Microwave chip packaging device welding equipment and method

Abstract

The invention discloses a welding device and method for a microwave chip packaging device, relates to the technical field of microwave chip welding, and aims to solve the technical problem that the quality of a welding point is affected as the temperature of the bottom of a circuit board is inconsistent with that of the top of the circuit board due to the fact that the circuit board is easily affected by the temperature of a conveying track. The reflow soldering furnace body comprises a conveying mechanism, the conveying mechanism comprises a conveying belt, a fixed side plate is arranged on the side of the conveying belt, multiple sets of device bearing frames are arranged on the conveying belt, a forward guide plate and a reverse guide plate are arranged on the side wall of the fixed side plate, and each set of device bearing frame is composed of a front frame and a rear frame. The front frame comprises a first lifting positioning frame and a plurality of clamping assemblies. The device has the advantages that it can be guaranteed that the position of the circuit board in the reflow soldering furnace is stable, the circuit board body is lifted and kept above the conveying belt, it is guaranteed that all angles of the circuit board body are evenly heated, and the soldering quality is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of microwave chip welding, and more specifically to a microwave chip packaging device welding device and method. Background Art

[0002] Reflow soldering is mainly used in surface mount technology. It is achieved by heating the microwave chip packaging device pre-placed on the circuit board to melt the solder paste, and then cooling and solidifying it. In the welding of microwave chip packaging devices, the reflow soldering furnace achieves welding by precisely controlling the temperature of the welding area. It usually has multiple temperature zones, each of which can independently set the temperature and heating time. When working, the circuit board enters from one end of the furnace and passes through the preheating zone, reflow zone and cooling zone along the conveyor track. In the preheating zone, the temperature gradually increases to evaporate the solvent in the solder paste and reduce splashing and voids in the subsequent welding process. In the reflow zone, the temperature reaches above the melting point of the solder alloy, so that the solder melts and forms a good connection between the component pins and the circuit board pads. The cooling zone solidifies the molten solder to complete the welding process.

[0003] In the welding of microwave chip packaging devices, the circuit board is usually placed directly on a conveyor belt and transported to a reflow oven for heating. During the transmission process, the circuit board may be affected by the vibration of the transmission equipment itself and shift in position, which may cause the position of the circuit board in each temperature zone in the reflow oven to be inconsistent, resulting in uneven heating of the circuit board and affecting the quality of the welding point; on the other hand, after the conveyor belt continues to work, it is affected by the high temperature of the reflow oven and its own temperature will gradually increase, which may cause the temperature at the bottom of the circuit board to be inconsistent with the top, causing the solder to melt unevenly, thus affecting the quality of the welding point. In view of this, we propose a microwave chip packaging device welding device and method. Summary of the invention

[0004] The purpose of the present invention is to provide a microwave chip packaging device welding device and method to solve the technical problem that the circuit board is easily affected by the temperature of the transmission track itself, resulting in the temperature at the bottom of the circuit board being inconsistent with the top, thereby affecting the quality of the welding point.

[0005] In order to solve the above technical problems, the present invention provides the following technical solutions: a microwave chip packaging device welding equipment, comprising a reflow soldering furnace main body, the reflow soldering furnace main body comprising a conveying mechanism, the conveying mechanism comprising a conveyor belt, fixed side plates are symmetrically arranged on both sides of the conveyor belt, and multiple groups of device carriers arranged in an array are arranged on the conveyor belt; wherein the side walls of the fixed side plates are arranged with a forward guide plate and a reverse guide plate; each group of the device carriers is composed of a front rack and a rear rack; the front rack comprises a base frame connected to the top surface of the conveyor belt, the top of the base frame is connected with a cover plate, a transmission component 1 is arranged inside the base frame, and the top of the cover plate is movably connected with a device connected to the transmission component 1 A movable lifting and positioning frame, wherein a plurality of clamping assemblies are arranged on the top of the lifting and positioning frame; a plurality of device placement plates are arranged on one side wall of the lifting and positioning frame, and a plurality of slots arranged on the sides of the device placement plates are opened from top to bottom on the lifting and positioning frame; the clamping assemblies are arranged above the slots; a plurality of plug plates corresponding to the slots are connected to the top surface of the cover plate, and the plug plates are used to control the clamping action of the clamping assemblies through the extension and lowering movement of the lifting and positioning frame; the forward guide plate is used to drive the transmission assembly to perform an ascending operation on the lifting and positioning frame, and the reverse guide plate is used to drive the transmission assembly to perform a descending operation on the lifting and positioning frame.

[0006] Preferably, the positive guide plate is arranged at the lower end of the side wall of the fixed side plate, and the reverse guide plate is arranged on the side of the positive guide plate; the top surface of the positive guide plate is staggered with an outer rack 1 and an inner rack 1; the bottom surface of the reverse guide plate is staggered with an outer rack 2 and an inner rack 2.

