Deposition mask for OLED pixel deposition

Abstract

A deposition mask according to an embodiment includes a metal plate including a deposition region and a non-deposition region, in which: the deposition region includes at least one active portion; the effective part comprises a plurality of unit through holes; the unit through hole includes a small-area hole formed on the first surface of the metal plate, a large-area hole formed on the second surface of the metal plate, and a connecting portion connecting the small-area hole and the large-area hole; ribs are arranged between the adjacent unit through holes in the first direction of the metal plate. Island-shaped parts are arranged between the adjacent unit through holes in the second direction of the metal plate; the island-shaped parts comprise a first island-shaped part and a second island-shaped part which are separated from each other; and the first island portion is in contact with the rib and the second island portion is spaced apart from the rib.

Description

Technical Field

[0001] Embodiments relate to deposition masks for OLED pixel deposition. Background Art

[0002] Display devices are applied to various devices. For example, display devices are applied to small devices such as smart phones or tablet PCs. Alternatively, display devices are applied to large devices such as TVs, monitors, or public displays (PDs). Recently, the demand for ultra-high definition (UHD) of 500 pixels per inch (PPI) or more is increasing. Therefore, display devices with high resolution are applied to small devices and large devices.

[0003] Display devices are classified into liquid crystal displays (LCD) and organic light emitting diodes (OLED) according to driving methods.

[0004] LCD is a display device driven by using liquid crystal (Liquid Crystal), while OLED is a display device driven by using organic materials.

[0005] OLED can show infinite contrast, has a response speed 1000 times faster than that of LCD, and has excellent viewing angle. Therefore, OELD has attracted much attention as a display device that can replace LCD.

[0006] The OLED includes a light-emitting layer. The light-emitting layer includes an organic material. The organic material is deposited on a substrate using a deposition mask. The deposition mask may include an open mask (OM) or a fine metal mask (FMM). A deposition pattern corresponding to the pattern formed on the deposition mask is formed on the substrate. Therefore, the deposition pattern can be used as a pixel.

[0007] An open mask is a thin plate that forms a deposition pattern only at specific locations when manufacturing an OLED. After the backplane is completed in the display manufacturing process, an open mask is used in the deposition process of forming a light-emitting layer thereon. That is, an open mask is a mask that does not cover the portion within the operating range of the display in order to deposit the entire surface of the display. Therefore, an open mask is used when depositing a light-emitting layer having a light-emitting material of one color.

[0008] On the other hand, the fine metal mask is used to change the color of the sub-pixel of the light-emitting layer. Therefore, the fine metal mask includes ultra-fine holes. The process of using the fine metal mask requires a multi-step deposition process. Therefore, the process requires precise alignment. Therefore, the process of using the fine metal mask is more difficult than the process of using the open mask.

[0009] When an open mask is used to deposit the light-emitting layer of an OLED, only a monochrome light-emitting layer is formed. Therefore, a separate color filter (C / F) is required to achieve various colors. On the other hand, when a fine metal mask is used, an RGB light-emitting layer can be formed. Therefore, no separate color filter is required. In other words, the technical difficulty of using a fine metal mask is high. However, compared with the method using an open mask, since no filter is required to block light, the light efficiency is good.

[0010] The fine metal mask is usually made of an Invar alloy metal plate including iron (Fe) and nickel (Ni). Through holes are formed through one surface and the other surface of the metal plate. The through holes are formed at positions corresponding to the pixel pattern. Therefore, organic materials of red (Red), green (Green) and blue (Blue) can pass through the through holes of the metal plate and be deposited on the deposition substrate. Therefore, a pixel pattern can be formed on the deposition substrate.

[0011] Meanwhile, the fine metal mask includes a small-area hole formed on one surface of the metal plate and a large-area hole formed on the other surface of the metal plate. The small-area hole and the large-area hole are connected by a connecting portion. Thus, a through hole is formed.

[0012] The organic material is sprayed in the direction of the fine metal mask. The organic material is deposited on the deposition substrate using the large area holes as inlets and the small area holes as outlets.

[0013] The fine metal mask includes a plurality of via holes. Therefore, when the shapes or sizes of the plurality of via holes are not uniform, the deposition reliability of the mask may be reduced.

[0014] For example, a pixel pattern deposited on a deposition substrate may vary due to differences in the size or shape of the through hole in the major and minor axis directions. Therefore, the deposition reliability of the fine metal mask may be reduced.

[0015] Therefore, a deposition mask with a new structure that can solve the above problems is needed. Summary of the invention

[0016] Technical issues

[0017] The present embodiment provides a deposition mask for OLED pixel deposition, the deposition mask having improved deposition efficiency and deposition reliability.

[0018] Technical Solutions

[0019] A deposition mask comprises a metal plate comprising a deposition area and a non-deposition area, wherein the deposition area comprises at least one effective portion; wherein the effective portion comprises a plurality of unit through holes, wherein the unit through holes comprise: small-area holes formed on a first surface of the metal plate; large-area holes formed on a second surface of the metal plate; and connecting portions connecting the small-area holes and the large-area holes, wherein ribs are arranged between adjacent unit through holes in a first direction, wherein island portions are arranged between adjacent unit through holes in a second direction, wherein the island portions comprise a first island portion and a second island portion spaced apart from each other, wherein the first island portion contacts the ribs, and wherein the second island portion is spaced apart from the ribs.

