A thin-film capacitor and a production method

Abstract

The present invention relates to a thin-film capacitor and a production method, belonging to the field of capacitors. It includes a housing with a preset cavity; a plurality of capacitor cores distributed in the cavity of the housing; a first annular electrode plate arranged on one side of the capacitor core away from the bottom of the cavity for connecting the capacitor core to the outside; a second annular electrode plate arranged on one side of the capacitor core close to the bottom of the cavity for connecting the capacitor core to the outside; a heat dissipation plate arranged on the side of the second annular electrode plate away from the first annular electrode plate for heat dissipation; and a glue injection member arranged in the cavity. This application has the effect of improving the heat dissipation of the capacitor.

Description

Technical Field

[0001] The present invention relates to the field of capacitors, and in particular to a thin film capacitor and a production method. Background Art

[0002] A capacitor is an electronic component that can store electrical energy in an electric field. It consists of two conductors separated by an insulating medium and close to each other. It stores electrical energy by accumulating positive and negative charges on the two plates respectively during the charging process and releases electrical energy during discharge.

[0003] Currently in the industrial field, especially with the rise of emerging industries such as new energy vehicles and smart grids, the application of capacitors is becoming more and more extensive, and the demand for capacitors is also getting higher and higher. A capacitor includes a housing, a plurality of capacitance cores for storing and releasing charges, and a connecting plate. The housing is preset with a cavity for placing the capacitance cores, and the connecting plate is used to connect the plurality of capacitance cores. During the operation of the capacitor, the capacitance cores generate heat, and the heat is conducted to the housing through the connecting plate for heat dissipation.

[0004] When the capacitor generates heat during operation, since the capacitor only dissipates heat through the housing, when the capacitor operates for a long time, it is easy to cause slow heat dissipation speed, resulting in an increasing temperature of the capacitor. When the capacitor is in a high-temperature environment, it will lead to performance degradation and even cause accidents, with low safety. Summary of the Invention

[0005] In order to improve the heat dissipation effect of the capacitor, the present invention provides a thin film capacitor and a production method.

[0006] In a first aspect, the present invention provides a thin film capacitor, adopting the following technical solution:

[0007] A thin film capacitor, comprising:

[0008] A housing, preset with a cavity;

[0009] A plurality of capacitance cores, arranged and distributed in the cavity;

[0010] A first annular plate, arranged on a side of the capacitance core away from the bottom of the cavity;

[0011] A second annular plate, arranged on a side of the capacitance core close to the bottom of the cavity;

[0012] A heat dissipation plate, arranged on a side of the second annular plate away from the first annular plate;

[0013] A glue injection member, arranged in the cavity;

[0014] Both the first annular electrode plate and the second annular electrode plate are provided with a plurality of pins. On the side of the first annular electrode plate close to the second annular electrode plate, there are a plurality of fixing plates for fixing the pins. A plurality of placement grooves for placing the pins are provided on the inner side wall of the housing, and a plurality of heat dissipation grooves are provided on the outer side wall of the housing.

[0015] On the side of the first annular electrode plate close to the second annular electrode plate, there is a connecting plate for connecting the heat dissipation plate. A connecting groove for placing the connecting plate is provided on the second annular electrode plate. A plurality of fixing columns for connecting and fixing with the heat dissipation plate are provided on the connecting plate and the second annular electrode plate. Fixing holes for inserting and fixing the fixing columns are provided on the heat dissipation plate. A plate placement groove for placing the heat dissipation plate is provided on the housing.

[0016] By adopting the above technical solution, the first annular electrode plate and the second annular electrode plate located on both sides of the capacitor core are connected to the outside through pins, and heat is dissipated by means of the heat dissipation plate provided on one side of the second annular electrode plate. Among them, the heat dissipation grooves on the circumferential outer side wall of the housing can make the heat generated inside the capacitor be dissipated and transferred to the outside more quickly, thereby enhancing the heat dissipation effect.

[0017] Optionally, a plurality of the capacitor cores are arranged in two-layer circular rings. A plurality of U-shaped heat dissipation holes and circular heat dissipation holes for dissipating heat from the capacitor cores are provided on both the first annular electrode plate and the second annular electrode plate. A plurality of welding strips for fixing the capacitor cores are integrally provided on both the first annular electrode plate and the second annular electrode plate. The U-shaped heat dissipation holes and the circular heat dissipation holes both correspond to the welding strips. The inner-layer capacitor cores correspond to the circular heat dissipation holes, and the outer-layer capacitor cores correspond to two U-shaped heat dissipation holes.

[0018] By adopting the above technical solution, by arranging a plurality of capacitor cores in two-layer circular rings, a plurality of U-shaped and circular heat dissipation holes for dissipating heat from the capacitor cores are provided on the first annular electrode plate and the second annular electrode plate, and a plurality of welding strips for fixing the capacitor cores are integrally provided, so that the U-shaped and circular heat dissipation holes both correspond to the welding strips. The welding strips realize the electrical connection between the first annular electrode plate, the second annular electrode plate and the capacitor cores to ensure current conduction, reduce the contact resistance, and enhance the structural strength, assist heat conduction for heat dissipation, and realize the effective heat dissipation and stable fixation of the capacitor cores.

[0019] Optionally, central heat dissipation holes are provided on the first annular electrode plate and the second annular electrode plate. The central heat dissipation holes are located between two adjacent U-shaped heat dissipation holes corresponding to the same capacitor core. Additional heat dissipation holes are provided on the first annular electrode plate and the second annular electrode plate. The additional heat dissipation holes correspond to the gaps between adjacent capacitor cores. A central positioning hole for injecting and positioning the glue injection part is provided on the first annular electrode plate.

[0020] By adopting the above technical solution, the first annular electrode plate and the second annular electrode plate are provided with a central heat dissipation hole and additional heat dissipation holes. At the same time, the first annular electrode plate is provided with a central positioning hole, which enhances the heat dissipation effect of the capacitor core and provides positioning for the injection of the potting part through the central positioning hole. The heat dissipation holes on the first annular electrode plate and the second annular electrode plate accelerate heat convection and increase the heat dissipation area, thereby improving the heat dissipation efficiency of the capacitor and enhancing the overall performance and assembly convenience.

[0021] In a second aspect, the present application provides a production method of a thin film capacitor, which is applied to a thin film capacitor according to the first aspect, and adopts the following technical solution:

[0022] Obtain capacitor reference information and production image information in a preset production area;

[0023] Retrieve annular electrode plate information based on the capacitor reference information;

[0024] Determine the hole position distribution information according to the annular electrode plate information;

[0025] Determine whether the preset stain feature is included in the production image information;

[0026] If the preset stain feature is included in the production image information, then frame out the stain image according to the production image information;

[0027] Determine the cutting adjustment position according to the hole position distribution information and the stain feature, and perform cutting based on the cutting adjustment position by a preset cutting and punching method to obtain the first annular electrode plate and the second annular electrode plate;

[0028] If the preset stain feature is not included in the production image information, then determine the punching and cutting position according to the hole position distribution information, and perform cutting based on the punching and cutting position by a preset cutting and punching method to obtain the first annular electrode plate and the second annular electrode plate.

[0029] By adopting the above technical solution, the annular electrode plate information is retrieved from the reference information to determine the hole position distribution information and the punching types, and then it is judged whether there is a stain feature in the production image information. If there is a stain feature, the cutting adjustment position is analyzed and determined and the electrode plates are obtained by cutting according to the preset cutting and punching method; if there is no stain feature, the punching and cutting position is determined according to the hole position distribution information and the first annular electrode plate and the second annular electrode plate are obtained by cutting according to the preset cutting and punching method, ensuring that the first annular electrode plate and the second annular electrode plate can effectively assist the capacitor core in heat dissipation when forming a thin film capacitor subsequently, and improving the overall heat dissipation performance of the capacitor.

