Localization electrochemical deposition device for liquid feeding driven by flexible mechanism and working method

Abstract

The invention discloses a localized electrochemical deposition device with liquid feeding driven by a flexible mechanism and a working method, and belongs to the technical field of localized electrochemical deposition. A flexible hinge liquid supply processing system is used in the device, precise regulation and control of a mechanical structure are used for replacing pneumatic driving, the influence of pneumatic fluctuation on liquid supply stability is effectively avoided, and liquid supply continuity is ensured; the problem of gas path blockage is fundamentally avoided, and smooth liquid supply is ensured. The flexible hinge has the advantages of flexibility and high-precision control, and in combination with precise driving of piezoelectric ceramics, micron-scale and even nano-scale control over the liquid supply amount can be achieved. High-precision control is crucial to the accuracy of the electrochemical deposition process, it can be ensured that the thickness and uniformity of the deposition layer meet preset requirements, and the quality and performance of the deposition layer are improved.

Description

Technical Field

[0001] The invention belongs to the technical field of localized electrochemical deposition, and in particular relates to a localized electrochemical deposition device driven by a flexible mechanism to supply liquid and a working method. Background Art

[0002] Localized electrochemical deposition technology, as a cutting-edge technology in the field of micro-nano processing, realizes micro-additive manufacturing of micro-nano structures with highly sensitive force feedback capabilities by utilizing the localized liquid feeding capability of the hollow atomic force probe and electrochemical deposition technology.

[0003] However, in the hollow atomic force probe localized electrochemical deposition technology, the supply of electrolyte mainly depends on the air pressure system at the tail end of the probe, which has many limitations.

[0004] Specifically, there are the following main problems with the pneumatic system for delivering electrolyte: first, the pneumatic system pipeline is long and has a slow response speed, which makes it difficult to meet the needs of high-precision localized electrochemical deposition for fast and accurate electrolyte supply; second, air pressure fluctuations will inevitably lead to instability in the amount of liquid supplied, which in turn affects the uniformity and accuracy of the deposition effect, which is a serious challenge for micro-nano processing; the air path in the pneumatic drive system is easily blocked due to the accumulation of tiny particles or impurities, affecting the continuity of the experiment and the accuracy of the results; finally, the pneumatic liquid supply system usually needs to be equipped with complex control equipment and pipelines, which not only increases the complexity of the system, but also increases the maintenance cost.

[0005] Therefore, a new technical solution is urgently needed in the prior art to solve this problem. Summary of the invention

[0006] The technical problem to be solved by the present invention is to provide a localized electrochemical deposition device and a working method driven by a flexible mechanism to supply liquid, so as to solve the technical problems of slow response speed, unstable liquid supply, blockage of the gas path affecting the continuity of the experiment and the accuracy of the results, and complex control equipment and pipelines in the gas pressure system for supplying electrolyte.

[0007] A localized electrochemical deposition device with liquid feeding driven by a flexible mechanism comprises an operating platform and an electrochemical deposition device body, wherein the operating platform comprises a vibration isolation platform and a displacement platform control system fixed on the vibration isolation platform, an electrochemical workstation and a general control system; the electrochemical deposition device body comprises an electrochemical deposition device base, a precision X-axis system, a precision Y-axis system, a precision Z-axis system, an electrode moving unit, an electrode unit and a cleaning buffer unit; a groove is provided in the middle of the electrochemical deposition device base, and a slide rail is provided in the groove for smooth movement of the electrode moving unit and the cleaning buffer unit; the electrode moving unit is arranged on the slide rail of the electrochemical deposition device base, and is used to accurately move the electrode unit to a specified position; the electrode unit is arranged on the electrode moving unit, carries a material to be processed, and is connected to the electrochemical workstation to realize electrochemical deposition; the electrochemical workstation is used to provide an electric field required for electrochemical deposition; the general control system is respectively connected to the displacement platform control system, the electrochemical workstation, the precision X-axis system, the precision Y-axis system, the precision Z-axis system and the electrode moving unit;

