Chamfering processing method for ultra-thin glass

Abstract

The invention provides a chamfering processing method for ultra-thin glass. The chamfering processing method comprises the following steps: measuring multiple pieces of upper surface position information and multiple pieces of lower surface position information of to-be-processed ultra-thin glass on a cutting path along a cutting drawing; calculating a plurality of center positions of the ultra-thin glass to be processed along the cutting path of the cutting drawing in the Z direction; cutting the ultra-thin glass to be processed according to the cutting path of the cutting drawing by using Airy beam laser cutting equipment to form a cutting line, and changing the focal position of a cutting head of the Airy beam laser cutting equipment according to a plurality of central positions of the ultra-thin glass to be processed in the Z direction in the cutting process; and splitting the cut ultra-thin glass to be processed to obtain the ultra-thin glass with chamfers on the edge. The point spectrum confocal sensor is adopted to accurately measure the ultrathin glass, and the Airy beam laser cutting technology is combined, so that high-precision and high-quality cutting of the glass material is realized.

Description

Technical Field

[0001] The invention relates to the technical field of optical glass manufacturing, and in particular to a chamfering method for ultra-thin glass. Background Art

[0002] At present, in the production process of optical glass, such as cameras, mobile phone glass front and rear panels, flat glass front and rear panels, ultra-thin glass and other finished glass products, it is often necessary to chamfer sharp right-angle edges to improve safety, improve assembly performance, optimize optical performance, and enhance structural stability.

[0003] The existing technology usually uses CNC machine tools and ablation lasers to achieve glass chamfering. Among them, CNC machine tools process glass chamfers with large edge chipping and require multiple processes to optimize the edge chipping, resulting in a lot of consumables and poor economic benefits; ablation lasers process glass chamfers with large edge chipping, a lot of dust, low efficiency, and high roughness. In addition, these two processing methods are not applicable to the processing of ultra-thin glass chamfers.

[0004] Based on this, a new solution is needed. Summary of the invention

[0005] The object of the present invention is to provide a chamfering method for ultra-thin glass.

[0006] An embodiment of the present invention provides a chamfering method for ultra-thin glass, comprising the following steps:

[0007] Step S1, measuring multiple upper surface position information and multiple lower surface position information of the ultra-thin glass to be processed placed on the cutting platform along the cutting path of the cutting drawing by using a point spectrum confocal sensor;

[0008] Step S2, calculating multiple center positions of the ultra-thin glass to be processed in the Z direction along the cutting path of the cutting drawing according to the multiple upper surface position information and the multiple lower surface position information, wherein the Z direction is a direction perpendicular to the plane where the ultra-thin glass to be processed is located;

[0009] Step S3, using an Airy beam laser cutting device to cut the ultra-thin glass to be processed according to the cutting path of the cutting drawing to form a cutting line that passes through the upper surface and the lower surface of the ultra-thin glass to be processed, wherein during the cutting process, the focal position of the cutting head of the Airy beam laser cutting device is changed according to the multiple center positions of the ultra-thin glass to be processed in the Z direction;

[0010] Step S4, splitting the cut ultra-thin glass to be processed to obtain ultra-thin glass with chamfered edges.

[0011] In the chamfering method for ultra-thin glass provided by the present invention, in the step S3, the cutting parameters of the Airy beam laser cutting equipment are: duty cycle 55% to 75%, Burst 3 to 5, frequency 100 to 200 KHZ, speed 80 to 120 mm / s, and point spacing 0.001 to 0.003 mm.

[0012] In the chamfering method for ultra-thin glass provided by the present invention, in the step S4, a CO2 laser cracking device is used to crack the ultra-thin glass to be processed after cutting, wherein the equipment parameters of the CO2 laser cracking device are: speed 130-150 mm / s, frequency 50-70 KHZ, and duty cycle 50-70%.

[0013] In the chamfering method for ultra-thin glass provided by the present invention, in the step S4, the ultra-thin glass to be processed after cutting is split using a liquid polishing liquid through a liquid polishing device, wherein the liquid polishing liquid is an HF solution with a concentration of 1 to 2%, and the liquid polishing time is 1 to 3 minutes.

