Wet grinding and polishing device and polishing control system

Abstract

The invention provides a wet grinding and polishing device and a polishing control system, and belongs to the technical field of polishing devices. The polishing device comprises a polishing table, a polishing piece and a control assembly, the polishing piece is provided with a working face and a first channel, and the first channel communicates with the control assembly; the control assembly comprises a control cavity and a movable block, the control cavity is provided with a negative pressure port, a normal pressure port, a cleaning port and a connecting port communicated with the first channel, the movable block is movably installed in the control cavity and provided with a second channel, one end of the second channel is communicated with the connecting port, and the other end of the second channel is a butt joint end. Under the condition that the butt joint end communicates with the normal pressure port, the movable block can respond to the negative pressure port to achieve communication of the butt joint end and the negative pressure port, or the movable block can respond to the cleaning port to achieve communication of the butt joint end and the cleaning port. Through movement of the movable block, state switching of the polishing device is achieved under driving of the negative pressure source and the cleaning assembly, and the pipeline structure of the polishing device is simplified.

Description

Technical Field

[0001] The invention belongs to the technical field of polishing devices, and in particular relates to a wet grinding and polishing device and a polishing control system. Background Art

[0002] During the wet grinding and polishing process, it is necessary to grind and polish the material while injecting the polishing agent. In the related technology, you can refer to the Chinese patent documents with publication numbers CN117506677A and CN117484368A. Generally, the material is adsorbed and fixed on the fixture by negative pressure adsorption. The fixture is connected to the corresponding negative pressure equipment. When the material needs to be replaced, the negative pressure adsorption of the material is released, and the material can be quickly removed to achieve fast loading and unloading. At the same time, due to the effect of negative pressure adsorption, during the polishing process of the material, there will be grinding impurities and the like that will be adsorbed into the negative pressure channel inside the fixture. In order to ensure the stability of the grinding and polishing quality, the fixture will be backwashed regularly to rinse the internal channels of the fixture.

[0003] However, the need to realize the separate operation of negative pressure adsorption, material unloading and backwashing will lead to the complexity of the pipeline structure of the polishing equipment, and multiple control valves need to be controlled jointly to ensure the independent operation of each state, resulting in increased equipment costs. Summary of the invention

[0004] The purpose of this application is to provide a wet grinding and polishing device and a polishing control system to solve the above-mentioned technical problems existing in the prior art.

[0005] This application is implemented as follows:

[0006] In the first aspect, the present application provides a wet grinding and polishing device, including a polishing table, a polishing piece and a control component, the polishing piece having a working surface and a first channel, the working surface is used to cooperate with the polishing table, one end of the first channel is located on the working surface, and the other end is connected to the control component; the control component includes a control chamber and a movable block, the control chamber has a negative pressure port, a normal pressure port, a cleaning port and a connecting port connected to the first channel, the movable block is movably installed in the control chamber along a first direction, the movable block has a second channel, one end of the second channel is connected to the connecting port, and the other end is a docking end, when the docking end is connected to the normal pressure port, the movable block can respond to the negative pressure port to move toward the negative pressure port to achieve communication between the docking end and the negative pressure port, or the movable block can respond to the cleaning port to move toward the connecting port to achieve communication between the docking end and the cleaning port.

[0007] In a second aspect, an embodiment of the present application provides a wet grinding and polishing control system, comprising the polishing device provided in the embodiment of the first aspect, and also comprising a negative pressure source and a cleaning component, wherein the negative pressure source is connected to the negative pressure port, and the cleaning component is connected to the cleaning port.

