Controller, air conditioner outdoor unit and air conditioner

Abstract

The invention particularly discloses a controller, an air conditioner outdoor unit and an air conditioner, the controller comprises a circuit board, a module assembly, a radiator and a support, the module assembly is arranged on the circuit board, and the module assembly comprises a second power module used for driving a second fan and a third power module used for driving a compressor; the second power module and the third power module abut against the radiator. The height of the second power module is smaller than that of the third power module, the radiator is provided with a first step surface and a second step surface, the first step surface abuts against the second power module, and the second step surface abuts against the third power module; the bracket is fixedly arranged on the circuit board and is arranged between the circuit board and the radiator so as to support the module assembly; the controller can give consideration to heat dissipation effects of different power modules, and the working reliability of the controller is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of air conditioning, and in particular to a controller, an air conditioning outdoor unit and an air conditioner. Background Art

[0002] The controller is the core component of the air conditioner. For an air conditioner outdoor unit with an external fan, the controller needs at least two independent power modules to drive the fan and the compressor respectively. The power module generates a large amount of heat, and the controller also needs to be equipped with a radiator to dissipate the heat of the power module. However, in the related art, the radiator cannot dissipate heat for two different power modules at the same time, which often causes the temperature of one power module to be too high, triggering the temperature protection and stopping the work, affecting the reliability of the air conditioner. Summary of the invention

[0003] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention proposes a controller that can take into account the heat dissipation effect of different power modules and improve the working reliability of the controller.

[0004] The present invention also provides an air-conditioning outdoor unit and an air-conditioner having the controller.

[0005] A controller according to an embodiment of the first aspect of the present invention comprises a circuit board, a module assembly, a heat sink and a bracket, wherein: The module assembly is arranged on the circuit board, and the module assembly includes a second power module for driving a second fan and a third power module for driving a compressor; The second power module and the third power module are both in contact with the heat sink; the height of the second power module is less than that of the third power module, and the heat sink is provided with a first step surface and a second step surface, the first step surface is in contact with the second power module, and the second step surface is in contact with the third power module; The bracket is fixed to the circuit board and is arranged between the circuit board and the heat sink to support the third power module.

[0006] According to the controller of the embodiment of the present invention, there are at least the following beneficial effects: the module assembly arranged on the circuit board includes a second power module and a third power module, the third power module is used to drive the compressor, and the second power module is used to drive the second fan. The power of the compressor is often greater than that of the second fan, so the size of the third power module is often larger, and the height of the third power module is relatively high. By arranging a first step surface and a second step surface with different heights on the radiator, the first step surface abuts against the second power module, and the second step surface abuts against the third power module, so that the radiator can have a good fit with the second power module and the third power module at the same time, and the contact area is also large, and the heat of the second power module and the third power module can be better transferred to the radiator; in addition, a bracket is arranged between the circuit board and the radiator to support the third power module, so as to avoid the third power module being subjected to a large pressure from the radiator due to its high height, thereby avoiding the occurrence of the situation such as the position displacement of the third power module or the loosening of the pins of the third power module caused by excessive pressure; the controller can take into account the heat dissipation effect of different power modules and improve the working reliability of the controller.

[0007] According to one embodiment of the present invention, the heat sink is in the shape of a rectangular plate, the length direction of the second power module and the third power module is the same as the length direction of the heat sink, and the second power module and the third power module are arranged in sequence along the length direction of the heat sink.

[0008] According to one embodiment of the present invention, the module assembly also includes a rectifier module, an insulated gate bipolar transistor module and a fast recovery diode module arranged on the circuit board, and the rectifier module, the insulated gate bipolar transistor module and the fast recovery diode module are arranged in sequence along the length direction of the heat sink and are all abutted against the heat sink.

[0009] According to an embodiment of the present invention, the bracket extends along the length direction of the radiator.

[0010] According to one embodiment of the present invention, the bracket is provided with a third slot body matching the third power module, a fourth slot body matching the insulated gate bipolar transistor module, a fifth slot body matching the fast recovery diode module and a sixth slot body matching the rectifier module.

