Graphene heat dissipation structure and preparation method thereof

Abstract

The invention relates to the field of heat dissipation structures, and discloses a graphene heat dissipation structure and a preparation method thereof. The preparation method comprises the following steps: providing a first adhesive tape, carrying out die cutting operation to obtain a first coating layer, providing a graphene material strip, carrying out die cutting operation to obtain a graphene heat dissipation layer, attaching a first surface of the graphene heat dissipation layer to a first bonding layer, providing a second adhesive tape, carrying out die cutting operation to obtain an edge covering layer, and carrying out hot pressing on the edge covering layer. A second adhesive layer is attached to the first adhesive layer, the end, close to the graphene heat dissipation layer, of the edge covering layer is flush with the graphene heat dissipation layer, a third adhesive tape is provided, die cutting operation is conducted, a second covering layer is obtained, a fourth adhesive layer is attached to the second face of the graphene heat dissipation layer and the third adhesive layer, and the graphene heat dissipation structure is obtained. The edge covering layer is flush with the graphene heat dissipation layer, so that the mechanical strength of the graphene heat dissipation structure is improved, the overall structural stability of the graphene heat dissipation structure is improved, the finished product quality of the graphene heat dissipation structure is improved, and the service life of the graphene heat dissipation structure is prolonged.

Description

Technical Field

[0001] The present invention relates to the technical field of heat dissipation structures, and in particular to a graphene heat dissipation structure and a preparation method thereof. Background Art

[0002] Graphene heat dissipation structure is a heat dissipation material commonly used in electronic products. Since graphene material has excellent heat dissipation performance, when the graphene heat dissipation structure is installed on an electronic product, it can effectively and quickly conduct the heat generated by the electronic product when it is working to the external environment for rapid and effective heat dissipation. The graphene heat dissipation structure includes a graphene heat dissipation layer, and an adhesive layer coated on the upper and lower surfaces of the graphene heat dissipation layer. The periphery of the graphene heat dissipation layer is provided with an edge. The edge cooperates with the upper and lower adhesive layers on the periphery of the graphene heat dissipation layer to seal the graphene heat dissipation layer to form a graphene heat dissipation structure. It is widely used in electronic products as a heat dissipation structure, is easy to process and shape, can be processed into any shape according to different electronic products and different models, and is suitable for industrial production.

[0003] However, the structural stability of the edging of the existing graphene heat dissipation structure is poor. When subjected to external force during storage, transportation or use, the edging part is easily damaged, for example, wrinkles, cracks, etc. appear, affecting the overall structural stability and sealing performance of the graphene heat dissipation structure, thereby making the graphene heat dissipation layer prone to stratification, affecting the quality and service life of the graphene heat dissipation structure. Therefore, it is necessary to provide a graphene heat dissipation structure with good structural stability and long service life. Summary of the invention

[0004] The purpose of the present invention is to overcome the deficiencies in the prior art and provide a method for preparing a graphene heat dissipation structure which is beneficial to improving the stability of the edge structure of the graphene heat dissipation structure, thereby obtaining a graphene heat dissipation structure with good quality and long service life.

[0005] The objective of the present invention is achieved through the following technical solutions: A method for preparing a graphene heat dissipation structure comprises the following steps: Providing a first adhesive tape, and performing a die-cutting operation on the first adhesive tape to obtain a first covering layer, wherein the first covering layer is provided with a first adhesive layer; Providing a graphene material strip, performing a die-cutting operation on the graphene material strip to obtain a graphene heat dissipation layer, and laminating a first surface of the graphene heat dissipation layer onto the first adhesive layer; Providing a second adhesive tape, performing a die-cutting operation on the second adhesive tape to obtain an edge layer, wherein the edge layer is provided with a second adhesive layer and a third adhesive layer, the second adhesive layer and the third adhesive layer are arranged back to back, the second adhesive layer is attached to the first adhesive layer, the edge layer is arranged on the outside of the graphene heat dissipation layer, and is spaced apart from the graphene heat dissipation layer, and one end of the edge layer close to the graphene heat dissipation layer is arranged flush with the graphene heat dissipation layer; A third adhesive tape is provided, and the third adhesive tape is die-cut to obtain a second covering layer, wherein the second covering layer is provided with a fourth adhesive layer and a fifth adhesive layer, and the fourth adhesive layer is adhered to the second surface of the graphene heat dissipation layer and the third adhesive layer to obtain a graphene heat dissipation structure.

