MIP lamp bead detection method and device and lamp bead packaging equipment

Abstract

The invention discloses an MIP lamp bead detection method, an MIP lamp bead detection device and lamp bead packaging equipment. The method comprises the following steps: controlling a plurality of micro chips to be transferred to a packaging substrate; carrying out photoluminescence PL light color detection on the plurality of Micro chips on the packaging substrate, and identifying the Micro chips with abnormal light color in the plurality of Micro chips; packaging the plurality of Micro chips to form a plurality of MIP lamp beads; and carrying out electroluminescence (EL) electrical measurement on the plurality of packaged MIP lamp beads, and identifying the MIP lamp beads with abnormal electrical properties in the plurality of MIP lamp beads. According to the invention, the technical problem of relatively high detection time cost caused by performing EL electrical detection and EL light color detection on the MIP lamp beads one by one is solved.

Description

Technical Field

[0001] The present invention relates to the field of semiconductors, and in particular to a method and device for detecting microchip in-package (MIP) lamp beads, and lamp bead packaging equipment. Background Art

[0002] In the related art, the MIP packaging factory performs electroluminescence (EL) electrical testing and EL light color testing on each MIP lamp bead after packaging. However, performing EL electrical testing and EL light color testing on each MIP lamp bead will result in a large testing time cost, thereby increasing the production cost of the MIP lamp bead.

[0003] To address the above-mentioned problems, no effective solution has been proposed yet. Summary of the invention

[0004] The embodiments of the present invention provide a MIP lamp bead detection method, device and lamp bead packaging equipment to at least solve the technical problem of high detection time cost caused by performing EL electrical testing and EL light color testing on MIP lamp beads one by one.

[0005] According to one aspect of an embodiment of the present invention, a MIP lamp bead detection method is provided, comprising: controlling a plurality of micro-Micro chips to be transferred to a packaging substrate; performing photoluminescence (PL) light color detection on the plurality of Micro chips located on the packaging substrate, and identifying Micro chips with abnormal light colors among the plurality of Micro chips; packaging the plurality of Micro chips to form a plurality of MIP lamp beads; performing electroluminescence (EL) electrical testing on the plurality of packaged MIP lamp beads, and identifying MIP lamp beads with abnormal electrical properties among the plurality of MIP lamp beads.

[0006] Optionally, performing PL light color detection on the multiple Micro chips located on the packaging substrate to identify the Micro chips with abnormal light color among the multiple Micro chips includes: performing PL light color detection on the multiple Micro chips located on the packaging substrate one by one to identify the Micro chips with abnormal light color among the multiple Micro chips; and / or performing PL light color detection on the multiple Micro chips located on the packaging substrate area by area to identify the area where the Micro chips with abnormal light color exist among the multiple Micro chips.

[0007] Optionally, after performing PL light color detection on the multiple Micro chips located on the packaging substrate one by one and identifying the Micro chip with abnormal light color among the multiple Micro chips, it also includes: marking the coordinates of the MIP lamp beads where the Micro chip with abnormal light color is located as the first unqualified NG coordinates; and / or, after performing PL light color detection on the multiple Micro chips located on the packaging substrate piece by piece and identifying the area where the Micro chip with abnormal light color exists among the multiple Micro chips, it also includes: marking the coordinates of the MIP lamp beads in the area where the Micro chip with abnormal light color exists as the second NG coordinates.

[0008] Optionally, performing EL electrical testing on the multiple MIP lamp beads after packaging to identify MIP lamp beads with abnormal electrical performance among the multiple MIP lamp beads includes: performing EL electrical testing on the multiple MIP lamp beads after packaging one by one to identify MIP lamp beads with abnormal electrical performance among the multiple MIP lamp beads.

[0009] Optionally, after performing EL electrical testing on the multiple packaged MIP lamp beads one by one to identify the MIP lamp beads with abnormal electrical performance among the multiple MIP lamp beads, it also includes: marking the coordinates of the MIP lamp beads with abnormal electrical performance as third NG coordinates.

[0010] Optionally, after performing EL electrical testing on the multiple MIP lamp beads after packaging and identifying the MIP lamp beads with abnormal electrical properties among the multiple MIP lamp beads, it also includes: based on the first NG coordinate or the second NG coordinate, eliminating the MIP lamp beads with abnormal light color in the sorting stage; and / or, based on the third NG coordinate, eliminating the MIP lamp beads with abnormal electrical properties in the sorting stage.