[0008] The technical solution adopted by the present invention can achieve the following beneficial effects:

[0009] In the present application, a control component is arranged to be connected to the first channel, and the movement of the movable block of the control component in the control chamber is utilized to realize the docking of the first channel with one of the negative pressure port, the cleaning port and the normal pressure port, thereby realizing the separate operation of adsorption of materials, discharge of materials and backwashing of the first channel; and, in the control component, the adsorption effect of the negative pressure source connected to the negative pressure port is utilized to drive the movable block to move, thereby realizing the connection between the first channel and the negative pressure source, and the cleaning fluid introduced into the cleaning port is utilized to drive the movable block to move, thereby realizing the flushing of the first channel. When the negative pressure source stops working and the cleaning fluid is stopped from being introduced, the first channel is connected to the normal pressure port, the adsorption and fixation of the material is released, and the discharge of materials is completed. There is no need to set up multiple control valves for joint control. In actual use, it is only necessary to start or shut down the negative pressure source, introduce cleaning fluid or stop introducing cleaning fluid according to actual needs, so as to realize the operation switching of negative pressure adsorption and backwashing, simplify the piping structure of the polishing device, simplify the operation steps, and reduce the control difficulty of the polishing device. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for use in the embodiments of the present invention or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0011] Figure 1 is a schematic diagram of the structure of a polishing control system provided in some embodiments of the present application;

[0012] Figure 2 is a schematic structural diagram of a polishing device provided in some embodiments of the present application;

[0013] Figure 3 is a schematic diagram of the disassembly of the control components provided in some embodiments of the present application;

[0014] Figure 4 is a top view of a control assembly provided in some embodiments of the present application;

[0015] Figure 5 AA cross-sectional view provided in some embodiments of the present application Figure 1 ;

[0016] Figure 6 AA cross-sectional view provided in some embodiments of the present application Figure 2 ;

[0017] Figure 7 Some embodiments of the present application are about Figure 6 Detail of point B;

[0018] Figure 8 AA cross-sectional view provided in some embodiments of the present application Figure 3 ;

[0019] Fig. 9 AA cross-sectional view provided in some embodiments of the present application Figure 4 .

[0020] In the figure: 100-polishing part, 110-working surface, 120-first channel, 200-control component, 210-control chamber, 211-negative pressure port, 212-normal pressure port, 213-cleaning port, 214-connecting port, 215-limiting part, 216-active chamber, 220-active block, 221-second channel, 221a-first opening, 221b-second opening, 222-plug-in part, 223-moving part, 230-limiting block, 231-third channel, 232-fourth channel, 233-installing groove, 240-elastic part, 250-first baffle, 260-second baffle, 10-negative pressure source, 20-cleaning component, 21-cleaning pump, 22-liquid storage tank, 30-recovery tank, 40-material. DETAILED DESCRIPTION

[0021] To make the purpose, technical solution and advantages of the present invention clearer, the technical solution of the present invention will be described in detail below. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other implementation methods obtained by ordinary technicians in this field without creative work belong to the scope of protection of the present invention.

[0022] The terms "first", "second", etc. in the specification and claims of this application are used to distinguish similar objects, and are not used to describe a specific order or sequence. It should be understood that the terms used in this way can be interchangeable under appropriate circumstances, so that the embodiments of the present application can be implemented in an order other than those illustrated or described herein, and the objects distinguished by "first", "second", etc. are generally of the same type, and the number of objects is not limited. For example, the first object can be one or more.

[0023] The present application provides a wet grinding and polishing device, referring to Figure 1 and Figure 2As shown, it includes a polishing table, a polishing member 100 and a control assembly 200. The polishing member 100 has a working surface 110 and a first channel 120. The working surface 110 is used to fix the material 40, which refers to the object to be polished. The working surface 110 is used to cooperate with the polishing table to press the material 40 between the working surface 110 and the polishing table, and the polishing table is used to polish the material 40. The polishing table should be located below the polishing member 100. Figure 1 and Figure 2 The polishing station is not shown.

[0024] The control assembly 200 includes a control chamber 210 and a movable block 220. The control chamber 210 has a negative pressure port 211, a normal pressure port 212, a cleaning port 213, and a connection port 214 connected to the first channel 120. The movable block 220 is movably installed in the control chamber 210 along the first direction. Figure 5 , Figure 6 , Figure 8 and Fig. 9 As shown, the movable block 220 has a second channel 221, one end of the second channel 221 is connected to the connection port 214, and the other end is a docking end. The negative pressure port 211 is used to connect to the negative pressure source 10, the cleaning port 213 is used to connect to the cleaning component 20 to pass the cleaning liquid into the second channel 221, and the normal pressure port 212 is used to connect to the atmospheric environment.

