Epoxy resin composition for packaging high-performance semiconductor and preparation method of epoxy resin composition

Abstract

The invention discloses an epoxy resin composition for packaging a high-performance semiconductor and a preparation method of the epoxy resin composition. The epoxy resin composition comprises the following components in percentage by weight: 50%-70% of epoxy resin-200, 5%-15% of a curing agent, 5%-15% of an accelerant, 5%-15% of a softening agent, 5%-40% of a filling agent, 1%-10% of an auxiliary agent and 0-3% of carbon nanotubes. Before the preparation work is started, a worker cleans and removes dust on the raw materials, so that the influence of dust on the raw materials is reduced, and then the worker prepares the epoxy resin with relatively high electrical insulativity according to the requirements by mixing 70% of epoxy group-200, 10% of a curing agent, 5% of an accelerant, 5% of a softening agent, 5% of a filling agent and 5% of an auxiliary agent; the epoxy resin with high thermal conductivity is prepared from 60% of epoxy group-200, 5% of a curing agent, 10% of an accelerant, 8% of a softening agent, 2% of a filling agent, 7% of an auxiliary agent and 3% of carbon nanotubes, so that the chemical performance of the epoxy resin composition is improved, and the application range of the epoxy resin composition is widened.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor packaging, in particular to an epoxy resin composition for high-performance semiconductor packaging and a preparation method thereof. Background Art

[0002] High-performance semiconductor packaging refers to the technology of connecting semiconductor chips to external circuits. This process involves fixing the chip on a substrate and connecting pins to facilitate circuit interconnection. The purpose of this type of packaging technology is to improve the performance of electronic products, reduce volume, reduce power consumption and improve reliability. Epoxy resin for high-performance semiconductor packaging mainly refers to epoxy resin materials used for insulation and reinforcement in the semiconductor packaging process. This type of epoxy resin has excellent heat resistance, electrical insulation, bonding strength and chemical stability, and is an ideal choice for high-performance semiconductor packaging. When mixing the epoxy resin composition for high-performance semiconductor packaging, the electrical insulation and thermal conductivity of the normal epoxy resin composition are poor, and it cannot be used for semiconductor chips with high ambient temperatures, thereby reducing the scope of use of the epoxy resin composition. Therefore, in the process of high-performance semiconductor packaging, high-performance semiconductor packaging epoxy resin compositions and preparation methods thereof are needed.

[0003] The inventors found that there are at least the following problems in the prior art that have not been solved: 1. When mixing the epoxy resin composition for high-performance semiconductor packaging, the electrical insulation and thermal conductivity of the normal epoxy resin composition are poor, and it cannot be used for semiconductor chips with high ambient temperature, thereby reducing the scope of use of the epoxy resin composition; 2. When fusing the epoxy resin composition, it is necessary to add a variety of materials, which leads to a long fusion time for the raw materials and poor fusion quality; 3. During the fusion process of the raw materials, odor will be generated, and direct discharge will pollute the environment, and when the raw materials are cooled, a large amount of heat will be lost, resulting in energy waste. To this end, the present invention designs an epoxy resin composition for high-performance semiconductor packaging and a preparation method thereof. Summary of the invention

[0004] The object of the present invention is to provide an epoxy resin composition for high-performance semiconductor encapsulation and a preparation method thereof, so as to solve the problem that when the epoxy resin composition for high-performance semiconductor encapsulation proposed in the above-mentioned background technology is mixed, the electrical insulation and thermal conductivity of the normal epoxy resin composition are poor, and it cannot be used for semiconductor chips with high ambient temperature, thereby reducing the scope of use of the epoxy resin composition, and when the epoxy resin composition is fused, it is necessary to add a variety of materials, resulting in a long fusion time for the raw materials, and the fusion quality is poor, and in the process of fusion of the raw materials, odor will be generated, and direct discharge will cause pollution to the environment, and when the raw materials are cooled, a large amount of heat is lost, resulting in energy waste. To this end, the present invention designs an epoxy resin composition for high-performance semiconductor encapsulation and a preparation method thereof.

[0005] To achieve the above object, the present invention provides the following technical solution: a high-performance epoxy resin composition for semiconductor packaging, wherein the weight percentage of each component is:

[0006] Epoxy resin-200: 50%-70%;

[0007] Curing agent: 5%-15%;

[0008] Accelerator: 5%-15%;

[0009] Softener: 5%-15%;

[0010] Fillers: 5%-40%;

[0011] Additives: 1%-10%;

[0012] Carbon nanotubes: 0-3%.

