Cleaning equipment for MOS (Metal Oxide Semiconductor) chip and wafer

Abstract

The invention discloses cleaning equipment for MOS chips and wafers, and relates to the technical field of MOS chip and wafer cleaning, the cleaning equipment comprises a base and a supporting plate, the supporting plate is placed on the base, multiple sets of lower limiting parts are fixedly arranged on the supporting plate, each set of lower limiting parts is connected with one set of upper limiting parts in a matched mode, the adjacent upper limiting parts are fixedly arranged, and the lower limiting parts are fixedly connected with the supporting plate. The lower limiting piece and the upper limiting piece which are matched with each other are spliced to form a whole circle, and wafer fixing semi-rings are arranged on the inner sides of the lower limiting piece and the upper limiting piece which are matched with each other in a matched manner. During use, when a butt joint knob is in butt joint with a butt joint block, a motor drives a transmission shaft to rotate, the transmission shaft drives a plurality of groups of transmission wheels to rotate, and each group of transmission wheels drives two corresponding groups of semi-ring bodies to move through corresponding driving openings, so that a driving effect on a wafer is realized, and the wafer moves relative to an erasing plate; and meanwhile, the cleaning is carried out through the spray head, so that the cleaning effect is improved.

Description

Technical Field

[0001] The invention relates to the technical field of wafer cleaning, and in particular to a MOS chip and wafer cleaning equipment. Background Art

[0002] Wafers are silicon chips used to make silicon semiconductor integrated circuits. MOS chips are manufactured on wafers through a series of complex processes, such as photolithography and etching. During the manufacturing process, wafer cleaning operations need to be performed many times. Wafer cleaning is a key step in the semiconductor manufacturing process, which aims to remove pollutants generated by the contact of wafers with various organic substances, particles and metals during continuous processing. This process effectively removes particles, organic substances, metal ions and oxides on the surface of the wafer through physical and chemical methods to ensure that the wafer has a clean surface suitable for subsequent processing.

[0003] Tank cleaning equipment is a commonly used device for wafer cleaning. It mainly performs deep cleaning based on the cavitation effect of ultrasound in liquid. When using, the wafer needs to be placed in the cleaning basket, and then the cleaning basket is placed in the cleaning tank. The cleaning liquid is added in proportion to ensure that the water level is appropriate. After the power is turned on, the ultrasonic working time and temperature are set according to the cleaning requirements, and the cleaning begins. After the cleaning is completed, the wafer is taken out and dried.

[0004] Tank cleaning equipment has some shortcomings in wafer cleaning. On the one hand, due to its structural characteristics, cross-infection is easy to occur between different wafers or batches, especially when the cleaning solution is not replaced in time or the cleaning tank is not cleaned thoroughly, which increases the risk of contamination. On the other hand, tank cleaning may not fully clean some hard-to-reach areas such as gaps and holes on the surface of the wafer, resulting in poor cleaning results. Summary of the invention

[0005] The purpose of the present invention is to provide a cleaning device for MOS chips and wafers, which solves the technical problem that cross-infection between different wafers or batches is easy, especially when the cleaning solution is not replaced in time or the cleaning tank is not cleaned thoroughly, which increases the risk of contamination.

[0006] The purpose of the present invention can be achieved by the following technical solutions:

[0007] A cleaning device for MOS chips and wafers.

[0008] As a further solution of the present invention: it includes a base and a support plate, the support plate is placed on the base, and multiple groups of lower limit members are fixedly arranged on the support plate, each group of the lower limit members is matched and connected with a group of upper limit members, and adjacent upper limit members are fixedly arranged, and the lower limit members and the upper limit members that match each other are spliced ​​into a whole circle, and the inner sides of the lower limit members and the upper limit members that match each other are provided with wafer fixing half rings that match each other, and the two groups of wafer fixing half rings that match each other are spliced ​​into a whole circle, and wafers are matched and installed between every two groups of the wafer fixing half rings that match each other, and the base is provided with a driving mechanism for driving all the wafer fixing half rings to rotate synchronously, a spraying mechanism for flushing each group of wafers is provided above the support plate, and a detachable brushing mechanism for assisting the spraying mechanism and cleaning the wafer surface is provided above the upper limit member.