[0025] One end of the first channel 120 is located on the working surface 110, and the other end is connected to the control component 200. When the first channel 120 is connected to the negative pressure source 10 through the control component 200, refer to Figure 5 As shown, the polishing device is in a negative pressure adsorption working state, and can perform negative pressure adsorption on the material 40 on the working surface 110, thereby completing the fixation of the material 40. When the first channel 120 is connected to the external atmospheric environment through the control component 200, refer to Figure 6 As shown, the polishing device is in the working state of unloading, and can release the negative pressure adsorption of the material 40 to facilitate unloading. Fig. 9 As shown, the polishing device is in a backwashing working state, and the cleaning component 20 passes the cleaning liquid toward the first channel 120 to complete the flushing of the first channel 120.

[0026] The working state of the polishing device is changed by changing the position of the movable block 220 in the control chamber 210 and controlling the docking end to be connected to one of the negative pressure port 211, the normal pressure port 212 and the cleaning port 213. The negative pressure port 211, the normal pressure port 212 and the cleaning port 213 are independently arranged, so that multiple working states of the polishing device can be operated independently.

[0027] In the embodiment provided in the present application, when the docking end is connected to the normal pressure port 212, the movable block 220 can respond to the negative pressure port 211 to move toward the negative pressure port 211 to achieve connection between the docking end and the negative pressure port 211, or the movable block 220 can respond to the cleaning port 213 to move toward the connecting port 214 to achieve connection between the docking end and the cleaning port 213.

[0028] The movable block 220 responds to the negative pressure port 211, which means that under the suction action of the negative pressure source 10 connected to the negative pressure port 211, the movable block 220 can be driven to move in the control chamber 210, thereby changing the position of the movable block 220, so that the docking end and the negative pressure port 211 are connected, and the polishing device is changed from the unloading working state to the negative pressure adsorption working state.

[0029] The movable block 220 responds to the cleaning port 213, which means that under the action of the cleaning component 20 connected to the cleaning port 213, the cleaning component 20 will pass the cleaning liquid into the control chamber 210 through the cleaning port 213, and the movable block 220 is driven to move by the flow of the cleaning liquid, thereby changing the position of the movable block 220, so that the docking end is connected to the cleaning port 213, and the first channel 120 is flushed, and the polishing device is changed from the unloading working state to the backwashing working state.

[0030] When the material 40 needs to be negatively adsorbed, the negative pressure source 10 connected to the negative pressure port 211 can be started to adsorb the movable block 220, and the polishing device is switched from the material unloading state to the negative pressure adsorption state. When the first channel 120 needs to be flushed, the cleaning component 20 connected to the cleaning port 213 can be started to pass the cleaning liquid into the control chamber 210, and the polishing device is switched from the material unloading state to the backwashing state.

[0031] Switching to the negative pressure adsorption state or the backwash state only requires starting the corresponding equipment, such as the negative pressure source 10 and the cleaning component 20, without the need to set up multiple control valves for joint control, which is conducive to simplifying the piping structure of the polishing device, simplifying the operating steps, and reducing the control difficulty of the polishing device.

[0032] After the negative pressure source 10 or the cleaning assembly 20 is turned off, the movable block 220 needs to be driven to its docking end to communicate with the normal pressure port 212, so as to facilitate the switching of the polishing device to the next state. In some embodiments, the position of the movable block 220 can be directly adjusted by electric control to drive the movable block 220 to a position docking with the normal pressure port 212.

