Multi-partition thermal vacuum environment test simulation system

By designing a multi-zone thermal vacuum environment test simulation system, using a multi-layer base frame and liquid cooling temperature control board, combined with an independent temperature control unit and radiant heat cage cabin, the problem that the temperature of each temperature zone cannot be independently controlled in the thermal vacuum environment test of a single-machine satellite-borne traveling wave tube amplifier of the spacecraft component is solved, and the temperature control in each region is realized, avoiding inter-regional interference and meeting the needs of batch testing.

CN119975855AActive Publication Date: 2025-05-13XIAN INSTITUE OF SPACE RADIO TECH

Patent Information

Application Number
CN202510297310.2
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-03-13
Publication Date
2025-05-13
Estimated Expiration
2045-03-13

AI Technical Summary

Technical Problem

In the prior art, in the thermal vacuum environment test of spacecraft components, the temperature of each temperature zone cannot be independently controlled, and the regions interfere with each other during the control process, which cannot meet the needs of batch testing.

Method used

A multi-zone thermal vacuum environment test simulation system is designed. By setting up a multi-layer bottom frame and liquid cooling temperature control panel in the vacuum tank, combining independent temperature control units and radiant heat cage cabins, independent temperature control in each area is achieved to avoid interference between regions.

Benefits of technology

It realizes independent control of temperature in each temperature zone, avoids interference between regions, meets the needs of batch testing, and improves the thermal vacuum test capabilities of spacecraft components.

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Abstract

The invention discloses a multi-partition thermal vacuum environment test simulation system, which comprises a vacuum tank body, and is characterized in that a bottom plate mounting rack, a first bottom plate frame and a second bottom plate frame are arranged in the vacuum tank body; a first low-power liquid-cooled temperature control plate, a first high-power liquid-cooled temperature control plate and a first radiant heat cage small cabin are mounted on the first bottom plate frame; a second low-power liquid-cooled temperature control plate, a second high-power liquid-cooled temperature control plate and a second radiant heat cage small cabin are mounted on the second bottom plate frame; expansion plate type auxiliary heat sinks are arranged on the first bottom plate frame and the second bottom plate frame; the temperature controller in the multi-zone thermal vacuum environment test simulation system provided by the invention has the advantages that according to the temperature control requirement of each zone, two sets of refrigeration compressors arranged in the temperature controller enable each temperature control zone to have independent temperature control capability; the technical problems that the temperature of each temperature zone in a thermal vacuum environment test multi-partition structure of a spacecraft part and assembly single-machine satellite-borne traveling wave tube amplifier in the prior art cannot be independently controlled, and the zones interfere with each other in the control process are solved.
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Description

Technical Field

[0001] The invention belongs to the field of aerospace technology and relates to thermal vacuum tests of spacecraft parts and components and single-unit onboard traveling wave tube amplifiers, and in particular to a multi-zone thermal vacuum environment test simulation system. Background Art

[0002] With the continuous development and upgrading of satellite products, the degree of mass production is getting higher and higher. Thermal vacuum test is a key verification test item of satellite-borne traveling wave tube amplifiers in space simulation environment tests. The test cycle is long, the heat load is large, and the number of test equipment is limited. The number of single-machine tests of traditional thermal vacuum test equipment can no longer meet the test production needs. Based on the above situation and the defects of existing conventional thermal vacuum test equipment, a multi-zone thermal vacuum environment simulation test system is needed to simulate the thermal vacuum test conditions of various component-level spacecraft. Through full verification by ground equipment, the independent research and development capabilities and technical level of aerospace single machines are continuously improved. Summary of the invention

[0003] In view of the shortcomings of the prior art, the purpose of the present invention is to provide a multi-zone thermal vacuum environment test simulation system to solve the technical problems in the prior art that the temperatures of each temperature zone in the multi-zone structure of the thermal vacuum environment test of a single-unit onboard traveling wave tube amplifier of a spacecraft part or component cannot be independently controlled and the zones interfere with each other during the control process.

