Monocrystalline silicon semiconductor chip cutting device

Abstract

The invention relates to the field of cutting devices, in particular to a monocrystalline silicon semiconductor chip cutting device, which comprises a cutting component, a main shaft, a saw blade arranged on the main shaft and a support table arranged on the rear side of the main shaft, the water retaining part comprises a shielding assembly arranged on the front side of the supporting table, a sliding assembly arranged on the main shaft, a pushing assembly arranged on the sliding assembly and a closing assembly arranged on the pushing assembly; and the extension part comprises a rotating assembly arranged on the sealing assembly, a guiding assembly arranged on the rotating assembly, a gear tooth assembly arranged on the guiding assembly and a guiding assembly arranged on the sealing assembly. And a screw on the cover plate does not need to be manually rotated, use is convenient, and the overall cutting speed is increased.

Description

Technical Field

[0001] The invention relates to the field of cutting devices, in particular to a single crystal silicon semiconductor chip cutting device. Background Art

[0002] Monocrystalline silicon is one of the most commonly used materials in the semiconductor industry. During semiconductor production, the finished product is often in the form of chips. However, during chip processing, the chips need to be cut, which requires the use of a cutting device. The most common cutting device is a dicing machine.

[0003] During use, the existing dicing machine is similar to an electric saw, but the difference is that the precision is higher. At the same time, the chip is immersed in the cutting fluid during cutting to reduce the generation of burrs and dust. However, during cutting, the rotation of the electric saw will cause water to splash, so a waterproof cover is generally used in the cutting area for protection. However, during cutting, tools are needed to calibrate the distance between the saw blade and the chip, which requires removing the front cover of the waterproof cover and then reinstalling the front cover of the dust cover after the calibration is completed. When removing and installing the cover, workers are required to use tools to turn the threads on the cover to fix or remove it. This operation is more cumbersome and takes a long time, affecting the chip cutting efficiency. Summary of the invention

[0004] In view of the fact that in the above-mentioned or prior art, when the outer waterproof cover of the dicing machine is in use, it is necessary to use tools to calibrate the distance between the saw blade and the chip, so it is necessary to remove the front cover of the waterproof cover, and then reinstall the front cover of the dust cover after the calibration is completed. This operation is cumbersome and time-consuming, which affects the chip cutting efficiency. The present invention is proposed.

[0005] In order to solve the above technical problems, the present invention provides the following technical solutions: including a cutting component, including a main shaft, a saw blade arranged on the main shaft, and a support platform arranged on the rear side of the main shaft; a water-blocking component, including a shielding component arranged on the front side of the support platform, a sliding component arranged on the main shaft, a pushing component arranged on the sliding component, and a closing component arranged on the pushing component; an extension component, including a rotating component arranged on the closing component, a guide component arranged on the rotating component, a gear component arranged on the guide component, and a guide component arranged on the closing component.

[0006] As a preferred solution of the single crystal silicon semiconductor chip cutting device of the present invention, the shielding assembly includes a semicircular ring arranged on the outside of the main shaft, a back plate is fixedly connected to the semicircular ring, and the back plate is fixedly connected to the support platform by bolts.

[0007] As a preferred solution of the single crystal silicon semiconductor chip cutting device of the present invention, wherein: the sliding assembly includes a steel wire rope fixedly connected to the main shaft, a ball is fixedly connected to the steel wire rope, a plurality of connecting strips are fixedly connected to the main shaft, a moving ring is provided on the outer side of the main shaft, a plurality of mounting openings cooperating with the connecting strips are provided on the moving ring, a strip opening is provided on the moving ring, the width of the strip opening is greater than the diameter of the steel wire rope, and the width of the strip opening is less than the diameter of the ball.

[0008] As a preferred solution of the single crystal silicon semiconductor chip cutting device of the present invention, wherein: the pushing component includes a plurality of strip grooves arranged on a semicircular ring, the semicircular ring is provided with a supporting groove connected to the strip groove, a plurality of U-shaped sleeves with a width greater than the width of the strip groove are fixedly connected to the side wall of the semicircular ring, and a plurality of U-shaped sleeves are slidably connected with an L-shaped plate extending into the strip groove, a stop plate is fixedly connected to the U-shaped sleeve, the L-shaped plate and the stop plate are elastically connected by a first spring, a transmission ring with an inner ring diameter smaller than the outer diameter of the moving ring is provided on the rear side of the L-shaped plate, a T-shaped block is fixedly connected to the transmission ring, a plurality of T-shaped slots cooperating with the T-shaped blocks are provided on the semicircular ring, and the rear end of the L-shaped plate is against the transmission ring.