[0033] In other embodiments of the present application, a reset structure may be provided to drive the movable block 220 to reset, so that the polishing device switches from the negative pressure adsorption working state or the backwashing working state to the unloading state. Figure 5 , Figure 6 , Figure 8 and Fig. 9 As shown, the negative pressure port 211 and the cleaning port 213 are arranged along the first direction, and an elastic member 240 is connected between the movable block 220 and the control chamber 210. When the elastic member 240 is in a natural state, the butt end is connected to the normal pressure port 212, and the cleaning port 213 is connected to the space around the elastic member 240. At this time, the negative pressure source 10 and the cleaning assembly 20 are both in a closed state.

[0034] When the material 40 needs to be adsorbed, the negative pressure source 10 is started, and the movable block 220 moves in response to the negative pressure port 211, while compressing the elastic member 240. When the polishing of the material 40 is completed and it needs to be unloaded, the negative pressure source 10 is turned off. Since the elastic member 240 is in a compressed state, the compressed elastic member 240 can drive the movable block 220 to move and reset, so that the butt end of the movable block 220 can be connected to the normal pressure port 212.

[0035] When the first channel 120 of the polishing member 100 needs to be flushed, the cleaning assembly 20 is started, and the movable block 220 moves in response to the cleaning port 213, and the elastic member 240 is stretched at the same time. After the cleaning assembly 20 is started, the cleaning liquid is introduced into the control chamber 210 through the cleaning port 213. As the cleaning liquid in the control chamber 210 increases, the movable block 220 located in the control chamber 210 is pushed to move. The cleaning port 213 is connected to the space around the elastic member 240. As the cleaning liquid increases, the space gradually expands, thereby causing the elastic member 240 in the space to stretch. After the flushing of the first channel 120 is completed, the cleaning assembly 20 is closed. Since the elastic member 240 is in a stretched state, the stretched elastic member 240 can drive the movable block 220 to move and reset, so that the butt end of the movable block 220 can be connected to the normal pressure port 212.

[0036] The elastic member 240 can be used to automatically reset the movable block 220 without using an additional control structure. During the use of the polishing device, the movable block 220 in the control component 200 can automatically adjust its position according to whether the negative pressure source 10 and the cleaning component 20 are started or not, thereby cooperating with the working state switching of the polishing device.

[0037] In some preferred embodiments of the present application, the butt end includes a first opening 221a and a second opening 221b, both of which are connected to the second channel 221. Figure 5 , Figure 6 , Figure 8 and Fig. 9 The first opening 221a is used to connect with the negative pressure port 211 and the cleaning port 213 , and the second opening 221b is used to connect with the normal pressure port 212 .

[0038] When the second opening 221b is docked with the normal pressure port 212, the first opening 221a is sealed with the control chamber 210. The first opening 221a needs to be sealed to ensure that the first channel 120 of the polishing piece 100 is connected to the external normal pressure environment through the movable block 220, which is convenient for material unloading. When the first opening 221a is docked with the negative pressure port 211 or the cleaning port 213, the second opening 221b is sealed with the control chamber 210 to ensure that the first channel 120 of the polishing piece 100 is connected to the negative pressure source 10 or the cleaning component 20 through the movable block 220.

[0039] The sealing cooperation between the first opening 221a or the second opening 221b and the control chamber 210 means that the opening is blocked by the inner wall of the control chamber 210, or the opening is blocked by other components in the control chamber 210 to form a sealing effect.

[0040] In some specific embodiments of this application, reference Figure 5 , Figure 6 , Figure 8 and Fig. 9 As shown, a limit block 230 is fixed in the control chamber 210, and the limit block 230 divides the control chamber 210 into two parts. The negative pressure port 211 is located at one end of the limit block 230, and the movable block 220, the elastic member 240, the normal pressure port 212, the cleaning port 213 and the connection port 214 are all located at the other end of the limit block 230.

[0041] A third channel 231 and a fourth channel 232 are arranged inside the limit block 230. The fourth channel 232 penetrates the limit block 230 along the first direction. The control chambers 210 located at both ends of the limit block 230 can be connected through the fourth channel 232. One end of the third channel 231 is connected to the negative pressure port 211, and the other end is connected to the fourth channel 232.

