Soft jelly glue conductivity detection table

Abstract

The invention discloses a soft jelly glue conductivity detection bench, and relates to the field of conductivity detection benches, the soft jelly glue conductivity detection bench comprises an LED test chip pedestal and a plurality of LED chip main bodies arranged on the LED test chip pedestal, each LED chip main body comprises an LED chip N pole arranged at the center position and an LED chip P pole arranged at the edge position, an LED chip P / N pole insulating isolation strip is arranged at the center of the LED chip body, a first current collection metal plate and a second current collection metal plate are fixed to the bottom end of the LED chip N pole and the bottom end of the LED chip P pole respectively, and a soft conductive layer is arranged at the top end of the LED chip N pole. And a plurality of power supply access contact terminals connected with a power supply outgoing line of the LED chip are embedded and fixed in the bottom end of the LED chip main body. According to the invention, the non-rigid soft jelly conductive adhesive coating and the soft conductive film covering with the LED chip N pole and the LED chip P pole are in contact, so that the problem that the detection effect is affected due to the fact that the electrodes cannot be in contact due to different surface flatness of the LED Die is avoided.

Description

Technical Field

[0001] The invention relates to the field of conductive testing platforms, in particular to a soft jelly conductive testing platform. Background Art

[0002] LED (light emitting diode) is an efficient and energy-saving light source, widely used in lighting, display and communication. With the continuous advancement of technology, the optical performance of LED is crucial to its application effect. Therefore, accurate optical testing of LED is a key link to ensure that its performance meets the requirements. During the production and testing of the flip-chip LED chip body, one DIE on the chip will have N LED light points. In the chip manufacturing process, it is necessary to detect whether each LED in the die is emitting light.

[0003] Patent No. CN102326090A discloses an LED chip testing device, which measures the characteristics of an LED chip. The LED chip testing device comprises: a rotating member, which supports the LED chip and rotates the LED chip to a test position for testing the characteristics of the LED chip; and a testing machine, which is installed adjacent to the rotating member and is used to measure the characteristics of the LED chip at the test position.

[0004] However, due to the different production processes of the flip-chip LED chip body, the surface flatness of each Die is different. Currently, most of them use electrode sheets for contact conduction. Therefore, when a single rigid conductive structure is used to connect multiple LED chip bodies for luminescence testing, some Dies will be unable to contact the rigid conductive structure, resulting in poor test results for the luminescence of the LED chip body. Summary of the invention

[0005] Based on this, the purpose of the present invention is to provide a soft jelly conductive testing platform to solve the technical problem that when a single rigid conductive structure is used to connect multiple LED chip bodies for luminescence testing, some Dies cannot contact the rigid conductive structure, resulting in poor test effect on the luminescence of the LED chip body.

[0006] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a soft jelly gel conductive detection platform, comprising an LED test chip base and a plurality of LED chip bodies arranged on the LED test chip base, the LED chip body comprising an LED chip N pole arranged at a central position and an LED chip P pole arranged at an edge position, and an LED chip P / N pole insulating isolation belt is arranged at the central position of the LED chip body, a first collector metal plate and a second collector metal plate are respectively fixed to the bottom ends of the LED chip N pole and the LED chip P pole, and a soft conductive layer is arranged at the top of the LED chip N pole, the first collector metal plate and the second collector metal plate are both fixed to the bottom ends of the LED chip power supply lead wires, and a plurality of power supply access contact terminals connected to the LED chip power supply lead wires are embedded and fixed at the bottom end of the LED chip body.