[0008] The localized electrochemical deposition device driven by a flexible mechanism to feed liquid also includes a flexible hinge liquid feeding processing system, the flexible hinge liquid feeding processing system includes a liquid storage tank, a polyurethane film, a flexible hinge, piezoelectric ceramics, and an electrochemical processing probe; the liquid storage tank stores the solution required for electrochemical deposition; the polyurethane film horizontally covers the upper part of the liquid storage tank; the fixed end of the flexible hinge is fixedly connected to the precision Z-axis system through a fixed component, and the force-applying end of the flexible hinge presses against the middle of the polyurethane film;

[0009] The operating platform also includes a piezoelectric ceramic driver; the piezoelectric ceramic driver is connected to the piezoelectric ceramic and controls the deformation of the piezoelectric ceramic; the piezoelectric ceramic is installed in a groove opened in the center of the flexible hinge, and the piezoelectric ceramic is deformed to push the force-applying end of the flexible hinge to extrude the polyurethane film; the electrochemical machining probe is installed at the lower part of the liquid storage tank and receives and outputs the solution required for electrochemical deposition pushed by the flexible hinge.

[0010] The relationship between the volume ΔV of the solution required for electrochemical deposition output by the electrochemical machining probe and the driving voltage V of the piezoelectric ceramic driver is as follows:

[0011] ΔV≈DAR·A·d v ·V;

[0012] Where, d v is the piezoelectric constant of the piezoelectric ceramic, A is the effective drainage area on the upper part of the liquid storage tank; DAR is the displacement amplification ratio of the flexible hinge;

[0013] The formula for effective drainage area A is as follows:

[0014] A=∫g(x c )dxc ;

[0015] In the formula, g(x c ) is the shape function of the upper opening of the liquid storage tank, and x is the independent variable defined along the horizontal direction of the film;

[0016] The formula of the flexible hinge displacement amplification ratio DAR is as follows:

[0017]

[0018] Where, d1 and d2 are the input arm length and output arm length respectively; P1 is the integral of the longitudinal flexibility of the hinge; P2 is the integral of the bending flexibility of the hinge; P3 is the integral of the bending flexibility related to the hinge position; G is the shear modulus of the hinge material.

[0019] The formulas of P1, P2, and P3 are as follows:

[0020]

[0021] Where y(x) is the shape function of the hinge profile, x is the lateral coordinate along the hinge length, and d l is the hinge thickness and l0 is the half length of the hinge.

[0022] The flexible hinge liquid feeding processing system also includes a Z-axis bracket, a sealing ring and a bracket cover; the sealing ring is installed on the outer periphery of the polyurethane film; the Z-axis bracket is fixedly connected to the precision Z-axis system; one end of the bracket cover is fixedly installed on the upper part of the Z-axis bracket to constitute the fixed component, and the other end of the bracket cover is provided with a through hole; a protrusion matching the shape of the liquid storage tank is provided on the lower outer side of the through hole, and the inner side of the protrusion abuts against the outer side of the sealing ring.

[0023] The flexible hinge liquid feeding processing system also includes a top view camera; the top view camera is arranged on one side of the fixed component.

[0024] The working method of the localized electrochemical deposition device driven by a flexible mechanism to supply liquid comprises the following steps, and the following steps are performed in sequence:

[0025] Step 1: Place the copper-plated silicon wafer in a beaker containing acetone and clean it for 15 minutes using an ultrasonic cleaner; then transfer the copper-plated silicon wafer to a beaker containing deionized water and continue ultrasonic cleaning for 5 minutes;

[0026] Step 2: Use tweezers to mount the copper-plated silicon wafer on the electrode unit, connect the electrode unit to the electrochemical workstation, and start the electrochemical workstation;

[0027] Step 3: Place the electrochemical probe tightly on the bottom of the liquid storage tank, fill the liquid storage tank with 0.5M CuSO4 solution, and seal it with a polyurethane film;

[0028] Step 4: Install the liquid storage tank into the device and fix it;

[0029] Step 5: Add 0.5M H2SO4 solution into the electrode unit to immerse the copper-plated silicon wafer installed in step 2, and add deionized water and 0.5M H2SO4 solution into the cleaning buffer unit;

