A semiconductor chip packaging finished product pin quality inspection equipment

Abstract

The present invention discloses a semiconductor chip package finished product pin quality detection device, which relates to the field of semiconductor chip technology, including a base, a tension detection mechanism, the tension detection mechanism including a first fixed seat and a tension sensor, the first fixed seat has two and is respectively fixedly sleeved on two support columns at the front end by bolts, and the tension sensor has two and is respectively fixedly installed between the two first fixed seats and the movable frame by bolts. The present invention drives the movable frame to descend and cooperates with the tension sensor to realize the tension quality detection of multiple pins at one time, which not only reduces the labor intensity, but also pulls down the pins for detection at the same time, and the force applied to the pins is the same, so that the reliability of the detection data is improved, and the bending quality detection of the semiconductor chip pins is realized by controlling the translation and extension of the reciprocating rod, which not only improves the accuracy of the detection data, but also effectively improves the efficiency of the semiconductor chip pin quality detection.

Description

Technical Field

[0001] The invention relates to the technical field of semiconductor chips, in particular to a device for detecting quality of pins of semiconductor chip packaged finished products. Background Art

[0002] In the semiconductor chip packaging process, the pin quality is directly related to the connection reliability between the chip and the external circuit. If the pins have problems such as inconsistent length, unqualified spacing, bending and deformation, it may cause poor contact, signal transmission errors and even chip damage in subsequent applications. Therefore, strict inspection of the pin quality of the packaged product is an important part of ensuring chip performance and reliability. The Chinese patent application with application number 201821629810.3 discloses "a detection device for inspecting the quality of product pin bonding, including: a base and a bracket: a placement station, which is set on the base and can place the product to be tested; a camera, which is set on the bracket The processing unit is on the rack and can collect image data of the pins of the product to be tested: the processing unit is electrically connected to the camera to obtain image data of the pins of the product to be tested for analysis and processing. The camera collects image data of the product to be tested and transmits it to the processing unit. The processing unit analyzes the image data based on whether there is a break or missing shadow at the pin, or whether the shadow area of ​​the hot melt adhesive is too large, or whether there is a bubble shadow, so as to determine whether the joining quality of the product pin is qualified. Replacing manual inspection with the utility model can not only save labor costs, but also use image data for judgment, and can also detect problems with inspection benchmark standards and small structures, and the judgment accuracy is greatly improved. "

[0003] This technical solution only solves the problems of inconsistent standards, easy fatigue and low accuracy during manual visual inspection. However, it is impossible to detect the mechanical properties of the finished chip package pins only by collecting images of the pins. The existing testing of the bonding strength between the pins and the package body and the fatigue resistance of the pins still needs to be done manually. The force applied during manual inspection is difficult to be the same, and repetitive operations are also prone to manual fatigue. Not only is the inspection efficiency low, but the detected data also has large errors. Summary of the invention

[0004] The object of the present invention is to provide a semiconductor chip package finished product pin quality inspection device to solve the problems raised in the above background technology.

[0005] To achieve the above object, the present invention provides the following technical solution: a semiconductor chip package finished product pin quality inspection device, comprising a base, the top four corners of the base are fixed with support columns by bolts;

[0006] A chip placement mechanism, the chip placement mechanism comprises a support seat and a placement column, the support seat has two and is movably arranged on the left and right sides of the four support columns, and the placement column has two groups and two columns in each group, and is fixedly installed on the front and rear top ends of the two support seats by bolts;

[0007] A chip fixing mechanism, the chip fixing mechanism comprises a lifting plate and a pressing block, the lifting plates are two in total and both ends of the lifting plates are movably sleeved on four supporting columns;

[0008] A pin clamping mechanism, the pin clamping mechanism comprising a movable frame, the movable frame being movably arranged outside a group of placement columns located at the front end;

[0009] A tension detection mechanism, the tension detection mechanism comprising a first fixing seat and a tension sensor, the first fixing seats having two in total and being respectively fixedly sleeved on two support columns at the front end by bolts, and the tension sensors having two in total being respectively fixedly installed between the two first fixing seats and the movable frame by bolts;

[0010] The bending detection mechanism includes a support frame, a reciprocating rod and a pressure sensor. There are two support frames and they are movably arranged on both sides of the two placement columns located at the rear end. There are two reciprocating rods and they are movably installed on one end of the two support frames close to the placement columns by insertion. There are two pressure sensors and they are fixedly arranged in one end of the two reciprocating rods close to the placement columns.

[0011] Preferably, the chip placement mechanism includes a support rail, an upper guard plate, a connecting plate, a partition, a two-way threaded rod and a first turning handle, there are two support rails in total, which are fixedly installed at the bottom ends of the front and rear groups of support columns by bolts, the upper guard plate is fixedly installed in the middle of the top ends of the two support rails by bolts, the front and rear bottom ends of the two support seats are both installed in the two support rails by sliding movement, and are respectively located on both sides of the upper guard plate, the top of the placement column is fixedly bonded with a placement seat, the lower pressure block and the placement seat are both made of rubber material, there are two connecting plates in total, which are fixedly installed between the two ends of the two support rails by bolts, there are two partitions in total, and both ends are fixedly installed on the opposite sides of the two support rails by bolts, and are respectively located on both sides of the upper guard plate, the two ends of the two-way threaded rod are respectively movably installed in the middle of the two connecting plates through bearings, the two-way threaded rod is movably installed in the middle of the two partitions by insertion, and there are two first turning handles in total, which are respectively fixedly installed at both ends of the two-way threaded rod by bolts.

