Semiconductor material detection workbench
By using positioning and control mechanisms on the semiconductor material detection workbench to adjust the height and coverage range of the laser light source, the problem of fixing the distance of the light source and the coverage range in the prior art is solved, and the detection accuracy and comprehensiveness are improved.
Patent Information
- Application Number
- CN202510197965.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-21
- Publication Date
- 2025-05-13
- Estimated Expiration
- Not applicable · inactive patent
AI Technical Summary
When existing optical detection equipment detects semiconductor materials, the light source distance is fixed and cannot be adjusted, resulting in poor detection effect and the light source coverage cannot be adjusted according to the material size, which reduces the comprehensiveness of detection.
A semiconductor material detection workbench is designed, using a positioning mechanism and a control mechanism to adjust the height of the laser light source through the motor driving the threaded rod and the lifting block, ensuring that the distance between the light source and the material surface is always consistent, and the light source coverage range is adjusted through the distance sensor and the PLC control panel.
It improves detection accuracy, avoids damage to the surface of the light source heat, ensures the quality of the material product, and enhances the comprehensiveness and accuracy of the inspection.
Smart Images
Figure CN119985448A_ABST
Abstract
Description
Technical Field
[0001] The invention belongs to the technical field of semiconductor material detection, and in particular relates to a semiconductor material detection workbench. Background Art
[0002] Semiconductor materials refer to materials whose electrical conductivity is between that of conductors and insulators, and have the ability to control electric current. The electrical conductivity of semiconductor materials can be adjusted by doping with different types of impurities, a process called doping. After doping, semiconductor materials can exhibit different electrical characteristics and are widely used in electronic devices such as integrated circuits (ICs), solar cells, and optoelectronic devices.
[0003] Strict testing is required during the production and processing of semiconductor materials because the process of producing semiconductor devices is very complicated and the requirements for materials are very high. Among them, optical testing equipment, such as high-resolution microscopes and interferometers, can detect micron-level or even nano-level details in semiconductor materials, which helps to find tiny defects in materials and improve the product performance of semiconductor materials.
[0004] However, the existing optical detection equipment still has the following technical problems when detecting semiconductor materials: The position of the light source is often fixed. Therefore, when the thickness of the semiconductor material is different, it is impossible to ensure that the distance between the light source and the upper surface of the semiconductor remains unchanged. If this distance is longer or shorter, the detection effect will be affected as follows: when the semiconductor material is thinner, the distance between the light source and the upper surface of the semiconductor is longer, and the light intensity irradiated to the surface will be weakened, affecting the brightness and clarity of the image; when the semiconductor material is thicker, the distance between the light source and the upper surface of the semiconductor is shorter, resulting in excessive focusing of the light, forming an overly strong light spot, and even causing the heat of the light source to affect the semiconductor surface, reducing the detection accuracy and affecting the product quality of the semiconductor; In addition, the coverage range of the light source in the detection equipment cannot be adjusted according to the size of the semiconductor material, and it cannot be guaranteed that the semiconductor material is always within the detection range covered by the light source, which reduces the comprehensiveness of the semiconductor material detection. Summary of the invention
[0005] The purpose of the present invention is to provide a semiconductor material detection workbench that can keep the distance between the laser light source and the upper surface of the semiconductor material constant without being too long or too short, thereby improving the detection accuracy, in response to the problems raised in the above background technology.