[0013] Preferably, the weight ratio of the components of the epoxy resin A with higher electrical insulation is: epoxy resin-200: 70%, curing agent: 10%, accelerator: 5%, softener: 5%, filler: 5%, and auxiliary agent 5%.

[0014] Preferably, the weight ratio of the components of the epoxy resin B with higher thermal conductivity is: epoxy resin-200: 60%, curing agent: 5%, accelerator: 10%, softener: 8%, filler: 2%, auxiliary agent: 7%, carbon nanotubes: 3%.

[0015] Preferably, the curing agent is a mixture of anhydride, accelerator and imidazole in a mixing ratio of 1:1:1:1.

[0016] Preferably, the softener is a mixture of bisphenol A-free epoxy gum, cyclic aliphatic epoxy and epoxidized butadiene, wherein the softener contains: bisphenol A-free epoxy gum: 50%, cyclic aliphatic epoxy: 30%, epoxidized butadiene: 20%.

[0017] Preferably, the filler is a mixture of epoxy resin, polyethylene and polypropylene, and the ratio of epoxy resin, polyethylene and polypropylene is 1:2:1.

[0018] Preferably, the accelerator is composed of a mixture of pentaerythritol, polyethylene glycol, phthalic anhydride, n-butanol and isopropanol, and the ratio of the components is 1:1:1:1:1.

[0019] Preferably, the method for preparing the high-performance epoxy resin composition for semiconductor encapsulation comprises the following steps:

[0020] S1. Raw material preparation

[0021] 1. Purchase raw materials; 2. Clean the raw materials and vacuum dust removal; 3. Material ratio: the weight ratio of each component per kilogram of epoxy resin with higher electrical insulation is: epoxy resin-200: 70%, curing agent: 10%, accelerator: 5%, softener: 5%, filler: 5%, auxiliary agent 5%; the weight ratio of each component per kilogram of epoxy resin with higher thermal conductivity is: epoxy resin-200: 60%, curing agent: 5%, accelerator: 10%, softener: 8%, filler: 2%, auxiliary agent: 7%, carbon nanotube: 3%;

[0022] S2. Raw material mixing

[0023] 1. Check the mixing equipment, ① clean the equipment, ② check whether the instrument is normal, 2. Add raw materials, ① crush the raw materials, ② check the crushing quality, 3. Start fusion, ① heat and melt, ② control the temperature in stages, the first stage is 160 degrees Celsius, the time is 1h, the second stage is 140 degrees Celsius, the time is 1h, the third stage is 120 degrees Celsius, the time is 0.5h, 4. Environmental protection treatment, ① absorb odor, ② heat recovery;

[0024] S3, vacuum degassing

[0025] 1. Check the vacuum degassing equipment, ① for leakage, ② check the instrument, 2. Perform degassing, ① detect air pressure, ② set time, 3. Danger warning, ① air pressure warning, ② danger alarm, ③ emergency treatment, 4. Degassing detection, use X-ray equipment for detection.

[0026] S4, resin curing

[0027] 1. Prepare the mold, prepare three molds of different sizes, 2. Shape the resin, 3. Cure the resin.

[0028] S5. Storage and transportation

[0029] 1. Resin storage: ① Store in a low temperature environment; ② Keep dry; 2. Resin transportation.

[0030] Preferably, the material balance equation in the smelting equipment is: Min=Mout+Mloss, wherein Min is the total amount of material entering the smelting equipment, Mout is the total amount of material after smelting, and Mloss is the amount of material loss.

[0031] Preferably, the temperature control equation in the smelting equipment is: T=T0+k(Q-Qloss), wherein T is the material temperature during the smelting process, T0 is the initial temperature, k is the heat transfer coefficient, Q is the input heat, and Qloss is the heat loss.

[0032] Compared with the prior art, the present invention has the following beneficial effects:

[0033] 1. Before the preparation work of the present invention begins, the staff cleans and removes dust from the raw materials to reduce the impact of dust on the raw materials. Then, the staff mixes the epoxy resin with higher electrical insulation according to the needs, according to the ratio of epoxy resin-200: 70%, curing agent: 10%, accelerator: 5%, softener: 5%, filler: 5%, and auxiliary agent 5%. Then, the staff mixes the epoxy resin with higher thermal conductivity according to the ratio of epoxy resin-200: 60%, curing agent: 5%, accelerator: 10%, softener: 8%, filler: 2%, auxiliary agent: 7%, and carbon nanotubes: 3%, thereby improving the chemical properties of the epoxy resin composition and increasing its scope of use.