[0007] Preferably, the inner bottom surface of the base frame is connected to multiple fixed frames; the transmission component 1 includes a rotating rod rotatably arranged between the multiple fixed frames, and both ends of the rotating rod respectively penetrate the side walls of the base frame and are connected to gear 1; two worms are arranged on the circumferential outer wall of the rotating rod; the inner bottom surface of the base frame is rotatably connected to two worm wheels, and the worms are meshingly connected to the worm wheels.

[0008] Preferably, a rotating drum is coaxially connected above the worm gear, and an arc-shaped groove is provided on the side wall of the rotating drum; a plurality of supporting drums are connected to the top surface of the cover plate, and the rotating drum is movably arranged in the inner cavity of the supporting drum, and a plurality of sliding protrusions are arranged on the circumferential inner wall of the supporting drum; a lifting column is movably arranged in the inner cavity of the rotating drum, and a sliding column is connected to the circumferential outer wall of the lifting column, and the sliding column is movably arranged in the arc-shaped groove; a plurality of sliding grooves matching the shape of the sliding protrusions are provided on the circumferential outer wall of the lifting column, and the lifting column slides in cooperation with the inner cavity of the supporting drum through the sliding grooves.

[0009] Preferably, the rear frame is arranged with the same structural components as the front frame; wherein, the rear frame includes a lifting and positioning frame 2 and a transmission component 2; the lifting and positioning frame 2 and the lifting and positioning frame 1 are mutually symmetrical structural components; the transmission component 2 includes a gear 2 arranged with the same structural components as the gear 1, and the rotation direction of the gear 2 and the gear 1 are staggered.

[0010] Preferably, the outer rack 1 is used to mesh with the bottom of the gear 1, driving the gear 1 to rotate forward, and the inner rack 1 is used to mesh with the bottom of the gear 2, driving the gear 2 to rotate forward; the outer rack 2 is used to mesh with the top of the gear 1, driving the gear 1 to rotate reversely, and the inner rack 2 is used to mesh with the top of the gear 2, driving the gear 2 to rotate reversely.

[0011] Preferably, the bottom surface of the lifting and positioning frame 1 is connected to the top surface of the lifting column; every two device placement plates form a group, and the lifting and positioning frame 1 and the lifting and positioning frame 2 cooperate with each other, and the circuit board body is supported by the top of the two groups of mutually symmetrical device placement plates, and the two groups of mutually symmetrical device placement plates position the four corners of the circuit board body, and the side walls of the device placement plates are set as curved panel structures.

[0012] Preferably, the clamping assembly includes a clamping plate rotatably arranged on the inner side wall of the slot and two arc columns connected to the top surface of the lifting and positioning frame, the two arc columns are symmetrically distributed on both sides of the clamping plate, a sliding cylinder is slidably sleeved on the arc column, the sliding cylinders on the two arc columns are connected by a connecting rod, the connecting rod is connected to the side wall of the clamping plate, the arc column is also sleeved with an arc spring, and the arc spring is arranged between the sliding cylinder and the lifting and positioning frame.

[0013] Preferably, the top of the plug plate is rotatably connected to a rotating cylinder, the rotating cylinder is arranged below the clamping plate, and the side wall of the clamping plate is configured as an arc surface structure.

[0014] Compared with the prior art, the present invention has the following beneficial effects:

[0015] 1. The present invention designs a carrier frame with lifting and clamping functions, so that when the circuit board body follows the carrier frame into the reflow soldering furnace body for soldering, the circuit board body can be clamped and fixed by the clamping assembly of the carrier frame, ensuring that the position of the circuit board body inside the reflow soldering furnace body is relatively stable, avoiding position displacement of the circuit board body and causing uneven heating, which affects the quality of the soldering points. At the same time, the circuit board body can be lifted by the carrier frame to above the conveyor belt inside the reflow soldering furnace body, so that the circuit board body is away from the conveyor belt, avoiding the circuit board body being easily affected by the conveyor belt and causing the temperature at the bottom of the circuit board body to be inconsistent with the top, causing uneven melting of the solder, thereby affecting the quality of the soldering points. At the same time, the circuit board body above the conveyor belt can ensure that it is heated evenly at all angles, thereby improving the soldering quality.

[0016] 2. In the present invention, when gear one rotates forward, gear one drives the rotating rod to rotate, and the rotating rod drives the worm wheel to rotate through the worm, and the worm wheel drives the rotating drum to rotate in the supporting drum, and the arc groove of the rotating drum drives the sliding column to move upward, and further drives the lifting column to slide upward along the sliding protrusion of the supporting drum, thereby driving the lifting and positioning frame one to rise, so that the circuit board body on the top of the device placement plate rises, and the circuit board body moves away from the conveyor belt and enters the space above the conveyor belt. Since it is difficult for the worm wheel to drive the worm to rotate, the lifting column can maintain a stable state after rising, and it is difficult to rely on its own gravity to cause a situation of falling, thereby realizing the function of locking the state after rising, and further enabling the circuit board body after rising to maintain a relatively stable state, thereby improving the stability of welding.

