Chip welding device for micro-electric assembly

By designing a chip welding device for microelectric assembly including a driving mechanism and a lifting mechanism, the problem of substrate fixing and rapid removal in the prior art is solved, and efficient welding and rapid removal of substrates that are adapted to different sizes are achieved.

CN119973269AInactive Publication Date: 2025-05-13CHENGDU TIANBO MICROELECTRONICS TECH CO LTD
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Patent Information

Application Number
CN202510454713.3
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-04-11
Publication Date
2025-05-13
Estimated Expiration
Not applicable · inactive patent

AI Technical Summary

Technical Problem

Existing chip welding devices are difficult to adapt to substrates of different sizes, and it is difficult for staff to quickly remove the welded substrates.

Method used

A chip soldering device for microelectric assembly is designed, including a soldering machine, a platform, a vertical block, a fixed table, a groove and a lifting plate. Through the drive mechanism and the lift mechanism, the substrate is fixed, welded and quickly removed.

Benefits of technology

The device can plan suitable placement areas according to different sizes of substrates, ensure the quality of chip welding, and through the design of the lifting plate, it is convenient for staff to quickly remove the welded substrate.

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Abstract

The invention discloses a chip welding device for micro-electric assembly, and belongs to the technical field of micro-electronic assembly, the chip welding device comprises a soldering machine, a platform is arranged on the soldering machine, a plurality of vertical blocks are fixedly arranged on the platform, the side walls of the vertical blocks are jointly and fixedly connected with a fixing table, a groove is formed in the top wall of the fixing table, and the vertical blocks are arranged in the groove. Two opposite side walls of the groove are provided with transverse grooves respectively, the other two opposite side walls of the groove are provided with vertical grooves respectively, the two vertical rods penetrate through the two through holes respectively, a driving mechanism used for controlling the vertical rods and the short rods is arranged in the working cavity, and four lifting mechanisms used for controlling the lifting plates are arranged between the platform and the fixed table. The driving mechanism and the lifting mechanism linked with the driving mechanism are arranged in the fixed table, so that a worker can plan the range in advance according to the limited size of the substrate, and after the substrate is welded, the substrate can be lifted up through the lifting plate, and then the worker can take out the substrate conveniently.
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Description

Technical Field

[0001] The invention relates to the technical field of microelectronic assembly, and in particular to a chip welding device for microelectronic assembly. Background Art

[0002] Micro-electric assembly, or microelectronics assembly, is to assemble various micro components that make up the circuit on a high-density multi-layer interconnect substrate using micro-welding and packaging processes according to circuit diagrams or logic diagrams to form high-density, high-speed, high-reliability, three-dimensional microelectronic products. As a comprehensive technology, microelectronics assembly involves physics, chemistry, optics and other disciplines. Among various components, the chip is undoubtedly a very important one. The quality of chip welding is directly related to the quality of the entire product. The chip welding methods can be roughly divided into two categories: metal alloy welding (or low-melting point welding) and resin bonding.

[0003] For many surface-mount components, it is very common to use automatic soldering machines for machine soldering. The general workflow is that the staff first puts the substrate into the soldering position, and then the machine solders the chip to the substrate. Although most soldering machines have labels to prompt the staff how to place the substrate in the correct position, the substrate to be soldered will also change, and the labels may not be valid for all labels. In addition, after soldering, the staff needs to manually remove the substrate. The substrate is usually thin, so it will stick to the soldering machine. It is difficult for the staff to quickly remove the substrate with the chip soldered. For this reason, we propose a chip welding device for microelectronic assembly to solve the above problems. Summary of the invention

[0004] The purpose of the present invention is to solve the shortcomings existing in the prior art, such as: the chip welding device is difficult to fix and limit substrates of different sizes, and it is difficult for workers to quickly remove the substrate with the chip welded, and a chip welding device for micro-electronic assembly is proposed.

[0005] In order to achieve the above object, the present invention adopts the following technical solutions: A chip welding device for micro-electronic assembly comprises a soldering machine, wherein a platform is installed on the soldering machine, a plurality of vertical blocks are fixedly installed on the platform, and the side walls of the plurality of vertical blocks are commonly fixedly connected to a fixed platform, a top wall of the fixed platform is provided with a groove, two opposite side walls of the groove are respectively provided with a horizontal groove, and the other two opposite side walls are respectively provided with a vertical groove, a vertical rod is commonly slidably connected in the two vertical grooves, and short rods are respectively slidably connected in the two horizontal grooves, a horizontal rod is fixedly installed between the two short rods, a through hole is provided in the cross rod, and the two vertical rods respectively pass through two through holes, a working cavity is provided in the fixed platform, the vertical groove is connected with the working cavity, a driving mechanism for controlling the vertical rod and the short rod is provided in the working cavity, a lifting hole is provided in the middle position of the groove, a lifting plate is provided in the lifting hole, and four lifting mechanisms for controlling the lifting plate are provided between the platform and the fixed platform.

