Resin composition for sealing, cured product, and electronic device

Abstract

Provided is a resin composition for sealing, which has improved balance between adhesion to copper and flowability. This sealing resin composition contains an epoxy resin, a curing agent, an inorganic filler, and erucyl nitrile, and the content of the erucyl nitrile in the sealing resin composition is 90 ppm to 5000 ppm (inclusive).

Description

Technical Field The present invention relates to a sealing resin composition, a cured product and an electronic device. Background Art As a material for sealing a semiconductor package, etc., a thermosetting resin composition (sealing resin composition) is known. For example, Patent Document 1 discloses a sealing resin composition containing a specific epoxy resin, a curing agent, an inorganic filler, and the like. Prior art literature Patent Literature Patent Document 1: Japanese Patent Application Publication No. 2010-084091 Summary of the invention Technical problem to be solved by the invention According to the research conducted by the inventors of the present invention, it has been found that the sealing resin composition described in Patent Document 1 has room for improvement from the viewpoint of the balance between adhesion to copper and fluidity. The present invention has been made in view of the above circumstances, and provides a sealing resin composition having an improved balance between adhesion to copper and fluidity. Technical solutions for solving technical problems The inventors of the present invention have repeatedly conducted intensive studies to solve the above technical problems. As a result, they have found that the balance between adhesion to copper and fluidity can be improved by including an epoxy resin, a curing agent, an inorganic filler and erucic nitrile (13-docosenenitrile) and adjusting the content of erucic nitrile to a specific range, thereby completing the present invention.

[0001] A sealing resin composition comprises an epoxy resin, a curing agent, an inorganic filler and erucic acid nitrile, The content of the erucic acid nitrile in the sealing resin composition measured by the following method is 90 ppm or more and 5000 ppm or less, (method) The sealing resin composition is diluted with chloroform to prepare a 5-20wt% solution; 1 μL of the soluble matter obtained by filtering the solution is introduced into an injection port filled with helium at 250°C to gasify it, and all the components are passed into a column; an oven provided with a column is kept at 40°C for 5 minutes, and then the temperature is increased to 300°C at a rate of 10°C / min, and kept at 300°C for 9 minutes to separate the components; the gas of each component obtained by separation is introduced into a mass spectrometer, ionized by an electron impact method in its ionization section, and measured as a mass spectrum; the identification of each detected peak is performed based on the respective retention time and mass spectrum; the intensity ratio of each identified peak is calculated to determine the intensity of erucic acid nitrile, C 15 H 31 CONH2, C 17 H 33CONH2 and C 17 H 35 CONH2 content.

[0002] The sealing resin composition as described in the above-mentioned [1], wherein The C in the sealing resin composition measured by the above method 15 H 31 The content of CONH2 is 1 ppm or more and 200 ppm or less.

[0003] The sealing resin composition as described in [1] or [2] above, wherein The C in the sealing resin composition measured by the above method 17 H 33 The content of CONH2 is 1 ppm or more and 500 ppm or less.

[0004] The sealing resin composition as described in any one of [1] to [3] above, wherein The C in the sealing resin composition measured by the above method 17 H 35 The content of CONH2 is 1 ppm or more and 200 ppm or less.

[0005] The sealing resin composition as described in any one of [1] to [4] above, wherein The epoxy resin includes one or more selected from the group consisting of novolac epoxy resin, bisphenol epoxy resin, biphenyl epoxy resin, trisphenol methane epoxy resin and aralkyl epoxy resin.

[0006] The sealing resin composition as described in any one of [1] to [5] above, wherein The content of the epoxy resin is 1% by mass or more and 15% by mass or less relative to the total solid content of the sealing resin composition.

[0007] The sealing resin composition as described in any one of the above [1] to [6], wherein The curing agent includes a phenolic resin curing agent.

[0008] The sealing resin composition as described in the above-mentioned [7], wherein The phenolic resin curing agent comprises one or more selected from novolac phenolic resin, multifunctional phenolic resin, aralkyl phenolic resin and bisphenol compound.

[0009] The sealing resin composition as described in any one of [1] to [8] above, wherein The content of the curing agent is 0.5 mass % or more and 25 mass % or less relative to the total solid content of the sealing resin composition.

[0010] The sealing resin composition as described in any one of the above [1] to [9], wherein The content of the inorganic filler is 50% by mass or more and 97% by mass or less based on the total solid content of the sealing resin composition.

[0011] A cured product of the sealing resin composition according to any one of [1] to

[10] above.

[0012] An electronic device in which an electronic component is sealed with a cured product of the sealing resin composition according to any one of [1] to

