Infrared long-wave high-threshold low-damage metal high-reflection film and preparation method thereof

Abstract

The invention discloses an infrared long-wave high-threshold low-damage metal high-reflection film and a preparation method thereof, and belongs to the field of infrared high reflection, the infrared long-wave high-threshold low-damage metal high-reflection film comprises a substrate and a Cr layer, a Cu layer, an Au layer, a Y2O3 layer, a ZnS layer and a YbF3 layer which are plated on the substrate, the substrate is an aluminum substrate, and the problems that in the prior art, an infrared high-reflection film is thick, the reflectivity is low, the thin film is not firm, and the damage rate is high are solved. And the service life is short.

Description

Technical Field

[0001] The invention relates to the field of infrared anti-reflection, and in particular to an infrared long-wave high-threshold low-damage metal high-reflection film and a preparation method thereof. Background Art

[0002] In the field of modern science and technology, long-wave infrared high-reflective film plays an indispensable role in many key fields with its unique optical properties. It mainly includes the following aspects: material science, biomedicine, environmental monitoring, security monitoring, energy, and aerospace. In the field of material science, it helps to conduct in-depth research on the microstructure and optical properties of materials; in biomedicine, it provides important support for infrared imaging diagnosis, photothermal therapy and other technologies; in environmental monitoring, it can be used for high-precision detection of atmospheric pollutants, greenhouse gases, etc.; in the field of security monitoring, it improves the imaging quality of monitoring equipment at night and in harsh environments; in the field of energy, it plays a role in solar energy utilization, infrared radiation refrigeration, etc.; in the field of aerospace, it guarantees the optical detection and communication functions of aircraft in complex space environments.

[0003] However, there are many problems that need to be solved in the existing infrared high-reflection film. First, the film thickness is not ideal, which limits its reflection efficiency of infrared light, resulting in low reflectivity and unable to meet some application scenarios with strict requirements for high reflectivity. Secondly, the adhesion between the film and the substrate is insufficient, which makes the film unstable and prone to shedding and peeling during actual use, greatly affecting its service life. Among the commonly used infrared high-reflection film materials, although gold has extremely high reflectivity in the infrared region, good chemical stability, is not easy to oxidize and be contaminated, and can maintain high reflectivity for a long time, its texture is relatively soft, has poor adhesion to the substrate, has low hardness, and is very easy to be scratched or peeled off. Chromium has good mechanical properties, and the chromium film plated on the substrate is firmly bonded to the substrate. Therefore, this characteristic of the chromium film is often used to use an extremely thin chromium film as a transition layer and as a bottom film of gold to enhance the adhesion of the gold film to the substrate. The transparent area of ​​ZnS film is 0.38-14.0um, and it has good adhesion to other material films pre-plated on the substrate. However, when deposited on a room temperature substrate, the film firmness is often poor. The transparent area of ​​YbF3 film is 0.35-12.0um. YbF3 film deposited on a room temperature substrate shows a slightly lower refractive index value. YbF3 film deposited at a higher rate shows a higher tensile stress. When deposited on a ZnS substrate, it will completely fall off the substrate. In addition, YbF3 material is prone to splashing during evaporation, and sufficient pre-melting and degassing treatment is required. The existing infrared high-reflection film has problems in film thickness, reflectivity, film firmness and service life, which seriously restricts its further development and application in various fields. Therefore, it is of great practical significance and market demand to develop a new long-wave infrared high-reflection film that can effectively solve the above problems. Summary of the invention

[0004] The invention provides an infrared long-wave high-threshold low-damage metal high-reflective film and a preparation method thereof, which solves the problems of thick infrared high-reflective film, low reflectivity, weak film and short service life existing in the prior art.

[0005] In order to solve this technical problem, the present invention provides the following technical solution:

[0006] An infrared long-wave high-threshold low-damage metal high-reflective film comprises: a substrate and a Cr layer, a Cu layer, an Au layer, a Y2O3 layer, a ZnS layer and a YbF3 layer plated on the substrate; the substrate is an aluminum substrate.

