Vehicle-mounted thermal management system and method and vehicle

Abstract

The invention provides a vehicle-mounted thermal management system and method and a vehicle. The vehicle-mounted heat management system comprises a cooling and heating box, cooling and heating vehicle-mounted equipment and auxiliary heat management equipment, the cooling and heating vehicle-mounted equipment comprises a semiconductor module; the semiconductor module comprises a heat exchange end; the heat exchange end comprises a hot end and a cold end, and one of the cold end and the hot end is located in the cold and warm box; the auxiliary heat management equipment can be used for carrying out auxiliary heat management on the heat exchange end of the cooling and heating vehicle-mounted equipment; the vehicle-mounted air conditioning system comprises a compressor, an air conditioning evaporator and a condenser; the cooling and heating vehicle-mounted equipment, the vehicle-mounted air conditioning system and the auxiliary heat management equipment share a compressor, and the auxiliary heat management equipment assists the semiconductor module in refrigerating and / or heating again on the basis of refrigerating and / or heating of the semiconductor module of the cooling and heating box, so that the temperature of the cooling and heating box is lower or higher. In this way, the refrigerating and / or heating performance of the cold and warm box is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of vehicle thermal management, and in particular to a vehicle-mounted thermal management system, method and vehicle. Background Art

[0002] Independent semiconductor devices in related technologies, such as refrigerators, have limited refrigeration capacity and cannot reach low temperatures. Independent compressor refrigerators generate a lot of waste heat and noise, which has a great impact on the passenger compartment, and the compressor cost is too high. Summary of the invention

[0003] The present application provides a vehicle thermal management system, method and vehicle.

[0004] In a first embodiment, the present application provides a vehicle thermal management system, including:

[0005] Cold and warm box;

[0006] A cooling and heating vehicle-mounted device, the cooling and heating vehicle-mounted device comprises a semiconductor module; the semiconductor module comprises a heat exchange end, the heat exchange end comprises a hot end and a cold end, and one of the cold end or the hot end is located in the cooling and heating box;

[0007] Auxiliary thermal management equipment, the cooling and heating vehicle-mounted equipment can perform auxiliary thermal management for the heat exchange end of the cooling and heating vehicle-mounted equipment;

[0008] The vehicle air-conditioning system includes a compressor, an air-conditioning evaporator and a condenser. The vehicle-mounted cooling and heating equipment, the vehicle-mounted air-conditioning system and the auxiliary thermal management device share the compressor. The cooling and heating box, based on the cooling and / or heating of the semiconductor module, the auxiliary thermal management device assists the semiconductor module in cooling and / or heating again, so that the temperature of the cooling and heating box is lower or higher.

[0009] Furthermore, in the second embodiment, the vehicle-mounted thermal management system also includes: an air guide channel and a damper arranged on the air guide channel; the air guide channel connects the semiconductor module and the auxiliary thermal management device; the air in the auxiliary thermal management device exchanges heat with the heat exchange end of the semiconductor module through the air guide channel, thereby assisting the heat exchange end of the semiconductor module in adjusting the temperature.

[0010] Furthermore, in a third embodiment, the cold end is located in the cooling and heating box, the cold end exchanges heat with the cooling and heating box, the hot end exchanges heat with the outside of the cooling and heating box, the auxiliary thermal management device includes an air-conditioning evaporator, and the air guide channel connects the air-conditioning evaporator and the cooling and heating box; the semiconductor module is started, the damper is opened, the air-conditioning evaporator transfers cold air to the cooling and heating box through the air guide channel, exchanges heat with the cooling and heating box, and cools down the cooling and heating box. The semiconductor module is cooled as the cooling and heating box is cooled, and the cold end of the semiconductor module is cooled.

[0011] Furthermore, in a fourth embodiment, the cold end is located in the cold and warm box, the cold end exchanges heat with the inside of the cold and warm box, and the hot end exchanges heat with the outside of the cold and warm box; the auxiliary thermal management device also includes a heat exchange component arranged in parallel with the air-conditioning evaporator, the heat exchange component is located outside the cold and warm box and is arranged opposite to the hot end of the semiconductor module or is connected through a channel, the heat exchange component exchanges heat with the hot end, and the heat exchange component cools down the hot end.

[0012] Further, in a fifth embodiment, the cold end is located in the cold and warm box, the cold end exchanges heat with the cold and warm box, the hot end exchanges heat with the outside of the cold and warm box, the auxiliary thermal management device includes an air-conditioning evaporator, and the air guide channel connects the air-conditioning evaporator and the hot end of the semiconductor module;

[0013] The semiconductor module is started, the damper is opened, and the air conditioner evaporator transfers cold air to the hot end of the semiconductor module through the air guide channel to cool the hot end of the semiconductor module.

[0014] Further, in a sixth embodiment, the auxiliary thermal management device includes a heat exchange component disposed outside the cold and warm box;

[0015] The heat exchange end includes a first heat exchange end arranged inside the cold and warm box and a second heat exchange end arranged outside the cold and warm box;

[0016] The heat exchange components are respectively connected between the vehicle air conditioner and the second heat exchange end. The heat exchange components are close to the second heat exchange end and perform heat exchange with the second heat exchange end through the circulation of the heat exchange medium inside the heat exchange components.

[0017] Further, in the seventh embodiment, the cooling and heating vehicle-mounted device further includes a cold storage module disposed around the heat exchange end;

[0018] After the vehicle thermal management system reaches the set temperature of the cold and warm box, the cold storage module stores cold;

[0019] When the temperature of the cooling and heating box returns to normal after the vehicle thermal management system reaches the set temperature of the cooling and heating box, the cold storage module is preferentially used to release cold energy to cool the heat exchange end of the semiconductor module.

[0020] Further, the heat exchange end includes: a first heat exchange end provided inside the cold and warm box and a second heat exchange end provided outside the cold and warm box;

[0021] The cold storage module is connected to the inside of the semiconductor module, close to the first heat exchange end, and cools the first heat exchange end;

[0022] and / or,

[0023] The cold storage module is connected around the second heat exchange end; wherein, a temperature difference is set between the first heat exchange end and the second heat exchange end; the cold storage module cools down the second heat exchange end, and the first heat exchange end of the semiconductor module is cooled synchronously with the temperature of the second heat exchange end.

[0024] Further, in the eighth embodiment, the vehicle thermal management system further comprises a strong convection circulation device connected to the periphery of the heat exchange end;

[0025] The strong convection circulation device circulates the air flow around the strong convection circulation device to perform heat exchange with the heat exchange end and / or the cold storage module.

[0026] The present application provides a vehicle, which includes the vehicle thermal management system as described above.

[0027] The present application provides a vehicle thermal management method, based on the vehicle thermal management system as described above, the vehicle thermal management system further includes a controller and a sensor connected to the controller; the valve group system of the vehicle thermal management system includes an electronic valve at the compressor end of the vehicle air conditioner; the sensor monitors the ambient temperature, the temperature inside the cooling and heating box, and the temperature of the heat exchange end of the cooling and heating vehicle equipment respectively;

[0028] According to the set temperature of the cooling and heating box, the ambient temperature, the temperature inside the cooling and heating box and the temperature of the heat exchange end, it is determined whether the vehicle thermal management system reaches the set temperature of the cooling and heating box to control the working mode of the vehicle thermal management system.

[0029] Further, based on the second embodiment, the third embodiment to the fifth embodiment, the working mode of the vehicle thermal management system includes a first working mode; in the first working mode, the cold air of the vehicle air conditioner is introduced to cool the cold and warm box;

[0030] The controller controls the semiconductor module to start up and controls the damper to open at the same time. The air-conditioning evaporator of the vehicle air-conditioning transmits cold air to the cooling and heating box through the air guide channel to cool the cooling and heating box. The semiconductor module exchanges heat with the cooling and heating box as the cooling and heating box is cooled down until the vehicle thermal management system reaches the set temperature of the cooling and heating box, and controls the damper to close.