[10] above. Effects of the Invention According to the present invention, it is possible to provide a sealing resin composition having an improved balance between adhesion to copper and fluidity. DETAILED DESCRIPTION Hereinafter, embodiments of the present invention will be described in detail. In this specification, unless otherwise specified, the expression "X to Y" in the description of a numerical range means greater than or equal to X and less than or equal to Y. For example, "1 to 5 mass %" means "1 mass % or more and 5 mass % or less". <Sealing resin composition> First, the sealing resin composition according to the present embodiment will be described. The sealing resin composition of the present embodiment includes an epoxy resin, a curing agent, an inorganic filler, and erucic acid nitrile. The content of the erucic acid nitrile in the sealing resin composition measured by the following method is 90 ppm to 5000 ppm. (method) The sealing resin composition is diluted with chloroform to prepare a 5-20wt% solution. 1μL of the soluble matter obtained by filtering the solution is introduced into a 250°C injection port filled with helium to vaporize it, and all the components are passed into the column. After the oven equipped with the column is kept at 40°C for 5 minutes, the temperature is increased to 300°C at a rate of 10°C / min, and kept at 300°C for 9 minutes to separate the components. The gases of the separated components are introduced into a mass spectrometer, ionized by an electron impact method in its ionization section, and measured as a mass spectrum. The identification of each detected peak is based on its respective retention time and mass spectrum. According to the intensity ratio of each identified peak, the concentrations of erucic acid nitrile, C 15 H 31 CONH2, C 17 H 33 CONH2 and C 17 H 35 CONH2 content. The sealing resin composition of the present embodiment comprises an epoxy resin, a curing agent, an inorganic filler and erucic acid nitrile, and the content of the erucic acid nitrile in the sealing resin composition measured by the above (method) is greater than 90 ppm and less than 5000 ppm, thereby improving the balance between adhesion to copper and fluidity. The reason is not clear, but it is considered that by making the sealing resin composition of the present embodiment contain a specific amount of erucic acid nitrile, erucic acid nitrile modifies the surface state of the cured product of the sealing resin composition, improves the affinity with copper, and reduces the affinity for the mold used for sealing. As a result, it is believed that the sealing resin composition of the present embodiment improves the balance between adhesion and fluidity to copper. From the viewpoint of improving the adhesion to copper and the reliability of electronic components, the lower limit of the content of erucic acid nitrile in the sealing resin composition of the present embodiment measured by the above (method) is 90 ppm or more, preferably 100 ppm or more, more preferably 110 ppm or more, further preferably 120 ppm or more, further preferably 130 ppm or more, further preferably 140 ppm or more, further preferably 150 ppm or more, further preferably 160 ppm or more, further preferably 170 ppm or more, further preferably 180 ppm or more, further preferably 190 ppm or more. In addition, from the viewpoint of improving fluidity and continuous moldability, the upper limit of the content of the erucic acid nitrile is 5000 ppm or less, preferably 4000 ppm or less, more preferably 3000 ppm or less, further preferably 2000 ppm or less, further preferably 1000 ppm or less, further preferably 500 ppm or less, further preferably 400 ppm or less, further preferably 300 ppm or less, further preferably 200 ppm or less. From the viewpoint of further improving the adhesion to copper and the reliability of electronic components, the C in the sealing resin composition of the present embodiment measured by the above (method) is 15 H 31 The lower limit of the content of CONH2 is preferably 1 ppm or more, more preferably 2 ppm or more, further preferably 3 ppm or more, further preferably 4 ppm or more, further preferably 5 ppm or more, further preferably 6 ppm or more, further preferably 7 ppm or more, further preferably 8 ppm or more. In addition, from the viewpoint of further improving fluidity and continuous moldability, the above C 15 H 31The upper limit of the CONH2 content is preferably 200 ppm or less, more preferably 150 ppm or less, further preferably 100 ppm or less, further preferably 90 ppm or less, further preferably 80 ppm or less, further preferably 70 ppm or less, further preferably 60 ppm or less. From the viewpoint of further improving the adhesion to copper and the reliability of electronic components, the C in the sealing resin composition of the present embodiment measured by the above (method) is 17 H 33 The lower limit of the CONH2 content is preferably 1 ppm or more, more preferably 10 ppm or more, further preferably 50 ppm or more, further preferably 100 ppm or more, further preferably 150 ppm or more, further preferably 200 ppm or more, further preferably 250 ppm or more, further preferably 270 ppm or more. In addition, from the viewpoint of further improving fluidity and continuous moldability, the above C 15 H 31 The upper limit of the CONH2 content is preferably 500 ppm or less, more preferably 450 ppm or less, further preferably 400 ppm or less, further preferably 350 ppm or less, further preferably 300 ppm or less, further preferably 280 ppm or less. From the viewpoint of further improving the adhesion to copper and the reliability of electronic components, the C in the sealing resin composition of the present embodiment measured by the above (method) is 17 H 35 The lower limit of the content of CONH2 is preferably 1 ppm or more, more preferably 5 ppm or more, further preferably 10 ppm or more, further preferably 20 ppm or more, further preferably 30 ppm or more, further preferably 40 ppm or more, further preferably 50 ppm or more, further preferably 60 ppm or more. In addition, from the viewpoint of further improving fluidity and continuous moldability, the above C 15 H 31 The upper limit of the content of CONH2 is preferably 200 ppm or less, more preferably 150 ppm or less, further preferably 100 ppm or less, further preferably 90 ppm or less, further preferably 80 ppm or less, further preferably 70 ppm or less. In the sealing resin composition of the present embodiment, erucic acid nitrile, C 15 H 31 CONH2, C 17 H 33 CONH2 and C 17 H 35CONH2 can also be contained in the sealing resin composition by directly adding these components to the sealing resin composition. 15 H 31 CONH2, C 17 H 33 CONH2 and C 17 H 35 CONH2 can also be contained in the sealing resin composition by adding a release agent described later to the sealing resin composition and kneading the mixture according to the production method described later. Hereinafter, each component contained in the sealing resin composition will be described in more detail. [Epoxy resin] The sealing resin composition of the present embodiment includes an epoxy resin. Examples of the epoxy resin used in the sealing resin composition of the present embodiment include: novolac epoxy resins such as phenol novolac epoxy resins and cresol novolac epoxy resins, bisphenol A epoxy resins, bisphenol F epoxy resins and other bisphenol-type epoxy resins, aromatic glycidylamine epoxy resins such as N,N-diglycidyl aniline, N,N-diglycidyl toluidine, diaminodiphenylmethane glycidylamine, aminophenol glycidylamine, hydroquinone epoxy resins, biphenyl epoxy resins, stilbene epoxy resins, and the like. Aromatic epoxy resins such as aralkyl epoxy resins such as phenol aralkyl epoxy resins containing phenylene and / or biphenylene skeletons, naphthol aralkyl epoxy resins containing phenylene and / or biphenylene skeletons, and aliphatic epoxy resins such as alicyclic epoxy groups such as vinylcyclohexene dioxide, dicyclopentadiene oxide, and alicyclic diepoxy adipic acid. These may be used alone or in combination of two or more. Among them, the epoxy resin used in the sealing resin composition of the present embodiment preferably contains one or more selected from novolac type epoxy resins, bisphenol type epoxy resins, biphenyl type epoxy resins, trisphenol methane type epoxy resins and aralkyl type epoxy resins, more preferably contains one or more selected from bisphenol type epoxy resins and phenol aralkyl type epoxy resins containing phenylene and / or biphenylene skeletons, and further preferably contains one or more selected from bisphenol A type epoxy resins and phenol aralkyl type epoxy resins containing biphenylene skeletons. From the viewpoint of improving the mechanical strength of the cured product