[0007] The present invention is further configured as follows: the soft conductive layer includes a non-rigid soft jelly conductive glue coating and a soft conductive film, and the thickness of the soft conductive layer exceeds the insulating isolation zone and is less than half the width of the insulating isolation zone. The soft conductive film is bonded to the surface of the LED chip body, and the LED chip N pole and the LED chip P pole are respectively provided on the LED chip body, and the LED chip N pole and the LED chip P pole are isolated by the LED chip P / N pole insulating isolation zone. The LED chip body connects the LED chip N pole and the LED chip P pole through the soft conductive layer, and supplies power through the LED chip power supply lead wire and the power access contact terminal. The soft structure of the non-rigid soft jelly conductive glue coating and the soft conductive film covering are in contact with the LED chip N pole and the LED chip P pole. The conductive material of the soft structure has a certain fluidity, thereby avoiding the problem of electrodes being unable to contact and affecting the detection effect due to the different surface flatness of each LED Die, thereby improving the accuracy of LED chip body detection.

[0008] The present invention is further configured that the testing steps of the LED test chip base include:

[0009] S1 places the chip to be tested on the test equipment and positions it (whole wafer test);

[0010] The S2 test equipment scans the layout to confirm the position of the single LED Die under test;

[0011] S3: Move the test unit to the top of the LED Die under test and press down. The downward pressure of the test unit shall not exceed 0.5N.

[0012] After S4 applies a soft structure conductive layer on the LED, it energizes the chip to be tested and lights up the LED to be tested;

[0013] S5 collects and analyzes the main image of the LED chip;

[0014] The S6 optical inspection equipment confirms the quality of the LED Die based on the analysis results.

[0015] The present invention is further configured that the acquisition and analysis of the main image of the LED chip includes:

[0016] Under the light source of a fixed LED lamp, the camera on the test equipment captures a high-definition image of the target object;

[0017] Perform noise filtering on the collected images to remove interference signals in the images;

[0018] Enhance the edge features of the image to make the details in the image clearer;

[0019] Adjust the grayscale value of the image for subsequent analysis;

[0020] Use algorithms to extract key features, including the brightness of the LEDs;

[0021] The set parameter range determines whether there are defects in the inspection area;

[0022] The present invention is further configured such that the test equipment adopts artificial intelligence technology and deep learning to train big data samples, which significantly improves the accuracy of defect identification. After the test equipment completes the test, the system generates a report indicating the defect type and specific location. The test equipment uses optical imaging technology and image processing algorithms to quickly and efficiently complete quality inspection of large quantities of products.

[0023] The present invention is further configured that the components of the non-rigid soft jelly conductive adhesive include: epoxy resin (20-30%), graphene (1-3%), nano silver powder (1-3%), polyurethane elastomer (10-15%), diluent (5-10%), curing agent (1-3%), toughening agent (0.5-1%), thixotropic agent (0.5-1%), and antioxidant (0.01-0.1%).

[0024] The present invention is further configured such that the main body of the epoxy resin is resin, the epoxy resin provides good bonding performance and mechanical strength, the nano silver powder is a high-conductivity filler, and the nano silver powder ensures that the non-rigid soft jelly conductive adhesive has good conductivity.

[0025] The present invention is further configured such that the polyurethane elastomer is used to increase the flexibility and elasticity of the non-rigid soft jelly conductive adhesive, so that the non-rigid soft jelly conductive adhesive can still maintain its performance when bent or folded, and the diluent is butyl acetate, which is used to reduce the viscosity of the non-rigid soft jelly conductive adhesive.

[0026] The present invention is further configured such that the curing agent is dicyandiamide, and the curing agent can promote the curing of the epoxy resin to ensure the structural stability of the non-rigid soft jelly conductive adhesive.

[0027] The present invention is further configured that the toughening agent is polyamide wax, and the toughening agent and the thixotropic agent can improve the impact resistance and construction performance of the non-rigid soft jelly conductive adhesive, and the antioxidant is used to protect the non-rigid soft jelly conductive adhesive from oxidation and prolong the service life of the non-rigid soft jelly conductive adhesive.