[0011] According to an embodiment of the present invention, the third trough body, the fourth trough body, the fifth trough body and the sixth trough body are sequentially arranged along the length direction of the heat sink.

[0012] According to an embodiment of the present invention, the circuit board is provided with a second current loop connected to the second power module, and a third current loop connected to the third power module.

[0013] According to one embodiment of the present invention, the second current loop includes a first capacitor for filtering and stabilizing voltage, a third capacitor for filtering out high-frequency interference signals, and a second sampling resistor for sampling the second fan current; the first capacitor is electrically connected to the third capacitor, the third capacitor is electrically connected to the second sampling resistor, and the third capacitor and the second sampling resistor are both electrically connected to the second power module.

[0014] According to one embodiment of the present invention, the third current loop includes a second capacitor for filtering and voltage stabilization, a fourth capacitor for filtering out high-frequency interference signals, and a third sampling resistor for sampling the compressor current; the second capacitor is electrically connected to the fourth capacitor, the fourth capacitor is electrically connected to the third sampling resistor, and the fourth capacitor and the third sampling resistor are both electrically connected to the third power module.

[0015] According to an embodiment of the present invention, a height of the first step surface relative to the upper surface of the heat sink is greater than a height of the second step surface relative to the upper surface of the heat sink.

[0016] According to an embodiment of the present invention, the width of the second power module is smaller than the width of the third power module, and the width of the first step surface is smaller than the width of the second step surface.

[0017] An air-conditioning outdoor unit according to an embodiment of the second aspect of the present invention comprises a controller according to an embodiment of the first aspect of the present invention.

[0018] According to an embodiment of the present invention, the air conditioner outdoor unit further comprises an electric control box, the controller is installed in the electric control box, and the module assembly is located on the side of the circuit board facing the bottom wall of the electric control box.

[0019] An air conditioner according to an embodiment of the third aspect of the present invention comprises an air conditioner outdoor unit according to the embodiment of the second aspect of the present invention.

[0020] Additional aspects and advantages of the present invention will be given in part in the following description and in part will be obvious from the following description, or will be learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The present invention will be further described below with reference to the accompanying drawings and embodiments, wherein: Figure 1 A schematic diagram of the layout of a controller module assembly, a rectifier module, an insulated gate bipolar transistor module and a fast recovery diode module installed on a circuit board according to an embodiment of the present invention; Figure 2 A schematic diagram of a first current loop of a controller according to an embodiment of the present invention; Figure 3 A schematic diagram of a second current loop of a controller according to an embodiment of the present invention; Figure 4 A schematic diagram of a third current loop of a controller according to an embodiment of the present invention; Figure 5 It is an exploded schematic diagram of a controller according to an embodiment of the present invention; Figure 6 It is a schematic diagram of an exploded view of a controller according to an embodiment of the present invention from another angle; Figure 7 An exploded side view of a controller according to an embodiment of the present invention.

[0022] Reference numerals: Controller 1000; Circuit board 100; second screw hole 110; Module assembly 200; first power module 210; first current loop 211; first capacitor 2111; third capacitor 2112; first sampling resistor 2113; first bootstrap circuit 212; second power module 220; second current loop 221; second sampling resistor 2211; second bootstrap circuit 222; output line 223; third power module 230; third current loop 231; second capacitor 2311; fourth capacitor 2312; third sampling resistor 2313; third bootstrap circuit 232; Radiator 300; first step surface 311; second step surface 312; first screw hole 320; mounting groove 330; Rectifier module 410; Insulated gate bipolar transistor module 420; Fast recovery diode module 430; Bracket 500; first slot body 510; second slot body 520; third slot body 530; first support plate 532; first through hole 5321; fourth slot body 540; second support plate 542; second through hole 5421; fifth slot body 550; third support plate 552; third through hole 5521; sixth slot body 560; fourth support plate 562; fourth through hole 5621; third screw hole 570. DETAILED DESCRIPTION

[0023] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0024] In the description of the present invention, it is necessary to understand that descriptions involving orientations, such as up, down, inside, outside, etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0025] In the description of the present invention, if there is a description of first and second, it is only for the purpose of distinguishing the technical features, and cannot be understood as indicating or implying the relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0026] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.