[0020] Beneficial effects

[0021] The deposition mask according to an embodiment includes at least one second island portion.

[0022] The second island-shaped portion protrudes toward the connecting portion. The shape and size of the unit through hole are controlled by the second island-shaped portion.

[0023] In detail, the second island portion reduces the deviation of the tilt angle of the inner surface of the large-area hole and the deviation of the height of the small-area hole. Therefore, the thickness of the deposition pattern deposited through one unit through-hole becomes uniform by means of the second island portion.

[0024] In addition, a thickness deviation of a deposition pattern deposited through a plurality of unit via holes is reduced.

[0025] In addition, the uniformity of the size and / or shape of the plurality of unit through holes is improved. Therefore, the size and / or shape of the deposition pattern formed by the plurality of unit through holes becomes uniform.

[0026] Therefore, the deposition mask according to the embodiment has improved deposition efficiency and deposition reliability.

[0027] In addition, at least one of the inclination angle of the inner surface of the large-area hole, the curvature of the inner surface of the large-area hole, the height of the large-area hole, and the height of the small-area hole may be controlled to various sizes in different regions.

[0028] Therefore, in the deposition mask according to the embodiment, the shapes or sizes of the large-area holes and the small-area holes may be adjusted in various ways according to the use environment.

[0029] Therefore, the deposition mask according to the embodiment may have improved deposition efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 is a view illustrating a combination of a deposition mask and a frame according to an embodiment.

[0031] Figure 2 is a cross-sectional view of an organic material deposition apparatus including a deposition mask according to an embodiment.

[0032] Figure 3 is a view illustrating forming a deposition pattern on a deposition substrate through a through hole of a deposition mask according to an embodiment.

[0033] Figure 4 is a plan view of a deposition mask according to an embodiment.

[0034] Figure 5 is a plan view of an effective portion of a deposition mask according to an embodiment.

[0035] Figure 6 It is along Figure 5 A cross-sectional view taken at area AA'.

[0036] Figure 7 It is along Figure 5 A cross-sectional view taken at area BB'.

[0037] Figure 8 It is along Figure 5 A cross-sectional view taken in the area CC'.

[0038] Fig. 9 is an enlarged view of a unit through hole of a deposition mask according to an embodiment.

[0039] Fig.10 and Fig.11 is a view for explaining the shape of a unit through hole of a deposition mask according to an embodiment.

[0040] Fig.12 It is along Figure 5 A cross-sectional view taken at region D-D'.

[0041] Fig.13 It is along Figure 5 A cross-sectional view taken in the region EE'.

[0042] Fig.14 It is along Figure 5 A cross-sectional view taken in the region F-F'. DETAILED DESCRIPTION

[0043] Hereinafter, the embodiments of the present disclosure will be described in detail with reference to the accompanying drawings. However, the spirit and scope of the present disclosure are not limited to the parts of the described embodiments, and can be implemented in various other forms, and in the spirit and scope of the present disclosure, one or more elements of the elements of the embodiments can be selectively combined and substituted. In addition, unless explicitly defined and described otherwise, the terms (including technical terms and scientific terms) used in the embodiments of the present disclosure can be interpreted as the same meanings commonly understood by ordinary technicians in the field to which the present disclosure belongs, and terms such as those defined in common dictionaries can be interpreted as having a meaning consistent with its meaning in the context of the relevant technology.

[0044] In addition, the terms used in the embodiments of the present disclosure are used to describe the embodiments and are not intended to limit the present disclosure. In this specification, unless otherwise specified in a phrase, a singular form may also include a plural form, and when described as "at least one (or more) of A (and), B, and C", at least one combination of all combinations that can be combined in A, B, and C may be included.

[0045] In addition, when describing the elements of the embodiments of the present disclosure, terms such as first, second, A, B, (a), and (b) may be used. These terms are only used to distinguish an element from other elements, and these terms do not limit the nature, order, or sequence of the elements.

[0046] In addition, when an element is described as being “connected,” “coupled” or “coupled” to another element, it may include not only the case where the element is directly “connected,” “coupled” or “coupled” to other elements, but also the case where the element is “connected,” “coupled” or “coupled” to the other elements through another element.

[0047] In addition, when described as being formed or arranged "on" or "under" each element, "on" or "under" may include not only the case where two elements are directly connected to each other, but also the case where one or more other elements are formed or arranged between the two elements.

[0048] Furthermore, when expressed as “up (above)” or “down (below)”, not only an upward direction but also a downward direction can be included based on one element.

[0049] Hereinafter, a deposition mask according to an embodiment will be described with reference to the accompanying drawings.

[0050] The deposition mask described below is a fine metal mask (FMM) capable of forming an RGB pixel pattern on a deposition substrate by depositing organic materials of red, green and blue on the deposition substrate. In addition, the following description does not apply to an open mask (OM).

[0051] Figures 1 to 3 1 is a view for explaining a process of depositing an organic material on a deposition substrate 300 using the deposition mask 100 according to an embodiment.