of the sealing resin composition of the present embodiment, when the total solid content of the sealing resin composition is set to 100 mass %, the lower limit of the content of the epoxy resin in the sealing resin composition of the present embodiment is preferably 1 mass % or more, more preferably 2 mass % or more, further preferably 3 mass % or more, further preferably 4 mass % or more, further preferably 5 mass % or more. In addition, from the viewpoint of further improving the balance between adhesion and fluidity to copper, when the total solid content of the sealing resin composition is set to 100 mass%, the upper limit of the content of the epoxy resin is preferably 15 mass% or less, more preferably 12 mass% or less, further preferably 10 mass% or less, further preferably 9 mass% or less, further preferably 8 mass% or less, and further preferably 7 mass% or less. [Curing agent] The sealing resin composition of the present embodiment includes a curing agent. As the curing agent, known curing agents commonly used in sealing resin compositions can be cited. Among the known curing agents, it is preferred to include a phenolic resin curing agent from the viewpoint of further improving the balance between adhesion and fluidity to copper. As the phenolic resin curing agent, for example, there can be mentioned: novolac-type phenolic resins such as phenol novolac resin, cresol novolac resin, and naphthol novolac resin; multifunctional phenolic resins such as trisphenol methane-type phenolic resin; modified phenolic resins such as terpene-modified phenolic resin and dicyclopentadiene-modified phenolic resin; aralkyl-type phenolic resins such as phenol aralkyl resins having a phenylene skeleton and / or a biphenylene skeleton, and naphthol aralkyl resins having a phenylene and / or a biphenylene skeleton; bisphenol compounds such as bisphenol A and bisphenol F, etc. These can be used alone or in combination of two or more. In the sealing resin composition of the present embodiment, the phenolic resin curing agent preferably comprises one or more selected from novolac type phenolic resin, multifunctional phenolic resin, aralkyl type phenolic resin, and bisphenol compound, more preferably comprises aralkyl type phenolic resin, and more preferably comprises phenol aralkyl resin having a biphenylene skeleton. By such a phenolic resin curing agent, it is possible to achieve a good balance of heat resistance, moisture resistance, curability, storage stability, etc. Furthermore, examples of the curing agent that can be used together include polyaddition type curing agents, catalytic type curing agents, condensation type curing agents, and the like. Examples of the polyaddition curing agent include: aliphatic polyamines such as diethylenetriamine (DETA), triethylenetetramine (TETA), and meta-xylylenediamine (MXDA); aromatic polyamines such as diaminodiphenylmethane (DDM), meta-phenylenediamine (MPDA), and diaminodiphenyl sulfone (DDS); and polyamine compounds such as dicyandiamide (DICY) and organic acid dihydrazides; acid anhydrides such as alicyclic acid anhydrides such as hexahydrophthalic anhydride (HHPA) and methyltetrahydrophthalic anhydride (MTHPA); aromatic acid anhydrides such as trimellitic anhydride (TMA), pyromellitic anhydride (PMDA), and benzophenonetetracarboxylic acid (BTDA); polyphenol compounds such as novolac-type phenolic resins and phenolic polymers; polythiol compounds such as polysulfides, thioesters, and thioethers; isocyanate compounds such as isocyanate prepolymers and blocked isocyanates; and organic acids such as carboxylic acid-containing polyester resins. Examples of catalytic curing agents include tertiary amine compounds such as benzyldimethylamine (BDMA) and 2,4,6-tris-dimethylaminomethylphenol (DMP-30); imidazole compounds such as 2-methylimidazole and 2-ethyl-4-methylimidazole (EMI24); and Lewis acids such as BF3 coordination compounds. Examples of the condensation type curing agent include resol-type phenolic resins, urea resins such as methylol-containing urea resins, and melamine resins such as methylol-containing melamine resins. When using other such curing agents, the lower limit of the content of the phenolic resin curing agent is preferably more than 20 mass % relative to all curing agents, more preferably more than 30 mass %, more preferably more than 50 mass %, more preferably more than 70 mass %, more preferably more than 90 mass %. When the content of the phenolic resin curing agent is above the above lower limit, the balance of adhesion and fluidity for copper can be further improved. In addition, the upper limit of the content of the phenolic resin curing agent is not particularly limited, and preferably is less than 100 mass % relative to all curing agents. The lower limit of the total value of the content of the curing agent in the sealing resin composition of the present embodiment is not particularly limited, when the total solid content of the sealing resin composition is set to 100% by mass, preferably 0.5% by mass or more, more preferably 1% by mass or more, more preferably 1.5% by mass or more, more preferably 2% by mass or more, more preferably 3% by mass or more, more preferably 4% by mass or more. When the total value of the content of the curing agent is above the above lower limit, good curability can be obtained. In addition, the upper limit relative to the total value of the content of the curing agent of the sealing resin composition is not particularly limited, when the total solid content of the sealing resin composition is set to 100% by mass, preferably 25% by mass or less, more preferably 15% by mass or less, more preferably 10% by mass or less, more preferably 8% by mass or less, more preferably 6% by mass or less. When the total value of the content of the curing agent is below the above upper limit, the balance of adhesion and fluidity for copper can be further improved. [Inorganic filler] The sealing resin composition of the present embodiment includes an inorganic filler. As an inorganic filler, for example, fused silica such as fused crushed silica and fused spherical silica, crystalline silica, alumina, kaolin, talc, clay, mica, rock wool, wollastonite, glass powder, glass flakes, glass beads, glass fiber, silicon carbide, silicon nitride, aluminum nitride, carbon black, graphite, titanium dioxide, calcium carbonate, calcium sulfate, barium carbonate, magnesium carbonate, magnesium sulfate, barium sulfate, etc. Among them, preferably fused crushed silica, fused spherical silica, crystalline silica and other silica, more preferably fused spherical silica. One inorganic filler can be used, or two or more can be used in combination. The average particle size D of the inorganic filler in the sealing resin composition of this embodiment is 50 The lower limit of is preferably 0.01 μm or more, more preferably 0.05 μm or more, further preferably 0.10 μm or more, further preferably 0.30 μm or more, further preferably 0.50 μm or more. 50 When the average particle size D of the inorganic filler is equal to or greater than the above lower limit, the adhesion of the sealing resin composition of the present embodiment to copper can be improved. 50 The upper limit of is preferably 75 μm or less, more preferably 50 μm or less, further preferably 25 μm or less, and further preferably 20 μm or less. 50 When the content is equal to or less than the above upper limit, the fluidity of the sealing resin composition of the present embodiment can be improved. Average particle size D 50The average particle size D can be obtained, for example, by a laser diffraction / scattering particle size distribution measuring device. Specifically, the inorganic filler material is measured by a dry method using a particle size distribution measuring device "LA-950" manufactured by HORIBA Corporation to obtain a particle size distribution curve, and the distribution curve is analyzed to obtain the average particle size D. 50 . In addition, the sealing resin composition of the present embodiment may contain two or more particles having different average particle sizes D 50 As an inorganic filler, the fluidity of the sealing resin composition of the present embodiment is improved, and the filling property into the mold during sealing is improved. When the total solid content of the sealing resin composition is set to 100% by mass, the lower limit of the content of the inorganic filler in the sealing resin composition of the present embodiment is preferably 50% by mass or more, more preferably 60% by mass or more, more preferably 65% ​​by mass or more, more preferably 70% by mass or more, more preferably 75% by mass or more, more preferably 80% by mass or more, more preferably 85% by mass or more. When the content of the inorganic filler