Wave soldering process of DIP device

Abstract

The invention discloses a wave soldering process of a DIP device, which specifically comprises the following processing steps: S1, preparing the DIP device and a soldering material: before wave soldering, preparing a cleaning solution, cleaning the surface of the DIP device, and preparing the soldering material; s2, wave soldering equipment is set, the size of the DIP device is measured and matched, and parameters of the wave soldering equipment are set and comprise the preheating temperature, the soldering temperature and the soldering speed; s3, loading the DIP device: correctly loading the prepared DIP device into a clamp of wave soldering equipment, and ensuring that the device is in good contact with welding waves; s4, wave soldering equipment is started; and S5, cooling and cleaning. By providing a cleaning solution formula, a specific welding material composition, wave-soldering equipment parameter setting, a temperature curve control technology, a laser measurement technology and a rapid cleaning and cooling treatment method, the wave-soldering process of the DIP device is improved, the welding quality, precision and consistency are improved, and innovativeness and practicability are achieved.

Description

Technical Field

[0001] The invention relates to the technical field of integrated circuit processing, in particular to a wave soldering process of a DIP device. Background Art

[0002] DIP (dual in-line package) is a common electronic component packaging method used in integrated circuits (ICs) and other electronic devices. DIP devices have a rectangular plastic or ceramic shell with two rows of parallel pins on the bottom. These pins are designed to be inserted into holes on a printed circuit board (PCB) and fixed by welding, thereby providing an electrical connection between the device and the circuit. The CPU chip in a DIP package has two rows of pins and needs to be inserted into a chip socket with a DIP structure. DIP packaged components can be installed on the circuit board using through-hole plug-in technology, and wave soldering is used to allow the soldering surface of the plug-in electronic circuit board to directly contact the high-temperature liquid tin to achieve the purpose of soldering. Wave soldering is a process in which molten liquid solder is pumped to form a solder wave of a specific shape on the surface of the solder tank, and the PCB with the components inserted is placed on a conveyor chain, and the solder joints are soldered by passing through the solder wave crest at a certain angle and a certain immersion depth. During the process of being conveyed by the chain conveyor, the components are first preheated in the preheating zone of the welder (the preheating of the components and the temperature to be reached are still controlled by the predetermined temperature curve.

[0003] There are some problems with the traditional wave soldering process of DIP devices. During the process, the soldering is uneven, the soldering temperature is difficult to control, and poor soldering contact is prone to occur. Here we propose a wave soldering process for DIP devices. Summary of the invention

[0004] In order to solve the above technical deficiencies, the present invention adopts a modified technical solution, a wave soldering process for DIP devices, which specifically includes the following processing steps:

[0005] S1, prepare DIP devices and welding materials: before wave soldering, prepare cleaning solution, clean the surface of DIP devices, and prepare welding materials;

[0006] S2, wave soldering equipment setting, measuring and matching the size of DIP devices, and setting the parameters of wave soldering equipment, including preheating temperature, soldering temperature and soldering speed;

[0007] S3, loading DIP devices: correctly load the prepared DIP devices into the fixture of the wave soldering equipment, ensuring good contact between the device and the soldering wave;

[0008] S4, start the wave soldering equipment, so that the soldering wave flows through the pins of the DIP device at a preset temperature to achieve soldering connection, control the soldering time and temperature, and ensure the soldering quality and stability;

[0009] S5, Cooling and cleaning: After welding, the device is quickly cleaned, then sent to a sealed cabinet and injected with mixed inert gas for rapid cooling to prevent welding material residue and oxidation.

[0010] As a further preferred embodiment of the present invention, in step S1, the formula of the cleaning solution includes the following: 2-6 parts of acetone, 1-3 parts of ethanol, 2-4 parts of isopropanol, 1-5 parts of surfactant, 1.5-4 parts of chelating agent, 2-5 parts of buffer, and 3-4 parts of deionized water.

[0011] As a further preferred embodiment of the present invention, the welding material comprises: 5%-25% tin, 5%-10% palladium, 15%-20% indium, 5%-15% cobalt, 5%-15% silver, 0%-5% copper and 0%-15% antimony.