[0052] Reference Figure 1 and Figure 2 , the organic material deposition apparatus includes a deposition mask 100 , a mask frame 200 , a deposition substrate 300 , an organic material deposition container 400 , and a vacuum chamber 500 .

[0053] The deposition mask 100 includes a metal. For example, the deposition mask includes iron (Fe) and nickel (Ni). In detail, the deposition mask includes an Invar alloy including iron (Fe) and nickel (Ni).

[0054] The deposition mask 100 includes a plurality of through holes TH. The through holes are disposed in an effective portion. The through holes are disposed to correspond to a pixel pattern to be formed on a deposition substrate. The deposition mask 100 includes a non-effective portion except for an effective portion including a deposition area.

[0055] The mask frame 200 includes an opening 205. A plurality of through holes are provided on a region corresponding to the opening 205. Thus, the organic material supplied to the organic material deposition container 400 is deposited on the deposition substrate 300. The deposition mask 100 is provided and fixed on the mask frame 200. For example, the deposition mask 100 is tensioned with a set tension. In addition, the deposition mask 100 is welded and fixed on the mask frame 200.

[0056] For example, the ineffective portion of the deposition mask 100 is welded. Thus, the deposition mask 100 is fixed to the mask frame 200. Then, the portion protruding from the mask frame 200 is cut and removed.

[0057] The mask frame 200 includes metal having high rigidity. Therefore, deformation of the mask frame during the welding process is reduced.

[0058] The deposition substrate 300 is a substrate used when manufacturing a display device. For example, an OLED pixel pattern is formed on the deposition substrate 300. Organic patterns of red, green, and blue are formed on the deposition substrate 300 to form pixels of three primary colors of light. That is, an RGB pattern is formed on the deposition substrate 300.

[0059] The organic material deposition container 400 is a crucible. The organic material is disposed inside the crucible. The organic material deposition container 400 moves inside the vacuum chamber 500. That is, the organic material deposition container 400 moves in one direction inside the vacuum chamber 500. For example, the organic material deposition container 400 moves in the width direction of the deposition mask 100 inside the vacuum chamber 500.

[0060] A heat source and / or an electric current is supplied to the organic material deposition container 400 , thereby the organic material is deposited on the deposition substrate 300 .

[0061] Reference Figure 3 , the deposition mask 100 includes a metal plate 10. The metal plate has a first surface 1S and a second surface 2S. The first surface 1S and the second surface 2S are opposite to each other.

[0062] The first surface 1S includes small-area holes V1. The second surface 2S includes large-area holes V2. For example, a plurality of small-area holes V1 and a plurality of large-area holes V2 are formed on the first surface 1S and the second surface 2S, respectively.

[0063] In addition, the deposition mask 100 includes a through hole TH. The through hole TH is formed by a connection portion CA connecting a boundary between the small-area hole V1 and the large-area hole V2.

[0064] The width of the large-area hole V2 is greater than the width of the small-area hole V1. The width of the small-area hole V1 is measured on the first surface 1S of the deposition mask 100. The width of the large-area hole V2 is measured on the second surface 2S of the deposition mask 100.

[0065] In addition, the width of the connection portion CA has a set size. In detail, the width of the connection portion CA may be 15 μm to 33 μm. In more detail, the width of the connection portion CA may be 19 μm to 33 μm. In more detail, the width of the connection portion CA may be 20 μm to 27 μm. When the width of the connection portion CA exceeds 33 μm, it is difficult to achieve a resolution of 500 PPI or higher. In addition, when the width of the connection portion CA is less than 15 μm, defects may be generated during the deposition process.

[0066] The small-area hole V1 faces the deposition substrate 300. The small-area hole V1 is disposed close to the deposition substrate 300. Therefore, the small-area hole V1 has a shape corresponding to the deposition pattern DP.

[0067] The large-area hole V2 faces the organic material deposition container 400. Therefore, the organic material supplied from the organic material deposition container 400 can be received with a wide width through the large-area hole V2. In addition, a fine pattern can be quickly formed on the deposition substrate 300 through the small-area hole V1.

[0068] Therefore, the organic material contained in the large-area hole V2 is deposited on the deposition substrate 300 through the small-area hole V1. Therefore, any one of the red, green and blue pixel patterns is formed on the deposition substrate 300. Then, the above process is repeated. Therefore, all the red, green and blue pixel patterns are formed on the deposition substrate 300.

[0069] Figure 4 is a plan view of a deposition mask 100 according to an embodiment.

[0070] Reference Figure 4 , the deposition mask 100 includes a deposition area DA and a non-deposition area NDA.

[0071] The deposition area DA is an area for forming a deposition pattern. The deposition area DA includes a pattern area and a non-pattern area. The pattern area is an area including a small-area hole V1, a large-area hole V2, a through hole TH, and an island-shaped portion IS. The non-pattern area is an area that does not include a small-area hole V1, a large-area hole V2, a through hole TH, and an island-shaped portion IS. The deposition area DA may be defined as an area from an initial starting point to an end point of a through hole or a hole in a longitudinal direction of the deposition mask 100.