[0014] In the chamfering method for ultra-thin glass provided by the present invention, before step S1, it also includes:

[0015] Step S0: performing silk screen baking treatment on the front and back surfaces of the ultra-thin glass to be processed, respectively, so as to form protective layers on the front and back surfaces of the ultra-thin glass to be processed, respectively.

[0016] In the chamfering method for ultra-thin glass provided by the present invention, the protective layer is an acid-resistant protective oil film layer.

[0017] In the chamfering method for ultra-thin glass provided by the present invention, step S4 comprises:

[0018] Step S41, using a CO2 laser cracking device to crack the cut ultra-thin glass to be processed, wherein the equipment parameters of the CO2 laser cracking device are: speed 130-150 mm / s, frequency 50-70 KHZ, duty cycle 50-70%;

[0019] Step S42, using a liquid polishing liquid to split the cut ultra-thin glass to be processed through a liquid polishing device, wherein the liquid polishing liquid is an HF solution with a concentration of 1 to 2%, and the liquid polishing time is 1 to 3 minutes.

[0020] In the chamfering method for ultra-thin glass provided by the present invention, after the step S4, the method further includes stripping the protective layer.

[0021] According to a second aspect of the present invention, there is further provided an ultra-thin glass with chamfers, wherein the ultra-thin glass is processed by the chamfer processing method for ultra-thin glass as described above.

[0022] The implementation of the embodiments of the present invention has the following beneficial effects: in the chamfering method for ultra-thin glass provided by the present invention, by using a point spectrum confocal sensor to accurately measure the ultra-thin glass, combined with Airy beam laser cutting technology, high-precision and high-quality cutting of glass materials is achieved; by accurately calculating multiple center positions in the Z direction, it is ensured that the focus of the laser cutting equipment is always in the central area of ​​the glass, thereby improving the cutting quality and reducing surface roughness. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0024] Figure 1 The figure is a schematic flow chart of the chamfering method for ultra-thin glass provided by the present invention;

[0025] Figure 2 Schematic diagram of drawings showing laser cutting and laser slicing;

[0026] Figure 3 Shown is a schematic diagram of the cross-section of the product after laser cutting;

[0027] Figure 4 The figure shows the cross-section of the product after CO2 laser splitting;

[0028] Figure 5 The figure shows a schematic diagram of the cross section of the product after liquid-blasting splitting;

[0029] Figure 6 Shown is a schematic diagram of the cross-section of the product after laser cutting;

[0030] Figure 7 The figure shows the cross-section of the product after CO2 laser splitting;

[0031] Figure 8 Shown is a schematic diagram of the cross-section of the product after liquid polishing and splitting. DETAILED DESCRIPTION

[0032] In order to facilitate understanding of the present application, the present application will be described more fully below with reference to the relevant drawings. Typical embodiments of the present application are provided in the drawings. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present application more thorough and comprehensive.

[0033] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used herein in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application.

[0034] In order to better understand the above-mentioned technical scheme, the above-mentioned technical scheme will be described in detail below in conjunction with the accompanying drawings and specific implementation methods. It should be understood that the embodiments of the present invention and the specific features in the embodiments are detailed descriptions of the technical scheme of the present application, rather than limitations on the technical scheme of the present application. In the absence of conflict, the embodiments of the present invention and the technical features in the embodiments can be combined with each other.

[0035] Figure 1 FIG. 2 is a flow chart of the chamfering method for ultra-thin glass provided by the present invention. Figure 1 As shown, the chamfering method for ultra-thin glass provided by the embodiment of the present invention comprises the following steps:

[0036] Step S1, measuring multiple upper surface position information and multiple lower surface position information of the ultra-thin glass to be processed placed on the cutting platform along the cutting path of the cutting drawing by using a point spectrum confocal sensor;