[0042] The elastic member 240 is located between the movable block 220 and the limit block 230. The movable block 220 can be inserted into the fourth channel 232 and move toward the negative pressure port 211 under the suction of the negative pressure source 10 connected to the negative pressure port 211, so that the opening of the third channel 231 connected to the fourth channel 232 docks with the docking end of the movable block 220, connecting the second channel 221 and the third channel 231.

[0043] The movable block 220 is inserted into the fourth channel 232, and the fourth channel 232 is connected to the negative pressure port 211. Therefore, under the suction of the negative pressure source 10, the movable block 220 can be driven to move toward the negative pressure port 211 in the fourth channel 232. At the same time, since one end opening of the third channel 231 is located on the inner wall of the fourth channel 232, before the butt end of the movable block 220 is connected to the third channel 231, the peripheral side wall of the movable block 220 blocks the opening of the third channel 231 to ensure that the negative pressure source 10 can smoothly perform negative pressure suction on the movable block 220 located in the fourth channel 232, and control the moving position of the movable block 220.

[0044] When the butt end of the movable block 220 moves to communicate with the third channel 231 , the third channel 231 , the second channel 221 and the first channel 120 are connected to form a negative pressure channel, and the negative pressure source 10 performs negative pressure adsorption on the material 40 through the channel.

[0045] By setting the third channel 231 and the fourth channel 232 on the limit block 230, the fourth channel 232 is used to limit the moving direction of the movable block 220. At the same time, it is also ensured that at least part of the surface of the movable block 220 is exposed to the suction action of the negative pressure source 10, thereby ensuring that the movable block 220 can move under the suction action of the negative pressure source 10.

[0046] In some preferred embodiments, the fourth channel 232 is provided with a corresponding limiting structure. After the movable block 220 moves to its docking end and connects with the third channel 231, the movable block 220 cooperates with the limiting structure to prevent the movable block 220 from continuing to move toward the negative pressure port 211, thereby avoiding the movable block 220 from moving too far, resulting in the docking end being connected to the third channel 231 and then being offset.

[0047] In some preferred embodiments of the present application, reference Figure 3 As shown, the movable block 220 includes a plug-in portion 222 and a moving portion 223, and the cross-sectional dimension of the moving portion 223 is larger than the cross-sectional dimension of the plug-in portion 222. Figure 5 , Figure 6 , Figure 8 and Fig. 9 As shown, at least part of the plug-in portion 222 is located in the fourth channel 232, and the circumferential side wall of the plug-in portion 222 is in contact with the circumferential side wall of the fourth channel 232, the movable portion 223 is located at one end of the limit block 230 close to the connection port 214, the circumferential side wall of the movable portion 223 is in contact with the inner wall of the control chamber 210, and the elastic member 240 is fixed between the movable portion 223 and the limit block 230.

[0048] The cross-sectional dimension of the movable portion 223 is relatively large. The movable portion 223 is located outside the fourth channel 232 and cannot be plugged into the fourth channel 232. The size difference between the movable portion 223 and the plug-in portion 222 is used to limit the range of motion of the movable block 220. After the movable portion 223 abuts against the limiting portion 215, the plug-in portion 222 moves to the limit position, which is closest to the position of the negative pressure port 211. The position of the docking end on the movable block 220 can be adjusted so that when the movable portion 223 and the limiting block 230 are limited, the docking end is connected to the third channel 231. At this time, under the suction effect of the negative pressure source 10 and the limiting effect of the limiting block 230, the position of the movable block 220 is stable, which is conducive to maintaining the stability of the negative pressure adsorption state of the polishing device.

[0049] Furthermore, since the size of the moving part 223 is relatively large, it is convenient to install the elastic member 240. As the plug-in part 222 moves in the fourth channel 232, the distance between the moving part 223 and the limiting block 230 changes, thereby stretching or compressing the elastic member 240.