[0006] In one embodiment, the first tape is a single-sided tape.

[0007] In one embodiment, the second tape is a double-sided tape.

[0008] In one embodiment, the third tape is a double-sided tape.

[0009] In one embodiment, after the fourth adhesive layer is bonded to the second surface of the graphene heat dissipation layer and the third adhesive layer, a first release film is provided and the first release film is bonded to the fifth adhesive layer.

[0010] In one embodiment, after laminating the first release film on the fifth adhesive layer, a second release film is provided, and the second release film is laminating on the first covering layer.

[0011] In one embodiment, the thickness of the third adhesive layer gradually increases from an end close to the graphene heat dissipation layer to an end far from the graphene heat dissipation layer.

[0012] In one embodiment, a buffer groove is formed on a side of the third adhesive layer close to the fourth adhesive layer.

[0013] In one embodiment, the buffer groove is arc-shaped.

[0014] A graphene heat dissipation structure is made by the above-mentioned graphene heat dissipation structure preparation method.

[0015] Compared with the prior art, the present invention has at least the following advantages: The preparation method of the graphene heat dissipation structure is provided by providing a first tape, a second tape and a third tape, wherein the first tape and the third tape are die-cut to form a first coating layer and a second coating layer, the area of ​​the first coating layer and the second coating layer is larger than the area of ​​the graphene heat dissipation layer, the first coating layer and the second coating layer are used to be coated on the first surface and the second surface of the graphene heat dissipation layer respectively, and the second tape is die-cut to form an edge layer, which is a frame-shaped structure, coated on the outside of the graphene heat dissipation layer and bonded to the first coating layer and the second coating layer, so as to seal and package the graphene heat dissipation layer. The graphene heat dissipation layer protects the graphene heat dissipation layer. At the same time, one end of the edging layer close to the graphene heat dissipation layer is arranged to be flush with the graphene heat dissipation layer. That is to say, one end of the edging layer close to the graphene heat dissipation layer has the same thickness as the graphene heat dissipation layer, so that the edging layer has a larger thickness, which improves the mechanical strength of the edging layer, thereby improving the structural stability of the edging layer and making it less susceptible to damage, thereby improving the overall structural stability of the graphene heat dissipation structure, improving the finished product quality and service life of the graphene heat dissipation structure, and the preparation process is simple, which is suitable for industrial production. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for use in the embodiments are briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without creative work.

[0017] Figure 1 A flowchart of the steps of a method for preparing a graphene heat dissipation structure according to an embodiment of the present invention; Figure 2 It is a schematic diagram of the three-dimensional decomposition structure of a graphene heat dissipation structure according to one embodiment of the present invention. DETAILED DESCRIPTION

[0018] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the relevant drawings. The preferred embodiments of the present invention are given in the drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thoroughly understood.

[0019] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which the present invention belongs. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.

[0020] For an implementation method, please refer to Figure 1 , a method for preparing a graphene heat dissipation structure, comprising the following steps: S110, providing a first adhesive tape, and performing a die-cutting operation on the first adhesive tape to obtain a first covering layer, wherein the first covering layer is provided with a first adhesive layer.

[0021] It should be noted that, in this embodiment, the first tape is fed by a material roll feeding device, and the first tape is die-cut by a corresponding die cutter according to the shape required for actual production, and the first coating layer of the corresponding shape is obtained by die-cutting. Specifically, the first tape is a single-sided adhesive tape. The first tape is a single-sided adhesive tape, which includes a substrate layer and a first adhesive layer with stickiness disposed on the substrate layer. The first adhesive layer is used to bond and coat the first surface of the graphene heat dissipation layer and the edge layer, and protects the first surface of the graphene heat dissipation layer.