[0009] As a further solution of the present invention: each group of the wafer fixing semi-rings includes a semi-ring body, the inner side of the semi-ring body is provided with a wafer groove for loading wafers, each group of the lower limit members includes a lower semi-ring limit plate fixedly connected to the support plate, both sides of the lower semi-ring limit plate are fixedly connected with lower connecting plates, the inner side of the lower semi-ring limit plate is provided with a lower movement groove, each group of the upper limit members includes an upper semi-ring limit plate, both sides of the upper semi-ring limit plate are fixedly connected with upper connecting plates matched with the lower connecting plates, the inner side of the upper semi-ring limit plate is provided with an upper movement groove, the two adjacent groups of upper semi-ring limit plates are fixedly connected, and the lower movement groove and the inner side of the upper movement groove are matched with the corresponding semi-ring bodies.

[0010] As a further solution of the present invention: a plurality of groups of lower balls are arranged on the inner side of the lower motion groove for equidistant rotation, a plurality of groups of upper balls are arranged on the inner side of the upper motion groove for equidistant rotation, and a ball groove matching with the lower balls and the upper balls is opened on the outer side of the semi-ring body.

[0011] As a further solution of the present invention: side limiting grooves are provided on both sides of the semi-ring body, and the inner sides of the upper movement groove and the lower movement groove are both provided with protrusions that cooperate with the side limiting grooves and play a limiting role on the semi-ring body.

[0012] As a further solution of the present invention: the driving mechanism includes a transmission shaft rotatably connected to all or part of the lower semi-ring limit plate and a motor fixedly connected to the base, the motor output end is coaxially fixedly connected with a docking block, a plurality of groups of transmission wheels are equidistantly arranged and fixedly connected to the side of the transmission shaft, a driving opening is opened on one side of the lower semi-ring limit plate, each group of transmission wheels contacts with the corresponding semi-ring body through the corresponding driving opening, and one end of the transmission shaft is coaxially fixedly connected with a docking knob matching the docking block.

[0013] As a further solution of the present invention: the support plates are provided in two groups, and the base is fixedly connected with a sliding guide rail that slidably cooperates with the corresponding support plates.

[0014] As a further solution of the present invention: the spraying mechanism includes a water pipe that is slidably fitted above the corresponding support plate, and a plurality of groups of nozzles are fixedly connected to the water pipe at equal intervals, each group of the nozzles is located on one side of the corresponding lower semi-ring limit plate, and one end of the water pipe is fixedly connected to a Y-shaped mixing tube, and valves are provided at both groups of inlets of the Y-shaped mixing tube, one group of the valve input ends is fixedly connected to a cleaning liquid delivery device, and the other group of the valve input ends is fixedly connected to an airflow delivery fan.

[0015] As a further solution of the present invention: the water pipe is arranged in a polygonal shape, and a spraying adjustment mechanism is arranged on the base, and the spraying adjustment mechanism includes an electric telescopic rod fixedly connected to one side of the base, the telescopic end of the electric telescopic rod is connected to a transmission rope, and the other end of the transmission rope is connected to an articulated frame, one end of the water pipe is fixedly connected to a hinged plate movably hinged to the articulated frame, a changing vertical rod is fixedly connected to the base, an opening is opened on the changing vertical rod, and a changing wheel for changing the extension direction of the transmission rope is rotatably connected to the inner side of the opening, and an elastic component is fixedly arranged on the water pipe, and the elastic end of the elastic component is fixedly connected to a group of lower semi-ring limit plates.

[0016] As a further solution of the present invention: the scrubbing mechanism includes an arc-shaped cover plate, which is placed above all the upper half-ring limit plates, and a plurality of groups of wiping plates for cleaning the wafer surface are fixedly connected to the bottom of the arc-shaped cover plate at equal intervals.

[0017] As a further solution of the present invention: the elastic component includes a spring, one end of the spring is connected to the water pipe, and the other end of the spring is connected to a group of lower half ring limit plates.