[0028] In summary, the present invention mainly has the following beneficial effects: the present invention respectively arranges the N pole of the LED chip and the P pole of the LED chip on the LED chip body, and isolates the N pole of the LED chip and the P pole of the LED chip through the LED chip P / N pole insulating isolation belt; the LED chip body connects the N pole of the LED chip and the P pole of the LED chip through a soft conductive layer, and supplies power through the LED chip power supply lead wire and the power access contact terminal; the soft structure is contacted with the N pole of the LED chip and the P pole of the LED chip by coating with non-rigid soft jelly conductive glue and covering with soft conductive film; the conductive material of the soft structure has a certain fluidity, thereby avoiding the problem of electrodes being unable to contact and affecting the detection effect due to the different surface flatness of each LED Die, thereby improving the accuracy of LED chip body detection. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 It is a schematic diagram of the three-dimensional structure of the present invention;

[0030] Figure 2 This is a schematic diagram of the main structure of the LED chip of the present invention;

[0031] Figure 3 This is a schematic diagram of the main test structure of the LED chip of the present invention;

[0032] Figure 4 This is a schematic diagram of the internal structure of the LED chip body of the present invention;

[0033] Figure 5 It is a schematic diagram of the test process of the present invention;

[0034] Figure 6 It is a schematic diagram of the LED chip main body image acquisition and analysis process of the present invention.

[0035] In the figure: 1. LED test chip base; 2. LED chip body; 3. LED chip P pole; 4. LED chip N pole; 5. LED chip P / N pole insulation isolation belt; 6. Soft conductive layer; 7. First collector metal plate; 8. Second collector metal plate; 9. LED chip power supply lead wire; 10. Power access contact terminal. DETAILED DESCRIPTION

[0036] The following will be combined with the accompanying drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0037] A soft jelly gel conductive test station, such as Figure 1-6 As shown, it includes an LED test chip base and a plurality of LED chip bodies arranged on the LED test chip base, the LED chip body includes an LED chip N pole arranged at a central position and an LED chip P pole arranged at an edge position, and an LED chip P / N pole insulating isolation belt is arranged at the central position of the LED chip body, the bottom ends of the LED chip N pole and the LED chip P pole are respectively fixed with a first collector metal plate and a second collector metal plate, and a soft conductive layer is arranged at the top of the LED chip N pole, the bottom ends of the first collector metal plate and the second collector metal plate are both fixed with LED chip power supply lead wires, and the bottom end of the LED chip body is embedded with a plurality of power access contact terminals connected to the LED chip power supply lead wires.

[0038] The soft conductive layer includes a non-rigid soft jelly conductive glue coating and a soft conductive film, and the thickness of the soft conductive layer exceeds the insulating isolation zone and is less than half the width of the insulating isolation zone. The soft conductive film is bonded to the surface of the LED chip body, and the LED chip N pole and the LED chip P pole are respectively arranged on the LED chip body, and the LED chip N pole and the LED chip P pole are isolated by the LED chip P / N pole insulating isolation zone. The LED chip body connects the LED chip N pole and the LED chip P pole through the soft conductive layer, and supplies power through the LED chip power supply lead wire and the power access contact terminal. The soft structure of the non-rigid soft jelly conductive glue coating and the soft conductive film covering are in contact with the LED chip N pole and the LED chip P pole. The conductive material of the soft structure has a certain fluidity, thereby avoiding the problem of electrodes being unable to contact and affecting the detection effect due to the different surface flatness of each LED Die, thereby improving the accuracy of LED chip body detection.

[0039] The test steps of LED test chip base include:

[0040] S1 places the chip to be tested on the test equipment and positions it (whole wafer test);

[0041] The S2 test equipment scans the layout to confirm the position of the single LED Die under test;

[0042] S3: Move the test unit to the top of the LED Die under test and press down. The downward pressure of the test unit shall not exceed 0.5N.

[0043] After S4 applies a soft structure conductive layer on the LED, it energizes the chip to be tested and lights up the LED to be tested;

[0044] S5 collects and analyzes the main image of the LED chip;

[0045] The S6 optical inspection equipment confirms the quality of the LED Die based on the analysis results.