[0006] Through the above technical solution, the driving mechanism arranged in the fixed table and the lifting mechanism linked thereto enable the staff to plan the range in advance according to the size restrictions of the substrate, and after the substrate is welded, the substrate can be lifted upward by the lifting plate, thereby facilitating the staff to take out the substrate.

[0007] Preferably, the driving mechanism includes a first dual-axis motor, a first threaded rod, a first driving ring, a first bevel gear, an electric push rod, a second bevel gear, a telescopic rod, a forward and reverse screw rod and a motion block, the two output ends of the first dual-axis motor are respectively fixedly connected to the two first threaded rods, the first driving ring is threadedly connected to the first threaded rod, the side wall of the first driving ring is fixedly connected to an end of the vertical rod extending into the working chamber, the first bevel gear is fixedly connected to the first threaded rod and fixedly connected to an end away from the first dual-axis motor, the electric push rod is also arranged in the working chamber, the output end of the electric push rod is fixedly connected to the side wall of the second bevel gear, the first bevel gear is meshed with the second bevel gear, the telescopic rod is fixedly connected to the side wall of the second bevel gear away from the electric push rod, the other end of the telescopic rod is fixedly connected to the forward and reverse screw rods, the two motion blocks are respectively threadedly connected to the two opposite threaded sections of the forward and reverse screw rods, and the two short rods are respectively fixedly connected to the side walls of the two motion blocks.

[0008] Through the above technical solution, the first dual-axis motor in the driving mechanism can simultaneously drive the two first threaded rods to rotate. The rotation of the first threaded rod will cause the first driving ring to move, and the vertical rod installed on the side wall of the first driving ring can move in the vertical groove. The rotation of the first threaded rod will also cause the first bevel gear to drive the second bevel gear to rotate, and the second bevel gear will also drive the forward and reverse screw rods to rotate, thereby causing the moving block to drive the short rod and the cross rod to move, thereby dividing the position of the substrate.

[0009] Preferably, the telescopic rod includes a sleeve, an inner cylinder and a plurality of clamping rods, one end of the inner cylinder is fixedly connected to one end of the positive and negative screw rods, and the side wall of the other end is provided with a plurality of clamping grooves, and the plurality of clamping rods are respectively fixedly connected to the inner wall of the sleeve, and the sleeve is sleeved on the outside of the inner cylinder, and the plurality of clamping rods are respectively slidably connected to the inner walls of the plurality of clamping grooves, and the side wall of the sleeve away from the inner cylinder is fixedly connected to the side wall of the second bevel gear away from the electric push rod.

[0010] Through the above technical solution, since the telescopic rod not only needs to transmit the rotation of the second bevel gear to the forward and reverse screw rods, but also needs to achieve the purpose of telescoping, a movable sleeve and inner cylinder, as well as a clamping rod and a clamping slot that facilitate telescoping are provided, so that the telescopic rod can be both rotated and telescopic.

[0011] Preferably, the overall shape of the working chamber is "C"-shaped, and a side chamber is also provided in the fixing platform. The side chamber is located at the opening position of the working chamber, and the shape of the side chamber is "I"-shaped.

[0012] With the above technical solution, since the groove is arranged on the fixing table, the overall shape of the fixing table becomes a U-shape, and the working cavity and the side cavity can together form a U-shape, so the internal space of the fixing table can be completely divided, and the working cavity and the side cavity are not connected.

[0013] Preferably, a second dual-axis motor is installed in the side cavity, and the two output ends of the second dual-axis motor are respectively fixedly connected to second threaded rods, and the two second threaded rods are respectively threadedly connected to second drive rings, and the second drive ring is fixedly connected to the side wall of the vertical rod at one end away from the first drive ring.

[0014] Through the above technical solution, the first dual-axis motor and the second dual-axis motor can be controlled by one controller, so they can be started and shut down at the same time, so that both ends of the vertical rod can move at the same time, thereby planning a space for placing the substrate.