[0022] S120, providing a graphene material strip, performing a die-cutting operation on the graphene material strip to obtain a graphene heat dissipation layer, and laminating a first surface of the graphene heat dissipation layer onto the first adhesive layer.

[0023] It should be noted that the graphene tape can be made of multilayer graphene material. The graphene material has excellent heat dissipation performance, which can ensure that the heat generated by the electronic products can be well dissipated when used in electronic products, and the heat dissipation effect is good. Similarly, the graphene tape is loaded through a material roll loading device, and the graphene tape is die-cut with a corresponding die cutter according to the shape required for actual production. The die-cutting obtains a graphene heat dissipation layer of the corresponding shape. The shape and area of ​​the graphene heat dissipation layer are slightly smaller than the shape and area of ​​the first coating layer, and it is attached to the center position of the first adhesive layer, which can ensure that the first coating layer completely covers and coats the outside of the first surface of the graphene heat dissipation layer, avoiding exposure of the graphene heat dissipation layer, ensuring the subsequent sealing and closure of the graphene heat dissipation layer, and protecting the graphene heat dissipation layer.

[0024] S130. Provide a second adhesive tape, and perform a die-cutting operation on the second adhesive tape to obtain an edge layer, wherein the edge layer is provided with a second adhesive layer and a third adhesive layer, the second adhesive layer and the third adhesive layer are arranged back to back, and the second adhesive layer is adhered to the first adhesive layer, the edge layer is arranged on the outside of the graphene heat dissipation layer, and is spaced apart from the graphene heat dissipation layer, and one end of the edge layer close to the graphene heat dissipation layer is arranged flush with the graphene heat dissipation layer.

[0025] It should be noted that, in the present embodiment, the second tape is a double-sided tape. The second tape adopts a double-sided tape structure having a substrate layer and adhesive layers on both sides of the substrate layer, the second tape is fed by a feeding roll device, and the second tape is die-cut by a corresponding die cutter, and a edging layer of a corresponding shape is obtained by die-cutting, the edging layer is a hollow frame-shaped structure, the edging layer has a second adhesive layer and a third adhesive layer, the second adhesive layer is arranged close to the first adhesive layer, and is bonded to the first adhesive layer, so that the edging layer is fixedly installed on the first coating layer, the edging layer is arranged on the outer side of the graphene heat dissipation layer, and the outer side of the edging layer is aligned with the outer side of the first coating layer, and a certain gap is left between the edging layer and the graphene heat dissipation layer, specifically, the gap width between the edging layer and the graphene is 0.25mm~0.35mm, and the gap width is moderate, so as to avoid the edging layer being deformed by external force to squeeze the graphene heat dissipation layer, and to avoid damaging the graphene heat dissipation layer and affecting the heat dissipation performance.

[0026] Furthermore, one end of the edging layer close to the graphene heat dissipation layer is arranged flush with the graphene heat dissipation layer, that is, the thickness of the end of the edging layer close to the graphene heat dissipation layer is set to be the same as the thickness of the graphene heat dissipation layer, so that the edging layer has a larger thickness, and when the subsequent second coating layer is attached to the graphene heat dissipation layer and the edging layer, a smooth transition structure can be formed between the graphene heat dissipation layer and the edging layer, which is conducive to better adhesion of the second coating layer to the graphene heat dissipation layer and the edging layer, ensuring that it is firmly bonded to the edging layer, and the thickness of the edging layer is large, and the mechanical strength is improved, thereby improving the structural stability of the edging layer and making it less susceptible to damage, thereby preventing impurities or moisture in the external environment from entering through the edging layer to damage the graphene heat dissipation layer, and avoiding stratification of the graphene heat dissipation layer, thereby improving the overall structural stability of the graphene heat dissipation structure, and improving the finished product quality and service life of the graphene heat dissipation structure.