[0034] 2. Clean the raw material crushing device and check whether the instruments on the crushing device can work normally. Then add the raw materials, start the equipment, crush the raw materials, and then check the quality of the crushing. Then decide to stop or continue the crushing of the raw materials, thereby reducing the subsequent time for raw material fusion and improving the quality of raw material fusion.

[0035] 3. The crushed raw materials are melted, first at 160 degrees Celsius for 1 hour, then at 140 degrees Celsius for 1 hour, and finally at 120 degrees Celsius for 0.5 hours. During the smelting process, the generated gases are absorbed and purified by the purification equipment, and then the smelt is cooled and heat is recovered by the heat recovery device, thereby ensuring the environmental friendliness of the equipment and improving the recovery and utilization of excess heat. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] Figure 1 It is the weight percentage diagram of each component of the present invention;

[0037] Figure 2 is a flow chart of the preparation method of the present invention;

[0038] Figure 3It is a debugging code diagram of the smelting equipment in the preparation method of the present invention;

[0039] Figure 4 It is an operation code diagram of the smelting equipment in the preparation method of the present invention. DETAILED DESCRIPTION

[0040] The technical solutions in the embodiments of the present invention are described clearly and completely below. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0041] See also Figure 1-Figure 4 The present invention provides a technical solution: an epoxy resin composition for high-performance semiconductor packaging, wherein the weight percentage of each component is:

[0042] Epoxy resin-200: 50%-70%;

[0043] Curing agent: 5%-15%;

[0044] Accelerator: 5%-15%;

[0045] Softener: 5%-15%;

[0046] Fillers: 5%-40%;

[0047] Additives: 1%-10%;

[0048] Carbon nanotubes: 0-3%.

[0049] Embodiment 1:

[0050] The weight percentage of each component is:

[0051] Epoxy resin-200: 50%-70%;

[0052] Curing agent: 5%-15%;

[0053] Accelerator: 5%-15%;

[0054] Softener: 5%-15%;

[0055] Fillers: 5%-40%;

[0056] Additives: 1%-10%;

[0057] Carbon nanotubes: 0-3%.

[0058] In this embodiment, the weight ratio of the components of epoxy resin A with higher electrical insulation is: epoxy resin-200: 70%, curing agent: 10%, accelerator: 5%, softener: 5%, filler: 5%, and auxiliary agent 5%.

[0059] In this embodiment, the weight ratio of the components of epoxy resin B with higher thermal conductivity is: epoxy resin-200: 60%, curing agent: 5%, accelerator: 10%, softener: 8%, filler: 2%, auxiliary agent: 7%, carbon nanotubes: 3%.

[0060] In this embodiment, the curing agent is a mixture of anhydride, accelerator and imidazole, and the mixing ratio is 1:1:1:1.

[0061] In this embodiment, the softener is a mixture of bisphenol A-free epoxy gum, cyclic aliphatic epoxy and epoxidized butadiene, wherein the softener contains: bisphenol A-free epoxy gum: 50%, cyclic aliphatic epoxy: 30%, epoxidized butadiene: 20%.

[0062] In this embodiment, the filler is formed by mixing epoxy resin, polyethylene and polypropylene, and the ratio of epoxy resin, polyethylene and polypropylene is 1:2:1.

[0063] In this embodiment, the accelerator is composed of a mixture of pentaerythritol, polyethylene glycol, phthalic anhydride, n-butanol and isopropanol, and the ratio of the mixture is 1:1:1:1:1.

[0064] The preparation method of this embodiment comprises the following steps:

[0065] S1. Raw material preparation

[0066] 1. Purchase raw materials; 2. Clean the raw materials and vacuum dust removal; 3. Material ratio. The weight ratio of each component per kilogram of epoxy resin with higher electrical insulation is: epoxy resin-200: 70%, curing agent: 10%, accelerator: 5%, softener: 5%, filler: 5%, auxiliary agent 5%. The weight ratio of each component per kilogram of epoxy resin with higher thermal conductivity is: epoxy resin-200: 60%, curing agent: 5%, accelerator: 10%, softener: 8%, filler: 2%, auxiliary agent: 7%, carbon nanotube: 3%. Before the preparation work begins, the staff first determines the type of raw materials and then purchases them. Then the raw materials are cleaned and dusted. To ensure that the impact of dust on the raw materials is reduced, the staff will then mix the epoxy resin with higher electrical insulation according to the weight ratio of each component per kilogram: epoxy resin-200: 70%, curing agent: 10%, accelerator: 5%, softener: 5%, filler: 5%, auxiliary agent 5%, and then mix the epoxy resin with higher thermal conductivity according to the weight ratio of each component per kilogram: epoxy resin-200: 60%, curing agent: 5%, accelerator: 10%, softener: 8%, filler: 2%, auxiliary agent: 7%, carbon nanotubes: 3%, so that the chemical properties of the epoxy resin composition are improved and its scope of use is increased;

[0067] S2. Raw material mixing

[0068] 1. Check the mixing equipment, ① clean the equipment, ② check whether the instrument is normal, 2. Add raw materials, ① crush the raw materials, ② check the crushing quality, 3. Start fusion, ① heat and melt, ② control the temperature in stages, the first stage is 160 degrees Celsius, the time is 1h, the second stage is 140 degrees Celsius, the time is 1h, the third stage is 120 degrees Celsius, the time is 0.5h, 4. Environmental protection treatment, ① absorb odor, ② heat recovery, clean the raw material crushing device, and check whether the instrument on the crushing device can be used normally, then add the raw materials, the staff starts the equipment, crushes the raw materials, and then passes the work The operator checks the quality of the crushing and decides to stop or continue the crushing of the raw materials, thereby reducing the subsequent time for the fusion of the raw materials and improving the quality of the fusion of the raw materials. The crushed raw materials are then smelted, first at 160 degrees Celsius for 1 hour, then at 140 degrees Celsius for 1 hour, and finally at 120 degrees Celsius for 0.5 hours. During the smelting process, the generated gases are absorbed and purified by the purification equipment, and then the smelt is cooled and heat recovered by the heat recovery device, thereby ensuring the environmental protection of the equipment and improving the recovery and utilization of excess heat.

[0069] S3, vacuum degassing

[0070] 1. Check the vacuum degassing equipment, ① for leakage, ② check the instrument, 2. Degassing, ① detect the air pressure, ② set the time, 3. Danger warning, ① air pressure warning, ② danger alarm, ③ emergency treatment, 4. Degassing detection, use X-ray equipment for detection, after the raw materials are fused and cooled, put the raw materials into the vacuum degassing equipment, degassing the raw materials, so as to improve the quality of the epoxy resin mixture, and then monitor the air pressure of the vacuum equipment to prevent the equipment from exploding due to excessive or low air pressure, thereby reducing the danger of equipment use, and then use X-ray equipment to detect the degassing quality of the epoxy resin composition after vacuum degassing.

[0071] S4, resin curing

[0072] 1. Prepare the mold, prepare three molds of different sizes, 2. Shape the resin, 3. Curing the resin, prepare three molds of different sizes to shape the epoxy resin composition, and then add the epoxy resin composition into the mold for curing.

[0073] S5. Storage and transportation

[0074] 1. Resin storage: ① Store in a low-temperature environment, ② Keep dry. 2. Resin transportation: Package the cured resin and then store it in a low-temperature and dry environment to ensure the activity of the resin. Then, when the resin needs to be used, transport it.

[0075] In this embodiment, the material balance equation in the smelting equipment is: Min=Mout+Mloss, wherein Min is the total amount of material entering the smelting equipment, Mout is the total amount of material after smelting, and Mloss is the material loss.

[0076] In this embodiment, the temperature control equation in the smelting equipment is: T = T0 + k (Q-Qloss), where T is the material temperature during the smelting process, T0 is the initial temperature, k is the heat transfer coefficient, Q is the input heat, and Qloss is the heat loss. Figure 1 , Figure 2 , Figure 3 and Figure 4 ).

[0077] Embodiment 2:

[0078] The difference from the first embodiment is that:

[0079] Epoxy resin-200: 50%-70%;

[0080] Curing agent: 5%-15%;

[0081] Accelerator: 5%-15%;

[0082] Softener: 5%-15%.

[0083] In this embodiment, the weight ratio of each component of the fertilizer is: epoxy resin-200: 70%, curing agent: 10%, accelerator: 10%, softener: 10%.