[0015] Preferably, the bottom wall of the working chamber and the bottom wall of the side chamber are both provided with through holes, the positions of the through holes are located on the forward paths of the first drive ring and the second drive ring, a moving rod is slidably connected in the through holes, and the longitudinal section of the moving rod is "L" shaped.

[0016] Through the above technical solution, the positions of the perforation and the motion rod are respectively located at the end of the first drive ring and the second drive ring away from the first dual-axis motor and the second dual-axis motor. Therefore, only when the first drive ring and the second drive ring drive the vertical rod to expand the circle range, that is, when the restriction on the substrate is released, will the motion rod be triggered to drive the lifting mechanism described below to move, so that the substrate placed on the lifting plate is driven to rise.

[0017] Preferably, the lifting mechanism includes a driving rack, a rotating gear, a driven rack, a connecting rod, a translation block and a support rod, one end of the moving rod is fixedly connected to the side wall of the driving rack, the rotating gear is rotatably connected to the top wall of the platform, the driving rack and the driven rack are respectively located on both sides of the rotating gear, the driving rack and the driven rack are both meshed with the rotating gear, the side wall of the driven rack is fixedly connected to the side wall of the connecting rod, two parallel extrusion grooves are provided on the top wall of the platform, the translation block is slidably connected to the inner wall of the extrusion groove, the side wall of the translation block is fixedly connected to the side wall of the connecting rod, one end of the support rod is rotatably connected to the top wall of the translation block, and the other end is rotatably connected to the bottom wall of the lifting plate.

[0018] Through the above technical solution, the moving rod is driven by the first driving ring and the second driving ring to move, so that the driving rack drives the rotating gear to rotate, and the driven rack meshing with the other side of the rotating gear can drive the connecting rod to move together, so that the translation block moves toward the middle position. The translation block drives the rotation of the support rod to lift the lifting plate, and the substrate placed on the lifting plate can be lifted, making it convenient for the staff to take the substrate.

[0019] Preferably, the top wall of the platform is provided with a plurality of limiting grooves, the bottom wall of the driving rack and the bottom wall of the driven rack are fixedly provided with limiting rods, the limiting rods are respectively slidably connected to the inner walls of the plurality of limiting grooves, one end of the driving rack is fixedly connected to a telescopic spring, and the other end of the telescopic spring is fixedly connected to the side wall of the vertical block.

[0020] Through the above technical solution, limiting rods and limiting grooves are set at the bottom of the driving rack and the driven rack, so that the movement direction of the driving rack and the driven rack is restricted, thereby ensuring that the movement of the two can be in the correct direction, effectively preventing the driving rack and the driven rack from moving in other directions, and avoiding unnecessary energy loss inside the system.

[0021] Preferably, a bottom groove is formed on the bottom wall of the vertical rod, two sliders are slidably connected in the bottom groove, a center spring is fixedly connected between the two sliders, baffles are fixedly connected to the side walls of the two sliders, the bottom wall of the baffles is abutted against the bottom wall of the groove, and the side wall of the baffle away from the slider is flush with the side wall of the vertical rod facing the lifting plate.

[0022] Through the above technical solution, since the vertical rod needs to pass through the through hole of the side wall of the horizontal rod, the thickness of the vertical rod is actually smaller than the thickness of the horizontal rod, and the bottom of the vertical rod does not directly contact the bottom of the groove, so the two vertical rods cannot play a limiting role on both sides of the substrate. Therefore, a baffle and a center spring are set at the bottom of the vertical rod. When the horizontal rod moves, the baffle can be squeezed to compress the center spring. The baffle directly in contact with the bottom of the groove can replace the vertical rod to play a role in limiting the position, so that the vertical rod can also support the side wall of the substrate, thereby fixing the substrate in the divided area.

