Temperature compensation method and device for micro-nano manufacturing optical measurement

Abstract

The invention provides a temperature compensation method and device for micro-nano manufacturing optical measurement, the temperature compensation method is used for compensating thermal deformation of a connecting piece between a camera assembly and a support frame, and the material of the connecting piece is a material with an invar effect at normal temperature; an intersection point between a first optical axis of the camera assembly and the surface of the detected object is a first intersection point; the temperature compensation method comprises the following steps: measuring current temperatures of at least three temperature measuring points on a connecting surface; fitting according to the current temperature at the temperature measuring point to obtain a deformation surface after thermal deformation of the connecting surface; obtaining a second intersection point of a second optical axis of the camera assembly and the surface of the detected object according to the deformation surface, and obtaining a thermal deformation vector according to a position difference between the second intersection point and the first intersection point; and performing thermal compensation on all points on the surface of the detected object based on the thermal deformation vector. According to the temperature compensation method, the influence of thermal deformation on the optical detection precision is reduced, and the repeatability precision of optical measurement is improved.

Description

Technical Field

[0001] The present invention relates to the field of micro-nano manufacturing measurement, and in particular to a temperature compensation method and device for micro-nano manufacturing optical measurement. Background Art

[0002] In today's micro-nano manufacturing field, especially in the IC (Integrated Circuit) manufacturing field and optoelectronic manufacturing field, with the rapid development of technology, IC devices are showing a trend of shrinking physical scale and expanding to three-dimensional structures, and the corresponding process nodes are also continuously upgraded. In this context, the requirements for detection technology in the IC manufacturing process have reached an unprecedented level. IC measurement and detection occupies a vital position in the entire IC manufacturing process and is a key link in achieving process control and yield management in the IC manufacturing process.

[0003] Optical measurement technology has been widely used in the field of IC manufacturing process control and yield management due to its advantages such as fast measurement speed, non-contact, no damage to the test object, and easy online integration. Optical measurement uses optoelectronic technology to measure key dimensions in micro-nano manufacturing production based on optical principles to achieve yield control, mainly including key dimension measurement, three-dimensional morphology measurement, thin film thickness measurement, overlay accuracy measurement, etc. Optical measurement of chip position can quickly and accurately identify defects and their location information in the test sample with the help of machine recognition, image processing, machine learning, and artificial intelligence. Specifically, the camera is used to scan the machine vision to identify the entire wafer, and then obtain the integrity and position information of the chip on the wafer. In the actual application of this technology, the camera is fixed on the marble gantry, and the wafer is placed on the chuck. The scanning of different parts of the wafer is achieved by moving in the x-axis and y-axis directions, and finally the chip information on the entire wafer is obtained by splicing.

[0004] In addition, after the position information of the chip on the wafer is identified by machine vision, it is necessary to go through the step of calibrating the SVD (Singular Value Decomposition) matrix conversion to obtain the actual coordinate information of the chip. However, as the chip size continues to shrink, the accuracy requirements for measuring equipment become more and more stringent. In a high-precision measurement environment, even small environmental fluctuations may have a significant impact on the measurement results. Although measuring equipment is usually measured in a dust-free workshop (with constant temperature and humidity conditions), the presence of heat sources such as light sources and cameras inside the equipment will affect the thermal stability of the measurement system in a local area. Moreover, the thermal expansion problem of the measurement system tooling cannot be ignored. This problem will have an adverse effect on the measurement and reduce the repeatability and accuracy of the measurement. Summary of the invention

[0005] The object of the present invention is to provide a temperature compensation method and device for optical measurement in micro-nano manufacturing, which has the advantage of being able to achieve thermal deformation compensation.

[0006] To achieve the above-mentioned object, the present invention provides a temperature compensation method for optical measurement of micro-nano manufacturing, the temperature compensation method is used to compensate for the thermal deformation of a connecting member between a camera assembly and a support frame, the connecting member having a connecting surface adjacent to the camera assembly; in a reference state where the connecting member is not thermally deformed, the intersection point between the first optical axis of the camera assembly and the surface of the detected object is the first intersection point; the temperature compensation method comprises:

[0007] S10, after the connection piece is thermally deformed, measuring the current temperature at at least three temperature measurement points on the connection surface;

[0008] S20, obtaining a deformation surface of the connection surface after thermal deformation according to the current temperature at at least three temperature measurement points;

[0009] S30, obtaining, according to the deformation surface, a second intersection point between a second optical axis of the camera assembly and the surface of the detected object after the connecting member is deformed, and obtaining a thermal deformation vector according to a position difference between the second intersection point and the first intersection point;

[0010] S40, performing thermal compensation on all points on the surface of the detected object after the connection component is thermally deformed based on the thermal deformation vector.