[0018] Beneficial effects of the present invention:

[0019] 1. When the present invention is in use, when the docking knob is docked with the docking block, the motor is started to drive the docking block and the docking knob to rotate, the docking knob drives the transmission shaft to rotate, the transmission shaft drives multiple groups of transmission wheels to rotate, each group of transmission wheels drives the corresponding two groups of semi-ring bodies to move through the corresponding driving openings, thereby achieving a driving effect on the wafer, so that the wafer moves relative to the wiping plate, thereby facilitating the cleaning of the wafer surface by the wiping plate, and at the same time flushing through the nozzle to improve the cleaning effect.

[0020] 2. When the present invention is in use, during cleaning or drying, the electric telescopic rod will repeatedly contract and extend. When the electric telescopic rod contracts, it will drive one end of the transmission rope to move, thereby pulling the hinged frame, driving the hinged plate and the water pipe to move; when the electric telescopic rod extends, the water pipe, the hinged plate, the hinged frame, and the transmission rope will reset under the action of the spring; thereby realizing the reciprocating motion of the nozzle, realizing the adjustment of the flushing position of the cleaning liquid, and improving the flushing or drying effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The present invention will be further described below in conjunction with the accompanying drawings.

[0022] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0023] Figure 2 yes Figure 1 A schematic diagram of the partially enlarged structure at position A in the middle;

[0024] Figure 3 It is a schematic diagram of the structure of the upper limit member and the lower limit member in cooperation with each other in the present invention;

[0025] Figure 4 It is a schematic diagram of the structure after the present invention is split;

[0026] Figure 5 It is a structural schematic diagram of the spraying mechanism of the present invention;

[0027] Figure 6 It is a schematic diagram of the structure of the driving opening of the present invention;

[0028] Figure 7 It is a schematic diagram of the structure of the wafer fixing half ring of the present invention;

[0029] Figure 8 It is a structural schematic diagram of the cross-section of the upper limit member and the lower limit member of the present invention.

[0030] In the figure: 1, base; 2, lower limiter; 201, lower half ring limiter plate; 202, lower connecting plate; 203, lower ball; 204, drive opening; 205, lower motion groove; 3, support plate; 4, upper limiter; 401, upper half ring limiter plate; 402, upper connecting plate; 403, upper ball; 404, upper motion groove; 5, scrubbing mechanism; 501, arc cover plate; 502, wiper plate; 6, spraying mechanism; 601, water pipe; 602, nozzle; 603, Y-type mixing pipe; 604 , valve; 7, spray adjustment mechanism; 701, electric telescopic rod; 702, change-direction vertical rod; 703, hinged plate; 704, hinged frame; 705, elastic component; 706, transmission rope; 8, wafer fixing half ring; 801, half ring body; 802, side limit groove; 803, bead groove; 804, wafer groove; 9, driving mechanism; 901, motor; 902, docking block; 903, docking knob; 904, transmission shaft; 905, transmission wheel; 10, sliding guide rail; 11, protrusion. DETAILED DESCRIPTION

[0031] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0032] See also Figure 1-8 As shown, the present invention is a MOS chip and wafer cleaning device, comprising a base 1 and a support plate 3, wherein the support plate 3 is provided in two groups, and a sliding guide rail 10 is fixedly connected to the base 1 and slides with the corresponding support plate 3, so as to facilitate the movement and positioning of the support plate 3. Figure 3 As shown, multiple groups of lower limit members 2 are fixedly arranged on the support plate 3, and each group of lower limit members 2 is matched and connected with a group of upper limit members 4. Adjacent upper limit members 4 are fixedly arranged, and the matched lower limit members 2 and upper limit members 4 are spliced ​​into a whole circle. Each group of lower limit members 2 includes a lower semi-ring limit plate 201 fixedly connected to the support plate 3, and lower connecting plates 202 are fixedly connected on both sides of the lower semi-ring limit plate 201, and a lower movement groove 205 is opened on the inner side of the lower semi-ring limit plate 201. Each group of upper limit members 4 includes an upper semi-ring limit plate 401, and upper connecting plates 402 matched and connected with the lower connecting plates 202 are fixedly connected on both sides of the upper semi-ring limit plate 401, and an upper movement groove 404 is opened on the inner side of the upper semi-ring limit plate 401, and two adjacent groups of upper semi-ring limit plates 401 are fixedly connected.