[0027] As we all know, the controller is the core component of the air conditioner. For an air conditioner outdoor unit with an external fan, the controller needs at least two independent power modules to drive the fan and the compressor respectively. The power module generates a large amount of heat, and the controller also needs to be equipped with a radiator to dissipate the heat of the power module. However, in the related art, the radiator cannot dissipate heat for two different power modules at the same time, which often causes a power module to overheat and trigger the temperature protection and stop working, affecting the reliability of the air conditioner.

[0028] To this end, an embodiment of the first aspect of the present invention provides a controller 1000, specifically referring to the accompanying drawings of the specification. Figures 1 to 7 shown.

[0029] Reference Figure 1 As shown, a controller 1000 according to an embodiment of the present invention includes a circuit board 100 and a module assembly 200. Figure 1As shown, the module assembly 200 is arranged on the circuit board 100, and the module assembly 200 includes a first power module 210, a second power module 220 and a third power module 230. Among them, the first power module 210 is used to drive the first fan, the second power module 220 is used to drive the second fan, and the third power module 230 is used to drive the compressor. It should be noted that the first fan and the second fan are both variable frequency fans, the compressor is a variable frequency compressor, and the first power module 210, the second power module 220 and the third power module 230 are all intelligent power modules (Intelligent Power Module, IPM). It can be understood that the intelligent power module is small in size and high in reliability, and can meet the needs of driving variable frequency fans and variable frequency compressors. It can be understood that the first power module 210, the second power module 220 and the third power module 230 all have pins (not shown in the figure), and the pins are all soldered to the circuit board 100 by wave soldering. Wave soldering refers to the process of jetting molten soft solder (such as lead-tin alloy) into a solder wave peak as required by the design through an electric pump or an electromagnetic pump. It can also be formed by injecting nitrogen into the solder pool, so that a printed circuit board (i.e., the circuit board 100 in the embodiment of the present invention) pre-installed with components (such as the first power module 210, the second power module 220, and the third power module 230 in the embodiment of the present invention) passes through the solder wave peak to achieve soft soldering of mechanical and electrical connections between the component soldering ends or pins and the printed circuit board pads.

[0030] Reference Figure 1 and Figure 2 As shown, in a controller 1000 according to an embodiment of the present invention, the circuit board 100 is provided with a first current loop 211, and the first current loop 211 is connected to the first power module 210 and supplies power to the first power module 210, so that the first power module 210 drives the first fan; in one embodiment, the circuit structure of the first current loop 211 includes a first capacitor 2111, a third capacitor 2112 and a first sampling resistor 2113. Among them, the first capacitor 2111 is an electrolytic capacitor, which plays a role in filtering and stabilizing voltage, the third capacitor 2112 is a bypass capacitor, which is used to filter out high-frequency interference signals, and the first sampling resistor 2113 is a current sampling resistor, which is used in the first current loop 211 to perform current sampling on the first fan. Refer to Figure 1 As shown, the circuit board 100 is provided with a first bootstrap circuit 212 , and the first bootstrap circuit 212 is connected to the first power module 210 to improve the working stability of the first power module 210 .

[0031] Reference Figure 1 and Figure 3As shown, in a controller 1000 of an embodiment of the present invention, the circuit board 100 is also provided with a second current loop 221, and the second current loop 221 is connected to the second power module 220 and supplies power to the second power module 220, so that the second power module 220 drives the second fan; in one embodiment, the circuit structure of the second current loop 221 includes a first capacitor 2111, a third capacitor 2112, and a second sampling resistor 2211. Among them, the first capacitor 2111 is an electrolytic capacitor, which plays a role in filtering and stabilizing voltage, the third capacitor 2112 is a bypass capacitor, which is used to filter out high-frequency interference signals, and the second sampling resistor 2211 is a current sampling resistor, which is used in the second current loop 221 to perform current sampling on the second fan. Refer to Figure 1 As shown, the circuit board 100 is provided with a second bootstrap circuit 222 , and the second bootstrap circuit 222 is connected to the second power module 220 to improve the working stability of the second power module 220 .