[0030] Optionally, the method for confirming the cutting adjustment position includes:

[0031] Determine the stain position and stain area based on the stain image;

[0032] Determine the number of stains based on the stain position;

[0033] Determine whether the number of stains is greater than 1;

[0034] If the number of stains is greater than 1, determine the offset position according to the hole position distribution information by a preset offset analysis method, and use the offset position as the cutting adjustment position;

[0035] If the number of stains is not greater than 1, determine the coverage range of the first electrode plate and the punching position of the first electrode plate according to the hole position distribution information;

[0036] Determine whether the stain area falls within the coverage range of the first electrode plate;

[0037] If the stain area falls within the coverage range of the first electrode plate, determine the punching area of the first electrode plate and the punching area of the second electrode plate according to the annular electrode plate information;

[0038] Determine whether the stain area is smaller than the punching area of the first electrode plate;

[0039] If the stain area is smaller than the punching area of the first electrode plate, determine the cutting adjustment position according to the stain position and the punching position of the first electrode plate;

[0040] If the stain area is not smaller than the punching area of the first electrode plate, determine the second cutting position and use it as the cutting adjustment position or control by avoiding distance according to the judgment result of whether the stain area is smaller than the punching area of the second electrode plate;

[0041] If the stain area does not fall within the coverage range of the first electrode plate, use the punching position of the first electrode plate as the cutting adjustment position.

[0042] By adopting the above technical solution, analyze the number of stains. If the number of stains exceeds 1, determine the offset position by offset analysis and use it as the cutting adjustment position; if the number of stains is 1, analyze according to the position and area of the stain, choose to cover the stain and then continue punching or adjust the punching position and then continue punching to ensure that the punching position of the annular electrode plate is accurate in the case of stains, so that the subsequent formed thin film capacitor can effectively assist the capacitor core in heat dissipation through these punchings and maintain good overall heat dissipation performance.

[0043] Optionally, the offset analysis method includes:

[0044] Determine the comprehensive coverage range of the electrode plate, the punching distribution position and the hole position distribution area according to the hole position distribution information;

[0045] Determine whether the stain position falls within the comprehensive coverage range of the electrode plate;

[0046] If the stain position falls within the comprehensive coverage range of the electrode plates, select the stain position according to the stain area to obtain the stain selection position, and use the stain positions other than the stain selection position as the remaining stain positions. Define the area corresponding to the stain selection position as the stain selection area, and define the area corresponding to the remaining stain positions as the remaining stain area;

[0047] Select the punching distribution position according to the stain selection area and the hole position distribution area and use it as the punching selection position;

[0048] Calculate the distance between the rust selection position and the remaining stain positions and use it as the rust separation distance value;

[0049] Determine the remaining punching positions according to the punching selection position and the rust separation distance value, and use the punching selection position and the remaining punching positions as the cutting adjustment positions;

[0050] Determine the excess stain information according to the remaining stain positions, the remaining punching positions, and the remaining stain area, and remove it using a preset stain removal method;

[0051] If the stain position does not fall within the comprehensive coverage range of the electrode plates, determine the hole punching positions according to the hole position distribution information, and use the punching positions as the cutting adjustment positions.

[0052] By adopting the above technical solution, the offset analysis method is to improve the analysis of the rust position and the positions that need to be punched, so as to select the largest punching position that can cover the stains, and use this position as the cutting adjustment position for punching, so that the subsequent formed thin film capacitor can effectively assist the capacitor core in heat dissipation through these punched holes and maintain good overall heat dissipation performance.

[0053] Optionally, the stain removal method includes:

[0054] Retrieve the excess stain positions and the excess stain area based on the excess stain information;

[0055] Determine the types of excess stains according to the production image information and the excess stain positions;

[0056] When the type of excess stain is a preset raised foreign object, determine the grinding position according to the excess stain positions;

[0057] Control a preset grinding device to grind the grinding position;

[0058] When the type of excess stain is a preset rust type, determine the rust value according to the excess stain area;

[0059] Determine the laser value according to the rust value;

[0060] Determine the removal path according to the excess stain positions;

[0061] Control the preset removal device to remove rust by removing the path and laser value.

[0062] By adopting the above technical solution, the types of redundant stains are determined through the production image information. If it is a raised foreign object, grinding is performed. If it is rust, laser removal is performed, effectively removing different types of redundant stains and effectively dealing with different types of redundant stains.

[0063] Optionally, the cutting and punching method includes:

[0064] Determine the punching type according to the annular plate information;

[0065] Determine the circular hole cutting position, U-hole cutting position and other hole cutting positions according to the punching type and the punching position database;

[0066] Determine the U-hole area and circular hole area according to the punching type and the preset punching area database;

[0067] Determine the number and length of U-hole welding bars according to the U-hole area;

[0068] Determine the number and length of circular hole welding bars according to the circular hole area;

[0069] Determine the number of U-holes, circular holes and other holes according to the annular plate information;

[0070] Determine the U-hole cutting path according to the U-hole welding bar position, U-hole cutting position, U-hole area, number of U-holes, number of circular hole welding bars and length of circular hole welding bars;

[0071] Determine the circular hole cutting path according to the circular hole welding bar position, circular hole cutting position, length of circular hole welding bars, number of circular holes, number of circular hole welding bars and length of circular hole welding bars;

[0072] Determine the other hole cutting path according to the other hole cutting position and the number of other holes;

[0073] Control the preset punching device to punch holes according to the circular hole cutting path, U-hole cutting path and other hole cutting positions, and perform bending by the preset bending method after punching.

[0074] By adopting the above technical solution, the U-shaped heat dissipation holes, circular heat dissipation holes and other holes are cut along different paths. Among them, the U-shaped heat dissipation holes and circular heat dissipation holes have corresponding welding bars respectively, realizing precise punching processing of the annular plate, making the hole distribution and specifications on the manufactured annular plate reasonable, effectively assisting the heat dissipation of the capacitor core, ensuring that the film capacitor has good heat dissipation performance and meeting its heat dissipation requirements during operation.

[0075] Optionally, the bending method includes:

[0076] Retrieve model information based on capacitor reference information;

[0077] Determine the bending position, bending angle, and bending hardness according to the model information;

[0078] Determine the bending force according to the bending angle and bending hardness;

[0079] Control the preset bending device to bend the bending position with the bending force and bending degree, and re-obtain the production image information after bending;

[0080] Determine whether the production image information contains preset abnormal bending features;

[0081] If not, complete the bending, and control the preset clamping device to clamp the first annular electrode plate and the second annular electrode plate to the preset assembly area for assembly;

[0082] If so, determine the crack value according to the production image information;

[0083] Determine whether the crack value is less than the preset reference repair interval;

[0084] If the crack value is less than the reference repair interval, determine the repair parameters according to the crack value, control the preset welding device to repair with the repair parameters, and after repair, control the preset clamping device to clamp the first annular electrode plate and the second annular electrode plate to the preset assembly area for assembly;

[0085] If the crack value is not less than the reference repair interval, control the preset clamping device to clamp the first annular electrode plate and the second annular electrode plate to the preset waste area.

[0086] By adopting the above technical solutions, determine the bending parameters according to the model information and perform bending. After bending, re-obtain the production image information. When there are abnormal bending features, determine the crack value. When the crack value is less than the reference repair interval, determine the repair parameters and perform welding repair, and then send the two electrode plates to the assembly area, realizing effective control of the bending quality of the annular electrode plate.

[0087] Optionally, it further includes the step of controlling the preset clamping device to clamp the first annular electrode plate and the second annular electrode plate to the preset assembly area for assembly:

[0088] Control the preset welding device to weld the U-hole welding strip position and the round hole welding strip position of the first annular electrode plate to the capacitor core;

[0089] Control the preset manipulator to abut the second annular electrode plate against the capacitor core and obtain the assembly image information;

[0090] Determine the spacing detection value according to the assembly image information;

[0091] Determine the pin pitch value according to the annular plate information;

[0092] Determine the pitch adjustment value according to the pitch detection value and the pin pitch value;

[0093] Control the preset clamping device to rotate and adjust the second annular plate by the pitch adjustment value;

[0094] Control the preset welding device to weld the U-hole welding strip position and the round-hole welding strip position of the second annular plate to the capacitor core;

[0095] Obtain the housing installation position of the housing and the heat dissipation plate apex position of the heat dissipation plate;

[0096] Determine the housing assembly position according to the housing installation position and the heat dissipation plate apex position, and control the preset clamping device to install and cover the housing at the housing installation position.

[0097] By adopting the above technical solutions, control the welding device to weld the U-hole and round-hole welding strip positions of the first annular plate to the capacitor core, then use the manipulator to make the second annular plate abut against the capacitor core and obtain the assembly image information, determine the pitch detection value through this information, combine with the pin pitch value in the annular plate information to determine the pitch adjustment value, and finally rotate and adjust the second annular plate according to this value and weld the welding strip positions of its U-hole and round-hole to the capacitor core, and complete the installation and covering of the housing according to the housing installation position, ensuring the structural stability and electrical connection reliability of the capacitor, and laying a foundation for good heat dissipation and stable overall performance.