[0011] According to another aspect of the present invention, a MIP lamp bead detection device is provided, comprising: a control module, used to control the transfer of multiple Micro chips to a packaging substrate; a first identification module, used to perform PL light color detection on the multiple Micro chips located on the packaging substrate, and identify the Micro chips with abnormal light color among the multiple Micro chips; a packaging module, used to package the multiple Micro chips to form multiple MIP lamp beads; a second identification module, used to perform EL electrical testing on the multiple MIP lamp beads after packaging, and identify the MIP lamp beads with abnormal electrical performance among the multiple MIP lamp beads.

[0012] According to another aspect of the present invention, a computer-readable storage medium is provided, wherein the computer-readable storage medium includes a stored executable program, wherein when the executable program is running, the device where the computer-readable storage medium is located is controlled to execute any one of the above-mentioned MIP lamp bead detection methods.

[0013] According to another aspect of the present invention, there is provided a lamp bead packaging device, comprising: a giant transfer device and a controller, wherein the controller is used to control the giant transfer device to transfer multiple Micro chips to a packaging substrate; the controller is also used to detect multiple MIP lamp beads formed by the multiple Micro chips on the packaging substrate based on any one of the above-mentioned MIP lamp bead detection methods.

[0014] According to yet another aspect of the present invention, there is provided a computer program product, comprising a computer program, wherein when the computer program is executed by a processor, the steps of any one of the methods described in the MIP lamp bead detection method are implemented.

[0015] In an embodiment of the present invention, a method combining photoluminescence (PL) light color detection and EL electrical measurement is adopted. By performing PL light color detection on a micro chip before packaging and performing EL electrical measurement on a MIP lamp bead after packaging, the purpose of effectively identifying and eliminating MIP lamp beads with abnormal light color and abnormal electrical performance is achieved, thereby achieving the technical effect of improving the production efficiency of MIP lamp beads and reducing the production cost of MIP lamp beads, and further solving the technical problem of high detection time cost caused by performing EL electrical measurement and EL light color detection on MIP lamp beads one by one. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The drawings described herein are used to provide a further understanding of the present invention and constitute a part of this application. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation of the present invention. In the drawings:

[0017] Figure 1 It is a schematic diagram of a single pixel light color abnormality phenomenon of a terminal direct display module according to the related technology;

[0018] Figure 2 It is a schematic diagram of performing PL or EL spectroscopic color separation detection on a whole micro chip wafer sampling according to the related technology;

[0019] Figure 3 It is a schematic diagram of three MIP lamp bead detection methods according to related technologies;

[0020] Figure 4 is a flow chart of a MIP lamp bead detection method according to an embodiment of the present invention;

[0021] Figure 5 is a schematic diagram of a novel MIP lamp bead detection method according to an optional implementation mode of the present invention;

[0022] Figure 6It is a schematic diagram of an EL light color detection and EL electrical measurement method according to the related art;

[0023] Figure 7 is a schematic diagram of a PL light color detection and EL electrical measurement method according to an optional embodiment of the present invention;

[0024] Figure 8 It is a structural block diagram of a MIP lamp bead detection device according to an embodiment of the present invention. DETAILED DESCRIPTION

[0025] In order to enable those skilled in the art to better understand the scheme of the present invention, the technical scheme in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present invention.

[0026] It should be noted that the terms "first", "second", etc. in the specification and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged where appropriate, so that the embodiments of the present invention described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units that are clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0027] First, some nouns or terms that appear in the description of the embodiments of the present application are subject to the following explanations:

[0028] Micro-chip In Package (MIP) lamp beads: a type of lamp bead that is packaged using MIP packaging technology. Different from traditional packaging methods, MIP packaging technology directly packages the Micro chip on a circuit board or substrate to form a smaller, denser, and higher-performance display unit. MIP packaging technology combines the principle of chip scale packaging (CSP), which means that the size of the package is close to or equal to the size of the chip, thereby reducing the extra volume and weight in the packaging process.

[0029] Mass transfer: abbreviated as mass transfer, is a process that can simultaneously process and transfer a large number of Micro chips to a substrate.

[0030] Front-end epitaxial whole-wafer process: In the manufacture of light emitting diode (LED) chips, the front-end process usually refers to the growth of the chip and the formation of the basic structure, while epitaxy refers to the growth of additional semiconductor layers on the surface of the wafer. At this stage, the LED chip is manufactured in the form of a whole wafer, rather than a single separate chip. This means that each location on the entire wafer will form an LED chip, but they are physically connected to each other and will not be cut into individual chips at this stage of manufacturing.