[0030] Step 6: Start the displacement platform control system and the piezoelectric ceramic driver, move the electrochemical machining probe to the deionized water in the cleaning buffer unit, and push the flexible hinge to act on the polyurethane film by controlling the driving voltage output by the piezoelectric ceramic driver, so that CuSO4 fills the electrochemical machining probe;

[0031] Step 7: Move the electrode displacement unit under the electrochemical machining probe to start electrochemical additive manufacturing. The overall control system first calculates the liquid volume ΔV to be output according to the machining parameters, and then outputs the relationship between the solution volume ΔV required for electrochemical deposition and the driving voltage V of the piezoelectric ceramic driver through the electrochemical machining probe. The driving voltage V value of the piezoelectric ceramic driver is obtained by reverse calculation, and a control signal is output to drive the piezoelectric ceramic. The deposition is monitored through a top-view camera. The top-view camera is only used to observe the deposition morphology in real time and does not participate in calculation or closed-loop control:

[0032] The relationship between the solution volume ΔV required for electrochemical deposition output by the electrochemical machining probe and the driving voltage V of the piezoelectric ceramic driver is as follows:

[0033] ΔV≈DAR·A·d v B;

[0034] Where, d v is the piezoelectric constant of the piezoelectric ceramic, A is the effective drainage area on the upper part of the liquid storage tank;

[0035] The formula for effective drainage area A is as follows:

[0036] A=∫g(x c )dx c

[0037] In the formula, g(x c ) is the shape function of the upper opening of the liquid storage tank, and x is the independent variable defined along the horizontal direction of the film;

[0038] DAR is the displacement amplification ratio of the flexible hinge, and its formula is as follows:

[0039]

[0040] Where, d1 and d2 are the input arm length and output arm length respectively; P1 is the integral of the longitudinal flexibility of the hinge; P2 is the integral of the bending flexibility of the hinge; P3 is the integral of the bending flexibility related to the hinge position; G is the shear modulus of the hinge material.

[0041] The formulas of P1, P2, and P3 are as follows:

[0042]

[0043] Where y(x) is the shape function of the hinge profile, x is the lateral coordinate along the hinge length, and d l is the hinge thickness and l0 is the half length of the hinge.

[0044] Through the above design scheme, the present invention can bring the following beneficial effects:

[0045] 1. Avoid unstable liquid supply caused by air pressure fluctuations

[0046] The conventional electrochemical deposition device uses a pneumatic drive system, which is easily affected by the external environment, resulting in unstable liquid supply. The present invention uses a flexible hinge liquid feeding processing system, and uses precise control of the mechanical structure to replace the pneumatic drive, which effectively avoids the influence of pneumatic pressure fluctuations on the stability of liquid supply and ensures the continuity of liquid supply.

[0047] 2. Reduce the risk of blockage

[0048] The gas path in the traditional pneumatic drive system is easily blocked due to the accumulation of tiny particles or impurities, affecting the continuity of the experiment and the accuracy of the results. The flexible hinge liquid feeding processing system does not rely on air pressure, and achieves liquid flow through precise control of the mechanical structure, fundamentally avoiding the problem of gas path blockage and ensuring unimpeded liquid supply.

[0049] 3. Achieve high-precision control

[0050] The flexible hinge has the advantages of flexibility and high-precision control. Combined with the precise drive of piezoelectric ceramics, the present invention can achieve micron-level or even nano-level control of the liquid supply. High-precision control is crucial to the accuracy of the electrochemical deposition process, which can ensure that the thickness and uniformity of the deposited layer meet the predetermined requirements and improve the quality and performance of the deposited layer. BRIEF DESCRIPTION OF THE DRAWINGS

[0051] The present invention is further described below with reference to the accompanying drawings and specific embodiments:

[0052] Figure 1 It is a schematic diagram of the overall structure of the localized electrochemical deposition device in the flexible mechanism driven liquid feeding and the working method of the localized electrochemical deposition device of the present invention;

[0053] Figure 2 It is a schematic diagram of the overall structure of the localized electrochemical deposition device in the flexible mechanism driven liquid feeding and the working method of the localized electrochemical deposition device of the present invention;

[0054] Figure 3 It is a structural schematic diagram of a flexible hinge liquid feeding processing system in a localized electrochemical deposition device and working method for liquid feeding driven by a flexible mechanism of the present invention;

[0055] Figure 4 It is a schematic cross-sectional structure diagram of a flexible hinge liquid feeding processing system in a localized electrochemical deposition device and working method driven by a flexible mechanism for liquid feeding of the present invention.