[0033] The inner sides of the mutually cooperating lower limit member 2 and upper limit member 4 are both provided with mutually cooperating wafer fixing half rings 8, such as Figure 7As shown, two sets of wafer fixing half rings 8 that cooperate with each other are spliced ​​into a full circle, and wafers are installed between each two sets of wafer fixing half rings 8 that cooperate with each other. Each set of wafer fixing half rings 8 includes a half ring body 801, and a wafer groove 804 for loading wafers is opened inside the half ring body 801. The half ring body 801 is arranged inside the lower movement groove 205 and the upper movement groove 404, and the half ring body 801 can move along the lower movement groove 205 and the upper movement groove 404, thereby driving the wafer to rotate, thereby facilitating the cleaning of the wafer.

[0034] Multiple groups of lower balls 203 are arranged equidistantly and rotatably around the inner side of the lower movement groove 205, and multiple groups of upper balls 403 are arranged equidistantly and rotatably around the inner side of the upper movement groove 404. Ball grooves 803 cooperating with the lower balls 203 and the upper balls 403 are provided on the outer side of the semi-ring body 801, so as to facilitate the semi-ring body 801 to move along the lower movement groove 205 and the upper movement groove 404. Side limiting grooves 802 are provided on both sides of the semi-ring body 801, and protrusions 11 cooperating with the side limiting grooves 802 and limiting the semi-ring body 801 are provided on the inner side of the upper movement groove 404 and the lower movement groove 205. The protrusions 11 ensure that the semi-ring body 801 will not easily escape from the upper movement groove 404 and the lower movement groove 205.

[0035] The base 1 is provided with a driving mechanism 9 for driving all wafer fixing half rings 8 to rotate synchronously, and the driving mechanism 9 includes a transmission shaft 904 rotatably connected to all or part of the lower half ring limit plates 201 and a motor 901 fixedly connected to the base 1, such as Figure 1 As shown, the output end of the motor 901 is coaxially fixedly connected with a docking block 902, and multiple groups of transmission wheels 905 are equidistantly arranged and fixedly connected on the side of the transmission shaft 904. A driving opening 204 is provided on one side of the lower semi-ring limit plate 201, and each group of transmission wheels 905 contacts the corresponding semi-ring body 801 through the corresponding driving opening 204. A docking knob 903 coaxially fixedly connected with the docking block 902 is provided on one end of the transmission shaft 904, and a groove body that can be embedded with the docking block 902 is provided on the side of the docking knob 903 close to the docking block 902. When the docking knob 903 is docked with the docking block 902, the motor 901 is started, driving the docking block 902 and the docking knob 903 to rotate, the docking knob 903 drives the transmission shaft 904 to rotate, and the transmission shaft 904 drives multiple groups of transmission wheels 905 to rotate, and each group of transmission wheels 905 drives the corresponding two groups of semi-ring bodies 801 to move through the corresponding driving opening 204, thereby achieving the driving effect on the wafer.

[0036] The transmission shaft 904 can be rotatably connected to all of the lower half-ring limit plates 201 , or can be rotatably connected to some of the lower half-ring limit plates 201 , the main purpose of which is to ensure the stability of the transmission shaft 904 during rotation.

[0037] A spray mechanism 6 for washing each group of wafers is arranged above the support plate 3. The spray mechanism 6 includes a water pipe 601 that is slidably fitted above the corresponding support plate 3. Multiple groups of nozzles 602 are fixedly connected to the water pipe 601 at equal intervals. Each group of nozzles 602 is located on one side of the corresponding lower semi-ring limit plate 201. A Y-shaped mixing pipe 603 is fixedly connected to one end of the water pipe 601. Valves 604 are arranged at both inlets of the Y-shaped mixing pipe 603. A cleaning liquid delivery device is fixedly connected to the input end of one group of valves 604 for delivering cleaning liquid, and an airflow delivery fan is fixedly connected to the input end of the other group of valves 604 for delivering airflow. The cleaning liquid is used to wash the surface of the wafer, and the airflow is used to dry the cleaning liquid on the surface of the wafer.