[0098] In summary, the present application includes at least one of the following beneficial technical effects:

[0099] 1. When producing the electrode plate, determine whether there are stains. When there are stains and the quantity is large or the area is large, re-determine the punching position, punch and cover a part of the stains to reduce the stain area. After punching and covering a part of the stains, first determine the type of the remaining stains. If it is a raised foreign object, grind it. If it is rust, remove it by laser, so that the subsequent formed thin film capacitor can effectively assist the capacitor core in heat dissipation through these punched holes and maintain good overall heat dissipation performance;

[0100] 2. After removing the stains, punch holes along different paths, and bend after punching, thereby improving the production quality of the capacitor and enhancing the heat dissipation effect after punching;

[0101] 3. After the electrode plate is manufactured, it is assembled with other components to complete the production of the thin film capacitor, thereby ensuring the structural stability and electrical connection reliability of the capacitor, and laying a foundation for good heat dissipation and stable overall performance. Description of the Drawings

[0102] Figure 1 is an overall explosion schematic diagram of the thin-film capacitor according to an embodiment of the present application;

[0103] Figure 2 is an explosion schematic diagram of the first annular electrode plate and the second annular electrode plate of the heat dissipation plate of the thin-film capacitor according to an embodiment of the present application.

[0104] The names of the parts referred to by the respective numerical labels in the above drawings are as follows: 1. Outer shell; 2. Capacitor core; 3. First annular electrode plate; 4. Second annular electrode plate; 5. Heat dissipation plate; 6. Glue injection part; 7. Pin; 8. Fixing plate; 9. Placing groove; 10. Connecting plate; 11. Connecting groove; 12. Fixing column; 13. Fixing hole; 14. Plate placing groove; 15. U-shaped heat dissipation hole; 16. Circular heat dissipation hole; 17. Welding strip; 18. Central heat dissipation hole; 19. Additional heat dissipation hole; 20. Central positioning hole; 21. Heat dissipation groove. Detailed implementation manners

[0105] The present invention will be further described in detail below with reference to the drawings and embodiments.

[0106] Referring to Figure 1 , an embodiment of the present application discloses a thin-film capacitor, including: an outer shell 1, a capacitor core 2, a first annular electrode plate 3, a second annular electrode plate 4, and a heat dissipation plate 5. A plurality of capacitor cores 2 are provided and are evenly distributed in the cavity of the outer shell 1, and the plurality of capacitor cores 2 are arranged in two-layer circular rings. The first annular electrode plate 3 is provided on one side of the capacitor core 2, the second annular electrode plate 4 is provided on the side of the capacitor core 2 away from the first annular electrode plate 3, and a plurality of fixing plates 8 are annularly distributed on the side of the first annular electrode plate 3 facing the second annular electrode plate 4. A plurality of pins 7 for connecting to the outside are provided on the side edges of both the first annular electrode plate 3 and the second annular electrode plate 4. The pins 7 of the first annular electrode plate 3 face away from the second annular electrode plate 4, and the pins 7 of the first annular electrode plate 3 are welded to the fixing plates 8. The pins 7 of the second annular electrode plate 4 face the first annular electrode plate 3. Through the fixing plates 8 integrally provided on the first annular electrode plate 3, it is convenient to fix the pins 7. In this embodiment, 18 capacitor cores 2 are provided, 6 in the inner layer and 12 in the outer layer.

[0107] Referring to Figure 1 And Figure 2, both the first annular electrode plate 3 and the second annular electrode plate 4 are provided with U-shaped heat dissipation holes 15 and circular heat dissipation holes 16 for dissipating heat from the capacitor core 2. The inner capacitor core 2 corresponds to the circular heat dissipation holes 16, and the outer capacitor core 2 corresponds to two U-shaped heat dissipation holes 15, thereby realizing the heat dissipation of the capacitor core 2. Both the first annular electrode plate 3 and the second annular electrode plate 4 are integrally provided with a plurality of welding strips 17 for fixing the capacitor core 2. The U-shaped heat dissipation holes 15 and the circular heat dissipation holes 16 both correspond to the welding strips 17. Among them, the U-shaped heat dissipation holes 15 correspond to one welding strip 17 and are evenly distributed on the side of the first annular electrode plate 3 and the second annular electrode plate 4 close to the edge. The circular heat dissipation holes 16 correspond to four welding strips 17 and are evenly distributed in the circular heat dissipation holes 16, realizing the effective combination of heat dissipation and fixing functions. A plurality of central heat dissipation holes 18 are provided on the first annular electrode plate 3 and the second annular electrode plate 4. The central heat dissipation holes 18 are located in the middle of two adjacent U-shaped heat dissipation holes 15 corresponding to the same capacitor core 2, further enhancing the heat dissipation effect. A plurality of additional heat dissipation holes 19 are also provided on the two electrode plates. The additional heat dissipation holes 19 correspond to the gaps between adjacent capacitor cores 2. A central positioning hole 20 for positioning is provided at the middle position of the first annular electrode plate 3. In this embodiment, there are 6 circular heat dissipation holes 16, 24 U-shaped heat dissipation holes 15, 12 central heat dissipation holes 18, 6 additional heat dissipation holes 19, and 1 central positioning hole 20 on the first annular electrode plate 3. There are 26 U-shaped heat dissipation holes 15, 13 central heat dissipation holes 18, and 4 additional heat dissipation holes 19 on the second annular electrode plate 4.

[0108] Referring to Figure 1 and Figure 2 , a connecting plate 10 is integrally provided on the side of the first annular electrode plate 3 close to the second annular electrode plate 4. The connecting plate 10 is L-shaped. A connecting groove 11 for the part of the connecting plate 10 far from the first annular electrode to be placed idle is provided on the second annular electrode plate 4. A plurality of fixing columns 12 are welded on both the connecting plate 10 and the side of the second annular electrode plate 4 far from the first annular electrode plate 3. Fixing holes 13 for the fixing columns 12 to be inserted are provided on the heat dissipation plate 5, thereby installing and fixing the heat dissipation plate 5 on the connecting plate 10 and the second annular electrode plate 4. The heat dissipation plate 5 undertakes the heat dissipation function, ensuring that the heat generated during the operation of the capacitor can be dissipated in time and guaranteeing its stable performance.

[0109] Referring to Figure 1 and Figure 2 , the housing 1 is preset with a cavity for placing the capacitor core 2, the first annular electrode plate 3 and the second annular electrode plate 4. A plate placing groove 14 for placing the heat dissipation plate 5 is also provided on the housing 1. The plate placing groove 14 is communicated with the cavity. Referring to Figure 1 and Figure 2, a plurality of placement grooves 9 are provided on the circumferential inner side wall of the outer shell 1. The placement grooves 9 are used to place the pins 7 of the first annular electrode plate 3 and the second annular electrode plate 4. A plurality of heat dissipation grooves 21 are provided on the circumferential outer side wall of the outer shell 1. The heat dissipation grooves 21 and the placement grooves 9 are arranged at intervals in turn. Through the heat dissipation grooves 21 and the placement grooves 9, the placement requirement of the pins 7 is satisfied, and the heat dissipation effect of the outer shell 1 can be enhanced.

[0110] Referring to Figure 1 and Figure 2 , the potting member 6 is injected into the cavity to fix and seal the internal components of the capacitor, enhancing the stability and protection performance of the capacitor.

[0111] Based on the same inventive concept, an embodiment of the present invention provides a method for detecting a thin film capacitor, including:

[0112] Step 100: Obtain the capacitor reference information and the production image information in the preset production area.

[0113] The capacitor reference information refers to the basic parameter information of the capacitor, which is obtained through pre-input. The capacitor reference information includes annular electrode plate information, model information, the installation position of the outer shell, and the top angle position of the heat dissipation plate. The production area refers to the area where the capacitor is produced, and the production area should be preset by the staff. The production image information refers to the image in the production area, which is obtained through the camera preset in the production area.

[0114] Step 101: Retrieve the annular electrode plate information based on the capacitor reference information.