[0056] In the figure, 1-operating platform, 2-electrodeposition device body, 3-flexible hinge driven liquid feeding device, 101-vibration isolation platform, 102-displacement platform control system, 103-electrochemical workstation, 104-piezoelectric ceramic driver, 105-general control system, 201-electrodeposition device base, 202-precision X-axis system, 203-precision Y-axis system, 204-precision Z-axis system, 205-electrode moving unit, 206-electrode unit, 207-cleaning buffer unit, 301-Z-axis bracket, 302-liquid storage tank, 303-polyurethane film, 304-sealing ring, 305-bracket cover, 306-flexible hinge, 307-piezoelectric ceramic, 308-electrochemical processing probe, 309-top view camera. DETAILED DESCRIPTION

[0057] like Figure 1 and Figure 2 As shown, a localized electrochemical deposition device driven by a flexible mechanism to supply liquid comprises an operating platform 1, an electro-deposition device body 2 and a flexible hinge liquid supply processing system 3.

[0058] The operating platform 1 includes a vibration isolation platform 101, a displacement platform control system 102, an electrochemical workstation 103, a piezoelectric ceramic driver 104 and a general control system 105. The vibration isolation platform 101 serves as a stable base for the device, effectively isolating external vibrations and ensuring stable operation of the device. All key components of the device are fixed on this platform; the displacement platform control system 102 achieves precise movement of the processing device by precisely controlling the X-axis system 202, the Y-axis system 203 and the Z-axis system 204; the electrochemical workstation 103 and the general control system 105 are installed on the left side of the vibration isolation platform 101, and are responsible for providing the electric field required for electrochemical deposition; the piezoelectric ceramic driver 104 is connected to the piezoelectric ceramic 307, and drives the flexible hinge 306 to achieve stable supply of liquid by precisely controlling its deformation; this part is the control part of the entire device.

[0059] The electrodeposition device body 2 includes an electrodeposition device base 201, a precision X-axis system 202, a precision Y-axis system 203, a precision Z-axis system 204, an electrode moving unit 205, an electrode unit 206, and a cleaning buffer unit 207. The electrodeposition device base 201 is designed as a rectangular parallelepiped with a central slot, and has a built-in slide rail for smooth movement of the electrode moving unit 205 and the cleaning buffer unit 207; the precision X-axis system 202, the precision Y-axis system 203, and the precision Z-axis system 204 are respectively responsible for the lateral and longitudinal movement in the horizontal plane and the precise adjustment in the vertical direction to ensure the processing accuracy; the electrode moving unit 205 is arranged on the slide rail of the electrodeposition device base 201, and is used to accurately move the electrode unit 206 to a specified position; the electrode unit 206 is arranged on the electrode moving unit 205, carries the material to be processed, and is connected to the electrochemical workstation 103 to realize electrochemical deposition; the cleaning buffer unit 207 is arranged on the slide rail of the electrodeposition device base 201, and provides cleaning and buffer for cleaning and preparation of the electrochemical processing probe 308.

