Ambient temperature detection system and electronic equipment

Abstract

The invention provides an environment temperature detection system and electronic equipment, the environment temperature detection system comprises an environment temperature detection module and a processor, the environment temperature detection module comprises a first temperature sensor, a second temperature sensor and a heat conduction element clamped between the first temperature sensor and the second temperature sensor, the processor is connected with the first temperature sensor and the second temperature sensor. The environment temperature detection module is used for being arranged in the electronic equipment. The first temperature sensor is used for collecting first temperature, and the second temperature sensor is used for collecting second temperature; the processor is used for obtaining the first temperature and the second temperature and determining the environment temperature according to the first temperature and the second temperature. In the application, the heat conduction element can transmit the heat at one temperature sensor to the environment through the other temperature sensor, the electronic equipment determines the environment temperature based on the temperatures collected by the two temperature sensors, and compared with the prior art, the detection accuracy of the environment temperature can be improved.

Description

Technical Field

[0001] The embodiments of the present application relate to the technical field of electronic equipment, and in particular to an ambient temperature detection system and an electronic equipment. Background Art

[0002] As user demands increase, electronic devices need to detect the ambient temperature of the environment in which the electronic devices are located. Currently, a temperature sensor can be set on the housing inside the electronic device, and the temperature sensor is used to detect the ambient temperature. However, in this method, the temperature sensor is easily affected by the internal temperature of the electronic device and the temperature of the human body, and there is a problem of low accuracy in detecting the ambient temperature. Summary of the invention

[0003] The embodiments of the present application provide an ambient temperature detection system and an electronic device to improve the detection accuracy of ambient temperature.

[0004] In a first aspect, an embodiment of the present application provides an ambient temperature detection system, which may include an ambient temperature detection module and a processor. The ambient temperature detection module is used to be arranged inside an electronic device, the ambient temperature detection module may include a first temperature sensor, a second temperature sensor, and a heat conductive element sandwiched between the first temperature sensor and the second temperature sensor, and the processor is connected to the first temperature sensor and the second temperature sensor respectively.

[0005] The first temperature sensor is used to collect a first temperature, and the second temperature sensor is used to collect a second temperature. The processor is used to obtain the first temperature and the second temperature, and determine the ambient temperature according to the first temperature and the second temperature.

[0006] In an embodiment of the present application, an ambient temperature detection module is disposed inside an electronic device. The ambient temperature detection module is composed of two temperature sensors sandwiching a heat conductive element. The heat conductive element can transfer heat from one temperature sensor to the environment through another temperature sensor. Compared with the prior art solution of using a sensor inside an electronic device to detect ambient temperature, the accuracy of ambient temperature detection can be improved.

[0007] In a possible implementation, the processor is further configured to, after determining that a difference between the first temperature and the second temperature is less than or equal to a first threshold, execute a step of determining the ambient temperature based on the first temperature and the second temperature.

[0008] When the difference between the first temperature and the second temperature is less than or equal to the first threshold, it indicates that the electronic device is in thermal equilibrium. When the electronic device is in thermal equilibrium, the temperature difference between the second temperature collected by the second temperature sensor and the first temperature collected by the first temperature sensor is small, the amount of heat transferred by the thermal conductive element is small, and the thermal conductive element has time to completely transfer the heat to the first temperature sensor, and the heat will not diffuse in other directions, which can further improve the accuracy of the ambient temperature.

[0009] The following describes a method in which the processor determines the ambient temperature based on the first temperature and the second temperature:

[0010] First, the processor is specifically used to determine the ambient temperature based on the first temperature, the second temperature, the thermal resistance per unit area of ​​the heat-conducting element, the convection heat transfer coefficient of the shell of the electronic device, and the radiation coefficient of the shell.

[0011] In a possible implementation, the processor is specifically configured to determine the ambient temperature according to Formula 1:

[0012] εσT amb 4 +hT amb =εσT1 4 +hT1-(T2-T1) / R Formula 1

[0013] Wherein, T1 represents the first temperature, T2 represents the second temperature, T amb represents the ambient temperature, R represents the thermal resistance per unit area of ​​the heat-conducting element, h represents the convection heat transfer coefficient of the shell, ε represents the radiation coefficient of the shell, and σ represents the Steiner constant.

[0014] In this example, because the heat transfer on the same path is equal, for example, the heat conducting element can transfer almost all the heat of the second temperature sensor to the first temperature sensor, and less heat diffuses to the surroundings, and when the shell transfers heat from the first temperature sensor to the environment, because the first temperature sensor can be set close to the shell, the shell can transfer almost all the heat to the environment, and less heat diffuses to the surroundings, so it can be regarded as equal heat transfer on the same path. In the embodiment of the present application, based on the equality of the first heat flux and the second heat flux, the calculated ambient temperature has a higher accuracy than the ambient temperature obtained in the prior art.

[0015] Secondly, in some embodiments, a temperature mapping relationship may be preset in the electronic device, where the temperature mapping relationship is used to represent the temperature collected by the first temperature sensor and the temperature collected by the second sensor under different ambient temperatures.

[0016] In this example, the processor is specifically configured to: determine the ambient temperature according to the first temperature, the second temperature, and the temperature mapping relationship. Exemplarily, the processor may search for the ambient temperature mapped by the first temperature and the second temperature in the temperature mapping relationship, and use the ambient temperature as the final ambient temperature.

[0017] In a possible implementation, the ambient temperature detection system includes at least two ambient temperature detection modules, wherein the processor is further configured to determine the ambient temperature according to the first temperature and the second temperature collected by the at least two ambient temperature detection modules.

[0018] Exemplarily, the processor can determine the ambient temperature corresponding to each ambient temperature detection module according to the method in "one" or "two" above, according to the first temperature and the second temperature collected by each ambient temperature detection module, and the processor can determine the final ambient temperature according to the ambient temperature corresponding to each ambient temperature detection module. Exemplarily, for example, the processor can use the mean or weighted value of the ambient temperature corresponding to each ambient temperature detection module as the final ambient temperature.

[0019] In a possible implementation, the distance between at least two of the ambient temperature detection modules is greater than or equal to a second threshold. The purpose of such a setting is that heat will not be transferred to each other between at least two of the ambient temperature detection modules to avoid affecting the detection of the ambient temperature.

[0020] In a possible implementation, in order to prevent heat between the first temperature sensor and the second temperature sensor from being transferred to the surroundings and to ensure that the heat can be completely transferred through the heat conducting element, so as to improve the calculation accuracy of the first heat flux and to improve the accuracy of the ambient temperature, this can be achieved by setting a heat conducting element in an embodiment of the present application.

[0021] In some embodiments, the thermal resistance per unit area of ​​the thermal conductive element is 0.005-0.01 m 2 ·K / W.

[0022] In some embodiments, the thickness of the heat conducting element is 2-5 mm. In this way, the thickness of the heat conducting element is not too thick, and the heat between the first temperature sensor and the second temperature sensor can be completely transferred.

[0023] In some embodiments, the first surface of the thermal conductive element contacts the first temperature sensor, the second surface of the thermal conductive element contacts the second temperature sensor, the contact area between the first temperature sensor and the first surface is smaller than the area of ​​the first surface, and the contact area between the second temperature sensor and the second surface is smaller than the area of ​​the second surface. Such a design can also ensure that the heat between the first temperature sensor and the second temperature sensor is completely transferred through the thermal conductive element, avoiding heat transfer to the surroundings, thus ensuring the accuracy of the first heat flux, and then ensuring the accuracy of the ambient temperature.

[0024] In a second aspect, an embodiment of the present application provides an electronic device, the electronic device comprising a housing and an ambient temperature detection system as described in the first aspect and any implementation manner. The ambient temperature detection system may be located within a space enclosed by the housing. In other words, the space enclosed by the housing may be regarded as the interior of the electronic device, wherein the ambient temperature detection system may be located within the electronic device.

