Square silicon rod cutting and grinding all-in-one machine

Abstract

A square silicon rod cutting and grinding all-in-one machine comprises a base, a supporting frame arranged on the base and a transferring device which is arranged on the supporting frame and can transfer on the supporting frame in the X-axis direction, the Y-axis direction and the Z-axis direction, and a feeding and discharging device is arranged at one end of the base. A half-cutting device is arranged on one side of the base, and a grinding-down device is arranged on the other side of the base; the half-cutting device comprises a rack, a cutting station I and a cutting station II, wherein the cutting station I and the cutting station II are arranged on the rack. Each of the cutting station I and the cutting station II comprises a left supporting plate, a silicon rod supporting plate and a right supporting plate, and a cutting assembly is arranged on the rack; the grinding and falling device comprises a left sliding rail and a right sliding rail which are arranged on the two sides of the base, and a grinding and falling assembly which is arranged on the left sliding rail and the right sliding rail and can do left-right linear motion on the left sliding rail and the right sliding rail; a left tool setting assembly and a right tool setting assembly which are parallel to each other are arranged on the base and between the left sliding rail and the right sliding rail; a left grinding station and a right grinding station which are parallel are arranged at one end of the left tool setting assembly and one end of the right tool setting assembly and on the base.

Description

Technical Field

[0001] The invention relates to the technical field of silicon workpiece processing, in particular to a square silicon rod cutting and grinding integrated machine. Background Art

[0002] With the expansion of photovoltaic and other application scenarios, the market demand for half-rod silicon wafers has gradually emerged. Half-rods are usually obtained by cutting the finished square rods along the length direction (i.e., the center-cutting process). The processing flow includes: half-cutting, cutting the square rod or finished square rod longitudinally into two half-rods; half-rod grinding, secondary grinding of the half-rod surface after center-cutting to meet the accuracy requirements of subsequent multi-wire cutting.

[0003] The existing technology has the following bottlenecks: insufficient process coordination, there is a rhythm mismatch between the half-splitting operation and the unloading process, which causes the equipment to idle and wait; the half-rod grinding accuracy fluctuates greatly (such as flatness deviation > 0.05mm), affecting the silicon wafer yield; the overall cost is high, and the configuration of multiple equipment leads to a large footprint, rising energy consumption and maintenance costs.

[0004] Therefore, the industry urgently needs to develop an integrated processing solution to achieve continuous coordination of half-splitting and half-rod grinding processes, especially to solve core problems such as low feeding efficiency after half-splitting and insufficient surface treatment accuracy of half-rods, so as to improve the economy and product consistency of half-rod processing. Summary of the invention

[0005] The technical problem to be solved by the present invention is to provide a square silicon rod cutting and grinding integrated machine with low comprehensive cost, small footprint due to multi-device configuration, low energy consumption and low maintenance cost.

[0006] The technical solution adopted by the present invention to solve the technical problem is:

[0007] A square silicon rod cutting and grinding machine comprises a base, a support frame arranged on the base, and a transfer device arranged on the support frame and capable of performing XYZ axis transfer on the support frame, wherein a loading and unloading device is arranged at one end of the base; a half-cutting device is arranged on one side of the base, and a grinding device is arranged on the other side;

[0008] The half-cutting device comprises a frame, a cutting station I and a cutting station II arranged on the frame; the cutting station I and the cutting station II both comprise a left support plate, a silicon rod support plate, and a right support plate, both sides of the left support plate, the silicon rod support plate, and the right support plate extend out of both sides of the frame and are connected downward with a screw slider, both sides of the frame are provided with a linear screw rail, the screw in the linear screw rail is threadedly connected with the screw slider so that the cutting station I and the cutting station II can move left and right on the frame; a cutting assembly is provided on the frame;

[0009] The grinding device includes a left slide rail and a right slide rail arranged on both sides of the base, and a grinding assembly arranged on the left slide rail and the right slide rail and capable of making left and right linear motion on the left slide rail and the right slide rail; a parallel left tool setting assembly and a right tool setting assembly are arranged on the base and between the left slide rail and the right slide rail; a parallel left grinding station and a parallel right grinding station are arranged on one end of the left tool setting assembly and the right tool setting assembly and on the base.