[0027] S140, providing a third adhesive tape, and die-cutting the third adhesive tape to obtain a second covering layer, wherein the second covering layer is provided with a fourth adhesive layer and a fifth adhesive layer, and the fourth adhesive layer is adhered to the second surface of the graphene heat dissipation layer and the third adhesive layer to obtain a graphene heat dissipation structure.

[0028] It should be noted that, in the present embodiment, the third tape is a double-sided tape. The third tape is a double-sided tape having a substrate layer, and adhesive layers are arranged on both sides of the substrate layer. In this way, the prepared second coating layer can have a fourth adhesive layer and a fifth adhesive layer, wherein the fourth adhesive layer is used to bond and coat the second surface and the edge layer of the graphene heat dissipation layer, and is used to cooperate with the first coating layer and the edge layer to seal and seal the graphene heat dissipation layer, and protect the graphene heat dissipation layer. The fifth adhesive layer is used to bond and fit with the specific working surface of the electronic product, so that the graphene heat dissipation structure is bonded and installed in the electronic product, which is convenient to install and use. Specifically, the third tape is fed by a material roll feeding device, and the third tape is die-cut by a corresponding die cutter according to the shape required for actual production, and the second coating layer of the corresponding shape is obtained by die-cutting. The second coating layer has the same shape and size as the first coating layer. The first surface and the second surface of the graphene heat dissipation layer are respectively covered and protected, and the second covering layer is adhered to the second surface of the graphene heat dissipation layer and the edge layer through the fourth adhesive layer, so as to be sealed and packaged into a finished graphene heat dissipation layer. The preparation process is simple and suitable for industrial production. By arranging one end of the edge layer close to the graphene heat dissipation layer to be flush with the graphene heat dissipation layer, the edge layer has a larger thickness, which improves the mechanical strength of the edge layer, thereby improving the structural stability of the edge layer and making it less susceptible to damage. The graphene heat dissipation layer can be well protected, dust or moisture in the external environment can be prevented from entering through the edge layer to damage the graphene heat dissipation layer, and graphene delamination can be avoided, thereby improving the overall structural stability of the graphene heat dissipation structure. The prepared graphene heat dissipation structure has high quality, long service life and good heat dissipation performance.

[0029] In one embodiment, after the fourth adhesive layer is attached to the second surface of the graphene heat dissipation layer and the third adhesive layer, a first release film is further provided, and the first release film is attached to the fifth adhesive layer. It can be understood that by providing the first release film, the first release film has a certain viscosity and can be adhered to the fifth adhesive layer. The first release film can be used as a protective layer to protect the fifth adhesive layer, prevent the fifth adhesive layer from being contaminated during storage and affect the viscosity, and the first release film is easy to tear off and remove. When the graphene heat dissipation structure needs to be used, the first release film is torn off and adhered to a specific working plane through the fifth adhesive layer. It is easy to use and has good practicality.

[0030] In one embodiment, after the operation of attaching the first release film to the fifth adhesive layer, a second release film is further provided, and the second release film is attached to the first coating layer. It can be understood that, similarly, by providing the second release film, the first coating layer can be protected. Specifically, the second release film is attached to the side of the first coating layer away from the graphene heat dissipation layer, so that the second release film and the first release film cooperate with each other to protect the two surfaces of the graphene heat dissipation structure respectively, which is beneficial to the storage of the graphene heat dissipation structure, and it is convenient to tear and remove when it is needed, and has good practicality.

[0031] In one embodiment, the thickness of the third adhesive layer gradually increases from one end close to the graphene heat dissipation layer to one end away from the graphene heat dissipation layer. It can be understood that by setting the thickness of the third adhesive layer to gradually increase from one end close to the graphene heat dissipation layer to one end away from the graphene heat dissipation layer, a trapezoidal third adhesive layer structure can be formed, thereby increasing the surface area of ​​the end of the edging layer away from the graphene heat dissipation layer. Since the end of the edging layer away from the graphene heat dissipation layer is easily impacted by external forces during storage and use, by increasing the surface area of ​​the end of the edging layer away from the graphene heat dissipation layer, the force area of ​​the end of the edging layer away from the graphene heat dissipation layer is increased, and the external impact force can be better borne and buffered, and it is not easy to be damaged. In addition, the third adhesive layer has an inclined surface, which increases the contact area with the fourth adhesive layer, which is conducive to more firmly bonding with the fourth adhesive layer, so that the overall structural stability of the graphene heat dissipation structure is further improved, and the finished product has good quality and long service life.