[0037] Specifically, in this embodiment, in order to provide key data for the subsequent calculation of the laser cutting path and the precise positioning of the laser focus, it is necessary to draw a CAD drawing according to the design drawing and specification requirements of the product contour to be formed, and then calculate the cutting path (such as the cutting path) in the cutting drawing. Figure 2As shown), the upper surface position information and the lower surface position information of the ultra-thin glass to be processed are measured, wherein the upper surface position information refers to the height of the upper surface of the ultra-thin glass to be processed relative to the plane where the cutting platform is located, and the lower surface position information refers to the height of the lower surface of the ultra-thin glass to be processed relative to the plane where the cutting platform is located. For ultra-thin glass, the surface height difference is small and is easily affected by deformation and surface unevenness. Therefore, in this embodiment, the accurate position information of the upper and lower surfaces is obtained by a point spectrum confocal sensor, which detects the position of the surface by emitting a laser beam and receiving a reflected light signal. Its working principle is to accurately measure the height information of different points by adjusting the focusing position of the sensor and capturing the intensity change of the reflected light. The point spectrum confocal sensor can not only provide micron-level height resolution, but also will not cause any physical interference to the glass surface, avoiding surface damage or deformation caused by contact measurement.

[0038] Step S2, calculating multiple center positions of the ultra-thin glass to be processed in the Z direction along the cutting path of the cutting drawing according to the multiple upper surface position information and the multiple lower surface position information, wherein the Z direction is a direction perpendicular to the plane where the ultra-thin glass to be processed is located;

[0039] Specifically, in this embodiment, multiple center positions of the ultra-thin glass to be processed in the Z direction along the cutting path of the cutting drawing are calculated based on the measured height of the upper surface of the ultra-thin glass to be processed relative to the plane where the cutting platform is located and the height of the lower surface of the ultra-thin glass to be processed relative to the plane where the cutting platform is located. For example, if the height of the upper surface of the ultra-thin glass to be processed relative to the plane where the cutting platform is located measured at a certain point on the cutting path is Z1, and the height of the lower surface of the ultra-thin glass to be processed relative to the plane where the cutting platform is located is Z2, then the center position of the ultra-thin glass to be processed at this point is (Z1+Z2) / 2.

[0040] By calculating the center positions of multiple points of the ultra-thin glass to be processed along the preset cutting path along the direction perpendicular to the plane where the ultra-thin glass to be processed is located, the Z-direction center position of each point of the ultra-thin glass to be processed can be transmitted to the Z-axis that controls the laser focus in subsequent laser cutting, and the focus position can be changed by changing the position of the Z-axis.

[0041] Step S3, using an Airy beam laser cutting device to cut the ultra-thin glass to be processed according to the cutting path of the cutting drawing to form a cutting line that passes through the upper surface and the lower surface of the ultra-thin glass to be processed, wherein during the cutting process, the focal position of the cutting head of the Airy beam laser cutting device is changed according to the multiple center positions of the ultra-thin glass to be processed in the Z direction;

[0042] Specifically, in this embodiment, the laser uses SLM (spatial light modulator) beam shaping to form an Airy spot to perform laser cutting on the ultra-thin glass to be processed. On the glass surface, the Airy laser beam is irradiated along a preset cutting path. Thus, a cutting line is formed on the glass surface according to the cutting path by the Airy laser. The Airy beam shaped by SLM (spatial light modulation) is a high-order Bessel beam. The roughness of the glass body processed by the Bessel beam can reach 100-200um, which is much smaller than the roughness of 500-1000um processed by laser ablation.

[0043] Specifically, in this embodiment, the focus of the laser cutting device is dynamically adjusted by accurately calculating the center position in the Z direction to ensure that the laser can accurately act on the central area of ​​the glass during the cutting process. The precise focus position not only helps to avoid excessive scattering or over-focusing of the light beam, thereby effectively improving the cutting accuracy and surface quality, but also ensures the symmetry of the upper and lower chamfers formed during the laser cutting process of the ultra-thin glass to be processed.