[0012] Preferably, the chip fixing mechanism includes a lifting frame, a lifting threaded rod and a second turning handle, there are two lower pressure blocks, which are respectively fixed and bonded in the middle of the bottom ends of the two lifting plates, the bottom end of the lifting frame is fixedly installed in the middle of the top ends of the two lifting plates by bolts, the top ends of the four support columns are fixedly installed with a top plate by bolts, the top end of the lifting threaded rod is movably installed in the middle of the top plate by a bearing, the bottom end of the lifting threaded rod is movably installed in the middle of the lifting frame by threaded insertion, and the second turning handle is fixedly installed on the top end of the lifting threaded rod by bolts.

[0013] Preferably, the pin clamping mechanism comprises an outer clamping plate, an outer tooth plate, a first gear, a first transmission rod, a first worm gear, a first worm gear and an inner clamping plate, the outer clamping plates have two pieces, and two ends are respectively mounted on the front and rear sides of the two ends of the movable frame by sliding movement, and are located between the two outer clamping plates, the outer tooth plates have two groups, and each group has two pieces, and are respectively fixedly mounted on the bottom and top ends of the two outer clamping plates by bolts, the first gear has two pieces, and are respectively mounted between the two groups of outer tooth plates by meshing movement, the two ends of the first transmission rod are movably mounted on both sides of the movable frame by bearings, and are located on the front sides of the two front placement columns, the two first gears are fixedly sleeved on the first transmission rod by bolts, the first worm gear is fixedly sleeved on the end of the first transmission rod located on the outside of the left side of the movable frame by bolts, the first worm gear is movably mounted on the left side of the movable frame by bearings, and the first worm gear is movably mounted on the left side of the movable frame by bearings, and is movably connected to the first worm gear by meshing, the inner clamping plates have two pieces, and two ends are respectively mounted on the front and rear sides of the two ends of the movable frame by sliding movement

[0014] Preferably, the pin clamping mechanism includes an inner tooth plate, a second gear, a second transmission rod, a second worm wheel and a second worm. There are two groups of inner tooth plates with two pieces in each group, and they are fixedly mounted on the bottom and top ends of the two inner clamping plates on opposite sides of both ends by bolts. There are two second gears and they are movably mounted between the two groups of inner tooth plates by meshing. The two ends of the second transmission rod are movably mounted on both sides of the movable frame by bearings, and are located on the rear sides of the two front placement columns. The two second gears are fixedly sleeved on the second transmission rod by bolts, and the second worm wheel is fixedly sleeved on the end of the second transmission rod located outside the right side of the movable frame by bolts. The second worm wheel is movably mounted on the right side of the movable frame by bearings, and is movably connected to the second worm wheel by meshing.

[0015] Preferably, the tension detection mechanism includes a base plate, a movable groove, a tension detection threaded rod, a screw sleeve, a first bevel gear, a first motor and a second bevel gear. The base plate is fixedly installed in the middle of the bottom end of the movable frame by bolts. There are two movable grooves in total and both penetrate the base plate, and are respectively movably sleeved on the outside of two placement columns at the front end. The top end of the tension detection threaded rod is fixedly installed in the middle of the bottom end of the base plate by bolts. The screw sleeve is movably installed in the middle of a support rail at the front end through a bearing and is installed in the middle of the front end of the upper guard plate by insertion. The bottom end of the tension detection threaded rod is movably installed in the screw sleeve by threaded insertion. The first bevel gear is fixedly sleeved on the bottom end of the screw sleeve by bolts. The first motor is fixedly installed on the bottom end of the support rail at the front end by bolts. The second bevel gear is fixedly sleeved on the output shaft of the first motor by bolts, and the second bevel gear is movably connected to the first bevel gear through meshing.

[0016] Preferably, the bending detection mechanism includes a second fixed seat, a sliding rod, a translation threaded rod, a second motor and a translation seat. There are two second fixed seats in total, which are respectively fixedly sleeved on two support columns at the rear end by bolts, and are located above the support seat. The sliding rod is fixedly installed between one end of the two second fixed seats close to the movable frame by bolts. The two ends of the translation threaded rod are respectively movably installed between one end of the two second fixed seats away from the sliding rod by bearings. The second motor is fixedly installed at the rear end of the second fixed seat at the left end by bolts. The output shaft of the second motor is fixedly connected to the left end of the translation threaded rod by bolts. The top end of the translation seat is movably sleeved on the translation threaded rod by threads, and is movably sleeved on the sliding rod by sliding.

[0017] Preferably, the bending detection mechanism includes a first belt shaft, a second belt shaft, a third motor, a first transmission belt, a second transmission belt, a reciprocating wheel and a connecting arm, there are two first belt shafts and they are movably mounted on the inner bottom ends of the two support frames through bearings, there are two second belt shafts and they are movably mounted on the left and opposite ends of the two support frames through bearings, the third motor is fixedly mounted on the right bottom end of a support frame located at the rear end by bolts, and the output shaft of the third motor is fixedly connected to a first belt shaft located at the rear end by bolts, the two ends of the first transmission belt are movably sleeved on the two first belt shafts, and the second There are two transmission belts in total, and the top ends are movably connected to the left ends of the two second belt shafts outside the support frame, and the bottom ends are movably connected to the left ends of the two first belt shafts outside the support frame. There are two reciprocating wheels in total, which are respectively located at the internal top ends of the two support frames, and are respectively fixedly installed on one end of the two second belt shafts located on the support frames by bolts. There are two connecting arms in total, which are respectively located at the internal top ends of the two support frames, and one end close to the second belt shaft is movably installed on the side of the reciprocating wheel away from the second belt shaft through a rotating shaft, and away from the second belt shaft. The end of the connecting arm away from the second belt shaft is movably connected to the end of the reciprocating rod close to the reciprocating wheel through a rotating shaft.