[0031] Further, based on the vehicle thermal management system as described in the fourth embodiment above, a temperature difference is set between the first heat exchange end of the semiconductor module and the second heat exchange end of the semiconductor module;

[0032] The operating mode of the vehicle thermal management system includes a second operating mode; in the second operating mode, the cold and warm box is cooled by a heat exchange component;

[0033] The controller controls the electronic valve to open, controls the heat exchange component to work, and cools down the second heat exchange end so that the temperature of the first heat exchange end is lowered until the vehicle thermal management system reaches the set temperature of the cooling and heating box.

[0034] Further, based on the vehicle thermal management system as described in the seventh embodiment, the vehicle thermal management system includes a heat dissipation pipe arranged outside the cold and warm box and close to the second heat exchange end of the semiconductor module, and the working mode of the vehicle thermal management system includes a fourth working mode; in the fourth working mode, the cold and warm box is cooled by a strong convection circulation device;

[0035] When the load of the vehicle thermal management system meets the independent cooling of the semiconductor module, the controller controls the electronic valve on the compressor end of the vehicle air conditioner to close, controls the damper to close, controls the strong convection circulation equipment to open, and dissipates heat through the heat dissipation pipe and the vehicle interior space to reduce the temperature of the second heat exchange end of the semiconductor module.

[0036] Further, based on the working mode of the vehicle thermal management system described in the eighth embodiment and the ninth embodiment, the working mode includes a third working mode; in the third working mode, the cold and warm box is cooled by the cold storage module;

[0037] When the temperature of the cold / warm box rises after the vehicle thermal management system reaches the set temperature of the cold / warm box, the controller controls the strong convection circulation equipment to blow out the cold of the cold storage module to maintain the temperature of the cold / warm box. After the vehicle thermal management system reaches the set temperature of the cold / warm box and the cold storage module can no longer maintain the temperature of the cold / warm box, the controller controls the semiconductor module to start cooling and the electronic valve to open.

[0038] Furthermore, the operating mode of the vehicle thermal management system includes a fifth operating mode; in the fifth operating mode, the cold and warm boxes are heated by the heat exchange component;

[0039] The controller controls the electronic valve at the compressor end of the vehicle air conditioner to close and controls the semiconductor module to start.

[0040] Further, based on the sixth embodiment, the working mode of the vehicle thermal management system includes a sixth working mode; in the sixth working mode, the condenser and the cold end are arranged opposite to each other or connected through a channel, the condenser and the cold end exchange heat, and the condenser heats up the cold end.

[0041] In some embodiments, a vehicle thermal management system of the present application includes a cooling and heating box, a cooling and heating vehicle-mounted device, and an auxiliary thermal management device. By sharing a compressor with the cooling and heating vehicle-mounted device, the vehicle-mounted air-conditioning system, and the auxiliary thermal management device, the cost of the compressor can be reduced, and the noise of the compressor of the semiconductor device alone can be reduced. At the same time, the auxiliary thermal management device performs auxiliary thermal management for the heat exchange end of the semiconductor module on the basis of the refrigeration capacity of the semiconductor module itself. For example, when cooling, it is equivalent to superimposing at least two stages of refrigeration to improve the refrigeration capacity of the semiconductor module so that the temperature range reaches the expected value. And / or, the auxiliary thermal management device performs auxiliary thermal management for the heat exchange end of the semiconductor module on the basis of the heating capacity of the semiconductor module itself. For example, when heating, it is equivalent to superimposing at least two stages of heating to improve the heating capacity of the semiconductor module so that the temperature range reaches the expected value. BRIEF DESCRIPTION OF THE DRAWINGS

[0042] Figure 1 Shown is a schematic diagram of a vehicle thermal management system according to an embodiment of the present application;

[0043] Figure 2 Shown Figure 1 A first structural schematic diagram of an air guide channel included in the vehicle thermal management system shown;

[0044] Figure 3 Shown Figure 1 A second structural schematic diagram of the air guide channel included in the vehicle thermal management system shown;

[0045] Figure 4 Shown Figure 1 The vehicle thermal management system shown includes a schematic diagram of the overall structure of a heat exchange component;

[0046] Figure 5 Shown Figure 1 The vehicle thermal management system shown includes a detailed structural schematic diagram of a heat exchange component;

[0047] Figure 6 Shown Figure 1 The vehicle thermal management system shown includes a first structural schematic diagram of a cold storage module disposed outside a cold and warm box;

[0048] Figure 7 Shown Figure 1 The vehicle thermal management system shown includes a first structural schematic diagram of a cold storage module disposed on both sides of the cold and warm boxes;

[0049] Figure 8 Shown Figure 1 The vehicle thermal management system shown includes a second structural schematic diagram of cold storage modules arranged on both sides of the cold and warm boxes;

[0050] Fig. 9 Shown Figure 1 The vehicle thermal management system shown includes a second structural schematic diagram of a cold storage module disposed outside the cold and warm boxes;

[0051] Fig.10 Shown Figure 1 Schematic diagram of the heating working mode of the vehicle thermal management system shown.

[0052] Description of reference numerals:

[0053] 10-heating and cooling box, 20-heating and cooling vehicle equipment, 21-semiconductor module, 211-hot end, 212-cold end, 30-auxiliary thermal management equipment, 31-vehicle air-conditioning system, 311-compressor, 312-air-conditioning evaporator, 313-condenser, 314-liquid storage tank, 315-battery cooler, 32-heat dissipation evaporator, 41-air guide channel, 42-air door, 51-cold storage module, 61-first fan, 62-second fan, 71-first sensor, 72-second sensor, 73-third sensor, 74-fourth sensor. DETAILED DESCRIPTION

[0054] Exemplary embodiments will be described in detail herein, examples of which are shown in the accompanying drawings. When the following description refers to the drawings, the same numbers in different drawings represent the same or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with one or more embodiments of the present specification. Instead, they are merely examples of devices and methods consistent with some aspects of one or more embodiments of the present specification as detailed in the appended claims.

[0055] It should be noted that: in other embodiments, the steps of the corresponding method are not necessarily performed in the order shown and described in this specification. In some other embodiments, the steps included in the method may be more or less than those described in this specification. In addition, a single step described in this specification may be decomposed into multiple steps for description in other embodiments; and multiple steps described in this specification may be combined into a single step for description in other embodiments.

[0056] The embodiment of the present application provides a vehicle thermal management system, including a heating and cooling box, a heating and cooling vehicle device and an auxiliary thermal management device. The heating and cooling vehicle device includes a semiconductor module, and the vehicle air-conditioning system includes a compressor, an air-conditioning evaporator and a condenser. In addition, the cost of the compressor can be reduced by sharing the compressor between the heating and cooling vehicle device, the vehicle air-conditioning system and the auxiliary thermal management device. Moreover, the auxiliary thermal management device performs auxiliary thermal management for the heat exchange end of the semiconductor module on the basis of the refrigeration capacity of the semiconductor module itself. For example, when cooling, it is equivalent to superimposing at least two stages of refrigeration to improve the refrigeration capacity of the semiconductor module so that the temperature range reaches the expected value, thereby making the temperature of the heating and cooling box lower. And / or, the auxiliary thermal management device performs auxiliary thermal management for the heat exchange end of the semiconductor module on the basis of the heating capacity of the semiconductor module itself. For example, when heating, it is equivalent to superimposing at least two stages of heating to improve the heating capacity of the semiconductor module so that the temperature range reaches the expected value, thereby making the temperature of the heating and cooling box higher.

[0057] Figure 1 Shown is a schematic diagram of a vehicle thermal management system according to an embodiment of the present application.

[0058] like Figure 1 As shown, the vehicle thermal management system may include, but is not limited to, a cooling and heating box 10 , a cooling and heating vehicle device 20 , and an auxiliary thermal management device 30 .

[0059] The above-mentioned cold and warm box 10 is a box device that can realize cooling and heating functions in the same device.