[0032] In one embodiment, a buffer groove is provided on one side of the third adhesive layer close to the fourth adhesive layer. It is understandable that when the second adhesive tape is die-cut, the third adhesive layer is die-cut synchronously while the second adhesive tape is die-cut by using a die cutter of a corresponding shape, so that a buffer groove is formed on the third adhesive layer. In this embodiment, the buffer groove is arc-shaped. The arc-shaped buffer groove can form an avoidance structure, so that when the edge layer is impacted by an external impact force, the impact force is released and dispersed at the buffer groove, which greatly reduces the damage and influence of the impact force on the edge layer. The buffer groove is set to a smooth arc shape, and a hook-shaped buffer groove is formed on the inclined surface of the third adhesive layer, which can disperse and buffer the impact force well, greatly improve the buffering performance and structural stability of the edge layer, and can ensure the sealing packaging and protection of the graphene heat dissipation layer, which greatly improves the service life and quality of the graphene heat dissipation structure.

[0033] In one of the embodiments, buffer particles are provided on the inner side wall of the buffer groove, and the buffer particles are rubber buffer particles. It is understandable that, since the third adhesive layer has viscosity, and the buffer groove is a groove structure opened on the surface of the third adhesive layer, the inner side wall of the buffer groove also has viscosity, and the inner side wall of the buffer groove is a concave structure, and is not directly bonded to the fourth adhesive layer. By providing rubber buffer particles on the inner side wall of the buffer groove, the viscosity of the inner side wall of the buffer groove can well fix the rubber buffer particles in the buffer groove, and the rubber buffer particles can be processed in the buffer groove by spraying or mold stamping. The preparation process is simple, and the rubber buffer particles can be sealed in the buffer groove by the fourth adhesive layer, so that the rubber buffer particles are not easily affected by the external environment, and are not easily affected by external moisture or light sources. The rubber buffer particles are The structure of the rubber particles is not easily damaged, not easy to harden and degenerate, and can maintain excellent elasticity, thereby maintaining excellent buffering performance, which is beneficial to greatly improve the structural stability and service life of the finished graphene heat dissipation structure without the need to invest too much in finished products. Specifically, rubber buffer particles are inexpensive, easy to obtain, and have excellent elasticity and damping characteristics. They can effectively absorb and reduce the vibration energy generated by external impact force, thereby reducing the impact on the edge layer and reducing damage to the edge layer, thereby ensuring the structural stability of the edge layer and ensuring the protection of the graphene heat dissipation layer. The graphene heat dissipation structure has good overall structural stability, good heat dissipation performance, high quality, simple preparation process, and high production efficiency.

[0034] In one implementation, see Figure 2 , a graphene heat dissipation structure is also provided, which is made by the preparation method of the above graphene heat dissipation structure. The graphene heat dissipation structure 10 includes a first coating layer 100, a graphene heat dissipation layer 200, an edge layer 300 and a second coating layer 400, the first coating layer 100 is provided with a first adhesive layer, the edge layer 300 is provided with a second adhesive layer and a third adhesive layer, the second coating layer 400 is provided with a fourth adhesive layer and a fifth adhesive layer, the first surface of the graphene heat dissipation layer 200 and the second adhesive layer are respectively connected to the first adhesive layer, the edge layer 300 is arranged on the outside of the graphene heat dissipation layer 200, and the edge layer 300 and the graphene heat dissipation layer 200 are arranged at intervals, the end of the edge layer 300 close to the graphene heat dissipation layer 200 is arranged flush with the graphene heat dissipation layer 200, and the fourth adhesive layer is respectively connected to the second surface of the graphene heat dissipation layer 200 and the third adhesive layer.