[0031] Spectrophotometry: It is a test method used to evaluate the optical properties of light sources, especially LED lamp beads. It mainly determines the color, brightness, and uniformity of light by measuring the spectral intensity distribution of the light source at different wavelengths. In the LED industry, spectrophotometry is often used to ensure that the luminous color of the lamp beads meets the predetermined standards, and to screen out LED lamp beads with specific colors and brightness for classification.

[0032] Photo Luminescence (PL): PL refers to the phenomenon of luminescence produced when a substance is excited by light or other forms of photon energy, due to the release of photons when electrons transition from the ground state to the excited state and then return from the excited state to a lower energy level. This light usually continues for a period of time after the excitation source stops working. In LED and display technology, PL testing is often used to evaluate the photochromic properties of materials, such as the luminous efficiency, wavelength and color purity of LED chips. By applying light of a specific wavelength to a material or device, it can be stimulated to emit light, and its optical properties can be analyzed by measuring the luminescence spectrum.

[0033] Electroluminescence (EL): Electroluminescence refers to the phenomenon that when a substance (usually a semiconductor material) is subjected to an electric field, electrons are driven by the electric field to jump from the valence band to the conduction band and recombine, and the released photon energy forms light emission. This is the basic principle of LED luminescence, that is, light is generated by injecting current into semiconductor materials. EL detection can be used to evaluate the electrical and optical properties of devices in LED technology. By applying voltage or current to the LED chip, its luminous state can be observed, and the brightness and color consistency of the luminous brightness and the current-voltage characteristics of the device can be detected.

[0034] The MIP lamp bead process involves the mass transfer of Micro chips. The Micro chip process is a whole-chip process for the front-end epitaxy of LEDs, and does not support the early stage of light separation and color separation before packaging. If the light separation and color separation detection is missing, the terminal direct display module is prone to single-pixel light color abnormalities. Figure 1It is a schematic diagram of a single pixel light color abnormality phenomenon of a terminal direct display module according to the related technology, such as Figure 1 shown.

[0035] In order to avoid abnormal light color of single pixel in terminal direct display module, Micro epitaxial chip factory samples the whole Micro chip wafer for PL or EL spectral color separation detection, among which the abnormal spectral color separation chips are destructively eliminated to ensure that the subsequent MIP lamp bead packaging process can avoid abnormal spectral color separation chips. However, this increases the cost of Micro epitaxial chips and reduces the utilization rate of Micro chips in MIP packaging factories, which is not conducive to long-term development. Figure 2 It is a schematic diagram of performing PL or EL spectroscopic color separation detection on a whole micro chip wafer sample according to the related technology, such as Figure 2 shown.

[0036] After packaging the Micro chip, the MIP packaging factory will perform spectral and color separation detection on the MIP lamp beads. Although it can accurately eliminate abnormal MIP lamp beads, the detection time cost will increase by more than 15 times. That is, when the giant transfer technology matures and MIP lamp beads are mass-produced, this practice will greatly increase production costs.

[0037] Figure 3 It is a schematic diagram of three MIP lamp bead detection methods according to related technologies, such as Figure 3 As shown, these three methods all have the disadvantage of high cost.

[0038] The new MIP lamp bead detection method in this optional implementation method integrates the PL spectral and color separation detection of the LED epitaxial chip factory with the electrical measurement link of the MIP packaging to achieve the integration of the detection process. Avoid the LED epitaxial chip factory from destructively eliminating abnormal chips during PL detection, thereby reducing time consumption and effectively controlling the production cost of the LED epitaxial chip factory. Introducing PL light color detection in the MIP packaging process to replace the traditional EL light color detection can significantly reduce the detection cost and improve efficiency. For the blue or green light color anomaly that occurs in a single pixel of the terminal module (for example, the blue or green light chip wavelength shifts by 20nm, resulting in abnormal light color), PL light color detection is used to accurately identify the MIP lamp beads with abnormal light color, and their coordinates are marked to ensure that the abnormal lamp beads are eliminated in subsequent sorting, thereby greatly reducing the defective ratio of MIP lamp beads in subsequent surface mount technology (Surface Mount Technology, SMT) modules.

[0039] As mentioned above, there is a lack of low-cost spectroscopic and color separation detection methods for packaged MIP lamp beads. In view of this, an embodiment of the present invention provides a MIP lamp bead detection method, which aims to optimize the time-consuming detection process, improve detection efficiency and reduce costs.