[0004] In order to solve the above technical problems, the present invention adopts the following technical solutions to achieve the above problems:

[0005] A multi-zone thermal vacuum environment test simulation system comprises a vacuum tank body, a bottom plate mounting frame is arranged in the vacuum tank body, a first bottom plate frame and a second bottom plate frame are fixedly mounted on the bottom plate mounting frame, and the first bottom plate frame is located below the second bottom plate frame.

[0006] The first bottom plate frame is sequentially installed with a first low-power liquid-cooled temperature control board and a first high-power liquid-cooled temperature control board in the shape of a rectangular plate. One side of the long side of the first high-power liquid-cooled temperature control board is connected to the first radiation heat cage cabin, and the first radiation heat cage cabin is located between the first bottom plate frame and the second bottom plate frame.

[0007] The second bottom plate frame is sequentially mounted with a second low-power liquid-cooled temperature control board and a second high-power liquid-cooled temperature control board in rectangular shape, and one side of the long side of the second high-power liquid-cooled temperature control board is connected to the second radiation heat cage cabin.

[0008] An expansion plate type auxiliary heat sink is arranged on one side frame of the first base plate frame and the second base plate frame. The expansion plate type auxiliary heat sink includes a plate segment expansion plate type auxiliary heat sink and an arc segment expansion plate type auxiliary heat sink. The plate segment expansion plate type auxiliary heat sink does not contact the first low-power liquid-cooled temperature control plate, the first high-power liquid-cooled temperature control plate, the second low-power liquid-cooled temperature control plate and the second high-power liquid-cooled temperature control plate. The arc segment expansion plate type auxiliary heat sink is partially located above the second radiation heat cage cabin.

[0009] The first low-power liquid-cooled temperature control board, the first high-power liquid-cooled temperature control board, the second low-power liquid-cooled temperature control board, the second high-power liquid-cooled temperature control board, the second radiation heat cage cabin, the first radiation heat cage cabin and the expansion plate type auxiliary heat sink are respectively independently divided into seven areas.

[0010] The present invention also has the following technical features:

[0011] Two independent temperature control units are arranged outside the vacuum tank, one temperature control unit is composed of a one-to-three temperature control unit, and the other temperature control unit is composed of a one-to-two temperature control unit.

[0012] The one-to-two temperature control unit includes a first refrigeration compressor, which independently controls the temperature of a second low-power liquid-cooled temperature control board and a second high-power liquid-cooled temperature control board. The temperature control method is a heat transfer oil mechanical refrigeration method.

[0013] The one-to-three temperature control unit includes a second refrigeration compressor, which independently controls the temperature of a first low-power liquid-cooled temperature control plate, a first high-power liquid-cooled temperature control plate and an expansion plate auxiliary heat sink. The temperature control method is a thermal oil mechanical refrigeration method.

[0014] The first radiation heat cage cabin and the second radiation heat cage cabin are both equipped with herringbone heat sinks, and the first radiation heat cage cabin and the second radiation heat cage cabin are both cooled by liquid nitrogen.

[0015] The temperature of the first low-power liquid-cooled temperature control board and the second low-power liquid-cooled temperature control board is -70°C to +120°C.

[0016] The temperature of the first high-power liquid-cooled temperature control board and the second high-power liquid-cooled temperature control board is -70°C to +120°C.

[0017] The temperature of the expansion plate auxiliary heat sink is -70℃~+120℃.

[0018] The temperature of the first radiation heat cage cabin and the second radiation heat cage cabin is -180℃~+120℃.

[0019] The no-load temperature change rate of the first low-power liquid-cooled temperature control board, the second low-power liquid-cooled temperature control board, the first high-power liquid-cooled temperature control board and the second high-power liquid-cooled temperature control board is not less than 3°C / min.

[0020] The temperature control accuracy of the first low-power liquid-cooled temperature control board, the second low-power liquid-cooled temperature control board, the first high-power liquid-cooled temperature control board and the second high-power liquid-cooled temperature control board is better than ±0.4°C.

[0021] The first low-power liquid-cooled temperature control board, the second low-power liquid-cooled temperature control board, the first high-power liquid-cooled temperature control board and the second high-power liquid-cooled temperature control board all adopt reasonable flow channel design and are equipped with heat insulation baffles.

[0022] The vacuum tank body is also provided with a vacuum device, an auxiliary device and a measurement and control device.