[0009] As a preferred solution of the single crystal silicon semiconductor chip cutting device of the present invention, wherein: the closing component includes a push plate fixedly connected to the L-shaped plate, the push plate is provided with a receiving groove, a rotating shaft is rotatably connected in the receiving groove, an adapter plate is fixedly connected to the rotating shaft, a fan-shaped plate is fixedly connected to the adapter plate, a sealing gasket that is fixedly connected to the inner wall of the fan-shaped plate and abuts against the inner wall of the semicircular ring is fixedly connected to the inner wall of the fan-shaped plate, and a first torsion spring is provided on the rotating shaft.

[0010] As a preferred solution of the single crystal silicon semiconductor chip cutting device of the present invention, wherein: the fan-shaped plates are provided with grooves, adjacent fan-shaped plates are provided with water stop strips matching the grooves, and a plurality of the fan-shaped plates are spliced ​​into a semicircular plate.

[0011] As a preferred solution of the single crystal silicon semiconductor chip cutting device of the present invention, wherein: the rotating component includes a bracket arranged on the side walls of the left and right fan-shaped plates, the bracket is rotatably connected to a transmission shaft, the transmission shaft is wound with a first waterproof belt, and the left and right ends of the semicircular ring are fixedly connected with a second waterproof belt.

[0012] As a preferred solution of the single crystal silicon semiconductor chip cutting device of the present invention, wherein: the guide component includes an arc groove arranged on two left and right fan-shaped plates, the arc groove is provided with an arc mouth, an arc plate is slidably connected in the arc groove, a cutting edge is provided on the arc plate, and a top block slidably connected to the arc mouth is fixedly connected to the arc plate.

[0013] As a preferred solution of the single crystal silicon semiconductor chip cutting device of the present invention, wherein: the gear tooth assembly includes a gear fixedly connected to the transmission shaft, the bracket is provided with a through hole, an L-shaped tooth plate meshing with the gear is slidably connected in the through hole, the L-shaped tooth plate is abutted against the top block, and the L-shaped tooth plate is elastically connected to the bracket through a second spring.

[0014] As a preferred solution of the single crystal silicon semiconductor chip cutting device of the present invention, wherein: the guide assembly includes two guide plates fixedly connected to the bracket, and the two guide plates are both provided with arc edges for guiding the first waterproof belt.

[0015] The beneficial effects of the single crystal silicon semiconductor chip cutting device of the present invention are as follows: by arranging a cutting component and a water-blocking component, when the main shaft rotates to drive the saw blade to rotate, the centrifugal force is used to drive the moving ring to move, and then the transmission is used to drive the multiple fan-shaped plates to flip, so that the water on the front side of the saw blade is automatically blocked, and after the main shaft stops, the fan-shaped plates are automatically reset, so that the front side of the saw blade is open, so that there is no need for workers to turn the threads on the cover plate for installation or removal, which is convenient to use and saves time. By arranging an extension component, the first waterproof belt can be unfolded, so that the front side protection extends all the way to the liquid surface, and the protection effect is better, thereby solving the problem that when the waterproof cover on the outside of the dicing machine is in use, it is necessary to use a tool to calibrate the distance between the saw blade and the chip, so that the front cover of the waterproof cover needs to be removed, and then the front cover of the dust cover needs to be reinstalled after the calibration is completed. This operation is relatively cumbersome and takes a long time, which affects the chip cutting efficiency. The water blocking and water blocking release on the front side of the saw blade are automatically performed to improve the cutting efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without paying creative work.

[0017] Figure 1 This is a schematic diagram of the external structure of the single crystal silicon semiconductor chip cutting device after the fan-shaped plate is flipped.

[0018] Figure 2 for Figure 1 A schematic diagram of the enlarged structure of .