[0010] In one embodiment, the cutting assembly includes a left cutting support plate and a right cutting support plate fixedly connected to both sides of the frame, wherein a driving guide wheel and a left driven guide wheel are sequentially provided on the left end of the left cutting support plate from left to right, and a right driven guide wheel is provided on the right end of the left cutting support plate; a tensioning guide wheel and a left driven guide wheel I are sequentially provided on the left end of the right cutting support plate from left to right, and a right driven guide wheel II is provided on the right end of the right cutting support plate.

[0011] In one embodiment, an annular diamond wire is wound around the driving guide wheel, the left driven guide wheel, the right driven guide wheel, the tensioning guide wheel, the left driven guide wheel I, and the right driven guide wheel II; one end of the annular diamond wire is wound around the left driven guide wheel from the driving guide wheel, then around the left driven guide wheel I and the tensioning guide wheel, and finally around the right driven guide wheel II and the right driven guide wheel, and is closed with the annular diamond wire on the driving guide wheel to achieve winding.

[0012] In one embodiment, the annular diamond wire passes around the right driven guide wheel and the right driven guide wheel II to form a first cutting line; the annular diamond wire passes around the left driven guide wheel and the left driven guide wheel I to form a second cutting line.

[0013] In one embodiment, a motor for driving the linear screw guide rail to move is provided at one end of the linear screw guide rail.

[0014] In one embodiment, the grinding assembly includes a grinding fixture, a left grinding head and a right grinding head arranged in parallel at one end of the grinding fixture, and a left chamfering head and a right chamfering head arranged in parallel at the other end of the grinding fixture.

[0015] In one embodiment, the left surface grinding head and the right surface grinding head are both connected to the grinding and chamfering fixed frame via a lifting slide rail; the left chamfering grinding head and the right chamfering grinding head are both connected to the grinding and chamfering fixed frame via a rotating cylinder.

[0016] In one embodiment, the left grinding station and the right grinding station both include a silicon rod support seat, a telescopic cylinder disposed on both sides of the silicon rod support seat, and a clamping plate fixedly connected to the output shaft of the telescopic cylinder.

[0017] In one embodiment, the center of the left chamfering grinding head, the center of the left surface grinding head, the center of the left tool setting assembly, and the center of the left grinding station are all on a straight line.

[0018] In one embodiment, the center of the right chamfering grinding head, the center of the right grinding head, the center of the right tool setting assembly, and the center of the right grinding station are all on a straight line.

[0019] Compared with the prior art, the present invention has the following beneficial effects:

[0020] The present invention comprises a base, a support frame arranged on the base, and a transfer device arranged on the support frame and capable of performing transfer in the XYZ axis directions on the support frame. A loading and unloading device is arranged at one end of the base; a half-cutting device is arranged on one side of the base, and a grinding device is arranged on the other side; the half-cutting device comprises a frame, a cutting station I and a cutting station II arranged on the frame; the cutting station I and the cutting station II both comprise a left support plate, a silicon rod support plate, and a right support plate, both sides of the left support plate, the silicon rod support plate, and the right support plate extend out of both sides of the frame and are downwardly connected with a screw slider, and both sides of the frame are provided with a linear screw rail, and the screw in the linear screw rail is threadedly connected with the screw slider so that the cutting station I and the cutting station II can perform left and right transfer on the frame. right movement; a cutting assembly is provided on the frame; the grinding device comprises a left slide rail and a right slide rail arranged on both sides of the base, and a grinding assembly arranged on the left slide rail and the right slide rail and capable of making left and right linear motion on the left slide rail and the right slide rail; a parallel left tool setting assembly and a right tool setting assembly are provided on the base and between the left slide rail and the right slide rail; a parallel left grinding station and a right grinding station are provided on one end of the left tool setting assembly and the right tool setting assembly and on the base; thereby solving the problem of insufficient process coordination, the rhythm mismatch between the half-section operation and the unloading link, resulting in idling and waiting of the equipment; the half-rod grinding accuracy fluctuates greatly (such as flatness deviation > 0.05mm), affecting the yield of silicon wafers; the comprehensive cost is high, and the technical problems of large floor space, rising energy consumption and maintenance costs caused by multiple equipment configurations. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 This is a schematic diagram of the overall structure of Embodiment 1 of the present invention;