[0025] In a possible implementation, the ambient temperature detection module is arranged close to the inner wall of the housing. The purpose of such arrangement is to facilitate the first temperature sensor to contact the housing more directly and to be away from interference from the human body, clothes, etc. The first temperature sensor is arranged close to the inner wall of the housing, and the first temperature sensor can exchange heat with the environment directly through the housing without passing through the air, so that the housing can transfer all the heat from the first temperature sensor to the environment.

[0026] In a possible implementation, the electronic device is a wearable device, the housing includes an upper housing, a lower housing, and a side wall, the ambient temperature detection module is in close contact with the upper housing or the side wall, the lower housing is a housing that is in close contact with the human body when the wearable device is in a worn state, and the upper housing is a housing that is away from the human body when the wearable device is in a worn state. The purpose of such a setting is to facilitate the first temperature sensor to be away from interference from the human body, clothes, etc.

[0027] In a possible implementation, the ambient temperature detection module is also used to be set near a first position inside the electronic device, and the temperature change at the first position is less than or equal to a first threshold. Exemplarily, when the electronic device is a wearable device, the first position is any of the following positions: a battery or a metal element. In the ambient temperature detection module, the first temperature sensor is used to be set close to the housing, and the second temperature sensor is used to be set close to the first position.

[0028] In an embodiment of the present application, a temperature sensor is set at a first position, and the temperature change at the first position is less than or equal to a first threshold value, indicating that the first position is a stable heat source. A stable heat source is conducive to the electronic device to quickly reach a thermal equilibrium state, thereby ensuring the accuracy of ambient temperature detection.

[0029] In a third aspect, an embodiment of the present application provides an ambient temperature detection module, which includes a first temperature sensor, a second temperature sensor, and a heat conducting element sandwiched between the first temperature sensor and the second temperature sensor. The first temperature sensor is used to collect a first temperature, and the second temperature sensor is used to collect a second temperature.

[0030] The environment temperature detection module is used to be arranged inside the electronic device, and the first temperature and the second temperature are used to determine the environment temperature of the electronic device. It should be understood that the specific process of using the first temperature and the second temperature to determine the environment temperature of the electronic device can refer to the description in the first aspect.

[0031] In a possible implementation, the thermal resistance per unit area of ​​the heat conducting element is 0.005-0.01 m2·K / W.

[0032] In a possible implementation, the thickness of the heat conducting element is 2-5 mm.

[0033] In a possible implementation, the first surface of the heat conductive element contacts the first temperature sensor, the second surface of the heat conductive element contacts the second temperature sensor, the contact area between the first temperature sensor and the first surface is smaller than the area of ​​the first surface, and the contact area between the second temperature sensor and the second surface is smaller than the area of ​​the second surface.

[0034] In a fourth aspect, an embodiment of the present application provides a computer program product comprising instructions, which, when executed on a computer, enables the computer to execute the steps executed by the processor in the first aspect above.

[0035] In a fifth aspect, an embodiment of the present application provides a computer-readable storage medium, wherein instructions are stored in the computer-readable storage medium, and when the computer-readable storage medium is run on a computer, the computer executes the steps executed by the processor in the first aspect above.

[0036] The beneficial effects of the possible implementation methods of the third to fifth aspects mentioned above can be referred to the beneficial effects brought about by the first and second aspects mentioned above, and will not be elaborated here. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] Figure 1 A schematic diagram of a structure of an electronic device;

[0038] Figure 2 is another structural schematic diagram of an electronic device;

[0039] Figure 3 is another structural schematic diagram of an electronic device;

[0040] Figure 4 A schematic diagram of the structure of an electronic device provided in an embodiment of the present application;

[0041] Figure 5A Another structural schematic diagram of an electronic device provided in an embodiment of the present application;

[0042] Figure 5B Another structural schematic diagram of an electronic device provided in an embodiment of the present application;

[0043] Figure 5C Another structural schematic diagram of an electronic device provided in an embodiment of the present application;

[0044] Figure 6 A schematic diagram of heat transfer in an electronic device provided in an embodiment of the present application;

[0045] Fig. 7A A schematic diagram of heat transfer under non-thermal equilibrium provided in an embodiment of the present application;

[0046] Figure 7B A schematic diagram of heat transfer under thermal equilibrium provided in an embodiment of the present application;

[0047] Fig. 8A A schematic diagram of the location of the ambient temperature detection module provided in an electronic device according to an embodiment of the present application;

[0048] Figure 8B Another schematic diagram of the location of the ambient temperature detection module provided in the embodiment of the present application in the electronic device;

[0049] Fig. 9 A schematic diagram of heat transfer when the ambient temperature detection module provided in an embodiment of the present application is placed close to an unstable heat source;

[0050] Fig. 10A A schematic diagram of the structure of the ambient temperature detection module provided in the embodiment of the present application;

[0051] Fig. 10B for Fig. 10A Schematic diagram of the left view and the right view;

[0052] Fig.11 Another structural schematic diagram of an electronic device provided in an embodiment of the present application;

[0053] Fig.12Another schematic diagram of the structure of an electronic device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0054] For ease of understanding, the following first introduces the relevant terms and concepts involved in the embodiments of the present application:

[0055] Thermal power consumption: used to reflect the heat released by electronic components during operation.

[0056] Heat flow: The amount of heat transferred through an object by conduction, convection, radiation, etc. per unit time when there is a temperature difference between the two sides of the object. The heat flow through the object is proportional to the temperature difference between the two sides, inversely proportional to the thickness of the object, and related to the thermal conductivity of the object. In some embodiments, heat flow can also be called heat flux.

[0057] Heat flux: The amount of heat flow per unit area. In some embodiments, heat flux may be referred to as heat flow rate.

[0058] Thermal conductivity: refers to the amount of heat transferred per unit area within 1 hour when the temperature difference between the two surfaces of a 1m thick object is 1°C or 1K.

[0059] Thermal resistance: refers to the resistance encountered when heat is transferred through an object. Thermal resistance can reflect the heat transfer capacity of an object. For example, thermal resistance can represent the temperature difference between the two sides of an object caused by 1W of heat passing through the object.

[0060] As the functions of electronic devices become more and more abundant, the demand for electronic devices to detect ambient temperature is gradually increasing. In order to detect the ambient temperature of electronic devices, refer to Figure 1 In some embodiments, taking the electronic device as a watch as an example, a temperature sensor 21 may be provided inside the electronic device near the upper case, and the electronic device may use the temperature collected by the temperature sensor 21 as the ambient temperature. It should be understood that in order to indicate that the temperature sensor 21 is provided inside the electronic device, Figure 1 The temperature sensor 21 is represented by a dotted frame. In this method, because the temperature sensor 21 is disposed inside the electronic device, the temperature sensor 21 is affected by the heat generated by the electronic device and the heat generated by the human body, and the detection accuracy of the ambient temperature is low.

[0061] In some embodiments, in order to improve the detection accuracy of the ambient temperature, refer to Figure 2 , a heat insulation pad 22 can be set on the side of the temperature sensor 21 close to the human body, and the heat insulation pad 22 can isolate part of the heat generated by the electronic equipment and the human body, but the temperature sensor 21 will still be affected by the heat generated by the electronic equipment and the human body, and the detection accuracy is still relatively low. It should be understood that Figure 2 The middle is a side view of the watch.

[0062] In some embodiments, reference Figure 3 For example, two test points can be determined inside the electronic device, namely test point 1 and test point 2. Temperature sensor 1 is set at test point 1, and temperature sensor 2 is set at test point 2. Temperature sensor 1 can collect temperature T1 at test point 1, and temperature sensor 2 can collect temperature T2 at test point 2. In addition, a heating element can be set inside the electronic device. The heat power consumption generated by the heating element can be P, and the heat power consumption can reflect the heat released by the heating element. Among them, the heat transfer of the heating element can be transferred along the path of "heating element-test point 1, test point 2, and environment".