[0017] 3. The present invention also arranges an outer rack 1 and an inner rack 1 on the top surface of the forward guide plate in a staggered manner, and arranges an outer rack 2 and an inner rack 2 on the bottom surface of the reverse guide plate in a staggered manner, and the rotation directions of the gear 2 and the gear 1 are staggered, so that after the device carrier enters the main body of the reflow soldering furnace, the gear 1 of the front rack and the gear 2 of the rear rack can be meshed and connected with the outer rack 1 and the inner rack 1 on the top surface of the forward guide plate respectively at the same time, and the outer rack 1 drives the gear 1 to rotate forwardly, and the inner rack 1 drives the gear 2 to rotate forwardly, so that the lifting and positioning frame 1 and the lifting and positioning frame 2 can rise at the same time, and the device is placed on the top of the electrical board. The main body of the circuit board is driven to rise and move away from the conveyor belt. After the welding operation is completed, the conveyor belt transports the device carrier to the output end of the reflow oven main body, so that the gear 1 of the front rack and the gear 2 of the rear rack are respectively meshed with the outer rack 2 and the inner rack 2 on the bottom surface of the reverse guide plate. The outer rack 2 drives the gear 1 to rotate in the opposite direction, and the inner rack 2 drives the gear 2 to rotate in the opposite direction, so that the lifting and positioning frame 1 and the lifting and positioning frame 2 can be lowered at the same time, and the carrier can automatically lift the circuit board main body in the process of being transported forward inside the reflow oven main body, making the entire welding process more convenient.

[0018] 4. The present invention designs a clamping assembly, and during the process of the lifting and positioning frame one and the lifting and positioning frame two rising, the plug plate can be gradually left from the slot, so that the bottom surface of the clamping plate loses the supporting effect of the plug plate, and the slide cylinder is subjected to the elastic force of the arc spring, so that the slide cylinder slides along the arc column, and further drives the clamping plate to rotate through the connecting rod, so that the clamping plate is gradually pressed down on the top surface of the circuit board body, and a clamping effect is formed on the four corners of the top surface of the circuit board body through the four clamping plates. When the lifting and positioning frame one and the lifting and positioning frame two are lowered, the plug plate can be gradually inserted into the slot, and the rotating cylinder on the top of the plug plate pushes the clamping plate to rotate and open, so that the four clamping plates lose the clamping effect on the circuit board body, which not only realizes the linkage function with the lifting and positioning frame one and the lifting and positioning frame two, but also enables the clamping assembly to automatically clamp or release, provides convenience for the welding process, and can ensure the stability and reliability of welding through the clamping effect formed at the four corners of the top surface of the circuit board body.

[0019] 5. The present invention positions the four corners of the circuit board body through two groups of mutually symmetrical device placement plates, so that the circuit board body can remain stable on the top surface of the device placement plate and is not prone to shaking or position displacement. In addition, by setting the side wall of the device placement plate as a curved plate-like structure, during the unloading process, when the device placement plate rotates with the conveyor belt, it can be separated from the circuit board body through the curved plate-like structure without scratching the circuit board body, thereby protecting the circuit board body. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0021] Figure 2 It is a schematic diagram of the top structure of the conveyor belt of the present invention;

[0022] Figure 3 It is a schematic diagram of the fixed side plate structure of the present invention;

[0023] Figure 4 It is a schematic diagram of the structure of the device carrier and the forward guide plate of the present invention;

[0024] Figure 5 It is a schematic diagram of the structure of the device carrier and the reverse guide plate of the present invention;

[0025] Figure 6 It is a schematic diagram of the structure of the top of the forward guide plate and the bottom of the reverse guide plate of the present invention;

[0026] Figure 7 It is a schematic diagram of the front rack structure of the present invention;

[0027] Figure 8 It is a structural schematic diagram of a lifting and positioning frame of the present invention;

[0028] Fig. 9It is a schematic diagram of the front rack split structure of the present invention;

[0029] Fig.10 It is an enlarged schematic diagram of the structure of a transmission component of the present invention;

[0030] Fig.11 It is an enlarged schematic diagram of a split structure of a transmission assembly of the present invention;

[0031] Fig.12 It is a schematic diagram of the bottom structure of the lifting column of the present invention;

[0032] Fig.13 It is a schematic diagram of the support tube and the plug plate structure of the present invention;

[0033] Fig.14 It is a schematic diagram of the structure of the clamping assembly of the present invention;

[0034] Fig.15 The figure is a schematic diagram of a usage state of the present invention.