[0035] It should be noted that the second coating layer 400, the graphene heat dissipation layer 200, the edging layer 300, and the first coating layer 100 are stacked in sequence from top to bottom, and the second coating layer 400, the edging layer 300 and the first coating layer 100 are respectively coated on the upper and lower surfaces and all around the graphene heat dissipation layer 200, so as to seal, package and protect the graphene heat dissipation layer 200 to form a graphene heat dissipation structure, and the end of the edging layer 300 close to the graphene heat dissipation layer 200 is arranged to be flush with the graphene heat dissipation layer 200, that is, the end of the edging layer 300 close to the graphene heat dissipation layer 200 is the same as the thickness of the graphene heat dissipation layer 200, so that the edging layer 300 has a larger thickness, which improves the mechanical strength of the edging layer 300, thereby improving the structural stability of the edging layer 300, making it less susceptible to damage, thereby improving the overall structural stability of the graphene heat dissipation structure, and improving the finished product quality and service life of the graphene heat dissipation structure.

[0036] In one embodiment, the graphene heat dissipation structure further includes a first release film (not shown) and a second release film 500, wherein the first release film is connected to the fifth adhesive layer, and the second release film 500 is connected to a side of the first coating layer 100 away from the graphene heat dissipation layer 200. It can be understood that by providing the first release film and the second release film 500, the two outer side surfaces of the graphene heat dissipation structure can be protected, which is beneficial to protecting the graphene heat dissipation structure from being polluted by the external environment during storage, and the first release film and the second release film 500 are easy to tear and remove, which is convenient for users to use and has good practicality.

[0037] In one embodiment, the thickness of the third adhesive layer gradually increases from one end close to the graphene heat dissipation layer 200 to one end away from the graphene heat dissipation layer 200. It can be understood that by forming a trapezoidal third adhesive layer structure, the surface area of ​​the end of the edge layer 300 away from the graphene heat dissipation layer 200 is increased, and the force bearing area of ​​the end of the edge layer 300 away from the graphene heat dissipation layer 200 is increased, which can better withstand and buffer the external impact force and is not easy to be damaged. In addition, the third adhesive layer has an inclined surface, which increases the contact area with the fourth adhesive layer, which is conducive to more firmly bonding with the fourth adhesive layer, so that the overall structural stability of the graphene heat dissipation structure is further improved, and the finished product has good quality and long service life.

[0038] In one embodiment, a buffer groove is provided on one side of the third adhesive layer close to the fourth adhesive layer. It is understandable that in this embodiment, the buffer groove is in an arc shape. The arc-shaped buffer groove can form an avoidance structure, so that when the edge layer 300 is impacted by an external impact force, the impact force is released and dispersed at the buffer groove, which greatly reduces the damage and impact of the impact force on the edge layer 300, and the buffer groove is set to a smooth arc shape, forming a hook-shaped buffer groove on the inclined surface of the third adhesive layer, which can disperse and buffer the impact force well, greatly improving the buffering performance and structural stability of the edge layer 300, and can ensure the sealing packaging and protection of the graphene heat dissipation layer 200, greatly improving the service life and quality of the graphene heat dissipation structure.

[0039] In one embodiment, the inner wall of the buffer groove is provided with buffer particles, and the buffer particles are rubber buffer particles. It can be understood that by providing the rubber buffer particles on the inner wall of the buffer groove, the rubber buffer particles have excellent elasticity and damping properties, and can effectively absorb and reduce the vibration energy generated by the external impact force, thereby reducing the impact on the edge layer 300 and reducing the damage to the edge layer 300, thereby ensuring the structural stability of the edge layer 300 and ensuring the protection of the graphene heat dissipation layer 200. The overall structural stability of the graphene heat dissipation structure is good, the heat dissipation performance is good, and the quality is high.