[0019] Figure 3 It is a schematic diagram of the cross-sectional structure of a single crystal silicon semiconductor chip cutting device.

[0020] Figure 4 It is a schematic diagram of the cross-sectional structure of the sliding assembly of the single crystal silicon semiconductor chip cutting device.

[0021] Figure 5 It is a schematic diagram of the cross-sectional structure of the driving component of the single crystal silicon semiconductor chip cutting device.

[0022] Figure 6 This is a schematic diagram of the external structure of the enclosed component of the single crystal silicon semiconductor chip cutting device.

[0023] Figure 7 This is an exploded view of the external structure of the water stop strip of the single crystal silicon semiconductor chip cutting device.

[0024] Figure 8 The present invention is a schematic diagram of the cross-sectional structure of a guide component of a single crystal silicon semiconductor chip cutting device.

[0025] In the figure: 100, cutting component; 101, spindle; 102, saw blade; 103, support platform; 200, water-blocking component; 201, shielding component; 201a, semicircular ring; 201b, back plate; 202, sliding component; 202a, wire rope; 202b, round ball; 202c, connecting strip; 202d, moving ring; 202e, installation port; 202f, strip port; 203, pushing component; 203a, strip groove; 203b, supporting groove; 203c, U-shaped sleeve; 203d, L-shaped plate; 203e, stop plate; 203f, first spring; 203g, transmission ring; 203h, T-shaped groove; 204, closing component; 204a, push plate; 204 b, accommodating groove; 204c, rotating shaft; 204d, adapter plate; 204e, fan-shaped plate; 204f, first torsion spring; 204g, water stop strip; 300, extension component; 301, rotating component; 301a, bracket; 301b, transmission shaft; 301c, first waterproof belt; 301d, second waterproof belt; 302, guide component; 302a, arc groove; 302b, arc mouth; 302c, arc plate; 302d, cutting edge; 302e, top block; 303, gear tooth component; 303a, gear; 303b, through-hole; 303c, L-shaped tooth plate; 303d, second spring; 304, guide component; 304a, guide plate; 304b, arc edge. DETAILED DESCRIPTION

[0026] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific implementation methods of the present invention are described in detail below in conjunction with the accompanying drawings.

[0027] Example 1, reference Figures 1 to 8, which is the first embodiment of the present invention, provides a single crystal silicon semiconductor chip cutting device, which can achieve the effect of automatically waterproofing the front end of the dicing machine by rotating the main shaft 101 without manual operation when the saw blade 102 of the dicing machine rotates, and includes a cutting component 100, including a main shaft 101, a saw blade 102 arranged on the main shaft 101, and a support platform 103 arranged on the rear side of the main shaft 101; a water-blocking component 200, including a shielding component 201 arranged on the front side of the support platform 103, a sliding component 202 arranged on the main shaft 101, a pushing component 203 arranged on the sliding component 202, and a closing component 204 arranged on the pushing component 203; an extension component 300, including a rotating component 301 arranged on the closing component 204, a guiding component 302 arranged on the rotating component 301, a gear component 303 arranged on the guiding component 302, and a guiding component 304 arranged on the closing component 204

[0028] Specifically, the support platform 103 is provided with a water spray system and a drainage system matching the saw blade 102, so as to cool down the cutting and lubricate the cutting. The rear end of the main shaft 101 is connected to a motor, and the rotating shaft 204c of the main shaft 101 can be controlled. This is the existing technology and will not be elaborated here.

[0029] Furthermore, the shielding assembly 201 includes a semicircular ring 201a arranged on the outside of the main shaft 101, and a back plate 201b is fixedly connected to the semicircular ring 201a, and the back plate 201b is fixedly connected to the support platform 103 by bolts; the sliding assembly 202 includes a steel wire rope 202a fixedly connected to the main shaft 101, a round ball 202b is fixedly connected to the steel wire rope 202a, and a plurality of connecting strips 202c are fixedly connected to the main shaft 101, a movable ring 202d is provided on the outside of the main shaft 101, and a plurality of mounting openings 202e cooperating with the connecting strips 202c are provided on the movable ring 202d, and a strip opening 202f is provided on the movable ring 202d, and the width of the strip opening 202f is greater than the diameter of the steel wire rope 202a, and the width of the strip opening 202f is smaller than the diameter of the round ball 202b.