[0040] According to an embodiment of the present invention, an embodiment of a MIP lamp bead detection method is provided. It should be noted that the steps shown in the flowchart of the accompanying drawings can be executed in a computer system such as a set of computer executable instructions, and although the logical order is shown in the flowchart, in some cases, the steps shown or described can be executed in an order different from that shown here.

[0041] Figure 4 is a flow chart of a MIP lamp bead detection method according to an embodiment of the present invention. Figure 4 As shown, the method comprises the following steps:

[0042] Step S402, controlling the transfer of multiple Micro chips to a packaging substrate.

[0043] As an optional embodiment, the execution subject of the method of this embodiment may be a packaging device for MIP lamp bead packaging, that is, the embodiment of the present invention may be a packaging device applied to a MIP packaging factory. The packaging device integrates PL and EL detection functions, which can significantly improve the detection efficiency while ensuring the detection accuracy. The execution subject of the method of this embodiment may also be a control device for controlling the MIP lamp bead packaging process, which can control the packaging device and the detection device respectively.

[0044] As an optional embodiment, when controlling the transfer of multiple Micro chips to the packaging substrate, mass transfer technology can be used. Mass transfer technology can achieve high-density chip transfer, improve the utilization rate of the packaging substrate, thereby reducing production costs, and is particularly suitable for the scenario of mass production of high-resolution display screens.

[0045] Step S404, performing PL light color detection on multiple Micro chips located on the packaging substrate, and identifying Micro chips with abnormal light color among the multiple Micro chips.

[0046] As an optional embodiment, when performing PL light color detection on multiple Micro chips located on a packaging substrate and identifying Micro chips with abnormal light color among the multiple Micro chips, a variety of methods can be used. For example, PL light color detection can be performed on multiple Micro chips located on a packaging substrate one by one to identify Micro chips with abnormal light color among the multiple Micro chips. For another example, PL light color detection can also be performed on multiple Micro chips located on a packaging substrate area by area to identify the area where Micro chips with abnormal light color exist among the multiple Micro chips. Among them, the method of performing PL light color detection one by one can more accurately locate Micro chips with abnormal light color, reduce the complexity of subsequent processing, and is suitable for the manufacture of high-end products with strict requirements on display effects. The method of performing PL light color detection on an area by area can further speed up the speed of PL light color detection on multiple Micro chips while locating the area where the Micro chip with abnormal light color is located, thereby reducing the detection time.

[0047] As an optional embodiment, after performing PL light color detection on multiple Micro chips located on the packaging substrate and identifying the Micro chips with abnormal light colors among the multiple Micro chips, a variety of methods can be used to mark the abnormalities. For example, the position of the Micro chip with abnormal light color is directly marked, and the method of marking the Micro chip with abnormal light color is simple and direct. For another example, the position of the MIP lamp beads to which the Micro chip with abnormal light color belongs after packaging is marked. The method of marking the MIP lamp beads with abnormal light color facilitates the rapid positioning and removal of these MIP lamp beads in the sorting process after the MIP lamp beads are packaged, and the coordinate file obtained by marking the MIP lamp beads is smaller than the coordinate file obtained by marking the Micro chip, which is convenient for reading, writing and storage.

[0048] Among them, the position of the MIP lamp bead to which the Micro chip with abnormal light color belongs after packaging can also be marked in a variety of ways. For example, when PL light color detection is performed on multiple Micro chips located on the packaging substrate one by one, and the Micro chip with abnormal light color is identified among the multiple Micro chips, the coordinates of the MIP lamp bead where the Micro chip with abnormal light color is located can be marked as the first NG coordinate. For another example, when PL light color detection is performed on multiple Micro chips located on the packaging substrate piece by piece, and the area where the Micro chip with abnormal light color exists among the multiple Micro chips is identified, the coordinates of the MIP lamp bead in the area where the Micro chip with abnormal light color exists can be marked as the second NG coordinate. That is, when PL light color detection is performed one by one, the coordinates of the MIP lamp bead where the Micro chip with abnormal light color is located are marked, and when PL light color detection is performed piece by piece, the coordinates of all MIP lamp beads in the abnormal area are marked. By marking the coordinates of the MIP lamp bead where the abnormal Micro chip is located, the problematic MIP lamp bead can be quickly located and eliminated, thereby improving the automation level and efficiency of the production line, and is suitable for production environments with a high degree of automation.