[0084] In this embodiment, the curing agent is a mixture of anhydride, accelerator and imidazole, and the mixing ratio is 1:1:1:1.

[0085] In this embodiment, the softener is a mixture of bisphenol A-free epoxy gum, cyclic aliphatic epoxy and epoxidized butadiene, wherein the softener contains: bisphenol A-free epoxy gum: 50%, cyclic aliphatic epoxy: 30%, epoxidized butadiene: 20%.

[0086] The purification method of this embodiment comprises the following steps:

[0087] S1. Raw material preparation

[0088] 1. Purchase of raw materials; 2. Cleaning of raw materials and vacuum dust removal; 3. Material proportioning. Before the preparation work begins, the staff will first determine the type of raw materials and then purchase them. Then the raw materials will be cleaned and dusted to ensure that the impact of dust on the raw materials is reduced;

[0089] S2. Raw material mixing

[0090] 1. Check the mixing equipment. 2. Start fusion and melt the raw materials at 160 degrees Celsius for 1 hour, then cool the smelted raw materials naturally.

[0091] S3, resin curing

[0092] 1. Prepare the mold, prepare three molds of different sizes, 2. Shape the resin, 3. Curing the resin, prepare three molds of different sizes to shape the epoxy resin composition, and then add the epoxy resin composition into the mold for curing.

[0093] S4. Storage and transportation

[0094] 1. Resin storage: ① Store in a low temperature environment, ② Keep dry. 2. Resin transportation: Package the cured resin and store it in a low temperature and dry environment to ensure the activity of the resin. When the resin needs to be used, transport the resin. Refer to ( Figure 1 , Figure 2 , Figure 3 and Figure 4 ).

[0095] Embodiment three:

[0096] The difference between the first embodiment and the second embodiment is that:

[0097] The weight percentage of each component is:

[0098] Epoxy resin-200: 50%-70%;

[0099] Curing agent: 5%-15%;

[0100] Accelerator: 5%-15%;

[0101] Carbon nanotubes: 0-3%.

[0102] In this embodiment, the weight ratio of each component of the epoxy resin is: epoxy resin-200: 70%, curing agent: 15%, accelerator: 12%, and carbon nanotubes 3%.

[0103] The preparation method of this embodiment comprises the following steps:

[0104] S1. First, prepare the ingredients:

[0105] Prepare the epoxy resin components with the following weight ratios: epoxy resin-200: 70%, curing agent: 15%, accelerator: 12%, carbon nanotubes 3%;

[0106] S2, then mix:

[0107] A certain amount of epoxy resin-200, curing agent, accelerator and carbon nanotubes are added into the melting equipment for mixing.

[0108] S3, degassing detection, using X-ray equipment for detection, after the raw materials are fused and cooled, they are put into vacuum degassing equipment for degassing.

[0109] S5. Storage and transportation

[0110] 1. Resin storage: ① Store in a low temperature environment, ② Keep dry. 2. Resin transportation: Package the cured resin and store it in a low temperature and dry environment to ensure the activity of the resin. When the resin needs to be used, transport the resin. Refer to ( Figure 1 , Figure 2 , Figure 3 and Figure 4 ).

[0111] In summary: By referring to ( Figure 1 , Figure 2 , Figure 3 and Figure 4) Compare Example 1, Example 2 with Example 3. Before the preparation work begins, the staff first determines the type of raw materials and then purchases them. Then the raw materials are cleaned and dusted to ensure that the influence of dust on the raw materials is reduced. Then the staff will mix the epoxy resin with higher electrical insulation according to the needs, according to the weight ratio of each component per kilogram: epoxy resin-200: 70%, curing agent: 10%, accelerator: 5%, softener: 5%, filler: 5%, auxiliary agent 5%, and then mix the epoxy resin with higher thermal conductivity, according to the weight ratio of each component per kilogram: epoxy resin-200: 60%, curing agent: 5%, accelerator: 10%, softener: 8%, filler: 2%, auxiliary agent: 7%, carbon nanotubes: 3%, thereby improving the chemical properties of the epoxy resin composition and increasing its scope of use.

[0112] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, technique, article or equipment including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, technique, article or equipment.

[0113] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. An epoxy resin composition for high-performance semiconductor encapsulation, characterized in that: The weight percentage of each component is: Epoxy resin-200: 50%-70%; Curing agent: 5%-15%; Accelerator: 5%-15%; Softener: 5%-15%; Fillers: 5%-40%; Additives: 1%-10%; Carbon nanotubes: 0-3%.