[0007] Cr has good mechanical properties, and the chromium film plated on the substrate is very firmly bonded to the substrate. Taking advantage of this property of the chromium film, an extremely thin chromium film is used as a transition layer, as a base film of gold to enhance the adhesion of the gold film to the substrate.

[0008] The combination of chromium and copper can further improve the adhesion between the gold film and the substrate.

[0009] Gold has extremely high reflectivity in the infrared region and good chemical stability. Gold film is not easy to oxidize and is not easily polluted in the atmosphere, so it can maintain its high reflectivity characteristics for a long time. The gold film is relatively soft, has poor adhesion to the substrate, has low hardness, and is easily scratched or peeled off. In order to improve the adhesion of the gold film to the substrate, a layer of chrome film is first plated on the substrate as a base, and then the gold film is plated. This is because the adhesion between the gold film and the chrome film is relatively good, and the adhesion between the substrate and the chrome film is also relatively good.

[0010] The transparent area of ​​Y2O3 film is 0.3-12.0um, with extremely good mechanical strength and good water resistance. It is often used as a protective coating for metal reflectors in the infrared region (8.0-13um). It has good adhesion to gold film and is also used as a transition layer.

[0011] The transparent area of ​​ZnS film is 0.38-14.0um. ZnS film has good adhesion to other material films pre-plated on the substrate. When ZnS film is deposited on a substrate at room temperature, its film firmness is often very poor; if ion source assistance is implemented, good film firmness can be obtained.

[0012] The transparent area of ​​the YbF3 film is 0.35-12.0um. The YbF3 film deposited on a room temperature substrate shows a slightly lower refractive index value. The YbF3 film deposited at a higher rate shows a higher tensile stress, and when it is deposited on a ZnS substrate, it will completely fall off the substrate.

[0013] Preferably, the spectral performance index of the infrared long-wave high-threshold low-damage metal high-reflective film is:

[0014] Rave≥99.65%@7.7-10.5um.

[0015] This solution also provides a method for preparing the above-mentioned infrared long-wave high-threshold low-damage metal high-reflective film, comprising the following steps:

[0016] S1. Pre-melting before plating: 1# and 2# molybdenum boats are loaded with high-purity YbF3 and Au; copper crucibles are loaded with Cr, Cu, Y2O3 and ZnS respectively; clean Al substrate test pieces are loaded into the vacuum chamber; the vacuum chamber door is closed, and the vacuum chamber is automatically evacuated. The vacuum chamber is kept closed for baking; the vacuum degree of the vacuum chamber reaches 10 -4 Pa, 40 minutes;

[0017] First, slowly increase the beam current of molybdenum boat 1# to 420A, the molybdenum boat begins to turn red, pause for 120s, and the vacuum degree does not change; continue to increase the beam current to 480A, the molybdenum boat turns red, pause for 180s, and the vacuum degree does not change; continue to increase the beam current to 540A, the molybdenum boat turns red and emits dazzling light, pause for 180s, and the vacuum degree does not change; continue to increase the beam current to 600A, the molybdenum boat turns red and emits dazzling white light, pause for 120s, and the vacuum degree quickly drops to 10 -3 Pa, lasting 30s, the vacuum degree quickly dropped to 10 -4 Pa; continue to increase the beam current to 660A, the entire molybdenum boat turns red, emits brighter and stronger white light, pause for 30s; slowly reduce the beam current to 0, the pre-melting of YbF3 in the 1# molybdenum boat is completed; place Au in the 2# molybdenum boat, slowly increase the beam current to 120A, the molybdenum boat turns red, and the gold particles begin to melt, gradually increase to 150A, the gold has become a solid-liquid mixture, the red light gradually becomes brighter, and the pre-melting is completed;