[0018] Compared with the prior art, the present invention has the following beneficial effects:

[0019] The present invention adjusts the spacing between each group of placement columns and uses a pressing block to fix the semiconductor chip, so that the placed semiconductor chip can be evenly stressed during the pin quality inspection. The outer tooth plate is first controlled to translate and contact the pin, and then the inner clamping plate is controlled to translate and contact the pin. The pin is clamped by the outer tooth plate and the inner clamping plate, so that the device can be applied to semiconductor chips of different sizes, thereby improving the universal applicability of the device. After the pin is clamped, the movable frame is driven to descend and cooperate with the tension sensor to realize the tension quality inspection of multiple pins at one time, which not only reduces the labor intensity, but also pulls down the pins for inspection at the same time, and the force applied to the pins is the same, so that the reliability of the inspection data is improved. The reciprocating rod is controlled to translate and extend to realize the bending quality inspection of the semiconductor chip pins, and the pins can be inspected one by one according to the same standard, which not only improves the accuracy of the inspection data, but also effectively improves the efficiency of the semiconductor chip pin quality inspection. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The drawings herein are incorporated into the specification and constitute a part of the specification, showing embodiments consistent with the present disclosure, and together with the specification, are used to explain the principles of the present disclosure. Obviously, the drawings described below are only some embodiments of the present disclosure, and for ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work. In the drawings:

[0021] Figure 1 Provides an overall structural diagram for an embodiment of the present invention;

[0022] Figure 2 A schematic diagram of the back-end structure of a device provided in an embodiment of the present invention;

[0023] Figure 3 A schematic diagram of a chip placement mechanism provided by an embodiment of the present invention;

[0024] Figure 4 A schematic diagram of a chip fixing mechanism provided by an embodiment of the present invention;

[0025] Figure 5 A schematic diagram of the connection between the pin clamping mechanism and the tension detection mechanism provided in an embodiment of the present invention;

[0026] Figure 6 A schematic diagram of the internal structure of a movable frame provided by an embodiment of the present invention;

[0027] Figure 7 A schematic diagram of a bending detection mechanism provided in an embodiment of the present invention;

[0028] Figure 8 A schematic diagram of the internal structure of a support frame provided in an embodiment of the present invention.

[0029] In the figure: 1, base; 2, support column; 3, chip placement mechanism; 301, support rail; 302, upper guard plate; 303, support seat; 304, placement column; 305, connecting plate; 306, partition; 307, two-way threaded rod; 308, first handle; 4, chip fixing mechanism; 401, lifting plate; 402, lower pressure block; 403, lifting frame; 404, lifting threaded rod; 405, second handle; 5, pin clamping mechanism; 501, movable frame; 502, outer clamping plate; 503, outer tooth plate; 504, first gear; 505, first transmission rod; 506, first worm gear; 507, first worm; 508, inner clamping plate; 509, inner tooth plate; 510, second gear; 511, second transmission rod; 512, Second worm gear; 513, second worm; 6, tension detection mechanism; 601, first fixed seat; 602, tension sensor; 603, bottom plate; 604, movable groove; 605, tension detection threaded rod; 606, screw sleeve; 607, first bevel gear; 608, first motor; 609, second bevel gear; 7, bending detection mechanism; 701, second fixed seat; 702, sliding rod; 703, translation threaded rod; 704, second motor; 705, translation seat; 706, support frame; 707, first belt shaft; 708, second belt shaft; 709, third motor; 710, first transmission belt; 711, second transmission belt; 712, reciprocating wheel; 713, connecting arm; 714, reciprocating rod; 715, pressure sensor. DETAILED DESCRIPTION

[0030] In order to make the purpose, technical solutions and advantages of the present disclosure clearer, the present disclosure will be further described in detail below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present disclosure, rather than all of the embodiments. Based on the embodiments in the present disclosure, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present disclosure.

[0031] The terms used in the embodiments of the present disclosure are only for the purpose of describing specific embodiments, and are not intended to limit the present disclosure. The singular forms "a", "said" and "the" used in the embodiments of the present disclosure and the appended claims are also intended to include plural forms, unless the context clearly indicates other meanings, and "multiple" generally includes at least two, and other quantifiers are similar.

[0032] It should be understood that, although the terms first, second, third, etc. may be used to describe in the disclosed embodiments, these descriptions should not be limited to these terms. These terms are only used to distinguish the described objects. For example, without departing from the scope of the disclosed embodiments, the first may also be referred to as the second, and similarly, the second may also be referred to as the first. In addition, the terms "first", "second", "third", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0033] In the description of the present disclosure, it should be noted that, unless otherwise clearly specified and limited, the terms "connected" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0034] It should also be noted that the term "includes", "comprising" or any other variation thereof is intended to cover non-exclusive inclusion, so that a commodity or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such commodity or device. In the absence of more restrictions, the elements defined by the sentence "comprising a ..." do not exclude the existence of other identical elements in the commodity or device including the elements.

[0035] The optional embodiments of the present disclosure are described in detail below with reference to the accompanying drawings.

[0036] See also Figures 1 to 8 , the present invention provides a technical solution: a semiconductor chip package finished product pin quality inspection equipment, comprising a base 1, the top four corners of the base 1 are fixed with support columns 2 by bolts;

[0037] The chip placement mechanism 3 includes a support seat 303 and a placement column 304. There are two support seats 303, which are movably arranged on the left and right sides of the four support columns 2. There are two groups of placement columns 304, each with two columns, which are fixedly installed on the front and rear top ends of the two support seats 303 by bolts.