[0115] The annular electrode plate information refers to the parameter information of the first annular electrode plate 3 and the second annular electrode plate 4. The annular electrode plate information includes hole position distribution information, punching types, the number of U-shaped holes, the number of round holes, the number of other holes, the pin pitch value, the punching area of the first electrode plate, the punching area of the second electrode plate, the pin length information, and the pin position information. By retrieving the annular electrode plate information from the capacitor reference information, the annular electrode plate information can be obtained.

[0116] Step 102: Determine the hole position distribution information according to the annular electrode plate information.

[0117] The hole position distribution information refers to the distribution information of the hole positions on the first annular electrode plate 3 and the second annular electrode plate 4. The hole position distribution information includes the punching and cutting position, the coverage range of the first electrode plate and the punching position of the first electrode plate, the comprehensive coverage range of the electrode plates, the punching distribution position, the hole position distribution area, the hole punching position, and the number of each hole. The punching type refers to the types of hole positions on the first annular electrode plate 3 and the second annular electrode plate 4. The punching types include U-shaped heat dissipation holes, circular heat dissipation holes, and other round holes. There are two different sizes of holes in the other round holes. By retrieving the hole position distribution information and the punching types from the annular electrode plate information, the hole position distribution information and the punching types can be obtained.

[0118] Step 103: Determine whether the production image information contains a preset stain feature.

[0119] The stain feature refers to the feature of stains on the surface when producing the first annular electrode plate 3 and the second annular electrode plate 4, and the stain feature is preset by the staff. By judging whether the production image information contains the preset stain feature, it is determined whether punching and cutting can be directly performed.

[0120] Step 1030: If the production image information contains the preset stain feature, then select the stain image according to the production image information.

[0121] The stain image refers to a photo of the stain. If the production image information contains the preset stain feature, it means that there are stains that need to be removed. Then, the image that meets the stain feature is selected from the production image information according to the stain feature, so as to obtain the stain image.

[0122] Step 104: Determine the cutting adjustment position according to the hole position distribution information and the stain feature, and perform cutting based on the cutting adjustment position by a preset cutting and punching method to obtain the first annular electrode plate 3 and the second annular electrode plate 4.

[0123] The cutting adjustment position refers to the cutting position after cutting adjustment for the first annular electrode plate 3 and the second annular electrode plate 4. By analyzing the hole position distribution information and the stain image, the cutting adjustment position is determined. The confirmation method of the cutting adjustment position is from step 200 to step 305, and cutting is performed based on the cutting adjustment position by a preset cutting and punching method to obtain the first annular electrode plate 3 and the second annular electrode plate 4. The cutting and punching method refers to the cutting method for punching the first annular electrode plate 3 and the second annular electrode plate 4. The cutting and punching method is from step 500 to step 509.

[0124] Step 1031: If the production image information does not contain the preset stain feature, then determine the punching and cutting position according to the hole position distribution information, and perform cutting based on the punching and cutting position by a preset cutting and punching method to obtain the first annular electrode plate 3 and the second annular electrode plate 4.

[0125] The punching and cutting position refers to the position for punching and cutting the first annular electrode plate 3 and the second annular electrode plate 4. If the production image information does not contain the preset stain feature, it means that there are no stains and normal punching and cutting can be performed. Then, the punching and cutting position is retrieved from the hole position distribution information, so as to obtain the punching and cutting position, and cutting is performed based on the punching and cutting position by a preset cutting and punching method to obtain the first annular electrode plate 3 and the second annular electrode plate 4.

[0126] In step 104, in order to further ensure the rationality of the cutting adjustment position, it is necessary to perform a further separate analysis and calculation on the cutting adjustment position. The method for confirming the cutting adjustment position includes:

[0127] Step 200: Determine the stain position and stain area based on the stain image.

[0128] The stain position refers to the position where the stain appears identified in the production image information, and the stain position includes all positions corresponding to the stains. The stain area refers to the area where the stain appears identified in the production image information, and the stain area includes the areas corresponding to all stain positions. A coordinate system is established in the copper bar image, and the stain position and stain area are determined by the position and area covered by the stain features in the coordinate system.

[0129] Step 201: Determine the number of stains based on the stain position.

[0130] The number of stains is determined by analyzing and calculating the number of each stain in the stain position.

[0131] Step 202: Determine whether the number of stains is greater than 1.

[0132] By judging whether the number of stains is greater than 1, it is determined whether there are multiple stains.

[0133] Step 2020: If the number of stains is greater than 1, determine the offset position according to the hole position distribution information by a preset offset analysis method, and use the offset position as the cutting adjustment position.

[0134] The offset position refers to the position corresponding to the offset from the original reference position during punching. If the number of stains is greater than 1, it means there are multiple stains, then determine the offset position according to the hole position distribution information by a preset offset analysis method, and use the offset position as the cutting adjustment position. The offset analysis method refers to the method of offsetting the punching position from the original reference position due to the appearance of stains during punching. The offset analysis method is steps 300 to 305.

[0135] Step 2021: If the number of stains is not greater than 1, determine the coverage range of the first electrode plate and the punching position of the first electrode plate according to the hole position distribution information.

[0136] The coverage range of the first electrode plate refers to the area covered by the first annular electrode plate 3 on the production material during the production process. The punching position of the first electrode plate refers to the position where the first annular electrode plate 3 needs to be punched during the production process. If the number of stains is not greater than 1, it means there is only one stain, then retrieve the coverage range of the first electrode plate and the punching position of the first electrode plate from the hole position distribution information, so as to obtain the coverage range of the first electrode plate and the punching position of the first electrode plate.

[0137] Step 203: Determine whether the stain area falls within the coverage range of the first electrode plate.

[0138] By judging whether the stain area falls within the coverage range of the first electrode plate, it is determined whether there is an impact on the first annular electrode plate 3.

[0139] Step 2030: If the stain area falls within the coverage range of the first electrode plate, determine the drilling area of the first electrode plate and the drilling area of the second electrode plate according to the annular electrode plate information.

[0140] The drilling area of the first electrode plate refers to the coverage area of the U-shaped heat dissipation holes 15, circular heat dissipation holes 16, central heat dissipation holes 18, additional heat dissipation holes 19 and central positioning holes 20 on the first annular electrode plate 3. The drilling area of the second electrode plate refers to the coverage area of the U-shaped heat dissipation holes 15, central heat dissipation holes 18 and additional heat dissipation holes 19 on the second annular electrode plate 4. If the stain area falls within the coverage range of the first electrode plate, it means that the stain has an impact on the production of the first annular electrode plate 3, and then the drilling area of the first electrode plate and the drilling area of the second electrode plate are retrieved through the annular electrode plate information.

[0141] Step 204: Determine whether the stain area is smaller than the drilling area of the first electrode plate.

[0142] By judging whether the stain area is smaller than the drilling area of the first electrode plate, it is determined whether the stain can be removed by drilling.

[0143] Step 2040: If the stain area is smaller than the drilling area of the first electrode plate, determine the cutting adjustment position according to the stain position and the drilling position of the first electrode plate.

[0144] If the stain area is smaller than the drilling area of the first electrode plate, it means that the stain can be covered by drilling. Then, position analysis is carried out based on the stain position and the drilling position of the first electrode plate, and the sizes of all drilling areas are compared. The drilling position that can cover the stain to the greatest extent is used as the cutting adjustment position.

[0145] Step 2041: If the stain area is not smaller than the drilling area of the first electrode plate, determine the second cutting position as the cutting adjustment position or the avoidance distance for control according to the judgment result of whether the stain area is smaller than the drilling area of the second electrode plate.

[0146] If the stain area is not smaller than the drilling area of the first electrode plate, it means that the stain is too large and cannot be covered by drilling. Then, according to the judgment result of whether the stain area is smaller than the drilling area of the second electrode plate, determine the second cutting position as the cutting adjustment position or the avoidance distance for control. The specific judgment method is from Step 205 to Step 206.

[0147] Step 205: When the stain area is smaller than the punching area of the second electrode plate, determine the second cutting position according to the annular electrode plate information, and define the second cutting position as the cutting adjustment position.

[0148] The second cutting position refers to the cutting position when punching the second annular electrode plate 4. When the stain area is smaller than the punching area of the second electrode plate, it indicates that the hole positions of the second annular electrode plate 4 can cover the stain. Then, retrieve the second cutting position through the annular electrode plate information and define the second cutting position as the cutting adjustment position.