[0006] In order to achieve the above object, the present invention adopts the following technical solutions: A semiconductor material testing workbench, comprising: A workbench body, wherein a mounting cylinder is fixedly connected to the upper portion of the workbench body, an adjusting cylinder is slidably connected to the inner wall of the mounting cylinder along the vertical direction, and a laser light source is fixedly installed in the adjusting cylinder; A positioning mechanism, used for positioning the semiconductor material and adjusting the height of the laser light source according to the thickness of the semiconductor material, the positioning mechanism comprising a positioning plate slidably connected to the upper end of the workbench body in a vertical direction, and a connecting rod fixedly connected between the positioning plate and the adjusting cylinder; A control mechanism is used to adjust the coverage range of the laser light source according to the cross-sectional range of the semiconductor material. The control mechanism includes a turntable rotatably connected to the upper end of the workbench body, an annular plate is fixedly connected to the upper end of the workbench body, and a plurality of distance sensors distributed in a circumferential array are fixedly connected to the circumferential side wall of the annular plate, a conical elastic ring plate is fixedly connected to the lower end of the adjustment cylinder, and the laser light source in the adjustment cylinder is irradiated onto the upper surface of the semiconductor material through the conical elastic ring plate, a plurality of return springs distributed in a circumferential array are arranged between the conical elastic ring plate and the outer wall of the adjustment cylinder, a limit ring is sleeved on the circumferential side wall of the conical elastic ring plate, and two electric telescopic rods for adjusting the position of the limit ring are arranged above the limit ring, a PLC control panel is arranged on the upper end of the workbench body, and the distance sensor, the PLC control panel and the electric telescopic rod are electrically connected.
[0007] Preferably, when the turntable drives the semiconductor material to rotate, the multiple distance sensors continuously measure the distance between them and the edge of the semiconductor material, and the PLC control panel controls the extension and retraction degree of the electric telescopic rod according to the minimum distance between the distance sensor and the edge of the semiconductor material.
[0008] Preferably, the positioning mechanism also includes a threaded rod rotatably connected to the upper end of the workbench body, a first motor for driving the threaded rod is fixedly connected to the lower end of the workbench body, a lifting block is threadedly connected to the threaded rod, the lifting block is fixedly connected to the positioning plate, a limiting rod is fixedly connected to the upper end of the workbench body, and the limiting rod passes through and is slidably connected to the lifting block.
[0009] Preferably, a cleaning mechanism is provided under the workbench main body, which is used for cleaning the upper surface of the semiconductor material while driving the turntable to rotate, and the cleaning mechanism includes an L-shaped plate fixedly connected to the lower end of the workbench main body, the upper end of the L-shaped plate is fixedly connected to a second motor, the output end of the second motor is fixedly connected to a rotating rod, the top end of the rotating rod is fixedly connected to the bottom end of the turntable, and the lower end of the workbench main body is fixedly connected to a cleaning box through a supporting rod, the part of the rotating rod located in the cleaning box is provided with a reciprocating threaded section, the inner wall of the cleaning box is air-tightly slidably connected to a piston plate in a vertical direction, and a movable plate is fixedly connected to the upper side of the piston plate through a fixing rod, and the movable plate is threadedly connected to the reciprocating threaded section, and an air inlet pipe and an exhaust pipe are fixedly connected to the side wall of the cleaning box located below the piston plate, and the other end of the exhaust pipe extends to the top of the workbench main body.
[0010] Preferably, both the air inlet pipe and the exhaust pipe are provided with a one-way valve.
[0011] Preferably, an adjustment mechanism is provided on the circumferential side of the adjustment cylinder, which is used to further adjust the coverage range of the laser light source during the process of adjusting the height of the laser light source after adjusting the coverage range of the laser light source according to the cross-sectional range of the semiconductor material. The adjustment mechanism includes an annular adjustment box fixedly connected to the circumferential side wall of the adjustment cylinder, a piston ring is sealingly and slidably connected in the annular adjustment box, two extension rods are fixedly connected to the lower end of the piston ring, the extension rods extend to the bottom of the annular adjustment box and are fixedly connected to the electric telescopic rod at the corresponding position, a liquid storage tank is fixedly connected to the outer wall of the mounting cylinder through two mounting rods, a piston block is sealingly and slidably connected in the liquid storage tank, an L-shaped rod is fixedly connected to the lower end of the piston block, the L-shaped rod extends to the bottom of the liquid storage tank and is fixedly connected to the outer wall of the annular adjustment box, and an infusion hose is fixedly connected between the annular adjustment box and the liquid storage tank.
[0012] Preferably, one end of the infusion hose extends to the space below the piston block in the liquid storage box, and the other end extends to the space above the piston ring in the annular adjustment box.
[0013] Preferably, a liquid storage space is formed between the liquid storage box, the liquid infusion hose and the annular regulating box, and the liquid storage space is filled with hydraulic oil.