[0023] Compared with the prior art, the present invention has the following beneficial effects: 1. By driving the first dual-axis motor and the second dual-axis motor, the vertical rod and the horizontal rod can be moved at the same time, and the position of the horizontal rod can be fixed by controlling the electric push rod, so as to accurately divide the placement area suitable for the current substrate. The appropriate area can be planned according to substrates of different sizes, which is convenient for welding chips on the substrate; 2. The operation of the first dual-axis motor and the second dual-axis motor can not only drive the vertical rod and the horizontal rod to divide the area, but also after the area is divided and the vertical rod opens the area, the two driving rings can drive the motion rod to move, and then the translation block drives the lifting plate to rise. Since the lifting plate is located in the middle of the groove, the substrate placed in the groove will definitely be driven by the lifting plate to rise together, so that it is convenient for the staff to take the substrate; 3. Since both the horizontal bar and the vertical bar need to limit the position of the substrate, the bottom of the horizontal bar and the vertical bar are preferably flush with the bottom of the groove, so that they can limit the substrate. A through hole is provided in the middle of the horizontal bar, so the bottom of the vertical bar cannot touch the bottom of the groove. In order to make the vertical bar also limit the substrate, a slider, a baffle and a center spring are provided at the bottom of the vertical bar, so that the baffle can be pushed by the horizontal bar, and then it can also play a limiting role while adapting to the position of the horizontal bar. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 This is a schematic structural diagram of a chip welding device for micro-electronic assembly proposed by the present invention; Figure 2 is a structural schematic diagram of the driving mechanism; Figure 3 is a schematic diagram of the structure between the second bevel gear and the telescopic rod; Figure 4 for Figure 3 A schematic diagram of the enlarged structure of part A; Figure 5 It is a schematic diagram of the structure inside the side cavity; Figure 6 It is a structural schematic diagram of the bottom of the vertical rod; Figure 7 It is a structural schematic diagram of the lifting mechanism; Figure 8 It is a structural schematic diagram of the translation block and the lifting plate; Fig. 9 Schematic diagram of the structure inside the limiting groove on the top of the platform.

[0025] In the figure: 1, soldering machine; 2, platform; 3, vertical block; 4, fixed table; 5, groove; 6, horizontal groove; 7, vertical groove; 8, vertical rod; 9, short rod; 10, horizontal rod; 11, through hole; 12, lifting hole; 13, lifting plate; 14, first dual-axis motor; 15, first threaded rod; 16, first driving ring; 17, first bevel gear; 18, electric push rod; 19, second bevel gear; 20, positive and negative threaded rod; 21, moving block; 22, sleeve; 23, inner Cylinder; 24, clamping rod; 25, clamping slot; 26, second dual-axis motor; 27, second threaded rod; 28, second drive ring; 29, perforation; 30, moving rod; 31, driving rack; 32, rotating gear; 33, driven rack; 34, connecting rod; 35, translation block; 36, supporting rod; 37, extrusion groove; 38, limiting groove; 39, limiting rod; 40, telescopic spring; 41, bottom groove; 42, slider; 43, center spring; 44, baffle. DETAILED DESCRIPTION

[0026] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0027] Reference Figure 1 A chip welding device for micro-electronic assembly includes a soldering machine 1, a platform 2 is installed on the soldering machine 1, a plurality of vertical blocks 3 are fixedly installed on the platform 2, the side walls of the plurality of vertical blocks 3 are fixedly connected to a fixed platform 4, and there is enough space between the fixed platform 4 and the platform 2 to place the lifting mechanism mentioned below. A groove 5 is opened on the top wall of the fixed platform 4, a lifting hole 12 is opened in the middle of the groove 5, a lifting plate 13 is installed in the lifting hole 12, and the size of the lifting hole 12 is consistent with the size of the lifting plate 13, so the lifting plate 13 is restricted by the lifting hole 12 in the direction of movement, and can only move along the direction of the lifting hole 12.

[0028] Two opposite side walls of the groove 5 are provided with transverse grooves 6, and the other two opposite side walls are provided with vertical grooves 7, that is, movable grooves are provided on all four sides of the groove 5, and the widths of the transverse grooves 6 and the vertical grooves 7 are consistent. A vertical rod 8 is slidably connected to the two vertical grooves 7, and a short rod 9 is slidably connected to the two transverse grooves 6, respectively. The width of the short rod 9 is consistent with the width of the transverse groove 6. A transverse rod 10 is fixedly installed between the two short rods 9, and the width of the transverse rod 10 is greater than the width of the short rod 9. The bottom of the transverse rod 10 is against the bottom of the groove 5. A through hole 11 is provided in the transverse rod 10, and the two vertical rods 8 pass through the two through holes 11 respectively, so the vertical rod 8 does not directly contact the bottom of the groove 5.