[0149] Step 206: When the stain area is not less than the punching area of the second electrode plate, perform processing with a preset offset analysis method.

[0150] When the stain area is not less than the punching area of the second electrode plate, it indicates that the hole positions of the second annular electrode plate 4 cannot cover the stain either. Then, perform processing with a preset offset analysis method.

[0151] Step 2031: If the stain area does not fall within the coverage range of the first electrode plate, use the punching position of the first electrode plate as the cutting adjustment position.

[0152] If the stain area does not fall within the coverage range of the first electrode plate, it indicates that the stain does not affect the production of the electrode plate. Then, use the punching position of the first electrode plate as the cutting adjustment position.

[0153] In Step 206 and Step 2020, in order to cover a part of the stain by punching, it is necessary to perform further separate analysis and calculation on the punching position. The offset analysis method includes:

[0154] Step 300: Determine the comprehensive coverage range of the electrode plate, the punching distribution position, and the hole position distribution area according to the hole position distribution information.

[0155] The comprehensive coverage range of the electrode plate refers to the range area that the first annular electrode plate 3 and the second annular electrode plate 4 need to cover on the material. The punching distribution position refers to the distribution of all hole positions that need to perform punching operations. The hole position distribution area refers to the area corresponding to each punching repair that needs to perform punching operations. Retrieve the comprehensive coverage range of the electrode plate, the punching distribution position, and the hole position distribution area from the hole position distribution information.

[0156] Step 301: Determine whether the stain position falls within the comprehensive coverage range of the electrode plate.

[0157] By judging whether the stain position falls within the comprehensive coverage range of the electrode plate, it is determined whether the stain needs to be removed.

[0158] Step 3010: If the stain position falls within the comprehensive coverage range of the electrode plates, select the stain position according to the stain area to obtain the stain selection position, and take the stain positions other than the stain selection position as the stain remaining positions. Define the area corresponding to the stain selection position as the stain selection area, and define the area corresponding to the stain remaining positions as the stain remaining area.

[0159] The stain selection position refers to the position selected for punching among the various stain positions. The stain selection area refers to the area of the stain corresponding to the position where punching is performed. The stain remaining area refers to the area of each stain position corresponding to the stain positions after removing the stain selection position from the stain positions. The stain remaining positions refer to the stain positions other than the stain selection position as the stain remaining positions. If the stain position falls within the comprehensive coverage range of the electrode plates, it indicates that the position of the stain affects the production of the first annular electrode plate 3 and the second annular electrode plate 4. Then, analyze and select the stain with the largest area within the range where punching can be performed through the stain area, take the position corresponding to the largest area of the stain as the stain selection position, take the stain positions other than the stain selection position as the stain remaining positions, define the area corresponding to the stain selection position as the stain selection area, and define the area corresponding to the stain remaining positions as the stain remaining area.

[0160] Step 302: Select the punching distribution position according to the stain selection area and the hole position distribution area and use it as the punching selection position.

[0161] The punching selection position refers to the position where punching is reselected due to the presence of stains. Analyze through the stain selection area and the hole position distribution area, select the punching position that can reduce the stain area the most, and use this punching position as the punching selection position.

[0162] Step 303: Calculate the distance between the rust selection position and the stain remaining positions and use it as the rust separation distance value.

[0163] The rust separation distance value refers to the distance between the rust selection position and the stain remaining positions. Calculate the difference between the distances of the rust selection position and the stain remaining positions, and use this difference as the rust separation distance value.

[0164] Step 304: Determine the punching remaining positions according to the punching selection position and the rust separation distance value, and use the punching selection position and the punching remaining positions as the cutting adjustment positions.

[0165] The punching remaining positions refer to the remaining punching positions after determining the punching selection position. Analyze and calculate through the punching selection position and the rust separation distance value to obtain the punching remaining positions, and use the punching selection position and the punching remaining positions as the cutting adjustment positions.

[0166] Step 305: Determine the redundant stain information based on the remaining stain position, remaining punching position, and remaining stain area, and remove it using a preset stain removal method.

[0167] The redundant stain information refers to the area and position of the remaining stains except for those covered by the punched holes. The redundant stain information includes the redundant stain position and the redundant stain area. The redundant neural network model is obtained by the staff pre-inputting different remaining stain positions, remaining punching positions, and remaining stain areas and then training. Input different remaining stain positions, remaining punching positions, and remaining stain areas into the preset redundant neural network model for training and analysis to obtain the redundant stain information, and remove it using a preset stain removal method. The stain removal method refers to the method of treating the stains on the first annular electrode plate 3 and the second annular electrode plate 4. The stain removal method is Steps 400 to 407.

[0168] Step 3011: If the stain position does not fall within the comprehensive coverage range of the electrode plates, determine the punching position of the hole according to the hole position distribution information, and use the punching position as the cutting adjustment position.

[0169] If the stain position does not fall within the comprehensive coverage range of the electrode plates, it means that the stain will not affect the production of the first annular electrode plate 3 and the second annular electrode plate 4. Then, retrieve the punching position of the hole through the hole position distribution information, and use the punching position as the cutting adjustment position.

[0170] In Step 305, in order not to let the stain affect the production of the capacitor, it is necessary to treat the stain on the electrode plate. The stain removal method includes:

[0171] Step 400: Retrieve the redundant stain position and the redundant stain area based on the redundant stain information.

[0172] Retrieve the redundant stain position and the redundant stain area through the redundant stain information to obtain the redundant stain position and the redundant stain area.

[0173] Step 401: Determine the type of redundant stain according to the production image information and the redundant stain position.

[0174] The type of redundant stain refers to the type of stain on the production material. The type of redundant stain includes the type with uneven raised foreign objects on the surface and the type with rust on the surface. Different types of redundant stains corresponding to the stains in the production image information are stored in the type database. The type database is pre-set by the staff and will not be elaborated here. Input the production image information corresponding to the redundant stain position into the preset type database to obtain the type of redundant stain.

[0175] Step 402: When the type of redundant stain is the preset raised foreign object, determine the grinding position according to the redundant stain position.

[0176] The raised foreign object refers to an object that appears in the production image reflected by the production image information and is higher than the normal surface at the position where the stain is excessive. The grinding position refers to the specific position where the raised foreign object needs to be removed by the grinding process. When the type of excessive stain is a preset raised foreign object, it indicates that there is an uneven raised foreign object on the surface, and the position where the stain is excessive is used as the grinding position.

[0177] Step 403: Control a preset grinding device to grind the grinding position.

[0178] The grinding device is a surface grinding machine, which is preset by the staff. Control the grinding device to grind the grinding position to eliminate the raised foreign object.

[0179] Step 404: When the type of excessive stain is a preset rust type, determine the rust value according to the excessive stain area.

[0180] The rust type refers to the type of rust that appears on the electrode plate, and the rust type is preset by the staff. The rust value is a numerical index indicating the degree of surface rust. Different rust values corresponding to different excessive stain areas are stored in the rust database, which is preset by the staff and will not be elaborated here. When the type of excessive stain is a preset rust type, it indicates a stain. Input the excessive stain area into the preset rust database to obtain the rust value.

[0181] Step 405: Determine the laser value according to the rust value.

[0182] The laser value refers to the laser parameter for removing rust. Different laser values corresponding to different rust values are stored in the laser database, which is preset by the staff and will not be elaborated here. Input the rust value into the laser database to obtain the laser value.

[0183] Step 406: Determine the removal path according to the excessive stain position.

[0184] The removal path refers to the path when removing rust. The path neural network model is obtained by the staff pre-inputting different excessive stain positions and training. Input the excessive stain position into the preset path neural network model for training and analysis to obtain the removal path.

[0185] Step 407: Control a preset removal device to remove the rust with the removal path and the laser value.

[0186] The removal device is a laser rust remover, which is preset by the staff. Control the laser rust remover to remove the rust on the electrode plate with the removal path and the laser value.

[0187] In steps 104 and 1031, in order to further complete the production of the middle plates of the capacitor, the cutting and punching method includes:

[0188] Step 500: Determine the punching types according to the annular plate information.

[0189] The punching types refer to the types of hole positions on the first annular plate 3 and the second annular plate 4. The punching types include U-shaped heat dissipation holes, circular heat dissipation holes, and other round holes. The other round holes include the central heat dissipation hole 18, the additional heat dissipation hole 19, and the central positioning hole 20. By retrieving the hole position distribution information and punching types from the annular plate information, the hole position distribution information and punching types are obtained.