[0023] The vacuum tank body is a rectangular shell structure.

[0024] Compared with the prior art, the present invention has the following technical effects:

[0025] (I) The temperature controller in the multi-zone thermal vacuum environment test simulation system proposed by the present invention is based on the temperature control requirements of each zone. The two sets of refrigeration compressors arranged in the temperature controller enable each temperature control zone to have the ability of independent temperature control. The design of the temperature control base plate ensures that the temperature control zones do not interfere with each other, thereby solving the technical problems in the prior art that the temperature of each temperature zone in the multi-zone structure of the thermal vacuum environment test of a single-unit onboard traveling wave tube amplifier of a spacecraft part or component cannot be independently controlled and the zones interfere with each other during the control process.

[0026] (II) The height and space design of the workstations between the various areas proposed by the present invention are in line with ergonomics, and the test operation space is sufficient, simple and reliable. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 Schematic diagram of the temperature control area distribution of the multi-zone thermal vacuum environment test simulation system.

[0028] Figure 2 This is a schematic diagram of the partitions of a multi-partition thermal vacuum environment test simulation system.

[0029] Figure 3 Schematic diagram of the installation structure of the temperature control base plate.

[0030] Figure 4 This is a schematic diagram of the principle of temperature control of the second refrigeration compressor.

[0031] The meanings of the numbers in the figure are: 1-vacuum tank body, 2-first bottom plate frame, 3-second bottom plate frame, 4-first low-power liquid-cooled temperature control board, 5-first high-power liquid-cooled temperature control board, 6-first radiation heat cage cabin, 7-second low-power liquid-cooled temperature control board, 8-second high-power liquid-cooled temperature control board, 9-second radiation heat cage cabin, 10-expansion plate type auxiliary heat sink, 11-temperature control unit, 12-vacuum device, 13-auxiliary device, 14-measurement and control device, 15-power supply, 16-satellite traveling wave tube amplifier, 17-bottom plate mounting frame, 18-expansion oil tank, 19-thermal oil pump, 20-oil cooler, 21-refrigeration valve group, 22-heater.

[0032] 1001-plate segment expansion type auxiliary heat sink, 1002-arc segment expansion type auxiliary heat sink.

[0033] 1101 - a first refrigeration compressor, 1102 - a second refrigeration compressor.

[0034] The specific contents of the present invention are further described in detail below in conjunction with the accompanying drawings and embodiments. DETAILED DESCRIPTION

[0035] It should be noted that, unless otherwise specified, all devices and components in the present invention are devices and components known in the prior art.

[0036] The PID (Proportional-Integral-Derivative) in this embodiment is a proportional-integral-derivative controller.

[0037] In the present embodiment, the low power in the first low-power liquid-cooled temperature control board specifically refers to heat consumption ≤ 300W; the high power in the first high-power liquid-cooled temperature control board specifically refers to 300W ≤ heat consumption ≤ 600W.

[0038] In accordance with the above technical scheme, specific embodiments of the present invention are given below. It should be noted that the present invention is not limited to the following specific embodiments, and all equivalent changes made on the basis of the technical scheme of this application fall within the protection scope of the present invention.

[0039] Example:

[0040] This embodiment proposes a multi-zone thermal vacuum environment test simulation system, including a vacuum tank 1, such as Figure 1 As shown, a bottom plate mounting frame 17 is provided in the vacuum tank body 1 , and a first bottom plate frame 2 and a second bottom plate frame 3 are fixedly mounted on the bottom plate mounting frame 17 , and the first bottom plate frame 2 is located below the second bottom plate frame 3 .

[0041] like Figures 1 to 3As shown, a first low-power liquid-cooled temperature control board 4 and a first high-power liquid-cooled temperature control board 5 in the shape of a rectangular plate are installed in sequence on the first bottom plate frame 2. One side of the long side of the first high-power liquid-cooled temperature control board 5 is connected to the first radiation heat cage cabin 6. The first radiation heat cage cabin 6 is located between the first bottom plate frame 2 and the second bottom plate frame 3.

[0042] like Figures 1 to 3 As shown, a second low-power liquid-cooled temperature control board 7 and a second high-power liquid-cooled temperature control board 8 in the shape of a rectangular plate are sequentially installed on the second base plate frame 3, and one side of the long side of the second high-power liquid-cooled temperature control board 8 is connected to the second radiation heat cage cabin 9.