[0060] The above-mentioned vehicle-mounted cooling and heating device 20 is at least partially disposed in the cooling and heating box 10. The vehicle-mounted cooling and heating device 20 is used to realize the cold storage function, the heating function and the cooling function. The vehicle-mounted cooling and heating device 20 may include but is not limited to a semiconductor module 21. The semiconductor module 21 may include but is not limited to a heat exchange end ( Figure 1(not shown in the figure). The heat exchange end includes a cold end 212 and a hot end 211, and at least one of the cold end and the hot end is located in the cold and warm box. When current passes through a semiconductor module 21 formed by contact between two different semiconductor materials (usually n-type and p-type materials), the current will cause one side of the contact point to absorb heat and the other side to release heat. Among them, the side that absorbs heat is called the cold end 212, and the side that releases heat is called the hot end 211. The cold and warm vehicle-mounted device 20 has the ability to store cold, and the cold and warm vehicle-mounted device mainly absorbs the heat in the cold and warm box through the cold end of the semiconductor module 21 to achieve cooling of the cold and warm box; of course, the cold and warm vehicle-mounted device 20 can also release heat into the cold and warm box through the hot end of the semiconductor module 21 to achieve heating of the cold and warm box. After the semiconductor template is selected, the temperature difference between the cold end and the hot end is a fixed value. Therefore, when the temperature of the hot end is lowered, the temperature of the cold end will also drop, causing the cold end to absorb more heat and the temperature of the heating and cooling box to drop more. Similarly, when the temperature of the cold end is increased, the temperature of the hot end can also be increased. If the hot end is located in the heating and cooling box, it can release more heat to the heating and cooling box to increase the temperature of the heating and cooling box.

[0061] The heating and cooling box 10 and the heating and cooling vehicle-mounted device 20 herein may form a vehicle-mounted device with heating / cooling functions. For example, the vehicle-mounted device with heating / cooling functions may be, but is not limited to, one or more of a vehicle-mounted refrigerator with heating / cooling functions, an air purifier with heating / cooling functions, and an air humidifier with heating / cooling functions.

[0062] The auxiliary thermal management device 30 and the heating and cooling vehicle-mounted device 20 can perform auxiliary thermal management for the heat exchange end of the heating and cooling vehicle-mounted device 20. When the heating and cooling box is cooling, heat exchange is performed with the hot end. When the heating and cooling box is heating, heat exchange is performed with the cold end. The auxiliary thermal management device 30 includes a device arranged outside the heating and cooling box 10. The vehicle-mounted thermal management system also includes an on-board air-conditioning system 31; the on-board air-conditioning system 31 includes a compressor 311; the heating and cooling vehicle-mounted device, the on-board air-conditioning system 31 and the auxiliary thermal management device 30 share the compressor 311. On the basis of the thermal management of the semiconductor module 21, the auxiliary thermal management device assists the semiconductor module to perform at least two levels of thermal management. For example, on the basis of cooling and / or heating the semiconductor module 21, the auxiliary thermal management device 30 assists the semiconductor module 21 in cooling and / or heating again, so that the temperature of the heating and cooling box is lower or higher, so as to perform at least two levels of cooling.

[0063] It should be noted that the auxiliary thermal management device 30 may include but is not limited to the air conditioning evaporator 312 of the vehicle air conditioning system 31, the heat dissipation evaporator 32, the fan and other auxiliary semiconductor modules 21 for cooling the cold end 212 and / or hot end so that the heating and cooling box 10 can reach a low temperature.

[0064] In the embodiment of the present application, the compressor 311 is the compressor 311 of the vehicle air conditioning system 31. At the same time, the auxiliary thermal management device 30 performs auxiliary thermal management for the heat exchange end of the semiconductor module 21 on the basis of the cooling capacity of the semiconductor module 21 itself, so as to improve the cooling capacity of the semiconductor module 21 so that the temperature range reaches the expected value. In addition, since the vehicle-mounted cooling and heating device 20 does not use an independent compressor 311, a large amount of waste heat and noise can be reduced, reducing the impact on the passenger compartment.

[0065] Figure 2 Shown Figure 1 A first structural schematic diagram of the air guide channel 41 included in the vehicle thermal management system shown; Figure 3 Shown Figure 1 A second structural schematic diagram of the air guide channel 41 included in the vehicle thermal management system is shown.

[0066] Combination Figure 1 ,like Figure 2 and Figure 3 As shown, the above-mentioned vehicle thermal management system may also include, but is not limited to: an air guide channel 41 and a damper 42 provided on the air guide channel 41. The damper 42 is used to open or close the air guide channel 41. When it is opened, the air guide channel 41 is opened, so that air can flow in the air guide channel 41 to cool down or heat up the cold and warm box. The damper 42 is closed, and the air guide channel 41 is closed. The air guide channel 41 connects the semiconductor module 21 and the auxiliary thermal management device 30. In this embodiment, the auxiliary thermal management device 30 is an air conditioning evaporator 312; the auxiliary thermal management device 30 transfers air through the air guide channel 41, and the auxiliary semiconductor module 21 adjusts the temperature. In this way, the air in the auxiliary thermal management device 30 exchanges heat with the heat exchange end of the semiconductor module 21 through the air guide channel 41, and the heat exchange end of the auxiliary semiconductor module 21 adjusts the temperature. For example, cold air is transferred to assist the semiconductor module 21 to cool down.

[0067] In the embodiment of the present application, the air guide channel 41 and the air door 42 can further improve the ability to assist in adjusting the temperature of the semiconductor module 21, and further, enable the semiconductor module 21 to cool down faster to achieve a cooling function.

[0068] Continue as Figure 2In the example shown, the cold end 212 is located in the cold and warm box 10, the cold end 212 exchanges heat with the cold and warm box 10, and the hot end 211 exchanges heat with the outside of the cold and warm box 10, the auxiliary thermal management device 30 includes an air-conditioning evaporator 312, and an air guide channel 41 connects the air-conditioning evaporator 312 and the cold and warm box 10; the semiconductor module 21 is started, the damper 42 is opened, the air-conditioning evaporator 312 transfers air to the cold and warm box 10 through the air guide channel 41, exchanges heat with the cold and warm box 10, and cools down the cold and warm box 10, and the semiconductor module 21 exchanges heat with the cold and warm box 10 as the cold and warm box 10 is cooled, and the cold end 212 of the semiconductor module 21 is cooled to achieve refrigeration.

[0069] Continue as Figure 2 and Figure 3 As shown, the vehicle air conditioning system 31 is composed of core components such as a compressor 311, a condenser 313, a liquid storage tank 314, an expansion valve and an air conditioning evaporator 312 to achieve cooling or heating.

[0070] The air conditioning evaporator 312 of the vehicle air conditioning system 31 converts the refrigerant from liquid to gas to realize the refrigeration cycle of the vehicle air conditioning system 31. Furthermore, the above-mentioned air guide channel 41 is connected between the air conditioning evaporator 312 and the cold and warm box 10. In this way, the evaporation process of the refrigerant in the air conditioning evaporator 312 absorbs heat from the air. When the vehicle air conditioning system 31 is working, the refrigerant enters the air conditioning evaporator 312 through the expansion valve, and in the low temperature and low pressure environment of the air conditioning evaporator 312, the refrigerant changes from liquid to gas. In this process, the refrigerant absorbs heat from the surrounding air, thereby lowering the temperature of the air, and is opened through the damper 42, and the cold and warm box 10 is cooled through the air guide channel 41.

[0071] Continue as Figure 3 In the example shown, the cold end 212 is located in the cold and warm box 10, the cold end 212 exchanges heat with the cold and warm box 10, and the hot end 211 exchanges heat with the outside of the cold and warm box 10, and the auxiliary thermal management device 30 includes an air conditioning evaporator 312. The air guide channel 41 connects the air conditioning evaporator 312 of the vehicle air conditioning system 31 and the hot end 211 of the semiconductor module 21. When the semiconductor module 21 is started, the damper 42 is opened, and the air conditioning evaporator 312 transfers cold air to the hot end 211 of the semiconductor module 21 through the air guide channel 41, and cools down the hot end 211 of the semiconductor module 21 to achieve refrigeration.

[0072] In the embodiment of the present application, the refrigeration cycle of the vehicle air-conditioning system 31 is used to optimize the heat dissipation of the semiconductor module 21, the hot end 211 of the semiconductor module 21 is cooled, and the temperature of the cold end 212212 is reduced to a low temperature through refrigeration of the semiconductor module 21. After optimization, a freezing effect can be achieved.