[0012] As a further preferred embodiment of the present invention, in step S2, the preheating temperature: using a precisely controlled temperature control system, according to the characteristics of the device and the welding material, the preheating temperature is set and controlled between 85°C and 175°C, the welding temperature curve, the welding speed, is between 2cm / s and 80cm / s, the selection of the peak height is adjusted according to the pin size of the device and the welding requirements, between 0.1mm and 15mm, and the welding time is between 0.3 seconds and 2.5 seconds.

[0013] As a further preferred embodiment of the present invention, in step S2, temperature curve control technology is introduced, and the temperature is dynamically adjusted to optimize the temperature distribution and thermal cycle effect during the welding process. The temperature sensor is arranged between 120°C and 480°C: multiple temperature sensors are arranged in the wave soldering equipment to monitor the temperature changes during the welding process. The sensors are placed in the contact area of ​​the welding wave, around the device pins and other key positions. The data of the temperature sensor is obtained in real time, and the temperature curve is controlled according to the preset temperature curve to formulate a suitable temperature curve. The temperature curve includes a preheating stage, a welding stage and a cooling stage. Each stage corresponds to a different temperature setting value and time. Based on the real-time temperature sensor data and the preset temperature curve, a temperature adjustment algorithm is designed. The algorithm adjusts the heating power or other control parameters of the welding equipment according to the deviation between the actual temperature and the target temperature to achieve dynamic temperature adjustment, real-time monitoring and feedback control. If the temperature deviates from the preset curve, it is adjusted to keep the actual temperature consistent with the preset temperature.

[0014] As a further preferred embodiment of the present invention, in step S2, laser measurement technology is introduced to measure the geometric parameters and surface features of the workpiece in real time, the laser bar image is perspective projected onto an industrial camera, and data is extracted through an image processing algorithm, and the dimensional error is controlled between 0.3um and 0.8um.

[0015] As a further preferred embodiment of the present invention, in step S5, after welding is completed, 92% ethanol is used for rapid cleaning, and the inert gas is selected from helium or argon. The gas injection is maintained at 45 ml / min to keep the oxygen content in the cavity less than 42 uL / L.

[0016] The beneficial effects achieved by the present invention are as follows: the patent provides a formula of a cleaning solution, including acetone, ethanol, isopropanol, surfactant, chelating agent, buffer and deionized water. The formula of this cleaning solution can effectively remove dirt and impurities on the surface of the DIP device, provide a clean surface for the welding process, and provide a specific welding material composition, including different proportions of tin, palladium, indium, cobalt, silver, copper and antimony. This welding material composition can provide a good welding connection according to the welding requirements and has the required physical and chemical properties. The temperature curve control technology is introduced, and the temperature is dynamically adjusted during the welding process by arranging multiple temperature sensors and performing real-time control according to the preset temperature curve. This technology can optimize the temperature distribution and thermal cycle effect, improve the welding quality and stability, and introduce laser measurement technology to measure the geometric parameters and surface features of the DIP device in real time. Through the perspective projection of the laser bar image and the image processing algorithm, the data can be accurately extracted and the dimensional error can be controlled, thereby improving the accuracy and consistency of welding. The use of 92% ethanol for rapid cleaning and the rapid cooling treatment by injecting inert gas can effectively remove the residual welding material and prevent oxidation, thereby improving the welding quality and reliability. DETAILED DESCRIPTION

[0017] The following will be combined with the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0018] The present invention provides a technical solution: a wave soldering process for a DIP device, which specifically includes the following processing steps:

[0019] S1, prepare DIP devices and welding materials: before wave soldering, prepare cleaning solution, clean the surface of DIP devices, and prepare welding materials;

[0020] S2, wave soldering equipment setting, measuring and matching the size of DIP devices, and setting the parameters of wave soldering equipment, including preheating temperature, soldering temperature and soldering speed;

[0021] S3, loading DIP devices: correctly load the prepared DIP devices into the fixture of the wave soldering equipment, ensuring good contact between the device and the soldering wave;

[0022] S4, start the wave soldering equipment, so that the soldering wave flows through the pins of the DIP device at a preset temperature to achieve soldering connection, control the soldering time and temperature, and ensure the soldering quality and stability;

[0023] S5, Cooling and cleaning: After welding, the device is quickly cleaned, then sent to a sealed cabinet and injected with mixed inert gas for rapid cooling to prevent welding material residue and oxidation.