[0011] Optionally, the material of the connecting piece is a material having Invar effect at room temperature.

[0012] Optionally, in step S10, the number of the temperature measurement points is four, and the four temperature measurement points are located at four corners of the square connection surface.

[0013] Optionally, in step S20, obtaining the deformation surface of the connection surface after thermal deformation according to the current temperature fitting at at least three temperature measurement points includes:

[0014] S201, calculating and obtaining the position of each temperature measurement point after thermal deformation;

[0015] S202: The deformation surface is obtained by fitting based on each of the temperature measurement points, and the vertical distance between the deformation surface and each of the temperature measurement points is the smallest.

[0016] Optionally, the four temperature measurement points include a first measurement point and a second measurement point, and a line connecting the first measurement point and the second measurement point is parallel to a bottom edge of the connecting surface; in step S30, obtaining a second intersection point between the second optical axis of the camera assembly and the surface of the detected object according to the deformation surface specifically includes:

[0017] S301, obtaining a central projection point by projecting the central point of the connecting surface onto the deformation surface;

[0018] S302, finding an optical axis parallel line through the central projection point that is parallel to the deformation surface and perpendicular to a line connecting the first measurement point and the second measurement point;

[0019] S303, calculating the normal vector of the deformable surface, and moving the optical axis parallel line along the normal vector of the deformable surface by the distance between the first optical axis and the connecting surface to obtain a second optical axis.

[0020] Optionally, in step S201, the position of each temperature measurement point after thermal deformation is calculated according to the temperature change of each temperature measurement point, the thickness of the connecting member and the thermal expansion coefficient of the connecting member.

[0021] Optionally, in step S40, the points on the surface of the detected object are thermally compensated by the thermal deformation vector to obtain compensated physical coordinates. After step S40, step S50 is also included: multiplying the compensated physical coordinates with the camera imaging matrix to obtain compensated image coordinates.

[0022] Optionally, after step S40, the method further includes step S50: multiplying the compensated physical coordinates with a camera imaging matrix to obtain compensated image coordinates, wherein the camera imaging matrix includes a scaling factor, a rotation angle, and a coordinate translation amount.

[0023] The present invention also provides a device for optical detection of micro-nano manufacturing, the device comprising:

[0024] A camera component, used to obtain optical information of the surface of the object being inspected;

[0025] A support frame, used for supporting the camera assembly;

[0026] A connecting member, disposed between the camera assembly and the supporting frame, to connect the camera assembly and the supporting frame;

[0027] at least three temperature sensors, disposed at different positions on the connecting member;

[0028] The temperature compensation controller is connected to the temperature sensor and the camera assembly, and is provided with a memory and a processor. The memory stores a computer program, and when the computer program is executed by the processor, the temperature compensation method as described above is implemented.

[0029] Optionally, the connecting member has a connecting surface adjacent to the camera assembly; the number of the temperature sensors is four, and the four temperature sensors are respectively arranged at the four corners of the connecting surface; and / or the material of the connecting member is a material that exhibits the Invar effect at room temperature.

[0030] In summary, compared with the prior art, the temperature compensation method and device for micro-nano manufacturing optical measurement provided by the present invention have the following beneficial effects:

[0031] The temperature compensation method of the present invention introduces the change in the optical axis position of the camera component caused by the thermal deformation of the connector due to temperature change, and quantitatively compensates for the thermal deformation to reduce the influence of the thermal deformation on the optical detection accuracy and improve the repeatability accuracy of the optical measurement. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 The figure is a flow chart of the temperature compensation method for optical measurement in micro-nano manufacturing according to the present invention.

[0033] Figure 2 It is a schematic diagram of the structure of the device for optical measurement of micro-nano manufacturing according to the present invention.

[0034] Figure 3 It is a structural schematic diagram of the front view angle of the device for optical measurement of micro-nano manufacturing of the present invention.