[0014] Compared with the existing technology, the advantages of this semiconductor material testing workbench are: 1. The present invention sets a positioning mechanism. Before detection, the first motor drives the threaded rod to rotate, driving the lifting block and the positioning plate to move in the vertical direction, so that the positioning plate can abut against the upper surface of the semiconductor material. During this process, the positioning plate can drive the adjustment tube to move downward relative to the installation tube, thereby lowering the height of the laser light source in the adjustment tube, so that the distance between the laser light source and the upper surface of the semiconductor material remains unchanged at all times and will not be too long or too short. While improving the detection accuracy, it avoids the heat of the light source from causing thermal damage to the semiconductor surface, thereby improving the product quality of the semiconductor material.
[0015] 2. The present invention sets a control mechanism. Before the positioning plate moves, the semiconductor material is first placed on a turntable, and the semiconductor material is driven to rotate by the turntable, so that multiple distance sensors in the annular plate continuously measure the distance between it and the edge of the semiconductor material. The PLC control panel controls the extension and retraction degree of the electric telescopic rod according to the minimum distance between the distance sensor and the edge of the semiconductor material, ensuring that the semiconductor material is always within the detection range covered by the light source, while reducing the portion of the laser light source irradiating the non-detection area of the semiconductor material, thereby improving the detection accuracy.
[0016] 3. The present invention provides a cleaning mechanism. During the rotation of the turntable, the rotating rod will drive the movable plate and the piston plate to perform reciprocating vertical displacement through the reciprocating threaded section provided thereon, continuously discharging the air below the workbench body to above the workbench body, thereby accelerating the air flow above the semiconductor material, so that the dust attached to the upper surface of the semiconductor material slides off the semiconductor material with the flowing air, avoiding the reflection or diffraction effect caused by the dust on the upper surface of the semiconductor material during the detection process, and further improving the detection accuracy.
[0017] 4. The present invention provides an adjustment mechanism. When the height of the adjustment cylinder changes, the position of the piston block in the liquid storage tank will be changed through the L-shaped rod. When the downward displacement distance of the adjustment cylinder is relatively large, the limit ring moves downward a large distance on the peripheral side wall of the conical elastic ring plate. The conical elastic ring plate can adaptively adjust its coverage range on the upper surface of the semiconductor material, avoiding changes in the detection range covered by the adjustment cylinder and the laser light source inside it after adjustment, thereby reducing the possibility of errors. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] Figure 1 It is a three-dimensional structural schematic diagram of the present invention; Figure 2 yes Figure 1 The enlarged view of point A in the middle; Figure 3 yes Figure 1 The enlarged view of point B in the middle; Figure 4 It is a partial cross-sectional view of the cleaning box in the present invention; Figure 5 It is a partial cross-sectional view of the annular regulating box in the present invention.
[0019] In the figure: 1. workbench body; 11. mounting cylinder; 12. adjusting cylinder; 2. positioning mechanism; 21. positioning plate; 22. connecting rod; 23. threaded rod; 24. first motor; 25. lifting block; 26. limiting rod; 3. control mechanism; 31. turntable; 32. annular plate; 33. distance sensor; 34. conical elastic ring plate; 35. reset spring; 36. limiting ring; 37. electric telescopic rod; 38. PLC control panel; 4. cleaning mechanism; 41. L-shaped plate; 42. second motor; 43. rotating rod; 44. cleaning box; 45. reciprocating threaded section; 46. piston plate; 47. moving plate; 48. intake pipe; 49. exhaust pipe; 5. adjusting mechanism; 51. annular adjusting box; 52. piston ring; 53. extension rod; 54. liquid storage tank; 55. piston block; 56. L-shaped rod; 57. infusion hose. DETAILED DESCRIPTION
[0020] The following examples are for illustrative purposes only and are not intended to limit the scope of the present invention.
[0021] Example: Refer to Figures 1 to 5 , a semiconductor material detection workbench, comprising: A workbench body 1, wherein a mounting cylinder 11 is fixedly connected to the upper position of the workbench body 1, an adjusting cylinder 12 is slidably connected to the inner wall of the mounting cylinder 11 along the vertical direction, and a laser light source is fixedly installed in the adjusting cylinder 12; Specifically, the laser light source is a semiconductor laser or a gas laser, wherein the laser wavelength is set to 800-1000nm, the output power is between 10W and 100W, and the pulse frequency is continuous wave.