[0022] Figure 2 For the present invention Figure 1 A schematic diagram of a top view of a half-section device;

[0023] Figure 3 For the present invention Figure 1 A schematic diagram of the side structure of a half-section device;

[0024] Figure 4 For the present invention Figure 1 Schematic diagram of the grinding device structure.

[0025] In the figure: 10. base, 20. support frame, 30. transfer device, 40. loading and unloading device;

[0026] 50. Half-section device, 510. Frame, 511. Left cutting support plate, 512. Right cutting support plate, 513. Driving guide wheel, 514. Left driven guide wheel, 515. Right driven guide wheel, 516. Tensioning guide wheel, 517. Left driven guide wheel I, 518. Right driven guide wheel II, 519. Annular diamond wire, 520. Left support plate, 521. Silicon rod support plate, 522. Right support plate, 523. Screw slider, 524. Left fixed plate, 525. Left transverse cylinder I, 526. Left transverse cylinder II, 527. Left fixed plate, 528. Right transverse cylinder I, 529. Right transverse cylinder II, 540. Linear screw slide rail;

[0027] 60. Grinding device, 611. Left slide rail, 612. Right slide rail, 613. Left tool setting assembly, 614. Right tool setting assembly, 615. Grinding fixture, 616. Left grinding surface grinding, 617. Right grinding surface grinding, 618. Left chamfering grinding head, 619. Right chamfering grinding head, 620. Lifting slide rail, 621. Rotating cylinder, 630. Left grinding station, 631. Right grinding station, 632. Silicon rod support seat, 633. Telescopic cylinder, 634. Clamping plate. DETAILED DESCRIPTION

[0028] The present invention is further described below in conjunction with the accompanying drawings and embodiments.

[0029] Example 1

[0030] like Figure 1 As shown, this embodiment includes a base 10, a support frame 20 arranged on the base 10, and a transfer device 30 arranged on the support frame 20 and capable of performing XYZ axis direction in the support frame 20. In this embodiment, the transfer device 30 is a manipulator capable of XYZ axis; and the transfer device 30 is used to grab the silicon rod to be processed from the loading and unloading device 40 to the half-splitting device 50 for half-splitting, and can grab the half-splitting silicon rod to the grinding device 60 for grinding, and can also grab the ground silicon rod to the loading and unloading device 40, thereby solving the problem of insufficient process coordination, the problem of mismatch in rhythm between the half-splitting operation and the unloading link, resulting in idling and waiting of the equipment; the half-rod grinding accuracy fluctuates greatly (such as flatness deviation > 0.05mm), affecting the yield of silicon wafers; the comprehensive cost is high, and the configuration of multiple equipment leads to large floor space, energy consumption and maintenance costs. Technical problems.

[0031] A loading and unloading device 40 is disposed at one end of the base 10 . In the present embodiment, the loading and unloading device 40 is a commercially available loading and unloading device 40 for loading and unloading silicon rods.

[0032] A half-cut device 50 is provided on one side of the base 10, and a grinding device 60 is provided on the other side;

[0033] like Figure 2-3 As shown, the half-cutting device 50 includes a frame 510, a cutting station I and a cutting station II arranged on the frame 510; the cutting station I and the cutting station II both include a left support plate 520, a silicon rod support plate 521, and a right support plate 522, both sides of the left support plate 520, the silicon rod support plate 521, and the right support plate 522 extend out of both sides of the frame 510 and are connected downwardly with a screw slider 523, and both sides of the frame 510 are provided with a linear screw guide rail 540, and the screw in the linear screw guide rail 540 is threadedly connected with the screw slider 531 so that the cutting station I and the cutting station II can move left and right on the frame 510;

[0034] In one embodiment, the left support plate 520 , the silicon rod supporting plate 521 , the right support plate 522 are provided with a gap from the frame 510 via the screw slider 523 and the screw slider 523 .