[0018] S2, Cr, Cu plating: adjust the vacuum degree of the vacuum chamber to 4.0*10 -4 Pa, set the revolution to 5R / M, perform pre-plating cleaning for 5 minutes, and the ion source beam current is 100mA; after cleaning, set the revolution to 30R / M, and use electron beam evaporation to plate Cr and Cu;

[0019] S3, Au plating: slowly increase the beam current to 120A, the molybdenum boat turns red, and the gold particles begin to melt. Gradually increase the beam current to 150A, the gold has become a solid-liquid mixture, and the red light gradually becomes dazzling; slowly increase the beam current to 220A, the gold liquid in the molybdenum boat rolls violently, emitting dazzling white light; quickly open the baffle, and officially start gold plating;

[0020] S4, Y2O3 plating: start the ion source, control the ion source baffle and the electron gun baffle to open at the same time; supplement the Y2O3 crucible with 20sccm of oxygen;

[0021] S5, ZnS plating: ion source filled with 20sccmAr, ion beam current 100mA auxiliary, vacuum degree 7.5*10 -3 Pa, ZnS evaporation rate 10 angstroms / second; S6, YbF3 plating: ion source filled with 20 sccmAr, ion beam current 100 mA auxiliary, vacuum degree 7.5*10 - 3 Pa, YbF3 evaporation rate 4 angstroms / second;

[0022] YbF3 material is prone to splashing during evaporation, so it needs to be fully pre-melted and degassed. Generally, it takes about 15 minutes to pre-melt. During deposition, attention should be paid to controlling the plating rate to reduce splashing.

[0023] Preferably, the vacuum degree of Cr and Cu deposited by electron beam evaporation in step S2 is 8.0*10-4 Pa.

[0024] Preferably, the vacuum degree of gold plating in step S3 is 4.3*10 -4 Pa.

[0025] Preferably, the ion source in step S4 is high-purity Ar.

[0026] Preferably, the vacuum degree in step S4 is 9.0*10 -3 Pa.

[0027] Compared with the prior art, the present invention has the following advantages: the film layer is firm and good; it can withstand harsh use environments; and it has high laser resistance strength. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] The drawings described herein are used to provide a further understanding of the embodiments of the present invention, constitute a part of this application, and do not constitute a limitation of the embodiments of the present invention. In the drawings:

[0029] Figure 1 This is the roughness map of the Al substrate sample with D50*5 tested by the Armstrong white light interferometer;

[0030] Figure 2 The roughness diagram of the Al substrate sample with D50*5 in different directions tested by Armstrong white light interferometer;

[0031] Figure 3 This is the three-dimensional roughness map of the Al substrate sample with D50*5 tested by the Armstrong white light interferometer;

[0032] Figure 4 This is the actual test spectrum of the Al substrate sample with D50*5 of the present invention. DETAILED DESCRIPTION

[0033] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with embodiments. The illustrative embodiments of the present invention and their description are only used to explain the present invention and are not intended to limit the present invention.

[0034] An infrared long-wave high-threshold low-damage metal high-reflective film of this embodiment includes: a substrate and a Cr layer, a Cu layer, an Au layer, a Y2O3 layer, a ZnS layer and a YbF3 layer plated on the substrate; the substrate is an aluminum substrate.

[0035] The spectral performance mark of the infrared long-wave high-threshold low-damage metal high-reflective film is: Rave≥99.65%@7.7-10.5um.