[0060] The flexible hinge liquid feeding processing system 3 includes a Z-axis bracket 301, a liquid storage tank 302, a polyurethane film 303, a sealing ring 304, a bracket cover 305, a flexible hinge 306, a piezoelectric ceramic 307, an electrochemical processing probe 308 and a top view camera 309. The Z-axis bracket 301 is fixed on the precision Z-axis system 204 to provide support for the liquid storage tank 302 and other components; the liquid storage tank 302 is installed in the Z-axis bracket 301 and is designed to have a maximum capacity of 150 ml for storing the solution required for electrochemical deposition; Figure 3 and Figure 4 As shown, the polyurethane film 303 is horizontally arranged above the liquid storage tank 302, as a flexible sealing layer, covering the liquid storage tank, and directly contacting the flexible hinge 306 to push the liquid; the sealing ring 304 is tightly fitted to the outer side of the polyurethane film 303 to ensure the sealing of the liquid storage tank 302 and prevent pressure leakage; the bracket cover 305 is fixed to the Z-axis bracket 301 by quick-release bolts, and the protrusion below it is designed to further compress the sealing ring 304 to enhance the sealing effect; the flexible hinge 306 is installed on the bracket cover 305, and its application The force end is precisely pressed against the polyurethane film 303 to push the liquid through deformation; the piezoelectric ceramic 307 is installed in the central groove of the flexible hinge 306, and under the control of the piezoelectric ceramic driver 104, it produces precise deformation to push the flexible hinge 306 to work; the electrochemical machining probe 308 is installed under the liquid storage tank 302 to receive and export the liquid pushed by the flexible hinge 306 to achieve localized electrochemical deposition; the top view camera 309 is set on one side of the Z-axis bracket 301 to monitor the deposition situation during the machining process in real time to ensure machining accuracy.

[0061] The working method of the localized electrochemical deposition device driven by a flexible mechanism to supply liquid comprises the following steps:

[0062] Step 1: Place the copper-plated silicon wafer in a beaker containing acetone and clean it using an ultrasonic cleaner for 3 minutes; then, transfer it to a beaker containing deionized water and continue ultrasonic cleaning for 5 minutes.

[0063] Step 2: Use tweezers to mount the copper-plated silicon wafer on the electrode unit 206 , connect the electrode unit 206 to the electrochemical workstation 103 , and start the electrochemical workstation 103 .

[0064] Step 3: Remove the fixing screws of the bracket cover 305, take out the liquid storage tank 302 installed on the Z-axis bracket 301, tightly cover the electrochemical probe 308 at the bottom of the liquid storage tank 302, inject 100 ml of 0.5M CuSO4 solution into the liquid storage tank 302, and seal the polyurethane film 303 on the liquid storage tank 302 with the sealing ring 304.

[0065] Step 4: Put the liquid storage tank 302 back into the Z-axis bracket 301, cover the bracket cover 305 and tighten the fixing screws.

[0066] Step 5: Add 0.5M H2SO4 solution into the electrode unit 206 to immerse the copper-plated silicon wafer installed in step 2, and add deionized water and 0.5M H2SO4 solution into the buffer cleaning unit.

[0067] Step six: start the displacement platform control system 102 and the piezoelectric ceramic driver 104, move the electrochemical machining probe 308 into the deionized water of the buffer cleaning unit, and bend the flexible hinge 306 by controlling the driving voltage of the piezoelectric ceramic 307, thereby compressing the polyurethane film 303, so that CuSO4 fills the electrochemical machining probe 308.

[0068] Step 7: Move the electrode displacement unit to the electrochemical machining probe 308 to start electrochemical additive manufacturing. The overall control system 105 first calculates the volume of liquid to be output ΔV according to the machining parameters. The upper opening of the liquid storage tank 302 is circular, so the formula The driving voltage V value of the piezoelectric ceramic driver 104 is obtained by reverse deduction, and a control signal is output to drive the piezoelectric ceramic 307, and the deposition situation is monitored through the top-view camera 309. The top-view camera 309 is only used to observe the deposition morphology in real time and does not participate in calculation or closed-loop control.

[0069] The present invention designs a localized electrochemical deposition device based on a flexible mechanism to drive liquid supply, effectively solves the problems of unstable liquid supply and easy clogging in the traditional electrochemical deposition process, realizes stable, continuous and accurate liquid supply, and provides a reliable liquid environment for the electrochemical deposition process. The device has the advantages of simple structure, convenient operation, high processing accuracy, etc., and has broad application prospects in the field of micro-nano manufacturing.