[0063] Among them, taking test point 1 and the environment as an example, the heat of the heating element is transferred to test point 1, and then transferred from test point 1 to the environment, and the path from test point 1 to the environment can be used as path 1. Taking test point 2 and the environment as an example, the heat of the heating element is transferred to test point 2, and then transferred from test point 2 to the environment, and the path from test point 2 to the environment can be used as path 2. Because the thermal resistance of path 1 and path 2 is different, and based on the definition of thermal resistance, the temperature difference at both ends of the path can be expressed by multiplying the thermal power consumption by the thermal resistance, which can be shown in the following formula 1:

[0064]

[0065] Where R represents the thermal resistance of the path, and the unit of thermal resistance is ℃ / W or K / W. P represents the thermal power consumption, and the unit of thermal power consumption is W. ΔT represents the temperature difference between the two ends of the path.

[0066] Assuming that the heat power consumption at test point 1 is P, and the two ends of path 1 are test point 1 and the environment, the temperature difference between the temperature T1 at test point 1 on path 1 and the ambient temperature can be expressed by the following formula 2:

[0067]

[0068] Where R1 is the thermal resistance of path 1, T a Indicates the ambient temperature.

[0069] Similarly, assuming that the heat power consumption at test point 2 is P, and the two ends of path 1 are test point 2 and the environment, the temperature difference between the temperature T2 at test point 2 on path 2 and the ambient temperature can be expressed by the following formula 3:

[0070]

[0071] Wherein, R2 represents the thermal resistance on path 1.

[0072] Based on Formula 2 and Formula 3, eliminating the thermal power consumption P, we can get the following Formula 4:

[0073]

[0074] In summary, the electronic device can calculate the ambient temperature T according to the temperature T1 collected by temperature sensor 1, the temperature T2 collected by temperature sensor 2, the thermal resistance R1 on path 1, and the thermal resistance R2 on path 2 through formula 4. a .

[0075] However, in this method, the assumption that the thermal power consumption at test point 1 is P and the thermal power consumption at test point 2 is P is not valid, because the heat of the heating element will be transferred in all directions, and will not be uniformly transferred along the path of "heating element-test point 1, test point 2, and environment". Therefore, the thermal power consumption at test point 1 and the thermal power consumption at test point 2 are different and not equal to P. In order to eliminate the thermal power consumption P in the above formula, the thermal power consumption at test point 1 and the thermal power consumption at test point 2 are assumed to be P, resulting in calculation deviation, which in turn leads to low accuracy of ambient temperature.

[0076] In order to improve the detection accuracy of ambient temperature, the embodiment of the present application provides an ambient temperature detection system and an electronic device, wherein the ambient temperature detection system is arranged inside the electronic device, and the ambient temperature detection system includes an ambient temperature detection module. The ambient temperature detection module is composed of two temperature sensors sandwiching a heat conducting element, and the heat conducting element can transfer the heat at one temperature sensor to the environment through another temperature sensor. Based on the principle that the heat transferred on the same path is the same, the electronic device can calculate the ambient temperature based on the temperatures collected by the two temperature sensors.

[0077] It should be understood that the electronic device in the embodiments of the present application may be referred to as user equipment (UE), terminal, etc. For example, the electronic device may be a wearable device, a mobile phone, a portable android device (PAD), a personal digital assistant (PDA), a handheld device with a wireless communication function, a computing device, a vehicle-mounted device, a virtual reality (VR) terminal device, an augmented reality (AR) terminal device, a wireless terminal in industrial control, a wireless terminal in a smart home, etc. The form of the electronic device in the embodiments of the present application is not specifically limited. Among them, wearable devices may include but are not limited to: wearable devices such as watches, bracelets, glasses, helmets, etc. In the following embodiments, the electronic device is described as a watch as an example.

[0078] The following is a description of the ambient temperature detection system and electronic device provided by the embodiments of the present application in conjunction with specific embodiments. The following embodiments may be combined with each other, and the same or similar concepts or processes may not be described in detail in some embodiments.

[0079] Figure 4 A schematic diagram of the structure of an electronic device provided in an embodiment of the present application. Figure 4 The electronic device 40 includes an environment temperature detection system 41. The environment temperature detection system 41 is used to detect the environment temperature of the electronic device.

[0080] In some embodiments, the electronic device 40 may include a housing and an ambient temperature detection system 41. The ambient temperature detection system 41 may be located in a space enclosed by the housing. In some embodiments, the space enclosed by the housing may be regarded as the interior of the electronic device, and the ambient temperature detection system 41 is located in the interior of the electronic device.

[0081] Understandably, Figure 4 The structure shown does not constitute a specific limitation on the electronic device. In other embodiments of the present application, the electronic device may include more or fewer components than shown in the figure, or combine some components, or split some components, or arrange the components differently. The components shown in the figure may be implemented in hardware, software, or a combination of software and hardware.

[0082] Reference Figure 4 , the ambient temperature detection system 41 may include: an ambient temperature detection module 411 and a processor 412. The ambient temperature detection module 411 is used to collect a first temperature and a second temperature inside the electronic device, and the first temperature and the second temperature are used by the electronic device to determine the ambient temperature of the electronic device. Among them, the processor 42 can obtain the first temperature and the second temperature collected by the ambient temperature detection module 411, and determine the ambient temperature of the electronic device based on the first temperature and the second temperature. In the following embodiments, the "ambient temperature of the electronic device" is referred to as "ambient temperature".

[0083] Reference Figure 4 The ambient temperature detection module 411 may include: a first temperature sensor 51, a second temperature sensor 52, and a heat conducting element 53 sandwiched between the first temperature sensor 51 and the second temperature sensor 52. The processor 412 may be connected to the first temperature sensor 51 and the second temperature sensor 51, respectively.

[0084] The first temperature sensor 51 is used to collect the first temperature. The second temperature sensor 52 is used to collect the second temperature.

[0085] In some embodiments, after the first temperature sensor 51 collects the first temperature, it can send the first temperature to the processor 412. Similarly, after the second temperature sensor 52 collects the second temperature, it can send the second temperature to the processor 412. In some embodiments, the processor 412 can periodically request the first temperature from the first temperature sensor 51. Similarly, the processor 412 can periodically request the second temperature from the second temperature sensor 52. In this way, the processor 412 can obtain the first temperature and the second temperature. In the embodiment of the present application, the processor 412 can determine the ambient temperature based on the first temperature and the second temperature. For details, please refer to the relevant description in the following embodiments.

[0086] The first temperature sensor 51 and the second temperature sensor 52 may be, for example, a negative temperature coefficient sensor (NTC), a positive temperature coefficient sensor (PTC), or a digital temperature sensor, etc., which is not limited in the present embodiment. The first temperature sensor 51 and the second temperature sensor 52 may be of the same or different types.

[0087] In some embodiments, the heat conductive element 53 can be used to transfer heat between the first temperature sensor 51 and the second temperature sensor 52. In some embodiments, the heat conductive element 53 can be bonded to the first temperature sensor 51 and / or the second temperature sensor 52. In some embodiments, when manufacturing the ambient temperature detection module 411, the heat conductive element 53 can be sandwiched between the first temperature sensor 51 and the second temperature sensor 52. In this example, the thickness of the heat conductive element 53 can be equal to the distance between the first temperature sensor 51 and the second temperature sensor 52.

[0088] In some embodiments, when the first temperature sensor 51 and the second temperature sensor 52 are analog temperature sensors such as NTC or PTC, the first temperature collected by the first temperature sensor 51 and the second temperature collected by the second temperature sensor 52 are analog signals. In order to facilitate the processor 412 to process the first temperature and the second temperature, in some embodiments, reference is made to Figure 5AThe electronic device 40 may further include an analog to digital converter (ADC) 413. The ADC 413 may be connected to the first temperature sensor 51 and the second temperature sensor 51 respectively, and the ADC 413 is also connected to the processor 412. The ADC 413 may obtain the first temperature and the second temperature of the analog signal, and convert the analog signal into a digital signal, and the ADC 413 may send the digital signal to the processor 412. In this way, the processor 412 may obtain the first temperature and the second temperature of the digital signal, and the processor 412 may identify the first temperature and the second temperature, and then determine the ambient temperature according to the first temperature and the second temperature.