[0072] In addition, the deposition area DA includes a plurality of effective portions AA1, AA2, and AA3. A plurality of deposition patterns may be formed by the effective portions. In detail, the pattern area includes a plurality of effective portions AA1, AA2, and AA3.

[0073] The deposition area DA includes a plurality of separation areas IA1 and IA2. The separation areas IA1 and IA2 are disposed between adjacent effective portions. The separation areas IA1 and IA2 are spacing areas between the plurality of effective portions. Adjacent effective portions may be distinguished from each other by the separation areas IA1 and IA2. In addition, one deposition mask 100 may support a plurality of effective portions.

[0074] The non-deposition area NDA is an area not involved in deposition. The non-deposition area NDA includes frame fixing areas FA1 and FA2. The frame fixing areas FA1, FA2 are areas for fixing the deposition mask 100 to the mask frame 200. In addition, the non-deposition area NDA may include half-etched portions HF1 and HF2 and an opening portion.

[0075] The half-etched portions HF1 and HF2 may disperse stress generated when the deposition mask 100 is tensioned.

[0076] In addition, the opening portion may disperse stress generated when the deposition mask 100 is tensioned. Therefore, deformation of the deposition mask may be reduced.

[0077] As described above, the deposition mask 100 includes a through-hole. The through-hole is a passage through which an organic material moves.

[0078] The through hole is formed by a small area hole, a large area hole and a connecting portion. The metal plate includes a plurality of through holes. In detail, the effective portion includes a plurality of through holes.

[0079] When the angle of the inner surface and the height or size of the small area hole in the major and minor axis directions are not uniform within a through hole, the amount of deposited material moving through the through hole may vary. In addition, the distance between the deposition mask and the deposition substrate may vary. As a result, the thickness of the deposition pattern may be uneven.

[0080] In addition, when the shapes and / or sizes of the plurality of through holes are not uniform, a size or shape deviation of a deposition pattern deposited on a deposition substrate may increase, and thus, deposition reliability of the deposition mask may be reduced.

[0081] Hereinafter, a deposition mask capable of solving the above-mentioned deposition unevenness will be described.

[0082] In the following, reference will be made to Figures 5 to 14 A deposition mask according to an embodiment is described.

[0083] Reference Figures 5 to 14 , the deposition mask 100 includes a plurality of through holes. In detail, the deposition mask 100 includes a plurality of unit through holes UTH. The unit through holes UTH are formed of a small-area hole V1, a large-area hole V2, and a connection portion CA.

[0084] The unit through hole UTH includes a first width W1 in the first direction 1D and a second width W2 in the second direction 2D. The first direction 1D and the second direction 2D may be a longitudinal direction or a width direction of the deposition mask 100. For example, the first direction 1D may be a longitudinal direction of the deposition mask 100. In addition, the second direction 2D may be a width direction of the deposition mask 100. In addition, the size of the width is defined as the size of the width of the large-area hole V2.

[0085] The first width W1 and the second width W2 are different. For example, the first width W1 is greater than the second width W2. Therefore, the unit through hole UTH has a long width in the first direction and a short width in the second direction.

[0086] However, the embodiment is not limited thereto. The first width and the second width may be the same or similar.

[0087] A rib RB and an island portion IS are provided between the plurality of unit through holes UTH. The rib RB is a region where the metal plate 10 is partially etched. In addition, the island portion IS is a region where the metal plate 10 is not etched.

[0088] Reference Figures 6 to 8, the island portion IS is a surface on which one surface of the metal plate is not etched. In addition, the rib RB is an area or surface on one side where two surfaces meet when the metal plate 10 is partially etched. For example, the rib RB may be a side or surface where the inner surface ES of the through hole meets. The longitudinal direction of the rib RB may extend along the second direction.

[0089] The rib RB is provided between the unit through holes UTH adjacent to each other in the first direction 1D. In addition, the island portion IS is provided between the unit through holes UTH adjacent to each other in the second direction 2D.

[0090] The island portion IS includes a first island portion IS1, a second island portion IS2, and a third island portion IS3. The first island portion IS1, the second island portion IS2, and the third island portion IS3 are connected.

[0091] Reference Figures 5 to 8 , the first island portion IS1 and the second island portion IS2 are spaced apart from each other. In addition, the third island portion IS3 is connected to the first island portion IS1 and the second island portion IS2. Therefore, the first island portion IS1 and the second island portion IS2 are connected through the third island portion IS3. That is, the first island portion IS1 and the second island portion IS2 do not contact each other. However, the first island portion IS1 and the second island portion IS2 are connected through the third island portion IS3.

[0092] The first island portion IS1 is disposed between adjacent unit through holes UTH1 and UTH2. In detail, the first island portion IS1 is disposed between unit through holes UTH adjacent to each other in the first direction 1D. The first island portion IS1 contacts the rib RB. For example, the rib RB connects adjacent first island portions IS1. Therefore, one end of the first island portion IS1 is connected to the third island portion IS3 in the second direction 2D. In addition, the other end of the first island portion IS1 is connected to the rib RB.