[0035] In this embodiment, a motor is provided at one end of the linear screw guide 540 to drive the screw guide 540 to move; thereby, the linear screw guide 540 is driven by the motor to operate, and the linear screw guide 540 drives cutting station I and cutting station II to move left and right on the frame 510.

[0036] A left fixed plate 524 is provided on the left supporting plate 520, and a left transverse cylinder I 525 and a left transverse cylinder II 526 facing the right supporting plate 522 are provided on the left fixed plate 524; a right fixed plate 527 is provided on the right supporting plate 522, and a right transverse cylinder I 528 and a right transverse cylinder II 529 facing the left supporting plate 520 are provided on the right fixed plate 527; thereby, the silicon rod is positioned left and right by the left transverse cylinder I 525 and the left transverse cylinder II 526 and the right transverse cylinder I 528 and the right transverse cylinder II 529.

[0037] In one embodiment, the linear screw guide rail 540 is a bidirectional linear screw guide rail 540, so that the cutting station I and the cutting station II can be moved away from each other for cutting, or the cutting station I and the cutting station II can be moved close to each other for cutting.

[0038] A cutting assembly is provided on the frame 510, and the cutting assembly includes a left cutting support plate 511 and a right cutting support plate 512 fixedly connected to both sides of the frame 510, wherein a driving guide wheel 513 and a left driven guide wheel 514 are provided on the left end of the left cutting support plate 511 from left to right, and a right driven guide wheel 515 is provided on the right end of the left cutting support plate 511; a tensioning guide wheel 516 and a left driven guide wheel I 517 are provided on the left end of the right cutting support plate 512 from left to right, and a right driven guide wheel II 518 is provided on the right end of the right cutting support plate 512;

[0039] In this embodiment, a rotating motor for driving the driving guide wheel 513 to rotate is connected to the bottom of the driving guide wheel 513 .

[0040] The driving guide wheel 513, the left driven guide wheel 514, the right driven guide wheel 515, the tensioning guide wheel 516, the left driven guide wheel I 517, and the right driven guide wheel II 518 are wound with an annular diamond wire 519; one end of the annular diamond wire 519 is wound around the left driven guide wheel 514 from the driving guide wheel 513, and then around the left driven guide wheel I 517 and the tensioning guide wheel 516, and finally around the right driven guide wheel II 518 and the right driven guide wheel 515, and is closed with the annular diamond wire 519 on the driving guide wheel 513 to achieve winding; thereby, the driving guide wheel 513 is driven to rotate by the operation of the rotating motor, and the driving guide wheel 513 synchronously drives the left driven guide wheel 514, the right driven guide wheel 515, the tensioning guide wheel 516, the left driven guide wheel I 517, and the right driven guide wheel II 518 to rotate through the annular diamond wire 519;

[0041] Then, the annular diamond wire 519 bypasses the right driven guide wheel 515 and the right driven guide wheel II 518 to form a first cutting line, and cuts the silicon rods on the support slide I 520 or the support slide II 530; the annular diamond wire 519 bypasses the left driven guide wheel 514 and the left driven guide wheel I 517 to form a second cutting line, and cuts the silicon rods on the support slide I 520 or the support slide II 530.

[0042] like Figure 4 As shown, the grinding device 60 includes a left slide rail 611 and a right slide rail 612 arranged on both sides of the base 10, and a grinding component arranged on the left slide rail 611 and the right slide rail 612 and capable of making left and right linear motion on the left slide rail 611 and the right slide rail 612; thereby, the grinding component can make left and right linear motion through the left slide rail 611 and the right slide rail 612; in this embodiment, the left slide rail 611 and the right slide rail 612 are both electric slide rails.