[0038] The chip fixing mechanism 4 includes a lifting plate 401 and a pressing block 402. The lifting plates 401 are two in total and both ends are movably sleeved on the four supporting columns 2.

[0039] The pin clamping mechanism 5 includes a movable frame 501, and the movable frame 501 is movably arranged outside a group of placement columns 304 located at the front end;

[0040] The tension detection mechanism 6 includes a first fixing seat 601 and a tension sensor 602. There are two first fixing seats 601, which are respectively fixedly sleeved on the two support columns 2 at the front end by bolts. There are two tension sensors 602, which are respectively fixedly installed between the two first fixing seats 601 and the movable frame 501 by bolts.

[0041] The bending detection mechanism 7 includes a support frame 706, a reciprocating rod 714 and a pressure sensor 715. There are two support frames 706 and they are movably arranged on both sides of the two placement columns 304 located at the rear end. There are two reciprocating rods 714 and they are movably installed on one end of the two support frames 706 close to the placement column 304 by insertion. There are two pressure sensors 715 and they are fixedly arranged in one end of the two reciprocating rods 714 close to the placement column 304.

[0042] The chip placement mechanism 3 includes a support rail 301, an upper guard plate 302, a connecting plate 305, a partition 306, a bidirectional threaded rod 307 and a first turning handle 308. There are two support rails 301, which are fixedly installed at the bottom ends of the front and rear groups of support columns 2 by bolts respectively. The upper guard plate 302 is fixedly installed in the middle of the top ends of the two support rails 301 by bolts. The front and rear bottom ends of the two support seats 303 are both installed in the two support rails 301 by sliding movement, and are respectively located on both sides of the upper guard plate 302. The top of the placement column 304 is fixedly bonded with a placement seat. The lower pressure block 402 and the placement seat are both made of rubber material. There are two connecting plates 305, which are fixedly installed between the two ends of the two support rails 301 by bolts respectively. There are two partitions 306 and The two ends are fixedly installed on the opposite side of the two support rails 301 by bolts, and are respectively located on the two sides of the upper guard plate 302. The two ends of the two-way threaded rod 307 are respectively movably installed in the middle of the two connecting plates 305 by bearings. The two-way threaded rod 307 is movably installed in the middle of the two partitions 306 by insertion. There are two first turning handles 308, which are respectively fixedly installed on the two ends of the two-way threaded rod 307 by bolts. The two-way threaded rod 307 is driven to rotate by the first turning handle 308, and the two support seats 303 are driven to move relative to or away from each other at the same time by the two-way threaded rod 307. The support seat 303 drives the placement column 304 to move. After adjusting the horizontal position of the placement seat by the placement column 304, the semiconductor chip can be placed on the two placement seats.

[0043] The chip fixing mechanism 4 also includes a lifting frame 403, a lifting threaded rod 404 and a second turning handle 405. There are two lower pressing blocks 402, which are respectively fixed and bonded in the middle of the bottom ends of the two lifting plates 401. The bottom end of the lifting frame 403 is fixedly installed in the middle of the top ends of the two lifting plates 401 by bolts. The top ends of the four supporting columns 2 are fixedly installed with a top plate by bolts. The top end of the lifting threaded rod 404 is movably installed in the middle of the top plate by a bearing. The bottom end of the lifting threaded rod 404 is movably installed in the middle of the top plate by threaded insertion. The second turning handle 405 is fixedly installed on the top end of the lifting threaded rod 404 by bolts. The lifting threaded rod 404 is driven to rotate by the second turning handle 405. When the lifting threaded rod 404 rotates, the lifting plate 401 is driven to descend by the lifting frame 403, so that the lower pressing block 402 follows the lifting plate 401 to descend. At this time, the lower pressing block 402 moves toward the placement seat until the lower pressing block 402 contacts the top end of the semiconductor chip and the semiconductor chip is pressed tightly. At this time, the semiconductor chip is firmly placed in the device.

[0044] The pin clamping mechanism 5 includes an outer clamping plate 502, an outer tooth plate 503, a first gear 504, a first transmission rod 505, a first worm wheel 506, a first worm 507 and an inner clamping plate 508. There are two outer clamping plates 502, and both ends are movably mounted on the front and rear sides of the two ends of the movable frame 501 through sliding, and are located between the two outer clamping plates 502. There are two groups of outer tooth plates 503, each with two pieces, and are fixedly mounted on the bottom and top ends of the two outer clamping plates 502 through bolts. There are two first gears 504, which are movably mounted between the two groups of outer tooth plates 503 through meshing. Both ends of the first transmission rod 505 are movably mounted on both sides of the movable frame 501 through bearings, and are located on the front sides of the two front placement columns 304. The two first gears 504 are fixedly sleeved on the first transmission rod 505 by bolts. The first worm gear 506 is fixedly sleeved on the end of the first transmission rod 505 located on the left side of the movable frame 501 by bolts, the first worm 507 is movably installed on the left side of the movable frame 501 through a bearing, and is movably connected with the first worm gear 506 through meshing, and there are two inner clamping plates 508, and both ends are respectively movably installed on the front and rear sides of the two ends of the movable frame 501 through sliding movements; the first worm gear 507 drives the first worm gear 506 to rotate, so that the first transmission rod 505 rotates with the first worm gear 506, and the first transmission rod 505 drives the two first gears 504 to rotate. When the two first gears 504 rotate, the two outer clamping plates 502 are driven to move simultaneously in the direction close to the semiconductor chip pins through the two sets of outer tooth plates 503, until the two outer clamping plates 502 both contact the outer sides of the semiconductor chip pins and stop;