[0093] The second island portion IS2 protrudes in the direction of the connection portion CA of the unit through hole UTH. In detail, the second island portion IS2 protrudes from the third island portion IS3 in the second direction 2D. The second island portion IS2 is spaced apart from the rib RB. That is, the second island portion IS2 does not contact the rib RB. The second island portion IS2 is connected to the third island portion IS3. The second island portion IS2 includes at least one island portion. For example, the second island portion IS2 includes a plurality of island portions.

[0094] The second island portion IS is connected to the inner surface ES of the through hole. Therefore, one end of the second island portion IS2 is connected to the third island portion IS3 in the second direction 2D. In addition, the other end of the second island portion IS2 is connected to the inner surface ES of the through hole.

[0095] The third island portion IS3 is disposed between adjacent unit through holes UTH. In detail, the third island portion IS3 is disposed between unit through holes UTH adjacent to each other in the second direction 2D. The third island portion IS3 is spaced apart from the rib RB. That is, the third island portion IS3 is not in contact with the rib RB. The third island portion IS3 is connected to the first island portion IS1 and the second island portion IS2. In detail, one end of the third island portion IS3 is connected to the first island portion IS1 and the second island portion IS2 in the second direction 2D. In addition, the other end of the third island portion IS3 is connected to the first island portion IS1 and the second island portion IS2.

[0096] Reference Fig. 9 , the unit through holes UTH1 and UTH2 are divided into a plurality of regions. In detail, the unit through holes UTH1 and UTH2 are divided into a plurality of regions by the second island portion IS2.

[0097] For example, the unit through holes UTH1 and UTH2 include a first region 1A, a second region 2A, and a third region 3A. That is, the second island portion IS2 includes a plurality of second island portions. Therefore, the unit through holes UTH1, UTH2 are divided into a plurality of regions.

[0098] In the figure, it is shown that the second island portion IS2 includes a 2-1 island portion IS2-1, a 2-2 island portion IS2-2, a 2-3 island portion IS2-3, and a 2-4 island portion IS2-4. In addition, it is shown that the unit through holes UTH1 and UTH2 include a first area 1A, a second area 2A, and a third area 3A. However, the embodiment is not limited thereto. The second island portion may include less than four or more than four second island portions. Alternatively, the number of areas of the unit through holes UTH1 and UTH2 may vary.

[0099] The first region 1A is disposed in the central region of the unit through holes UTH1 and UTH2. In addition, the third region 3A is disposed in the outer region of the unit through holes UTH1 and UTH2. In addition, the second region 2A is disposed between the first region 1A and the third region 3A. Therefore, the two second regions 2A are disposed adjacent to the first region 1A in the first direction 1D. In addition, the two third regions 3A are disposed adjacent to the second region 2A in the first direction 1D.

[0100] The size of each region of the unit through hole is made uniform by the second island-shaped portion IS2. In addition, the deviation of the plurality of unit through holes is reduced by the second island-shaped portion IS2. In addition, the shapes of the plurality of unit through holes become uniform.

[0101] In detail, the deviation of the inclination angle of the inner surface of the large-area holes and the deviation of the height of the small-area holes in the first to third regions are reduced by the second island portion IS2.

[0102] Fig.10 and Fig.11 It is a view for explaining the deviation of the inclination angle of the inner surface of the large-area hole and the deviation of the height of the small-area hole which are different due to the presence of the second island portion.

[0103] Reference Fig.10 , when the second island portion is not included, the central region of the cell through hole is etched relatively more than the outer region.

[0104] In detail, the inner surface ES2 of the large-area hole V2 has different etching degrees for each region. In detail, when forming a through hole, the etchant can be concentrated toward the central region rather than the outer region. Therefore, the etching amount of the central region can be greater than the etching amount of the outer region.

[0105] Therefore, in the central region of the unit through hole, the inclination angle of the inner surface ES2 of the large-area hole increases, and the height H of the inner surface ES1 of the small-area hole decreases. Therefore, the deviation of the inclination angle of the inner surface of the large-area hole and the deviation of the height of the inner surface of the small-area hole increase between the central region and the outer region of the through hole.

[0106] Therefore, the deviation of the inclination angle and the height increases between the central area and the outer area of ​​the finally manufactured unit through hole. When the outer area is controlled to be less than or equal to 6μm so as to control the height of the small area hole to be less than or equal to 6μm, the height of the small area hole in the central area is close to 0. Therefore, the deposition pattern deposited on the deposition substrate and the deposition material remaining in the deposition mask can be connected. Therefore, when the deposition mask is removed, the deposition pattern can be demolded. On the other hand, when the height of the small area hole in the central area is controlled to be less than or equal to 6μm, the outer area is formed to be greater than or equal to 10μm. Therefore, the deposition pattern may not be deposited on the deposition substrate corresponding to the outer area.

[0107] For example, a large amount of deposition material may enter the central region, and a small amount of deposition material may enter the outer region. In addition, the distance between the deposition mask and the deposition substrate may be short in the central region, and the distance between the deposition mask and the deposition substrate may be long in the outer region. Therefore, the thickness deviation of the deposition pattern formed by the central region and the outer region of the unit through hole increases. Therefore, the deposition reliability of the deposition mask may be reduced.