[0030] Among them, a circular opening is provided on the back plate 201b, allowing the main shaft 101 to pass through the circular opening, so that the back plate 201b and the main shaft 101 will not be stuck. A threaded hole is provided on the support platform 103, so that the back plate 201b can be pressed between the bolt and the support platform 103. The width of the strip opening 202f is greater than the diameter of the wire rope 202a, and the width of the strip opening 202f is smaller than the diameter of the ball 202b, so as to prevent the ball 202b from moving to the front side of the moving ring 202d. The setting of the installation opening 202e and the connecting strip 202c can ensure that when the moving ring 202d rotates, relative sliding can still occur between the moving ring 202d and the main shaft 101.

[0031] Preferably, the pushing assembly 203 includes a plurality of strip grooves 203a arranged on the semicircular ring 201a, a supporting groove 203b connected to the strip groove 203a is provided on the semicircular ring 201a, a plurality of U-shaped sleeves 203c with a width greater than the width of the strip groove 203a are fixedly connected to the side wall of the semicircular ring 201a, and an L-shaped plate 203d extending into the strip groove 203a is slidably connected to the plurality of U-shaped sleeves 203c. A stop plate 203e is fixedly connected to the upper portion, and the L-shaped plate 203d is elastically connected to the stop plate 203e through a first spring 203f. A transmission ring 203g whose inner diameter is smaller than the outer diameter of the moving ring 202d is provided at the rear side of the L-shaped plate 203d. A T-shaped block is fixedly connected to the transmission ring 203g. A plurality of T-shaped grooves 203h cooperating with the T-shaped blocks are provided on the semicircular ring 201a. The rear end of the L-shaped plate 203d abuts against the transmission ring 203g.

[0032] The closing assembly 204 includes a push plate 204a fixedly connected to the L-shaped plate 203d, the push plate 204a is provided with a receiving groove 204b, a rotating shaft 204c is rotatably connected in the receiving groove 204b, an adapter plate 204d is fixedly connected to the rotating shaft 204c, a fan-shaped plate 204e is fixedly connected to the adapter plate 204d, a sealing gasket that abuts against the inner wall of the semicircular ring 201a is fixedly connected to the inner wall of the fan-shaped plate 204e, and a first torsion spring 204f is provided on the rotating shaft 204c; a groove is provided on the fan-shaped plate 204e, and adjacent fan-shaped plates 204e are provided with water stop strips 204g that match the groove, and multiple fan-shaped plates 204e are spliced ​​into a semicircular plate.

[0033] It should be noted that the moving ring 202d here cooperates with the transmission ring 203g, and a plurality of small balls are rotatably connected to the moving ring 202d, and a track rotatably connected to the small balls is inside the transmission ring 203g, thereby reducing the friction between the moving ring 202d and the transmission ring 203g during relative rotation, reducing wear, and increasing the service life of the transmission ring 203g. A groove is provided on the fan-shaped plate 204e, and a water stop strip 204g cooperating with the groove is provided on the adjacent fan-shaped plates 204e to prevent water from spraying out from the gap between two adjacent fan-shaped plates 204e.