[0022] Specifically, the laser light source uses laser induced breakdown spectroscopy technology, which can excite the surface atoms of the semiconductor material and generate plasma when the laser acts on the semiconductor material. The elemental composition and internal defects of the semiconductor material can be determined by analyzing the plasma emission spectrum.
[0023] A positioning mechanism 2, used for positioning the semiconductor material and adjusting the height of the laser light source according to the thickness of the semiconductor material, the positioning mechanism 2 comprises a positioning plate 21 slidably connected to the upper end of the workbench body 1 in the vertical direction, and a connecting rod 22 is fixedly connected between the positioning plate 21 and the adjusting cylinder 12; Specifically, the positioning mechanism 2 also includes a threaded rod 23 rotatably connected to the upper end of the workbench body 1, and a first motor 24 for driving the threaded rod 23 is fixedly connected to the lower end of the workbench body 1. A lifting block 25 is threadedly connected to the threaded rod 23, and the lifting block 25 is fixedly connected to the positioning plate 21. A limiting rod 26 is fixedly connected to the upper end of the workbench body 1, and the limiting rod 26 passes through and is slidably connected to the lifting block 25.
[0024] Specifically, the limiting rod 26 limits the lifting block 25 , so that the lifting block 25 can only move in the vertical direction along the threaded rod 23 when the threaded rod 23 rotates.
[0025] In view of the fact that the position of the light source in the prior art is often fixed, when the thickness of the semiconductor material is different, it is impossible to ensure that the distance between the light source and the upper surface of the semiconductor remains unchanged, resulting in reduced detection accuracy and thermal damage to the semiconductor surface. The present invention sets a positioning mechanism 2. Before detection, the threaded rod 23 is driven to rotate by the first motor 24, driving the lifting block 25 and the positioning plate 21 to move in the vertical direction, so that the positioning plate 21 can abut against the upper surface of the semiconductor material. During this process, the positioning plate 21 can drive the adjusting cylinder 12 to move downward relative to the mounting cylinder 11 through the connecting rod 22, thereby lowering the height of the laser light source in the adjusting cylinder 12. The different thicknesses of the semiconductor material will result in different degrees of lowering the height of the laser light source, so that the distance between the laser light source and the upper surface of the semiconductor material remains unchanged, and will not be longer or shorter. While improving the detection accuracy, it avoids thermal damage to the semiconductor surface caused by the heat of the light source, thereby improving the product quality of the semiconductor material.
[0026] In addition, when the positioning plate 21 abuts against the upper surface of the semiconductor material, it will partially block the upper surface of the semiconductor material, which may affect the comprehensiveness of the detection of the upper surface of the semiconductor material. The width of the positioning plate 21 can be set smaller to reduce the impact on the detection of the semiconductor material. At the same time, after the detection is completed, the semiconductor material can be driven to rotate by the rotation of the turntable 31, so that the positioning plate 21 abuts against other positions on the upper surface of the semiconductor material for detection again, further reducing the impact of the positioning plate 21 on the semiconductor material detection process. The impact here is very small, so it is not considered.
[0027] The control mechanism 3 is used to adjust the coverage of the laser light source according to the cross-sectional range of the semiconductor material. The control mechanism 3 includes a turntable 31 rotatably connected to the upper end of the workbench body 1, and the upper end of the workbench body 1 is fixedly connected to an annular plate 32, and a plurality of distance sensors 33 distributed in a circumferential array are fixedly connected to the peripheral side wall of the annular plate 32. The lower end of the adjustment cylinder 12 is fixedly connected to a conical elastic ring plate 34, and the laser light source in the adjustment cylinder 12 irradiates the upper surface of the semiconductor material through the conical elastic ring plate 34. A plurality of return springs 35 distributed in a circular array are provided between the conical elastic ring plate 34 and the outer wall of the adjusting cylinder 12, a limiting ring 36 is sleeved on the circumferential side wall of the conical elastic ring plate 34, two electric telescopic rods 37 for adjusting the position of the limiting ring 36 are provided above the limiting ring 36, the telescopic ends of the electric telescopic rods 37 are fixedly connected to the upper end of the limiting ring 36, a PLC control panel 38 is provided at the upper end of the workbench body 1, and the distance sensor 33, the PLC control panel 38 and the electric telescopic rod 37 are electrically connected.