[0049] Step S406, encapsulating multiple Micro chips to form multiple MIP lamp beads.

[0050] As an optional embodiment, after performing PL light color detection on multiple Micro chips, the multiple Micro chips can be packaged to form multiple MIP lamp beads. Since the electrical properties of the Micro chips may be changed during the packaging process, for example, the electrical properties of some Micro chips may be damaged, it is necessary to detect the electrical properties of the multiple MIP lamp beads after forming them.

[0051] Step S408, performing EL electrical testing on the multiple packaged MIP lamp beads to identify the MIP lamp beads with abnormal electrical performance among the multiple MIP lamp beads.

[0052] As an optional embodiment, when performing EL electrical testing on multiple packaged MIP lamp beads and identifying MIP lamp beads with abnormal electrical performance among the multiple MIP lamp beads, a variety of methods can be used. For example, EL electrical testing can be performed on multiple packaged MIP lamp beads one by one to identify MIP lamp beads with abnormal electrical performance among the multiple MIP lamp beads. It is also possible to use a device that performs EL electrical testing on multiple MIP lamp beads at the same time to perform EL electrical testing on several MIP lamp beads among the multiple packaged MIP lamp beads at the same time. By performing EL electrical testing on multiple packaged MIP lamp beads, MIP lamp beads with abnormal electrical performance among the multiple MIP lamp beads can be accurately identified, so that MIP lamp beads with abnormal electrical performance can be eliminated in the subsequent sorting process, ensuring that the electrical performance of each MIP lamp bead meets the standards and improving the reliability of the finished product.

[0053] As an optional embodiment, after performing EL electrical testing on the packaged multiple MIP lamp beads one by one and identifying the MIP lamp beads with abnormal electrical performance among the multiple MIP lamp beads, the coordinates of the MIP lamp beads with abnormal electrical performance can also be marked as the third NG coordinates. By marking the coordinates of the MIP lamp beads with abnormal electrical performance, subsequent elimination and analysis are more convenient, which helps to improve product quality control.

[0054] As an optional embodiment, after performing EL electrical testing on multiple MIP lamp beads after packaging and identifying MIP lamp beads with abnormal electrical performance among multiple MIP lamp beads, a sorting step can also be performed. For example, based on the first NG coordinate or the second NG coordinate, MIP lamp beads with abnormal light color are eliminated in the sorting step; and / or, based on the third NG coordinate, MIP lamp beads with abnormal electrical performance are eliminated in the sorting step. By eliminating MIP lamp beads with abnormal light color based on the first NG coordinate or the second NG coordinate, and eliminating MIP lamp beads with abnormal electrical performance based on the third NG coordinate, it can be ensured that the products shipped by the MIP packaging factory after the packaging process and the sorting step do not contain products with abnormal light color or abnormal electrical performance. That is, by eliminating abnormal MIP lamp beads based on the coordinates of the detection results, not only can accurate quality control be achieved and resource waste be reduced, but also the yield rate of MIP lamp beads can be improved.

[0055] Through the above steps, the combination of PL light color detection and EL electrical measurement can be realized in the MIP packaging factory, which can effectively identify and eliminate MIP lamp beads with abnormal light color and abnormal electrical performance, which can not only improve product quality, but also improve production efficiency, thereby solving the technical problem of high detection time cost caused by performing EL electrical measurement and EL light color detection on MIP lamp beads one by one.

[0056] In combination with the above embodiment and the optional embodiment, an optional implementation is provided. In this optional implementation, a new MIP lamp bead detection method is proposed.

[0057] In the related technology, the MIP lamp beads can be tested for spectrophotometry and color separation in the LED epitaxial chip factory or the MIP packaging factory. Method 1: The LED epitaxial chip factory uses PL detection to perform spectrophotometry and color separation on the entire epitaxial wafer, but the detected color-biased chips must be destructively removed. Since the entire epitaxial wafer contains a large number of Micro chips, it is difficult to locate the color-biased chips in the entire epitaxial wafer and remove them, which will cause the cost of LED epitaxial chips to increase. Method 2: The LED epitaxial chip factory uses EL detection to perform sampling spectrophotometry and color separation on the entire epitaxial wafer. Since EL detection is much more time-consuming than PL detection, only sampling spectrophotometry and color separation can be performed on the entire epitaxial wafer, and accurate spectrophotometry and color separation of each Micro chip cannot be achieved, which will affect the product quality and production efficiency of the MIP packaging factory. Method 3: The MIP packaging factory performs spectrophotometry and color separation tests on each MIP lamp bead. However, due to the limitation that the size of the lamp bead is less than 0.3mm, there is a lack of suitable testing equipment. Even if there is, the detection stability is insufficient, especially using the electrical measurement process after packaging to perform spectrophotometry and color separation. The time cost will increase by more than 15 times, which is a heavy cost burden for the large-scale production of MIP lamp beads. Method 4: The LED epitaxial chip factory provides the NG coordinate information of the color-biased chip to assist the MIP packaging factory in avoiding these chips during the giant transfer process. However, the coordinate data file is huge and requires extra time to retrieve during the giant transfer, which also increases the process cost of the packaging factory.