[0035] Description of the numbers in the figure:

[0036] 1. Reflow oven body; 2. Conveying mechanism; 3. Conveying belt; 4. Fixed side plate; 5. Device carrier; 6. Front rack; 7. Rear rack; 8. Circuit board body;

[0037] 41. Forward guide plate; 42. Reverse guide plate;

[0038] 4101, external rack one; 4102, internal rack one; 4201, external rack two; 4202, internal rack two;

[0039] 61. base frame; 62. cover plate; 63. transmission component 1; 64. lifting and positioning frame 1; 65. clamping component; 66. plug plate;

[0040] 6101, fixed frame; 6201, support cylinder; 6202, sliding protrusion; 6301, rotating rod; 6302, gear 1; 6303, worm; 6304, worm wheel; 6305, rotating cylinder; 63051, arc groove; 6306, lifting column; 6307, sliding column; 6308, sliding groove; 6401, device placement plate; 6402, slot; 6501, clamping plate; 6502, arc column; 6503, sliding cylinder; 6504, connecting rod; 6505, arc spring; 6601, rotating cylinder;

[0041] 71. Lifting and positioning frame 2; 72. Transmission assembly 2; 7201. Gear 2. DETAILED DESCRIPTION

[0042] Embodiment 1, as Figures 1 to 15As shown, the present invention relates to a microwave chip packaging device welding equipment, including a reflow oven main body 1, the reflow oven main body 1 includes a conveying mechanism 2, the conveying mechanism 2 includes a conveyor belt 3, fixed side panels 4 are symmetrically arranged on both sides of the conveyor belt 3, the fixed side panels 4 are fixed to the top of the conveyor mechanism 2 by screws, and a plurality of array-arranged device carriers 5 are arranged on the conveyor belt 3, wherein the reflow oven main body 1 and the conveying mechanism 2 are both prior arts in the example.

[0043] In the embodiment of the present invention, the side wall of the fixed side plate 4 is arranged with a forward guide plate 41 and a reverse guide plate 42; each group of device carriers 5 is composed of a front frame 6 and a rear frame 7; the front frame 6 includes a base frame 61 connected to the top surface of the conveyor belt 3, the top of the base frame 61 is connected to a cover plate 62, a transmission component 63 is arranged inside the base frame 61, the top of the cover plate 62 is movably connected to a lifting and positioning frame 64 linked to the transmission component 63, and a plurality of clamping components 65 are arranged on the top of the lifting and positioning frame 64; the lifting and positioning The side wall of the frame 64 is provided with a plurality of device placement plates 6401, and the lifting and positioning frame 64 is provided with a plurality of slots 6402 arranged on the side of the device placement plates 6401 from top to bottom; the clamping assembly 65 is arranged above the slots 6402; the top surface of the cover plate 62 is connected with a plurality of plug-in plates 66 corresponding to the slots 6402, and the plug-in plates 66 are used to control the clamping action of the clamping assembly 65 through the extension and lowering movement of the lifting and positioning frame 64; the positive guide plate 41 is used to drive the transmission assembly 63 to the lifting and positioning frame The lifting and positioning frame 64 is lifted up, and the reverse guide plate 42 is used to drive the transmission component 63 to lower the lifting and positioning frame 64; the present invention designs a carrier frame 5 with a lifting function and a clamping and positioning function, so that when the circuit board body 8 follows the carrier frame 5 into the reflow soldering furnace body 1 for welding, the circuit board body 8 can be clamped and fixed by the clamping component 65 of the carrier frame 5, so as to ensure that the position of the circuit board body 8 inside the reflow soldering furnace body 1 is relatively stable, and avoid the circuit board body 8 from being offset and causing uneven heating, which affects the quality of the welding point. At the same time, the circuit board body 8 can be lifted by the carrier frame 5 to the top of the conveyor belt 3 inside the reflow soldering furnace body 1, so that the circuit board body 8 is away from the conveyor belt 3, and the circuit board body 8 is avoided from being easily affected by the conveyor belt 3, resulting in the temperature at the bottom of the circuit board body 8 being inconsistent with the top, causing the solder to melt unevenly, thereby affecting the quality of the welding point. At the same time, the circuit board body 8 above the conveyor belt 3 can ensure that it is heated evenly at all angles, thereby improving the welding quality.