[0073] As another optional embodiment, the hot end 211 is located in the cold and warm box 10, the hot end 211 exchanges heat with the cold and warm box 10, and the cold end 212 exchanges heat with the outside of the cold and warm box 10. The auxiliary thermal management device 30 includes a condenser 313 of the vehicle air-conditioning system. The condenser 313 is arranged opposite to the cold end 212 or connected through a channel. The condenser 313 exchanges heat with the cold end 212, and the condenser 313 heats the cold end 212.

[0074] In the embodiment of the present application, the condenser 313 of the vehicle air conditioning system 31 is used to circulate and optimize the temperature rise of the cold end 212 of the semiconductor module 21 .

[0075] Figure 4 Shown Figure 1 The vehicle thermal management system shown includes a schematic diagram of the overall structure of a heat exchange component.

[0076] like Figure 2 and Figure 4 As shown, the cold end 212 is located in the cold and warm box 10, the cold end 212 exchanges heat with the cold and warm box 10, and the hot end 211 exchanges heat with the outside of the cold and warm box 10; the auxiliary thermal management device also includes a heat exchange component arranged in parallel with the air-conditioning evaporator, the heat exchange component is located outside the cold and warm box 10 and is arranged opposite to the hot end 211 of the semiconductor module or is connected through a channel, the heat exchange component exchanges heat with the hot end 211, and the heat exchange component cools down the hot end 211.

[0077] The vehicle thermal management system may include, but is not limited to, a heat exchange component disposed outside the cold and warm box 10. The heat exchange component may exchange heat with the heat exchange end outside the cold and warm box 10 through the medium flowing inside. The medium may include, but is not limited to, liquid, gas, and refrigerant, etc., which are not limited here. Of course, other substances with large specific heat may also be used for liquid cooling, which can achieve the desired temperature and reduce the air conditioning startup rate, requiring the addition of a circulating liquid pump and liquid storage space.

[0078] The heat exchange component may be, but is not limited to, a heat dissipation evaporator 32, such as a heat dissipation fin.

[0079] The heat exchange end in this article may include but is not limited to a first heat exchange end provided inside the cold and warm box 10 and a second heat exchange end provided outside the cold and warm box 10. One of the first heat exchange end and the second heat exchange end may be a hot end 211, and the other of the first heat exchange end and the second heat exchange end may be a cold end 212. The above-mentioned heat exchange components are respectively connected between the vehicle air conditioning system 31 and the second heat exchange end, and the heat exchange component is close to the second heat exchange end, and heat is exchanged with the second heat exchange end through the circulation of the heat exchange medium (hereinafter also referred to as the medium) inside the heat exchange component.

[0080] Figure 5 Shown Figure 1 The vehicle thermal management system shown includes a detailed structural schematic diagram of the heat exchange component.

[0081] In such Figure 5 In the example shown, the heat dissipation evaporator 32 heats the hot end 211 of the semiconductor module 21 .

[0082] In the embodiment of the present application, when the heat exchange component is working, the temperature inside or outside the cold and warm box 10 can be adjusted by circulating the heat exchange medium inside the heat exchange component. For example, in the cooling mode, the heat exchange medium can perform heat exchange through the second heat exchange end, absorb the heat inside the cold and warm box 10, and then transfer it to the outside of the cold and warm box 10, thereby reducing the temperature inside the cold and warm box 10.

[0083] Figure 6 , Figure 7 , Figure 8 and Fig. 9 The following are shown: Figure 1 The vehicle thermal management system shown includes various structural schematic diagrams of the cold storage module 51.

[0084] like Figure 2 , Figure 3 , Figure 5 and Figures 6 to 9 As shown, the vehicle-mounted device 20 for heating and cooling further includes a cold storage module 51, which is arranged around the heat exchange end. The cold storage module 51 is generally used to store cold energy and release cold energy when needed to help maintain the internal temperature. When the vehicle-mounted device with heating / cooling function is working, the condenser 313 transfers cold energy to the cold storage module 51, which stores the cold energy so that it can be released when needed.

[0085] The ice storage module has a refrigerant, which can be water or a salt water solution, which turns into ice after cooling to store cold energy. The system usually uses a phase change method (from water to ice) to achieve the storage and release of cold energy.

[0086] In one example, after the vehicle thermal management system reaches the set temperature of the cooling and heating box 10, the cold storage module 51 stores cold. In another example, after the vehicle thermal management system reaches the set temperature of the cooling and heating box 10 and the temperature of the cooling and heating box 10 returns to normal, the cold storage module 51 is used to release cold energy to cool the heat exchange end of the semiconductor module 21. Figure 2 , Figure 3 , Figure 5 , Figure 7 and Figure 8 As shown, after the cold storage module 51 is integrated with the cold end 212 of the semiconductor module 21, the startup rate of the compressor 311 of the vehicle air-conditioning system 31 is reduced, and the compressor 311 can be kept off for a long time, thereby reducing the energy consumption of the whole vehicle.

[0087] The above-mentioned set temperature refers to the temperature expected by the user, and the various components of this article cooperate to maintain this set temperature.

[0088] In the embodiment of the present application, cold storage is a physical phase change process, which does not cause redundant logic for the control of the entire vehicle, reduces the complexity of control, and thus reduces costs.

[0089] In such Figure 2 , Figure 3 and Figure 5 In the first example shown, the heat exchange end includes: a first heat exchange end provided inside the cold and warm box 10 and a second heat exchange end provided outside the cold and warm box 10; the cold storage module 51 is connected to the inside of the semiconductor module 21, close to the first heat exchange end, to cool the first heat exchange end. Figure 2 , Figure 3 and Figure 5 As shown, the cold storage module 51 can cool the cold end 212 of the semiconductor module 21 .

[0090] In such Figure 6 and Fig. 9 In the second example shown, the cold storage module 51 is connected around the second heat exchange end; wherein the first heat exchange end and the second heat exchange end are set to have a temperature difference, the cold storage module 51 cools down the second heat exchange end, and the first heat exchange end of the semiconductor module 21 is cooled down synchronously with the temperature of the second heat exchange end, until the vehicle thermal management system reaches the set temperature of the cold and warm box 10. Figure 6 and Fig. 9 As shown, the cold storage module 51 can also cool the hot end 211 of the semiconductor module 21. By lowering the temperature of the hot end 211, based on the set temperature difference between the hot end 211 and the cold end 212, the cold end 212 will be cooled synchronously with the temperature drop of the hot end 211 until the vehicle thermal management system reaches the set temperature of the cold and warm box.

[0091] The first example and the second example can be performed independently or in combination. Figure 7 and Figure 8 As shown, the cold storage module 51 can also cool down the cold end 212 and the hot end 211 of the semiconductor module 21 at the same time. In this way, more efficient cooling can be achieved.

[0092] In the embodiment of the present application, the cooling of the semiconductor module 21, the cold storage module 51 and the vehicle air-conditioning system 31 share a common compressor 311, thereby achieving many advantages such as expansion of the cooling temperature range, solution of waste heat and noise problems, cost reduction, and energy consumption reduction.

[0093] For the vehicle thermal management system of the present application, in some embodiments, the vehicle thermal management system may not include strong convection circulation equipment, and may also achieve cooling of the cold and warm boxes.

[0094] In other embodiments, the vehicle thermal management system may also include, but is not limited to, a strong convection circulation device, which is connected to the periphery of the heat exchange end. The strong convection circulation device circulates the air flow around the strong convection circulation device to perform heat exchange with the heat exchange end and / or the cold storage module 51.

[0095] The strong convection circulation device is used to accelerate the air flow and realize forced convection. The strong convection circulation device may include but is not limited to one or more of a fan and a blower. The strong convection circulation device is used to accelerate the air flow and generate cold air.

[0096] Combination Figure 2 , Figure 3 , Figure 5 as well as Figures 6 to 9 As shown, while the cold storage module 51 stores cold, the strong convection circulation device blows cold air to the cold and warm box 10 until the vehicle thermal management system reaches the set temperature of the cold and warm box 10, controls the semiconductor module 21 to stop, and closes the electronic valve exv1.