[0108] In addition, a thickness deviation of a deposition pattern formed by a plurality of unit through holes may increase. Furthermore, a shape and / or size of the deposition pattern may become non-uniform. Therefore, the deposition reliability of the deposition mask may be reduced.

[0109] On the other hand, refer to Fig.11 When the second island portion IS2 is included, the deviation of the unit through-holes may be reduced. In addition, the shape and / or size of the deposition pattern formed by the plurality of unit through-holes may be uniform.

[0110] In detail, the inner surface ES2 of the large-area hole V2 and the inner surface ES1 of the small-area hole V1 may be divided into a plurality of regions by the second island portion IS2 .

[0111] The unit through hole can be formed by etching multiple regions separately, rather than etching all regions at once. Therefore, in each region of the unit through hole, the deviation of the inclination angle of the inner surface ES2 of the large-area hole V2 is reduced. In addition, the deviation of the height of the inner surface ES1 of the small-area hole V1 is reduced.

[0112] Therefore, the deviation of the inclination angle of the inner surface ES2 of the large-area hole V2 in the plurality of regions of the unit through-hole is reduced, and the deviation of the height H of the inner surface ES1 of the small-area hole V1 is reduced.

[0113] Preferably, the deviation of the inclination angle of the inner surface ES2 of the large-area hole V2 in multiple regions of the unit through hole may be less than or equal to 20°, less than or equal to 10°, less than or equal to 5°, or less than or equal to 2°. In addition, the deviation of the height H of the inner surface ES of the small-area hole V1 and / or the large-area hole V2 may be less than or equal to 5μm, less than or equal to 4μm, less than or equal to 3μm, less than or equal to 2μm, or less than or equal to 1μm.

[0114] Therefore, in the central area and the outer area of ​​the finally manufactured unit through hole, the deviation of the inclination angle of the inner surface ES2 of the large area hole V2 and the deviation of the height of the inner surface ES1 of the small area hole V1 are reduced. Therefore, when the deposition pattern is formed by the unit through hole, the thickness deviation between the central area and the outer area of ​​the unit through hole is reduced. Therefore, the deposition reliability of the deposition mask can be improved.

[0115] In addition, the thickness deviation of the deposition pattern formed by the plurality of unit through holes is reduced. In addition, the shape and / or size of the deposition pattern becomes uniform. Therefore, the deposition reliability of the deposition mask can be improved.

[0116] Meanwhile, in the deposition mask 100, the shape and size of the inner surface of the unit through hole can be formed in various ways by the second island portion. In detail, in the deposition mask 100, the height of the inner surface of the small-area hole V1 and the inclination angle of the inner surface of the large-area hole V2 can be formed to have various sizes for each region.

[0117] Figure 12 to Figure 14 : is a cross-sectional view of the first region to the third region of the unit through hole. The first region is the central region of the unit through hole based on the first direction. The third region is the outer region of the unit through hole. The second region is the region between the first region and the third region.

[0118] Reference Figure 12 to Figure 14 The first region 1A of the large-area holes includes a 2-1 inner surface ES2-1 in the first direction 1D. In addition, the first region 1A of the small-area holes includes a 1-1 inner surface ES1-1 in the first direction 1D.

[0119] In addition, the 2-1 inner surface ES2-1 has a curvature. In addition, the 2-1 inner surface ES2-1 has a first inclination angle θ1. In addition, the large-area hole in the first region 1A has a 2-1 height H2-1. In addition, the small-area hole in the first region 1A has a 1-1 height H1-1.

[0120] The second region 2A of the large-area holes includes a 2-2 inner surface ES2-2 in the first direction 1D. In addition, the second region 2A of the small-area holes includes a 1-2 inner surface ES1-2 in the first direction 1D.

[0121] In addition, the 2-2 inner surface ES2-2 has a curvature. In addition, the 2-2 inner surface ES2-2 has a second inclination angle θ2. In addition, the large-area hole in the second region 2A has a 2-2 height H2-2. In addition, the small-area hole in the second region 2A has a 1-2 height H1-2.

[0122] The third region 3A of the large-area holes includes a 2-3 inner surface ES2-3 in the first direction 1D. In addition, the third region 3A of the small-area holes includes a 1-3 inner surface ES1-3 in the first direction 1D.

[0123] In addition, the 2-3 inner surface ES2-3 has a curvature. In addition, the 2-3 inner surface ES2-3 has a third inclination angle θ3. In addition, the large-area hole in the third region 3A has a 2-3 height H2-3. In addition, the small-area hole in the third region 3A has a 1-3 height H1-3.

[0124] An imaginary line connecting one end of the connecting portion CA and one end of the large-area hole V2 may be defined. The inclination angle of the large-area hole V2 is an acute angle formed by the imaginary line and the extension line of the connecting portion CA. In addition, the height of the large-area hole is the vertical height from the connecting portion CA to the island portion IS3. In addition, the height of the small-area hole V1 is the vertical height from the connecting portion CA to the first surface. In addition, the curvature is defined as the inverse of the curvature radius (μm).

[0125] The 2-1 inner surface ES2-1, the 2-2 inner surface ES2-2 and the 2-3 inner surface ES2-3 may have different inclination angles. In addition, the 2-1 inner surface ES2-1, the 2-2 inner surface ES2-2 and the 2-3 inner surface ES2-3 may have different curvatures. In addition, the 1-1 inner surface ES1-1, the 1-2 inner surface ES1-2 and the 1-3 inner surface ES1-3 may have different heights.