[0058] Figure 5 is a schematic diagram of a novel MIP lamp bead detection method according to an optional implementation mode of the present invention, such as Figure 5 As shown, the method is executed by a MIP packaging factory and includes the following processing.

[0059] S1, macro-transfer process. The Micro chips produced by the LED epitaxial chip factory are macro-transferred and transferred to the packaging substrate.

[0060] S2, PL light color detection. PL light color detection is used to replace EL light color detection in related technologies, and PL light color detection is performed before packaging, while EL light color detection is performed after packaging. PL light color detection can simultaneously determine whether multiple MIP lamp beads in the area have abnormal light colors, and obtain the locations of MIP lamp beads with abnormal light colors.

[0061] S3, packaging process: The Micro chip on the packaging substrate is packaged into a MIP lamp bead.

[0062] S4, EL electrical measurement. In the related technology, EL light color detection and EL electrical measurement (i.e. EL process) need to be performed simultaneously. Since the light measurement of a single MIP lamp bead is required, the EL process needs to perform electrical and photometric measurements on each MIP lamp bead, which is very time-consuming. Figure 6 It is a schematic diagram of an EL light color detection and EL electrical measurement method according to the related art, such as Figure 6The optional implementation mode of the present invention only needs to conduct electrical measurement on the MIP lamp beads, and can conduct electrical measurement on multiple MIP lamp beads at the same time to obtain the electrical value (i.e., electrical performance) of each MIP lamp bead, and obtain the location of the MIP lamp bead with abnormal electrical performance. Figure 7 is a schematic diagram of a PL light color detection and EL electrical measurement method according to an optional embodiment of the present invention, such as Figure 7 shown.

[0063] S5, sorting stage. In the sorting stage, MIP lamp beads with abnormal light color and abnormal electrical performance are removed.

[0064] By combining PL light color detection with EL electrical measurement, PL light color detection and EL electrical measurement can be performed on multiple MIP lamp beads on the packaging substrate. This new MIP lamp bead detection method can be directly applied to the MIP packaging factory process. Compared with the efficiency of detecting about 7,000-10,000 lamp beads per hour by performing EL light color detection and EL electrical measurement on MIP lamp beads one by one in the related art, the optional implementation method of the present invention can achieve an efficiency of detecting 130,000 lamp beads per hour. The optional implementation method of the present invention can not only reduce the cost of MIP lamp bead detection, but also avoid the outflow of MIP lamp beads with abnormal light color.

[0065] The optional implementation mode of the present invention can use PL light color detection to detect MIP lamp beads with abnormal light color; can also use PL light color detection on the packaging substrate to detect MIP lamp beads with abnormal light color; can also use PL light color detection on the packaging substrate to detect MIP lamp beads with abnormal light color, and use EL electrical measurement to detect MIP lamp beads with abnormal electrical performance. Through the above detection method, it is avoided to be limited by whether the LED epitaxial chip factory provides information on chips with abnormal light color, and it is also avoided to be limited by whether the giant transfer equipment of the MIP packaging factory has the function of excluding chips with abnormal light color according to coordinates. PL light color detection and EL electrical measurement can perform multiple MIP lamp bead detections at the same time, saving more than 15 times of detection time, and can also output NG coordinates for subsequent sorting links to eliminate, avoiding color deviation pixels in the terminal module.

[0066] According to an embodiment of the present invention, a MIP lamp bead detection device is provided. Figure 8 is a structural block diagram of a MIP lamp bead detection device according to an embodiment of the present invention. Figure 8 As shown, the device includes: a control module 802, a first identification module 804, a packaging module 806 and a second identification module 808. The device is described below.