[0024] In step S1, the formula of the cleaning solution includes the following: 2-6 parts of acetone, 1-3 parts of ethanol, 2-4 parts of isopropanol, 1-5 parts of surfactant, 1.5-4 parts of chelating agent, 2-5 parts of buffer, and 3-4 parts of deionized water.

[0025] The soldering materials include: 5%-25% tin, 5%-10% palladium, 15%-20% indium, 5%-15% cobalt, 5%-15% silver, 0%-5% copper and 0%-15% antimony.

[0026] In step S2, preheating temperature: use a precisely controlled temperature control system to set the preheating temperature between 85°C and 175°C according to the characteristics of the device and welding materials, the welding temperature curve, the welding speed, between 2cm / s and 80cm / s, the selection of the peak height is adjusted according to the pin size of the device and the welding requirements, between 0.1mm and 15mm, and the welding time is between 0.3 seconds and 2.5 seconds.

[0027] In step S2, temperature curve control technology is introduced, temperature is dynamically adjusted, temperature distribution and thermal cycle effect in welding process are optimized, and temperature sensors are arranged between 120℃-480℃: multiple temperature sensors are arranged in wave soldering equipment to monitor temperature changes in welding process, and sensors are placed in the contact area of ​​welding wave, around device pins and other key positions, and the data of temperature sensors are obtained in real time, and controlled according to the preset temperature curve to formulate a suitable temperature curve. The temperature curve includes preheating stage, welding stage and cooling stage, each stage corresponds to different temperature setting value and time, and the temperature adjustment algorithm is designed based on the real-time temperature sensor data and the preset temperature curve. The algorithm adjusts the heating power or other control parameters of the welding equipment according to the deviation between the actual temperature and the target temperature to achieve dynamic temperature adjustment, real-time monitoring and feedback control, and the temperature deviates from the preset curve, and is adjusted to keep the actual temperature consistent with the preset temperature.

[0028] In step S2, laser measurement technology is introduced to measure the geometric parameters and surface features of the workpiece in real time. The laser bar image is projected onto an industrial camera, and data is extracted through an image processing algorithm. The dimensional error is controlled between 0.3um and 0.8um.

[0029] In step S5, after welding is completed, 92% ethanol is used for rapid cleaning, and the inert gas is selected from helium or argon. The gas injection is maintained at 45 ml / min to keep the oxygen content in the cavity less than 42 uL / L.

[0030] Embodiment 1

[0031] A wave soldering process for a DIP device specifically includes the following processing steps: preparing the DIP device and soldering materials: before wave soldering, preparing a cleaning solution, cleaning the surface of the DIP device, and preparing soldering materials. The formula of the cleaning solution includes the following: 6 parts of acetone, 3 parts of ethanol, 4 parts of isopropanol, 5 parts of surfactant, 4 parts of chelating agent, 5 parts of buffer, and 4 parts of deionized water. The soldering materials include: 25% tin, 10% palladium, 20% indium, 15% cobalt, 15% silver, 5% copper, and 10% antimony; setting the wave soldering equipment, measuring and matching the size of the DIP device, introducing laser measurement technology to measure the geometric parameters and surface features of the workpiece in real time, using laser bar image perspective projection to image on an industrial camera, and extracting data through an image processing algorithm, and controlling the size error between 0.8um; setting the parameters of the wave soldering equipment, Including preheating temperature, welding temperature and welding speed, preheating temperature: use a precisely controlled temperature control system, according to the characteristics of the device and welding materials, set the preheating temperature, control it between 175℃, welding temperature curve, welding speed, between 80cm / s, the selection of wave crest height is adjusted according to the pin size of the device and welding requirements, at 15mm, welding time, at 2.5 seconds, introduce temperature curve control technology, dynamic adjustment of temperature, optimize the temperature distribution and thermal cycle effect during welding, 480℃ temperature sensor layout: arrange multiple temperature sensors in the wave soldering equipment to monitor the temperature changes during welding. The sensors are placed in the contact area of ​​the welding wave, around the device pins and other key positions, and obtain the data of the temperature sensor in real time, and control it according to the preset temperature curve to formulate a suitable temperature curve. The temperature curve includes a preheating stage, a welding stage and a cooling stage. Each stage corresponds to a different temperature setting value and time. Based on the real-time temperature sensor data and the preset temperature curve, a temperature adjustment algorithm is designed. The algorithm adjusts the heating power or other control parameters of the welding equipment according to the deviation between the actual temperature and the target temperature to achieve dynamic temperature adjustment, real-time monitoring and feedback control. The temperature deviates from the preset curve and is adjusted to keep the actual temperature consistent with the preset temperature. Loading DIP devices: correctly load the prepared DIP devices into the fixture of the wave soldering equipment to ensure good contact between the device and the welding wave. Start the wave soldering equipment to make the welding wave flow through the pins of the DIP device at the preset temperature to achieve welding connection. Control the welding time and temperature to ensure welding quality and stability; Cooling and cleaning: After welding is completed, the device is quickly cleaned, and then the device is sent to a sealed cabinet and injected with a mixed inert gas for rapid cooling to prevent residual and oxidation of welding materials. After welding is completed, 92% ethanol is used for rapid cleaning. The inert gas is selected from helium or argon. The gas injection is maintained at 45ml / min to keep the oxygen content in the cavity less than 42uL / L.