[0089] In some embodiments, reference Figure 5B When the first temperature sensor 51 and the second temperature sensor 52 are analog temperature sensors such as NTC or PTC, the processor 412 may be a processor with a built-in analog-to-digital conversion function. When the processor 412 obtains the first temperature and the second temperature of the analog signal, the processor 412 may convert the analog signal into a digital signal to obtain the first temperature and the second temperature of the digital signal. In this way, the processor 412 may determine the ambient temperature based on the first temperature and the second temperature.

[0090] In some embodiments, reference Figure 5C When the first temperature sensor 51 and the second temperature sensor 52 are digital temperature sensors, because the first temperature collected by the first temperature sensor 51 and the second temperature collected by the second temperature sensor 52 are both digital signals, there is no need for analog-to-digital conversion processing. The processor 412 can identify the first temperature and the second temperature, and determine the ambient temperature based on the first temperature and the second temperature.

[0091] In the embodiment of the present application, there is no restriction on the location of the processor 412. In some embodiments, the ambient temperature detection module 411 can be set inside the electronic device near the housing. For example, the ambient temperature detection module 411 can be set close to the inner wall of the housing of the electronic device. In some embodiments, the ambient temperature detection module 411 can be glued to the inner wall of the housing, or a buckle can be set on the inner wall of the housing, and the ambient temperature detection module 411 can be buckled on the inner wall of the housing. The embodiment of the present application does not limit this.

[0092] Reference Figure 4 , the first temperature sensor 51, compared with the second temperature sensor 52, is disposed inside the electronic device 40 near the housing. In some embodiments, the first temperature sensor 51 may be disposed close to the inner wall of the housing of the electronic device, and the second temperature sensor 52 may be disposed away from the inner wall of the housing.

[0093] Figure 4The purpose of such a configuration is that when there is a temperature difference between the second temperature sensor 52 and the first temperature sensor 51, the heat conducting element 41 can transfer the heat at the second temperature sensor 52 to the environment through the first temperature sensor 51 in a timely manner, or the heat from the environment can be transferred to the second temperature sensor 52 through the first temperature sensor 51 in a timely manner.

[0094] Exemplarily, when the temperature at the second temperature sensor 52 is higher than the temperature at the first temperature sensor 51, the heat conducting element 53 can transfer the heat at the second temperature sensor 52 to the environment through the first temperature sensor 51. Exemplarily, when the temperature at the second temperature sensor 52 is lower than the temperature at the first temperature sensor 51, the heat conducting element can transfer the heat from the environment to the second temperature sensor 5 through the first temperature sensor 51. Based on the principle of equal heat transfer on the same path, the heat transferred between the second temperature sensor 52 and the first temperature sensor 51 is equal to the heat transferred between the first temperature sensor 51 and the environment.

[0095] Because heat flux can represent the heat flow rate transferred by an object per unit area, in the embodiment of the present application, the electronic device can determine the ambient temperature by calculating the first heat flux from the second temperature sensor 52 to the first temperature sensor 51, and the second heat flux from the first temperature sensor 51 to the environment, and using the first heat flux to be equal to the second heat flux.

[0096] Based on the definition of heat flux, the heat flux is proportional to the temperature difference on both sides of the heat conducting element 53. In the embodiment of the present application, the processor 412 can calculate the first heat flux based on the temperature difference on both sides of the heat conducting element 53. The temperature difference on both sides of the heat conducting element 53 is: the difference between the second temperature collected by the second temperature sensor 52 and the first temperature collected by the first temperature sensor 51.

[0097] In some embodiments, because the heat between the second temperature sensor 52 and the first temperature sensor 51 is transferred through the solid heat conducting element 53, according to Fourier's law, the heat flux per unit area through the ambient temperature detection module 411, that is, the first heat flux from the second temperature sensor 52 to the first temperature sensor 51 can be calculated by formula 5:

[0098] q cond =(T2-T1) / R Formula 5

[0099] Among them, q cond represents the first heat flux, T2 represents the second temperature collected by the second temperature sensor 52 , T1 represents the first temperature collected by the first temperature sensor 51 , and R represents the thermal resistance per unit area of ​​the heat conducting element 53 .

[0100] The heat from the first temperature sensor 51 to the environment is transferred through the shell near the first temperature sensor 51. There are two heat exchange pathways from the first temperature sensor 51 to the environment, one is the radiation heat exchange from the first temperature sensor 51 to the environment (such as air), and the other is the convection heat exchange from the first temperature sensor 51 to the environment (such as air). Among them, radiation heat exchange can be understood as heat absorption or heat dissipation, and convection heat exchange can be understood as heat transfer between the fluid and the solid wall surface in contact with it (such as the shell near the first temperature sensor 51).

[0101] In some embodiments, for radiation heat transfer, according to the Stefan-Boltzmann law, the heat flux of radiation heat transfer from the first temperature sensor 51 to the environment can be calculated by Formula 6:

[0102] q rad =εσ(T1 4 -T amb 4 ) Formula 6

[0103] Among them, q rad represents the heat flux of radiation heat exchange from the first temperature sensor 51 to the environment, ε represents the radiation coefficient of the shell near the first temperature sensor 51, σ represents the Steiner constant, T amb Indicates the ambient temperature.

[0104] In some embodiments, for convective heat transfer, according to Newton's law, the heat flux of convective heat transfer from the first temperature sensor 51 to the environment can be calculated by formula 7:

[0105] q conv =h c (T1-T amb ) Formula 7

[0106] Among them, q conv represents the heat flux of convective heat transfer from the first temperature sensor 51 to the environment, h c represents the convection heat transfer coefficient of the shell close to the first temperature sensor 51.

[0107] The heat flux q of the radiation heat exchange from the first temperature sensor 51 to the environment is rad The heat flux q of the convection heat exchange from the first temperature sensor 51 to the environment conv The sum of can be regarded as the second heat flux from the first temperature sensor 51 to the environment. The first heat flux and the second heat flux are equal, which can be expressed by the following formula 8:

[0108] q conv +q rad =q cond Formula 8

[0109] Replace q in Formula 5cond , q in Formula 6 rad , and q in Formula 7 conv Substituting into formula 8, we get the following formula 9:

[0110] εσT amb 4 +h c T amb =εσT1 4 +h c T1-(T2-T1) / R Formula 9

[0111] In the embodiment of the present application, the radiation coefficient ε, the step constant σ, and the convective heat transfer coefficient h of the shell can be pre-configured in the electronic device. c , and the thermal resistance per unit area of ​​the heat conducting element 53, after obtaining the first temperature T1 and the second temperature T2, the processor 411 can obtain the ambient temperature T by solving the binary quartic equation in formula 9 according to the radiation coefficient of the shell, the Steiner constant, the convection heat transfer coefficient of the shell, and the thermal resistance per unit area of ​​the heat conducting element 53. amb .

[0112] In some embodiments, Formula 9 may be referred to as Formula 1.

[0113] Compared to Figure 3 In the embodiment, Figure 3 When the heat generated by the heating element reaches test point 1 and test point 2 respectively, the degree of heat dissipation is different. The heat power consumption generated by the heating element is still used as the heat power consumption at test point 1 and the heat power consumption at test point 2, and the calculated ambient temperature has low accuracy. In the embodiment of the present application, the heat power consumption (or heat) from one heating element to two temperature sensors is not used for calculation, but the calculation is based on the condition that the first heat flux from the second temperature sensor 52 to the first temperature sensor 51 is equal to the heat flux from the first temperature sensor 51 to the environment. Because the same path (for example Figure 6 For example, the heat transfer on the lateral transfer path of the second temperature sensor 52 can be transferred by the heat conducting element 53 to the first temperature sensor 51, and less heat is diffused to the surroundings. When the housing transfers heat from the first temperature sensor 51 to the environment, because the first temperature sensor 51 is close to the housing, the housing can transfer almost all the heat to the environment, and less heat is diffused to the surroundings. Therefore, the heat transfer on the same path can be regarded as equal. In the embodiment of the present application, based on the equality of the first heat flux and the second heat flux, the calculated ambient temperature is compared with Figure 3 The ambient temperature obtained in the embodiment has high accuracy. It should be understood that Figure 6 The watch and the ambient temperature detection module 411 provided in the watch are briefly shown, and Figure 6The heat transfer is represented by dashed arrows.