[0035] Figure 4 Schematic diagram of the structure of the camera assembly and connectors in a reference state without thermal deformation.

[0036] Figure 5 Schematic diagram of the structure of the camera assembly and connectors after thermal deformation.

[0037] Description of reference numerals:

[0038] Device for optical detection of micro-nano manufacturing 10

[0039] Camera assembly 100

[0040] Support frame 110

[0041] Connector 120

[0042] Connection surface P0

[0043] Deformation Surface P i

[0044] Temperature sensor 130

[0045] First measuring point 131

[0046] Second measuring point 132

[0047] Detected object 20 DETAILED DESCRIPTION

[0048] The following will be combined with the attached embodiment of the present invention Figure 1 ~Attached Figure 5 , the technical solutions, structural features, objectives achieved and effects in the embodiments of the present invention are described in detail.

[0049] It should be noted that the drawings are in a very simplified form and use non-precise proportions. They are only used to conveniently and clearly assist in explaining the embodiments of the present invention, and are not used to limit the conditions for the implementation of the present invention. Therefore, they have no substantive technical significance. Any structural modification, change in proportional relationship or adjustment of size, without affecting the effects and purposes that can be achieved by the present invention, should still fall within the scope of the technical content disclosed by the present invention.

[0050] It should be noted that, in the present invention, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only the elements explicitly listed, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0051] The present invention provides a temperature compensation method for micro-nano manufacturing optical measurement. The temperature compensation method is used to compensate for the thermal deformation of the connecting member 120 between the camera assembly 100 and the support frame 110 (such as Figure 4 and Figure 5 When inspecting the inspected object 20 , such as a wafer, the camera assembly 100 is mounted on the support frame 110 through the connector 120 .

[0052] When the connector 120 is not thermally deformed, the connection surface P0 adjacent to the connector 120 and the camera assembly 100 is adjusted to a vertical state by adjusting the support frame 110 and the fasteners used for connection after the camera assembly 100 is assembled and connected to the support frame 110 through the connector 120 at room temperature. Taking this state as the reference state, the thickness of the connector 120 is measured to be L0, the length is a, the width is b, and the thermal expansion coefficient of the material making the connector 120 is α. The camera assembly 100 is installed on the connector 120. In the reference state, the optical axis of the camera assembly 100 is the first optical axis l0, the distance between the first optical axis l0 and the connector 120 is d, and the projection point of the first optical axis l0 on the detected object 20, that is, the intersection with the surface of the detected object 20 is the first intersection, and the physical coordinates of the first intersection are (x0, y0).

[0053] like Figure 1 As shown, the temperature compensation method includes:

[0054] S10, after the connection member 120 is thermally deformed, the current temperature at at least three temperature measurement points on the connection surface P0 is measured. In this embodiment, the number of temperature measurement points is four. In the reference state where the camera assembly 100, the connection member 120 and the support frame 110 are initially installed, the initial temperatures of the four temperature measurement points are measured and recorded as T 01 , T 02 , T 03 and T 04 When the temperature of the connecting member 120 changes, the current temperature of each temperature measurement point on the connecting surface P0 is measured through the temperature measurement point on the connecting surface P0, which is recorded as T i1 , T i2 , T i3 and T i4 (where i ≥ 0).

[0055] As a preferred embodiment, the connection surface P0 is a square plane, and four temperature measurement points are located at the four corners of the square connection surface P0 to measure the temperature changes at different positions of the connection member 120, and fit the position of the entire connection surface P0 after thermal deformation as completely as possible. In this embodiment, four temperature measurement points are set on the connection surface P0 to reduce the consumption of computing power as much as possible while ensuring the fitting accuracy of the connection surface P0 after deformation.

[0056] In other embodiments, the number of temperature measurement points on the connection surface P0 may be five or other numbers, as long as there are more than three to achieve fitting of the connection surface P0 after thermal deformation, which is not limited here. In addition, the connection surface P0 may also be other non-square shapes, such as triangles, etc., which is not limited here.