[0040] Compared with the prior art, the present invention has at least the following advantages: The preparation method of the graphene heat dissipation structure is provided by providing a first tape, a second tape and a third tape, wherein the first tape and the third tape are die-cut to form a first coating layer and a second coating layer, the area of ​​the first coating layer and the second coating layer is larger than the area of ​​the graphene heat dissipation layer, the first coating layer and the second coating layer are used to be coated on the first surface and the second surface of the graphene heat dissipation layer respectively, and the second tape is die-cut to form an edge layer, which is a frame-shaped structure, coated on the outside of the graphene heat dissipation layer and bonded to the first coating layer and the second coating layer, so as to seal and package the graphene heat dissipation layer. The graphene heat dissipation layer protects the graphene heat dissipation layer. At the same time, one end of the edging layer close to the graphene heat dissipation layer is arranged to be flush with the graphene heat dissipation layer. That is to say, one end of the edging layer close to the graphene heat dissipation layer has the same thickness as the graphene heat dissipation layer, so that the edging layer has a larger thickness, which improves the mechanical strength of the edging layer, thereby improving the structural stability of the edging layer and making it less susceptible to damage, thereby improving the overall structural stability of the graphene heat dissipation structure, improving the finished product quality and service life of the graphene heat dissipation structure, and the preparation process is simple, which is suitable for industrial production.

[0041] The above-mentioned embodiments only express several implementation methods of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims

1. A method for preparing a graphene heat dissipation structure, characterized in that: The following steps are involved: Providing a first adhesive tape, and performing a die-cutting operation on the first adhesive tape to obtain a first covering layer, wherein the first covering layer is provided with a first adhesive layer; Providing a graphene material strip, performing a die-cutting operation on the graphene material strip to obtain a graphene heat dissipation layer, and laminating a first surface of the graphene heat dissipation layer onto the first adhesive layer; Providing a second adhesive tape, performing a die-cutting operation on the second adhesive tape to obtain an edge layer, wherein the edge layer is provided with a second adhesive layer and a third adhesive layer, the second adhesive layer and the third adhesive layer are arranged back to back, the second adhesive layer is attached to the first adhesive layer, the edge layer is arranged on the outside of the graphene heat dissipation layer, and is spaced apart from the graphene heat dissipation layer, and one end of the edge layer close to the graphene heat dissipation layer is arranged flush with the graphene heat dissipation layer; A third adhesive tape is provided, and the third adhesive tape is die-cut to obtain a second covering layer, wherein the second covering layer is provided with a fourth adhesive layer and a fifth adhesive layer, and the fourth adhesive layer is adhered to the second surface of the graphene heat dissipation layer and the third adhesive layer to obtain a graphene heat dissipation structure.

2. The method for preparing the graphene heat dissipation structure according to claim 1, characterized in that: The first adhesive tape is a single-sided adhesive tape.

3. The method for preparing the graphene heat dissipation structure according to claim 1, characterized in that: The second adhesive tape is a double-sided adhesive tape.

4. The method for preparing the graphene heat dissipation structure according to claim 1, characterized in that: The third adhesive tape is a double-sided adhesive tape.

5. The method for preparing the graphene heat dissipation structure according to claim 1, characterized in that: After the operation of laminating the fourth adhesive layer to the second surface of the graphene heat dissipation layer and the third adhesive layer, a first release film is provided, and the first release film is laminating to the fifth adhesive layer.

6. The method for preparing the graphene heat dissipation structure according to claim 5, characterized in that: After the operation of laminating the first release film onto the fifth adhesive layer, a second release film is provided, and the second release film is laminating onto the first covering layer.

7. The method for preparing a graphene heat dissipation structure according to any one of claims 1 to 6, characterized in that: The thickness of the third adhesive layer gradually increases from an end close to the graphene heat dissipation layer to an end far away from the graphene heat dissipation layer.

8. The method for preparing the graphene heat dissipation structure according to claim 7, characterized in that: A buffer groove is formed on a side of the third adhesive layer close to the fourth adhesive layer.

9. The method for preparing the graphene heat dissipation structure according to claim 8, characterized in that: The buffer groove is in an arc shape.

10. A graphene heat dissipation structure, characterized in that: The graphene heat dissipation structure is made by the preparation method of any one of claims 1 to 9.

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