[0114] In some embodiments, in order to further improve the accuracy of ambient temperature detection, the processor 411 can calculate the ambient temperature by formula 9 based on the first temperature, the second temperature, the emissivity of the shell, the Stein constant, the convection heat transfer coefficient of the shell, and the thermal resistance per unit area of ​​the thermal conductive element 53 when determining that the electronic device is in thermal equilibrium.

[0115] Thermal balance can be understood as: the first heat flux from the second temperature sensor 52 to the first temperature sensor 51 is in a stable state. Wherein, the first heat flux being in a stable state can be understood as: the first heat flux is stable at a certain value or within a preset range. Wherein, when the electronic device is in thermal balance, the first heat flux from the second temperature sensor 52 to the first temperature sensor 51 is in a stable state. The first heat flux being in a stable state can be understood as: the difference between the second temperature collected by the second temperature sensor 52 and the first temperature collected by the first temperature sensor 51 is also in a stable state. Wherein, the difference between the second temperature and the first temperature being in a stable state can be understood as: the difference between the second temperature and the first temperature is stable at a certain value or within a preset range, for example, the preset range can be, for example, 0.5°C-1°C.

[0116] Reference Fig. 7A When the electronic device is in non-thermal equilibrium, the temperature difference between the second temperature collected by the second temperature sensor 52 and the first temperature collected by the first temperature sensor 51 is large, and the heat transferred by the heat conductive element 53 is large. When the heat conductive element 53 transfers heat to the first temperature sensor 51, the heat may not be completely transferred to the first temperature sensor 51, and the heat will diffuse in other directions, affecting the calculation accuracy of the first heat flux, and further affecting the accuracy of the ambient temperature. Similarly, when the electronic device is in non-thermal equilibrium, the heat transferred by the shell to the environment will also diffuse in other directions, so that the heat transferred by the heat conductive element 53 is not equal to the heat transferred by the shell. In the non-thermal equilibrium scenario, the ambient temperature calculated using the above formula 9 has a certain error.

[0117] Reference Figure 7B When the electronic device is in thermal equilibrium, the temperature difference between the second temperature collected by the second temperature sensor 52 and the first temperature collected by the first temperature sensor 51 is small, and the heat transferred by the heat-conducting element 53 is small. The heat-conducting element 53 can have time to completely transfer the heat to the first temperature sensor 51, and the heat will not diffuse in other directions. In this way, an accurate first heat flux can be obtained, and then an accurate ambient temperature can be obtained. Similarly, when the electronic device is in thermal equilibrium, the heat transferred by the shell to the environment will not diffuse in other directions. In this way, the heat transferred by the heat-conducting element 53 is equal to the heat transferred by the shell. In the thermal equilibrium scenario, using the above formula 9 to calculate the ambient temperature can improve the accuracy of the ambient temperature.

[0118] It should be understood that Fig. 7A and Figure 7B The dotted arrows indicate the heat transfer.

[0119] Therefore, in the embodiment of the present application, when the processor 411 determines that the electronic device is in thermal equilibrium, the ambient temperature can be determined according to the above formula 9, which can improve the accuracy of the ambient temperature. In the embodiment of the present application, the processor 411 can determine whether the electronic device is in thermal equilibrium.

[0120] In some embodiments, because when the electronic device is in thermal equilibrium, the difference between the second temperature collected by the second temperature sensor 52 and the first temperature collected by the first temperature sensor 51 is also in a stable state, the processor 411 can detect whether the difference between the first temperature and the second temperature is stable at a certain value or a preset range to detect whether the electronic device is in thermal equilibrium. When the difference between the first temperature and the second temperature is stable at a certain value or a preset range, the processor 411 can determine that the electronic device is in thermal equilibrium.

[0121] In some embodiments, the processor 411 may detect whether the difference between the first temperature and the second temperature is less than or equal to a third threshold value to detect whether the electronic device is in thermal equilibrium. When the difference between the first temperature and the second temperature is less than or equal to the third threshold value, the processor 411 may determine that the electronic device is in thermal equilibrium, and when the difference between the first temperature and the second temperature is greater than the third threshold value, the processor 411 may determine that the electronic device is not in thermal equilibrium. Exemplarily, for example, the third threshold value may be 1°C.

[0122] In some embodiments, taking the electronic device as a wearable device as an example, when the user just wears the wearable device, the human body temperature is high, and the temperature difference between the human body and the wearable device is large. The human body can transfer heat to the wearable device. This large amount of heat will also cause the heat transferred by the thermal conductive element 53 to be large, and the temperature difference between the second temperature sensor 52 and the first temperature sensor 51 is large, and the wearable device is in non-thermal equilibrium. After the user wears the wearable device for a period of time, the temperature difference between the human body temperature and the wearable device becomes smaller and tends to be stable. Similarly, the amount of heat that the human body can transfer to the wearable device is small, which causes the heat transferred by the thermal conductive element 53 to be small, the temperature difference between the second temperature sensor 52 and the first temperature sensor 51 to be small, and the wearable device is in thermal equilibrium.

[0123] In this example, when the electronic device is a wearable device, the processor 411 can detect the wearing time of the wearable device. When the wearing time is greater than or equal to the preset time, the processor 411 determines that the electronic device is in thermal equilibrium. When the wearing time is less than the preset time, the processor 411 determines that the electronic device is not in thermal equilibrium. In some embodiments, the processor 411 can determine whether the wearable device is worn based on the posture data of the wearable device, and when the wearable device is in the wearing state, the wearing time of the wearable device is recorded. The embodiment of the present application does not limit how the processor 411 determines whether the wearable device is worn.

[0124] In order to further improve the detection accuracy of the ambient temperature, the ambient temperature detection module 411 can also be set in the electronic device. Figure 4 , the ambient temperature detection module 411 can be set at any position in the electronic device. Fig. 8A , the ambient temperature detection module 411 can be set close to the inner wall of the shell. For example, the first temperature sensor 51 can be set close to the inner wall of the shell, and compared with the first temperature sensor 51, the second temperature sensor 52 can be set away from the inner wall of the shell, and a heat conducting element 53 is sandwiched between the first temperature sensor 51 and the second temperature sensor 52. It should be understood that Fig. 8A The processor 412 is not shown.

[0125] The purpose of such a setting is to facilitate the first temperature sensor to contact the housing more directly and stay away from interference from the human body, clothes, etc. For example, the first temperature sensor 51 is set close to the housing inside the electronic device, and the first temperature sensor 51 can exchange heat with the environment directly through the housing without passing through the air, so that the housing can transfer all the heat from the first temperature sensor 51 to the environment.

[0126] In some embodiments, when the electronic device is a wearable device, the housing of the wearable device may include an upper housing, a lower housing, and a side wall, and the ambient temperature detection module 411 may be arranged close to the upper housing or the side wall. The lower housing is the housing close to the human body when the wearable device is in a worn state, and the upper housing is the housing far from the human body when the wearable device is in a worn state. Exemplarily, when the wearable device is a watch, the upper housing is the upper housing of the watch, and the lower housing is the lower housing of the watch.