[0034] When in use, after the distance measurement, circuit and gas path inspection are completed, and the chip is placed, the main shaft 101 is controlled to rotate. At this time, there is a gap between the saw blade 102 and the chip, the push plate 204a is in the support groove 203b, and the first torsion spring 204f is in a compressed state. The distance between the moving ring 202d and the lower end of the saw blade 102 is greater than the thickness of the chip, so that the moving ring 202d will not collide with the chip. The rotation of the main shaft 101 will drive the wire rope 202a to rotate around the main shaft 101, so that under the action of centrifugal force Under the use, as the speed of the main shaft 101 increases, the wire rope 202a slowly changes from tilting to tending to vertical. At this time, the ball 202b moves toward the outer end, driving the moving ring 202d to move outward. The connecting strip 202c cooperates with the installation port 202e to guide the moving ring 202d. When the moving ring 202d moves, it can push the transmission ring 203g to move outward, push the L-shaped plate 203d to move outward, the first spring 203f is compressed, and the T-shaped block slides in the T-shaped groove 203h to drive the transmission ring 203 g, when the L-shaped plate 203d moves, it pushes the push plate 204a to move outward, so that the accommodating groove 204b moves out of the supporting groove 203b. At this time, under the action of the first torsion spring 204f, the rotating shaft 204c is reset, driving the multiple adapter plates 204d to deflect, so that the fan-shaped plate 204e deflects, and the multiple fan-shaped plates 204e flip to form a semicircular plate to block the front side of the saw blade 102 to waterproof the front side, and cooperate with the semicircular ring to block the water in the cutting area of ​​the saw blade 102. After 4e is flipped over, the outer wall of the sealing gasket abuts against the inner wall of the semicircular plate, thereby making the waterproof performance better, and when the motor stops rotating, under the action of the first spring 203f, the L-shaped plate 203d is reset, driving the push plate 204a to reset, at this time, the transmission plate abuts against the side wall of the support groove 203b and is retracted into the support groove 203b, the rotating shaft 204c rotates, and the first torsion spring 204f obtains elasticity for the next use. Here, the first spring 203f is elastic enough to ensure that it can drive the fan plate 204e to reset.

[0035] In summary, by setting the cutting component 100 and the water-blocking component 200, when the main shaft 101 rotates to drive the saw blade 102 for processing, multiple fan-shaped plates 204e can be automatically flipped, and after flipping, they automatically block the front side of the saw blade 102, and cooperate with the semicircular ring 201a and the back plate 201b to automatically waterproof the processing area.

[0036] Example 2, reference Figures 1 to 8, which is the second embodiment of the present invention. Different from the previous embodiment, this embodiment provides an extension component 300 of a single crystal silicon semiconductor chip cutting device, which solves the problem of how to make the water blocking effect better. It includes a rotating component 301, including a bracket 301a arranged on the side walls of the left and right fan-shaped plates 204e, a transmission shaft 301b is rotatably connected to the bracket 301a, a first waterproof belt 301c is wound on the transmission shaft 301b, and the left and right ends of the semicircular ring 201a are fixedly connected to the second waterproof belt 301d, and the guide component 302 includes an arc groove 302a arranged on the left and right fan-shaped plates 204e, and the arc groove 30 2a is provided with an arc-shaped opening 302b, an arc-shaped plate 302c is slidably connected in the arc-shaped groove 302a, a cutting edge 302d is provided on the arc-shaped plate 302c, and a top block 302e slidably connected to the arc-shaped opening 302b is fixedly connected to the arc-shaped plate 302c; the gear tooth assembly 303 includes a gear 303a fixedly connected to the transmission shaft 301b, a through opening 303b is provided on the bracket 301a, an L-shaped tooth plate 303c meshing with the gear 303a is slidably connected in the through opening 303b, the L-shaped tooth plate 303c is abutted against the top block 302e, and the L-shaped tooth plate 303c is elastically connected to the bracket 301a through a second spring 303d.

[0037] Specifically, the first waterproof tape 301c will not collide with the chip after being unfolded, so that the first waterproof tape 301c will not fall on the chip and be cut. When designing, the first waterproof tape 301c can be extended to the liquid surface of the cutting area. When cutting, the chip is generally immersed in liquid, and the arc-shaped opening 302b can guide the top block 302e to prevent the top block 302e from deviating.