[0046] The acquisition and analysis of the main image of the LED chip includes:

[0047] Under the light source of a fixed LED lamp, the camera on the test equipment captures a high-definition image of the target object;

[0048] Perform noise filtering on the collected images to remove interference signals in the images;

[0049] Enhance the edge features of the image to make the details in the image clearer;

[0050] Adjust the grayscale value of the image for subsequent analysis;

[0051] Use algorithms to extract key features, including the brightness of the LEDs;

[0052] The set parameter range determines whether there are defects in the inspection area;

[0053] The testing equipment uses artificial intelligence technology and deep learning to train big data samples, which significantly improves the accuracy of defect identification. After the test is completed, the system generates a report indicating the defect type and specific location. The testing equipment uses optical imaging technology and image processing algorithms to quickly and efficiently complete the quality inspection of large quantities of products. Optical testing equipment can achieve fast and high-precision detection of surface defects, size measurement, shape detection, etc. through high-precision optical imaging and image processing technology.

[0054] Furthermore, the components of the non-rigid soft jelly conductive adhesive include: epoxy resin (20-30%), graphene (1-3%), nano silver powder (1-3%), polyurethane elastomer (10-15%), diluent (5-10%), curing agent (1-3%), toughening agent (0.5-1%), thixotropic agent (0.5-1%), and antioxidant (0.01-0.1%).

[0055] The main body of the epoxy resin is resin, which provides good bonding performance and mechanical strength. The nano silver powder is a highly conductive filler, which ensures that the non-rigid soft jelly conductive adhesive has good conductive properties.

[0056] The polyurethane elastomer is used to increase the flexibility and elasticity of the non-rigid soft jelly conductive adhesive, so that the non-rigid soft jelly conductive adhesive can still maintain its performance when bent or folded. The diluent is butyl acetate, which is used to reduce the viscosity of the non-rigid soft jelly conductive adhesive.

[0057] The curing agent is dicyandiamide, which can promote the curing of epoxy resin and ensure the structural stability of the non-rigid soft jelly conductive adhesive.

[0058] The toughening agent is polyamide wax, and the toughening agent and thixotropic agent can improve the impact resistance and construction performance of the non-rigid soft jelly conductive adhesive. The antioxidant is used to protect the non-rigid soft jelly conductive adhesive from oxidation and extend the service life of the non-rigid soft jelly conductive adhesive.

[0059] The working principle of the present invention is as follows: an LED chip N pole and an LED chip P pole are respectively arranged on the LED chip body, and the LED chip N pole and the LED chip P pole are isolated by the LED chip P / N pole insulating isolation belt; the LED chip body connects the LED chip N pole and the LED chip P pole through a soft conductive layer, and supplies power through the LED chip power supply lead wire and the power access contact terminal; the soft structure is contacted with the LED chip N pole and the LED chip P pole by coating with non-rigid soft jelly conductive glue and covering with soft conductive film; the conductive material of the soft structure has a certain fluidity, thereby avoiding the problem that the electrodes cannot contact each other due to the different surface flatness of each LED Die, which affects the detection effect, and improves the accuracy of the LED chip body detection.

[0060] Although an embodiment of the present invention has been shown and described, this specific embodiment is merely an explanation of the present invention and is not a limitation of the invention. The specific features, structures, materials or characteristics described may be combined in a suitable manner in any one or more embodiments or examples. After reading this specification, those skilled in the art may make modifications, substitutions and variations to the embodiments without creative contributions as needed without departing from the principles and purpose of the present invention. However, as long as they are within the scope of the claims of the present invention, they are protected by patent law.

Claims

1. A soft jelly conductive test station, comprising an LED test chip base (1) and a plurality of LED chip bodies (2) arranged on the LED test chip base (1), characterized in that: The LED chip body (2) comprises an LED chip N pole (4) arranged at a central position and an LED chip P pole (3) arranged at an edge position, and an LED chip P / N pole insulating isolation zone (5) is arranged at the central position of the LED chip body (2), a first collector metal plate (7) and a second collector metal plate (8) are respectively fixed to the bottom ends of the LED chip N pole (4) and the LED chip P pole (3), and a soft conductive layer (6) is arranged at the top end of the LED chip N pole (4), LED chip power supply lead wires (9) are fixed to the bottom ends of the first collector metal plate (7) and the second collector metal plate (8), and a plurality of power supply access contact terminals (10) connected to the LED chip power supply lead wires (9) are embedded and fixed at the bottom end of the LED chip body (2).