[0127] In this example, when the electronic device is a wearable device and the electronic device is in a wearable state, the ambient temperature detection module 411 can be set close to the shell of the electronic device on the side away from the wearer, for example, the shell is an upper shell or a side wall. Exemplarily, for example, the first temperature sensor 51 can be set close to the upper shell, and compared with the first temperature sensor 51, the second temperature sensor 52 can be set toward a position away from the upper shell, and a heat conductive element 53 is sandwiched between the first temperature sensor 51 and the second temperature sensor 52. Among them, the wearer is, for example, a user, an animal, etc.

[0128] In some embodiments, reference Figure 8B , the ambient temperature detection module 411 can also be placed close to a stable heat source, and the location of the stable heat source can be called a first location. A stable heat source can be understood as a location where the temperature changes less. Specifically, the temperature change of the stable heat source can be less than or equal to the first threshold, that is, the temperature change at the first location can be less than or equal to the first threshold. In this example, refer to Fig. 8A For example, the first temperature sensor 51 is used to be set close to the side wall, and the second temperature sensor 52 is used to be set close to the first position.

[0129] In the embodiment of the present application, when the electronic device is a wearable device, such as a watch, a bracelet, etc., the first position may be, for example, a location where a battery, a metal component, etc. are set inside the electronic device. Exemplarily, when the electronic device is a mobile phone, a tablet, etc., the first position may be, for example, a location far from a radio frequency module, a battery, etc., for example, the first position may be the location of a speaker hole. Figure 8B In the example, the electronic device is a watch, and the first position is the battery.

[0130] The purpose of setting the ambient temperature detection module 411 in this embodiment of the present application is described below:

[0131] If the ambient temperature detection module 411 is located near an unstable heat source, for example, the temperature variation of the unstable heat source is greater than the first threshold. Fig. 9, because the temperature variation of the unstable heat source is large, assuming that the temperature of the unstable heat source varies between temperature 1 and temperature 2, the difference between temperature 2 and temperature 1 is greater than the first threshold, and temperature 2 is higher than temperature 1. Among them, assuming that the temperature of the unstable heat source is temperature 1, it is not much different from the temperature of the second temperature sensor 52, and the difference between the second temperature collected by the second temperature sensor 52 and the first temperature collected by the first temperature sensor 51 can be quickly enabled to be in a stable state, enabling the electronic device to reach thermal equilibrium, so that the processor 412 can obtain the accurate ambient temperature. However, because the temperature of the unstable heat source is constantly changing, when the temperature of the unstable heat source is greater than temperature 1 or even reaches temperature 2, it will destroy the thermal balance of the electronic device, and the electronic device will be in non-thermal equilibrium, which will affect the accuracy of the ambient temperature obtained by the processor 412. It should be understood that Fig. 9 The dotted arrows indicate the heat transfer.

[0132] When the ambient temperature detection module 411 is set close to a stable heat source, since the temperature change of the stable heat source is small, the difference between the second temperature collected by the second temperature sensor 52 and the first temperature collected by the first temperature sensor 51 can be quickly enabled to be in a stable state, enabling the electronic device to reach thermal balance, which makes it easier for the processor 412 to obtain accurate ambient temperature.

[0133] As described in the above embodiment, "the heat-conducting element 53 can transfer heat between the first temperature sensor 51 and the second temperature sensor 52". In order to prevent the heat between the first temperature sensor 51 and the second temperature sensor 52 from being transferred to the surroundings and to ensure that the heat can be completely transferred through the heat-conducting element 53, so as to improve the calculation accuracy of the first heat flux and to improve the accuracy of the ambient temperature, this can be achieved by setting a heat-conducting element 53 in the embodiment of the present application.

[0134] In some embodiments, the heat conducting element 53 may be an existing element in the electronic device, or a newly added element. When the heat conducting element 53 is an existing element in the electronic device, for example, the existing element may be foam.

[0135] Because both thermal conductivity and thermal resistance can characterize the heat transfer capacity of an object. In some embodiments, the thermal resistance per unit area of ​​the heat conducting element 53 can be set within a preset range, which can be, for example, 0.005-0.01 m 2 ·K / W, so that the heat between the first temperature sensor 51 and the second temperature sensor 52 can be completely transferred through the heat-conducting element 53. In some embodiments, the thermal conductivity of the heat-conducting element 53 can also be set to 0.2-1W / (m·K).

[0136] In some embodiments, when the heat-conducting element 53 is a foam in an electronic device, the thermal resistance per unit area of ​​the foam can be adjusted to 0.005-0.01 m by adjusting the thickness of the foam. 2 ·K / W.

[0137] In some embodiments, in order to facilitate the thermal conductive element 53 to completely transfer heat between the first temperature sensor 51 and the second temperature sensor 52, the thermal conductive element 53 itself does not transfer much heat to the surroundings, and the thickness of the thermal conductive element 53 can be set to 2-5 mm. The thickness of the thermal conductive element 53 is not too thick, which can ensure that the heat between the first temperature sensor 51 and the second temperature sensor 52 is completely transferred.

[0138] The heat conducting element 53 is sandwiched between the first temperature sensor 51 and the second temperature sensor 52, wherein the first surface of the heat conducting element 53 contacts the first temperature sensor 51, and the second surface of the heat conducting element 53 contacts the second temperature sensor 52. In some embodiments, in order to ensure that the heat conducting element 53 can completely transfer the heat between the first temperature sensor 51 and the second temperature sensor 52, the contact area between the first temperature sensor 51 and the first surface can be set to be smaller than the area of ​​the first surface, and the contact area between the second temperature sensor 52 and the second surface can be set to be smaller than the area of ​​the second surface.

[0139] For example, Fig. 10A The present invention does not limit the form of the first temperature sensor 51, the second temperature sensor 52, and the heat conducting element 53. Fig. 10A , taking the first temperature sensor 51, the second temperature sensor 52, and the heat conducting element 53 as a rectangular parallelepiped as an example. The first surface 531 of the heat conducting element 53 contacts the first temperature sensor 51, and the second surface 532 of the heat conducting element 53 contacts the second temperature sensor 52. Fig. 10B , wherein the contact area between the first temperature sensor 51 and the first surface 531 is smaller than the area of ​​the first surface, and the contact area between the second temperature sensor 52 and the second surface 532 is smaller than the area of ​​the second surface, so that the heat between the first temperature sensor 51 and the second temperature sensor 52 is completely transferred through the heat conducting element 53, avoiding the heat transfer to the surrounding, so that the accuracy of the first heat flux can be ensured, and then the accuracy of the ambient temperature can be ensured. It should be understood that Fig. 10B The left and right views of the ambient temperature detection module are shown respectively.

[0140] In the embodiment of the present application, by placing the ambient temperature detection module 411 close to the inner wall position of the shell, the first temperature sensor 51 can be directly in contact with the shell, so that the shell can completely transfer the heat between the first temperature sensor 51 and the environment. In addition, the ambient temperature detection module 411 can also be set close to a stable heat source, which can quickly enable the difference between the second temperature collected by the second temperature sensor 52 and the first temperature collected by the first temperature sensor 51 to be in a stable state, so that the electronic device can reach thermal equilibrium, so that the processor 412 can obtain accurate ambient temperature. In addition, the embodiment of the present application also limits the thermal resistance or thermal conductivity, thickness of the heat-conducting element 53, and the contact area with the first temperature sensor 51 and the second temperature sensor 52, which can ensure that the heat-conducting element 53 can completely transfer the heat between the first temperature sensor 51 and the second temperature sensor 52, avoid the heat from being transferred to the surroundings, and also improve the detection accuracy of the ambient temperature.

[0141] As described in the above embodiment, a method for calculating the ambient temperature based on the principle that the first heat flux is equal to the second heat flux is described. In some embodiments, a temperature mapping relationship can also be pre-configured in the electronic device, and the processor 412 can determine the ambient temperature based on the temperature mapping relationship. Among them, the temperature mapping relationship is used to characterize the mapping relationship between the temperature collected by the first temperature sensor, the temperature collected by the second sensor, and the ambient temperature. In some embodiments, the temperature mapping relationship can also be understood as: the temperature collected by the first temperature sensor 51 and the temperature collected by the second temperature sensor 52 at different ambient temperatures.