[0126] Reference Figure 12 to Figure 14 , the third inclination angle θ3 may be greater than the first inclination angle θ1 and the second inclination angle θ2. In addition, the second inclination angle θ2 may be greater than the first inclination angle θ1. Therefore, the inclination angle of the inner surface of the large-area hole may decrease when extending from the outer region to the central region.

[0127] In addition, the curvature of the 2-3 inner surface ES2-3 can be greater than the curvature of the 2-1 inner surface ES2-1 and the curvature of the 2-2 inner surface ES2-2. In addition, the curvature of the 2-2 inner surface ES2-2 can be greater than the curvature of the 2-1 inner surface ES2-1. Therefore, the curvature of the inner surface of the large-area hole can decrease when extending from the outer area to the central area.

[0128] In addition, the height of the 1-1 inner surface ES1-1 may be greater than the height of the 1-2 inner surface ES1-2 and the 1-3 inner surface ES1-3. In addition, the height of the 1-2 inner surface ES1-2 may be greater than the height of the 1-3 inner surface ES1-3. Therefore, the height of the inner surface of the small-area hole may increase when extending from the outer region to the central region.

[0129] However, the embodiment is not limited thereto. That is, the inclination angle, curvature, and height of the inner surface of the large-area hole and the height of the small-area hole may be formed in various ways depending on the area.

[0130] For example, the first inclination angle θ1 may be greater than the second inclination angle θ2 and the third inclination angle θ3. In addition, the second inclination angle θ2 may be greater than the third inclination angle θ3. Therefore, the inclination angle of the inner surface of the large-area hole may increase when extending from the outer region to the central region.

[0131] In addition, the curvature of the inner surface ES2-1 of 2-1 may be greater than the curvature of the inner surface ES2-2 of 2-2 and the curvature of the inner surface ES2-3 of 2-3. In addition, the curvature of the inner surface ES2-2 of 2-2 may be greater than the curvature of the inner surface ES2-3 of 2-3. Therefore, the curvature of the inner surface of the large-area hole may increase when extending from the outer area to the central area.

[0132] In addition, the height of the 1-3 inner surface ES1-3 may be greater than the height of the 1-1 inner surface ES1-1 and the height of the 1-2 inner surface ES1-2. In addition, the height of the 1-2 inner surface ES1-2 may be greater than the height of the 1-1 inner surface ES1-1. Therefore, the height of the inner surface of the small-area hole may decrease when extending from the outer region to the central region.

[0133] Alternatively, the second inclination angle θ2 may be greater than the first inclination angle θ1 and the third inclination angle θ3. In addition, the first inclination angle θ1 and the third inclination angle θ3 may be the same. Alternatively, the first inclination angle θ1 and the third inclination angle θ3 may be different. For example, the first inclination angle θ1 may be greater than the third inclination angle θ3. Alternatively, the third inclination angle θ3 may be greater than the first inclination angle θ1. Therefore, the inclination angle of the inner surface of the large-area hole may increase and then decrease when extending from the central area to the outer area.

[0134] In addition, the curvature of the 2-2 inner surface ES2-2 can be greater than the curvature of the 2-1 inner surface ES2-1 and the curvature of the 2-3 inner surface ES2-3. In addition, the curvature of the 2-1 inner surface ES1 and the 2-3 inner surface ES2-3 can be the same. Alternatively, the curvature of the 2-1 inner surface ES2-1 and the 2-3 inner surface ES2-3 can be different. For example, the curvature of the 2-1 inner surface ES2-1 can be greater than the curvature of the 2-3 inner surface ES2-3. Alternatively, the curvature of the 2-3 inner surface ES2-3 can be greater than the curvature of the 2-1 inner surface ES2-1. Therefore, the curvature of the inner surface of the large area hole can increase and then decrease when extending from the central area to the outer area.

[0135] Alternatively, the height of the 1-2 inner surface ES1-2 may be less than the height of the 1-1 inner surface ES1-1 and the height of the 1-3 inner surface ES1-3. In addition, the height of the 1-1 inner surface ES1-1 and the height of the 1-3 inner surface ES1-3 may be the same. Alternatively, the height of the 1-1 inner surface ES1-1 and the height of the 1-3 inner surface ES1-3 may be different. For example, the height of the 1-1 inner surface ES1-1 may be greater than the height of the 1-3 inner surface ES1-3. Alternatively, the height of the 1-3 inner surface ES1-3 may be greater than the height of the 1-1 inner surface ES1-1. Therefore, the height of the inner surface of the small-area hole may increase and then decrease when extending from the central area to the outer area.

[0136] In the absence of the second island portion, the shape of the inner surface of the large-area hole is formed by an etching process so that the inclination angle decreases and the curvature increases when extending from the central area to the outer area. In addition, the shape of the small-area hole is formed so that the height increases when extending from the central area to the outer area.