[0029] Reference Figure 2-Figure 4 A working chamber is provided in the fixed table 4, and the vertical slot 7 is connected to the working chamber. A driving mechanism for controlling the vertical rod 8 and the short rod 9 is installed in the working chamber. The driving mechanism includes a first dual-axis motor 14, a first threaded rod 15, a first driving ring 16, a first bevel gear 17, an electric push rod 18, a second bevel gear 19, a telescopic rod, a forward and reverse screw rod 20 and a moving block 21. The first dual-axis motor 14 in the driving mechanism can simultaneously drive the two first threaded rods 15 to rotate. The rotation of the first threaded rod 15 will cause the first driving ring 16 to move, and the vertical rod 8 installed on the side wall of the first driving ring 16 can move in the vertical slot 7. The rotation of the first threaded rod 15 will also cause the first bevel gear 17 to drive the second bevel gear 19 to rotate, and the second bevel gear 19 will also drive the forward and reverse screw rods 20 to rotate, so that the moving block 21 drives the short rod 9 and the cross bar 10 to move, thereby dividing the position of the substrate.

[0030] The two output ends of the first dual-axis motor 14 are respectively fixedly connected to the two first threaded rods 15, the first drive ring 16 is threadedly connected to the first threaded rod 15, the side wall of the first drive ring 16 is fixedly connected to the end of the vertical rod 8 extending into the working chamber, and the first bevel gear 17 is fixedly connected to the end of the first threaded rod 15 away from the first dual-axis motor 14. At the same time, a vertical plate is also provided at the end of the first threaded rod 15 away from the first dual-axis motor 14. The main function of the vertical plate is to support the first threaded rod 15 so that the first threaded rod 15 can rotate stably. The electric push rod 18 is also installed in the working chamber. The setting direction of the electric push rod 18 is at right angles to the setting direction of the first dual-axis motor 14. The output end of the electric push rod 18 is fixedly connected to the side wall of the second bevel gear 19, and the first bevel gear 17 is meshed with the second bevel gear 19. The telescopic rod is fixedly connected to the side wall of the second bevel gear 19 away from the electric push rod 18, and the other end of the telescopic rod is fixedly connected to the positive and negative threaded rod 20. One end of the positive and negative threaded rod 20 is rotatably connected to the side wall of the working chamber. A new vertical plate is also provided at the bottom of the working chamber to support the positive and negative threaded rod 20, thereby ensuring the stable rotation of the positive and negative threaded rod 20. The two motion blocks 21 are respectively threadedly connected to the two opposite threaded sections of the positive and negative threaded rod 20, and the two short rods 9 are respectively fixedly connected to the side walls of the two motion blocks 21.

[0031] The telescopic rod includes a sleeve 22, an inner cylinder 23 and a plurality of clamping rods 24. The sleeve 22 and the inner cylinder 23 are both designed in an annular shape. The inner diameter of the sleeve 22 is larger than the outer diameter of the inner cylinder 23. One end of the inner cylinder 23 is fixedly connected to one end of the positive and negative threaded rod 20. The side wall of the other end is provided with a plurality of clamping grooves 25. The clamping grooves 25 are evenly arranged on the side wall of the inner cylinder 23. The plurality of clamping rods 24 are respectively fixedly connected to the inner wall of the sleeve 22. The sleeve 22 is sleeved outside the inner cylinder 23. The plurality of clamping rods 24 are respectively slidably connected to the inner walls of the plurality of clamping grooves 25. The clamping rods 24 can only move along the direction of the clamping grooves 25. Therefore, when the sleeve 22 rotates, the inner cylinder 23 can be driven to rotate together. The telescopic rod not only needs to transmit the rotation of the second bevel gear 19 to the positive and negative threaded rod 20, but also needs to achieve the purpose of telescoping. The side wall of the sleeve 22 away from the inner cylinder 23 is fixedly connected to the side wall of the second bevel gear 19 away from the electric push rod 18.

[0032] The bottom wall of the working chamber and the bottom wall of the side chamber are both provided with a through hole 29, and the position of the through hole 29 is located on the forward path of the first drive ring 16 and the second drive ring 28. The through hole 29 and the movement rod 30 are both located in the direction away from the first dual-axis motor 14 and the second dual-axis motor 26. Therefore, the movement rod 30 can only be driven to move when the vertical rod 8 expands outward. The movement rod 30 is slidably connected in the through hole 29, and the longitudinal section of the movement rod 30 is "L"-shaped. The "L"-shaped design is to better drive the movement of the drive rack 31.