[0044] As another embodiment of the present invention, a plurality of fixing frames 6101 are connected to the inner bottom surface of the base frame 61; a transmission assembly 63 includes a rotating rod 6301 rotatably arranged between the plurality of fixing frames 6101, and both ends of the rotating rod 6301 respectively penetrate the side wall of the base frame 61 and are connected to a gear 6302; two worms 6303 are arranged on the circumferential outer wall of the rotating rod 6301; two worm wheels 6304 are rotatably connected to the inner bottom surface of the base frame 61, and the worms 6303 are meshed with the worm wheels 6304; the worm wheels 6304 are arranged on the outer wall of the worm wheels 6304; The cover plate 62 is coaxially connected with a rotating cylinder 6305, and a side wall of the rotating cylinder 6305 is provided with an arc groove 63051. The top surface of the cover plate 62 is connected with a plurality of supporting cylinders 6201. The rotating cylinder 6305 is movably arranged in the inner cavity of the supporting cylinder 6201. A plurality of sliding protrusions 6202 are arranged on the inner circumferential wall of the supporting cylinder 6201. A lifting column 6306 is movably arranged in the inner cavity of the rotating cylinder 6305. A sliding column 6307 is connected to the outer circumferential wall of the lifting column 6306. The sliding column 6307 is movably arranged in the arc groove 63051. The lifting column 630 The outer wall of the circle is provided with a plurality of sliding grooves 6308 matching the shape of the sliding protrusion 6202, and the lifting column 6306 slides with the inner cavity of the support cylinder 6201 through the sliding grooves 6308; when the gear 1 6302 rotates forward, the gear 1 6302 drives the rotating rod 6301 to rotate, the rotating rod 6301 drives the worm wheel 6304 to rotate through the worm 6303, and the worm wheel 6304 drives the rotating cylinder 6305 to rotate in the support cylinder 6201, and the arc groove 63051 of the rotating cylinder 6305 It drives the sliding column 6307 to move upward, and further drives the lifting column 6306 to slide upward along the sliding protrusion 6202 of the support tube 6201. Since the worm wheel 6304 is difficult to drive the worm 6303 to rotate, the lifting column 6306 can maintain a stable state after rising, and it is difficult to rely on its own gravity to cause a situation of falling, thereby realizing the function of locking the state after rising; when the gear 1 6302 rotates in the opposite direction, it drives the lifting column 6306 to slide downward along the sliding protrusion 6202 of the support tube 6201.

[0045] As another embodiment of the present invention, the rear frame 7 is arranged with the same structural components as the front frame 6; wherein the rear frame 7 includes a lifting and positioning frame 2 71 and a transmission component 2 72; the lifting and positioning frame 2 71 and the lifting and positioning frame 1 64 are mutually symmetrical structural components; the transmission component 2 72 includes a gear 2 7201 arranged with the same structural components as the gear 1 6302, and the rotation direction of the gear 2 7201 and the gear 1 6302 are staggered; the forward guide plate 41 is arranged at the bottom end of the side wall of the fixed side plate 4, and the reverse guide plate 42 is arranged on the upper side of the forward guide plate 41; the top surface of the forward guide plate 41 is staggered with an outer rack 1 4101 and an inner rack 1 4102; the bottom surface of the reverse guide plate 42 is staggered An outer rack 4201 and an inner rack 4202 are arranged in the positive direction, the outer rack 4101 is used to mesh with the bottom of the gear 6302 to drive the gear 6302 to rotate forward, and the inner rack 4102 is used to mesh with the bottom of the gear 7201 to drive the gear 7201 to rotate forward; the outer rack 4201 is used to mesh with the top of the gear 6302 to drive the gear 6302 to rotate reversely, and the inner rack 4202 is used to mesh with the top of the gear 7201 to drive the gear 7201 to rotate reversely; the present invention also arranges the outer rack 4101 and the inner rack 4102 on the top surface of the positive guide plate 41, and arranges them on the bottom surface of the reverse guide plate 42 There are outer rack 2 4201 and inner rack 2 4202, and gear 2 7201 and gear 1 6302 are arranged in a staggered rotation direction, so that after the device carrier 5 enters the interior of the reflow oven body 1, gear 1 6302 of the front rack 6 and gear 2 7201 of the rear rack 7 can be respectively meshed with the outer rack 1 4101 and the inner rack 1 4102 on the top surface of the forward guide plate 41 at the same time, and the outer rack 1 4101 drives gear 1 6302 to rotate forwardly, and the inner rack 1 4102 drives gear 2 7201 to rotate forwardly, so that the lifting and positioning frame 1 64 and the lifting and positioning frame 2 71 can rise at the same time, driving the circuit board body 8 on the top of the device placement plate 6401 to rise and away from the conveying Belt 3, after completing the welding operation, the conveyor belt 3 conveys the device carrier 5 to the output end of the reflow oven main body 1, so that the gear 1 6302 of the front frame 6 and the gear 2 7201 of the rear frame 7 are respectively meshed with the outer rack 2 4201 and the inner rack 2 4202 on the bottom surface of the reverse guide plate 42, and the outer rack 2 4201 drives the gear 1 6302 to rotate in the opposite direction, and the inner rack 2 4202 drives the gear 2 7201 to rotate in the opposite direction, so that the lifting and positioning frame 1 64 and the lifting and positioning frame 2 71 can be lowered at the same time, so that the carrier 5 can automatically lift the circuit board main body 8 in the process of being conveyed forward inside the reflow oven main body 1, so that the whole welding process is more convenient.