is above the above lower limit, the increase in the amount of moisture absorption and the reduction in strength of the cured sealing resin composition obtained can be reduced. In addition, when the total solid content of the sealing resin composition is set to 100% by mass, the upper limit of the content of the inorganic filler is preferably 97% by mass or less, more preferably 95% by mass or less, more preferably 93% by mass or less, more preferably 91% by mass or less, more preferably 89% by mass or less, more preferably 87% by mass or less. When the content of the inorganic filler is below the above upper limit, the fluidity of the obtained sealing resin composition can be further improved. In addition, when using silica such as fused crushed silica, fused spherical silica, crystalline silica as an inorganic filler, when the inorganic filler of the sealing resin composition is set to 100% by mass as a whole, the content of silica is preferably 40% by mass or more, more preferably 60% by mass or more, and further preferably 80% by mass or more. When the content of silica is above the above lower limit, the balance of curability and fluidity of the sealing resin composition during transfer molding is good. In addition, the upper limit of the content of silica in this case is not particularly limited, but is, for example, 100 mass % or less when the entire inorganic filler in the sealing resin composition is taken as 100 mass %. When an inorganic filler is used in combination with a metal hydroxide such as aluminum hydroxide or magnesium hydroxide and an inorganic flame retardant such as zinc borate, zinc molybdate, or antimony trioxide, the total amount of the inorganic flame retardant and the inorganic filler is preferably within the range of the content of the inorganic filler. [Other ingredients] The sealing resin composition of the present embodiment may contain other components such as a release agent, a curing accelerator, a colorant, a flame retardant, a stress reducing agent, a coupling agent, and an ion scavenger as necessary in addition to the above components. (Release Agent) In order to improve the working efficiency during molding and to make the sealing resin composition contain the above-mentioned erucic acid nitrile, C 15 H 31 CONH2, C 17 H 33 CONH2 and C 17 H 35 CONH2, the sealing resin composition of this embodiment preferably includes a release agent. The release agent may include one or more selected from natural waxes such as carnauba wax; synthetic waxes such as montanate wax and oxidized polyethylene wax; higher fatty acids such as zinc stearate and their metal salts; paraffin wax; and carboxylic acid amides such as erucic acid amide. Among them, in order to improve the balance of adhesion and fluidity to copper, and to make the above-mentioned erucic acid nitrile, C 15 H 31 CONH2, C 17 H 33 CONH2 and C 17 H 35 From the viewpoint that the content of CONH2 is within the above numerical range, it is preferred to contain carboxylic acid amide, and it is more preferred to contain both montanic acid ester wax and carboxylic acid amide. From the viewpoint of improving the curability of the sealing resin composition, when the total solid content of the sealing resin composition is set to 100 mass%, the lower limit of the content of the release agent in the sealing resin composition is preferably 0.01 mass% or more, more preferably 0.1 mass% or more, further preferably 0.3 mass% or more, and further preferably 0.5 mass% or more. In addition, from the viewpoint of improving the fluidity of the sealing resin composition, when the total solid content of the sealing resin composition is set to 100 mass%, the upper limit of the content of the release agent in the sealing resin composition is preferably 2.0 mass% or less, more preferably 1.5 mass% or less, further preferably 1.0 mass% or less, and further preferably 0.8 mass% or less. (Curing accelerator) In order to improve the curability during sealing, the sealing resin composition of the present embodiment may also include a curing accelerator. The curing accelerator may include a phosphorus atom-containing compound selected from, for example, organic phosphines, tetraphenylphosphonium 2,3-dihydroxynaphthalene dicarboxylate, and other tetrasubstituted phosphonium compounds, phosphobetaine compounds, adducts of phosphine compounds and quinone compounds, adducts of phosphine compounds and silane compounds, and other phosphorus atom-containing compounds; 1,8-diazabicyclo[5.4.0]undecene-7, benzyldimethylamine, 2-methylimidazole, and other amidines and tertiary amines, and quaternary salts of the above amidines and amines. One or more of these. Among them, from the viewpoint of improving curability, it is more preferable to include a phosphorus atom-containing compound. In addition, from the viewpoint of improving the balance between moldability and curability, it is more preferable to include a latent substance such as a tetrasubstituted phosphonium compound, a phosphobetaine compound, an adduct of a phosphine compound and a quinone compound, and an adduct of a phosphine compound and a silane compound. From the viewpoint of improving the curability of the sealing resin composition, when the total solid content of the sealing resin composition is set to 100 mass%, the lower limit of the content of the curing accelerator in the sealing resin composition is preferably 0.01 mass% or more, more preferably 0.05 mass% or more, further preferably 0.1 mass% or more, further preferably 0.2 mass% or more, and further preferably 0.3 mass% or more. In addition, from the viewpoint of improving the fluidity of the sealing resin composition, when the total solid content of the sealing resin composition is set to 100 mass%, the upper limit of the content of the curing accelerator in the sealing resin composition is preferably 2.0 mass% or less, more preferably 1.0 mass% or less, and further preferably 0.5 mass% or less. (Colorant) In order to make the color tone of the cured product excellent during sealing, the sealing resin composition of the present embodiment may also include a colorant. The colorant may include one or more selected from, for example, carbon black and red iron. Among them, from the viewpoint of making the color tone of the cured product more excellent during sealing, it is preferred to include carbon black. From the viewpoint of achieving a preferred balance between the coloring of the cured product and the properties of the cured product as a sealing material, the lower limit of the content of the colorant in the sealing resin composition is preferably 0.01% by mass or more, more preferably 0.05% by mass or more, further preferably 0.1% by mass or more, further preferably 0.2% by mass or more, and further preferably 0.3% by mass or more, when the total solid content of the sealing resin composition is 100% by mass. In addition, from the viewpoint of improving the fluidity of the sealing resin composition, when the total solid content of the sealing resin composition is set to 100 mass%, the upper limit of the content of the colorant in the sealing resin composition is preferably 2.0 mass% or less, more preferably 1.0 mass% or less, and further preferably 0.5 mass% or less. (Flame Retardant) The sealing resin composition of the present embodiment may contain a flame retardant to improve the flame retardancy of the cured product during sealing. The flame retardant is preferably a metal hydroxide that suppresses the combustion reaction by dehydration and absorption of heat during combustion, or a composite metal hydroxide that can shorten the combustion time. Examples of the metal hydroxide include aluminum hydroxide, magnesium hydroxide, calcium hydroxide, barium hydroxide, and zirconium oxide hydroxide. As a composite metal hydroxide, it is sufficient that it is a hydrotalcite compound containing two or more metal elements, at least one of which is magnesium, and the other metal elements are metal elements selected from calcium, aluminum, tin, titanium, iron, cobalt, nickel, copper or zinc. As such a composite metal hydroxide, magnesium hydroxide-zinc solid solution is easily obtained as a commercial product. These flame retardants may be used alone or in combination of two or more. In order to reduce the influence on adhesion, the surface of the flame retardant may be treated with a silicon compound such as a silane coupling agent or an aliphatic compound such as wax. Among them, from the viewpoint of further improving the balance between the flame retardancy and fluidity of the cured product, it is preferred to contain one or more selected from aluminum hydroxide and a magnesium hydroxide-zinc solid solution. From the viewpoint of making the balance between the flame retardancy of the cured product