[0032] It should be noted that the first current loop 211 and the second current loop 221 share some circuit structures. Figure 1 , Figure 2 and Figure 3 As shown, in one embodiment, the circuit structure shared by the first current loop 211 and the second current loop 221 is the first capacitor 2111 and the third capacitor 2112. It can be understood that since the first current loop 211 and the second current loop 221 are both arranged on the circuit board 100, and the second current loop 221 and the first current loop 211 share part of the circuit structure, the total number of circuit structures arranged on the circuit board 100 is reduced, thereby reducing the area of ​​the circuit board 100 and reducing the production cost of the circuit board 100. It should be noted that the side of the circuit board 100 facing the module assembly 200 is the front side, and the other side is the back side. The circuit board 100 is also provided with an output line 223 connected to the second power module 220, the output line 223 is located on the front side of the circuit board 100, and the circuit of the circuit structure is located on the back side of the circuit board 100. It can be understood that through the above arrangement, the layout area of ​​the circuit board 100 is small, saving the material of the circuit board 100.

[0033] Reference Figure 1 and Figure 4As shown, in a controller 1000 of an embodiment of the present invention, the circuit board 100 is also provided with a third current loop 231, and the third current loop 231 is connected to the third power module 230 and supplies power to the third power module 230, so that the third power module 230 drives the compressor; in one embodiment, the circuit structure of the third current loop 231 includes a second capacitor 2311, a fourth capacitor 2312 and a third sampling resistor 2313. Among them, the second capacitor 2311 is an electrolytic capacitor, which plays a role in filtering and stabilizing voltage, the fourth capacitor 2312 is a bypass capacitor, which is used to filter out high-frequency interference signals, and the third sampling resistor 2313 is a current sampling resistor, which is used to sample the current of the compressor in the third current loop 231. Refer to Figure 1 As shown, the first capacitor 2111 is adjacent to the second capacitor 2311, making it more convenient to install the first capacitor 2111 and the second capacitor 2311. It can be understood that since the third current loop 231 is set separately from the first current loop 211 and the second current loop 221, that is, the third current loop 231 does not share the circuit structure with the first current loop 211 or the second current loop 221, the first power module 210 driving the first fan and the second power module 220 driving the second fan will not affect the current of the third power module 230 driving the compressor. Figure 1 As shown, the circuit board 100 is provided with a third bootstrap circuit 232 , and the third bootstrap circuit 232 is connected to the third power module 230 to improve the working stability of the third power module 230 .

[0034] Reference Figure 5 As shown, a controller 1000 of an embodiment of the present invention further includes a radiator 300, and the first power module 210, the second power module 220 and the third power module 230 are all in contact with the radiator 300 to dissipate heat through the radiator 300. It should be noted that the first power module 210, the second power module 220 and the third power module 230 are all arranged in a rectangular parallelepiped shape, and the above three power modules have two opposite faces with the largest area, one of which faces the electric control board, and the other face is in contact with the radiator 300. It can be understood that through the above arrangement, the heat generated by the first power module 210, the second power module 220 and the third power module 230 during operation can be transferred to the radiator 300 to the maximum extent, and dissipated through the radiator 300. In one embodiment, the radiator 300 is provided with a mounting groove 330 extending along its length direction, and the refrigerant pipe is installed in the mounting groove 330 to take away the heat absorbed by the radiator 300. In another embodiment, the radiator 300 is provided with a mounting hole (not shown in the figure) extending along the length direction thereof, and the refrigerant pipe is installed in the mounting hole to take away the heat absorbed by the radiator 300 .