[0036] This embodiment also provides a method for preparing an infrared long-wave high-threshold low-damage metal high-reflective film, comprising the following steps:

[0037] S1. Pre-melting before plating: 1# and 2# molybdenum boats are loaded with high-purity YbF3 and Au; copper crucibles are loaded with Cr, Cu, Y2O3 and ZnS respectively; clean Al substrate test pieces are loaded into the vacuum chamber; the vacuum chamber door is closed, and the vacuum chamber is automatically evacuated. The vacuum chamber is kept closed for baking; the vacuum degree of the vacuum chamber reaches 10 -4 Pa, 40 minutes;

[0038] First, slowly increase the beam current of molybdenum boat 1# to 420A, the molybdenum boat begins to turn red, pause for 120s, and the vacuum degree does not change; continue to increase the beam current to 480A, the molybdenum boat turns red, pause for 180s, and the vacuum degree does not change; continue to increase the beam current to 540A, the molybdenum boat turns red and emits dazzling light, pause for 180s, and the vacuum degree does not change; continue to increase the beam current to 600A, the molybdenum boat turns red and emits dazzling white light, pause for 120s, and the vacuum degree quickly drops to 10 -3 Pa, lasting 30s, the vacuum degree quickly dropped to 10 -4 Pa; continue to increase the beam current to 660A, the entire molybdenum boat turns red, emits brighter and stronger white light, pause for 30s; slowly reduce the beam current to 0, the pre-melting of YbF3 in the 1# molybdenum boat is completed; place Au in the 2# molybdenum boat, slowly increase the beam current to 120A, the molybdenum boat turns red, the gold particles begin to melt, gradually increase to 150A, the gold has become a solid-liquid mixture, the red light gradually becomes brighter, and the pre-melting is completed;

[0039] S2, Cr, Cu plating: adjust the vacuum degree of the vacuum chamber to 4.0*10 -4 Pa, set the revolution to 5R / M, pre-clean for 5 minutes before plating, and the ion source beam current is 100mA; after cleaning, set the revolution to 30R / M, and use electron beam evaporation to plate Cr and Cu, with a vacuum degree of 8.0*10 -4 Pa;

[0040] S3, Au plating: Slowly increase the beam current to 120A, the molybdenum boat turns red, and the gold particles begin to melt. Gradually increase the beam current to 150A, the gold has become a solid-liquid mixture, and the red light gradually becomes dazzling; slowly increase the beam current to 220A, the gold liquid in the molybdenum boat rolls violently, emitting dazzling white light; quickly open the baffle, and officially start gold plating; the vacuum degree is 4.3*10 -4 Pa.

[0041] S4, Y2O3 plating: Start the high-purity Ar ion source, control the ion source baffle and the electron gun baffle to open at the same time; Y2O3 crucible oxygen supplement 20sccm; vacuum degree is 9.0*10 -3 Pa

[0042] S5, ZnS plating: ion source filled with 20sccmAr, ion beam current 100mA auxiliary, vacuum degree 7.5*10-3 Pa, ZnS evaporation rate 10 Å / s;

[0043] S6, YbF3 plating: ion source filled with 20sccmAr, ion beam current 100mA auxiliary, vacuum degree 7.5*10 -3 Pa, YbF3 evaporation rate 4 angstroms / second.

[0044] Hereinafter, the embodiments of the present application will be described. The embodiments described below are exemplary and are only used to explain the present application, and should not be construed as limiting the present application. If no specific techniques or conditions are indicated in the embodiments, the techniques or conditions described in the literature in this area or the product specifications are used. If the manufacturer is not indicated in the reagents or instruments used, they are all conventional products that can be obtained commercially.

[0045] Example 1

[0046] 1. Preparation before plating.

[0047] Clean: Use anhydrous alcohol to repeatedly scrub two boat-shaped molybdenum boats, put them in an oven at 120°C to dry. Cool to room temperature, install them on the rotary steam-resisting point, seal the vacuum door, and evacuate to 3.0*10 -3 Pa, add the steam barrier beam to 200A, maintain for 30S, and completely remove the impurities on the surface of the molybdenum boat. Cool for 2 hours, release the gas, and take it out. Load high-purity YbF3, with a tare weight of 150g; there are twelve copper crucibles. The crucibles that have just been processed have impurities such as oil, so they need to be sandblasted with 0.3Kg pressure, and then the crucibles are repeatedly blown clean with high-pressure clean gas, and then cleaned with anhydrous alcohol for many times, and finally put into the oven at 120°C to dry. One for Cr, one for Cu, two for Y2O3, and eight for ZnS.