[0043] Specifically in this embodiment, the first low-power liquid-cooled temperature control board 4, the first high-power liquid-cooled temperature control board 5, the second low-power liquid-cooled temperature control board 7 and the second high-power liquid-cooled temperature control board 8 are divided into two layers, the first low-power liquid-cooled temperature control board 4, the first high-power liquid-cooled temperature control board 5, the second low-power liquid-cooled temperature control board 7 and the second high-power liquid-cooled temperature control board 8 have independent liquid inlet and outlet pipelines. The purpose is to enable the first low-power liquid-cooled temperature control board 4, the first high-power liquid-cooled temperature control board 5, the second low-power liquid-cooled temperature control board 7 and the second high-power liquid-cooled temperature control board 8 to have the ability to carry out test control at different single-machine test temperatures in the same spatial environment.

[0044] Specifically in this embodiment, the first low-power liquid-cooled temperature control plate 4, the first high-power liquid-cooled temperature control plate 5, the second low-power liquid-cooled temperature control plate 7 and the second high-power liquid-cooled temperature control plate 8 are processed by vacuum brazing, and the aluminum alloy upper plate, the aluminum alloy lower plate, the heat transfer oil channel and the inlet and outlet pipes are welded into one, and the plate surface meets the flatness requirement of: 0.1mm / 100mm*100mm.

[0045] like Figure 1 As shown, an expansion plate type auxiliary heat sink 10 is arranged on one side frame of the first base plate frame 2 and the second base plate frame 3, and the expansion plate type auxiliary heat sink 10 includes a plate segment expansion plate type auxiliary heat sink 1001 and an arc segment expansion plate type auxiliary heat sink 1002. The plate segment expansion plate type auxiliary heat sink 1001 is not in contact with the first low-power liquid-cooled temperature control plate 4, the first high-power liquid-cooled temperature control plate 5, the second low-power liquid-cooled temperature control plate 7 and the second high-power liquid-cooled temperature control plate 8, and the arc segment expansion plate type auxiliary heat sink 1002 is partially located above the second radiation heat cage cabin 9.

[0046] Specifically in this embodiment, the first low-power liquid-cooled temperature control plate 4, the first high-power liquid-cooled temperature control plate 5, the second low-power liquid-cooled temperature control plate 7, the second high-power liquid-cooled temperature control plate 8, the second radiation heat cage cabin 9, the first radiation heat cage cabin 6 and the expansion plate type auxiliary heat sink 10 are respectively independently divided into seven areas.

[0047] Specifically in this embodiment, the first low-power liquid-cooled temperature control board 4, the second low-power liquid-cooled temperature control board 7, the first high-power liquid-cooled temperature control board 5 and the second high-power liquid-cooled temperature control board 8 all adopt reasonable flow channel design and are equipped with heat insulation baffles, with the aim of solving the thermal interference problem in different areas.

[0048] Furthermore, in this embodiment, two independent temperature control units 11 are arranged outside the vacuum tank body 1, one set of temperature control units 11 is composed of a set of one-to-three temperature control units, and the other set of temperature control units 11 is composed of a set of one-to-two temperature control units. The temperature control unit 11 uses an intelligent control system, which is composed of components such as a PID operation processor, a communication interface, and a communication indicator light. The PID operation processor is embedded with an artificial intelligence PID expert-level algorithm. The algorithm has the function of automatically identifying the heat transfer properties of the controlled product, and can adjust the system control parameters according to its properties, thereby achieving intelligent temperature control. The test operator only needs to perform product self-tuning operations on the system before the test, and the system will automatically calculate the corresponding control parameters according to the heat transfer properties of the tested product. After the self-tuning is completed, the test operator starts the equipment and can conduct the test without making any adjustments to the system parameters.

[0049] Furthermore, in this embodiment, the one-to-two temperature control unit includes a first refrigeration compressor 1101, and the first refrigeration compressor 1101 independently controls the temperature of the second low-power liquid-cooled temperature control board 7 and the second high-power liquid-cooled temperature control board 8, and the temperature control method is a thermal oil mechanical refrigeration method.