[0057] S20, obtaining the deformation surface P after the connection surface P0 is thermally deformed according to the current temperature fitting at at least three temperature measurement points i Specifically, step S20 includes:

[0058] S201. Calculate the position of each temperature measurement point after thermal deformation. The position of each temperature measurement point after thermal deformation is calculated based on the temperature change of each temperature measurement point, the thickness L0 of the connector 120, and the thermal expansion coefficient α of the connector 120. Since the connector 120 will undergo thermal strain after being heated, especially the thermal strain in the thickness direction of the connector 120 has the greatest impact on the imaging of the camera assembly 100, the present invention mainly compensates for the thermal deformation amount in the thickness direction of the connector 120. Specifically, the thermal deformation amounts of the four temperature measurement points are calculated according to the following formulas:

[0059] ΔL i1 =(T i1 -T 01 )×α×L0

[0060] ΔL i2 =(T i2 -T 02 )×α×L0

[0061] ΔL i3 =(T i3 -T 03 )×α×L0

[0062] ΔL i4 =(T i4 -T 04 )×α×L0

[0063] S202, fitting the deformation surface P based on each temperature measurement point i , and the deformation surface P i The vertical distance from each temperature measurement point after thermal deformation is the smallest. i The plane obtained by fitting the connection surface P0 according to the temperature change of multiple temperature measurement points after thermal deformation is used as the deformation surface P i Indicates the position of the connection surface P0 after thermal deformation.

[0064] S30, according to the deformation surface P i The second optical axis l of the camera assembly 100 after the connecting member 120 is deformed is obtained. i The second intersection point (x i0 ,y i0). After the connector 120 is deformed by heat, the position of the camera assembly 100 close to the connection surface P0 of the connector 120 will also change accordingly, and the first optical axis l0 of the camera assembly 100 in the reference state will also change with the deformation of the connection surface P0. i The optical axis position of the camera assembly 100 after the connection member 120 is thermally deformed is shown in FIG. 2 . The object 20 to be detected does not move with the thermal deformation of the connection member 120. Therefore, after the camera assembly 100 follows the thermal deformation of the connection member 120, its second optical axis l i The intersection point with the surface of the detected object 20 will move relative to the first intersection point (x0, y0), and the second optical axis l of the camera assembly 100 will be i The intersection point with the surface of the detected object 20 is set as the second intersection point (x i0 ,y i0 ), according to the second intersection point (x i0 ,y i0 ) and the first intersection point (x0, y0) to obtain the thermal deformation vector In this embodiment, step S30 specifically includes:

[0065] S301, connect the center point of the surface P0 to the deformation surface P i The projection on gets the central projection point.

[0066] The four temperature measurement points in this embodiment include a first measurement point 131 and a second measurement point 132 (eg Figure 3 As shown), a line connecting the first measuring point 131 and the second measuring point 132 is parallel to the bottom edge of the connecting surface P0.

[0067] S302, find a point parallel to the deformation surface P through the center projection point i and perpendicular to the optical axis parallel line l of the line connecting the first measuring point 131 and the second measuring point 132 i0 .

[0068] S303, calculate deformation surface P i The normal vector of the optical axis is parallel to the line l i0 Along the deformation surface P i The normal vector of the first optical axis l0 is moved by a distance d between the first optical axis l0 and the connecting surface P0 to obtain the second optical axis l i (like Figure 4 and Figure 5 The second optical axis l i The intersection point with the detected object 20, such as the surface of a wafer, is the second intersection point (x i0 ,y i0 ).

[0069] S40, based on the thermal deformation vector, thermal compensation is performed on all points on the surface of the detected object 20 after the connection member 120 is thermally deformed. The thermal deformation vector is translated between the camera assembly 100 and the detected object 20. The original coordinates of the point on the surface of the detected object 20 are (x i ,y i ), and after thermal compensation, the compensated physical coordinates (x i -x i0 +x0,y i -y i0 +y0).

[0070] In this embodiment, after step S40, step S50 is also included: multiplying the compensated physical coordinates with the camera imaging matrix to obtain the compensated image coordinates. The camera imaging matrix includes a scaling factor K, a rotation angle θ, and a coordinate translation (u, v). An image coordinate system is established for the image captured by the camera assembly 100, and the pixel coordinates corresponding to the object can be measured in the image coordinate system. There is a one-to-one correspondence between the pattern on the object plane and the pattern of the image captured by the camera assembly 100, and the image coordinate system and the physical coordinate system satisfy an affine transformation relationship. Without considering temperature compensation, it is assumed that the coordinates of any point A measured by the camera at time i in the image coordinate system are (X i , Y i ), the point corresponding to point A in the physical coordinate system is (x i ,y i ), then there exists a matrix H such that The matrix H is a scaling, rotation and translation matrix, which makes the pixel points in the image coordinate system coincide with the corresponding points in the object coordinate system. The matrix H satisfies:

[0071]

[0072] Among them, K is the scaling factor, θ is the rotation angle, and (u, v) is the coordinate translation.