[0038] The water pipe 601 is arranged in a polygonal shape, and the water pipe 601 slides through the upper end of the support plate 3. The polygonal water pipe 601 can prevent the water pipe 601 from rotating when in use, and ensure that the output direction of the nozzle 602 will not change. A spraying adjustment mechanism 7 is arranged on the base 1, and the spraying adjustment mechanism 7 includes an electric telescopic rod 701 fixedly connected to one side of the base 1, and a transmission rope 706 is connected to the telescopic end of the electric telescopic rod 701, and the other end of the transmission rope 706 is connected to the hinge frame 704, and one end of the water pipe 601 is fixedly connected to a hinge plate 703 that is movably hinged to the hinge frame 704. The electric telescopic rod 701 is contracted to drive one end of the transmission rope 706 to move, and then the hinge frame 704 is pulled, driving the hinge plate 703 and the water pipe 601 to move, so as to adjust the position of the nozzle 602. A change-of-direction vertical rod 702 is fixedly connected to the base 1, and an opening is provided on the change-of-direction vertical rod 702. A change-of-direction wheel for changing the extension direction of the transmission rope 706 is rotatably connected to the inner side of the opening. An elastic component 705 is fixedly provided on the water pipe 601. The elastic component 705 includes a spring, one end of which is connected to the water pipe 601, and the other end is connected to a set of lower half ring limit plates 201. When the electric telescopic rod 701 is extended, the water pipe 601 and the nozzle 602 will be reset under the action of the spring.

[0039] A detachable brushing mechanism 5 for assisting the spraying mechanism 6 and brushing the wafer surface is arranged above the upper limit member 4. The brushing mechanism 5 comprises an arc-shaped cover plate 501, which is placed above all the upper half ring limit plates 401, and a plurality of groups of wiping plates 502 for cleaning the wafer surface are fixedly connected at equal intervals to the bottom of the arc-shaped cover plate 501, and a plurality of groups of soft brushes are arranged on the wiping plate 502 for cleaning the wafer surface.

[0040] The working principle of the present invention: when in use, the wafers are sequentially placed inside multiple groups of lower wafer slots 804 arranged inside the lower limit member 2, and the support plate 3 and its connecting components are placed inside the slot-type cleaning equipment for cleaning. After cleaning, the support plate 3 and its connecting components are placed on the base 1 to ensure that the support plate 3 and the sliding guide rail 10 are in sliding cooperation. Then, the upper limit member 4 is installed on the lower limit member 2, and the lower connecting plate 202 is connected with the upper connecting plate 402 by bolts to ensure that the positions of the lower semi-ring limit plate 201 and the upper semi-ring limit plate 401 are fixed, so that each group of wafers is fixed inside the corresponding two groups of wafer slots 804, and then the output ends of the cleaning liquid conveying device and the airflow conveying fan are respectively connected to the two groups of input ends of the Y-type mixing tube 603. The arc cover plate 501 is placed on the upper limit member 4, and the position of the arc cover plate 501 is adjusted so that each group of wafers is in contact with the corresponding wipe plate 502. If the wafers only need to be rinsed, there is no need to place the arc cover plate 501;

[0041] Push the support plate 3 to make the docking knob 903 dock with the docking block 902, and hinge the hinge frame 704 and the hinge plate 703 through the pin. Start the motor 901 to drive the docking block 902 and the docking knob 903 to rotate, the docking knob 903 drives the transmission shaft 904 to rotate, the transmission shaft 904 drives multiple sets of transmission wheels 905 to rotate, each set of transmission wheels 905 drives the corresponding two sets of semi-ring bodies 801 to move along the lower ball 203 and the upper ball 403 through the corresponding driving opening 204, thereby achieving the driving effect on the wafer, so that the wafer moves relative to the wiping plate 502, so as to facilitate the cleaning of the wafer surface by the wiping plate 502;

[0042] During rinsing, the valve 604 between the Y-shaped mixing tube 603 and the cleaning liquid delivery device is opened, and the other set of valves 604 is closed. The cleaning liquid delivery device delivers cleaning liquid to the Y-shaped mixing tube 603 and the water pipe 601, and rinses the corresponding wafer surface through the nozzle 602 to achieve secondary cleaning;