[0067] A control module is used to control the transfer of multiple Micro chips to a packaging substrate; a first identification module is connected to the above-mentioned control module and is used to perform PL light color detection on multiple Micro chips located on the packaging substrate, and identify Micro chips with abnormal light color among the multiple Micro chips; a packaging module is connected to the above-mentioned first identification module and is used to package multiple Micro chips to form multiple MIP lamp beads; a second identification module is connected to the above-mentioned packaging module and is used to perform EL electrical testing on the multiple MIP lamp beads after packaging, and identify MIP lamp beads with abnormal electrical performance among the multiple MIP lamp beads.

[0068] It should be noted here that the above-mentioned control module 802, the first identification module 804, the encapsulation module 806 and the second identification module 808 correspond to steps S302 to S308 in the embodiment, and the instances and application scenarios implemented by the multiple modules are the same as the corresponding steps, but are not limited to the contents disclosed in the above-mentioned embodiments.

[0069] As an optional embodiment, the first identification module includes: a first identification unit and a second identification unit. The first identification unit is used to perform PL light color detection on multiple Micro chips located on the packaging substrate one by one, and identify the Micro chips with abnormal light color among the multiple Micro chips; the second identification unit is used to perform PL light color detection on multiple Micro chips located on the packaging substrate piece by piece, and identify the area of ​​the Micro chips with abnormal light color among the multiple Micro chips.

[0070] As an optional embodiment, the first recognition module further includes: a first marking unit and a second marking unit. The first marking unit is connected to the first recognition unit and is used to mark the coordinates of the MIP lamp beads where the Micro chip with abnormal light color is located as the first unqualified NG coordinates; the second marking unit is connected to the second recognition unit and is used to mark the coordinates of the MIP lamp beads in the area where the Micro chip with abnormal light color exists as the second NG coordinates.

[0071] As an optional embodiment, the second identification module includes: a third identification unit. The third identification unit is used to perform EL electrical testing on the packaged multiple MIP lamp beads one by one to identify the MIP lamp beads with abnormal electrical performance among the multiple MIP lamp beads.

[0072] As an optional embodiment, the second identification module further includes: a third marking unit. The third marking unit is used to mark the coordinates of the MIP lamp beads with abnormal electrical performance as third NG coordinates.

[0073] As an optional embodiment, the device further includes: a sorting module. The sorting module is connected to the second identification module and is used to remove MIP lamp beads with abnormal light color in the sorting process based on the first NG coordinate or the second NG coordinate; and / or, based on the third NG coordinate, to remove MIP lamp beads with abnormal electrical performance in the sorting process.

[0074] According to an embodiment of the present invention, a computer-readable storage medium is provided, wherein the computer-readable storage medium includes a stored executable program, wherein when the executable program is running, the device where the computer-readable storage medium is located is controlled to execute any one of the above-mentioned MIP lamp bead detection methods.

[0075] According to an embodiment of the present invention, a lamp bead packaging device is provided, comprising: a giant transfer device and a controller, wherein the controller is used to control the giant transfer device to transfer multiple Micro chips to a packaging substrate; the controller is also used to detect multiple MIP lamp beads formed by the multiple Micro chips on the packaging substrate based on any one of the above-mentioned MIP lamp bead detection methods.

[0076] According to an embodiment of the present invention, a computer program product is provided, including a computer program, and when the computer program is executed by a processor, the steps of any one of the above-mentioned MIP lamp bead detection methods are implemented.

[0077] The serial numbers of the above embodiments of the present invention are only for description and do not represent the advantages or disadvantages of the embodiments.

[0078] In the above embodiments of the present invention, the description of each embodiment has its own emphasis. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0079] In the several embodiments provided in this application, it should be understood that the disclosed technical content can be implemented in other ways. Among them, the device embodiments described above are only schematic. For example, the division of the units can be a logical function division. There may be other division methods in actual implementation. For example, multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some interfaces, indirect coupling or communication connection of units or modules, which can be electrical or other forms.

[0080] The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple units. Some or all of the units may be selected according to actual needs to achieve the purpose of the present embodiment.

[0081] In addition, each functional unit in each embodiment of the present invention may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit. The above-mentioned integrated unit may be implemented in the form of hardware or in the form of software functional units.

[0082] If the integrated unit is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present invention, in essence, or the part that contributes to the prior art, or all or part of the technical solution can be embodied in the form of a software product, and the computer software product is stored in a storage medium, including a number of instructions for a computer device (which can be a personal computer, a server or a network device, etc.) to perform all or part of the steps of the method described in each embodiment of the present invention. The aforementioned storage medium includes: U disk, read-only memory (ROM, Read-Only Memory), random access memory (RAM, Random Access Memory), mobile hard disk, magnetic disk or optical disk and other media that can store program codes.