[0050] When the material 40 needs to be adsorbed, the negative pressure source 10 is started and the cleaning component 20 is closed. The negative pressure source 10 sucks the plug-in part 222 located in the fourth channel 232 through the negative pressure port 211. The plug-in part 222 drives the movable block 220 to move as a whole along the first direction toward the negative pressure port 211 until the docking end of the movable block 220 is connected to the third channel 231, and the polishing device is in a negative pressure adsorption state.

[0051] When the first channel 120 of the polishing piece 100 needs to be rinsed, the cleaning assembly 20 is started, the negative pressure source 10 is closed, and the cleaning assembly 20 injects cleaning liquid into the control chamber 210 through the cleaning port 213. The cleaning port 213 corresponds to the space where the elastic member 240 is located. The moving portion 223 and the limit block 230 define the installation space of the elastic member 240, and the part of the control chamber 210 where the elastic member 240 is located is defined as the active chamber 216. Figure 6 , Figure 8 and Fig. 9 As shown, the cleaning liquid is directly injected into the active chamber 216. As the cleaning liquid increases, the active chamber 316 around the elastic member 240 is filled. The two ends of the elastic member 240 are the limit block 230 and the movable part 223 respectively. Since the limit block 230 is fixed, as the cleaning liquid increases, the cleaning liquid will drive the movable part 223 to move in the direction away from the limit block 230, expand the active chamber 216, and stretch the elastic member 240 until the docking end is connected with the cleaning port 213. The cleaning liquid enters the first channel 120 through the docking end for flushing. The cleaning liquid will no longer fill the active chamber 216 around the elastic member 240, the position of the movable block 220 is stable, and the backwash state of the polishing assembly is stable.

[0052] In the case where the docking end includes a first opening 221a and a second opening 221b, the first opening 221a is provided at the plug-in portion 222 to facilitate the communication between the first opening 221a and the third channel 231. The second opening 221b may be located at the plug-in portion 222 or at the moving portion 223. Figure 5 , Figure 6 , Figure 8 and Fig. 9 As shown, the second opening 221b is disposed on the moving part 223, which is more convenient for independent operation and switching of the three states of the polishing device. The first opening 221a can be sealed by the inner wall of the fourth channel 232, and the second opening 221b can be sealed by the inner wall of the control chamber 210.

[0053] refer to Figure 4 As shown, the cleaning port 213 and the normal pressure port 212 can be respectively arranged on the radial sides of the control chamber 210, and correspondingly, the first opening 221a and the second opening 221b can be respectively oriented in different directions, thereby avoiding the situation where the first opening 221a and the second opening 221b are incorrectly docked with the ports of the control chamber 210.

[0054] In some embodiments of the present application, the end of the limit block 230 close to the moving part 223 is provided with a mounting groove 233, and the elastic member 240 is installed in the mounting groove 233 to improve the installation stability of the elastic member 240. In some specific embodiments, the elastic member 240 can be a spring, and the spring is sleeved outside the plug-in part 222.

[0055] In some preferred embodiments, reference Figure 6 and Figure 7 As shown, a first baffle 250 and a second baffle 260 are connected to the normal pressure port 212. One end of the first baffle 250 and the second baffle 260 are fixed to the edge of the normal pressure port 212, and the other end extends toward the control chamber 210. The first baffle 250 is arranged close to the connection port 214, and the second baffle 260 is arranged close to the negative pressure port 211.

[0056] When the second opening 221b is docked with the normal pressure port 212, the first baffle 250 and the second baffle 260 both extend through the docking end into the second channel 221. Figure 6 and Figure 7 When the first baffle 250 and the second baffle 260 are not squeezed, there is a gap between them to ensure that the butt end can be smoothly connected to the external environment through the normal pressure port 212.

[0057] When the movable block 220 responds to the negative pressure port 211, the first baffle 250 and the second baffle 260 can be pressed between the movable block 220 and the inner wall of the control chamber 210 under the drive of the movable block 220, and the position of the movable block 220 is changed from Figure 6 to Figure 5 At this time, the first baffle 250 can seal the normal-pressure port 212 , further improving the sealing effect of the normal-pressure port 212 .