[0097] In addition, when the vehicle thermal management system reaches the set temperature of the cooling and heating box 10 and the temperature of the cooling and heating box 10 returns to normal, the cold storage module 51 is blown out by the strong convection circulation equipment to cool the heat exchange end of the semiconductor module 21.

[0098] In the embodiment of the present application, the strong convection circulation device can force convection of the cold end 212 of the semiconductor module 21 and can also let the heat out of the hot end 211 of the semiconductor module 21 to accelerate the air convection of the hot end 211.

[0099] For the at least two-stage cooling of the vehicle thermal management system of the embodiment of the present application, the semiconductor module 21 and the auxiliary thermal management device mentioned above can be used for at least two-stage cooling. It is also possible to use multiple semiconductor modules 21 for at least two-stage cooling or at least two-stage compressor cooling, and the terminal uses the semiconductor module 21 to cool down, so as to reduce noise.

[0100] Based on the same inventive concept as the above-mentioned vehicle thermal management system, the embodiment of the present application further provides a vehicle. The above-mentioned vehicle may include, but is not limited to, the above-mentioned vehicle thermal management system. The vehicle may include, but is not limited to, one or more of a heavy truck, a light commercial vehicle, and a passenger car.

[0101] Based on the same inventive concept as the above-mentioned vehicle thermal management system, an embodiment of the present application also provides a vehicle thermal management method based on the above-mentioned vehicle thermal management system.

[0102] like Figure 2 , Figure 3 , Figure 5 as well as Figures 6 to 9 As shown, the vehicle thermal management system also includes a controller (not shown in the figure) and a sensor connected to the controller. Among them, the sensor may include but is not limited to a first sensor 71, a second sensor 72, a third sensor 73 and a fourth sensor 74. The valve group system of the vehicle thermal management system may include but is not limited to the electronic valve exv1 at the compressor end of the vehicle air-conditioning system 31. The sensors monitor the ambient temperature, the temperature inside the cold and warm box 10 and the temperature of the heat exchange end of the cold and warm vehicle equipment 20 respectively. According to the set temperature of the cold and warm box 10, the ambient temperature, the temperature inside the cold and warm box 10 and the temperature of the heat exchange end, it is determined whether the vehicle thermal management system reaches the set temperature of the cold and warm box 10 to control the working mode of the vehicle thermal management system.

[0103] Further, when it is determined that the vehicle thermal management system cannot reach the set temperature of the cooling and heating box 10, the controller controls the electronic valve exv1 at the compressor end to open, and controls the working mode of the vehicle thermal management system according to the set temperature, ambient temperature, temperature inside the cooling and heating box 10 and temperature at the heat exchange end;

[0104] When it is determined that the vehicle thermal management system has reached the set temperature of the heating and cooling box 10, the controller controls the electronic valve exv1 at the compressor end to close, and controls the working mode of the vehicle thermal management system according to the set temperature, ambient temperature, temperature inside the heating and cooling box 10 and temperature at the heat exchange end.

[0105] The controller may be an independent controller, and may exchange information with the vehicle controller for collaboration. The controller may also be a controller shared with other devices. For example, the controller may be a controller of the vehicle air conditioning system 31. In this way, the controller of the vehicle air conditioning system 31 and the vehicle controller exchange information for collaboration.

[0106] In the embodiment of the present application, the controller can intelligently adjust the switch state of each electronic valve according to the real-time data of the sensor, so as to accurately control the operation of the vehicle thermal management system. For example, when the second sensor 72 detects that the temperature inside the cold and warm box 10 is higher than the set temperature, the controller can control the compressor 311 to start, and adjust the flow of the refrigerant through the electronic valve exv1, and then cool the cold and warm box 10 through the vehicle air conditioning system 31. At the same time, the controller can also intelligently adjust the cooling power of the semiconductor module 21 according to the temperature data of the semiconductor module 21 detected by the third sensor 73, so as to achieve more accurate temperature control.

[0107] It should also be noted that if Figure 4As shown, the valve group system may include but is not limited to the electronic valve exv2 at the air conditioning evaporator end and the electronic valve exv3 at the end where the battery cooler 315 is located. In this way, the electronic valve exv2 at the air conditioning evaporator end optimizes the performance of the air conditioning system by accurately controlling the flow of the refrigerant. In this way, the sensor data (such as temperature, pressure, etc.) from the vehicle air conditioning system 31 is received, and the flow of the refrigerant is adjusted as needed to ensure the optimal working state of the air conditioning evaporator 312.

[0108] Next, the electronic valve exv3 at the end of the battery cooler 315 accurately adjusts the flow of the coolant according to the operating temperature of the battery pack and system requirements. The battery will generate a lot of heat when charging or working at high load. The electronic valve can adjust the flow of the coolant to accelerate the dissipation of heat and prevent the battery temperature from being too high, which will affect the efficiency and safety of the battery.

[0109] The electronic valves in this article may be, but are not limited to, electronic expansion valves and solenoid valves.

[0110] Based on this, the refrigeration working modes of this article include the following, such as the first working mode, the second working mode, the third working mode and the fourth working mode. The detailed description is as follows:

[0111] As an optional embodiment of the present application, the working mode of the vehicle thermal management system includes a first working mode; in the first working mode, cold air is introduced through the vehicle air conditioning system 31 to cool the cold and warm box 10. While the above-mentioned controller controls the semiconductor module 21 to start, it controls the damper 42 to open, and the air conditioning evaporator of the vehicle air conditioning system 31 transmits cold air to the cold and warm box 10 through the air guide channel 41 to cool the cold and warm box 10. The semiconductor module 21 exchanges heat with the cold and warm box 10 as the cold and warm box 10 cools down until the vehicle thermal management system reaches the set temperature of the cold and warm box 10, and the damper 42 is controlled to close. Furthermore, the semiconductor module 21 continues to work to cool the cold and warm box 10 to the set temperature of the refrigerator, and the temperature of the cold and warm box 10 is maintained by the semiconductor module 21 and the cold storage module 51, while storing cold for the cold storage module 51.

[0112] The cooling and heating vehicle equipment in this article is described in detail using a refrigerator as an example.

[0113] The first working mode may include, but is not limited to, the following first cooling mode and second cooling mode.

[0114] (1) The first cooling mode:

[0115] like Figure 2As shown, the above-mentioned cold and warm box 10 sets the temperature. If the refrigeration of the independent semiconductor module 21 can meet the temperature setting (also called low load), the semiconductor module 21 is used to reduce the temperature to the set temperature of the cold and warm box 10 and maintain the temperature of the cold and warm box 10. The first sensor 71 monitors the ambient temperature, the second sensor 72 monitors the temperature inside the cold and warm box 10, the third sensor 73 monitors the blowing temperature of the cold end 212 of the semiconductor module 21, and the fourth sensor 74 monitors the temperature of the hot end 211. At the same time, the entire system can read the air outlet temperature T of the vehicle-mounted air conditioning system 31 of the whole vehicle. In this way, the temperature of the cold and warm box 10 is set. If the refrigeration of the independent semiconductor module 21 can meet the temperature setting, the electronic valve exv1 at the compressor end of the vehicle-mounted air conditioning system 31 is closed. When the load is low, the semiconductor module 21 is used to refrigerate to meet the refrigerator temperature requirement, and the compressor 311 of the vehicle-mounted air conditioning system 31 can not be involved. Under the action of the cold storage module, the start-up rate of the air conditioning compressor 311 can be reduced, thereby reducing energy consumption.

[0116] If the refrigeration of the independent semiconductor module 21 does not meet the temperature setting (also called high load), the auxiliary thermal management device 30 is required to assist the cold end 212 of the semiconductor module 21 for cooling and the hot end 211 for heating: if the first sensor 71 monitors that the ambient temperature is too high, while starting the semiconductor module 21, the damper 42 is opened, and the air of the vehicle air-conditioning system 31 is used to cool the semiconductor module 21 and the cold and warm box 10 to the temperature T of the vehicle air-conditioning system 31. The cold air of the vehicle air-conditioning system 31 intervenes to allow the temperature in the cold and warm box 10 to drop to the temperature of the vehicle air-conditioning system 31 faster. Subsequently, the damper 42 is closed, and the semiconductor module 21 continues to work to lower the cold and warm box 10 to the set temperature of the refrigerator and maintain the temperature of the cold and warm box 10, while storing cold for the cold storage module 51. The cold storage module 51 is tightly combined with the cold end 212. During the entire refrigeration process, heat exchange is continuously performed to meet the heat exchange requirements, thereby meeting the use of various working conditions.