[0073] After thermal deformation compensation, the thermal deformation vector is translated between the camera assembly 100 and the detected object 20 The coordinates of point A after compensation in the object coordinate system are (x i -x i0 +x0,y i -y i0 +y0, and after the corresponding coordinate transformation, the measured coordinates of point A in the image coordinate system (X′ i , Y′ i ), which satisfies: After the above steps, thermal compensation for the imaging deviation of the camera assembly 100 caused by the thermal deformation of the connecting member 120 is completed.

[0074] In this embodiment, the detected object 20 is illustrated as a wafer. However, the object detected by the camera assembly 100 is not limited to a wafer, but may be other objects that can be optically detected, which is not limited here.

[0075] In this embodiment, the support frame 110 is exemplified by a gantry frame made of marble. Marble has the advantage of small thermal deformation when the temperature changes, and the gantry frame has the advantage of stable support. The gantry frame made of marble can minimize the impact of thermal deformation of the support frame 110 caused by temperature changes on the camera assembly 100. However, the support frame 110 can also be a structure made of other materials or other structures that can support the camera assembly 100, which is not limited here.

[0076] In this embodiment, the material of the connector 120 is selected from materials with Invar effect at room temperature. Materials with Invar effect are materials with low expansion coefficient at room temperature. As a preferred embodiment, the connector 120 is selected from Invar steel. Invar steel has the advantage of good thermal stability and can maintain a very small or even close to zero expansion coefficient in a wide temperature range near room temperature, thereby minimizing the influence of thermal expansion deformation of the connector 120 on the optical detection accuracy of the camera assembly 100.

[0077] In other embodiments, other materials may be selected for the connector 120 as long as the connection between the camera assembly 100 and the support frame 110 can be achieved. Of course, the smaller the thermal expansion coefficient, the better, so as to minimize the impact of thermal deformation of the connector 120 on the optical detection accuracy of the camera assembly 100.

[0078] In addition, if Figure 2 and Figure 3 As shown, the present invention also provides a device 10 for optical detection of micro-nano manufacturing, which includes a camera assembly 100, a support frame 110, a connector 120, at least three temperature sensors 130 and a temperature compensation controller (not shown in the figure).

[0079] The camera assembly 100 is used to photograph the inspected object 20 to obtain optical information of the surface of the inspected object 20. The inspected object 20 may be a wafer or other object that can be optically inspected.

[0080] The support frame 110 is used to support the camera assembly 100 so as to stably install the camera assembly 100 on the ground. In the present embodiment, the support frame 110 adopts a gantry frame made of marble. Marble has the advantage of small thermal deformation when the temperature changes, and the gantry frame has the advantage of stable support. The gantry frame made of marble can minimize the influence of the thermal deformation of the support frame 110 caused by the temperature change on the camera assembly 100. However, the support frame 110 can also be a structure made of other materials or other structures that can support the camera assembly 100, which is not limited here.

[0081] The connecting member 120 is disposed between the camera assembly 100 and the support frame 110 to connect the camera assembly 100 and the support frame 110. In this embodiment, the material of the connecting member 120 is a material having an Invar effect at room temperature, such as Invar steel.

[0082] The temperature sensors 130 are disposed at different positions on the connector 120 ; the connector 120 has a connection surface P0 adjacent to the camera assembly 100 ; there are four temperature sensors 130 , which are respectively disposed at the four corners of the connection surface P0 .

[0083] The temperature compensation controller is connected to the temperature sensor 130 and the camera assembly 100, and is provided with a memory and a processor. The memory stores a computer program, and when the computer program is executed by the processor, the temperature compensation method as described above is implemented.

[0084] Although the content of the present invention has been described in detail through the above preferred embodiments, it should be appreciated that the above description should not be considered as a limitation of the present invention. After reading the above content, it will be apparent to those skilled in the art that various modifications and substitutions of the present invention will occur. Therefore, the protection scope of the present invention should be limited by the appended claims.