2. The high performance semiconductor encapsulation epoxy resin composition according to claim 1, characterized in that: The weight ratio of the components of the epoxy resin A with higher electrical insulation is: epoxy resin-200: 70%, curing agent: 10%, accelerator: 5%, softener: 5%, filler: 5%, and auxiliary agent 5%.

3. The high performance semiconductor encapsulation epoxy resin composition according to claim 1, characterized in that: The weight ratio of the components of the epoxy resin B with higher thermal conductivity is: epoxy resin-200: 60%, curing agent: 5%, accelerator: 10%, softener: 8%, filler: 2%, auxiliary agent: 7%, carbon nanotube: 3%.

4. The high performance semiconductor encapsulation epoxy resin composition according to claim 1, characterized in that: The curing agent is a mixture of anhydride, accelerator and imidazole, and the mixing ratio is 1:1:1:

1.

5. The high performance semiconductor encapsulation epoxy resin composition according to claim 1, characterized in that: The softener is a mixture of bisphenol A-free epoxy gum, cyclic aliphatic epoxy and epoxidized butadiene, wherein the softener contains: bisphenol A-free epoxy gum: 50%, cyclic aliphatic epoxy: 30%, and epoxidized butadiene: 20%.

6. The high performance semiconductor encapsulation epoxy resin composition according to claim 1, characterized in that: The filler is formed by mixing epoxy resin, polyethylene and polypropylene, and the ratio of epoxy resin, polyethylene and polypropylene is 1:2:

1.

7. The high performance semiconductor encapsulation epoxy resin composition according to claim 1, characterized in that: The accelerator is composed of a mixture of pentaerythritol, polyethylene glycol, phthalic anhydride, n-butanol and isopropanol, and the proportion of the mixture is 1:1:1:1:

1.

8. A method for preparing a high-performance epoxy resin composition for semiconductor encapsulation, based on the high-performance epoxy resin composition for semiconductor encapsulation according to any one of claims 1 to 7, characterized in that: The following steps are involved: S1. Raw material preparation 1. Purchase raw materials; 2. Clean the raw materials and vacuum dust removal; 3. Material ratio: the weight ratio of each component per kilogram of epoxy resin with higher electrical insulation is: epoxy resin-200: 70%, curing agent: 10%, accelerator: 5%, softener: 5%, filler: 5%, auxiliary agent 5%; the weight ratio of each component per kilogram of epoxy resin with higher thermal conductivity is: epoxy resin-200: 60%, curing agent: 5%, accelerator: 10%, softener: 8%, filler: 2%, auxiliary agent: 7%, carbon nanotube: 3%; S2. Raw material mixing 1. Check the mixing equipment, ① clean the equipment, ② check whether the instrument is normal, 2. Add raw materials, ① crush the raw materials, ② check the crushing quality, 3. Start fusion, ① heat and melt, ② control the temperature in stages, the first stage is 160 degrees Celsius, the time is 1h, the second stage is 140 degrees Celsius, the time is 1h, the third stage is 120 degrees Celsius, the time is 0.5h, 4. Environmental protection treatment, ① absorb odor, ② heat recovery; S3, vacuum degassing 1. Check the vacuum degassing equipment, ① for leakage, ② check the instrument, 2. Perform degassing, ① detect air pressure, ② set time, 3. Danger warning, ① air pressure warning, ② danger alarm, ③ emergency treatment, 4. Degassing detection, use X-ray equipment for detection. S4, resin curing 1. Prepare the mold, prepare three molds of different sizes, 2. Shape the resin, 3. Cure the resin. S5. Storage and transportation 1. Resin storage: ① Store in a low temperature environment; ② Keep dry; 2. Resin transportation.

9. The method for preparing the high-performance epoxy resin composition for semiconductor encapsulation according to claim 8, characterized in that: The material balance equation in the smelting equipment is: Min=Mout+Mloss, wherein Min is the total amount of material entering the smelting equipment, Mout is the total amount of material after smelting, and Mloss is the amount of material loss.

10. The method for preparing the high-performance epoxy resin composition for semiconductor encapsulation according to claim 8, characterized in that: The temperature control equation in the smelting equipment is: T=T0+k(Q-Qloss), where T is the material temperature during the smelting process, T0 is the initial temperature, k is the heat transfer coefficient, Q is the input heat, and Qloss is the heat loss.

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