[0050] Furthermore, in this embodiment, the first refrigeration compressor 1101, the second low-power liquid-cooled temperature control board 7 and the second high-power liquid-cooled temperature control board 8 adopt a modular design to facilitate subsequent installation and maintenance.

[0051] Furthermore, in this embodiment, the one-to-three temperature control unit includes a second refrigeration compressor 1102, and the second refrigeration compressor 1102 performs independent temperature control on the first low-power liquid-cooled temperature control plate 4, the first high-power liquid-cooled temperature control plate 5 and the expansion plate type auxiliary heat sink 10, and the temperature control method is a thermal oil mechanical refrigeration method.

[0052] Furthermore, in this embodiment, the second refrigeration compressor 1102, the first low-power liquid-cooled temperature control board 4, the first high-power liquid-cooled temperature control board 5 and the expansion plate type auxiliary heat sink 10 adopt a modular design to facilitate subsequent installation and maintenance.

[0053] Specifically in this embodiment, the refrigeration principle of the first refrigeration compressor 1101 is the same as the refrigeration principle of the second refrigeration compressor 1102 .

[0054] Specifically, in this embodiment, the refrigeration principle of the second refrigeration compressor 1102 is as follows: Figure 4As shown, the second refrigeration compressor 1102 is divided into three paths, which respectively control the temperature of the first low-power liquid-cooled temperature control board 4, the first high-power liquid-cooled temperature control board 5 and the expansion plate type auxiliary heat sink 10. The heat transfer oil is pumped from the expansion oil tank 18 to the oil cooler 20 by the heat transfer oil pump 19, and the heat transfer oil is cooled by the refrigerator in the refrigeration valve group 21. The low-temperature oil is heated and temperature-controlled by the heater 22, and then enters the expansion plate type auxiliary heat sink 10 or the first low-power liquid-cooled temperature control board 4 or the first high-power liquid-cooled temperature control board 5 through the quick-release interface, and the expansion plate type auxiliary heat sink 10, the first low-power liquid-cooled temperature control board 4 or the first high-power liquid-cooled temperature control board 5 are independently temperature-controlled. The heat transfer oil that absorbs heat is pumped away by the heat transfer oil pump 19, completing a closed cycle, and finally realizing the temperature control of the test sample, and realizing the ability of the satellite-borne traveling wave tube amplifier to carry out thermal vacuum testing in parallel.

[0055] Specifically in this embodiment, herringbone heat sinks are installed in the first radiation heat cage cabin 6 and the second radiation heat cage cabin 9. The first radiation heat cage cabin 6 and the second radiation heat cage cabin 9 are both cooled by liquid nitrogen, and the high temperature is controlled by heating the electric heating wire through a DC power supply.

[0056] Specifically in this embodiment, the temperature of the first low-power liquid-cooled temperature control plate 4 and the second low-power liquid-cooled temperature control plate 7 is -70℃~+120℃; the temperature of the first high-power liquid-cooled temperature control plate 5 and the second high-power liquid-cooled temperature control plate 8 is -70℃~+120℃; the temperature of the expansion plate auxiliary heat sink 10 is -70℃~+120℃; the temperature of the first radiation heat cage cabin 6 and the second radiation heat cage cabin 9 is -180℃~+120℃, so that different temperature control of 30℃ in the same direction can be achieved between each temperature control area.

[0057] Specifically in this embodiment, the no-load temperature change rate of the first low-power liquid-cooled temperature control board 4, the second low-power liquid-cooled temperature control board 7, the first high-power liquid-cooled temperature control board 5 and the second high-power liquid-cooled temperature control board 8 is not less than 3°C / min.

[0058] Specifically in this embodiment, the temperature control accuracy of the first low-power liquid-cooled temperature control board 4, the second low-power liquid-cooled temperature control board 7, the first high-power liquid-cooled temperature control board 5 and the second high-power liquid-cooled temperature control board 8 is better than ±0.4°C.