[0045] The pin clamping mechanism 5 includes an inner tooth plate 509, a second gear 510, a second transmission rod 511, a second worm wheel 512 and a second worm 513. There are two groups of inner tooth plates 509, each group has two pieces, and they are fixedly mounted on the bottom and top ends of the two inner clamping plates 508 on opposite sides of the two ends by bolts. There are two second gears 510, which are movably mounted between the two groups of inner tooth plates 509 by meshing. The two ends of the second transmission rod 511 are movably mounted on both sides of the movable frame 501 through bearings, and are located on the rear sides of the two front placement columns 304. The two second gears 510 are both fixedly sleeved on the second transmission rod 511 by bolts. The second worm wheel 512 is fixedly sleeved on the second transmission rod 511 by bolts and is located outside the right side of the movable frame 501 At one end, the second worm 513 is movably installed on the right side of the movable frame 501 through a bearing, and is movably connected with the second worm gear 512 through meshing; the second worm 513 drives the second worm gear 512 to rotate, so that the second transmission rod 511 rotates following the second worm gear 512, and the second transmission rod 511 drives the two second gears 510 to rotate. When the two second gears 510 rotate, the two sets of inner tooth plates 509 drive the two inner clamping plates 508 to move toward the direction close to the semiconductor chip pin at the same time, until the two inner clamping plates 508 both contact the inner side of the semiconductor chip pin and stop, and then the first worm 507 and the second worm 513 are rotated at the same time, so that the semiconductor chip pin is clamped by the outer clamping plate 502 and the inner clamping plate 508;

[0046] The tension detection mechanism 6 includes a bottom plate 603, a movable groove 604, a tension detection threaded rod 605, a screw sleeve 606, a first bevel gear 607, a first motor 608 and a second bevel gear 609. The bottom plate 603 is fixedly installed in the middle of the bottom end of the movable frame 501 by bolts. There are two movable grooves 604 and both penetrate the bottom plate 603, and are respectively movably sleeved on the outside of the two placement columns 304 located at the front end. The top of the tension detection threaded rod 605 is fixedly installed in the middle of the bottom end of the bottom plate 603 by bolts. The screw sleeve 606 is movably installed in the middle of a support rail 301 located at the front end through a bearing, and is inserted and installed in the middle of the front end of the upper guard plate 302. The bottom end of the tension detection threaded rod 605 is movably installed in the screw sleeve 606 through threaded insertion. The first bevel gear 607 is fixedly sleeved on the bottom end of the screw sleeve 606 by bolts, the first motor 608 is fixedly installed on the bottom end of the support rail 301 located at the front end by bolts, the second bevel gear 609 is fixedly sleeved on the output shaft of the first motor 608 by bolts, and the second bevel gear 609 is movably connected with the first bevel gear 607 by meshing; the second bevel gear 609 is driven to rotate by the first motor 608, and the screw sleeve 606 is driven to rotate by the first bevel gear 607. When the screw sleeve 606 rotates, the movable frame 501 is driven to descend by the tension detection threaded rod 605, so that the outer clamping plate 502 and the inner clamping plate 508 are both lowered with the movable frame 501, at this time, tension is generated on the pins of the semiconductor chip, and the tension value is detected by the tension sensor 602;

[0047] The bending detection mechanism 7 includes a second fixed seat 701, a slide bar 702, a translation threaded rod 703, a second motor 704 and a translation seat 705. There are two second fixed seats 701, which are respectively fixedly sleeved on the two support columns 2 at the rear end by bolts and are located above the support seat 303. The slide bar 702 is fixedly installed between the two second fixed seats 701 at one end close to the movable frame 501 by bolts. The two ends of the translation threaded rod 703 are respectively movably installed between the two second fixed seats 701 at one end away from the slide bar 702 by bearings. The second motor 704 The second motor 704 is fixedly mounted on the rear end of the second fixed seat 701 at the left end by bolts, the output shaft of the second motor 704 is fixedly connected to the left end of the translation threaded rod 703 by bolts, the top of the translation seat 705 is movably sleeved on the translation threaded rod 703 by threads, and is movably sleeved on the slide bar 702 by sliding; the second motor 704 drives the translation threaded rod 703 to rotate, when the translation threaded rod 703 rotates, the translation seat 705 is driven to translate on the translation threaded rod 703 and the slide bar 702, and the two support frames 706 are driven to translate at the same time by the translation seat 705;

[0048] The bending detection mechanism 7 includes a first belt shaft 707, a second belt shaft 708, a third motor 709, a first transmission belt 710, a second transmission belt 711, a reciprocating wheel 712 and a connecting arm 713. There are two first belt shafts 707, which are movably mounted on the inner bottom ends of the two support frames 706 through bearings, two second belt shafts 708, which are movably mounted on the left and opposite ends of the two support frames 706 through bearings, and the third motor 709 is fixedly mounted on the right bottom end of a support frame 706 located at the rear end by bolts, and the third motor 709 The output shaft is fixedly connected to a first belt shaft 707 located at the rear end by bolts, and the two ends of the first transmission belt 710 are respectively movably sleeved on the two first belt shafts 707. There are two second transmission belts 711, and the top ends are respectively movably sleeved on the left ends of the two second belt shafts 708 located outside the support frame 706, and the bottom ends are respectively movably sleeved on the left ends of the two first belt shafts 707 located outside the support frame 706. There are two reciprocating wheels 712, which are respectively located at the inner top ends of the two support frames 706 and are respectively fixedly installed on the two second belt shafts 708 by bolts. Located at one end of the support frame 706, there are two connecting arms 713, which are respectively located at the inner top of the two support frames 706, and one end close to the second belt shaft 708 is movably installed on the side of the reciprocating wheel 712 away from the second belt shaft 708 through a rotating shaft, and away from the second belt shaft 708, the end of the connecting arm 713 away from the second belt shaft 708 is movably connected to the end of the reciprocating rod 714 close to the reciprocating wheel 712 through a rotating shaft; through the first transmission belt 710 and the second transmission belt 711, the second belt shafts 708 at the top of the two support frames 706 are driven to rotate simultaneously, so that The reciprocating wheel 712 rotates, and when the reciprocating wheel 712 rotates, the reciprocating rod 714 is driven to move into the support frame 706 through the connecting arm 713. After the reciprocating wheel 712 is driven to rotate half a circle by controlling the third motor 709, the reciprocating rod 714 moves into the support frame 706. At this time, the second motor 704 is controlled to drive the reciprocating rod 714 to move between the first pin and the second pin, and then the third motor 709 is controlled to drive the reciprocating wheel 712 to rotate half a circle, so that the reciprocating rod 714 extends from the support frame 706, and then the steps for detecting a pin are repeated in a cycle.