Claims

1. A localized electrochemical deposition device for liquid feeding driven by a flexible mechanism, comprising an operating platform (1) and an electrochemical deposition device body (2), wherein the operating platform (1) comprises a vibration isolation platform (101) and a displacement platform control system (102) fixed on the vibration isolation platform (101), an electrochemical workstation (103) and a general control system (105); the electrochemical deposition device body (2) comprises an electrochemical deposition device base (201), a precision X-axis system (202), a precision Y-axis system (203), a precision Z-axis system (204), an electrode moving unit (205), an electrode unit (206) and a cleaning buffer unit (207); a groove is provided in the middle of the electrochemical deposition device base (201), and a slide rail is provided in the groove for the electrode moving unit (205) to move the electrode moving unit (206) and the cleaning buffer unit (207). and the cleaning buffer unit (207) move smoothly; the electrode moving unit (205) is arranged on the slide rail of the electrodeposition device base (201) and is used to accurately move the electrode unit (206) to a specified position; the electrode unit (206) is arranged on the electrode moving unit (205) and carries the material to be processed, and the electrode unit (206) is connected to the electrochemical workstation (103) to achieve electrochemical deposition; the electrochemical workstation (103) is used to provide the electric field required for electrochemical deposition; the overall control system (105) is respectively connected to the displacement platform control system (102), the electrochemical workstation (103), the precision X-axis system (202), the precision Y-axis system (203), the precision Z-axis system (204) and the electrode moving unit (205); Its characteristics are: It also includes a flexible hinge liquid feeding processing system (3), the flexible hinge liquid feeding processing system (3) including a liquid storage tank (302), a polyurethane film (303), a flexible hinge (306), a piezoelectric ceramic (307), and an electrochemical processing probe (308); the liquid storage tank (302) stores the solution required for electrochemical deposition; the polyurethane film (303) horizontally covers the upper part of the liquid storage tank (302); the fixed end of the flexible hinge (306) is fixedly connected to the precision Z-axis system (204) through a fixing component, and the force-applying end of the flexible hinge (306) is pressed against the middle part of the polyurethane film (303); The operating platform (1) also includes a piezoelectric ceramic driver (104); the piezoelectric ceramic driver (104) is connected to the piezoelectric ceramic (307) and controls the deformation of the piezoelectric ceramic (307); the piezoelectric ceramic (307) is installed in a groove body opened in the center of the flexible hinge (306), and the piezoelectric ceramic (307) is deformed to push the force-applying end of the flexible hinge (306) to extrude the polyurethane film (303); the electrochemical processing probe (308) is installed at the lower part of the liquid storage tank (302) and receives and guides the solution required for electrochemical deposition pushed by the flexible hinge (306).

2. The localized electrochemical deposition device with flexible mechanism driven liquid feeding according to claim 1 is characterized in that: The relationship between the volume ΔV of the solution required for electrochemical deposition output by the electrochemical machining probe (308) and the driving voltage V of the piezoelectric ceramic driver (104) is as follows: ΔV≈DAR·A·d v ·V; Where, d v is the piezoelectric constant of the piezoelectric ceramic, A is the effective liquid discharge area of ​​the upper part of the liquid storage tank (302); DAR is the displacement amplification ratio of the flexible hinge; The formula for effective drainage area A is as follows: A=∫g(x c )dx c ; In the formula, g(x c ) is a shape function of the upper opening of the liquid storage tank (302), and x is an independent variable defined along the horizontal direction of the film; The formula of the flexible hinge displacement amplification ratio DAR is as follows: Where, d1 and d2 are the input arm length and output arm length respectively; P1 is the integral of the longitudinal flexibility of the hinge; P2 is the integral of the bending flexibility of the hinge; P3 is the integral of the bending flexibility related to the hinge position; G is the shear modulus of the hinge material.

3. The localized electrochemical deposition device with flexible mechanism driven liquid feeding according to claim 2 is characterized by: The formulas of P1, P2, and P3 are as follows: Where y(x) is the shape function of the hinge profile, x is the lateral coordinate along the hinge length, and d l is the hinge thickness and l0 is the half length of the hinge.