[0028] Specifically, the conical elastic ring plate 34 is made of silicone rubber, which has excellent elasticity and flexibility, and can undergo elastic deformation within a large range without breaking. At the same time, it has good optical transparency, low absorption and scattering of lasers, and will not cause obvious interference to the transmission and detection of laser light sources.
[0029] Specifically, when the turntable 31 drives the semiconductor material to rotate, the multiple distance sensors 33 continuously measure the distance between them and the edge of the semiconductor material, and the PLC control panel 38 controls the extension degree of the electric telescopic rod 37 according to the minimum distance between the distance sensor 33 and the edge of the semiconductor material.
[0030] Specifically, the PLC control panel 38 can determine the extension amount of the electric telescopic rod 37 according to the range of the minimum distance value, and set different threshold ranges. When the minimum distance is 0-20mm, the electric telescopic rod extends 0-10mm; when it is 20-40mm, it extends 10-20mm.
[0031] In view of the fact that the coverage range of the light source in the prior art cannot be adjusted according to the size of the semiconductor material, and it is impossible to ensure that the semiconductor material is always within the detection range covered by the light source, thereby reducing the problem of comprehensive detection of semiconductor materials, the present invention sets a control mechanism 3, and before the positioning plate 21 moves, the semiconductor material is first placed on the turntable 31, and the turntable 31 drives the semiconductor material to rotate, so that the multiple distance sensors 33 in the annular plate 32 continuously measure the distance between it and the edge of the semiconductor material, and the PLC control panel 38 controls the extension degree of the electric telescopic rod 37 according to the minimum distance between the distance sensor 33 and the edge of the semiconductor material: When the minimum distance between the distance sensor 33 and the edge of the semiconductor material is relatively small, it means that the boundary area around the semiconductor material is relatively large. At this time, the PLC control panel 38 controls the electric telescopic rod 37 to be in a retracted state, and the limit ring 36 is in an upper position of the conical elastic ring plate 34. At this time, the conical elastic ring plate 34 will expand a relatively large range under the elastic force of multiple reset springs 35, so that the coverage range of the laser light source irradiating the upper surface of the semiconductor material is relatively large, ensuring that the semiconductor material is always within the detection range covered by the light source, thereby improving the comprehensiveness of the semiconductor material detection; When the minimum distance between the distance sensor 33 and the edge of the semiconductor material is relatively large, it means that the boundary area around the semiconductor material is relatively small. At this time, the PLC control panel 38 controls the electric telescopic rod 37 to be in an extended state, and the limit ring 36 is in a lower position of the conical elastic ring plate 34. At this time, the conical elastic ring plate 34 will expand a relatively small range under the limiting action of the limit ring 36, so that the coverage range of the laser light source irradiating the upper surface of the semiconductor material is relatively small, reducing the part of the laser light source irradiating the non-detection area of the semiconductor material, preventing the reflection, scattering and other signals in these additional areas from being misjudged as signals of the semiconductor material, and improving the detection accuracy.
[0032] A cleaning mechanism 4 is provided below the workbench main body 1, which is used to clean the upper surface of the semiconductor material while driving the turntable 31 to rotate. The cleaning mechanism 4 includes an L-shaped plate 41 fixedly connected to the lower end of the workbench main body 1, and a second motor 42 is fixedly connected to the upper end of the L-shaped plate 41. A rotating rod 43 is fixedly connected to the output end of the second motor 42, and the top of the rotating rod 43 is fixedly connected to the bottom end of the turntable 31. The lower end of the workbench main body 1 is fixedly connected to a cleaning box 44 through a supporting rod, and the part of the rotating rod 43 located in the cleaning box 44 is provided with a reciprocating threaded section 45. The inner wall of the cleaning box 44 is airtightly slidably connected to a piston plate 46 in the vertical direction, and a movable plate 47 is fixedly connected to the upper side of the piston plate 46 through a fixed rod, and the movable plate 47 is threadedly connected to the reciprocating threaded section 45. An air inlet pipe 48 and an exhaust pipe 49 are fixedly connected on the side wall of the cleaning box 44 located below the piston plate 46, and the other end of the exhaust pipe 49 extends to the top of the workbench main body 1.