[0049] Working principle: When the present invention is used, two semiconductor chips to be tested for the quality of the pins of the packaged finished product need to be placed in the device first. However, due to the different sizes of different semiconductor chips, the spacing between the two sets of placement columns 304 needs to be adjusted so that after the semiconductor chips are placed and tested, the chips can maintain uniform force. Therefore, it is necessary to rotate the first handle 308, and the bidirectional threaded rod 307 is driven to rotate by the first handle 308, and the two support seats 303 are driven to move relative to or opposite to each other at the same time by the bidirectional threaded rod 307, and the placement columns 304 are driven by the support seats 303 to move relative to or opposite to each other. 4 moves, after adjusting the horizontal position of the placement seat by the placement column 304, the semiconductor chip can be placed on the two placement seats, and then the second turning handle 405 is turned, and the lifting threaded rod 404 is driven to rotate by the second turning handle 405. When the lifting threaded rod 404 rotates, the lifting plate 401 is driven to descend by the lifting frame 403, so that the lower pressing block 402 follows the lifting plate 401 to descend, and at this time, the lower pressing block 402 moves toward the placement seat until the lower pressing block 402 contacts the top of the semiconductor chip, and the semiconductor chip is pressed tightly, so that the semiconductor chip is firmly placed in the device;

[0050] After the semiconductor chips are placed, the tension quality of the pins of the semiconductor chip at the front end is tested, and the bending quality of the pins of the semiconductor chip at the back end is tested;

[0051] When the pins of the semiconductor chip are subjected to the tensile quality inspection, the first worm 507 is first rotated, and the first worm wheel 506 is driven to rotate by the first worm 507, so that the first transmission rod 505 rotates following the first worm wheel 506, and the two first gears 504 are driven to rotate by the first transmission rod 505. When the two first gears 504 rotate, the two outer clamping plates 502 are driven to move toward the pins of the semiconductor chip at the same time by the two sets of outer tooth plates 503, until the two outer clamping plates 502 both contact the outer sides of the pins of the semiconductor chip and stop, and then the second worm 513 is rotated, and the second worm 513 is driven by the second The worm 513 drives the second worm gear 512 to rotate, so that the second transmission rod 511 rotates with the second worm gear 512, and the two second gears 510 are driven to rotate by the second transmission rod 511. When the two second gears 510 rotate, the two sets of inner tooth plates 509 drive the two inner clamping plates 508 to move toward the semiconductor chip pins at the same time, until the two inner clamping plates 508 both contact the inner side of the semiconductor chip pins and stop, and then the first worm 507 and the second worm 513 are rotated at the same time, so that the semiconductor chip pins are clamped by the outer clamping plate 502 and the inner clamping plate 508;

[0052] When the pins of the semiconductor chip are clamped, the first motor 608 is started, and the second bevel gear 609 is driven to rotate by the first motor 608, and the screw sleeve 606 is driven to rotate by the first bevel gear 607. When the screw sleeve 606 rotates, the tension detection threaded rod 605 drives the movable frame 501 to descend, so that the outer clamping plate 502 and the inner clamping plate 508 are both lowered with the movable frame 501. At this time, a tension is generated on the pins of the semiconductor chip, and the tension value is detected by the tension sensor 602.

[0053] When testing the pin tension of a semiconductor chip, a rated tension value may be set first. When the tension generated by the movable frame 501 moving downward to pull the pin reaches the rated value, the movable frame 501 is controlled to stop. At this time, the connection between the pin and the semiconductor chip may be observed and determined. In addition, the pin may be pulled until the connection between the pin and the chip is broken, and the maximum tension value may be obtained to obtain the maximum tension value that the pin can withstand after being connected to the chip.

[0054] When the bending quality of the pins of the semiconductor chip is tested, the distance between the reciprocating rod 714 and the first pin is first adjusted according to the spacing of the pins in the semiconductor chip to be tested, so that the distance between the reciprocating rod 714 and the first pin is equal to half of the pin spacing. Therefore, the second motor 704 is started first, and the second motor 704 drives the translation threaded rod 703 to rotate. When the translation threaded rod 703 rotates, it drives the translation seat 705 to translate on the translation threaded rod 703 and the slide bar 702, and the two support frames 706 are driven to translate at the same time by the translation seat 705, so that the reciprocating rod 714 follows the support frame 706 to move to the set position, and then the test is carried out, and the second motor 704 is controlled to start again, so that the reciprocating rod 714 translates to contact the pin, and the pressure sensor 715 is driven by the reciprocating rod 714 to move and contact the pin to bend it, and the pressure sensor 715 can be used to obtain the bending of the pin. The pressure during bending, when the pin is bent, the third motor 709 is started to drive a first belt shaft 707 located at the rear end to rotate, and through the first transmission belt 710 and the second transmission belt 711, the second belt shaft 708 at the top of the two support frames 706 is driven to rotate at the same time, so that the reciprocating wheel 712 rotates, when the reciprocating wheel 712 rotates, the reciprocating rod 714 is driven to move into the support frame 706 through the connecting arm 713, and after the reciprocating wheel 712 is driven to rotate half a circle by controlling the third motor 709, the reciprocating rod 714 moves into the support frame 706, at this time, the second motor 704 is controlled to drive the reciprocating rod 714 to move between the first pin and the second pin, and then the third motor 709 is controlled to drive the reciprocating wheel 712 to rotate half a circle, so that the reciprocating rod 714 extends out from the support frame 706, and then the steps for detecting a pin are repeated in a cycle.