[0046] As another embodiment of the present invention, the bottom surface of the lifting and positioning frame 64 is connected to the top surface of the lifting column 6306; every two device placement plates 6401 form a group, and the lifting and positioning frame 64 and the lifting and positioning frame 2 71 cooperate with each other, and the circuit board body 8 is supported by the top of the two groups of mutually symmetrical device placement plates 6401, and the two groups of mutually symmetrical device placement plates 6401 position the four corners of the circuit board body 8, and the side walls of the device placement plates 6401 are set as a curved plate-like structure. The present invention positions the four corners of the circuit board body 8 by two groups of mutually symmetrical device placement plates 6401, so that the circuit board body 8 can remain stable on the top surface of the device placement plates 6401, and is not prone to shaking or position displacement, and by setting the side walls of the device placement plates 6401 as a curved plate-like structure, during the unloading process, when the device placement plates 6401 rotate with the conveyor belt 3, they can be separated from the circuit board body 8 through the curved plate-like structure without scratching the circuit board body 8, thereby protecting the circuit board body 8.

[0047] As another embodiment of the present invention, the clamping assembly 65 includes a clamping plate 6501 rotatably arranged on the inner side wall of the slot 6402, and two arc columns 6502 connected to the top surface of the lifting and positioning frame 64, the two arc columns 6502 are symmetrically distributed on both sides of the clamping plate 6501, and a slide cylinder 6503 is slidably sleeved on the arc column 6502. The slide cylinders 6503 on the two arc columns 6502 are connected by a connecting rod 6504, and the connecting rod 6504 is connected to the side wall of the clamping plate 6501. The arc column 6502 is also sleeved with a The arc spring 6505 is arranged between the slide cylinder 6503 and the lifting and positioning frame 1 64. The top of the plug plate 66 is rotatably connected to the rotating cylinder 6601, and the rotating cylinder 6601 is arranged below the clamping plate 6501. The side wall of the clamping plate 6501 is set as an arc surface structure. The arc surface structure is used to prevent the clamping plate 6501 from scratching the circuit board body 8. The present invention can make the plug plate 66 rotate in the process of the lifting and positioning frame 1 64 and the lifting and positioning frame 2 71 rising. 66 gradually leaves the slot 6402, so that the bottom surface of the clamping plate 6501 loses the support of the insert plate 66, and the slide cylinder 6503 is acted upon by the elastic force of the arc spring 6505, so that the slide cylinder 6503 slides along the arc column 6502, and further drives the clamping plate 6501 to rotate through the connecting rod 6504, so that the clamping plate 6501 is gradually pressed down on the top surface of the circuit board body 8, and the four clamping plates 6501 form a clamping effect on the four corners of the top surface of the circuit board body 8. When the lifting and positioning frame 1 64 and the lifting and positioning frame 2 71 are lowered, the clamping plate 6501 is clamped. When descending, the plug plate 66 can be gradually inserted into the slot 6402, and the rotating cylinder 6601 on the top of the plug plate 66 pushes the clamping plate 6501 to rotate and open, so that the four clamping plates 6501 lose the clamping effect on the circuit board body 8, which not only realizes the linkage function with the lifting and positioning frame 1 64 and the lifting and positioning frame 2 71, but also enables the clamping assembly 65 to automatically clamp or release, providing convenience for the welding process, and can ensure the stability and reliability of welding through the clamping effect formed at the four corners of the top surface of the circuit board body 8.

[0048] Embodiment 2: This embodiment provides a method for using a microwave chip packaging device welding device, comprising the following steps:

[0049] S1, loading operation, placing the circuit board body 8 with microwave chip packaging devices pre-arranged on the top surface on the top of two groups of mutually symmetrical device placement plates 6401 of the device carrier 5 on the conveying end of the conveying mechanism 2, and conveying the device carrier 5 to the inside of the reflow oven body 1 through the conveyor belt 3;