[0043] A parallel left tool setting assembly 613 and a right tool setting assembly 614 are provided on the base 610 and between the left slide rail 611 and the right slide rail 612; in the present embodiment, the left tool setting assembly 613 and the right tool setting assembly 614 are tool setting devices that can be purchased on the market; the left tool setting assembly 613 and the right tool setting assembly 614 are arranged in parallel in the middle of the base 10; thereby facilitating the tool setting process of the grinding assembly.

[0044] A parallel left grinding station 630 and a right grinding station 631 are provided on one end of the left tool setting assembly 613 and the right tool setting assembly 614 and on the base 10; the left grinding station 630 and the right grinding station 631 both include a silicon rod support seat 632, a telescopic cylinder 633 arranged on both sides of the silicon rod support seat 632, and a clamping plate 634 fixedly connected to the output shaft of the telescopic cylinder 633; ​​thereby, the silicon rod to be processed is placed on the silicon rod support seat 632, and then through the operation of the telescopic cylinder 633, the clamping plate 634 clamps the silicon rod of the silicon rod support seat 632, so as to facilitate the grinding process of the grinding assembly.

[0045] In this embodiment, two silicon rods to be processed can be placed on the left grinding station 630 and the right grinding station 631; thus, four silicon rods can be processed at the same time; thereby solving the technical problems of equipment idling, high comprehensive cost, large floor space caused by multiple equipment configuration, and rising energy consumption and maintenance costs.

[0046] The grinding assembly includes a grinding fixture 615. In this embodiment, the grinding fixture 615 is slidably connected to the left slide rail 611 and the right slide rail 612, so that the grinding fixture 615 can perform left and right linear motion on the left slide rail 611 and the right slide rail 612;

[0047] The left surface grinding head 616 and the right surface grinding head 617 are arranged in parallel at one end of the grinding and chamfering fixed frame 615, and the left chamfering grinding head 618 and the right chamfering grinding head 619 are arranged in parallel at the other end of the grinding and chamfering fixed frame 615; in the present embodiment, the left surface grinding head 616 and the right surface grinding head 617 are connected to the grinding and chamfering fixed frame 615 through the lifting slide rail 620; the left chamfering grinding head 618 and the right chamfering grinding head 619 are connected to the grinding and chamfering fixed frame 615 through the rotating cylinder 621; thus, the left chamfering grinding head 618 and the right chamfering grinding head 619 can be rotated 180° in the top view plane through the rotating cylinder 21 to grind the chamfers on both sides.

[0048] In addition, the center of the left chamfering grinding head 618, the center of the left grinding head 616, the center of the left tool setting assembly 613, and the center of the left grinding station 630 are all in a straight line; the center of the right chamfering grinding head 619, the center of the right grinding head 617, the center of the right tool setting assembly 614, and the center of the right grinding station 631 are all in a straight line.

[0049] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the technical solutions of the present invention have been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A square silicon rod cutting and grinding machine, characterized in that: The invention comprises a base (10), a support frame (20) arranged on the base (10), and a transfer device (30) arranged on the support frame (20) and capable of performing transfer in the XYZ axis directions on the support frame (20); a loading and unloading device (40) is provided at one end of the base (10); a half-cutting device (50) is provided on one side of the base (10), and a grinding device (60) is provided on the other side; The half-cutting device (50) comprises a frame (510), a cutting station I and a cutting station II arranged on the frame (510); the cutting station I and the cutting station II both comprise a left support plate (520), a silicon rod support plate (521), and a right support plate (522); both sides of the left support plate (520), the silicon rod support plate (521), and the right support plate (522) extend out of both sides of the frame (510) and are connected downwardly with a screw slider (523); both sides of the frame (510) are provided with a linear screw guide rail (540); the screw in the linear screw guide rail (540) is threadedly connected to the screw slider (531) so that the cutting station I and the cutting station II can move left and right on the frame (510); a cutting assembly is provided on the frame (510); The grinding device (60) comprises a left slide rail (611) and a right slide rail (612) arranged on both sides of the base (10), and a grinding assembly arranged on the left slide rail (611) and the right slide rail (612) and capable of performing left and right linear motion on the left slide rail (611) and the right slide rail (612); a parallel left tool setting assembly (613) and a right tool setting assembly (614) are arranged on the base (10) and between the left slide rail (611) and the right slide rail (612); and a parallel left grinding station (630) and a right grinding station (631) are arranged on one end of the left tool setting assembly (613) and the right tool setting assembly (614) and on the base (10).