[0117] The second sensor 72 controls the start and stop of the semiconductor module 21, the first sensor 71 monitors the ambient temperature, and controls the temperature setting by adjusting the ambient temperature. The third sensor 73 monitors the temperature of the air blown out of the cold end 212, and the fourth sensor 74 monitors the temperature of the hot end 211. The first fan 61 is a cooling fan for the cold end 212, and the second fan 62 is a heat dissipation fan for the hot end 211. When the temperature of the hot end 211 is too high, resulting in the temperature of the cold end 212 being unable to meet the cooling demand, the electronic valve exv1 at the compressor end of the vehicle air conditioning system 31 will also be opened to allow the heat dissipation evaporator 32 to cool the hot end 211 of the semiconductor module 21, thereby meeting the cooling demand of the cold end 212. Due to the presence of the cold storage module 51, when the second sensor 72 monitors that the temperature in the box has risen, the first fan 61 is preferentially turned on to blow out the cold of the cold storage module 51 to maintain the temperature of the cold and warm box 10. When the temperature of the third sensor 73 is higher than the set temperature, the semiconductor module 21 needs to be started for cooling to maintain the temperature of the cold and warm box 10, and the above process is repeated.

[0118] When the ambient temperature is too high, for example, higher than 30 degrees, the cooling effect of the semiconductor module 21 alone may not reach 5 degrees. At this time, it is necessary to control the auxiliary thermal management equipment to assist in cooling and heat dissipation.

[0119] For example, the cold medium of the vehicle air conditioning system 31 is first introduced to reduce the temperature of the cold and warm box 10 by 313-5 degrees. For example, the refrigerator is set to 6 degrees, and then the semiconductor module 21 is added for cooling.

[0120] In the embodiment of the present application, the temperature of the cold and warm box 10 is cooled to the set temperature by superimposing at least two stages of cooling, namely, the cooling of the vehicle air-conditioning system 31 integrated in the whole vehicle and the cooling of the semiconductor module 21 .

[0121] As an optional embodiment of the present application, a temperature difference is set between the first heat exchange end of the semiconductor module 21 and the second heat exchange end of the semiconductor module 21. The operating mode of the vehicle thermal management system includes a second operating mode; in the second operating mode, the cold and warm box 10 is cooled by the heat exchange component. The controller controls the electronic valve to open, controls the heat exchange component to work, and cools the second heat exchange end, so that the temperature of the first heat exchange end is lowered until the vehicle thermal management system reaches the set temperature of the cold and warm box 10.

[0122] As an optional embodiment of the present application, the working mode of the vehicle thermal management system includes a third working mode; in the third working mode, the cold and warm box 10 is cooled by the cold storage module 51. When the temperature of the cold and warm box 10 rises after the vehicle thermal management system reaches the set temperature of the cold and warm box 10, the controller controls the strong convection circulation device to blow out the cold of the cold storage module 51 to maintain the temperature of the cold and warm box 10, until the vehicle thermal management system reaches the set temperature of the cold and warm box 10 and the cold storage module 51 cannot maintain the temperature of the cold and warm box 10, the controller controls the semiconductor module 21 to start cooling, and the electronic valve opens.

[0123] The second working mode and the third working mode may include but are not limited to the second cooling mode and the third cooling mode:

[0124] (2) The second cooling mode:

[0125] Continue as Figure 2 As shown, when the refrigerator is under high load, it exceeds the refrigeration temperature range of the semiconductor module 21, the first sensor 71 monitors that the temperature inside the vehicle is too high, the fourth sensor 74 monitors that the temperature of the hot end 211 is too high, and the air outlet temperature of the cold end 2123 cannot continue to reach below the set temperature, and the second sensor 72 monitors that the temperature inside the heating and cooling box 10 is higher than the air outlet temperature T of the vehicle air-conditioning system 31.

[0126] The first situation with only one cold source: when the battery and the vehicle air-conditioning system 31 are in normal mode, the electronic valve exv1 at the compressor end of the vehicle air-conditioning system 31 is opened, and the heat dissipation evaporator 32 works to dissipate heat for the hot end 211 of the semiconductor module 21. The fourth sensor 74 monitors the temperature of the hot end 211 of the semiconductor module 21. Due to the set temperature difference between the cold end 212 and the hot end 211, after the temperature of the hot end 211 of the semiconductor module 21 decreases, the temperature of the cold end 212 decreases synchronously until 3 monitors that the cold air is lower than the set temperature. The refrigerator exchanges heat with the cold end 212 to reach the preset temperature of the refrigerator.

[0127] Among them, when the semiconductor module 21 is working and cannot meet the set temperature of the cold and warm box 10, this is called high load. When the load is high, the air conditioner is used to cool the hot end of the semiconductor module 21, so as to achieve the low temperature of the cold end of the semiconductor module 21. At the same time, the cold storage solution is added to reduce the start-up rate of the compressor 311 of the vehicle air conditioning system 31, thereby reducing energy consumption. Since the independent compressor of the refrigerator is eliminated, the noise source is removed, and the emission of compressor waste heat to the passenger compartment is also reduced.

[0128] The second situation of two cold sources: from the ambient temperature to the temperature of the vehicle air conditioning system 31, and from the temperature of the vehicle air conditioning system 31 to the preset temperature of the refrigerator.

[0129] When the battery and the vehicle air-conditioning system 31 are in normal mode, the electronic valve exv1 at the compressor end of the vehicle air-conditioning system 31 is opened, and the heat dissipation evaporator 32 works to dissipate heat for the hot end 211 of the semiconductor module 21. The refrigeration module of the semiconductor module 21 is started at the same time, and the damper 42 is opened. The cold air of the vehicle air-conditioning system 31 directly blows low-temperature cold air Tair into the cold and warm box 10, and the temperature in the cold and warm box 10 is quickly pulled to the evaporation temperature Tair of the vehicle air-conditioning system 31. The third sensor 73 detects the temperature of the wind entering the box from the cold end 212. When the measured temperature is lower than the temperature Tair of the vehicle air-conditioning system 31, when the temperature of the third sensor 73 is lower than the temperature Tair of the vehicle air-conditioning system 31, the damper 42 is closed. While blowing low-temperature cold air into the box, the cold storage module 51 exchanges heat with the low-temperature cold air. The cold air cools the cold storage module 51 and absorbs cold energy for storage.

[0130] An at least two-stage refrigeration solution is used independently using the integrated vehicle air-conditioning system 31 compressor 311 and the semiconductor module 21 to cool the hot end 211 of the semiconductor module 21 through the heat dissipation evaporator 32, so that the cold end 212 of the semiconductor module 21 is pulled to a lower temperature. The temperature of the third sensor 73 needs to reach a temperature lower than the set temperature. While storing cold, cold air is blown toward the cold and warm box 10.

[0131] When the temperature of the cooling and heating box 10 is lower than the set temperature, the semiconductor module 21 stops and the electronic valve exv1 at the compressor end is closed. When the temperature of the cooling and heating box 10 rises and exceeds the threshold, the first fan 61 starts to blow out the cold of the cold storage end 212 to maintain the temperature of the cooling and heating box 10. When the third sensor 73 monitors that the temperature exceeds the set temperature and the cold storage end 212 cannot maintain the temperature of the cooling and heating box 10, it automatically starts when the threshold is exceeded, the semiconductor module 21 starts cooling, and the electronic valve exv1 at the compressor end is opened.

[0132] During the operation of the refrigeration module of the semiconductor module 21 , the temperature of the cold storage end 212 is substantially the same as that of the cold end 212 , the semiconductor module 21 stops, and the cold storage end 212 continues to provide a cold source for the refrigerator.