[0059] Specifically, in this embodiment, a vacuum device 12, an auxiliary device 13 and a measurement and control device 14 are further provided outside the vacuum tank body 1. The vacuum device 12 is used to maintain the vacuum degree in the multi-zone thermal vacuum environment test simulation system; the auxiliary device 13 is used to supply air and water to the multi-zone thermal vacuum environment test simulation system; and the measurement and control device 14 is used for measurement and control.

[0060] Specifically in this embodiment, the vacuum tank body 1 is a rectangular shell structure, which effectively increases the space usage area of ​​the equipment.

[0061] Specifically, in this embodiment, a multi-zone thermal vacuum environment simulation test system is designed, which is independently divided into seven areas by the first low-power liquid-cooled temperature control board 4, the first high-power liquid-cooled temperature control board 5, the second low-power liquid-cooled temperature control board 7, the second high-power liquid-cooled temperature control board 8, the second radiation heat cage cabin 9, the first radiation heat cage cabin 6 and the expansion plate type auxiliary heat sink 10. During the test simulation process, power supplies are set on the first low-power liquid-cooled temperature control board 4 and the second low-power liquid-cooled temperature control board 7, and satellite-borne traveling wave tube amplifiers are placed on the first high-power liquid-cooled temperature control board 5 and the second high-power liquid-cooled temperature control board 8. The power supply on the first low-power liquid-cooled temperature control board 4 controls whether to test the satellite-borne traveling wave tube amplifier on the second high-power liquid-cooled temperature control board 8, but the first low-power liquid-cooled temperature control board 4 and the second high-power liquid-cooled temperature control board 5 have different temperature requirements. Therefore, the second low-power liquid-cooled temperature control board 7 and the second high-power liquid-cooled temperature control board 8 are independently temperature-controlled by the first refrigeration compressor 1101, and the first radiation heat cage cabin 6 is cooled by liquid nitrogen. The temperature is lowered by the method of cooling, and the high temperature is controlled by heating the electric heating wire through a DC power supply to ensure the verification of the thermal control performance and functional reliability of the satellite-borne traveling wave tube amplifier; the second low-power liquid-cooled temperature control board 7 and the second high-power liquid-cooled temperature control board 8 have the same working principle, and the second refrigeration compressor 1102 independently controls the temperature of the first low-power liquid-cooled temperature control board 4, the first high-power liquid-cooled temperature control board 5 and the expansion plate auxiliary heat sink 10. The second radiation heat cage cabin 9 adopts liquid nitrogen refrigeration, and the high temperature is controlled by heating the electric heating wire through a DC power supply, so that different areas have independent test temperatures and thus have the ability to carry out test control in the same space environment. The technical problems of the multi-zone structure and independent temperature control of each temperature zone in the thermal vacuum test of the spacecraft parts and components of the single-machine satellite-borne traveling wave tube amplifier are solved, ensuring that the various areas do not interfere with each other during the control process, and providing a reliable verification solution for ground simulation of various thermal vacuum tests.

Claims

1. A multi-zone thermal vacuum environment test simulation system, comprising a vacuum tank (1), wherein a bottom plate mounting frame (17) is arranged in the vacuum tank (1), characterized in that: The first base frame (2) and the second base frame (3) are fixedly mounted on the base mounting frame (17), and the first base frame (2) is located below the second base frame (3); The first bottom plate frame (2) is sequentially mounted with a first low-power liquid-cooled temperature control board (4) and a first high-power liquid-cooled temperature control board (5) in the shape of a rectangular plate, one side of the long side of the first high-power liquid-cooled temperature control board (5) is connected to a first radiation heat cage cabin (6), and the first radiation heat cage cabin (6) is located between the first bottom plate frame (2) and the second bottom plate frame (3); The second bottom plate frame (3) is sequentially mounted with a second low-power liquid-cooled temperature control board (7) and a second high-power liquid-cooled temperature control board (8) in the shape of a rectangular plate, and one side of the long side of the second high-power liquid-cooled temperature control board (8) is connected to the second radiation heat cage cabin (9); An expansion plate type auxiliary heat sink (10) is provided on one side frame of the first bottom plate frame (2) and the second bottom plate frame (3), and the expansion plate type auxiliary heat sink (10) includes a plate segment expansion plate type auxiliary heat sink (1001) and an arc segment expansion plate type auxiliary heat sink (1002), the plate segment expansion plate type auxiliary heat sink (1001) and the first low-power liquid cooling temperature control plate (4), the first high-power liquid cooling temperature control plate (5), the second low-power liquid cooling temperature control plate (7) and the second high-power liquid cooling temperature control plate (8), and the arc segment expansion plate type auxiliary heat sink (1002) is partially located above the second radiation heat cage cabin (9); The first low-power liquid-cooled temperature control board (4), the first high-power liquid-cooled temperature control board (5), the second low-power liquid-cooled temperature control board (7), the second high-power liquid-cooled temperature control board (8), the second radiation heat cage cabin (9), the first radiation heat cage cabin (6) and the expansion plate type auxiliary heat sink (10) are respectively independently divided into seven areas.