[0044] The core of glass cutting lies in the focal position of the laser. Excessive scattering or over-focusing of the focus will lead to uneven cutting, irregular cutting edges, and may even cause cracks or fragmentation on the glass surface. By accurately calculating and adjusting the center position in the Z direction, the laser focus can always be accurately focused on the center area of ​​the ultra-thin glass to ensure that the laser can act on the glass surface at the correct depth. If the focal position is too close to the glass surface, the laser beam will be too concentrated, resulting in local high energy density, which may cause the glass to be overheated, melted, or have irregular cutting edges. If the focal position deviates from the glass surface, the laser beam may diffuse, thereby reducing the cutting accuracy and efficiency, or even failing to complete effective cutting. By accurately calculating the distance between the upper and lower surfaces of the glass and ensuring that the focus is stable, these two situations are avoided, thereby improving the cutting quality. At the same time, if the laser focus is at different positions on the upper and lower surfaces, the processing depth of the upper and lower surfaces of the glass may be inconsistent when cutting, forming different chamfer angles, resulting in asymmetry. The present application can ensure that the laser acts on the upper and lower surfaces of the glass simultaneously during the cutting process by accurately calculating the center position in the Z direction and dynamically adjusting the focus, so as to ensure that the focal depth of each cutting point is consistent, so that the upper and lower chamfers form symmetrical inclined surfaces. Furthermore, the precise focus position not only affects the symmetry of the chamfer, but also effectively controls the quality of the cut edge. In glass cutting, the smoothness of the edge directly affects subsequent processing and use, such as polishing, coating or assembly. By precisely controlling the focus depth, the cut edge can be made smoother, the generation of defects and cracks can be reduced, and the yield of ultra-thin glass can be improved. Finally, the surface roughness of the glass is another important indicator for measuring cutting accuracy. Precise control of the laser focus can avoid surface unevenness caused by inaccurate beam focusing or scattering, thereby reducing the surface roughness after cutting. For ultra-thin glass, surface quality is particularly important because surface defects may cause the glass to break easily or produce stress concentration during subsequent use. Through precise focus control, unnecessary path deviation or repeated cutting during the cutting process can be avoided. Laser cutting equipment can stably cut on a precisely calculated path, thereby improving production efficiency and reducing unnecessary material waste.

[0045] Furthermore, in one embodiment of the present application, the processing parameters of the Airy beam laser cutting equipment are related to the surface quality (chipping, burring and other poor appearance) and the roughness of the Airy beam laser cutting, and the cutting parameters are confirmed by the process gradient.

[0046] Furthermore, in this embodiment, the duty cycle determines the ratio of the switching cycle of the signal during the laser cutting process; during the cutting process, the higher the duty cycle, the greater the output power of the laser, which is helpful for efficient cutting of thicker materials; however, if the duty cycle is too large, the laser power is too high, which may cause excessive heating of the glass surface, resulting in cracks or edge collapse. Therefore, in this embodiment, the duty cycle ranges from 55% to 75%; this range of duty cycles balances power and temperature control, and can ensure cutting accuracy while avoiding internal cracks or surface defects caused by excessive heating; by optimizing the duty cycle, problems such as edge collapse and flashing generated during glass cutting can be effectively reduced.

[0047] Furthermore, in this embodiment, Burst is used to control the number of micropulses contained in each laser pulse; an appropriate Burst can ensure the continuity and stability of the laser while controlling the amount of heating; a Burst that is too small will result in insufficient heat accumulation and internal cracks; a Burst that is too large will result in opaque cutting or poor edge quality. Therefore, in this embodiment, the Burst range is 3 to 5; this range setting ensures appropriate heat accumulation, helps improve cutting quality and avoids internal cracks.

[0048] Furthermore, in this embodiment, the frequency directly affects the number of laser pulses emitted per second, thereby affecting the energy of a single pulse. If the frequency is too high, the laser energy is concentrated, which may result in poor cutting or excessive heating; if the frequency is too low, the pulse energy is too small, and the cutting efficiency will be reduced. Therefore, in this embodiment, the frequency range is 100 to 200 KHz. Within this range, the frequency is sufficient to ensure sufficient single pulse energy to achieve effective cutting, while not excessively concentrating heat, thereby resulting in poor cutting or damage to the glass surface.

[0049] Furthermore, in this embodiment, the cutting speed directly affects the cutting efficiency. If the speed is too fast, the laser beam may not have enough time to act on the surface of the material, resulting in incomplete cutting; if the speed is too slow, it may cause excessive heat accumulation, affecting the cutting effect and surface quality. Therefore, in this embodiment, the speed range is 80 to 120 mm / s. This speed range can balance the cutting efficiency and processing quality, ensuring that the material is cut within a reasonable time, while avoiding the problem of heat accumulation caused by too slow speed.