[0190] Step 501: Determine the cutting positions of round holes, U-hole cutting positions, and other hole cutting positions according to the punching types and the punching position database.

[0191] The punching position database stores the cutting positions corresponding to different punching types, including the cutting positions of round holes, U-hole cutting positions, and other hole cutting positions, which are determined by different punching types. The punching position database is preset by the staff. The cutting position of the round hole refers to the cutting position of the circular heat dissipation hole on the first annular plate 3 and the second annular plate. The U-hole cutting position refers to the cutting position of the U-shaped heat dissipation hole on the first annular plate 3 and the second annular plate. The cutting position of the other hole refers to the cutting position of the central positioning hole 20, the additional heat dissipation hole 19, and the central heat dissipation hole 18 on the first annular plate 3 and the second annular plate.

[0192] Step 502: Determine the U-hole area and the round hole area according to the punching types and the preset punching area database.

[0193] The punching area database stores the areas that need to be punched corresponding to different punching types, including the U-hole area and the round hole area. The U-hole area refers to the area that needs to be punched for the U-shaped heat dissipation hole. The round hole area refers to the area that needs to be punched for the circular heat dissipation hole. The punching types are input into the punching area database to obtain the U-hole area and the round hole area.

[0194] Step 503: Determine the number of U-hole welding strips and the length of the U-hole welding strips according to the U-hole area.

[0195] The number of U-hole welding strips refers to the number of welding strips 17 on the U-shaped heat dissipation hole. The U-hole welding strip 17 refers to the length of the welding strip 17 on the U-shaped heat dissipation hole. The U-hole database stores the number of U-hole welding strips and the length of the U-hole welding strips corresponding to different U-hole areas. The U-hole database is preset by the staff and will not be elaborated here. The U-hole area is input into the preset U-hole database to obtain the number of U-hole welding strips and the length of the U-hole welding strips.

[0196] Step 504: Determine the number and length of the circular hole welding bars based on the area of the circular holes.

[0197] The number of circular hole welding bars refers to the number of welding bars 17 on the circular heat dissipation holes. The length of the circular hole welding bars refers to the length of the welding bars 17 on the circular heat dissipation holes. In the circular hole database, the number and length of the circular hole welding bars corresponding to different circular hole areas are stored. The circular hole database is preset by the staff and will not be elaborated here. Input the circular hole area into the preset circular hole database to obtain the number and length of the circular hole welding bars.

[0198] Step 505: Determine the number of U-shaped holes, the number of circular holes, and the number of other holes based on the annular plate information.

[0199] The number of U-shaped holes refers to the number of U-shaped heat dissipation holes on the first annular plate 3 and the second annular plate 4. The number of circular holes refers to the number of circular heat dissipation holes on the first annular plate 3 and the second annular plate 4. The number of other holes refers to the number of other circular holes on the first annular plate 3 and the second annular plate 4. Retrieve the number of U-shaped holes, the number of circular holes, and the number of other holes through the annular plate information to obtain the number of U-shaped holes, the number of circular holes, and the number of other holes.

[0200] Step 506: Determine the U-shaped hole cutting path based on the U-shaped hole welding bar position, U-shaped hole cutting position, U-shaped hole area, number of U-shaped holes, number of circular hole welding bars, and length of the circular hole welding bars.

[0201] The U-shaped hole cutting path refers to the cutting path when cutting the U-shaped heat dissipation holes. In the U-shaped hole cutting database, the U-shaped hole cutting paths corresponding to different U-shaped hole welding bar positions, U-shaped hole cutting positions, U-shaped hole areas, number of U-shaped holes, number of circular hole welding bars, and length of the circular hole welding bars are stored. The U-shaped hole cutting database is preset by the staff and will not be elaborated here. Input the U-shaped hole welding bar position, U-shaped hole cutting position, U-shaped hole area, number of U-shaped holes, number of circular hole welding bars, and length of the circular hole welding bars into the preset U-shaped hole cutting database to obtain the U-shaped hole cutting path.

[0202] Step 507: Determine the circular hole cutting path based on the circular hole welding bar position, circular hole cutting position, length of the circular hole welding bars, number of circular holes, number of circular hole welding bars, and length of the circular hole welding bars.

[0203] The circular hole cutting path refers to the cutting path when cutting circular heat dissipation holes. In the circular hole cutting database, there are stored circular hole cutting paths corresponding to different circular hole welding bar positions, circular hole cutting positions, circular hole welding bar lengths, circular hole quantities, circular hole welding bar quantities, and circular hole welding bar lengths. The circular hole cutting database is preset by the staff and will not be elaborated here. Input the circular hole welding bar position, circular hole cutting position, circular hole welding bar length, circular hole quantity, circular hole welding bar quantity, and circular hole welding bar length into the circular hole cutting database to obtain the circular hole cutting path.

[0204] Step 508: Determine the other hole cutting path according to the other hole cutting position and the other hole quantity.

[0205] The other hole cutting path refers to the cutting path when cutting other circular holes. In the other hole cutting database, there are stored other hole cutting paths corresponding to different other hole cutting positions and other hole quantities. The other hole cutting database is preset by the staff and will not be elaborated here. Input the other hole cutting position and the other hole quantity into the preset other hole cutting database to obtain the other hole cutting path.

[0206] Step 509: Control the preset punching device to punch holes according to the circular hole cutting path, U-hole cutting path, and other hole cutting positions, and perform bending by the preset bending method after punching.

[0207] The punching device is a laser drilling machine, which is preset by the staff. Control the laser drilling machine to punch holes according to the circular hole cutting path, U-hole cutting path, and other hole cutting positions to obtain U-shaped heat dissipation holes, circular heat dissipation holes, and other circular holes, and perform bending by the preset bending method after punching. The bending method refers to the production of the fixing plate 8 on the first annular electrode plate 3. The bending method is from step 600 to step 605.

[0208] In step 509, in order to further complete the production of the first annular electrode plate 3 and the second annular electrode plate 4 in the capacitor, the bending method includes:

[0209] Step 600: Retrieve the model information based on the capacitor reference information.

[0210] The capacitor reference information contains the model information, so the model information is retrieved through the capacitor reference information.

[0211] Step 601: Determine the bending position, bending angle, and bending hardness according to the model information.

[0212] The bending position refers to the position on the first annular electrode plate 3 where specific bending operations need to be performed. The bending angle refers to the angle formed by the bent part in the two states before and after the bending operation when the first annular electrode plate 3 is bent. The bending hardness refers to the ability of the material to resist deformation during the bending operation. The model information includes the bending position, bending angle, and bending hardness, so that the bending position, bending angle, and bending hardness can be retrieved through the model information.

[0213] Step 602: Determine the bending force according to the bending angle and bending hardness.

[0214] The bending force refers to the magnitude of the force that needs to be applied during the bending operation of manufacturing the first annular electrode plate 3 to make the object reach a specific bending angle and overcome the bending hardness of the object itself. Different bending angles and the corresponding bending forces for bending hardness are stored in the force database, which is pre-set by the staff and will not be elaborated here. The bending angle and bending hardness are input into the pre-set force database to obtain the bending force.

[0215] Step 603: Control the pre-set bending device to bend the bending position with the bending force and bending degree, and re-obtain the production image information after bending.

[0216] The bending device is a numerically controlled bending machine, which is pre-set by the staff. Control the numerically controlled bending machine to bend the bending position with the bending force and bending degree to obtain the fixed plate 8 of the first annular electrode plate 3, and re-obtain the production image information after bending.

[0217] Step 604: Determine whether the production image information contains pre-set abnormal bending features.

[0218] The abnormal bending feature refers to the characteristic performance that does not meet the normal bending process requirements and quality standards of the capacitor electrode plate, and the abnormal bending feature is pre-set by the staff. By judging whether the production image information contains the pre-set abnormal bending feature, it is determined whether the bending is standard.

[0219] Step 6040: If not, complete the bending, control the pre-set welding device to weld the pins 7 to the first annular electrode plate 3 and the second annular electrode plate 4 respectively, and control the pre-set clamping device to clamp the first annular electrode plate 3 and the second annular electrode plate 4 to the pre-set assembly area for assembly.