[0035] Reference Figure 1 As shown, in a controller 1000 of an embodiment of the present invention, the circuit board 100 is in the shape of a rectangular plate, and the length of the circuit board 100 is a, which satisfies: 233mm≤a≤253mm. Within this range, the circuit board 100 can meet the requirement of arranging multiple power modules in the length direction. In one embodiment, the length of the circuit board 100 is 243mm. Figure 5 As shown, the heat sink 300 is also in the shape of a rectangular plate, and the length direction of the first power module 210, the second power module 220 and the third power module 230 is the same as the length direction of the heat sink 300, and the first power module 210, the second power module 220 and the third power module 230 are arranged in sequence along the length direction of the heat sink 300. It can be understood that, through the above arrangement, all places of the heat sink 300 can be utilized, the volume of the heat sink 300 is reduced, and thus the manufacturing and processing costs of the heat sink 300 are reduced. In one embodiment, the length direction of the heat sink 300 is the same as the length direction of the circuit board 100. It should be noted that the length direction of the circuit board 100 is the same as the wave crest direction of the controller 1000 during wave crest soldering. Since the first power module 210, the second power module 220 and the third power module 230 are arranged in sequence along the length direction of the heat sink 300 (i.e., along the length direction of the circuit board 100), the one-time wave crest rate is improved, the pin soldering of the above three modules is reduced, and the production efficiency is improved.

[0036] Reference Figure 6 As shown, in a controller 1000 according to an embodiment of the present invention, the height of the first power module 210 is equal to that of the second power module 220, and is less than that of the third power module 230, and the heat sink 300 is provided with a first step surface 311 and a second step surface 312. It can be understood that the first step surface 311 and the second step surface 312 are both provided on the side of the heat sink 300 facing the circuit board 100. Among them, the first step surface 311 abuts against the first power module 210 and the second power module 220, and the second step surface 312 abuts against the third power module 230, that is, the height difference between the first step surface 311 and the second step surface 312 is approximately equal to the height difference between the third power module 230 and the first power module 210, or the height difference between the first step surface 311 and the second step surface 312 is approximately equal to the height difference between the third power module 230 and the second power module 220, combined with Figure 6 It can be seen that the height of the first step surface 311 relative to the upper surface of the heat sink 300 is greater than the height of the second step surface 312 relative to the upper surface of the heat sink 300; Figure 5 and Figure 6It can be seen that the width of the second power module 220 is smaller than the width of the third power module 230, the width 311 of the first step surface is smaller than the width of the second step surface 312, and the sizes of the two step surfaces match the sizes of the two power modules respectively, reducing the volume of the heat sink 300, thereby reducing the manufacturing and processing costs of the heat sink 300. It can be understood that by setting the first step surface 311 and the second step surface 312, the first power module 210, the second power module 220 and the third power module 230 can all contact the heat sink 300, and transfer the heat generated during operation to the heat sink 300 for heat dissipation. It should be noted that, according to the specific heights of the first power module 210, the second power module 220 and the third power module 230, the heat sink 300 can be set as a plane without a step surface, or multiple step surfaces can be set, which is not specifically limited here.

[0037] It should be noted that, in the controller 1000 provided in the embodiment of the present invention, the module assembly 200 arranged on the circuit board 100 includes a second power module 220 and a third power module 230, the third power module 230 is used to drive the compressor, and the second power module 220 is used to drive the second fan. The power of the compressor is often greater than that of the second fan, so the size of the third power module 230 is often larger, and the height of the third power module 230 is relatively high. By providing a first step surface 311 and a second step surface 312 with different heights on the heat sink 300, the first step surface 311 abuts against the second power module 220, and the second step surface 312 abuts against the third power module 230, so that the heat sink 300 0 can have a good fit with the second power module 220 and the third power module 230 at the same time, and the contact area is also large, so the heat of the second power module 220 and the third power module 230 can be better transferred to the radiator 300; in addition, a bracket 500 is arranged between the circuit board 100 and the radiator 300 to support the third power module 230, so as to avoid the third power module 230 being subjected to a large pressure from the radiator 300 due to its high height, thereby avoiding the position displacement of the third power module 230 or the loosening of the pins of the third power module 230 caused by excessive pressure; the controller 1000 can take into account the heat dissipation effect of different power modules and improve the working reliability of the controller.