[0050] Furthermore, in this embodiment, the dot pitch determines the interval between each laser pulse during the laser cutting process, thereby affecting the overlap of the cutting spot and the smoothness of the cutting edge. If the dot pitch is too large, it may lead to uneven cutting surface; if it is too small, it may lead to excessive overlap of laser points, increase surface roughness, and affect the liquid polishing effect. Therefore, in this embodiment, the dot pitch ranges from 0.001 to 0.003 mm. A smaller dot pitch can make the cutting more precise, reduce roughness, and improve the efficiency of liquid polishing, which is suitable for ultra-thin glass materials that require high surface quality and fine cutting.

[0051] In this embodiment, by accurately adjusting the cutting parameters, it is possible to optimize the cutting effect, reduce surface defects (such as edge collapse and flashing), and ensure good roughness while ensuring efficient cutting.

[0052] Step S4, splitting the cut ultra-thin glass to be processed to obtain ultra-thin glass with chamfered edges.

[0053] Specifically, in one embodiment of the present invention, the ultra-thin glass to be processed after cutting is split using a CO2 laser splitting device and / or a liquid polishing device. The processing parameters of the CO2 laser splitting device and the parameters of the liquid polishing device are related to the surface quality of the product after splitting (edge ​​collapse, burrs, waste residue and other poor appearance), and the splitting parameters are confirmed by the process gradient.

[0054] Furthermore, in this embodiment, a higher splitting speed may result in the laser beam not being able to fully act on the glass, resulting in incomplete splitting; while a lower splitting speed may result in excessive heat accumulation, making the glass easy to break or having a rough surface. Therefore, in this embodiment, the splitting speed is preferably within the range of 130 to 150 mm / s, so as to efficiently complete the splitting while controlling heat accumulation and reducing surface defects (such as edge collapse, flashing, etc.).

[0055] Furthermore, in the present embodiment, the frequency directly affects the emission interval of the laser pulses, and thus affects the degree of overlap of the light spots. During the splitting process, an appropriate frequency helps to control the light spot overlap rate, which in turn affects the splitting effect and surface quality. If the frequency is too high and the light spots overlap too much, it may lead to excessive heat accumulation, causing glass shattering or surface damage; if the frequency is too low, the light spots overlap insufficiently, and the laser energy cannot be effectively transferred to the splitting area, resulting in incomplete or failed splitting. Therefore, in the present embodiment, the frequency is set in the range of 50 to 70 kHz to ensure a reasonable light spot overlap rate. Through this frequency range, the laser beam can effectively split in a shorter time while avoiding excessive heating and excessive fragments.

[0056] Furthermore, in this embodiment, the duty cycle controls the output power of the laser pulse. When the duty cycle is too low, the laser power is insufficient, which may cause the glass to fail to crack; when the duty cycle is too high, the laser power is too high, which may cause the glass to overheat, resulting in fragments, shattering or surface damage. Therefore, in this embodiment, the duty cycle is set in the range of 50 to 70%, which can ensure sufficient laser power for cracking while avoiding excessive heating. A reasonable duty cycle helps to control the thermal stress of the glass during the cracking process and reduce surface defects (such as edge collapse and flashing).

[0057] In this embodiment, by reasonably setting the processing parameters of the CO2 laser cleavage equipment (speed 130-150 mm / s, frequency 50-70 kHz, duty cycle 50-70%), the cleavage speed, energy transfer and surface quality can be effectively balanced. Reasonable speed and frequency settings ensure the appropriateness of the spot overlap rate, while the duty cycle adjustment helps control the laser power to avoid incomplete cleavage or surface damage due to insufficient or excessive power.

[0058] Furthermore, in the present embodiment, the HF solution mainly plays the role of dissolving tiny defects on the glass surface and removing waste materials in liquid polishing. HF solutions of different concentrations have different effects on the glass surface: when the concentration is too low (less than 1%), the corrosion ability of the HF solution is weak, and the waste materials and tiny defects on the glass surface cannot be effectively removed, resulting in a small amount of "threading", and the waste materials may not be completely removed; when the concentration is too high (higher than 2%), the corrosion ability of the HF solution is enhanced, which may lead to an excessive amount of threading, excessive waste materials, and easy to cause excessive corrosion of the glass surface, resulting in a small glass thickness, and may even affect the quality and overall strength of the cracks. Therefore, in the present embodiment, the concentration of the HF solution is maintained within the range of 1-2%.