[0220] The welding device is a welder, which is preset by the staff. The clamping device is a manipulator, which is preset by the staff. The assembly area refers to the area where the thin-film capacitor is assembled, which is preset by the staff. The pin length information refers to the length of the pins 7 of the first annular plate 3 and the second annular plate 4. The pin position information refers to the welding positions of the pins 7 of the first annular plate 3 and the second annular plate 4. If not included, indicating the bending standard, then the bending is completed. According to the annular plate information, the pin length information and the pin position information are retrieved. According to the pin length information, the lengths of the pins 7 of the first annular plate 3 and the second annular plate 4 are determined. The welder is controlled to weld the corresponding welding strips 17 of the first annular plate 3 to the welding positions of the corresponding pins 7 of the first annular plate 3 respectively. The welder is controlled to weld the corresponding welding strips 17 of the second annular plate 4 to the welding positions of the corresponding pins 7 of the second annular plate 4 respectively. After welding, the manipulator is controlled to clamp the first annular plate 3 and the second annular plate 4 to the preset assembly area for assembly.

[0221] Step 6041: If included, then determine the cracking value according to the production image information.

[0222] The cracking value refers to the degree of cracking that occurs after bending. Different cracking values corresponding to the cracking states of the production image information are stored in the cracking database. If included, indicating that there is a problem after bending, then the cracking state at the bending position in the production image information is analyzed, and the cracking state is input into the preset cracking database to determine the cracking value.

[0223] Step 605: Determine whether the cracking value is less than the preset reference repair range.

[0224] The reference repair range refers to the numerical range within which cracking can be repaired after bending, and the reference repair range is preset by the staff. By judging whether the cracking value is less than the preset reference repair range, it is determined whether repair is possible.

[0225] Step 6050: If the cracking value is less than the reference repair range, then determine the repair parameters according to the cracking value, control the preset welding device to perform repair with the repair parameters, and after repair, control the preset clamping device to clamp the first annular plate 3 and the second annular plate 4 to the preset assembly area for assembly.

[0226] The repair parameters refer to the amount of solution for repair. Different repair parameters corresponding to different cracking values are stored in the repair database, and the repair database is preset by the staff and will not be elaborated here. If the cracking value is less than the reference repair range, indicating that repair is possible, then the cracking value is input into the preset repair database to obtain the repair parameters.

[0227] Step 6051: If the crack value is not less than the reference repair range, control the preset clamping device to clamp the first annular electrode plate 3 and the second annular electrode plate 4 to the preset waste area.

[0228] The waste area refers to the placement area of the discarded parts, which is preset by the staff. If the crack value is not less than the reference repair range, it means that repair is impossible, so control the manipulator to clamp the first annular electrode plate 3 and the second annular electrode plate 4 to the preset waste area.

[0229] In step 6050, in order to further complete the production of the capacitor, it is necessary to assemble the parts. It also includes the step of controlling the preset clamping device to clamp the first annular electrode plate 3 and the second annular electrode plate 4 to the preset assembly area for assembly:

[0230] Step 700: Control the preset welding device to weld the U-hole welding strip position and the round-hole welding strip position of the first annular electrode plate 3 to the capacitor core 2.

[0231] Control the welder to weld the U-hole welding strip position and the round-hole welding strip position of the first annular electrode plate 3 to the capacitor core 2.

[0232] Step 701: Control the preset manipulator to abut the second annular electrode plate 4 against the capacitor core 2 and obtain assembly image information.

[0233] The assembly image information refers to the picture obtained by detecting the assembly area, and the assembly image information is obtained by the camera preset in the assembly area. Control the preset manipulator to place and abut the second annular electrode plate 4 against the capacitor core 2, with the pins 7 spaced apart from each other, and obtain the assembly image information through the camera.

[0234] Step 702: Determine the spacing detection value according to the assembly image information.

[0235] Establish a coordinate system in the assembly image information, analyze the distance between the pins 7 in the first annular electrode plate 3 and the second annular electrode plate 4 in the coordinate system to obtain the spacing, and use this spacing as the spacing detection value.

[0236] Step 703: Determine the pin spacing value according to the annular electrode plate information.

[0237] The pin spacing value refers to the standard spacing between the pins 7 in the first annular electrode plate 3 and the second annular electrode plate 4. The annular electrode plate information contains the pin spacing value, so the pin spacing value is retrieved through the annular electrode plate information.

[0238] Step 704: Determine the spacing adjustment value according to the spacing detection value and the pin spacing value.

[0239] The pitch adjustment value refers to the value required to adjust the current pitch so that the actual pitch reaches the pin pitch value. By analyzing and calculating the pitch detection value and the pin pitch value, the difference between the pitch detection value and the pin pitch value is obtained, and this difference is defined as the pitch adjustment value.

[0240] Step 705: Control the preset clamping device to rotate and adjust the second annular plate 4 by the pitch adjustment value.

[0241] Control the manipulator to rotate and adjust the second annular plate 4 by the pitch adjustment value, so as to adjust the pitch between the pins 7 until the required position is reached.

[0242] Step 706: Control the preset welding device to weld the U-hole welding strip position and the round-hole welding strip position of the second annular plate 4 to the capacitor core 2.

[0243] Control the welder to weld the U-hole welding strip position and the round-hole welding strip position of the second annular plate 4 to the capacitor core 2.

[0244] Step 707: Obtain the housing installation position of the housing 1 and the top corner position of the heat dissipation plate 5.

[0245] The housing installation position refers to the specific position where the housing 1 is installed and fixed. The installation slot on the housing 1 is docked with the heat dissipation plate 5. The housing installation position is obtained through the photo of the housing 1 obtained in real time by the camera preset in the assembly area. By analyzing the preset fixed corner features of the housing 1, the housing installation position is obtained. The fixed corner features of the housing 1 refer to the positions and morphological features of the four fixed corners on the housing 1, and the fixed corner features of the housing 1 are preset by the staff. The top corner position of the heat dissipation plate refers to the specific positions of the four top corners of the heat dissipation plate 5 in the product assembly space. The top corner position of the heat dissipation plate is obtained through the photo of the heat dissipation plate 5 obtained in real time by the camera preset in the assembly area. By analyzing the positions of the preset top corner features of the heat dissipation plate 5 in the picture, the top corner position of the heat dissipation plate is obtained. The top corner features refer to the positions and morphological features of the four top corners on the heat dissipation plate 5, and the top corner features are preset by the staff.

[0246] Step 708: Determine the assembly position of the housing 1 according to the housing installation position and the top corner position of the heat dissipation plate, and control the preset clamping device to install and cover the housing 1 at the housing installation position.

[0247] The assembly position of the housing 1 refers to the specific position where the housing 1 is covered with the heat dissipation plate 5. By analyzing the four top corners of the top corner position of the heat dissipation plate and the installation slot of the housing installation position, the assembly position of the housing 1 is obtained, and the manipulator is controlled to install and cover the housing 1 at the housing installation position, thus completing the assembly.

[0248] The above are only the preferred embodiments of the present invention, and the protection scope of the present invention is not limited to the above embodiments. All technical solutions falling within the concept of the present invention belong to the protection scope of the present invention. It should be noted that for those of ordinary skill in the art, several improvements and refinements made without departing from the principle of the present invention should also be regarded as within the protection scope of the present invention.