[0133] In this way, when the load is low, the semiconductor module 21 is used to cool the refrigerator to meet the temperature requirements, and the compressor 311 of the vehicle air conditioning system 31 does not need to intervene. Under the action of the cold storage module, the start-up rate of the air conditioning compressor 311 can be reduced, thereby reducing energy consumption. At the same time, under the action of the cold storage module, the start-up rate will be further reduced.

[0134] (3) The third cooling mode:

[0135] like Figure 5As shown, in the first cooling mode and the second cooling mode, there is no cold air intervention from the vehicle air-conditioning system 31, and the cooling speed is slightly longer. Since there is no damper 42 and the air guide channel 41, the cost is reduced and the cooling effect is the same. The temperature of the cold and warm box 10 can be cooled to the set temperature by superimposing at least two stages of cooling, namely, the cooling of the vehicle air-conditioning system 31 integrated in the whole vehicle and the cooling of the semiconductor module 21. At the same time, during the cooling process, the cold storage end 212 stores cold. When the temperature of the cold and warm box 10 rises above the threshold, the first fan 61 is preferentially turned on to blow the cold from the cold storage end 212 to the inside of the cold and warm box 10 to maintain the temperature of the cold and warm box 10. When the cold is balanced and the cold storage module 51 releases the cold completely, the semiconductor module 21 end is turned on, the electronic valve exv1 at the compressor end is opened, and the cooling action is repeated.

[0136] As an optional embodiment of the present application, the vehicle thermal management system includes a heat dissipation pipe arranged outside the cold and warm box 10 and close to the second heat exchange end of the semiconductor module 21, and the working mode of the vehicle thermal management system includes a fourth working mode; in the fourth working mode, the cold and warm box 10 is cooled by a strong convection circulation device;

[0137] When the load of the vehicle thermal management system satisfies the independent cooling of the semiconductor module 21, the controller controls the electronic valve exv1 at the compressor end of the vehicle air-conditioning system 31 to close, controls the damper 42 to close, controls the strong convection circulation equipment to open, and dissipates heat through the heat dissipation pipe and the vehicle interior space to reduce the temperature of the second heat exchange end of the semiconductor module 21.

[0138] The fourth working mode may include but is not limited to the following fourth cooling mode:

[0139] like Figure 3As shown, the heat dissipation evaporator 32 in the first refrigeration mode and the second refrigeration mode is cancelled, and the cold air of the vehicle air-conditioning system 31 is directly used to cool the hot end 211 of the semiconductor module 21. The fourth sensor 74 is used to monitor the temperature of the hot end 211 of the semiconductor module 21. When the refrigerator is under high load, it exceeds the refrigeration temperature range of the semiconductor module 21. The first sensor 71 monitors that the temperature in the car is too high, the fourth sensor 74 monitors that the temperature of the hot end 211 is too high, and the outlet air temperature of the cold end 2123 cannot continuously reach a temperature lower than the set temperature. The second sensor 72 monitors that the temperature in the cold and warm box 10 is higher than the outlet air temperature T of the vehicle air-conditioning system 31. The damper 42 is opened, and the second fan 62 is opened to accelerate the heat dissipation of the hot end 211 of the semiconductor module 21. When the temperature is set high , use the independent semiconductor module 21 for cooling to meet the set temperature, close the damper 42, and turn on the second fan 62 to dissipate heat through the heat pipe and the interior space of the vehicle to reduce the temperature of the hot end 211 of the semiconductor module 21. At the same time, in extreme cases, the cold air of the vehicle air-conditioning system 31 intervenes to meet the refrigeration performance requirements. At the same time, when the temperature of the cold end 212 of the semiconductor module 21 is low, the cold end 212 exchanges heat with the cold storage module 51, and the cold storage end 212 stores cold. When the temperature of the cold and warm box 10 rises above the threshold, the first fan 61 is preferentially turned on to blow the cold amount of the cold storage end 212 to the inside of the cold and warm box 10 to maintain the temperature of the cold and warm box 10. When the cold amount is balanced and the cold amount of the cold storage module 51 is completely released, the semiconductor module 21 end is opened, and the valve damper 42 is opened to repeat the refrigeration action.

[0140] The heating working modes in this article include the following: for example, the working modes of the vehicle thermal management system include the fifth working mode and the sixth working mode.

[0141] like Fig.10 As shown, in the fifth working mode, the heat exchange component is used to heat the cold and warm box 10. The controller controls the electronic valve at the compressor 311 end of the vehicle air conditioning system 31 to close and controls the semiconductor module 21 to start.

[0142] Continue as Fig.10 As shown, the fifth working mode mentioned above in this article can include but is not limited to the following heating mode: through semiconductor heating, the electronic valve exv1 at the air-conditioning compressor end is closed, and the hot end of the semiconductor module 21 is inside the cold and warm box 10, and the cold end of the semiconductor module 21 is outside the cold and warm box 10, so as to directly heat the cold and warm box 10.

[0143] The heating function in this article can be completed by using the semiconductor module 21 for heating, and the electronic valve exv1 is closed.

[0144] As an optional embodiment of the present application, the operating mode of the vehicle thermal management system includes a sixth operating mode; in the sixth operating mode, the condenser and the cold end are arranged opposite to each other or connected through a channel, the condenser exchanges heat with the cold end, and the condenser heats the cold end.

[0145] As an optional embodiment of the present application, the working mode of the vehicle thermal management system includes a seventh working mode; in the seventh working mode, the cold and warm box 10 is heated by the heat exchange component. The controller controls the electronic valve exv1 at the compressor end of the vehicle air-conditioning system 31 to close and the semiconductor module 21 to start, and the heat exchange medium inside the heat exchange component circulates to heat the second heat exchange end set outside the cold and warm box 10. The first heat exchange end of the semiconductor module 21 rises synchronously with the temperature rise of the second heat exchange end until the vehicle thermal management system reaches the set temperature of the cold and warm box 10. In this way, the heat exchange component, such as the heat dissipation evaporator 32, assists in heating the second heat exchange end set outside the cold and warm box 10 while heating the first heat exchange end of the semiconductor module 21.

[0146] The cooling and heating equipment based on the semiconductor module 21 (such as semiconductor refrigerators, thermoelectric coolers, etc.) can achieve the switching between cooling and heating by changing the flow direction of the current. By changing the direction of the current, the transfer of heat can be controlled to achieve the effect of cooling or heating. In practical applications, the reverse switching of the current may be achieved through a power control module (such as an H-bridge circuit). In this way, the change in the direction of the current can simply switch the cooling and heating modes.

[0147] In the embodiment of the present application, the refrigerator has better refrigeration controllability, lower energy consumption, less noise, lower cost, faster cooling speed, and almost eliminates waste heat emissions.

[0148] In the description of this application, it should be understood that the terms "first", "second", etc. are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first", "second", etc. may explicitly or implicitly include at least one of the features.

[0149] It should be noted that when an element is referred to as being "fixed to", "disposed on", "fixedly arranged on" or "installed on" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. Furthermore, when an element is considered to be "fixedly connected to" another element, the two may be fixed in a detachable connection manner or in a non-detachable connection manner, such as socketing, snap-fitting, integral molding, welding, etc., which can be achieved in traditional technologies and will not be repeated here.

[0150] The above are only preferred embodiments of this specification and are not intended to limit this specification. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of this specification should be included in the scope of protection of this specification.

[0151] It should also be noted that the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, commodity or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, commodity or device. In the absence of more restrictions, the phrase "includes a ..." defines an element, does not exclude the presence of other identical elements in the process, method, commodity or device including the element.

Claims

1. A vehicle thermal management system, characterized in that: include: Cold and warm box; A cooling and heating vehicle-mounted device, the cooling and heating vehicle-mounted device comprises a semiconductor module; the semiconductor module comprises a heat exchange end, the heat exchange end comprises a hot end and a cold end, and one of the cold end or the hot end is located in the cooling and heating box; Auxiliary thermal management equipment, the cooling and heating vehicle-mounted equipment can perform auxiliary thermal management for the heat exchange end of the cooling and heating vehicle-mounted equipment; The vehicle air-conditioning system includes a compressor, an air-conditioning evaporator and a condenser. The vehicle-mounted cooling and heating equipment, the vehicle-mounted air-conditioning system and the auxiliary thermal management device share the compressor. The cooling and heating box, based on the cooling and / or heating of the semiconductor module, the auxiliary thermal management device assists the semiconductor module in cooling and / or heating again, so that the temperature of the cooling and heating box is lower or higher.