[0048] The vacuum chamber of the coating machine is thoroughly cleaned to keep it spotless. Key parts: steam blocking clamp, correction plate, baffle, electron gun head, scanning device.

[0049] 2. Plating process

[0050] 1. Load four clean Al substrate test pieces of D50. Close the vacuum chamber door, switch to automatic vacuum pumping, and keep the vacuum chamber baking closed. The vacuum degree of the vacuum chamber reaches 10 -4 Pa, it takes 40 minutes.

[0051] Pre-melting before plating begins. The conductivity of the molybdenum boat changes with its service life, and it keeps changing, causing the evaporation beam to change accordingly. General trend: the new boat is small, and the old boat is large. The new molybdenum boat 1# used in this experiment was installed in the rotating evaporation position 1# to evaporate YbF3. First, slowly increase the beam current of the 1# molybdenum boat to 420A. At this time, the molybdenum boat begins to turn red. After a pause of 120s, the vacuum degree does not change. Continue to increase the beam current to 480A, the entire molybdenum boat turns red, after a pause of 180s, the vacuum degree still does not change, continue to increase the beam current to 540A, the entire molybdenum boat turns red and emits a dazzling light, after a pause of 180s, the vacuum degree still does not change. Continue to increase the beam current to 600A, the entire molybdenum boat turns bright red and emits a dazzling white light, after a pause of 120s, the vacuum degree quickly drops to 10 -3 Pa, lasting 30s, the vacuum degree quickly dropped to 10 - 4 Pa. Continue to increase the beam current to 660A, the entire molybdenum boat turns red, emitting a brighter and stronger white light, and pause for 30s. At this time, from the observation window, you can see that there are dots of liquid droplets surging on the surface of the molybdenum boat. Slowly reduce the beam current to 0. At this point, the pre-melting of YbF3 in this boat is completed. The new molybdenum boat 2# is installed in the rotary resistance evaporation 2# position, and Au is placed: slowly increase the beam current to 120A, the molybdenum boat turns red, and the gold particles begin to melt. Gradually increase it to 150A, the gold has become a solid-liquid mixture, the red light gradually becomes dazzling, and the pre-melting is completed. Pre-melt Cu, put high-purity copper particles into a clean copper crucible, use a spot light, 300mA beam current, quickly burn the molten Cu, and remove surface impurities and oxides. Pre-melt Y2O3, put high-purity white Y2O3 particles into a clean copper crucible, melt them into a whole piece, remove impurities and pores, and eliminate sputtering hazards. Pre-melting takes 30 minutes.

[0052] 2. The vacuum degree of the vacuum chamber is 4.0*10 -4 Pa. Set the revolution to 5R / M, perform pre-cleaning for 5 minutes before plating, and the ion source beam current is 300-400mA.

[0053] 3. After cleaning, the revolution is set to 30R / M, EB plating Cr, Cu, vacuum degree at 8.0*10 -4 Pa.

[0054] 4. Au plating. The molybdenum boat for evaporating gold is placed at the 4# position of the rotary resist evaporator. The beam current is slowly increased to 120A. The molybdenum boat turns red and the gold particles begin to melt. The beam current is gradually increased to 150A. The gold has become a solid-liquid mixture and the red light gradually becomes dazzling. The beam current is slowly increased to 220A. The gold liquid in the tungsten boat rolls violently and emits a dazzling white light. The baffle is quickly opened to officially start gold plating. The vacuum degree is now 4.3*10 -4 Pa.

[0055] 5. Plating Y2O3+ZnS+YbF3: Start the ion source, control the ion source baffle and the electron gun baffle to open at the same time. Use high-purity Ar for the ion source and 20sccm for oxygen supplementation in the Y2O3 crucible. The vacuum degree is 9.0*10 -3 Pa, when plating ZnS, YbF3, the vacuum degree is 7.5*10 -3 Pa. Protective film plating time is 2.5 hours.