Claims

1. A production method of a thin film capacitor, characterized in that, Applied to a thin film capacitor: The thin film capacitor includes: A housing (1) preset with a cavity; A capacitor core (2), with several provided and distributed in the cavity; A first annular electrode plate (3), arranged on the side of the capacitor core (2) away from the bottom of the cavity; A second annular electrode plate (4), arranged on the side of the capacitor core (2) close to the bottom of the cavity; A heat dissipation plate (5), arranged on the side of the second annular electrode plate (4) away from the first annular electrode plate (3); A glue injection part (6), arranged in the cavity; Both the first annular electrode plate (3) and the second annular electrode plate (4) are provided with several pins (7). On the side of the first annular electrode plate (3) close to the second annular electrode plate (4), there are several fixing plates (8) for fixing the pins (7). On the inner side wall of the housing (1), there are several placement grooves (9) for placing the pins (7), and on the outer side wall of the housing (1), there are several heat dissipation grooves (21); On the side of the first annular electrode plate (3) close to the second annular electrode plate (4), there is a connecting plate (10) connecting the heat dissipation plate (5). On the second annular electrode plate (4), there is a connecting groove (11) for placing the connecting plate (10). On the connecting plate (10) and the second annular electrode plate (4), there are several fixing columns (12) connected and fixed to the heat dissipation plate (5). On the heat dissipation plate (5), there are fixing holes (13) for the fixing columns (12) to be inserted and fixed. On the housing (1), there is a plate placement groove (14) for placing the heat dissipation plate (5); Several of the capacitor cores (2) are arranged in a two - layer circular ring. Both the first annular electrode plate (3) and the second annular electrode plate (4) are provided with several U - shaped heat dissipation holes (15) and circular heat dissipation holes (16) for dissipating heat from the capacitor cores (2). Both the first annular electrode plate (3) and the second annular electrode plate (4) are integrally provided with several welding strips (17) for fixing the capacitor cores (2). The U - shaped heat dissipation holes (15) and the circular heat dissipation holes (16) both correspond to the welding strips (17). The inner - layer capacitor cores (2) correspond to the circular heat dissipation holes (16), and the outer - layer capacitor cores (2) correspond to two U - shaped heat dissipation holes (15); Both the first annular electrode plate (3) and the second annular electrode plate (4) are provided with a central heat dissipation hole (18). The central heat dissipation hole (18) is located in the middle of two adjacent U - shaped heat dissipation holes (15) corresponding to the same capacitor core (2). Both the first annular electrode plate (3) and the second annular electrode plate (4) are provided with additional heat dissipation holes (19). The additional heat dissipation holes (19) correspond to the gaps between adjacent capacitor cores (2). On the first annular electrode plate (3), there is a central positioning hole (20) for the glue injection part (6) to be injected and positioned; The production method includes: Obtaining capacitor reference information and production image information in a preset production area; Retrieving annular electrode plate information based on the capacitor reference information; Determine the hole position distribution information according to the annular plate information; Determine whether the production image information contains a preset stain feature; If the production image information contains a preset stain feature, then frame the stain image according to the production image information; Determine the cutting adjustment position according to the hole position distribution information and the stain feature, and perform cutting based on the cutting adjustment position with a preset cutting and punching method to obtain the first annular plate (3) and the second annular plate (4); if the production image information does not contain a preset stain feature, then determine the punching and cutting position according to the hole position distribution information, and perform cutting based on the punching and cutting position with a preset cutting and punching method to obtain the first annular plate (3) and the second annular plate (4); The method for confirming the cutting adjustment position includes: Determine the stain position and stain area according to the stain image; Determine the stain quantity according to the stain position; Determine whether the stain quantity is greater than 1; If the stain quantity is greater than 1, then determine the offset position according to the hole position distribution information with a preset offset analysis method, and use the offset position as the cutting adjustment position; If the stain quantity is not greater than 1, then determine the first plate coverage range and the first plate punching position according to the hole position distribution information; Determine whether the stain area falls within the first plate coverage range; If the stain area falls within the first plate coverage range, then determine the first plate punching area and the second plate punching area according to the annular plate information; Determine whether the stain area is less than the first plate punching area; If the stain area is less than the first plate punching area, then determine the cutting adjustment position according to the stain position and the first plate punching position; If the stain area is not less than the first plate punching area, then determine the second cutting position and use it as the cutting adjustment position or control by avoiding distance according to the judgment result of whether the stain area is less than the second plate punching area; If the stain area does not fall within the first plate coverage range, then use the first plate punching position as the cutting adjustment position.

2. The production method of a thin-film capacitor according to claim 1, characterized in that, The offset analysis method includes: Determine the comprehensive plate coverage range, punching distribution position and hole position distribution area according to the hole position distribution information; Determine whether the stain position falls within the comprehensive plate coverage range; If the stain position falls within the comprehensive plate coverage range, then select the stain position according to the stain area to obtain the stain selection position, use the stain position other than the stain selection position as the stain remaining position, define the area corresponding to the stain selection position as the stain selection area, and define the area corresponding to the stain remaining position as the stain remaining area; Select the punching distribution position according to the stain selection area and the hole position distribution area and use it as the punching selection position; Calculate the distance between the rust selection position and the stain remaining position and use it as the rust separation distance value; Determine the punching remaining position according to the punching selection position and the rust separation distance value, and use the punching selection position and the punching remaining position as the cutting adjustment position; Determine the redundant stain information according to the stain remaining position, punching remaining position and stain remaining area, and remove it with a preset stain removal method; If the stain position does not fall within the comprehensive plate coverage range, then determine the hole punching position according to the hole position distribution information, and use the punching position as the cutting adjustment position.

3. The production method of a thin film capacitor according to claim 2, characterized in that, The stain removal method includes: Retrieving the redundant stain position and redundant stain area based on the redundant stain information; Determining the type of redundant stain according to the production image information and the redundant stain position; When the type of redundant stain is a preset raised foreign object, determining the grinding position according to the redundant stain position; Controlling a preset grinding device to grind the grinding position; When the type of redundant stain is a preset rust type, determining the rust value according to the redundant stain area; Determining the laser value according to the rust value; Determining the removal path according to the redundant stain position; Controlling a preset removal device to remove the rust with the removal path and the laser value.

4. The production method of a thin film capacitor according to claim 1, characterized in that, The cutting and punching method includes: Determining the punching type according to the annular plate information; Determining the circular hole cutting position, U-shaped hole cutting position and other hole cutting positions according to the punching type and the punching position database; Determining the U-shaped hole area and the circular hole area according to the punching type and a preset punching area database; Determining the number and length of U-shaped hole welding strips according to the U-shaped hole area; Determining the number and length of circular hole welding strips according to the circular hole area; Determining the number of U-shaped holes, the number of circular holes and the number of other holes according to the annular plate information; Determining the U-shaped hole cutting path according to the U-shaped hole welding strip position, U-shaped hole cutting position, U-shaped hole area, number of U-shaped holes, number of circular hole welding strips and length of circular hole welding strips; Determining the circular hole cutting path according to the circular hole welding strip position, circular hole cutting position, length of circular hole welding strips, number of circular holes, number of circular hole welding strips and length of circular hole welding strips; Determining the other hole cutting path according to the other hole cutting position and the number of other holes; Controlling a preset punching device to punch with the circular hole cutting path, U-shaped hole cutting path and other hole cutting positions, and performing bending by a preset bending method after punching.

5. The production method of a thin film capacitor according to claim 4, characterized in that The bending method includes: Retrieving the model information based on the capacitor reference information; Determining the bending position, bending angle and bending hardness according to the model information; Determining the bending force according to the bending angle and bending hardness; Controlling a preset bending device to bend the bending position with the bending force and bending degree, and re-acquiring the production image information after bending; Determining whether the production image information contains a preset abnormal bending feature; If not, completing the bending and controlling a preset clamping device to clamp the first annular plate (3) and the second annular plate (4) to a preset assembly area for assembly; If so, determining the crack value according to the production image information; Determining whether the crack value is less than a preset reference repair interval; If the crack value is less than the reference repair interval, determining the repair parameters according to the crack value, controlling a preset welding device to perform repair with the repair parameters, and controlling a preset clamping device to clamp the first annular plate (3) and the second annular plate (4) to a preset assembly area for assembly after repair; If the crack value is not less than the reference repair interval, controlling a preset clamping device to clamp the first annular plate (3) and the second annular plate (4) to a preset waste area.

6. The production method of a thin film capacitor according to claim 5, characterized in that, It also includes the step of controlling a preset clamping device to clamp the first annular plate (3) and the second annular plate (4) to a preset assembly area for assembly: Control the preset welding device to weld the U-hole welding strip position and the round-hole welding strip position of the first annular electrode plate (3) to the capacitor core (2); Control the preset manipulator to abut the second annular electrode plate (4) against the capacitor core (2) and obtain the assembly image information; Determine the spacing detection value according to the assembly image information; Determine the pin spacing value according to the annular electrode plate information; Determine the spacing adjustment value according to the spacing detection value and the pin spacing value; Control the preset clamping device to rotate and adjust the second annular electrode plate (4) with the spacing adjustment value; Control the preset welding device to weld the U-hole welding strip position and the round-hole welding strip position of the second annular electrode plate (4) to the capacitor core (2); Obtain the housing installation position of the housing (1) and the heat sink apex position of the heat sink (5); Determine the assembly position of the housing (1) according to the housing installation position and the heat sink apex position, and control the preset clamping device to install and cover the housing (1) at the housing installation position.

Images