[0033] Reference Figure 5 The overall shape of the working chamber is "C"-shaped. A side chamber is also provided in the fixed platform 4. The side chamber is located at the opening position of the working chamber. The shape of the side chamber is "I"-shaped. Since the groove 5 is provided on the fixed platform 4, the overall shape of the fixed platform 4 becomes a round shape. The working chamber and the side chamber can form a round shape together, so the internal space of the fixed platform 4 can be divided completely, and the working chamber and the side chamber are not connected. A second dual-axis motor 26 is installed in the side chamber. The first dual-axis motor 14 and the second dual-axis motor 26 are only different in position. In fact, the two can be started by a starter. The two can be started and shut down at the same time. The two output ends of the second dual-axis motor 26 are respectively fixedly connected to the second threaded rod 27. The two second threaded rods 27 are respectively threadedly connected to the second drive ring 28. The second drive ring 28 is fixedly connected to the side wall of the vertical rod 8 away from the first drive ring 16.

[0034] Reference Figure 6The bottom wall of the vertical rod 8 is provided with a bottom groove 41, in which two sliders 42 are slidably connected, and a center spring 43 is fixedly connected between the two sliders 42. The side walls of the two sliders 42 are respectively fixedly connected with baffles 44, and the bottom wall of the baffle 44 is against the bottom wall of the groove 5. Since the vertical rod 8 needs to pass through the through hole 11 of the side wall of the cross bar 10, the bottom of the vertical rod 8 does not contact the bottom of the groove 5, and the two vertical rods 8 cannot play a limiting role on both sides of the substrate. Therefore, baffles 44 and center springs 43 are arranged at the bottom of the vertical rod 8, so that the vertical rod 8 can also support the side walls of the substrate, thereby fixing the substrate in the divided area, and the side wall of the baffle 44 away from the slider 42 is flush with the side wall of the vertical rod 8 facing the lifting plate 13. The reason why the baffle 44 is set flush with the side wall of the vertical rod 8 is to facilitate the staff to grasp the moving distance of the vertical rod 8, and then facilitate the control of the operation of the first dual-axis motor 14 and the second dual-axis motor 26.

[0035] Reference Figure 7 , Figure 8 and Fig. 9 Four lifting mechanisms for controlling the lifting plate 13 are installed between the platform 2 and the fixed platform 4, and the lifting mechanism includes a driving rack 31, a rotating gear 32, a driven rack 33, a connecting rod 34, a translation block 35 and a supporting rod 36. One end of the moving rod 30 is fixedly connected to the side wall of the driving rack 31, and the rotating gear 32 is rotatably connected to the top wall of the platform 2. The driving rack 31 and the driven rack 33 are respectively located on both sides of the rotating gear 32, and the driving rack 31 and the driven rack 33 are both engaged with the rotating gear 32. The moving rod 30 is driven by the two driving rings to move, so that the driving rack 31 drives the rotating gear 32 to rotate, and the driven rack 33 engaged with the other side of the rotating gear 32 can drive the connecting rod 34 to move together, so that the translation block 35 moves toward the middle position, so that the lifting plate 13 is lifted, and the substrate placed on the lifting plate 13 can be lifted to facilitate the staff to take the substrate. The top wall of the platform 2 is provided with a plurality of limiting grooves 38, and the bottom walls of the driving rack 31 and the driven rack 33 are fixedly provided with limiting rods 39, and the limiting rods 39 are respectively slidably connected to the inner walls of the limiting grooves 38. The limiting rods 39 and limiting grooves 38 are arranged at the bottom of the driving rack 31 and the driven rack 33, so that the movement direction of the driving rack 31 and the driven rack 33 is limited, thereby ensuring that the movement of the two can be in the correct direction. A telescopic spring 40 is fixedly connected to one end of the driving rack 31, and the other end of the telescopic spring 40 is fixedly connected to the side wall of the vertical block 3. The force applied by the telescopic spring 40 to the driving rack 31 will make the driving rack 31 and the moving rod 30 always be in the through hole 29 close to the end of the lifting plate 13.

[0036] The side wall of the driven rack 33 is fixedly connected to the side wall of the connecting rod 34. The top wall of the platform 2 is provided with two parallel extrusion grooves 37. Figure 7It can be seen that the extrusion groove 37 is located directly below the lifting plate 13 and is symmetrically arranged relative to the lifting plate 13. The translation block 35 is slidingly connected to the inner wall of the extrusion groove 37, the side wall of the translation block 35 is fixedly connected to the side wall of the connecting rod 34, one end of the support rod 36 is rotatably connected to the top wall of the translation block 35, and the other end is rotatably connected to the bottom wall of the lifting plate 13.