[0038] When in use, after the plurality of fan-shaped plates 204e are deflected, the arc-shaped plates 302c on the fan-shaped plates 204e at the left and right ends abut against the side walls of the adjacent fan-shaped plates 204e. Here, damping can be provided on the corresponding rotating shafts 204c of the left and right fan-shaped plates 204e, so as to delay the reset speed of the left and right fan-shaped plates 204e, so that the other fan-shaped plates 204e are flipped into place first, and then the arc-shaped plates 302c are abutted against the fan-shaped plates 204e. Here, the cutting edges 302d on the arc-shaped plates 302c are provided to avoid the phenomenon that the fan-shaped plates 204e are stuck with each other. The arc-shaped plates 302c abut against the fan-shaped plates 204e, so that the arc-shaped plates 302c are abutted against each other. 02c moves toward the arc groove 302a, so that the top block 302e slides in the arc mouth 302b and pushes the L-shaped tooth plate 303c to move toward the gear 303a, and the L-shaped tooth plate 303c is engaged with the gear 303a, thereby driving the gear 303a to deflect, causing the transmission shaft 301b to rotate and unfold the first waterproof belt 301c. Under the action of gravity, the first waterproof belt 301c hangs down and extends to the liquid surface, filling the gap between the semicircular plate formed by the fan plate 204e and the liquid surface, so that the waterproof effect is better. At the same time, the setting of the second waterproof belt 301d can block water at the left and right ends, so that the water blocking effect is better.

[0039] In summary, by providing the extension component 300, when the fan-shaped plate 204e is flipped over in front of the saw blade 102 to block water, the first waterproof belt 301c can also be unfolded to fill the gap between the semicircular plate formed by the fan-shaped plate 204e and the liquid surface, so that the overall water blocking effect is better.

[0040] Example 3, reference Figure 1-2 , which is the third embodiment of the present invention. Different from the previous embodiment, this embodiment provides a guide component 304 of a single crystal silicon semiconductor chip cutting device, which solves the problem of how to prevent the first waterproof tape 301c from bending and falling into the cutting area of ​​the saw blade 102. It includes a guide component 304, including two guide plates 304a fixedly connected to the bracket 301a, and the two guide plates 304a are provided with arc edges 304b for guiding the first waterproof tape 301c. The outer ends of the guide plates 304a protrude to the front side of the bracket 301a, so that the first waterproof tape 301c can be placed on the guide plates 304a when it droops.

[0041] When in use, after the first waterproof belt 301c is unfolded, it can be placed on the guide plate 304a. At this time, the arc edge 304b on the guide plate 304a guides the first waterproof belt 301c to prevent the first waterproof belt 301c from bending or folding inward, so that the first waterproof belt 301c can be unfolded better.

[0042] In summary, by setting up the guide assembly 304, after the first waterproof belt 301c is unfolded, it can be guided by the guide plate 304a so that the first waterproof belt 301c can be unfolded outward, avoiding the first waterproof belt 301c from moving inward and contacting with the saw blade 102, affecting the cutting of the saw blade 102, and avoiding damage to the first waterproof belt 301c.

[0043] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention rather than to limit it. Although the present invention has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solutions of the present invention may be modified or replaced by equivalents without departing from the spirit and scope of the technical solutions of the present invention, which should all be included in the scope of the claims of the present invention.

Claims

1. A single crystal silicon semiconductor chip cutting device, characterized in that: include, A cutting component (100) comprises a main shaft (101), a saw blade (102) arranged on the main shaft (101), and a support platform (103) arranged on the rear side of the main shaft (101); The water-blocking component (200) comprises a shielding component (201) arranged on the front side of the support platform (103), a sliding component (202) arranged on the main shaft (101), a pushing component (203) arranged on the sliding component (202), and a closing component (204) arranged on the pushing component (203); The extension component (300) comprises a rotating component (301) arranged on the closing component (204), a guiding component (302) arranged on the rotating component (301), a gear component (303) arranged on the guiding component (302), and a guiding component (304) arranged on the closing component (204).

2. The single crystal silicon semiconductor chip cutting device according to claim 1, characterized in that: The shielding assembly (201) comprises a semicircular ring (201a) arranged outside the main shaft (101), a back plate (201b) is fixedly connected to the semicircular ring (201a), and the back plate (201b) is fixedly connected to the support platform (103) via bolts.

3. The single crystal silicon semiconductor chip cutting device according to claim 2, characterized in that: The sliding assembly (202) comprises a steel wire rope (202a) fixedly connected to a main shaft (101), a round ball (202b) fixedly connected to the steel wire rope (202a), a plurality of connecting strips (202c) fixedly connected to the main shaft (101), a moving ring (202d) is provided on the outer side of the main shaft (101), a plurality of mounting openings (202e) matched with the connecting strips (202c) are provided on the moving ring (202d), a strip opening (202f) is provided on the moving ring (202d), the width of the strip opening (202f) is greater than the diameter of the steel wire rope (202a), and the width of the strip opening (202f) is less than the diameter of the round ball (202b).