[0033] Specifically, both the air inlet pipe 48 and the exhaust pipe 49 are provided with a one-way valve. The setting of the one-way valve ensures that when the piston plate 46 performs reciprocating vertical displacement in the cleaning box 44, the outside air can only be pumped into the cleaning box 44 through the air inlet pipe 48, and the air in the cleaning box 44 can only be pumped out to a position above the workbench body 1 through the exhaust pipe 49, thereby avoiding air backflow and ensuring the cleaning effect of the semiconductor material.
[0034] In order to prevent the dust on the upper surface of the semiconductor material from affecting the detection accuracy, the present invention sets a cleaning mechanism 4. When the second motor 42 drives the turntable 31 to rotate, the semiconductor material rotates. During the detection of the edge of the peripheral side of the semiconductor material, the rotating rod 43 will drive the moving plate 47 to perform reciprocating vertical displacement through the reciprocating threaded section 45 set thereon, and then drive the piston plate 46 to perform reciprocating vertical displacement in the cleaning box 44, continuously discharging the air under the workbench body to the top of the workbench body 1, accelerating the air flow above the semiconductor material, so that the dust attached to the upper surface of the semiconductor material slides off the semiconductor material with the flowing air, avoiding the dust on the upper surface of the semiconductor material during the detection process to cause reflection or diffraction effects, thereby further improving the detection accuracy.
[0035] An adjusting mechanism 5 is provided on the peripheral position of the adjusting cylinder 12, which is used to further adjust the coverage range of the laser light source in the process of adjusting the height of the laser light source after adjusting the coverage range of the laser light source according to the cross-sectional range of the semiconductor material. The adjusting mechanism 5 includes an annular adjusting box 51 fixedly connected to the peripheral wall of the adjusting cylinder 12, a piston ring 52 is sealingly and slidably connected in the annular adjusting box 51, and two extension rods 53 are fixedly connected to the lower end of the piston ring 52. The extension rods 53 extend to the bottom of the annular adjusting box 51 and are fixedly connected to the electric telescopic rod 37 at the corresponding position. A liquid storage tank 54 is fixedly connected to the outer wall of the mounting cylinder 11 through two mounting rods, a piston block 55 is sealingly and slidably connected in the liquid storage tank 54, and an L-shaped rod 56 is fixedly connected to the lower end of the piston block 55. The L-shaped rod 56 extends to the bottom of the liquid storage tank 54 and is fixedly connected to the outer wall of the annular adjusting box 51, and an infusion hose 57 is fixedly connected between the annular adjusting box 51 and the liquid storage tank 54.
[0036] Specifically, one end of the infusion hose 57 extends to the space below the piston block 55 in the liquid storage box 54 , and the other end extends to the space above the piston ring 52 in the annular adjustment box 51 .
[0037] Specifically, a liquid storage space is formed between the liquid storage box 54 , the liquid infusion hose 57 and the annular regulating box 51 , and the liquid storage space is filled with hydraulic oil.
[0038] Taking into account that the coverage of the laser light source will be affected during the adjustment of the height of the laser light source, for example, when the laser light source is displaced downward, since the conical elastic ring plate 34 can irradiate the light source on the upper surface of the semiconductor material in a conical shape, the greater the distance the laser light source is displaced downward, the smaller the distance between the laser light source and the upper surface of the semiconductor material, and the smaller the coverage of the light source when irradiating the upper surface of the semiconductor material, the present invention sets an adjustment mechanism 5, and when the height of the adjustment cylinder 12 changes, the position of the piston block 55 in the liquid storage tank 54 will be driven to change through the L-shaped rod 56, and when the distance the adjustment cylinder 12 is displaced downward is relatively large, the piston block 55 is moved downward in the liquid storage tank 54. The piston ring 52 can be displaced a relatively large distance downward in the annular adjustment box 51, and the electric telescopic rod 37 can be further driven to move a large distance downward as a whole through the extension rod 53, so that the limit ring 36 moves a large distance downward on the side wall of the conical elastic ring plate 34, so that when the adjustment cylinder 12 drives the laser light source to move downward, the conical elastic ring plate 34 can adaptively adjust its coverage range on the upper surface of the semiconductor material, thereby avoiding changes in the detection range covered by the adjustment cylinder 12 and the laser light source inside it after adjustment, thereby reducing the possibility of errors.