[0032] Embodiment 2

[0033] A wave soldering process for a DIP device specifically includes the following processing steps: preparing the DIP device and soldering materials: before wave soldering, preparing a cleaning solution, cleaning the surface of the DIP device, and preparing soldering materials. The formula of the cleaning solution includes the following: 2 parts of acetone, 1 part of ethanol, 2 parts of isopropanol, 1 part of surfactant, 1.5 parts of chelating agent, 2 parts of buffer, and 3 parts of deionized water. The soldering materials include: 20% tin, 10% palladium, 20% indium, 15% cobalt, 15% silver, 5% copper, and 15% antimony; setting the wave soldering equipment, measuring and matching the size of the DIP device, introducing laser measurement technology to measure the geometric parameters and surface features of the workpiece in real time, using laser bar image perspective projection to image on an industrial camera, and extracting data through an image processing algorithm, and controlling the size error within 0.3um; setting the parameters of the wave soldering equipment, including Including preheating temperature, welding temperature and welding speed, preheating temperature: use a precisely controlled temperature control system, set the preheating temperature according to the characteristics of the device and welding materials, and control it at 85°C, welding temperature curve, welding speed, 2cm / s, the selection of wave crest height is adjusted according to the pin size of the device and welding requirements, at 0.1mm, welding time, at 0.3 seconds, introduce temperature curve control technology, dynamic adjustment of temperature, optimize the temperature distribution and thermal cycle effect during welding, between 120°C-480°C Temperature sensor layout: arrange multiple temperature sensors in the wave soldering equipment to monitor the temperature changes during welding. The sensors are placed in the contact area of ​​the welding wave, around the device pins and other key locations, and obtain the data of the temperature sensor in real time, and control it according to the preset temperature curve to formulate a suitable temperature curve. The temperature curve includes a preheating stage, a welding stage and a cooling stage. Each stage corresponds to a different temperature setting value and time. Based on the real-time temperature sensor data and the preset temperature curve, a temperature adjustment algorithm is designed. The algorithm adjusts the heating power or other control parameters of the welding equipment according to the deviation between the actual temperature and the target temperature to achieve dynamic temperature adjustment, real-time monitoring and feedback control. The temperature deviates from the preset curve and is adjusted to keep the actual temperature consistent with the preset temperature. Loading DIP devices: correctly load the prepared DIP devices into the fixture of the wave soldering equipment to ensure good contact between the device and the welding wave. Start the wave soldering equipment to make the welding wave flow through the pins of the DIP device at the preset temperature to achieve welding connection. Control the welding time and temperature to ensure welding quality and stability; Cooling and cleaning: After welding is completed, the device is quickly cleaned, and then the device is sent to a sealed cabinet and injected with a mixed inert gas for rapid cooling to prevent residual and oxidation of welding materials. After welding is completed, 92% ethanol is used for rapid cleaning. The inert gas is selected from helium or argon. The gas injection is maintained at 45ml / min to keep the oxygen content in the cavity less than 42uL / L.