[0038] Reference Figure 1 and Figure 5As shown, a controller 1000 of an embodiment of the present invention, the module assembly 200 also includes a rectifier module 410, an insulated gate bipolar transistor module 420 and a fast recovery diode module 430 arranged on the circuit board 100. Among them, the rectifier module 410 has a rectifier bridge, the insulated gate bipolar transistor module 420 has an insulated gate bipolar transistor (IGBT), and the fast recovery diode module 430 has a fast recovery diode (FRD). It should be noted that the module assembly 200 rectifies the input alternating current through the rectifier module 410, the insulated gate bipolar transistor module 420 and the fast recovery diode module 430 to rectify it into direct current. The rectifier module 410, the insulated gate bipolar transistor module 420 and the fast recovery diode module 430 are arranged in sequence along the length direction of the heat sink 300, and all of them are in contact with the heat sink 300. It is understandable that when the rectifier module 410, the insulated gate bipolar transistor module 420 and the fast recovery diode module 430 perform rectification work, heat is generated, and the generated heat is transferred to the heat sink 300 and taken away by the refrigerant pipe, thereby achieving heat dissipation.

[0039] Continue to refer to Figure 1 and Figure 5 As shown, in one embodiment, the first power module 210, the second power module 220, the third power module 230, the rectifier module 410, the insulated gate bipolar transistor module 420 and the fast recovery diode module 430 are sequentially arranged along the length direction of the heat sink 300. It can be understood that, through the above arrangement, only one rectangular plate-shaped heat sink 300 is used to achieve heat dissipation of the first power module 210, the second power module 220, the third power module 230, the rectifier module 410, the insulated gate bipolar transistor module 420 and the fast recovery diode module 430, which greatly reduces the number of components of the controller 1000 and also reduces the cost of the controller 1000.

[0040] Reference Figure 5 , Figure 6 and Figure 7As shown, a controller 1000 of an embodiment of the present invention further includes a bracket 500 fixed to the circuit board 100, the bracket 500 extends along the length direction of the heat sink 300, and is arranged between the circuit board 100 and the heat sink 300 to support the module assembly 200. It should be noted that the bracket 500 can be fixedly connected to the circuit board 100 by means of threaded connection or the like. In one embodiment, the heat sink 300 is provided with a first screw hole 320, the circuit board 100 is provided with a second screw hole 110, the bracket 500 is provided with a third screw hole 570, and the screws are passed through the first screw hole 320, the second screw hole 110 and the third screw hole 570 to fix the bracket 500 and the heat sink 300 to the circuit board 100, and to enable the bracket 500 to support the module assembly 200, so that the first power module 210, the second power module 220 and the third power module 230 are in contact with the heat sink 300.

[0041] Reference Figure 5 As shown, in a controller 1000 according to an embodiment of the present invention, a bracket 500 is provided with a first slot body 510, a second slot body 520 and a third slot body 530. Among them, the first slot body 510 matches the first power module 210, and it can be understood that the first power module 210 is installed in the first slot body 510 and connected to the circuit board 100; the second slot body 520 matches the second power module 220, and it can be understood that the second power module 220 is installed in the second slot body 520 and connected to the circuit board 100; the third slot body 530 matches the third power module 230, and it can be understood that the third power module 230 is installed in the third slot body 530 and connected to the circuit board 100.

[0042] Reference Figure 5As shown, in a controller 1000 of an embodiment of the present invention, the bottom walls of the first slot body 510 and the second slot body 520 are hollow structures. It should be noted that the pins of the first power module 210 driving the first fan and the second power module 220 driving the second fan are relatively short, and the bottom walls of the first slot body 510 and the second slot body 520 are hollow structures, which facilitates the installation of the first power module 210 and the second power module 220. It can be understood that after the first power module 210 is installed in the first slot body 510, the first slot body 510 supports the surrounding side of the first power module 210; after the second power module 220 is installed in the second slot body 520, the second slot body 520 supports the surrounding side of the second power module 220. The bottom wall of the third slot body 530 is a first support plate 532 supporting the third power module 230, and the first support plate 532 is provided with a first through hole 5321 for the pins of the third power module 230 to pass through. It should be noted that the pins of the third power module 230 driving the compressor are relatively long, and the first support plate 532 can support the third power module 230, so that the installation of the third power module 230 is more stable. It should be noted that after the pins of the third power module 230 pass through the first through hole 5321 and are installed in the third slot body 530, the third slot body 530 also supports the peripheral side of the third power module 230.