[0043] After the cleaning is completed, the arc-shaped cover plate 501 is removed, the cleaning liquid delivery device is closed, the valve 604 between the Y-shaped mixing tube 603 and the cleaning liquid delivery device is closed, the valve 604 between the Y-shaped mixing tube 603 and the air flow delivery fan is opened, and the air flow delivery fan is turned on. The air flow delivery fan delivers the air flow to the wafer surface through the water pipe 601 and the nozzle 602, so as to facilitate drying the cleaning liquid on the wafer surface;

[0044] During cleaning or drying, the electric telescopic rod 701 will repeatedly contract and extend. When the electric telescopic rod 701 contracts, it will drive one end of the transmission rope 706 to move, thereby pulling the hinge frame 704, driving the hinge plate 703 and the water pipe 601 to move; when the electric telescopic rod 701 extends, the water pipe 601, the hinge plate 703, the hinge frame 704, and the transmission rope 706 will reset under the action of the spring; thereby realizing the reciprocating motion of the nozzle 602, realizing the adjustment of the flushing position of the cleaning liquid, and improving the flushing or drying effect;

[0045] During disassembly, the staff needs to rotate the docking knob 903 to reset the semi-ring bodies 801 inside the mutually cooperating lower movement groove 205 and the upper movement groove 404, so that the lower movement groove 205 and the upper movement groove 404 are aligned with the corresponding semi-ring bodies 801, that is, the contact surfaces of the two sets of mutually cooperating semi-ring bodies 801 are aligned with the contact surfaces of the mutually cooperating lower semi-ring limit plates 201 and upper semi-ring limit plates 401, thereby facilitating the separation of the lower limit member 2 and the upper limit member 4.

[0046] The above is a detailed description of an embodiment of the present invention, but the content is only a preferred embodiment of the present invention and cannot be considered to limit the scope of implementation of the present invention. All equivalent changes and improvements made within the scope of the present invention should still fall within the scope of the patent coverage of the present invention.

Claims

1. A cleaning device for MOS chips and wafers, characterized in that: The invention comprises a base (1) and a support plate (3), wherein the support plate (3) is placed on the base (1), and a plurality of groups of lower limit members (2) are fixedly arranged on the support plate (3), and each group of the lower limit members (2) is matched and connected with a group of upper limit members (4), and the adjacent upper limit members (4) are fixedly arranged, and the lower limit members (2) and the upper limit members (4) that match each other are spliced ​​together to form a full circle, and the inner sides of the lower limit members (2) and the upper limit members (4) that match each other are both provided with mutually matched wafer fixing half rings (8), and the lower limit members (2) and the upper limit members (4) that match each other are connected to each other. The two groups of mutually cooperating wafer fixing half rings (8) are spliced ​​together to form a full circle, and wafers are mounted between each two groups of mutually cooperating wafer fixing half rings (8). The base (1) is provided with a driving mechanism (9) for driving all the wafer fixing half rings (8) to rotate synchronously. A spraying mechanism (6) for flushing each group of wafers is provided above the support plate (3), and a detachable brushing mechanism (5) for assisting the spraying mechanism (6) and for cleaning the surface of the wafer is provided above the upper limit member (4).

2. A MOS chip and wafer cleaning device according to claim 1, characterized in that: Each group of the wafer fixing semi-rings (8) comprises a semi-ring body (801), the inner side of the semi-ring body (801) is provided with a wafer slot (804) for loading wafers, each group of the lower limiting members (2) comprises a lower semi-ring limiting plate (201) fixedly connected to the support plate (3), both sides of the lower semi-ring limiting plate (201) are fixedly connected with lower connecting plates (202), the inner side of the lower semi-ring limiting plate (201) is provided with a lower movement slot (205), and each group of the upper limiting members (2) comprises a lower semi-ring limiting plate (201) fixedly connected to the support plate (3), lower connecting plates (202) are fixedly connected on both sides of the lower semi-ring limiting plate (201), and a lower movement slot (205) is provided on the inner side of the lower semi-ring limiting plate (201). The limiting components (4) each include an upper semi-ring limiting plate (401), both sides of which are fixedly connected with upper connecting plates (402) that cooperate with the lower connecting plate (202), an upper movement groove (404) is provided on the inner side of the upper semi-ring limiting plate (401), two adjacent groups of the upper semi-ring limiting plates (401) are fixedly connected, and the inner sides of the lower movement groove (205) and the upper movement groove (404) cooperate with the corresponding semi-ring body (801).