[0050] S2, rising operation, after the device carrier 5 enters the reflow oven body 1, the gear 1 6302 of the front rack 6 and the gear 2 7201 of the rear rack 7 are respectively meshed with the outer rack 1 4101 and the inner rack 1 4102 on the top surface of the forward guide plate 41. As the device carrier 5 continues to move forward, the outer rack 1 4101 drives the gear 1 6302 to rotate forward, the gear 1 6302 drives the rotating rod 6301 to rotate, the rotating rod 6301 drives the worm wheel 6304 to rotate through the worm 6303, the worm wheel 6304 drives the rotating cylinder 6305 to rotate in the supporting cylinder 6201, the arc groove 63051 of the rotating cylinder 6305 drives the sliding column 6307 to move upward, and further drives the lifting column 6 306 slides upward along the sliding protrusion 6202 of the support cylinder 6201, thereby driving the lifting and positioning frame 1 64 to rise. Similarly, the inner rack 1 4102 drives the lifting and positioning frame 2 71 to rise simultaneously with the lifting and positioning frame 1 64 through the gear 2 7201, so that the circuit board body 8 on the top of the device placement plate 6401 rises, and the circuit board body 8 moves away from the conveyor belt 3 and enters the space above the conveyor belt 3. The circuit board body 8 is heated by the reflow oven body 1 to melt the solder paste on the circuit board body 8. Under the action of surface tension, the solder will wrap the solder joint position of the microwave chip packaging device and the circuit board body 8. Finally, in the cooling zone of the reflow oven body 1, the solder is quickly cooled and solidified to complete the welding process.

[0051] S3, clamping operation, during the rising operation, as the lifting and positioning frame 1 64 and the lifting and positioning frame 2 71 rise, the plug plate 66 will gradually leave the slot 6402, so that the bottom surface of the clamping plate 6501 loses the support of the plug plate 66, and the slide cylinder 6503 is subjected to the elastic force of the arc spring 6505, so that the slide cylinder 6503 slides along the arc column 6502, and further drives the clamping plate 6501 to rotate through the connecting rod 6504, so that the clamping plate 6501 is gradually pressed down on the top surface of the circuit board body 8, and the four clamping plates 6501 form a clamping effect on the four corners of the top surface of the circuit board body 8;

[0052] S4, unloading operation, after completing the welding operation, the conveyor belt 3 conveys the device carrier 5 to the output end of the reflow oven main body 1, so that the gear 1 6302 of the front rack 6 and the gear 2 7201 of the rear rack 7 are respectively meshed and connected with the outer rack 2 4201 and the inner rack 2 4202 on the bottom surface of the reverse guide plate 42 at the same time. As the device carrier 5 continues to move forward, the outer rack 2 4201 drives the gear 1 6302 to rotate in the opposite direction, and the reversely rotating gear 1 6302 causes the lifting and positioning frame 1 64 to descend. Similarly, the inner rack 2 4202 simultaneously drives the gear 2 7201 to rotate in the opposite direction, so that the lifting and positioning frame 2 71 follows the lifting and positioning frame 1 64 to descend at the same time, further making the plug plate 66 gradually inserted into the slot 6402, and the rotating cylinder 6601 on the top of the plug plate 66 pushes the clamping plate 6501 to rotate and open, so that the four clamping plates 6501 lose the clamping effect on the circuit board main body 8, and finally the circuit board main body 8 can be removed at the output end of the reflow oven main body 1.

[0053] The embodiments of the present invention disclose preferred embodiments, but are not limited thereto. A person skilled in the art can easily understand the spirit of the present invention based on the above embodiments and make different extensions and changes. However, as long as they do not deviate from the spirit of the present invention, they are all within the protection scope of the present invention.

Claims

1. A microwave chip packaging device welding device, comprising a reflow oven main body (1), the reflow oven main body (1) comprising a conveying mechanism (2), the conveying mechanism (2) comprising a conveying belt (3), characterized in that: Fixed side plates (4) are symmetrically arranged on both sides of the conveyor belt (3), and multiple groups of device carriers (5) arranged in an array are arranged on the conveyor belt (3); Wherein, the side wall of the fixed side plate (4) is arranged with a positive guide plate (41) and a reverse guide plate (42); Each group of device carriers (5) is composed of a front frame (6) and a rear frame (7); The front frame (6) comprises a base frame (61) connected to the top surface of the conveyor belt (3), the top of the base frame (61) is connected to a cover plate (62), a transmission component (63) is arranged inside the base frame (61), the top of the cover plate (62) is movably connected to a lifting and positioning frame (64) linked to the transmission component (63), and a plurality of clamping components (65) are arranged on the top of the lifting and positioning frame (64); The side wall of the lifting and positioning frame (64) is provided with a plurality of device placement plates (6401), and the lifting and positioning frame (64) is provided with a plurality of slots (6402) arranged on the sides of the device placement plates (6401) from top to bottom; The clamping assembly (65) is arranged above the slot (6402); The top surface of the cover plate (62) is connected to a plurality of plug plates (66) corresponding to the slots (6402), and the plug plates (66) are used to control the clamping action of the clamping assembly (65) through the extension and lowering movement of the lifting and positioning frame (64); The forward guide plate (41) is used to drive the transmission component 1 (63) to perform an ascending operation on the lifting and positioning frame 1 (64), and the reverse guide plate (42) is used to drive the transmission component 1 (63) to perform a descending operation on the lifting and positioning frame 1 (64).