[0043] Reference Figure 5 As shown, in a controller 1000 of an embodiment of the present invention, the bracket 500 is further provided with a fourth slot body 540, a fifth slot body 550 and a sixth slot body 560. Among them, the fourth slot body 540 matches the insulated gate bipolar transistor module 420. It can be understood that the insulated gate bipolar transistor module 420 is installed in the fourth slot body 540 and connected to the circuit board 100. It should be noted that the bottom wall of the fourth slot body 540 is a second support plate 542 supporting the insulated gate bipolar transistor module 420. The second support plate 542 is provided with a second through hole 5421 for the pins of the insulated gate bipolar transistor module 420 to pass through. The pins of the insulated gate bipolar transistor module 420 are relatively long. The second support plate 542 can support the insulated gate bipolar transistor module 420, so that the installation of the insulated gate bipolar transistor module 420 is more stable. It should be noted that after the pins of the IGBT module 420 pass through the second through holes 5421 and are installed in the fourth slot body 540 , the fourth slot body 540 also supports the peripheral side of the IGBT module 420 .

[0044] Reference Figure 5As shown, in a controller 1000 of an embodiment of the present invention, the fifth slot body 550 matches the fast recovery diode module 430. It can be understood that the fast recovery diode module 430 is installed in the fifth slot body 550 and connected to the circuit board 100. It should be noted that the bottom wall of the fifth slot body 550 is a third support plate 552 that supports the fast recovery diode module 430, and the third support plate 552 is provided with a third through hole 5521 for the pins of the fast recovery diode module 430 to pass through. The specific functions of the fifth slot body 550, the third support plate 552 and the third through hole 5521 are analogous to the above-mentioned fourth slot body 540, the second support plate 542 and the second through hole 5421, which will not be repeated here. Continue to refer to Figure 5 As shown, in a controller 1000 of an embodiment of the present invention, the sixth slot body 560 matches the rectifier module 410. It is understandable that the rectifier module 410 is installed in the sixth slot body 560 and connected to the circuit board 100. It should be noted that the bottom wall of the sixth slot body 560 is a fourth support plate 562 supporting the rectifier module 410, and the fourth support plate 562 is provided with a fourth through hole 5621 for the pins of the rectifier module 410 to pass through. The specific functions of the sixth slot body 560, the fourth support plate 562 and the fourth through hole 5621 are analogous to the above-mentioned fourth slot body 540, the second support plate 542 and the second through hole 5421, and will not be repeated here. Continue to refer to Figure 5 It can be seen that the third trough body 530, the fourth trough body 540, the fifth trough body 550 and the sixth trough body 560 are arranged in sequence along the length direction of the radiator 300, so that every place of the radiator 300 can be utilized, reducing the volume of the radiator 300, thereby reducing the manufacturing and processing costs of the radiator 300.

[0045] An embodiment of the second aspect of the present invention further proposes an air-conditioning outdoor unit, which is not shown in the figure. The air-conditioning outdoor unit includes the controller 1000 of the embodiment of the first aspect.

[0046] According to the air-conditioning outdoor unit of the embodiment of the present invention, since the production cost of the circuit board 100 is reduced, the overall cost of the air-conditioning outdoor unit is reduced; in addition, since the third power module 230 is not affected by the current of other current loops when driving the compressor, the operation of the compressor in the air-conditioning outdoor unit is more stable.

[0047] An air conditioner outdoor unit according to an embodiment of the present invention further comprises an electric control box, a controller 1000 is installed in the electric control box, and a module assembly 200 is located on the side of the circuit board 100 facing the bottom wall of the electric control box. The above arrangement can prevent dust accumulation in the module assembly 200 and affect the operation of the controller 1000.