[0137] However, in the deposition mask according to the embodiment, the etching degree of the inner surface of the large-area hole can be controlled for each region by the second island portion. Therefore, as described above, the inclination angle and curvature of the inner surface of the large-area hole and the height of the small-area hole can be varied.

[0138] Therefore, the inclination angle of the inner surface, the curvature of the inner surface, the height of the large-area hole, and the height of the small-area hole may be formed in various ways according to the positions of the large-area hole and the small-area hole based on the first direction.

[0139] Therefore, at least one of the shape of the large-area hole, the size of the large-area hole, and the size of the small-area hole may be formed in various sizes or shapes according to the environment in which the deposition mask is used.

[0140] For example, it is necessary to adjust the inclination angle of the inner surface of the large-area hole in order to reduce the height deviation of the small-area hole. In this case, since the height of the small-area hole in the central region is too low compared to the height of the small-area hole in the outer region, the deposition pattern may be stripped. In this case, by forming the large-area hole in the central region at a smaller angle, the height of the small-area hole in the central region can be increased. In addition, depending on the conditions of the organic material deposition equipment, a small amount of deposition material is deposited in the outer region of the unit through hole, and therefore the light efficiency of the deposition pattern may be low. In this case, the angle of the large-area hole in the outer region of the unit through hole can be increased, or the height of the small-area hole can be reduced. Therefore, the light efficiency of the deposition pattern can be improved by increasing the thickness of the deposition pattern deposited in the outer region. Therefore, the deposition mask has an improved deposition efficiency. In addition, the deposition reliability of the unit deposition area corresponding to the unit through hole can be improved.

[0141] The deposition mask according to an embodiment includes a plurality of second island portions.

[0142] The second island-shaped portion protrudes toward the connecting portion. The shape and size of the unit through hole are controlled by the second island-shaped portion. That is, the shape of the unit through hole can be made uniform for each region by the second island-shaped portion. In addition, the deviation of the inclination angle of the inner surface of the large-area hole and the deviation of the height of the small-area hole in multiple regions of the unit through hole can be reduced by the second island-shaped portion. In addition, the shape and size of multiple unit through holes can be uniform.

[0143] Therefore, the thickness uniformity of the deposition pattern formed by the unit through-holes can be improved. In addition, the thickness and shape of the deposition pattern formed by the plurality of unit through-holes become uniform.

[0144] Therefore, the deposition mask according to the embodiment has improved deposition efficiency and deposition reliability.

[0145] The characteristics, structures, effects, etc. described in the above embodiments are included in at least one embodiment of the present invention, but are not limited to only one embodiment. In addition, the characteristics, structures, and effects shown in each embodiment can be combined or modified by those skilled in the art for other embodiments. Therefore, it should be understood that such combinations and modifications are included within the scope of the present invention.

[0146] In addition, the above mainly describes the embodiment, but the embodiment is only an example and does not limit the present invention, and it can be understood by those skilled in the art that, without departing from the essential characteristics of the embodiment, several changes and applications not presented above can be made. For example, each component specifically shown in the embodiment can be changed. In addition, it should be explained that the differences related to such changes and such applications are included in the scope of the present invention defined in the appended claims.

Claims

1. A deposition mask, comprising: A metal plate comprising a deposition area and a non-deposition area, wherein the deposition area includes at least one effective portion; Wherein, the effective part includes a plurality of unit through holes, The unit through hole comprises: a small-area hole formed on the first surface of the metal plate; a large-area hole formed on the second surface of the metal plate; and a connecting portion connecting the small-area hole and the large-area hole. Wherein, ribs are arranged between the adjacent unit through holes in the first direction, An island portion is provided between the unit through holes adjacent to each other in the second direction, The island portion includes a first island portion and a second island portion that are spaced apart from each other. wherein the first island portion contacts the rib, Wherein, the second island portion is spaced apart from the rib portion.

2. The deposition mask according to claim 1 , further comprising a third island portion connected to the first island portion and the second island portion, in, The third island portion extends along the first direction.

3. The deposition mask according to claim 2, wherein: The second island portion protrudes from the third island portion toward the connection portion.

4. The deposition mask according to claim 1, wherein: One end of the first island portion is connected to the third island portion, and the other end is connected to the rib portion; One end of the second island portion is connected to the third island portion, and the other end is connected to the inner surface of the unit through hole.

5. The deposition mask according to claim 1, wherein: The second island-shaped portion includes a plurality of island-shaped portions.

6. The deposition mask according to claim 1, wherein: The inner surface of the large-area hole includes a first area, a second area, and a third area divided by the second island portion. wherein the first region is arranged in a central region of the inner surface of the large-area hole, wherein the third region is arranged in an outer region of the inner surface of the large-area hole, The second area is arranged between the first area and the third area.

7. The deposition mask according to claim 6, wherein: The inclination angles of the inner surfaces of the large-area holes in the first region, the second region, and the third region are different.

8. The deposition mask according to claim 6, wherein: The curvatures of the inner surfaces of the large-area holes in the first region, the second region, and the third region are different.

9. The deposition mask according to claim 6, wherein: The large-area holes in the first region, the second region, and the third region have different heights.

10. The deposition mask according to claim 6, wherein: The small-area holes in the first region, the second region, and the third region have different heights.

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