to the substrate and / or download information from the substrate to the external device.

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