2. A soft jelly conductive test station according to claim 1, characterized in that: The soft conductive layer (6) comprises a non-rigid soft jelly conductive adhesive coating and a soft conductive film, and the thickness of the soft conductive layer (6) exceeds the insulating isolation zone and is less than half the width of the insulating isolation zone, and the soft conductive film is bonded to the surface of the LED chip body (2).

3. A soft jelly conductive test station according to claim 1, characterized in that: The testing steps of the LED test chip base include: S1 places the chip to be tested on the test equipment and positions it (whole wafer test); The S2 test equipment scans the layout to confirm the position of the single LED Die under test; S3: Move the test unit to the top of the LED Die under test and press down. The downward pressure of the test unit shall not exceed 0.5N. After S4 applies a soft structure conductive layer on the LED, it energizes the chip to be tested and lights up the LED to be tested; S5 collects and analyzes the main image of the LED chip; The S6 optical inspection equipment confirms the quality of the LED Die based on the analysis results.

4. A soft jelly conductive test station according to claim 1, characterized in that: The LED chip main body image acquisition and analysis includes: Under the light source of a fixed LED lamp, the camera on the test equipment captures a high-definition image of the target object; Perform noise filtering on the collected images to remove interference signals in the images; Enhance the edge features of the image to make the details in the image clearer; Adjust the grayscale value of the image for subsequent analysis; Use algorithms to extract key features, including the brightness of the LEDs; The set parameter range determines whether there are defects in the inspection area.

5. A soft jelly conductive test station according to claim 4, characterized in that: The testing equipment adopts artificial intelligence technology and deep learning to train big data samples, which significantly improves the accuracy of defect identification. After the testing equipment completes the detection, the system generates a report indicating the defect type and specific location. The testing equipment uses optical imaging technology and image processing algorithms to quickly and efficiently complete the quality inspection of large quantities of products.

6. A soft jelly conductive test station according to claim 1, characterized in that: The components of the non-rigid soft jelly conductive adhesive include: epoxy resin (20-30%), graphene (1-3%), nano silver powder (1-3%), polyurethane elastomer (10-15%), diluent (5-10%), curing agent (1-3%), toughening agent (0.5-1%), thixotropic agent (0.5-1%), and antioxidant (0.01-0.1%).

7. A soft jelly conductive test station according to claim 6, characterized in that: The main body of the epoxy resin is resin, which provides good bonding performance and mechanical strength. The nano silver powder is a highly conductive filler, which ensures that the non-rigid soft jelly conductive adhesive has good conductive performance.

8. A soft jelly conductive test station according to claim 7, characterized in that: The polyurethane elastomer is used to increase the flexibility and elasticity of the non-rigid soft jelly conductive adhesive, so that the non-rigid soft jelly conductive adhesive can still maintain its performance when bent or folded. The diluent is butyl acetate, which is used to reduce the viscosity of the non-rigid soft jelly conductive adhesive.

9. A soft jelly conductive test station according to claim 8, characterized in that: The curing agent is dicyandiamide, which can promote the curing of epoxy resin and ensure the structural stability of the non-rigid soft jelly conductive adhesive.

10. A soft jelly conductive test station according to claim 9, characterized in that: The toughening agent is polyamide wax, and the toughening agent and thixotropic agent can improve the impact resistance and construction performance of the non-rigid soft jelly conductive adhesive. The antioxidant is used to protect the non-rigid soft jelly conductive adhesive from oxidation and extend the service life of the non-rigid soft jelly conductive adhesive.

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