[0059] Furthermore, in the present embodiment, the liquid polishing time directly affects the contact time between the glass surface and the HF solution, thereby affecting the waste removal effect and the amount of silk. If the liquid polishing time is insufficient, the HF solution will act for a short time, and the waste or small defects on the glass surface cannot be fully removed, resulting in a small amount of silk, and the waste may not fall off completely, affecting the quality of the splinters. If the liquid polishing time is too long, it will cause excessive corrosion, increase the amount of waste falling off, and may cause uneven corrosion or thickness changes on the glass surface, affecting the final splinter accuracy and product quality. Therefore, in the present embodiment, the liquid polishing time is controlled between 1 and 3 minutes, and the liquid polishing time is adjusted according to the specific characteristics of the glass and the required surface quality.

[0060] This embodiment can achieve relatively fine control by reasonably combining the liquid polishing concentration and time, ensuring that the waste material falls off while avoiding excessive corrosion of the glass. By setting the liquid polishing concentration and time within an appropriate range to control the amount of silk, it is ensured that the waste material can be effectively shed while avoiding excessive corrosion or thickness change of the glass surface.

[0061] Furthermore, in one embodiment of the present invention, in order to ensure that the upper and lower surfaces of the product are not thinned during the subsequent liquid polishing process, and only the body of the product has a silk screen, before step S1, it also includes silk screen baking treatment on the front and back of the ultra-thin glass to be processed, so as to form protective layers on the front and back of the ultra-thin glass to be processed. By forming protective layers on the front and back of the ultra-thin glass, it is possible to effectively prevent the HF solution from directly contacting the upper and lower surfaces of the glass during the liquid polishing process. In this way, only the body of the glass is corroded during the liquid polishing process, avoiding thinning and damage to the upper and lower surfaces.

[0062] Furthermore, in one embodiment of the present invention, the protective layer is an acid-resistant oil film layer, which can resist the corrosive effect of the HF solution during the liquid polishing process, protect the glass surface from excessive corrosion, and only form the required amount of corrosion at the corners, avoiding changes in the overall thickness and maintaining the strength and structural stability of the glass.

[0063] Furthermore, in one embodiment of the present invention, after step S4, the protective layer is further subjected to a deplating treatment. By deplating after the liquid polishing step, the protective layer is treated to avoid the residual protective layer affecting the quality of the glass or subsequent processing. Common deplating treatment methods include chemical solution immersion, mechanical removal or other appropriate deplating techniques. The specific deplating method needs to be selected according to the material of the protective layer used and the characteristics of the ultra-thin glass.

[0064] In this embodiment, by coating the protective layer on the glass surface, excessive corrosion and glass thickness changes during the liquid polishing process can be effectively avoided, ensuring that only the lower silk is formed at the body. This method effectively improves the quality and stability of the glass and can reduce the generation of waste. During the liquid polishing process, the protective layer baked by silk screen printing effectively prevents the HF solution from directly contacting the front and back of the glass, thereby ensuring that the glass surface is not corroded, and the quality of the cracks finally produced is more uniform and stable.

[0065] The chamfering method for ultra-thin glass provided by the present invention has the following advantages:

[0066] 1. Accurately calculate the center position in the Z direction and dynamically adjust the laser focus to ensure that the laser beam always acts on the best position of the glass, thereby optimizing the cutting process, ensuring the cutting quality, surface flatness, and symmetry of the upper and lower chamfers; it not only improves the processing accuracy, but also improves the cutting effect of ultra-thin glass, reduces defects in cutting, and ultimately makes the product quality more stable and reliable.

[0067] 2. Utilizing the non-diffraction characteristics of the Airy beam, high-precision cutting is achieved on ultra-thin glass, avoiding the cutting errors caused by the unstable focus position or diffraction effect of traditional laser technology; after Airy beam laser cutting, the roughness of the glass surface can be reduced to 100-200 microns, which is especially important for glass devices that require high-quality surface treatment (such as display screens, optical components, etc.).