during sealing and the characteristics of the sealing material of the cured product the preferred characteristics, when the total solid content of the sealing resin composition is 100% by mass, the lower limit of the content of the flame retardant in the sealing resin composition is preferably 0.1% by mass or more, more preferably 0.5% by mass or more, further preferably 1.0% by mass or more, and further preferably 1.5% by mass or more. In addition, from the viewpoint of improving the fluidity of the sealing resin composition, when the total solid content of the sealing resin composition is set to 100 mass%, the upper limit of the content of the flame retardant in the sealing resin composition is preferably 10.0 mass% or less, more preferably 7.5 mass% or less, further preferably 5.0 mass% or less, and further preferably 2.5 mass% or less. (Low stress agent) In order to reduce the elastic modulus of the cured product during sealing, the sealing resin composition in this embodiment may also contain a low stress agent. The low stress agent may contain one or more selected from silicone oil, silicone rubber, polybutadiene compound, and acrylonitrile butadiene rubber. From the viewpoint of achieving a preferred balance between the elastic modulus of the cured product and the properties of the sealing material of the cured product, when the total solid content of the sealing resin composition is 100% by mass, the lower limit of the content of the low stress agent in the sealing resin composition is preferably 0.01% by mass or more, more preferably 0.05% by mass or more, further preferably 0.10% by mass or more, and further preferably 0.15% by mass or more. In addition, from the viewpoint of improving the fluidity of the sealing resin composition, when the total solid content of the sealing resin composition is set to 100 mass%, the upper limit of the content of the low stress agent in the sealing resin composition is preferably 2.0 mass% or less, more preferably 1.0 mass% or less, further preferably 0.5 mass% or less, and further preferably 0.3 mass% or less. (Coupling agent) In order to improve the adhesion between the epoxy resin and the inorganic filler, the fluidity and continuous moldability of the sealing resin composition, the sealing resin composition of the present embodiment may also contain a coupling agent such as a silane coupling agent. As a coupling agent, for example, epoxy silane, amino silane, urea silane, mercapto silane, etc. can be cited. As epoxysilane, 3-glycidoxypropyltriethoxysilane, 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropylmethyldimethoxysilane, 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane etc. are mentioned, for example. In addition, examples of aminosilanes include 3-aminopropyltriethoxysilane, 3-aminopropyltrimethoxysilane, N-2 (aminoethyl) 3-aminopropyltrimethoxysilane, N-2 (aminoethyl) 3-aminopropylmethyldimethoxysilane, N-phenyl 3-aminopropyltriethoxysilane, N-phenyl 3-aminopropyltrimethoxysilane, N-2 (aminoethyl) 3-aminopropyltriethoxysilane, N-6-(aminohexyl) 3-aminopropyltrimethoxysilane, and N-(3-(trimethoxysilylpropyl)-1,3-phenylenediamine. In addition, examples of ureidosilanes include 3-ureidopropyltriethoxysilane and hexamethyldisilazane. Etc. It can also be used as a latent aminosilane coupling agent that reacts the primary amino site of aminosilane with ketone or aldehyde to protect it. In addition, as aminosilane, it can also have a secondary amino group. In addition, as mercaptosilane, for example, silane coupling agents that show the same function as mercaptosilane coupling agents through thermal decomposition such as 3-mercaptopropyltrimethoxysilane, 3-mercaptopropylmethyldimethoxysilane, and bis(3-triethoxysilylpropyl)tetrasulfide, bis(3-triethoxysilylpropyl)disulfide, etc. can be cited. In addition, these silane coupling agents can also be matched with substances obtained by pre-hydrolysis reaction. These silane coupling agents can be used alone or in combination of two or more. From the viewpoint of continuous moldability, mercaptosilane is preferred, from the viewpoint of fluidity, aminosilane is preferred, and from the viewpoint of adhesion, epoxysilane is preferred. As the lower limit of the content of the coupling agent of the silane coupling agent etc. in the sealing resin composition of the present embodiment, when the total solid content of the sealing resin composition is set to 100 mass %, preferably more than 0.01 mass %, more preferably more than 0.05 mass %, more preferably more than 0.10 mass %, more preferably more than 0.15 mass %, more preferably more than 0.20 mass %, more preferably more than 0.25 mass %.If the content of the coupling agent such as silane coupling agent is more than the above-mentioned lower limit, the interfacial strength of epoxy resin and inorganic filler can be improved, and the adhesion for copper can be improved.In addition, as the upper limit of the content of the coupling agent such as silane coupling agent, when the total solid content of the sealing resin composition is set to 100 mass %, preferably less than 1.00 mass %, more preferably less than 0.80 mass %, more preferably less than 0.60 mass %, more preferably less than 0.40 mass %, more preferably less than 0.35 mass %. When the content of the coupling agent such as a silane coupling agent is at most the above upper limit, the fluidity and continuous moldability of the sealing resin composition of the present embodiment can be improved. (Ion Scavenger) In order to improve the reliability of the sealing material, the sealing resin composition of the present embodiment may also include an ion capture agent. The ion capture agent can include one or more of hydrous oxides of elements selected from, for example, hydrotalcites; selected from magnesium, aluminum, bismuth, titanium, and zirconium. As such an ion capture agent, for example, magnesium-aluminum-hydroxide-carbonate-hydrate, etc. can be cited. As the lower limit of the content of the ion capture agent in the sealing resin composition of the present embodiment, when the total solid content of the sealing resin composition is set to 100% by mass, it is preferably more than 0.01% by mass, more preferably more than 0.05% by mass, and more preferably more than 0.10% by mass. If the content of the ion capture agent is more than the above-mentioned lower limit, the reliability of the sealing material can be improved. In addition, as the upper limit of the content of the ion capture agent, when the total solid content of the sealing resin composition is set to 100% by mass, it is preferably less than 1.00% by mass, more preferably less than 0.80% by mass, more preferably less than 0.60% by mass, more preferably less than 0.40% by mass, and more preferably less than 0.20% by mass. If the content of the ion capture agent is below the above-mentioned upper limit, the fluidity of the sealing resin composition of the present embodiment can be improved. [characteristic] (Shrinkage (ASM)) For the sealing resin composition of the present embodiment, when a disk-shaped cured product with a diameter of 100 mm and a thickness of 3 mm is made under the conditions of a mold temperature of 175°C, a molding pressure of 14 MPa, and a curing time of 120 seconds, the upper limit of the shrinkage rate (ASM) calculated by the following formula (1) is preferably 0.80% or less, more preferably 0.70% or less, further preferably 0.60% or less, further preferably 0.50% or less, and further preferably 0.40% or less. By making the above-mentioned shrinkage rate (ASM) below the above-mentioned upper limit, the adhesion of the sealing resin composition of the present embodiment to copper can be further improved. The lower limit of the shrinkage ratio (ASM) is not particularly limited, but is, for example, 0.00% or more from the viewpoint of further improving the adhesion of the sealing resin composition of the present embodiment to copper. The above shrinkage ratio (ASM) is calculated as follows. First, the dimensions of the disk-shaped cavity at 25°C when the disk-shaped cured product is molded are measured at four locations, and the average value is calculated. Next, the sealing resin composition is charged into the cavity to mold a disk-shaped cured product, and the diameter (external dimensions) of the disk-shaped cured product at 25°C is measured at four locations corresponding to the measured locations in the mold, and the average value is calculated. The obtained value is substituted into the following formula (1) to obtain the shrinkage rate (ASM) (%). Shrinkage rate (ASM) (%) = {(inner diameter of the mold cavity at 25°C) - (outer diameter of the above-mentioned disk-shaped cured product at 25°C)} / (inner diameter of the mold cavity at 25°C) × 100 (%) (1) (Shrinkage (PMC)) For the sealing resin composition of the present embodiment, a disk-shaped cured product with a diameter of 100 mm and a thickness of 3 mm is made under the conditions of a mold temperature of 175°C, a molding pressure of 14 MPa, and a curing time of 120 seconds, and then cured at 175°C for 4 hours. The upper limit of the shrinkage (PMC) calculated by the following formula (2) is preferably 0.70% or less, more preferably 0.60% or less, further preferably 0.50% or less, further preferably 0.40% or less, and further preferably 0.30% or less. By making the above-mentioned shrinkage (PMC) below the above-mentioned upper limit, the adhesion of the sealing resin composition of the present embodiment to copper can be further improved. The lower limit of the shrinkage ratio (PMC) is not particularly limited, but is, for example, 0.00% or more from the viewpoint of further improving the adhesion of the sealing resin composition of the present embodiment to copper. The above shrinkage ratio (PMC) is calculated as follows. First, the disk-shaped solidified product obtained in the above shrinkage rate (ASM) was cooled to 25°C and then post-cured at 175°C for 4 hours to obtain a disk-shaped PMC solidified product. The diameter (external dimensions) of the obtained disk-shaped PMC solidified product at 25°C was measured at four corresponding locations before and after post-curing, and the average value was calculated. The obtained value was substituted into the following formula (2) to obtain the shrinkage rate (PMC) (%). Shrinkage rate (PMC) (%) = {(outer diameter of the above disk-shaped solidified product at 25°C) - (outer diameter of the disk-shaped PMC solidified product at 25°C)} / (outer diameter of the above disk-shaped solidified product at 25°C) × 100 (%) (2) [shape] The shape of the sealing resin composition of the present embodiment can be selected according to the molding method of the sealing resin composition, and examples thereof include a particle shape such as an ingot shape, a powder shape, and a granular shape; and a sheet shape. [Manufacturing method] About the manufacture method of the sealing resin composition of the present embodiment, for example, utilize known device to mix the above-mentioned each component, then utilize roller, kneading machine or extruder etc. to carry out melt mixing, pulverize after cooling, can obtain sealing resin composition by the above method.In addition, also can be shaped after pulverizing, obtain particle-like or sheet-like sealing resin composition.For example, also can be ingot-shaped, obtain particle-like sealing resin composition.In addition, for example, also can utilize vacuum extruder to obtain sheet-like sealing resin composition.In addition, also can appropriately adjust dispersion degree and fluidity etc. to the obtained sealing resin composition. [use] In one embodiment of the present invention, the sealing resin composition can be cured to form a cured product. In addition, as a cured product, it can also be applied to any use of known cured products, for example, it is preferably used to seal semiconductors, substrates, coils, magnets, etc. The electronic device of the present embodiment is sealed with electronic components by the cured product of the sealing resin composition in the present embodiment described above. In this specification, "electronic device" is used to mean components, equipment, final products, etc. that apply electronic engineering technology, such as semiconductor chips, semiconductor elements, semiconductor devices, printed circuit boards, circuit display devices, information communication terminals, light-emitting diodes, physical batteries, chemical batteries, and the like, and includes a structure in which a structure equipped with electronic components such as semiconductor elements, resistors and inductors on a circuit board is sealed together with a sealing resin composition. Specific examples of electronic components include: integrated circuits, large-scale integrated circuits, transistors, thyristors, diodes, solid-state imaging elements, and the like. As the types of electronic devices involved in the present embodiment, specifically, there can be cited: WLP (Wafer Level Package), MAP (Mold Array Package), QFP (Quad Flat Package), SOP (Small Outline Package), QFN (Quad Flat Non-leaded Package), SON (Small Outline Non-leaded Package), BGA (Ball Grid Array), LF-BGA (Lead Flame BGA), FCBGA (Flip Chip BGA), MAPBGA (Molded Array Process BGA), eWLB (Embedded Wafer-Level BGA), Fan-In type eWLB, Fan-Out type eWLB, etc. The embodiments of the present invention are described above, but these are examples of the present invention, and various structures other than the above can also be adopted. In addition, the present invention is not limited to the above embodiments, and modifications and improvements within the scope of achieving the purpose of the present invention are included in the present invention. Example Hereinafter, the present embodiment will be described in detail with reference to Examples and Comparative Examples. In addition, the present embodiment is not limited to these Examples. <Examples, Comparative Examples> (Preparation of Sealing Resin Composition) In each of the examples and comparative examples, a sealing resin composition was prepared as follows. First, the components shown in Table 1 were mixed with a mixer. Then, the obtained mixture was kneaded with a roll, cooled, and pulverized to obtain a sealing resin composition in the form of a powder or granular body. The details of each component in Table 1 are as follows. In addition, the mixing ratio of each component shown in Table 1 represents the content (mass %) relative to the entire sealing resin composition. (Inorganic filler) Inorganic filler 1: fused spherical silica (FB-105, manufactured by DENKA, average particle size 18 μm) Inorganic filler 2: fused spherical silica (SD2500-SQ, manufactured by Admatex, average particle size 0.6 μm) Inorganic filler 3: fused spherical silica (SD5500-SQ, manufactured by Admatex, average particle size 2.2 μm) (Epoxy resin) Epoxy resin 1: Phenol aralkyl type epoxy resin containing biphenylene skeleton (NC-3000, manufactured by Nippon Kayaku Co., Ltd.) Epoxy resin 2: bisphenol A type epoxy resin (YL6810, manufactured by Mitsubishi Chemical Corporation) (Curing agent) Curing agent 1: α-naphthol skeleton-containing phenol aralkyl resin (SN-485, manufactured by Nippon Steel Chemical Materials Co., Ltd.) Curing agent 2: 4,4-dimethoxymethylbiphenylphenol aralkyl resin produced by the following (production method of curing agent 2) (Method for producing curing agent 2) A separable flask was equipped with a stirring device, a thermometer, a reflux cooler, and a nitrogen inlet. 504 parts by mass of 1,3-dihydroxybenzene (resorcinol manufactured by Tokyo Chemical Industry, melting point 111°C, molecular weight 110, purity 99.4%), 141 parts by mass of phenol (special grade reagent manufactured by Kanto Chemical Co., Ltd., phenol, melting point 41°C, molecular weight 94, purity 99.3%), and 251 parts by mass of 4,4'-dichloromethylbiphenyl (4,4'-dichloromethylbiphenyl manufactured by Wako Pure Chemical Industries, Ltd., melting point 126°C, purity 95%, molecular weight 251) which had been crushed into granules in advance were weighed into the separable flask, nitrogen substitution was performed, and heating was performed. When phenol began to melt, stirring was started. The temperature in the system was maintained in the range of 110 to 130°C for 3 hours, and then heated and maintained in the range of 140 to 160°C for 3 hours. The hydrochloric acid gas generated in the system by the above reaction is discharged to the outside of the system by nitrogen flow. After the reaction is completed, the unreacted components are distilled off under reduced pressure conditions of 150°C and 2mmHg. Next, 400 parts by mass of toluene are added, and after uniform dissolution, the mixture is transferred to a separatory funnel, and after 150 parts by mass of distilled water is added and shaken, the water layer is discarded, and the above operation (washing) is repeated until the washing water is neutral, and then the oil layer is decompressed at 125°C, thereby distilling off volatile components such as toluene and residual unreacted components to obtain a curing agent 2 having a structure shown in the following formula (12A). In formula (12A), two Ys are independently hydroxyphenyl groups represented by the following formula (12B) or (12C), and X is a hydroxyphenylene group represented by the following formula (12D) or (12E). The average value of n is 2.3. (Curing accelerator) Curing accelerator: 2,3-dihydroxynaphthalene dicarboxylic acid tetraphenylphosphonium (Release Agent) Release agent 1: glyceryl trimontanate wax (manufactured by Clariant Japan, Licolub WE-4) Release agent 2: erucamide (ALFLOW P-10, manufactured by NOF Corporation) Release agent 3: erucic acid amide (manufactured by Jiangxi Dongyuan Technology Co., Ltd.) Release agent 4: erucic acid amide (manufactured by Nantong Ruiyisen Huagong Co., Ltd.) (Ion Scavenger) Ion scavenger: magnesium-aluminum-hydroxide-carbonate-hydrate (DHT-4H, manufactured by Kyowa Chemical Industry Co., Ltd.) (Colorant) Colorant: Carbon black (ERS-2001, manufactured by Tokai Carbon Co., Ltd.) (Flame Retardant) Flame retardant: Aluminum hydroxide (manufactured by Sumitomo Chemical Co., Ltd., CL303) (Low stress agent) · Low stress agent: a molten reactant prepared by the following method 66.1 parts by weight of bisphenol A epoxy resin (YL6810, manufactured by Mitsubishi Chemical Corporation, softening point 45°C, epoxy equivalent 172) was melted at 140°C, 33.1 parts by weight of an organopolysiloxane represented by the following formula (3) and 0.8 parts by weight of triphenylphosphine were added, and melt-mixed for 30 minutes to obtain a molten reaction product. In formula (3), the average value of n is 7.5. (Coupling agent) Coupling agent 1: N-phenyl 3-aminopropyl trimethoxysilane (CF-4083, manufactured by Dow Corning Toray Co., Ltd.) Coupling agent 2: 3-mercaptopropyltrimethoxysilane (KBM-803, manufactured by Shin-Etsu Silicone Co., Ltd.) Coupling agent 3: 3-glycidoxypropyltrimethoxysilane (KBM-403, manufactured by Shin-Etsu Silicone Co., Ltd.) <Evaluation> The physical properties of the sealing resin composition obtained in each example were evaluated by the following methods. (Thermal Decomposition-GC / MS) The components contained in the sealing resin composition of each of the examples and comparative examples were analyzed by gas chromatography-mass spectrometry (hereinafter, also referred to as GC / MS). The above-mentioned sealing resin composition is diluted with chloroform to prepare a 5-20wt% solution. 1μL of the soluble matter obtained by filtering the solution is introduced into the injection port filled with helium at 250℃, and it is vaporized, and all the components are passed into the column (product name: HP-5MS, manufactured by Agilent Technologies). After the oven equipped with the column is kept at 40℃ for 5 minutes, the temperature is increased to 300℃ at 10℃ / min, and kept at 300℃ for 9 minutes to separate the components. The gas of each component obtained by separation is introduced into a mass spectrometer (product name: 6890N type, manufactured by Agilent Technologies), ionized by the electron impact method in its ionization part, and measured as a mass spectrum. The identification of each detected peak is based on its respective retention time and mass spectrum. According to the intensity ratio of each identified peak, the intensity of erucic acid nitrile, C 15 H 31 CONH2, C 17 H 33 CONH2 and C 17 H 35 The results are shown in Table 1. In addition, "nd" means that the content of the component is below the lower limit of measurement and cannot be measured. (Spiral Flow) Using a low-pressure transfer molding machine (manufactured by Uetaki Seiki Co., Ltd., "KTS-15"), under the conditions of mold temperature 175°C, measurement time 5 minutes, injection pressure 6.9 MPa, and holding time 120 seconds, the sealing resin composition of each embodiment and comparative example was injected into the spiral flow measurement mold based on EMMI-1-66, and the flow length was measured, which was used as the spiral flow. The results are shown in Table 1. In addition, the spiral flow is a parameter of fluidity, and when the value is large, the fluidity is good. (Rectangular viscosity) A low-pressure transfer molding machine (KTS-15 manufactured by Uetaki Seiki Co., Ltd.) was used at a mold temperature of 175°C and an injection speed of 300 mm. 3 / second, the sealing resin composition of each embodiment and comparative example was injected into a rectangular flow channel with a width of 15 mm, a thickness of 1 mm, and a length of 170 mm. Then, the pressure change over time was measured by a pressure sensor embedded at a position 25 mm from the upstream front end of the above-mentioned flow channel. Next, the minimum pressure (kgf / cm 2 The results are shown in Table 1. In addition, the rectangular viscosity is a parameter of fluidity, and when the value is small, the fluidity is good. (Slit burr evaluation) For each embodiment and comparative example, the obtained sealing resin composition was subjected to slit burr measurement as follows. First, a mold for slit burr measurement was prepared. The mold for slit burr measurement comprises: a lower mold having a cavity and a slit connected to the cavity; and an upper mold having a resin injection port for injecting resin into the cavity. In addition, the width of the slit was 5 mm, and the thickness was 5 μm, 10 μm, 20 μm, and 40 μm. Next, the sealing resin composition of each embodiment and comparative example was molded under the conditions of a mold temperature of 175°C, an injection pressure of 6.9 MPa, an injection time of 15 seconds, and a curing time of 120 seconds using a mold for slit burr measurement. Next, the length of the sealing resin composition (slit burr) filled into the slit through the cavity was measured with a caliper. The results are shown in Table 1. (Shrinkage) The sealing resin composition of each example and comparative example was molded into a disk-shaped cured product with a diameter of 100 mm and a thickness of 3 mm under the conditions of a mold temperature of 175° C., a molding pressure of 14 MPa, and a curing time of 120 seconds. The shrinkage rate was calculated using the following formula (1) using the disk-shaped cured product. More specifically, first, the dimensions of the disk-shaped cavity at 25°C when the disk-shaped cured product is molded are measured at four locations, and the average value is calculated. Next, the sealing resin composition is loaded into the cavity to mold a disk-shaped cured product, and the diameter (external dimensions) of the obtained disk-shaped cured product at 25°C is measured at four locations corresponding to the measured locations in the mold, and the average value is calculated. The obtained value is substituted into the following formula (1) to obtain the shrinkage rate (ASM) (%). The results are shown in Table 1. Shrinkage rate (ASM) (%) = {(inner diameter of the mold cavity at 25°C) - (outer diameter of the above-mentioned disk-shaped cured product at 25°C)} / (inner diameter of the mold cavity at 25°C) × 100 (%) (1) Then, the disk-shaped solidified product was cooled to 25° C. and then post-cured at 175° C. for 4 hours to obtain a disk-shaped PMC solidified product. In addition, the diameter (outer dimensions) of the obtained disk-shaped PMC cured product at 25° C. was measured at four corresponding locations before and after post-curing, and the average value was calculated. The obtained numerical value was substituted into the following formula (2) to determine the shrinkage ratio (PMC) (%). The results are shown in Table 1. Shrinkage rate (PMC) (%) = {(outer diameter of the above disk-shaped solidified product at 25°C) - (outer diameter of the disk-shaped PMC solidified product at 25°C)} / (outer diameter of the above disk-shaped solidified product at 25°C) × 100 (%) (2) (Adhesion) The sealing resin composition of each example and comparative example was measured for die shear strength in post mold cure (PMC) as an index of adhesion by the following method. The sealing resin composition obtained in each example was molded into 10 pieces on a 9×29 mm long strip of test copper (Cu) lead frame using a low pressure transfer molding machine (manufactured by Yamashiro Seiki Co., Ltd., "AV-600-50-TF") at a mold temperature of 175°C, an injection pressure of 10 MPa, and a curing time of 180 seconds. The tightness strength test piece. Then, the sample cured at 175°C for 3 hours was subjected to die shear strength measurement at 25°C (RT) using an automatic die shear measuring device (DAGE 4000, manufactured by Nordson Advanced Technologies) to obtain die shear strength (N). The results are shown in Table 1. [Table 1] According to Table 1, the sealing resin compositions of Examples 1 and 2 have an improved balance between adhesion to copper and fluidity. The sealing resin compositions of Examples 1 and 2 contained other release agents in addition to erucic acid amide, and also contained the components described in Table 1. As a result, peaks of various compounds such as erucic acid nitrile were observed. This application claims priority based on Japanese application No. 2023-193217 filed on November 13, 2023, and all the contents disclosed therein are incorporated into this specification.