[0055] The above embodiments are only used to illustrate the technical solutions of the present disclosure, rather than to limit them. Although the present disclosure has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present disclosure.

Claims

1. A semiconductor chip package finished product lead quality inspection device, comprising a base (1), wherein support columns (2) are fixedly mounted at the four corners of the top of the base (1) by bolts, and characterized in that: A chip placement mechanism (3), the chip placement mechanism (3) comprising a support seat (303) and a placement column (304), the support seats (303) having two in total and being movably arranged on the left and right sides inside the four support columns (2), and the placement columns (304) having two in total and two in each group, and being fixedly mounted on the front and rear top ends of the two support seats (303) respectively; A chip fixing mechanism (4), the chip fixing mechanism (4) comprising a lifting plate (401) and a lower pressing block (402), the lifting plate (401) comprising two pieces and two ends of which are movably sleeved on four supporting columns (2); A pin clamping mechanism (5), the pin clamping mechanism (5) comprising a movable frame (501), the movable frame (501) being movably arranged outside a group of placement columns (304) located at the front end; A tension detection mechanism (6), the tension detection mechanism (6) comprising a first fixing seat (601) and a tension sensor (602), the first fixing seats (601) being two in total and being respectively fixedly sleeved on two support columns (2) located at the front end, and the tension sensors (602) being two in total and being respectively fixedly installed between the two first fixing seats (601) and the movable frame (501); A bending detection mechanism (7), the bending detection mechanism (7) comprising a support frame (706), a reciprocating rod (714) and a pressure sensor (715), wherein the support frames (706) are two in total and are movably arranged on both sides of two placement columns (304) located at the rear end, the reciprocating rods (714) are two in total and are movably installed on one end of the two support frames (706) close to the placement column (304), and the pressure sensors (715) are two in total and are fixedly arranged in one end of the two reciprocating rods (714) close to the placement column (304).

2. The semiconductor chip package finished product lead quality inspection device according to claim 1, characterized in that: The chip placement mechanism (3) comprises a support rail (301), an upper guard plate (302), a connecting plate (305), a partition plate (306), a bidirectional threaded rod (307) and a first turning handle (308). There are two support rails (301) and they are fixedly mounted on the bottom ends of the front and rear groups of support columns (2) by bolts respectively. The upper guard plate (302) is fixedly mounted in the middle of the top ends of the two support rails (301) by bolts. The front and rear bottom ends of the two support seats (303) are both mounted in the two support rails (301) by sliding movement and are respectively located on both sides of the upper guard plate (302). The top end of the placement column (304) is fixedly bonded with the placement seat. The lower pressing block (40 2) and the placement seat are both made of rubber material, there are two connecting plates (305) and they are fixedly installed between the two ends of the two support rails (301) by bolts, there are two partitions (306) and their two ends are fixedly installed on the opposite side of the two support rails (301) by bolts, and are respectively located on the two sides of the upper guard plate (302), the two ends of the bidirectional threaded rod (307) are movably installed in the middle of the two connecting plates (305) by bearings, the bidirectional threaded rod (307) is movably installed in the middle of the two partitions (306) by insertion, and there are two first turning handles (308) and they are fixedly installed at the two ends of the bidirectional threaded rod (307) by bolts.

3. The semiconductor chip package finished product lead quality inspection device according to claim 2, characterized in that: The chip fixing mechanism (4) comprises a lifting frame (403), a lifting threaded rod (404) and a second turning handle (405); the lower pressing block (402) comprises two pieces and is respectively fixedly bonded to the middle of the bottom ends of the two lifting plates (401); the bottom end of the lifting frame (403) is fixedly mounted to the middle of the top ends of the two lifting plates (401) by bolts; the top ends of the four support columns (2) are fixedly mounted with a top plate by bolts; the top end of the lifting threaded rod (404) is movably mounted in the middle of the top plate by a bearing; the bottom end of the lifting threaded rod (404) is movably mounted in the middle of the lifting frame (403) by threaded insertion; and the second turning handle (405) is fixedly mounted to the top end of the lifting threaded rod (404) by bolts.

4. The semiconductor chip package finished product lead quality inspection device according to claim 3, characterized in that: The pin clamping mechanism (5) comprises an outer clamping plate (502), an outer tooth plate (503), a first gear (504), a first transmission rod (505), a first worm wheel (506), a first worm (507) and an inner clamping plate (508). The outer clamping plates (502) have two pieces, and both ends are respectively mounted on the front and rear sides of the two ends of the movable frame (501) through sliding movement, and are located between the two outer clamping plates (502). The outer tooth plates (503) have two groups, each group has two pieces, and are respectively fixed to the bottom and top ends of the two outer clamping plates (502) through bolts. The first gears (504) have two pieces, and are respectively mounted between the two groups of outer tooth plates (503) through meshing movement. The two ends of the first transmission rod (505) are movably mounted on both sides of the movable frame (501) through bearings and are located in front of the two front placement columns (304). The two first gears (504) are both fixedly sleeved on the first transmission rod (505) through bolts. The first worm wheel (506) is fixedly sleeved on the end of the first transmission rod (505) located on the left side of the movable frame (501) through bolts. The first worm gear (507) is movably mounted on the left side of the movable frame (501) through bearings and is movably connected to the first worm wheel (506) through meshing. The inner clamping plates (508) have two pieces in total and the two ends are movably mounted on the front and rear sides of the two ends of the movable frame (501) through sliding movement.