[0056] 6. Aging: After plating, age for 2.0 hours.

[0057] Figure 1 This is a roughness diagram of a D50*5 Al substrate plated sample tested by the Armstrong white light interferometer. The X and Y axes represent the test length range. The X-axis direction range is 0-616.8795um, the Y-axis direction range is 0-462.4183um, and R represents the vertical distance from each test point to the average line.

[0058] Figure 2 This is the roughness map of the D50*5 Al substrate sample tested by the Armstrong white light interferometer. Figure 2 As shown in (a), the X-axis represents the test length, which is 616.8798um, and R represents the vertical distance from each test point to the average line. Figure 2 As shown in (b), the Y axis represents the test length, which is 462.4183um, R represents the vertical distance from each test point to the average line, and △Z represents the average roughness value in the range of X and Y axes. Figure 1 and Figure 2 It can be seen that in the range of 0-616.8798um on the X axis, the average roughness △Z is 0.1540nm, and in the range of 0-462.4183um on the Y axis, the average roughness △Z is 0.1333nm.

[0059] The three-dimensional roughness map of surface roughness detection is as follows Figure 3As shown in the figure, it can be measured that Ra (arithmetic mean roughness): the arithmetic mean of the absolute value of the deviation of each point on the profile curve from the average line is 0.216nm; Rp (maximum peak height): the vertical distance from the highest peak in the profile to the average line is 3.525nm; Rq (root mean square roughness): the root mean square value (RMS) of the deviation of each point on the profile curve from the average line is 0.275nm; Rt (total height of the profile): the vertical distance between the highest peak and the lowest valley in the profile (peak-to-valley difference) is 5.005nm; Rv (maximum valley depth): the vertical distance from the lowest valley in the profile to the average line is -1.48nm. The following physical properties tests were carried out on the prepared product: high and low temperature (±120°): holding time: 30min; temperature change rate: ≥10°C / min, number of cycles: 3 times; in the last cycle, keep warm at high and low temperatures for 2H. The film layer is not allowed to have peeling, delamination, cracks, and blistering. Ring test: After soaking in pure water with a resistivity greater than 55KΩ.CM for 24 hours at 16-32°C, clean the surface and inspect the film layer. There should be no peeling, delamination, cracks, or blistering defects. Firmness test: Use a 2CM wide tape with a peel strength of not less than 2.74N / CM to firmly stick it on the surface of the test piece film layer, and pull it up vertically and quickly. After the test, the film layer should not have delamination or cracking. Laser tolerance: Laser wavelength: 10.06um±0.2um, power spectrum density: 30W / cm 2 ,Duration: 30min, Spot diameter: 0.60cm, Three points, Adjust the output power to meet the average power spectrum density requirements, After the test, the film should not have peeling or cracking. All four samples passed at one time and all were qualified.

[0060] Spectral performance such as Figure 4 As shown in the figure, the D50*5 Al substrate accompanying plating film is tested by PE infrared spectrometer. The X-axis represents the test wavelength range of 7.0-12.0um, and the Y-axis represents the test reflectivity Rave=99.65%, Rave=99.65%@7.7-10.5um. It can be seen that the film has high reflectivity and better laser tolerance.

[0061] The specific implementation methods described above further illustrate the objectives, technical solutions and beneficial effects of the present invention in detail. It should be understood that the above description is only a specific implementation method of the present invention and is not intended to limit the scope of protection of the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. An infrared long-wave high-threshold low-damage metal high-reflective film, characterized in that: include: A substrate and a Cr layer, a Cu layer, an Au layer, a Y2O3 layer, a ZnS layer and a YbF3 layer plated on the substrate, wherein the substrate is an aluminum substrate.

2. The infrared long-wave high-threshold low-damage metal high-reflective film according to claim 1, characterized in that: The spectral performance mark of the infrared long-wave high-threshold low-damage metal high-reflective film is: Rave≥99.65%@7.7-10.5um.