2. The multi-zone thermal vacuum environment test simulation system according to claim 1, characterized in that: Two independent temperature control units (11) are arranged outside the vacuum tank body (1), one temperature control unit (11) is composed of a set of one-to-three temperature control units, and the other temperature control unit (11) is composed of a set of one-to-two temperature control units.

3. The multi-zone thermal vacuum environment test simulation system according to claim 2, characterized in that: The one-to-two temperature control unit comprises a first refrigeration compressor (1101), and the first refrigeration compressor (1101) independently controls the temperature of a second low-power liquid-cooled temperature control plate (7) and a second high-power liquid-cooled temperature control plate (8), and the temperature control method is a heat transfer oil mechanical refrigeration method.

4. The multi-zone thermal vacuum environment test simulation system according to claim 2, characterized in that: The one-to-three temperature control unit comprises a second refrigeration compressor (1102), and the second refrigeration compressor (1102) independently controls the temperature of a first low-power liquid-cooled temperature control plate (4), a first high-power liquid-cooled temperature control plate (5) and an expansion plate-type auxiliary heat sink (10), and the temperature control method is a heat transfer oil mechanical refrigeration method.

5. The multi-zone thermal vacuum environment test simulation system according to claim 1, characterized in that: The first radiation heat cage cabin (6) and the second radiation heat cage cabin (9) are both equipped with herringbone heat sinks, and the first radiation heat cage cabin (6) and the second radiation heat cage cabin (9) are both cooled by liquid nitrogen.

6. The multi-zone thermal vacuum environment test simulation system according to claim 1, characterized in that: The temperature of the first low-power liquid-cooled temperature control plate (4) and the second low-power liquid-cooled temperature control plate (7) is -70°C to +120°C; The temperature of the first high-power liquid-cooled temperature control board (5) and the second high-power liquid-cooled temperature control board (8) is -70°C to +120°C; The temperature of the expansion plate type auxiliary heat sink (10) is -70°C to +120°C; The temperature of the first radiation heat cage cabin (6) and the second radiation heat cage cabin (9) is -180°C to +120°C.

7. The multi-zone thermal vacuum environment test simulation system according to claim 1, characterized in that: The no-load temperature change rate of the first low-power liquid-cooled temperature control board (4), the second low-power liquid-cooled temperature control board (7), the first high-power liquid-cooled temperature control board (5) and the second high-power liquid-cooled temperature control board (8) is not less than 3°C / min; The temperature control accuracy of the first low-power liquid-cooled temperature control board (4), the second low-power liquid-cooled temperature control board (7), the first high-power liquid-cooled temperature control board (5) and the second high-power liquid-cooled temperature control board (8) is better than ±0.4°C.

8. The multi-zone thermal vacuum environment test simulation system according to claim 1, characterized in that: The first low-power liquid-cooled temperature control board (4), the second low-power liquid-cooled temperature control board (7), the first high-power liquid-cooled temperature control board (5) and the second high-power liquid-cooled temperature control board (8) all adopt reasonable flow channel design and are additionally equipped with heat insulation baffles.

9. The multi-zone thermal vacuum environment test simulation system according to claim 1, characterized in that: The vacuum tank body (1) is also provided with a vacuum device (12), an auxiliary device (13) and a measurement and control device (14) outside.

10. The multi-zone thermal vacuum environment test simulation system according to claim 1, characterized in that: The vacuum tank body (1) is a rectangular shell structure.

Citation Information

Patent Citations

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