[0048] An embodiment of the third aspect of the present invention further provides an air conditioner, not shown in the figure, which includes an air conditioner outdoor unit of the embodiment of the second aspect.

[0049] According to the air conditioner of the embodiment of the present invention, since the overall cost of the air conditioner outdoor unit is reduced and the compressor in the air conditioner outdoor unit works more stably, the air conditioner has a higher cost performance and is more likely to be favored by users.

[0050] The embodiments of the present invention are described in detail above in conjunction with the accompanying drawings. Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that the technical solutions described in the aforementioned embodiments can still be modified, or some or all of the technical features therein can be replaced by equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A controller, characterized in that: include: Circuit boards; A module assembly, arranged on the circuit board, the module assembly comprising a second power module for driving a second fan and a third power module for driving a compressor; A heat sink, wherein the second power module and the third power module are both in contact with the heat sink; the height of the second power module is less than the height of the third power module, and the heat sink is provided with a first step surface and a second step surface, wherein the first step surface is in contact with the second power module, and the second step surface is in contact with the third power module; The bracket is fixed to the circuit board and is arranged between the circuit board and the heat sink to support the third power module.

2. The controller according to claim 1, characterized in that: The heat sink is in a rectangular plate shape, the length direction of the second power module and the third power module is the same as the length direction of the heat sink, and the second power module and the third power module are arranged in sequence along the length direction of the heat sink.

3. The controller according to claim 1, characterized in that: The module assembly also includes a rectifier module, an insulated gate bipolar transistor module and a fast recovery diode module arranged on the circuit board. The rectifier module, the insulated gate bipolar transistor module and the fast recovery diode module are arranged in sequence along the length direction of the heat sink and are all in contact with the heat sink.

4. The controller according to claim 2 or 3, characterized in that: The bracket extends along the length direction of the radiator.

5. The controller according to claim 4, characterized in that: The bracket is provided with a third slot body matching the third power module, a fourth slot body matching the insulated gate bipolar transistor module, a fifth slot body matching the fast recovery diode module and a sixth slot body matching the rectifier module.

6. The controller according to claim 5, characterized in that: The third slot body, the fourth slot body, the fifth slot body and the sixth slot body are sequentially arranged along the length direction of the heat sink.

7. The controller according to claim 1, characterized in that: The circuit board is provided with a second current loop connected to the second power module, and a third current loop connected to the third power module.

8. The controller according to claim 7, characterized in that: The second current loop includes a first capacitor for filtering and stabilizing voltage, a third capacitor for filtering out high-frequency interference signals, and a second sampling resistor for sampling the second fan current; the first capacitor is electrically connected to the third capacitor, the third capacitor is electrically connected to the second sampling resistor, and the third capacitor and the second sampling resistor are both electrically connected to the second power module.

9. The controller according to claim 7, characterized in that: The third current loop includes a second capacitor for filtering and stabilizing voltage, a fourth capacitor for filtering high-frequency interference signals, and a third sampling resistor for sampling the compressor current; the second capacitor is electrically connected to the fourth capacitor, the fourth capacitor is electrically connected to the third sampling resistor, and the fourth capacitor and the third sampling resistor are both electrically connected to the third power module.

10. The controller according to claim 1, characterized in that: A height of the first step surface relative to an upper surface of the heat sink is greater than a height of the second step surface relative to the upper surface of the heat sink.

11. The controller according to claim 1, characterized in that: The width of the second power module is smaller than that of the third power module, and the width of the first step surface is smaller than that of the second step surface.

12. An air conditioner outdoor unit, characterized in that: A controller comprising any one of claims 1 to 11.

13. The air conditioner outdoor unit according to claim 12, characterized in that: The air conditioner outdoor unit further comprises an electric control box, the controller is installed in the electric control box, and the module assembly is located on the side of the circuit board facing the bottom wall of the electric control box.

14. An air conditioner, characterized in that Including the air conditioner outdoor unit as described in claim 12 or 13.

Images