[0142] In this example, during the test phase, the electronic device can be placed in different ambient temperatures, and the temperature collected by the first temperature sensor 51 and the temperature collected by the second temperature sensor 52 when the electronic device is in different ambient temperatures are obtained. By traversing different ambient temperatures, a data set of the temperature collected by the first temperature sensor 51 and the temperature collected by the second temperature sensor 52 under different ambient temperatures is obtained. Based on the data set, the electronic device can establish a temperature mapping relationship.

[0143] In the embodiment of the present application, after obtaining the first temperature and the second temperature, the processor 412 can query the ambient temperature corresponding to the first temperature and the second temperature according to the temperature mapping relationship, and use the queried ambient temperature as the ambient temperature of the electronic device.

[0144] In the embodiment of the present application, based on the settings of the ambient temperature detection module 411 and the ambient temperature detection system 41, the processor 412 can use different methods to determine the ambient temperature, which is highly flexible.

[0145] In some embodiments, after the processor 412 obtains the ambient temperature, it can output the ambient temperature. For example, the processor 412 can interact with the display screen of the electronic device to enable the display screen to display the ambient temperature. In some embodiments, the processor 412 can also obtain the human body temperature based on the ambient temperature, and use the ambient temperature in other scenarios, which is not limited in the embodiments of the present application.

[0146] As described in the above embodiment, the ambient temperature detection system 41 includes an ambient temperature detection module 411. In some embodiments, the ambient temperature detection system 41 may include at least two ambient temperature detection modules 411. The structure and setting method of each ambient temperature detection module 411 may refer to the relevant description in the above embodiment. In this example, the processor 412 may determine the ambient temperature based on the first temperature and the second temperature collected by the at least two ambient temperature detection modules 411.

[0147] The following takes the example that the ambient temperature detection system 41 includes a first ambient temperature detection module 41A and a second ambient temperature detection module 41B to introduce a solution in which the ambient temperature detection system 41 includes at least two ambient temperature detection modules 411. Fig.11 The ambient temperature detection system 41 includes a first ambient temperature detection module 41A and a second ambient temperature detection module 41B. The structure and configuration of the first ambient temperature detection module 41A and the second ambient temperature detection module 41B can refer to the relevant description of the "ambient temperature detection module 411" in the above embodiment.

[0148] In the embodiment of the present application, the first environment temperature detection module 41A includes a first temperature sensor 51, a second temperature sensor 52, and a heat conductive element 53 sandwiched between the first temperature sensor 51 and the second temperature sensor 52. The second environment temperature detection module 41B includes a third temperature sensor 54, a fourth temperature sensor 55, and a heat conductive element 56 sandwiched between the third temperature sensor 54 and the fourth temperature sensor 55. The heat conductive element 53 and the heat conductive element 56 can be the same element or different elements.

[0149] The processor 412 is connected to the first temperature sensor 51, the second temperature sensor 52, the third temperature sensor 54, and the fourth temperature sensor 55 respectively. It should be understood that Fig.11 The processor 412 is not shown in the figure. The first temperature sensor 51 can collect the first temperature, the second temperature sensor 52 can collect the second temperature, the third temperature sensor 54 can collect the third temperature, and the fourth temperature sensor 55 can collect the fourth temperature. The processor 412 can obtain the first temperature, the second temperature, the third temperature, and the fourth temperature, and the processor 412 can determine the ambient temperature according to the first temperature, the second temperature, the third temperature, and the fourth temperature.

[0150] The processor 412 may determine the first ambient temperature according to the first temperature and the second temperature, and reference may be made to the description in the above embodiment.

[0151] Similarly, the processor 412 can determine the second ambient temperature based on the third temperature and the fourth temperature. In some embodiments, the processor 412 can determine the second ambient temperature based on the third temperature, the fourth temperature, the radiation coefficient of the shell, the Steiner constant, the convection heat transfer coefficient of the shell, and the thermal resistance per unit area of ​​the thermal conductive element 56, and can refer to the description of the embodiments at Formula 5-Formula 9.

[0152] In some embodiments, a temperature mapping relationship may also be pre-configured in the electronic device, and the processor 412 may determine the second ambient temperature based on the temperature mapping relationship. The temperature mapping relationship is used to characterize the mapping relationship between the temperature collected by the first temperature sensor, the temperature collected by the second sensor, and the first ambient temperature, as well as the mapping relationship between the temperature collected by the third temperature sensor, the temperature collected by the fourth sensor, and the second ambient temperature. The temperature mapping relationship may also be understood as: the temperature collected by the first temperature sensor 51, the temperature collected by the second sensor 52, the temperature collected by the third temperature sensor 54, and the temperature collected by the fourth sensor 54 at different ambient temperatures.

[0153] In this example, during the test phase, the electronic device can be placed under different ambient temperatures, and the temperature collected by the first temperature sensor 51, the temperature collected by the second temperature sensor 52, the temperature collected by the third temperature sensor 54, and the temperature collected by the fourth temperature sensor 55 when the electronic device is under different ambient temperatures are obtained. By traversing different ambient temperatures, a data set of the temperature collected by the first temperature sensor 51, the temperature collected by the second temperature sensor 52, the temperature collected by the third temperature sensor 54, and the temperature collected by the fourth temperature sensor 55 under different ambient temperatures is obtained. Based on the data set, the electronic device can establish a temperature mapping relationship.

[0154] In the embodiment of the present application, after obtaining the third temperature and the fourth temperature, the processor 412 can query the ambient temperature corresponding to the third temperature and the fourth temperature according to the temperature mapping relationship, and use the queried ambient temperature as the second ambient temperature.

[0155] In the embodiment of the present application, after acquiring the first ambient temperature and the second ambient temperature, the processor 412 may use the average or weighted value of the first ambient temperature and the second ambient temperature as the ambient temperature of the electronic device.

[0156] In some embodiments, in order to further improve the accuracy of the ambient temperature, the distance between the second ambient temperature detection module 41B and the first ambient temperature detection module 41A can be set to be greater than or equal to the second threshold. Fig.11 Taking the electronic device as a watch as an example, when the distance between the second ambient temperature detection module 41B and the first ambient temperature detection module 41A is greater than or equal to the second threshold, the second ambient temperature detection module 41B and the first ambient temperature detection module 41A can be oriented in different directions respectively, so as to avoid heat transfer between the second ambient temperature detection module 41B and the first ambient temperature detection module 41A, and avoid the mutual influence of the heat transferred between the first temperature sensor 51 and the environment and the heat transferred between the third temperature sensor 54 and the environment, so that the processor 412 can determine the accurate first ambient temperature based on the first temperature and the second temperature, and can determine the accurate second ambient temperature based on the third temperature and the fourth temperature, which helps to determine the accurate ambient temperature.

[0157] In an embodiment of the present application, multiple ambient temperatures can be obtained by combining the temperatures collected by multiple ambient temperature detection modules, and the average or weighted value of the multiple ambient temperatures can be used as the ambient temperature of the electronic device, which can improve the accuracy of the ambient temperature.

[0158] In summary, the embodiments of the present application provide an ambient temperature detection module, and the structure of the ambient temperature detection module and the configuration method of the ambient temperature detection module in an electronic device can refer to the description in the above embodiments.

[0159] The embodiment of the present application provides an ambient temperature detection system, which may include a processor and at least one ambient temperature detection module. The structure of the ambient temperature detection system and the configuration method in the electronic device may refer to the description in the above embodiment.

[0160] An embodiment of the present application provides an electronic device, which may include an ambient temperature detection system, where the ambient temperature detection system is used to determine the ambient temperature. The structure of the electronic device and the process of determining the ambient temperature may refer to the description in the above embodiments.