[0058] When the movable block 220 responds to the cleaning port 213, the first baffle 250 and the second baffle 260 can be pressed between the movable block 220 and the inner wall of the control chamber 210 under the driving of the movable block 220, and the position of the movable block 220 is changed from Figure 6 to Figure 7 Then Figure 8 The second baffle 260 seals the normal-pressure port 212 , thereby improving the sealing effect of the normal-pressure port 212 .

[0059] The second opening 221b is a gradually expanding structure. Along the axial direction of the second opening 221b and in the direction away from the second channel 221, the diameter of the second opening 221b gradually increases. Figure 7 During the movement of the movable block 220 , the gradually expanding structure of the second opening 221 b can serve as a receiving space for the first blocking piece 250 or the second blocking piece 260 , and the blocking piece is gradually squeezed, so that the movement of the movable block 220 will be smoother.

[0060] refer to Figure 8 As shown, the control chamber 210 has a limit portion 215, which is located between the cleaning port 213 and the connecting port 214. When the docking end is connected to the cleaning port 213, the limit portion 215 cooperates with the movable block 220 to prevent the movable block 220 from continuing to stretch the elastic member 240 in response to the cleaning port 213, thereby preventing the movable block 220 from continuing to move to cause misalignment between the docking end and the cleaning port 213, or the movable block 220 is in an unstable position, resulting in an unstable backwashing state of the polishing device.

[0061] The embodiment of the present application also provides a wet grinding and polishing control system, including the polishing device provided by any of the above embodiments, and also including a negative pressure source 10 and a cleaning component 20, the negative pressure source 10 is connected to the negative pressure port 211, and the cleaning component 20 is connected to the cleaning port 213.

[0062] refer to Figure 1 As shown, the cleaning assembly 20 generally includes a cleaning pump 21 and a liquid storage tank 22 . The liquid storage tank 22 stores cleaning liquid. By turning on the cleaning pump 21 , the cleaning liquid in the liquid storage tank 22 is pumped into the first channel 120 .

[0063] In some preferred embodiments, a recovery box 30 is further provided between the negative pressure source 10 and the control assembly 200. When the material 40 is polished, part of the polishing liquid and impurities will be adsorbed to the negative pressure source 10 along with the adsorption of the negative pressure source 10, and the recovery box 30 is provided, and the polishing liquid and impurities will be stored in the recovery box 30 under the action of gravity, thereby avoiding affecting the normal use of the negative pressure source 10.

[0064] In some polishing control systems, when polishing the material 40, the polishing member 100 will rotate and revolve around the polishing table at the same time, thereby improving the polishing efficiency and polishing effect. The polishing member 100 will be connected to a drive motor and a coupling to ensure that the connection between the polishing member 100 and the control component 200 is stable during the rotation of the polishing member 100.

[0065] It should be noted that, in this article, the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the sentence "comprises a ..." does not exclude the existence of other identical elements in the process, method, article or device including the element.

[0066] The above description is only a specific implementation mode of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A wet grinding and polishing device, characterized in that: It comprises a polishing table, a polishing piece and a control assembly, wherein the polishing piece has a working surface and a first channel, wherein the working surface is used to cooperate with the polishing table, and one end of the first channel is located on the working surface, and the other end is connected to the control assembly; The control component includes a control chamber and a movable block, the control chamber has a negative pressure port, a normal pressure port, a cleaning port and a connecting port connected to the first channel, the movable block is movably installed in the control chamber along a first direction, the movable block has a second channel, one end of the second channel is connected to the connecting port, and the other end is a docking end, when the docking end is connected to the normal pressure port, the movable block can respond to the negative pressure port to move toward the negative pressure port to achieve communication between the docking end and the negative pressure port, or the movable block can respond to the cleaning port to move toward the connecting port to achieve communication between the docking end and the cleaning port.