2. The square silicon rod cutting and grinding machine according to claim 1, characterized in that: The cutting assembly comprises a left cutting support plate (511) and a right cutting support plate (512) fixedly connected to two sides of the frame (510), wherein a driving guide wheel (513) and a left driven guide wheel (514) are sequentially provided on the left end of the left cutting support plate (511) from left to right, and a right driven guide wheel (515) is provided on the right end of the left cutting support plate (511); a tensioning guide wheel (516) and a left driven guide wheel I (517) are sequentially provided on the left end of the right cutting support plate (512) from left to right, and a right driven guide wheel II (518) is provided on the right end of the right cutting support plate (512).

3. The square silicon rod cutting and grinding machine according to claim 2, characterized in that: An annular diamond wire (519) is wound around the driving guide wheel (513), the left driven guide wheel (514), the right driven guide wheel (515), the tensioning guide wheel (516), the left driven guide wheel I (517), and the right driven guide wheel II (518); one end of the annular diamond wire (519) is wound around the left driven guide wheel (514) from the driving guide wheel (513), then around the left driven guide wheel I (517) and the tensioning guide wheel (516), and finally around the right driven guide wheel II (518) and the right driven guide wheel (515), and is closed with the annular diamond wire (519) on the driving guide wheel (513) to achieve winding.

4. The square silicon rod cutting and grinding machine according to claim 3, characterized in that: The annular diamond wire (519) bypasses the right driven guide wheel (515) and the right driven guide wheel II (518) to form a first cutting line; the annular diamond wire (519) bypasses the left driven guide wheel (514) and the left driven guide wheel I (517) to form a second cutting line.

5. The square silicon rod cutting and grinding machine according to claim 4, characterized in that: A motor for driving the linear screw guide rail (540) to move is provided at one end of the linear screw guide rail (540).

6. The square silicon rod cutting and grinding machine according to claim 5, characterized in that: The grinding assembly comprises a grinding fixture (615), a left grinding head (616) and a right grinding head (617) arranged in parallel at one end of the grinding fixture (615), and a left chamfering head (618) and a right chamfering head (619) arranged in parallel at the other end of the grinding fixture (615).

7. The square silicon rod cutting and grinding machine according to claim 6, characterized in that: The left surface grinding head (616) and the right surface grinding head (617) are both connected to the grinding and chamfering fixed frame (615) via a lifting slide rail (620); the left chamfering grinding head (618) and the right chamfering grinding head (619) are both connected to the grinding and chamfering fixed frame (615) via a rotating cylinder (621).

8. The square silicon rod cutting and grinding machine according to claim 7, characterized in that: The left grinding station (630) and the right grinding station (631) both include a silicon rod support seat (632), a telescopic cylinder (633) arranged on both sides of the silicon rod support seat (632), and a clamping plate (634) fixedly connected to the output shaft of the telescopic cylinder (633).

9. The square silicon rod cutting and grinding machine according to claim 8, characterized in that: The center of the left chamfering grinding head (618), the center of the left surface grinding head (616), the center of the left tool setting assembly (613), and the center of the left grinding station (630) are all on a straight line.

10. The square silicon rod cutting and grinding machine according to claim 9, characterized in that: The center of the right chamfering grinding head (619), the center of the right grinding head (617), the center of the right tool setting assembly (614), and the center of the right grinding station (631) are all on a straight line.

Images