[0039] The present invention can be explained by the following operation mode: First, the semiconductor material is placed on the turntable 31, and the second motor 42 drives the rotating rod 43 and the turntable 31 to rotate, thereby driving the semiconductor material to rotate. During this process, the turntable 31 and the semiconductor material rotate at a relatively slow speed, so that displacement is not likely to occur, so that the multiple distance sensors 33 in the annular plate 32 continuously measure the distance between them and the edge of the semiconductor material. The PLC control panel 38 controls the extension degree of the electric telescopic rod 37 according to the minimum distance between the distance sensor 33 and the edge of the semiconductor material. When the boundary area around the semiconductor material is relatively large, the coverage range of the laser light source irradiating the upper surface of the semiconductor material is relatively large, ensuring that the semiconductor material is always within the detection range covered by the light source. When the boundary area around the semiconductor material is relatively small, the portion of the laser light source irradiating the non-detection area of the semiconductor material is reduced. The rotation of the rotating rod 43 will drive the moving plate 47 to reciprocate vertically through the reciprocating threaded section 45 provided thereon, thereby driving the piston plate 46 to reciprocate vertically in the cleaning box 44, and continuously discharge the air below the workbench body to above the workbench body 1, thereby accelerating the air flow above the semiconductor material, so that the dust attached to the upper surface of the semiconductor material slides off the semiconductor material along with the flowing air; Subsequently, the threaded rod 23 is driven to rotate by the first motor 24, driving the lifting block 25 and the positioning plate 21 to move in the vertical direction, so that the positioning plate 21 can abut against the upper surface of the semiconductor material. In this process, the positioning plate 21 can drive the adjustment cylinder 12 to move downward relative to the installation cylinder 11, thereby lowering the height of the laser light source in the adjustment cylinder 12, so that the distance between the laser light source and the upper surface of the semiconductor material remains unchanged; When the height of the adjusting cylinder 12 changes, the position of the piston block 55 in the liquid storage tank 54 is changed, which drives the electric telescopic rod 37 to change its position as a whole, thereby changing the position of the limit ring 36. When the adjusting cylinder 12 drives the laser light source to move downward, the conical elastic ring plate 34 can adaptively adjust its coverage range on the upper surface of the semiconductor material, thereby reducing the possibility of errors.
[0040] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims
1. A semiconductor material detection workbench, characterized in that: include: A workbench body (1), wherein a mounting cylinder (11) is fixedly connected to the upper portion of the workbench body (1), an adjusting cylinder (12) is slidably connected to the inner wall of the mounting cylinder (11) in a vertical direction, and a laser light source is fixedly mounted in the adjusting cylinder (12); The positioning mechanism (2) comprises a positioning plate (21) slidably connected to the upper end of the workbench body (1) in a vertical direction, and a connecting rod (22) is fixedly connected between the positioning plate (21) and the adjustment cylinder (12); The control mechanism (3) comprises a turntable (31) rotatably connected to the upper end of a workbench body (1); an annular plate (32) is fixedly connected to the upper end of the workbench body (1); a plurality of distance sensors (33) distributed in a circumferential array are fixedly connected to the peripheral side wall of the annular plate (32); a conical elastic ring plate (34) is fixedly connected to the lower end of the adjustment cylinder (12); a laser light source in the adjustment cylinder (12) irradiates the upper surface of the semiconductor material through the conical elastic ring plate (34); and the conical elastic ring plate (34) is fixedly connected to the lower end of the adjustment cylinder (12). A plurality of return springs (35) are arranged in a circumferential array between the plate (34) and the outer wall of the adjustment tube (12); a limit ring (36) is sleeved on the circumferential side wall of the conical elastic ring plate (34); two electric telescopic rods (37) for adjusting the position of the limit ring (36) are arranged above the limit ring (36); a PLC control panel (38) is arranged at the upper end of the workbench body (1); and the distance sensor (33), the PLC control panel (38) and the electric telescopic rod (37) are electrically connected.