[0068] Embodiment 1

[0069] 1. Place the product on the cutting platform and import the cutting drawing (such as Figure 2 ), use the point spectrum confocal sensor to measure the upper and lower surface positions of the product, and finally calculate the center position of the product in the Z direction through the algorithm, and change the focus position of the cutting head in real time by changing the z-axis position.

[0070] 2. Laser cut the glass and set the Airy beam laser cutting parameters: duty cycle 55%, Burst 3, frequency 1200KHZ, speed 120mm / s, point spacing 0.001mm; schematic diagram of the cross-section of the product after Airy beam laser cutting (such as Figure 3 ).

[0071] 3. Place the product on the splitting platform, and the CO2 laser splitting equipment imports the splitting drawing (such as Figure 2 ), set the CO2 laser cracking equipment parameters: speed 135mm / s, frequency 60KHZ, duty cycle 60%; CO2 laser cracking product cross-section diagram (such as Figure 4 ).

[0072] Embodiment 2

[0073] 1. Place the product on the cutting platform and import the cutting drawing (such as Figure 2 ), use the point spectrum confocal sensor to measure the upper and lower surface positions of the product, and finally calculate the center position of the product in the Z direction through the algorithm, and change the focus position of the cutting head in real time by changing the z-axis position.

[0074] 2. Laser cut the glass and set the Airy beam laser cutting parameters: duty cycle 65%, Burst 4, frequency 150KHZ, speed 100mm / s, point spacing 0.001mm; schematic diagram of the cross-section of the product after Airy beam laser cutting (such as Figure 3 ).

[0075] 3. Place the product on the liquid throwing rack and set the liquid throwing equipment parameters: HF concentration 2%, liquid throwing time 2min, and the cross-sectional diagram of the product after liquid throwing (such as Figure 5 ).

[0076] Embodiment 3

[0077] 1. Silk-screen the front of the product and bake it after silk-screen printing. Silk-screen the back of the product and bake it after silk-screen printing.

[0078] 2. Place the double-sided screen-printed product on the cutting platform, and import the cutting drawing (such as Figure 2 ), use the point spectrum confocal sensor to measure the upper and lower surface positions of the product, and finally calculate the center position of the product in the Z direction through the algorithm, and change the focus position of the cutting head in real time by changing the z-axis position.

[0079] 3. Laser cut the glass and set the Airy beam laser cutting parameters: duty cycle 55%, Burst 5, frequency 150KHZ, speed 110mm / s, point spacing 0.001mm; schematic diagram of the cross-section of the product after Airy beam laser cutting (such as Figure 6 ).

[0080] 4. Place the product on the splitting platform, and the CO2 laser splitting equipment will import the splitting drawing (such as Figure 2 ), set the CO2 laser cracking equipment parameters: speed 130mm / s, frequency 60KHZ, duty cycle 50%; CO2 laser cracking product cross-section diagram (such as Figure 7 ).

[0081] 5. Place the product on the liquid throwing rack and set the liquid throwing equipment parameters: HF concentration 1%, liquid throwing time 1min, and the cross-sectional diagram of the product after liquid throwing (such as Figure 8 ).

[0082] 6. Remove the acid-resistant protective oil from both sides of the product and clean it after removal. Figure 5 ).

[0083] In the description provided herein, a large number of specific details are described. However, it is understood that embodiments of the present invention can be practiced without these specific details. In some instances, well-known methods, structures and techniques are not shown in detail so as not to obscure the understanding of this description.

[0084] Similarly, it should be understood that in order to streamline the present disclosure and aid in understanding one or more of the various inventive aspects, in the above description of exemplary embodiments of the present invention, various features of the present invention are sometimes grouped together into a single embodiment, figure, or description thereof. However, this disclosed method should not be interpreted as reflecting the intention that the claimed invention requires more features than those explicitly recited in each claim. More specifically, as reflected in the claims below, inventive aspects lie in less than all the features of the individual embodiments disclosed above. Therefore, the claims that follow the specific embodiment are hereby expressly incorporated into the specific embodiment, with each claim itself serving as a separate embodiment of the present invention.