2. The vehicle thermal management system according to claim 1, characterized in that: The vehicle-mounted thermal management system also includes: an air guide channel and a damper arranged on the air guide channel; the air guide channel is connected to the semiconductor module and the auxiliary thermal management device; the air in the auxiliary thermal management device exchanges heat with the heat exchange end of the semiconductor module through the air guide channel, thereby assisting the heat exchange end of the semiconductor module to adjust the temperature.

3. The vehicle thermal management system according to claim 2, characterized in that: The cold end is located in the cooling and heating box, and the cold end exchanges heat with the inside of the cooling and heating box, and the hot end exchanges heat with the outside of the cooling and heating box. The auxiliary thermal management device includes an air-conditioning evaporator, and the air guide channel connects the air-conditioning evaporator and the cooling and heating box; the semiconductor module is started, the damper is opened, the air-conditioning evaporator transfers cold air to the cooling and heating box through the air guide channel, exchanges heat with the cooling and heating box, and cools down the cooling and heating box. The semiconductor module is cooled as the cooling and heating box is cooled, and the cold end of the semiconductor module is cooled.

4. The vehicle thermal management system according to any one of claims 1 to 3, characterized in that: The cold end is located in the cooling and heating box, and the cold end exchanges heat with the inside of the cooling and heating box, and the hot end exchanges heat with the outside of the cooling and heating box; the auxiliary thermal management device also includes a heat exchange component arranged in parallel with the air-conditioning evaporator, and the heat exchange component is located outside the cooling and heating box and is arranged opposite to the hot end of the semiconductor module or connected through a channel, and the heat exchange component exchanges heat with the hot end, and the heat exchange component cools down the hot end.

5. The vehicle thermal management system according to claim 2, characterized in that: The cold end is located in the cold and warm box, the cold end exchanges heat with the cold and warm box, and the hot end exchanges heat with the outside of the cold and warm box, the auxiliary thermal management device includes an air-conditioning evaporator, and the air guide channel connects the air-conditioning evaporator and the hot end of the semiconductor module; The semiconductor module is started, the damper is opened, and the air conditioner evaporator transfers cold air to the hot end of the semiconductor module through the air guide channel to cool the hot end of the semiconductor module.

6. The vehicle thermal management system according to claim 1, characterized in that: The hot end is located in the cooling and heating box, the hot end exchanges heat with the cooling and heating box, the cold end exchanges heat with the outside of the cooling and heating box, the auxiliary thermal management device includes a condenser of the vehicle air-conditioning system, the condenser and the cold end are arranged opposite to each other or connected through a channel, the condenser exchanges heat with the cold end, and the condenser heats the cold end.

7. The vehicle thermal management system according to any one of claims 1 to 4, characterized in that: The cooling and heating vehicle-mounted device further includes a cold storage module disposed around the heat exchange end; After the vehicle thermal management system reaches the set temperature of the cold and warm box, the cold storage module stores cold; When the temperature of the cooling and heating box returns to normal after the vehicle thermal management system reaches the set temperature of the cooling and heating box, the cold storage module is preferentially used to release cold energy to cool the heat exchange end of the semiconductor module.

8. The vehicle thermal management system according to claim 7, characterized in that: The heat exchange end includes: a first heat exchange end provided inside the cold and warm box and a second heat exchange end provided outside the cold and warm box; The cold storage module is connected to the inside of the semiconductor module, close to the first heat exchange end, and cools the first heat exchange end; and / or, The cold storage module is connected around the second heat exchange end; wherein, a temperature difference is set between the first heat exchange end and the second heat exchange end; the cold storage module cools down the second heat exchange end, and the first heat exchange end of the semiconductor module is cooled synchronously with the temperature of the second heat exchange end.

9. The vehicle thermal management system according to claim 7, characterized in that: The vehicle thermal management system further comprises a strong convection circulation device connected to the periphery of the heat exchange end; The strong convection circulation device circulates the air flow around the strong convection circulation device to perform heat exchange with the heat exchange end and / or the cold storage module.

10. A vehicle, characterized in that: The vehicle comprises the on-vehicle thermal management system according to any one of claims 1 to 9.

11. A vehicle thermal management method, characterized in that: Based on the vehicle thermal management system according to claim 1, the vehicle thermal management system also includes a controller and a sensor connected to the controller; the valve group system of the vehicle thermal management system includes an electronic valve at the compressor end of the vehicle air conditioner; the sensor monitors the ambient temperature, the temperature inside the cooling and heating box, and the temperature of the heat exchange end of the cooling and heating vehicle equipment respectively; According to the set temperature of the cooling and heating box, the ambient temperature, the temperature inside the cooling and heating box and the temperature of the heat exchange end, it is determined whether the vehicle thermal management system reaches the set temperature of the cooling and heating box to control the working mode of the vehicle thermal management system.

12. The vehicle thermal management method according to claim 11, characterized in that: The working mode of the vehicle thermal management system according to any one of claims 2, 3 and 5 includes a first working mode; in the first working mode, the cold air of the vehicle air conditioner is introduced to cool the cold and warm box; The controller controls the semiconductor module to start up and controls the damper to open at the same time. The air-conditioning evaporator of the vehicle air-conditioning transmits cold air to the cooling and heating box through the air guide channel to cool the cooling and heating box. The semiconductor module exchanges heat with the cooling and heating box as the cooling and heating box is cooled down until the vehicle thermal management system reaches the set temperature of the cooling and heating box, and controls the damper to close.

13. The vehicle thermal management method according to claim 11 or 12, characterized in that: Based on the vehicle thermal management system as claimed in claim 4, a temperature difference is set between the first heat exchange end of the semiconductor module and the second heat exchange end of the semiconductor module; The operating mode of the vehicle thermal management system includes a second operating mode; in the second operating mode, the cold and warm box is cooled by a heat exchange component; The controller controls the electronic valve to open, controls the heat exchange component to work, and cools down the second heat exchange end so that the temperature of the first heat exchange end is lowered until the vehicle thermal management system reaches the set temperature of the cooling and heating box.

14. The vehicle thermal management method according to claim 11, characterized in that: Based on the vehicle thermal management system according to claim 7, the vehicle thermal management system includes a heat dissipation pipe arranged outside the cold and warm box and close to the second heat exchange end of the semiconductor module, and the working mode of the vehicle thermal management system includes a fourth working mode; in the fourth working mode, the cold and warm box is cooled by a strong convection circulation device; When the load of the vehicle thermal management system meets the independent cooling of the semiconductor module, the controller controls the electronic valve on the compressor end of the vehicle air conditioner to close, controls the damper to close, controls the strong convection circulation equipment to open, and dissipates heat through the heat dissipation pipe and the vehicle interior space to reduce the temperature of the second heat exchange end of the semiconductor module.

15. The vehicle thermal management method according to claim 11, characterized in that: Based on the working mode of the vehicle thermal management system according to claim 8 or 9, the working mode includes a third working mode; in the third working mode, the cold and warm box is cooled by the cold storage module; When the temperature of the cold / warm box rises after the vehicle thermal management system reaches the set temperature of the cold / warm box, the controller controls the strong convection circulation equipment to blow out the cold of the cold storage module to maintain the temperature of the cold / warm box. After the vehicle thermal management system reaches the set temperature of the cold / warm box and the cold storage module can no longer maintain the temperature of the cold / warm box, the controller controls the semiconductor module to start cooling and the electronic valve to open.

16. The vehicle thermal management method according to claim 11, characterized in that: The working mode of the vehicle thermal management system includes a fifth working mode; in the fifth working mode, the cold and warm box is heated by the heat exchange component; the controller controls the electronic valve at the compressor end of the vehicle air conditioner to close and controls the semiconductor module to start; or, Based on claim 6, the working mode of the vehicle thermal management system includes a sixth working mode; in the sixth working mode, the condenser and the cold end are arranged opposite to each other or connected through a channel, the condenser and the cold end exchange heat, and the condenser heats the cold end.

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