3. The method for preparing a long-wave infrared high-threshold low-damage metal high-reflective film according to claim 1 or 2, characterized in that: The steps include: S1. Pre-melting before plating: 1# and 2# molybdenum boats are loaded with high-purity YbF3 and Au; copper crucibles are loaded with Cr, Cu, Y2O3 and ZnS respectively; clean Al substrate test pieces are loaded into the vacuum chamber; the vacuum chamber door is closed, and the vacuum chamber is automatically evacuated. The vacuum chamber is kept closed for baking; the vacuum degree of the vacuum chamber reaches 10 -4 Pa, 40 minutes; First, slowly increase the beam current of molybdenum boat 1# to 420A, the molybdenum boat begins to turn red, pause for 120s, and the vacuum degree does not change; continue to increase the beam current to 480A, the molybdenum boat turns red, pause for 180s, and the vacuum degree does not change; continue to increase the beam current to 540A, the molybdenum boat turns red and emits dazzling light, pause for 180s, and the vacuum degree does not change; continue to increase the beam current to 600A, the molybdenum boat turns red and emits dazzling white light, pause for 120s, and the vacuum degree quickly drops to 10 -3 Pa, lasting 30s, the vacuum degree quickly dropped to 10 -4 Pa; continue to increase the beam current to 660A, the entire molybdenum boat turns red, emits brighter and stronger white light, pause for 30s; slowly reduce the beam current to 0, the pre-melting of YbF3 in the 1# molybdenum boat is completed; place Au in the 2# molybdenum boat, slowly increase the beam current to 120A, the molybdenum boat turns red, the gold particles begin to melt, gradually increase to 150A, the gold has become a solid-liquid mixture, the red light gradually becomes brighter, and the pre-melting is completed; S2, Cr, Cu plating: adjust the vacuum degree of the vacuum chamber to 4.0*10 -4 Pa, set the revolution to 5R / M, perform pre-plating cleaning for 5 minutes, and the ion source beam current is 100mA; after cleaning, set the revolution to 30R / M, and use electron beam evaporation to plate Cr and Cu; S3, Au plating: slowly increase the beam current to 120A, the molybdenum boat turns red, and the gold particles begin to melt. Gradually increase the beam current to 150A, the gold has become a solid-liquid mixture, and the red light gradually becomes dazzling; slowly increase the beam current to 220A, the gold liquid in the molybdenum boat rolls violently, emitting dazzling white light; quickly open the baffle, and officially start gold plating; S4, Y2O3 plating: start the ion source, control the ion source baffle and the electron gun baffle to open at the same time; supplement the Y2O3 crucible with 20sccm of oxygen; S5, ZnS plating: ion source filled with 20sccmAr, ion beam current 100mA auxiliary, vacuum degree 7.5*10 -3 Pa, ZnS evaporation rate 10 Å / s; S6, YbF3 plating: ion source filled with 20sccmAr, ion beam current 100mA auxiliary, vacuum degree 7.5*10 -3 Pa, YbF3 evaporation rate 4 angstroms / second.

4. The method for preparing an infrared long-wave high-threshold low-damage metal high-reflective film according to claim 3, characterized in that: In step S2, the vacuum degree of Cr and Cu deposited by electron beam evaporation is 8.0*10 -4 Pa.

5. The method for preparing an infrared long-wave high-threshold low-damage metal high-reflective film according to claim 3, characterized in that: The vacuum degree of gold plating in step S3 is 4.3*10 -4 Pa.

6. The method for preparing a long-wave infrared high-threshold low-damage metal high-reflective film according to claim 3, characterized in that: The ion source in step S4 is high-purity Ar.

7. The method for preparing an infrared long-wave high-threshold low-damage metal high-reflective film according to claim 3, characterized in that: Step S4 vacuum degree is 9.0*10 -3 Pa.

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