[0085] In addition, those skilled in the art will appreciate that, although some embodiments herein include certain features included in other embodiments but not other features, the combination of features of different embodiments is meant to be within the scope of the present invention and form different embodiments. For example, in the claims below, any one of the claimed embodiments may be used in any combination.

[0086] It should be noted that the above embodiments illustrate the present invention rather than limit it, and that those skilled in the art may devise alternative embodiments without departing from the scope of the appended claims. In the claims, any reference symbol between brackets shall not be construed as a limitation on the claims. The word "comprising" does not exclude the presence of elements or steps not listed in the claims. The word "one" or "an" preceding an element does not exclude the presence of a plurality of such elements. The present invention may be implemented by means of hardware comprising a number of different elements and by means of a suitably programmed computer. In a unit claim enumerating a number of devices, several of these devices may be embodied by the same hardware item. The use of the words first, second, and third, etc., does not indicate any order. These words may be interpreted as names.

Claims

1. A chamfering method for ultra-thin glass, characterized in that: The following steps are involved: Step S1, measuring multiple upper surface position information and multiple lower surface position information of the ultra-thin glass to be processed placed on the cutting platform along the cutting path of the cutting drawing by using a point spectrum confocal sensor; Step S2, calculating multiple center positions of the ultra-thin glass to be processed in the Z direction along the cutting path of the cutting drawing according to the multiple upper surface position information and the multiple lower surface position information, wherein the Z direction is a direction perpendicular to the plane where the ultra-thin glass to be processed is located; Step S3, using an Airy beam laser cutting device to cut the ultra-thin glass to be processed according to the cutting path of the cutting drawing to form a cutting line that passes through the upper surface and the lower surface of the ultra-thin glass to be processed, wherein during the cutting process, the focal position of the cutting head of the Airy beam laser cutting device is changed according to the multiple center positions of the ultra-thin glass to be processed in the Z direction; Step S4, splitting the cut ultra-thin glass to be processed to obtain ultra-thin glass with chamfered edges.

2. The chamfering method for ultra-thin glass according to claim 1, characterized in that: In the step S3, the cutting parameters of the Airy beam laser cutting equipment are: duty cycle 55% to 75%, Burst 3 to 5, frequency 100 to 200 KHZ, speed 80 to 120 mm / s, and point spacing 0.001 to 0.003 mm.

3. The chamfering method for ultra-thin glass according to claim 1, characterized in that: In the step S4, the cut ultra-thin glass to be processed is split using a CO2 laser splitting device, wherein the device parameters of the CO2 laser splitting device are: speed 130-150 mm / s, frequency 50-70 KHZ, and duty cycle 50-70%.

4. The chamfering method for ultra-thin glass according to claim 1, characterized in that: In the step S4, the cut ultra-thin glass to be processed is split by liquid polishing equipment using a liquid polishing liquid, wherein the liquid polishing liquid is an HF solution with a concentration of 1 to 2%, and the liquid polishing time is 1 to 3 minutes.

5. The chamfering method for ultra-thin glass according to claim 1, characterized in that: Before step S1, the method further includes: Step S0: performing silk screen baking treatment on the front and back surfaces of the ultra-thin glass to be processed, respectively, so as to form protective layers on the front and back surfaces of the ultra-thin glass to be processed, respectively.

6. The chamfering method for ultra-thin glass according to claim 5, characterized in that: The protective layer is an acid-resistant protective oil film layer.

7. The chamfering method for ultra-thin glass according to claim 5, characterized in that: The step S4 comprises: Step S41, using a CO2 laser cracking device to crack the cut ultra-thin glass to be processed, wherein the equipment parameters of the CO2 laser cracking device are: speed 130-150 mm / s, frequency 50-70 KHZ, duty cycle 50-70%; Step S42, using a liquid polishing liquid through a liquid polishing device to crack the cut ultra-thin glass to be processed, wherein the liquid polishing liquid is an HF solution with a concentration of 1-2%, and the liquid polishing time is 1-3 minutes.

8. The chamfering method for ultra-thin glass according to claim 7, characterized in that: After step S4, the protective layer is stripped.

9. An ultra-thin glass with chamfered corners, characterized in that: The ultra-thin glass is processed by using the chamfering method for ultra-thin glass according to any one of claims 1 to 8.

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