[0083] The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principle of the present invention. These improvements and modifications should also be regarded as the scope of protection of the present invention.

Claims

1. A method for detecting microchip package MIP lamp beads, characterized in that: include: Control the transfer of multiple micro chips to the packaging substrate; Performing photoluminescence (PL) light color detection on the plurality of Micro chips located on the packaging substrate, and identifying Micro chips with abnormal light colors among the plurality of Micro chips; Encapsulating the plurality of Micro chips to form a plurality of MIP lamp beads; Electroluminescence (EL) testing is performed on the packaged multiple MIP lamp beads to identify MIP lamp beads with abnormal electrical performance among the multiple MIP lamp beads.

2. The method according to claim 1, characterized in that: The step of performing PL light color detection on the plurality of Micro chips located on the packaging substrate and identifying a Micro chip with abnormal light color among the plurality of Micro chips comprises: Performing PL light color detection on the multiple Micro chips located on the packaging substrate one by one, and identifying the Micro chips with abnormal light color among the multiple Micro chips; and / or, PL light color detection is performed on each region of the plurality of Micro chips located on the packaging substrate to identify a region of the Micro chips having abnormal light color among the plurality of Micro chips.

3. The method according to claim 2, characterized in that After performing PL light color detection on the multiple Micro chips located on the packaging substrate one by one and identifying the Micro chip with abnormal light color among the multiple Micro chips, the method further includes: marking the coordinates of the MIP lamp bead where the Micro chip with abnormal light color is located as the first unqualified NG coordinates; and / or, After performing PL light color detection on the plurality of Micro chips on the packaging substrate piece by piece and identifying the area of ​​the Micro chips with abnormal light color among the plurality of Micro chips, the method further includes: The coordinates of the MIP lamp beads in the area of ​​the Micro chip where the light color anomaly exists are marked as the second NG coordinates.

4. The method according to claim 3, characterized in that The step of performing EL electrical testing on the packaged multiple MIP lamp beads to identify MIP lamp beads with abnormal electrical performance among the multiple MIP lamp beads includes: Perform EL electrical testing on the packaged multiple MIP lamp beads one by one to identify the MIP lamp beads with abnormal electrical performance among the multiple MIP lamp beads.

5. The method according to claim 4, characterized in that After performing EL electrical testing on the packaged multiple MIP lamp beads one by one and identifying the MIP lamp beads with abnormal electrical performance among the multiple MIP lamp beads, the method further includes: The coordinates of the MIP lamp bead with abnormal electrical performance are marked as the third NG coordinates.

6. The method according to claim 5, characterized in that After performing EL electrical testing on the packaged multiple MIP lamp beads to identify MIP lamp beads with abnormal electrical performance among the multiple MIP lamp beads, the method further includes: Based on the first NG coordinate or the second NG coordinate, MIP lamp beads with abnormal light color are eliminated in the sorting process; and / or, Based on the third NG coordinate, the MIP lamp beads with abnormal electrical properties are eliminated in the sorting process.

7. A MIP lamp bead detection device, characterized in that: include: A control module, used to control the transfer of multiple Micro chips to a packaging substrate; A first identification module is used to perform PL light color detection on the multiple Micro chips located on the packaging substrate, and identify the Micro chips with abnormal light color among the multiple Micro chips; A packaging module, used for packaging the plurality of Micro chips to form a plurality of MIP lamp beads; The second identification module is used to perform EL electrical testing on the multiple MIP lamp beads after packaging, and identify the MIP lamp beads with abnormal electrical performance among the multiple MIP lamp beads.

8. A computer-readable storage medium, characterized in that: The computer-readable storage medium includes a stored executable program, wherein when the executable program is running, the device where the computer-readable storage medium is located is controlled to execute the MIP lamp bead detection method according to any one of claims 1 to 6.

9. A lamp bead packaging device, characterized in that: include: Giant transfer equipment and controller, wherein The controller is used to control the giant transfer device to transfer multiple Micro chips to the packaging substrate; The controller is also used to detect the multiple MIP lamp beads formed by the multiple Micro chips on the packaging substrate based on the MIP lamp bead detection method described in any one of claims 1 to 6.

10. A computer program product, comprising a computer program, characterized in that When the computer program is executed by a processor, the steps of the method according to any one of claims 1 to 6 are implemented.

Images