[0161] It should be noted that the data involved in this application (including but not limited to data used for analysis, stored data, displayed data, etc.) are all information and data authorized by the user or fully authorized by all parties, and the collection, use and processing of relevant data must comply with relevant laws, regulations and standards of relevant countries and regions, and provide corresponding operation entrances for users to choose to authorize or refuse.

[0162] In one embodiment, the present application also provides an electronic device, referring to Fig.12, the electronic device may include: a processor 1201 (such as a CPU), and a memory 1202. The memory 1202 may include a high-speed random access memory (RAM), and may also include a non-volatile memory (NVM), such as at least one disk memory. The memory 1202 may store various instructions for completing various processing functions and implementing the method steps of the present application.

[0163] Optionally, the electronic device involved in the present application may further include: a power supply 1203, a communication bus 1204 and a communication port 1205. The above-mentioned communication port 1205 is used to realize the connection and communication between the electronic device and other peripherals. In the embodiment of the present application, the memory 1202 is used to store computer executable program code, and the program code includes instructions; when the processor 1201 executes the instruction, the instruction causes the processor 1201 of the electronic device to perform the action in the above-mentioned method embodiment, and its implementation principle and technical effect are similar, which will not be repeated here.

[0164] Optionally, the electronic device involved in the present application may further include: a display screen 1206. The display screen 1206 is used to display an interface of the electronic device. For example, the display screen 1206 may display the ambient temperature.

[0165] It should be noted that the modules or components described in the above embodiments may be one or more integrated circuits configured to implement the above methods, such as one or more application specific integrated circuits (ASICs), or one or more digital signal processors (DSPs), or one or more field programmable gate arrays (FPGAs). For another example, when a module above is implemented in the form of a processing element scheduling program code, the processing element may be a general-purpose processor, such as a central processing unit (CPU) or other processors that can call program codes, such as a controller. For another example, these modules may be integrated together and implemented in the form of a system-on-a-chip (SOC).

[0166] In the above embodiments, it can be implemented in whole or in part by software, hardware, firmware or any combination thereof. When implemented using software, it can be implemented in whole or in part in the form of a computer program product. The computer program product includes one or more computer instructions. When loading and executing computer program instructions on a computer, the process or function according to the embodiment of the present application is generated in whole or in part. The computer can be a general-purpose computer, a special-purpose computer, a computer network, or other programmable devices. The computer instructions can be stored in a computer-readable storage medium, or transmitted from one computer-readable storage medium to another computer-readable storage medium. For example, the computer instructions can be transmitted from a website site, a computer, a server or a data center by wired (e.g., coaxial cable, optical fiber, digital subscriber line (DSL)) or wireless (e.g., infrared, wireless, microwave, etc.) mode to another website site, computer, server or data center. The computer-readable storage medium can be any available medium that a computer can access or a data storage device such as a server, a data center, etc. that contains one or more available media integrated. The available medium can be a magnetic medium, (e.g., a floppy disk, a hard disk, a tape), an optical medium (e.g., a DVD), or a semiconductor medium (e.g., a solid-state hard disk Solid State Disk (SSD)), etc.

[0167] The term "plurality" in this article refers to two or more than two. The term "and / or" in this article is only a description of the association relationship of associated objects, indicating that three relationships may exist. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " in this article generally indicates that the previous and next associated objects are in an "or" relationship; in the formula, the character " / " indicates that the previous and next associated objects are in a "division" relationship. In addition, it should be understood that in the description of this application, words such as "first" and "second" are only used for the purpose of distinguishing descriptions, and cannot be understood as indicating or implying relative importance, nor can they be understood as indicating or implying order.

[0168] It should be understood that the various numerical numbers involved in the embodiments of the present application are only used for the convenience of description and are not used to limit the scope of the embodiments of the present application.

[0169] It can be understood that in the embodiments of the present application, the size of the serial numbers of the above-mentioned processes does not mean the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present application.

Claims

1. An ambient temperature detection system, characterized in that: The electronic device comprises an environment temperature detection module and a processor, wherein the environment temperature detection module comprises a first temperature sensor, a second temperature sensor, and a heat conducting element sandwiched between the first temperature sensor and the second temperature sensor, wherein the processor is connected to the first temperature sensor and the second temperature sensor respectively, and the environment temperature detection module is used to be arranged inside the electronic device; The first temperature sensor is used to collect a first temperature, and the second temperature sensor is used to collect a second temperature; The processor is used to obtain the first temperature and the second temperature, and determine the ambient temperature according to the first temperature and the second temperature.

2. The environmental temperature detection system according to claim 1, characterized in that: The processor is further configured to execute the step of determining the ambient temperature based on the first temperature and the second temperature after determining that the difference between the first temperature and the second temperature is less than or equal to a first threshold.

3. The environmental temperature detection system according to claim 1 or 2, characterized in that: The processor determines the ambient temperature based on the first temperature and the second temperature, and is specifically used to determine the ambient temperature based on the first temperature, the second temperature, the thermal resistance per unit area of ​​the heat-conducting element, the convection heat transfer coefficient of the shell of the electronic device, and the radiation coefficient of the shell.

4. The environmental temperature detection system according to claim 3, characterized in that: The processor is specifically configured to determine the ambient temperature according to Formula 1: εσT amb 4 +hT amb σσT1 4 +hT1-(T2-T1) / R Other Wherein, T1 represents the first temperature, T2 represents the second temperature, T amb represents the ambient temperature, R represents the thermal resistance per unit area of ​​the heat-conducting element, h represents the convection heat transfer coefficient of the shell, ε represents the radiation coefficient of the shell, and σ represents the Steiner constant.

5. The system according to claim 1 or 2, characterized in that: The processor determines the ambient temperature according to the first temperature and the second temperature, specifically for: The ambient temperature is determined according to the first temperature, the second temperature, and a temperature mapping relationship, where the temperature mapping relationship is used to characterize the temperature collected by the first temperature sensor and the temperature collected by the second sensor under different ambient temperatures.

6. The environmental temperature detection system according to any one of claims 1 to 5, characterized in that: The ambient temperature detection system comprises at least two ambient temperature detection modules; The processor is further configured to: The ambient temperature is determined according to the first temperature and the second temperature collected by at least two of the ambient temperature detection modules.

7. The environmental temperature detection system according to claim 6, characterized in that: The distance between at least two of the ambient temperature detection modules is greater than or equal to a second threshold.

8. The environmental temperature detection system according to any one of claims 1 to 7, characterized in that: The thermal resistance per unit area of ​​the thermal conductive element is 0.005-0.01m 2 ·K / W.

9. The environmental temperature detection system according to any one of claims 1 to 8, characterized in that: The thickness of the heat conducting element is 2-5 mm.

10. The environmental temperature detection system according to any one of claims 1 to 9, characterized in that: The first surface of the heat conductive element contacts the first temperature sensor, the second surface of the heat conductive element contacts the second temperature sensor, the contact area between the first temperature sensor and the first surface is smaller than the area of ​​the first surface, and the contact area between the second temperature sensor and the second surface is smaller than the area of ​​the second surface.

11. An electronic device, characterized in that: It comprises a shell and an ambient temperature detection system as described in any one of claims 1 to 10, wherein the ambient temperature detection system is located in a space enclosed by the shell.

12. The electronic device according to claim 11, characterized in that: The ambient temperature detection module is arranged close to the inner wall of the shell.

13. The electronic device according to claim 12, characterized in that: The electronic device is a wearable device, the shell includes an upper shell, a lower shell and a side wall, the ambient temperature detection module is close to the upper shell or the side wall, the lower shell is the shell that is close to the human body when the wearable device is in a worn state, and the upper shell is the shell that is far away from the human body when the wearable device is in a worn state.

14. The electronic device according to claim 12 or 13, characterized in that: The ambient temperature detection module is also used to be arranged near a first position inside the electronic device, and the temperature change at the first position is less than or equal to a first threshold.

15. The electronic device according to claim 14, characterized in that: The first position is any one of the following positions: a battery or a metal element.

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