2. A microwave chip packaging device welding equipment according to claim 1, characterized in that: The forward guide plate (41) is arranged at the bottom end of the side wall of the fixed side plate (4), and the reverse guide plate (42) is arranged on the upper side of the forward guide plate (41); The top surface of the forward guide plate (41) is staggeredly arranged with an outer rack 1 (4101) and an inner rack 1 (4102); The bottom surface of the reverse guide plate (42) is staggeredly arranged with an outer rack second (4201) and an inner rack second (4202).

3. A microwave chip packaging device welding equipment according to claim 2, characterized in that: The inner bottom surface of the base frame (61) is connected to a plurality of fixing frames (6101); The transmission assembly 1 (63) comprises a rotating rod (6301) rotatably arranged between the plurality of fixed frames (6101), and both ends of the rotating rod (6301) respectively penetrate the side walls of the base frame (61) and are connected to a gear 1 (6302); Two worms (6303) are arranged on the circumferential outer wall of the rotating rod (6301); The inner bottom surface of the base frame (61) is rotatably connected to two worm wheels (6304), and the worm (6303) is meshingly connected to the worm wheels (6304).

4. A microwave chip packaging device welding equipment according to claim 3, characterized in that: A rotating drum (6305) is coaxially connected above the worm wheel (6304), and an arc-shaped groove (63051) is formed on the side wall of the rotating drum (6305); The top surface of the cover plate (62) is connected to a plurality of support cylinders (6201), the rotating cylinder (6305) is movably arranged in the inner cavity of the support cylinder (6201), and a plurality of sliding protrusions (6202) are arranged on the circumferential inner wall of the support cylinder (6201); A lifting column (6306) is movably arranged in the inner cavity of the rotating drum (6305), and a sliding column (6307) is connected to the circumferential outer wall of the lifting column (6306), and the sliding column (6307) is movably arranged in the arc-shaped groove (63051); The outer circumferential wall of the lifting column (6306) is provided with a plurality of sliding grooves (6308) matching the shape of the sliding protrusion (6202), and the lifting column (6306) is slidably matched with the inner cavity of the support tube (6201) through the sliding grooves (6308).

5. A microwave chip packaging device welding equipment according to claim 4, characterized in that: The rear rack (7) is provided with the same structural components as the front rack (6); Wherein, the rear frame (7) comprises a lifting and positioning frame 2 (71) and a transmission assembly 2 (72); The second lifting and positioning frame (71) and the first lifting and positioning frame (64) are symmetrical structural components; The transmission component 2 (72) includes a gear 2 (7201) having the same structural components as the gear 1 (6302), and the gear 2 (7201) and the gear 1 (6302) are arranged in a staggered rotation direction.

6. A microwave chip packaging device welding equipment according to claim 5, characterized in that: The outer rack one (4101) is used to mesh with the bottom of the gear one (6302) to drive the gear one (6302) to rotate in the forward direction, and the inner rack one (4102) is used to mesh with the bottom of the gear two (7201) to drive the gear two (7201) to rotate in the forward direction; the outer rack two (4201) is used to mesh with the top of the gear one (6302) to drive the gear one (6302) to rotate in the reverse direction, and the inner rack two (4202) is used to mesh with the top of the gear two (7201) to drive the gear two (7201) to rotate in the reverse direction.

7. A microwave chip packaging device welding equipment according to claim 6, characterized in that: The bottom surface of the lifting and positioning frame (64) is connected to the top surface of the lifting column (6306); Every two device placement plates (6401) form a group, and the lifting and positioning frame one (64) cooperates with the lifting and positioning frame two (71) to support the circuit board body (8) through the top of the two groups of mutually symmetrical device placement plates (6401). The two groups of mutually symmetrical device placement plates (6401) position the four corners of the circuit board body (8), and the side walls of the device placement plates (6401) are arranged as a curved panel structure.

8. The microwave chip packaging device welding equipment according to claim 7, characterized in that: The clamping assembly (65) includes a clamping plate (6501) rotatably arranged on the inner wall of the slot (6402) and two arc columns (6502) connected to the top surface of the lifting and positioning frame (64), the two arc columns (6502) are symmetrically distributed on both sides of the clamping plate (6501), a slide cylinder (6503) is slidably sleeved on the arc column (6502), the slide cylinders (6503) on the two arc columns (6502) are connected by a connecting rod (6504), and the connecting rod (6504) is connected to the side wall of the clamping plate (6501), and an arc spring (6505) is also sleeved on the arc column (6502), and the arc spring (6505) is arranged between the slide cylinder (6503) and the lifting and positioning frame (64).

9. A microwave chip packaging device welding equipment according to claim 8, characterized in that: The top of the plug plate (66) is rotatably connected to a rotating cylinder (6601), and the rotating cylinder (6601) is arranged below the clamping plate (6501). The side wall of the clamping plate (6501) is configured as an arc surface structure.

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