2. The semiconductor material detection workbench according to claim 1, characterized in that: When the rotating disk (31) drives the semiconductor material to rotate, the plurality of distance sensors (33) continuously measure the distance between the distance sensor (33) and the edge of the semiconductor material, and the PLC control panel (38) controls the extension and retraction degree of the electric telescopic rod (37) according to the minimum distance between the distance sensor (33) and the edge of the semiconductor material.
3. The semiconductor material detection workbench according to claim 1, characterized in that: The positioning mechanism (2) further comprises a threaded rod (23) rotatably connected to the upper end of the workbench body (1); a first motor (24) for driving the threaded rod (23) is fixedly connected to the lower end of the workbench body (1); a lifting block (25) is threadedly connected to the threaded rod (23); the lifting block (25) is fixedly connected to the positioning plate (21); a limiting rod (26) is fixedly connected to the upper end of the workbench body (1); the limiting rod (26) penetrates and is slidably connected to the lifting block (25).
4. The semiconductor material detection workbench according to claim 1, characterized in that: A cleaning mechanism (4) is provided below the workbench body (1), comprising an L-shaped plate (41) fixedly connected to the lower end of the workbench body (1), a second motor (42) fixedly connected to the upper end of the L-shaped plate (41), a rotating rod (43) fixedly connected to the output end of the second motor (42), a top end of the rotating rod (43) fixedly connected to the bottom end of the rotating disk (31), a cleaning box (44) fixedly connected to the lower end of the workbench body (1) via a supporting rod, and a portion of the rotating rod (43) located inside the cleaning box (44) A reciprocating threaded section (45) is provided, the inner wall of the cleaning box (44) is airtightly slidably connected to a piston plate (46) in the vertical direction, a movable plate (47) is fixedly connected above the piston plate (46) via a fixing rod, the movable plate (47) is threadedly connected to the reciprocating threaded section (45), an air intake pipe (48) and an exhaust pipe (49) are fixedly connected on the side wall of the cleaning box (44) below the piston plate (46), and the other end of the exhaust pipe (49) extends to the top of the workbench body (1).
5. The semiconductor material detection workbench according to claim 4, characterized in that: Both the air inlet pipe (48) and the exhaust pipe (49) are provided with a one-way valve.
6. The semiconductor material detection workbench according to claim 1, characterized in that: An adjusting mechanism (5) is provided at a peripheral position of the adjusting cylinder (12), comprising an annular adjusting box (51) fixedly connected to the peripheral side wall of the adjusting cylinder (12); a piston ring (52) is sealed and slidably connected in the vertical direction inside the annular adjusting box (51); two extension rods (53) are fixedly connected to the lower end of the piston ring (52); the extension rods (53) extend to the bottom of the annular adjusting box (51) and are fixedly connected to the electric telescopic rod (37) at the corresponding position; a liquid storage box (54) is fixedly connected to the outer wall of the mounting cylinder (11) via two mounting rods; a piston block (55) is sealed and slidably connected inside the liquid storage box (54); an L-shaped rod (56) is fixedly connected to the lower end of the piston block (55); the L-shaped rod (56) extends to the bottom of the liquid storage box (54) and is fixedly connected to the outer wall of the annular adjusting box (51); and an infusion hose (57) is fixedly connected between the annular adjusting box (51) and the liquid storage box (54).
7. The semiconductor material detection workbench according to claim 6, characterized in that: One end of the infusion hose (57) extends to a space below the piston block (55) in the liquid storage box (54), and the other end extends to a space above the piston ring (52) in the annular adjustment box (51).
8. The semiconductor material detection workbench according to claim 7, characterized in that: A liquid storage space is formed between the liquid storage box (54), the liquid infusion hose (57) and the annular regulating box (51), and the liquid storage space is filled with hydraulic oil.