2. A wet grinding and polishing device according to claim 1, characterized in that: The negative pressure port and the cleaning port are arranged along a first direction, and an elastic member is connected between the movable block and the control chamber; When the elastic member is in a natural state, the docking end is connected to the normal pressure port, the cleaning port is connected to the space around the elastic member, and the movable block can compress the elastic member in response to the negative pressure port or stretch the elastic member in response to the cleaning port.

3. A wet grinding and polishing device according to claim 2, characterized in that: The docking end includes a first opening and a second opening, the first opening is used to dock with the negative pressure port and the cleaning port, and the second opening is used to dock with the normal pressure port; When the second opening is docked with the normal pressure port, the first opening is sealed with the control chamber, and when the first opening is docked with the negative pressure port or the cleaning port, the second opening is sealed with the control chamber.

4. A wet grinding and polishing device according to claim 2, characterized in that: A limit block is fixed in the control chamber, the limit block divides the control chamber into two parts, the negative pressure port is located at one end of the limit block, and the movable block, the elastic member, the normal pressure port, the cleaning port and the connection port are all located at the other end of the limit block; A third channel and a fourth channel are provided inside the limit block, the fourth channel penetrates the limit block along the first direction, one end of the third channel is communicated with the negative pressure port, and the other end is communicated with the fourth channel; The elastic member is located between the movable block and the limit block. The movable block can be inserted into the fourth channel and move toward the negative pressure port under the suction of the negative pressure source connected to the negative pressure port, so that the opening of the third channel connected to the fourth channel docks with the docking end of the movable block, thereby connecting the second channel and the third channel.

5. A wet grinding and polishing device according to claim 4, characterized in that: The movable block includes a plug-in portion and a moving portion, the cross-sectional dimension of the moving portion is larger than the cross-sectional dimension of the plug-in portion, at least part of the plug-in portion is located in the fourth channel, and the circumferential side wall of the plug-in portion is in contact with and cooperates with the circumferential side wall of the fourth channel, the moving portion is located at one end of the limit block close to the connection port, the circumferential side wall of the moving portion is in contact with and cooperates with the inner wall of the control chamber, and the elastic member is fixed between the moving portion and the limit block.

6. A wet grinding and polishing device according to claim 5, characterized in that: The end of the limiting block close to the moving part is provided with a mounting groove, and the elastic member is installed in the mounting groove.

7. A wet grinding and polishing device according to claim 3, characterized in that: A first baffle and a second baffle are connected to the normal pressure port, one end of each of the first baffle and the second baffle is fixed to the edge of the normal pressure port, and the other end extends toward the control chamber, the first baffle is arranged close to the connection port, and the second baffle is arranged close to the negative pressure port; When the second opening is butted against the normal pressure port, both the first baffle and the second baffle extend through the butted end into the second channel; In the case where the movable block responds to the negative pressure port, the first baffle and the second baffle can be pressed tightly between the movable block and the inner wall of the control chamber under the driving of the movable block, and the first baffle can seal the normal pressure port; When the movable block responds to the cleaning port, both the first baffle and the second baffle can be pressed between the movable block and the inner wall of the control chamber under the drive of the movable block, and the second baffle can seal the normal pressure port.

8. A wet grinding and polishing device according to claim 7, characterized in that: The second opening is a gradually expanding structure, and the diameter of the second opening gradually increases along the axial direction of the second opening and in a direction away from the second channel.

9. A wet grinding and polishing device according to claim 2, characterized in that: The control chamber has a limiting portion, which is located between the cleaning port and the connecting port. When the docking end is connected to the cleaning port, the limiting portion cooperates with the movable block to prevent the movable block from stretching the elastic member in response to the cleaning port.

10. A wet grinding and polishing control system, characterized in that: The polishing device comprises the polishing device according to any one of claims 1 to 9, and further comprises a negative pressure source and a cleaning component, wherein the negative pressure source is connected to the negative pressure port, and the cleaning component is connected to the cleaning port.

Images