4. The localized electrochemical deposition device with flexible mechanism driven liquid feeding according to claim 1 is characterized by: The flexible hinge liquid feeding processing system (3) also includes a Z-axis bracket (301), a sealing ring (304) and a bracket cover plate (305); the sealing ring (304) is installed on the outer periphery of the polyurethane film (303); the Z-axis bracket (301) is fixedly connected to the precision Z-axis system (204); one end of the bracket cover plate (305) is fixedly installed on the upper part of the Z-axis bracket (301) to form the fixed component, and the other end of the bracket cover plate (305) is provided with a through hole; a protrusion matching the shape of the liquid storage tank (302) is provided on the outer side of the lower part of the through hole, and the inner side of the protrusion abuts against the outer side of the sealing ring (304).

5. The localized electrochemical deposition device with flexible mechanism driven liquid feeding according to claim (1), characterized in that: The flexible hinge liquid feeding processing system (3) further comprises a top view camera (309); the top view camera (309) is arranged on one side of the fixed component.

6. A method for operating a localized electrochemical deposition device with a flexible mechanism driven to supply liquid, using the localized electrochemical deposition device with a flexible mechanism driven to supply liquid as claimed in claim 1, characterized in that: The process includes the following steps, which are performed in sequence: Step 1: Place the copper-plated silicon wafer in a beaker containing acetone and clean it with an ultrasonic cleaner for (3) minutes; then transfer the copper-plated silicon wafer to a beaker containing deionized water and continue ultrasonic cleaning for (5) minutes; Step 2: Use tweezers to mount the copper-plated silicon wafer on the electrode unit (206), connect the electrode unit (206) to the electrochemical workstation (103), and start the electrochemical workstation (103); Step 3: tightly cover the electrochemical probe (308) at the bottom of the liquid storage tank (302), fill the liquid storage tank (302) with 0.5M CuSO4 solution, and seal it with a polyurethane film (303); Step 4: Install the liquid storage tank (302) into the device and fix it; Step 5: Add 0.5M H2SO4 solution into the electrode unit (206) to immerse the copper-plated silicon wafer installed in step 2, and add deionized water and 0.5M H2SO4 solution into the cleaning buffer unit (207); Step 6: Start the displacement platform control system (102) and the piezoelectric ceramic driver (104), move the electrochemical machining probe (308) into the deionized water of the cleaning buffer unit (207), and push the flexible hinge (306) to act on the polyurethane film (303) by controlling the driving voltage output by the piezoelectric ceramic driver (104), so that CuSO4 fills the electrochemical machining probe (308); Step 7: Move the electrode displacement unit (205) to the electrochemical machining probe (308) to start electrochemical additive manufacturing, wherein the overall control system (105) first calculates the liquid volume ΔV to be output according to the machining parameters, and then outputs the relationship formula between the solution volume ΔV required for electrochemical deposition and the driving voltage V of the piezoelectric ceramic driver (104) through the electrochemical machining probe (308), reversely calculates the driving voltage V value of the piezoelectric ceramic driver (104), and outputs a control signal to drive the piezoelectric ceramic (307), and monitors the deposition through the top view camera (309), which is only used to observe the deposition morphology in real time and does not participate in calculation or closed-loop control: The relationship between the volume ΔV of the solution required for electrochemical deposition output by the electrochemical machining probe (308) and the driving voltage V of the piezoelectric ceramic driver (104) is as follows: ΔV≈DAR·A·d v ·V; Where, d v is the piezoelectric constant of the piezoelectric ceramic, and A is the effective liquid discharge area at the top of the liquid storage tank (302); The formula for effective drainage area A is as follows: A=∫g(x c )dx c In the formula, g(x c ) is a shape function of the upper opening of the liquid storage tank (302), and x is an independent variable defined along the horizontal direction of the film; DAR is the displacement amplification ratio of the flexible hinge, and its formula is as follows: Where, d1 and d2 are the input arm length and output arm length respectively; P1 is the integral of the longitudinal flexibility of the hinge; P2 is the integral of the bending flexibility of the hinge; P3 is the integral of the bending flexibility related to the hinge position; G is the shear modulus of the hinge material.

7. The working method of the localized electrochemical deposition device with flexible mechanism driven liquid feeding according to claim 6 is characterized by: The formulas of P1, P2, and P3 are as follows: Where y(x) is the shape function of the hinge profile, x is the lateral coordinate along the hinge length, and d l is the hinge thickness and l0 is the half length of the hinge.

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