Claims

1. A sealing resin composition, characterized in that: Contains epoxy resin, curing agent, inorganic filler and erucic acid nitrile, The content of the erucic acid nitrile in the sealing resin composition measured by the following method is 90 ppm or more and 5000 ppm or less, method: The sealing resin composition is diluted with chloroform to prepare a 5-20 wt% solution; 1 μL of the soluble matter obtained by filtering the solution is introduced into an injection port filled with helium at 250°C to vaporize it, and all the components are passed into the column; The oven equipped with a column was kept at 40°C for 5 minutes, then heated to 300°C at a rate of 10°C / min and kept at 300°C for 9 minutes to separate the components; the gases of the separated components were introduced into a mass spectrometer, ionized by an electron impact method in its ionization section, and measured as a mass spectrum; the identification of the detected peaks was performed based on their respective retention times and mass spectra; the intensity ratios of eruconitrile, C 15 H 31 CONH2, C 17 H 33 CONH2 and C 17 H 35 CONH2 content.

2. The sealing resin composition according to claim 1, wherein: The C in the sealing resin composition measured by the method 15 H 31 The content of CONH2 is 1 ppm or more and 200 ppm or less.

3. The sealing resin composition according to claim 1 or 2, characterized in that: The C in the sealing resin composition measured by the method 17 H 33 The content of CONH2 is 500 ppm or less.

4. The sealing resin composition according to claim 1 or 2, wherein: The C in the sealing resin composition measured by the method 17 H 35 The content of CONH2 is 1 ppm or more and 200 ppm or less.

5. The sealing resin composition according to claim 1 or 2, wherein: The epoxy resin includes one or more selected from the group consisting of novolac epoxy resin, bisphenol epoxy resin, biphenyl epoxy resin, trisphenol methane epoxy resin and aralkyl epoxy resin.

6. The sealing resin composition according to claim 1 or 2, wherein: The content of the epoxy resin is 1% by mass or more and 15% by mass or less relative to the total solid content of the sealing resin composition.

7. The sealing resin composition according to claim 1 or 2, wherein: The curing agent comprises a phenolic resin curing agent.

8. The sealing resin composition according to claim 7, wherein: The phenolic resin curing agent comprises one or more selected from novolac phenolic resin, multifunctional phenolic resin, aralkyl phenolic resin and bisphenol compound.

9. The sealing resin composition according to claim 1 or 2, wherein: The content of the curing agent is 0.5 mass % or more and 25 mass % or less relative to the total solid content of the sealing resin composition.

10. The sealing resin composition according to claim 1 or 2, wherein: The content of the inorganic filler is 50 mass % or more and 97 mass % or less based on the total solid content of the sealing resin composition.

11. A cured product of the sealing resin composition according to claim 1 or 2.

12. An electronic device, characterized in that: An electronic component is sealed with a cured product of the sealing resin composition according to claim 1 or 2.

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