3. A MOS chip and wafer cleaning device according to claim 2, characterized in that: A plurality of groups of lower balls (203) are arranged on the inner side of the lower movement groove (205) so as to be equidistantly rotatable, and a plurality of groups of upper balls (403) are arranged on the inner side of the upper movement groove (404) so ​​as to be equidistantly rotatable. A ball groove (803) matching with the lower balls (203) and the upper balls (403) is provided on the outer side of the semi-ring body (801).

4. A MOS chip and wafer cleaning device according to claim 3, characterized in that: Side limiting grooves (802) are provided on both sides of the semi-ring body (801), and protrusions (11) are provided on the inner sides of the upper movement groove (404) and the lower movement groove (205) to match the side limiting grooves (802) and to limit the semi-ring body (801).

5. The MOS chip and wafer cleaning device according to claim 1, characterized in that: The driving mechanism (9) comprises a transmission shaft (904) rotatably connected to all or part of the lower semi-ring limit plate (201) and a motor (901) fixedly connected to the base (1); the output end of the motor (901) is coaxially fixedly connected to a docking block (902); a plurality of groups of transmission wheels (905) are equidistantly arranged and fixedly connected to the side of the transmission shaft (904); a driving opening (204) is provided on one side of the lower semi-ring limit plate (201); each group of transmission wheels (905) contacts a corresponding semi-ring body (801) through a corresponding driving opening (204); and a docking knob (903) cooperating with the docking block (902) is coaxially fixedly connected to one end of the transmission shaft (904).

6. A MOS chip and wafer cleaning device according to claim 1, characterized in that: The support plates (3) are provided in two groups, and the base (1) is fixedly connected with a sliding guide rail (10) which is slidably matched with the corresponding support plates (3).

7. The MOS chip and wafer cleaning device according to claim 1, characterized in that: The spraying mechanism (6) comprises a water pipe (601) which is slidably fitted on the corresponding support plate (3); a plurality of groups of nozzles (602) are fixedly connected to the water pipe (601) at equal intervals; each group of nozzles (602) is located on one side of the corresponding lower semi-ring limit plate (201); one end of the water pipe (601) is fixedly connected to a Y-shaped mixing pipe (603); valves (604) are provided at two groups of inlets of the Y-shaped mixing pipe (603); a cleaning liquid delivery device is fixedly connected to the input end of one group of valves (604); and an air flow delivery fan is fixedly connected to the input end of the other group of valves (604).

8. A MOS chip and wafer cleaning device according to claim 7, characterized in that: The water pipe (601) is arranged in a polygonal shape. A spraying adjustment mechanism (7) is arranged on the base (1). The spraying adjustment mechanism (7) comprises an electric telescopic rod (701) fixedly connected to one side of the base (1). The telescopic end of the electric telescopic rod (701) is connected to a transmission rope (706). The other end of the transmission rope (706) is connected to an articulated frame (704). One end of the water pipe (601) is fixedly connected to a hinged plate (703) movably hinged to the articulated frame (704). A direction-changing vertical rod (702) is fixedly connected to the base (1). An opening is provided on the direction-changing vertical rod (702). A direction-changing wheel for changing the extension direction of the transmission rope (706) is rotatably connected to the inner side of the opening. An elastic component (705) is fixedly arranged on the water pipe (601). The elastic end of the elastic component (705) is fixedly connected to a group of lower semi-ring limit plates (201).

9. A MOS chip and wafer cleaning device according to claim 1, characterized in that: The scrubbing mechanism (5) comprises an arc-shaped cover plate (501), wherein the arc-shaped cover plate (501) is placed above all the upper half ring limit plates (401), and a plurality of groups of wiping plates (502) for cleaning the wafer surface are fixedly connected at equal intervals to the bottom of the arc-shaped cover plate (501).

10. A MOS chip and wafer cleaning device according to claim 8, characterized in that: The elastic component (705) comprises a spring, one end of which is cooperatively connected to the water pipe (601), and the other end of which is cooperatively connected to a set of lower half ring limit plates (201).

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