[0037] In the present invention, the staff first puts the substrate to be welded with the chip in the middle position of the groove 5, at which time the substrate is on the lifting plate 13, and then drives the first double-axis motor 14 and the second double-axis motor 26, so that the two simultaneously drive the first threaded rod 15 and the second threaded rod 27 to rotate, and the first drive ring 16 and the second drive ring 28 installed thereon will move at the same time. Since the side walls of the two are jointly provided with a vertical rod 8, the vertical rod 8 will move in the air through the cross bar 10. At the same time, due to the rotation of the first threaded rod 15, the first bevel gear 17 installed on the first threaded rod 15 will drive the second bevel gear 17 to rotate. The second bevel gear 19 rotates, and the second bevel gear 19 drives the sleeve 22 and the clamping rod 24 to rotate together. Since the clamping rod 24 is set in the clamping groove 25, the sleeve 22 drives the inner cylinder 23 to rotate, and the inner cylinder 23 drives the forward and reverse screw rods 20 to rotate. The motion block 21 installed on the forward and reverse screw rods 20 drives the cross bar 10 to move. When the cross bar 10 moves to a suitable position, it can drive the electric push rod 18, so that the electric push rod 18 drives the second bevel gear 19 to leave the first bevel gear 17. At this time, the forward and reverse screw rods 20 will lose their power source, so that the cross bar 10 stays at the current position; When welding is completed, the reverse rotation of the first dual-axis motor 14 and the second dual-axis motor 26 can drive the first drive ring 16 and the second drive ring 28 to move to both sides, so that the first drive ring 16 and the second drive ring 28 drive the moving rod 30 to move along the through hole 29, and the movement of the moving rod 30 will drive the driving rack 31 to move, and the rotating gear 32 engaged with the driving rack 31 will drive the driven rack 33 to move, and then the driven rack 33 drives the connecting rod 34 to move, and the translation block 35 fixedly mounted on the side wall of the connecting rod 34 will move along the extrusion groove 37. Since the lifting plate 13 is framed in the lifting hole 12, the movement of the translation block 35 will cause the support rod 36 to tilt, thereby causing the lifting plate 13 to rise, and the substrate located on the lifting plate 13 will be driven to rise, thereby facilitating the staff to take the substrate with the chip welded.

[0038] In the description of the present invention, it is necessary to understand that the terms "coaxial", "bottom", "one end", "top", "middle", "the other end", "upper", "one side", "top", "inside", "front", "center", "both ends" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0039] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical solutions and concepts of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A chip welding device for micro-electronic assembly, comprising a soldering machine (1), wherein a platform (2) is mounted on the soldering machine (1), a plurality of vertical blocks (3) are fixedly mounted on the platform (2), and the side walls of the plurality of vertical blocks (3) are commonly fixedly connected to a fixing table (4), characterized in that: The top wall of the fixed platform (4) is provided with a groove (5), two opposite side walls of the groove (5) are respectively provided with a transverse groove (6), and the other two opposite side walls are respectively provided with a vertical groove (7), a vertical rod (8) is slidably connected to the two vertical grooves (7), a short rod (9) is slidably connected to the two horizontal grooves (6), a transverse rod (10) is fixedly installed between the two short rods (9), a through hole (11) is provided in the transverse rod (10), and the two vertical rods (8) pass through the two through holes (11), respectively, a working cavity is provided in the fixed platform (4), the vertical groove (7) is connected to the working cavity, a driving mechanism for controlling the vertical rod (8) and the short rod (9) is installed in the working cavity, a lifting hole (12) is provided in the middle position of the groove (5), a lifting plate (13) is installed in the lifting hole (12), and four lifting mechanisms for controlling the lifting plate (13) are installed between the platform (2) and the fixed platform (4).

2. A chip welding device for micro-electronic assembly according to claim 1, characterized in that: The driving mechanism comprises a first dual-axis motor (14), a first threaded rod (15), a first driving ring (16), a first bevel gear (17), an electric push rod (18), a second bevel gear (19), a telescopic rod, a positive and negative threaded rod (20) and a moving block (21), wherein two output ends of the first dual-axis motor (14) are respectively fixedly connected to the two first threaded rods (15), the first driving ring (16) is threadedly connected to the first threaded rod (15), a side wall of the first driving ring (16) is fixedly connected to one end of the vertical rod (8) extending into the working chamber, and the first bevel gear (17) is fixedly connected to the first threaded rod (15). ) is away from one end of the first dual-axis motor (14), the electric push rod (18) is also arranged in the working chamber, the output end of the electric push rod (18) is fixedly connected to the side wall of the second bevel gear (19), the first bevel gear (17) is meshed with the second bevel gear (19), the telescopic rod is fixedly connected to the side wall of the second bevel gear (19) away from the electric push rod (18), the other end of the telescopic rod is fixedly connected to the positive and negative threaded rod (20), the two moving blocks (21) are respectively threadedly connected to the two opposite threaded sections of the positive and negative threaded rod (20), and the two short rods (9) are respectively fixedly connected to the side walls of the two moving blocks (21).