5. The semiconductor chip package finished product lead quality inspection device according to claim 4, characterized in that: The pin clamping mechanism (5) comprises an inner tooth plate (509), a second gear (510), a second transmission rod (511), a second worm wheel (512) and a second worm (513). The inner tooth plate (509) comprises two groups, each group comprising two pieces, which are respectively fixed by bolts at the bottom and top ends of opposite sides of two inner clamping plates (508). The second gear (510) comprises two groups, which are respectively installed between the two groups of inner tooth plates (509) by meshing. The two ends of the second transmission rod (511) are The second gears (510) are movably mounted on both sides of the movable frame (501) via bearings and are located at the rear sides of the two front placement columns (304). The two second gears (510) are both fixedly sleeved on the second transmission rod (511) via bolts. The second worm gear (512) is fixedly sleeved on one end of the second transmission rod (511) located outside the right side of the movable frame (501) via bolts. The second worm gear (513) is movably mounted on the right side of the movable frame (501) via bearings and is movably connected to the second worm gear (512) via meshing.

6. The semiconductor chip package finished product lead quality inspection device according to claim 5, characterized in that: The tension detection mechanism (6) comprises a base plate (603), a movable groove (604), a tension detection threaded rod (605), a screw sleeve (606), a first bevel gear (607), a first motor (608) and a second bevel gear (609); the base plate (603) is fixedly mounted in the middle of the bottom end of the movable frame (501) by means of bolts; there are two movable grooves (604) which penetrate the base plate (603) and are respectively movably sleeved on the outside of two placement columns (304) located at the front end; the top end of the tension detection threaded rod (605) is fixedly mounted in the middle of the bottom end of the base plate (603) by means of bolts; the screw sleeve (606) is fixedly mounted in the middle of the bottom end of the base plate (603) by means of a bearing The tension detection threaded rod (605) is movably mounted in the middle of a support rail (301) located at the front end, and is inserted and mounted in the middle of the front end of the upper guard plate (302); the bottom end of the tension detection threaded rod (605) is movably mounted in the threaded sleeve (606) by threaded insertion; the first bevel gear (607) is fixedly sleeved on the bottom end of the threaded sleeve (606) by bolts; the first motor (608) is fixedly mounted on the bottom end of the support rail (301) located at the front end by bolts; the second bevel gear (609) is fixedly sleeved on the output shaft of the first motor (608) by bolts; and the second bevel gear (609) is movably connected to the first bevel gear (607) by meshing.

7. The semiconductor chip package finished product lead quality inspection device according to claim 6, characterized in that: The bending detection mechanism (7) comprises a second fixed seat (701), a sliding rod (702), a translation threaded rod (703), a second motor (704) and a translation seat (705). The second fixed seats (701) are two in total and are respectively fixedly sleeved on two support columns (2) at the rear end by bolts and are located above the support seat (303). The sliding rod (702) is fixedly installed between the two second fixed seats (701) at one end close to the movable frame (501) by bolts. The translation threaded rod ( The two ends of the second fixing seat (703) are respectively movably mounted between the ends of the two second fixing seats (701) away from the sliding rod (702) through bearings, the second motor (704) is fixedly mounted on the rear end of the second fixing seat (701) located at the left end through bolts, the output shaft of the second motor (704) is fixedly connected to the left end of the translation threaded rod (703) through bolts, and the top end of the translation seat (705) is movably sleeved on the translation threaded rod (703) through threads, and is movably sleeved on the sliding rod (702) through sliding.

8. The semiconductor chip package finished product lead quality inspection device according to claim 7, characterized in that: The bending detection mechanism (7) comprises a first belt shaft (707), a second belt shaft (708), a third motor (709), a first transmission belt (710), a second transmission belt (711), a reciprocating wheel (712) and a connecting arm (713), wherein the first belt shafts (707) are two in total and are movably mounted on the inner bottom ends of the two support frames (706) through bearings, the second belt shafts (708) are two in total and are movably mounted on the left and opposite ends of the two support frames (706) through bearings, the third motor (709) is fixedly mounted on the right bottom end of a support frame (706) located at the rear end through bolts, and the output shaft of the third motor (709) is fixedly connected to a first belt shaft (707) located at the rear end through bolts, the two ends of the first transmission belt (710) are movably sleeved on the two first belt shafts (707), and the second transmission belt (7 11) There are two of them, and the top ends are movably sleeved on the left ends of the two second belt shafts (708) located outside the support frame (706), and the bottom ends are movably sleeved on the left ends of the two first belt shafts (707) located outside the support frame (706); there are two reciprocating wheels (712) respectively located at the top ends inside the two support frames (706), and are respectively fixedly installed on one end of the two second belt shafts (708) located on the support frame (706) by bolts; there are two connecting arms (713) respectively located at the top ends inside the two support frames (706), and one end close to the second belt shaft (708) is movably installed on the side of the reciprocating wheel (712) away from the second belt shaft (708) through a rotating shaft, and away from the second belt shaft (708); one end of the connecting arm (713) away from the second belt shaft (708) is movably connected to one end of the reciprocating rod (714) close to the reciprocating wheel (712) through a rotating shaft.

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