Claims

1. A temperature compensation method for optical measurement in micro-nano manufacturing, characterized in that: The temperature compensation method is used to compensate for the thermal deformation of a connector between a camera assembly and a support frame, wherein the connector has a connection surface adjacent to the camera assembly; In a reference state where the connecting member is not thermally deformed, an intersection point between the first optical axis of the camera assembly and the surface of the detected object is a first intersection point; The temperature compensation method comprises: S10, after the connection piece is thermally deformed, measuring the current temperature at at least three temperature measurement points on the connection surface; S20, obtaining a deformation surface of the connection surface after thermal deformation according to the current temperature at at least three temperature measurement points; S30, obtaining, according to the deformation surface, a second intersection point between a second optical axis of the camera assembly and the surface of the detected object after the connecting member is deformed, and obtaining a thermal deformation vector according to a position difference between the second intersection point and the first intersection point; S40, performing thermal compensation on all points on the surface of the detected object after the connection component is thermally deformed based on the thermal deformation vector.

2. The temperature compensation method for micro-nano manufacturing optical measurement according to claim 1, characterized in that: The material of the connecting piece is a material having Invar effect at room temperature.

3. The temperature compensation method for micro-nano manufacturing optical measurement according to claim 1, characterized in that: In step S10, the number of the temperature measurement points is four, and the four temperature measurement points are located at four corners of the connection surface.

4. The temperature compensation method for micro-nano manufacturing optical measurement according to claim 1, characterized in that: In step S20, fitting the deformation surface of the connection surface after thermal deformation according to the current temperature at at least three temperature measurement points includes: S201, calculating and obtaining the position of each temperature measurement point after thermal deformation; S202: The deformation surface is obtained by fitting based on each of the temperature measurement points, and the vertical distance between the deformation surface and each of the temperature measurement points is the smallest.

5. The temperature compensation method for micro-nano manufacturing optical measurement according to claim 4, characterized in that: The temperature measurement points include a first measurement point and a second measurement point, and a line connecting the first measurement point and the second measurement point is parallel to the bottom edge of the connection surface; in step S30, obtaining a second intersection point between the second optical axis of the camera assembly and the surface of the detected object according to the deformation surface specifically includes: S301, obtaining a central projection point by projecting the central point of the connecting surface onto the deformation surface; S302, finding an optical axis parallel line through the central projection point that is parallel to the deformation surface and perpendicular to a line connecting the first measurement point and the second measurement point; S303, calculating the normal vector of the deformable surface, and moving the optical axis parallel line along the normal vector of the deformable surface by the distance between the first optical axis and the connecting surface to obtain a second optical axis.

6. The temperature compensation method for micro-nano manufacturing optical measurement according to claim 4, characterized in that: In step S201, the position of each temperature measurement point after thermal deformation is calculated according to the temperature change of each temperature measurement point, the thickness of the connecting member and the thermal expansion coefficient of the connecting member.

7. The temperature compensation method for micro-nano manufacturing optical measurement according to claim 1, characterized in that: In step S40, the points on the surface of the detected object are thermally compensated by using the thermal deformation vector to obtain compensated physical coordinates.

8. The temperature compensation method for micro-nano manufacturing optical measurement according to claim 7, characterized in that: After step S40, the method further includes step S50: multiplying the compensated physical coordinates with a camera imaging matrix to obtain compensated image coordinates, wherein the camera imaging matrix includes a scaling factor, a rotation angle, and a coordinate translation amount.

9. A device for optical measurement in micro-nano manufacturing, characterized in that: The device comprises: A camera component, used to obtain optical information of the surface of the object being inspected; A support frame, used for supporting the camera assembly; A connecting member, disposed between the camera assembly and the supporting frame, to connect the camera assembly and the supporting frame; at least three temperature sensors, disposed at different positions on the connecting member; A temperature compensation controller is connected to the temperature sensor and the camera assembly, and is provided with a memory and a processor. The memory stores a computer program. When the computer program is executed by the processor, the temperature compensation method according to any one of claims 1 to 8 is implemented.

10. The device for optical measurement of micro-nano manufacturing according to claim 9, characterized in that: The connector has a connection surface adjacent to the camera assembly; the number of the temperature sensors is four, and the four temperature sensors are respectively arranged at the four corners of the connection surface; and / or the material of the connector is a material having an Invar effect at room temperature.

Images