[0034] The above shows and describes the basic principles and main features of the present invention and the advantages of the present invention. It is obvious to those skilled in the art that the present invention is not limited to the details of the above exemplary embodiments, and the present invention can be implemented in other specific forms without departing from the spirit or basic features of the present invention. Therefore, no matter from which point of view, the embodiments should be regarded as exemplary and non-restrictive. The scope of the present invention is defined by the appended claims rather than the above description, and it is intended that all changes that fall within the meaning and scope of the equivalent elements of the claims are included in the present invention.

[0035] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. A wave soldering process for a DIP device, characterized in that: The specific processing steps include: S1, prepare DIP devices and welding materials: before wave soldering, prepare cleaning solution, clean the surface of DIP devices, and prepare welding materials; S2, wave soldering equipment setting, measuring and matching the size of DIP devices, and setting the parameters of wave soldering equipment, including preheating temperature, soldering temperature and soldering speed; S3, loading DIP devices: correctly load the prepared DIP devices into the fixture of the wave soldering equipment, ensuring good contact between the device and the soldering wave; S4, start the wave soldering equipment, make the soldering wave flow through the pins of the DIP device at a preset temperature, achieve soldering connection, control the soldering time and temperature, and ensure the soldering quality and stability; S5, Cooling and cleaning: After welding, the device is quickly cleaned, then sent to a sealed cabinet and injected with mixed inert gas for rapid cooling to prevent welding material residue and oxidation.

2. A wave soldering process for a DIP device according to claim 1, characterized in that: In step S1, the formula of the cleaning solution includes the following: 2-6 parts of acetone, 1-3 parts of ethanol, 2-4 parts of isopropanol, 1-5 parts of surfactant, 1.5-4 parts of chelating agent, 2-5 parts of buffer, and 3-4 parts of deionized water.

3. A wave soldering process for a DIP device according to claim 1, characterized in that: The welding material includes: 5%-25% tin, 5%-10% palladium, 15%-20% indium, 5%-15% cobalt, 5%-15% silver, 0%-5% copper and 0%-15% antimony.

4. A wave soldering process for a DIP device according to claim 1, characterized in that: In step S2, preheating temperature: use a precisely controlled temperature control system to set the preheating temperature between 85°C and 175°C according to the characteristics of the device and welding materials, the welding temperature curve, the welding speed, between 2cm / s and 80cm / s, the selection of the peak height is adjusted according to the pin size of the device and the welding requirements, between 0.1mm and 15mm, and the welding time is between 0.3 seconds and 2.5 seconds.

5. A wave soldering process for a DIP device according to claim 1, characterized in that: In step S2, temperature curve control technology is introduced, and the temperature is dynamically adjusted to optimize the temperature distribution and thermal cycle effect during the welding process. The temperature sensor is arranged between 120°C and 480°C: multiple temperature sensors are arranged in the wave soldering equipment to monitor the temperature changes during the welding process. The sensors are placed in the contact area of ​​the welding wave, around the device pins and other key positions. The data of the temperature sensor is obtained in real time, and the temperature curve is controlled according to the preset temperature curve to formulate a suitable temperature curve. The temperature curve includes a preheating stage, a welding stage and a cooling stage. Each stage corresponds to a different temperature setting value and time. Based on the real-time temperature sensor data and the preset temperature curve, a temperature adjustment algorithm is designed. The algorithm adjusts the heating power or other control parameters of the welding equipment according to the deviation between the actual temperature and the target temperature to achieve dynamic temperature adjustment, real-time monitoring and feedback control. If the temperature deviates from the preset curve, it is adjusted to keep the actual temperature consistent with the preset temperature.

6. A wave soldering process for a DIP device according to claim 1, characterized in that: In step S2, laser measurement technology is introduced to measure the geometric parameters and surface features of the workpiece in real time. The laser bar image is projected onto an industrial camera, and data is extracted through an image processing algorithm. The dimensional error is controlled between 0.3um and 0.8um.

7. A wave soldering process for a DIP device according to claim 1, characterized in that: In step S5, after welding is completed, 92% ethanol is used for rapid cleaning, and the inert gas is selected from helium or argon. The gas injection is maintained at 45 ml / min to keep the oxygen content in the cavity less than 42 uL / L.