4. The single crystal silicon semiconductor chip cutting device according to claim 3, characterized in that: The pushing assembly (203) comprises a plurality of strip grooves (203a) arranged on the semicircular ring (201a), the semicircular ring (201a) is provided with a supporting groove (203b) communicating with the strip groove (203a), a plurality of U-shaped sleeves (203c) having a width greater than that of the strip groove (203a) are fixedly connected to the side wall of the semicircular ring (201a), and an L-shaped plate (203d) extending into the strip groove (203a) is slidably connected to the plurality of U-shaped sleeves (203c), and the U-shaped sleeves (203c) are provided with a plurality of support grooves (203b) connected to the semicircular ring (201a). A stop plate (203e) is fixedly connected thereto; the L-shaped plate (203d) and the stop plate (203e) are elastically connected via a first spring (203f); a transmission ring (203g) having an inner diameter smaller than an outer diameter of the movable ring (202d) is provided on the rear side of the L-shaped plate (203d); a T-shaped block is fixedly connected to the transmission ring (203g); a plurality of T-shaped grooves (203h) cooperating with the T-shaped blocks are provided on the semicircular ring (201a); and a rear end of the L-shaped plate (203d) abuts against the transmission ring (203g).

5. The single crystal silicon semiconductor chip cutting device according to claim 4, characterized in that: The closure assembly (204) comprises a push plate (204a) fixedly connected to the L-shaped plate (203d), the push plate (204a) being provided with a receiving groove (204b), a rotating shaft (204c) being rotatably connected in the receiving groove (204b), an adapter plate (204d) being fixedly connected to the rotating shaft (204c), a fan-shaped plate (204e) being fixedly connected to the adapter plate (204d), a sealing gasket being fixedly connected to the inner wall of the fan-shaped plate (204e) and being against the inner wall of the semicircular ring (201a), and a first torsion spring (204f) being provided on the rotating shaft (204c).

6. The single crystal silicon semiconductor chip cutting device according to claim 5, characterized in that: The fan-shaped plate (204e) is provided with a groove, and adjacent fan-shaped plates (204e) are provided with a water stop strip (204g) matching the groove, and a plurality of fan-shaped plates (204e) are spliced ​​into a semicircular plate.

7. The single crystal silicon semiconductor chip cutting device according to claim 6, characterized in that: The rotating assembly (301) comprises a bracket (301a) arranged on the side walls of the left and right fan-shaped plates (204e), the bracket (301a) is rotatably connected to a transmission shaft (301b), a first waterproof belt (301c) is wound around the transmission shaft (301b), and the left and right ends of the semicircular ring (201a) are fixedly connected to a second waterproof belt (301d).

8. The single crystal silicon semiconductor chip cutting device according to claim 7, characterized in that: The guide assembly (302) comprises an arc-shaped groove (302a) arranged on two left and right fan-shaped plates (204e), the arc-shaped groove (302a) is provided with an arc-shaped opening (302b), an arc-shaped plate (302c) is slidably connected in the arc-shaped groove (302a), a cutting edge (302d) is provided on the arc-shaped plate (302c), and a top block (302e) slidably connected to the arc-shaped opening (302b) is fixedly connected to the arc-shaped plate (302c).

9. The single crystal silicon semiconductor chip cutting device according to claim 8, characterized in that: The gear assembly (303) comprises a gear (303a) fixedly connected to a transmission shaft (301b); a through opening (303b) is provided on the bracket (301a); an L-shaped tooth plate (303c) meshing with the gear (303a) is slidably connected in the through opening (303b); the L-shaped tooth plate (303c) abuts against a top block (302e); and the L-shaped tooth plate (303c) is elastically connected to the bracket (301a) via a second spring (303d).

10. The single crystal silicon semiconductor chip cutting device according to claim 8 or 9, characterized in that: The guide assembly (304) comprises two guide plates (304a) fixedly connected to the bracket (301a), and both guide plates (304a) are provided with arc edges (304b) for guiding the first waterproof belt (301c).

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