3. A chip welding device for micro-electronic assembly according to claim 2, characterized in that: The telescopic rod comprises a sleeve (22), an inner sleeve (23) and a plurality of clamping rods (24); one end of the inner sleeve (23) is fixedly connected to one end of the positive and negative threaded rod (20); a plurality of clamping grooves (25) are provided on the side wall of the other end; the plurality of clamping rods (24) are respectively fixedly connected to the inner wall of the sleeve (22); the sleeve (22) is sleeved outside the inner sleeve (23); the plurality of clamping rods (24) are respectively slidably connected to the inner walls of the plurality of clamping grooves (25); and the side wall of the sleeve (22) at one end away from the inner sleeve (23) is fixedly connected to the side wall of the second bevel gear (19) at one side away from the electric push rod (18).

4. A chip welding device for micro-electronic assembly according to claim 2, characterized in that: The overall shape of the working chamber is "C"-shaped, and the fixing platform (4) is also provided with a side chamber, the side chamber is located at the opening position of the working chamber, and the shape of the side chamber is "I"-shaped.

5. A chip welding device for micro-electronic assembly according to claim 4, characterized in that: A second dual-axis motor (26) is arranged in the side cavity, and two output ends of the second dual-axis motor (26) are respectively fixedly connected to second threaded rods (27), and two second threaded rods (27) are respectively threadedly connected to second drive rings (28), and the second drive rings (28) are fixedly connected to the side wall of the vertical rod (8) at one end away from the first drive ring (16).

6. A chip welding device for micro-electronic assembly according to claim 5, characterized in that: The bottom wall of the working chamber and the bottom wall of the side chamber are both provided with a through hole (29), the through hole (29) is located on the forward path of the first drive ring (16) and the second drive ring (28), a moving rod (30) is slidably connected in the through hole (29), and the longitudinal section of the moving rod (30) is "L"-shaped.

7. A chip welding device for micro-electronic assembly according to claim 6, characterized in that: The lifting mechanism comprises a driving rack (31), a rotating gear (32), a driven rack (33), a connecting rod (34), a translation block (35) and a support rod (36); one end of the moving rod (30) is fixedly connected to the side wall of the driving rack (31); the rotating gear (32) is rotatably connected to the top wall of the platform (2); the driving rack (31) and the driven rack (33) are respectively located on both sides of the rotating gear (32); 3) are meshed with the rotating gear (32), the side wall of the driven rack (33) is fixedly connected to the side wall of the connecting rod (34), the top wall of the platform (2) is provided with two parallel extrusion grooves (37), the translation block (35) is slidably connected to the inner wall of the extrusion groove (37), the side wall of the translation block (35) is fixedly connected to the side wall of the connecting rod (34), one end of the support rod (36) is rotatably connected to the top wall of the translation block (35), and the other end is rotatably connected to the bottom wall of the lifting plate (13).

8. A chip bonding device for micro-electronic assembly according to claim 7, characterized in that: The top wall of the platform (2) is provided with a plurality of limiting grooves (38); the bottom wall of the driving rack (31) and the bottom wall of the driven rack (33) are both fixedly provided with limiting rods (39); the limiting rods (39) are respectively slidably connected to the inner walls of the plurality of limiting grooves (38); one end of the driving rack (31) is fixedly connected to a telescopic spring (40); the other end of the telescopic spring (40) is fixedly connected to the side wall of the vertical block (3).

9. The chip bonding device for micro-electronic assembly according to claim 1, characterized in that: The bottom wall of the vertical rod (8) is provided with a bottom groove (41), and two sliders (42) are slidably connected in the bottom groove (41), a center spring (43) is fixedly connected between the two sliders (42), and baffles (44) are fixedly connected to the side walls of the two sliders (42), respectively, and the bottom wall of the baffle (44) abuts against the bottom wall of the groove (5), and the side wall of the baffle (44) away from the slider (42) is flush with the side wall of the vertical rod (8) facing the lifting plate (13).

Citation Information

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