Wafer processing method and processing device capable of improving productivity

Abstract

The invention relates to a wafer processing method capable of improving productivity and a processing device, and belongs to the technical field of semiconductor manufacturing processes, the wafer processing method capable of improving productivity comprises the following steps: step S100, a first robot takes out a wafer from a wafer box station, and sends the wafer into an alignment unit to align the wafer; the second robot grabs the aligned wafer and sends the wafer into a glue uniformizing cavity for glue uniformizing; after glue uniformizing of the wafer is completed, the second robot takes out the wafer from the glue uniformizing cavity and sends the wafer into a heating unit for hot drying; step S200, after the wafer is dried, the first robot and the second robot cooperatively send the wafer into a cooling unit for cooling; and after the wafer is cooled, the first robot takes out the wafer from the cooling unit and sends the wafer back to the box station. According to the invention, the wafer processing capacity can be improved.

Description

Technical Field

[0001] The present invention belongs to the field of semiconductor manufacturing process technology, and specifically relates to a wafer processing method and processing device that can improve production capacity. Background Art

[0002] In the existing field of semiconductor manufacturing process technology, the photolithography process usually includes multiple steps such as coating, exposure, and development. Coating is to evenly coat the photoresist on the surface of the wafer to form a photoresist film with uniform thickness and good performance, ready for exposure. Development is to process the exposed photoresist by chemical methods to make the exposed area and the unexposed area have different dissolution characteristics, thereby forming a pattern corresponding to the mask. Therefore, coating and development are indispensable links in the photolithography process, and their quality directly affects the final effect of the photolithography and the performance of the chip.

[0003] In the wafer uniformization process, process robots and box station robots are usually used. The box station robot transfers the wafers, and the process robot moves the wafers. If there are problems in the timing coordination between the process robot and the box station robot, such as the box station robot fails to send the wafer to the centering unit in time, or the box station robot or process robot fails to take the wafer away in time after the uniform coating is completed, the uniform coating equipment will be idle and waiting. Idle robots usually cannot create value, resulting in idleness and waste of production resources, low production efficiency, waste of production time, reduced production capacity, and inability to form an efficient and stable production rhythm, affecting the continuity and smoothness of production. Therefore, how to make the box station robot and the process robot work together to improve the production capacity of wafer uniform coating has become a technical problem that existing wafer processing equipment manufacturers need to solve. Summary of the invention

[0004] In view of the above technical problems, the present invention application provides a wafer processing method and a processing device that can improve productivity, aiming to partially or completely solve the technical problem of low efficiency in existing wafer processing. Accordingly, the technical solution adopted by the present invention application is as follows:

[0005] In a first aspect, a wafer processing method capable of improving productivity includes: a wafer processing method capable of improving productivity, characterized in that it includes:

[0006] Step S100, control the first robot to take out the wafer from the wafer box station and send it to the alignment unit to align the wafer; control the second robot to grab the aligned wafer and send it into the glue-spreading chamber for glue-spreading; after the wafer is glued, control the second robot to take out the wafer from the glue-spreading chamber and send it to the heating unit for heat baking;

[0007] Step S200, when the wafer is finished being heated, the first robot and the second robot are controlled to cooperatively send the wafer to the cooling unit for cooling; after the wafer is finished being cooled, the first robot is controlled to take the wafer out of the cooling unit and send it back to the box station.

[0008] Optionally, step S100 includes:

[0009] Step S101: controlling the first robot to take out the wafer from the wafer box station and send it to the alignment unit to align the wafer;

[0010] Step S102: Control the second robot to grab the aligned wafer and send the wafer into the glue-spreading chamber for glue-spreading;

[0011] Step S103: After the wafer is coated with glue, the second robot is controlled to take out the wafer from the coating chamber and send it to the heating unit for thermal drying.

[0012] Optionally, step S100 includes:

[0013] Step S201, after the wafer is baked, the first robot and the second robot are controlled to collaboratively send the wafer to a cooling unit for cooling;

[0014] Step S202: After the wafer is cooled, the first robot is controlled to take the wafer out of the cooling unit and send it back to the box station.

[0015] Optionally, step S101 includes: controlling the first robot to take out the wafer from the wafer box station, and the first robot rotates and lifts the wafer to place it into the alignment unit.

[0016] Optionally, step S102 includes: controlling the second robot to take out the aligned wafer from the alignment unit, and the second robot rotates and lifts the wafer to place it into the glue-spreading chamber.

[0017] Optionally, step S103 includes: after the wafer is coated with glue, controlling the second robot to take out the wafer from the coating chamber, and the second robot rotates and lifts the wafer to place the wafer into the heating unit for baking.

[0018] Optionally, step S201 includes:

[0019] Step S2011: after the wafer is baked, determine whether the first robot and the second robot are idle. If the first robot is idle and the second robot is not idle, proceed to step S2012; if the second robot is idle and the first robot is not idle, proceed to step S2013;

[0020] Step S2012: After the wafer is baked, the first robot sends the wafer to a cooling unit for cooling;

[0021] Step S2013: After the wafer has been baked, the second robot sends the wafer to a cooling unit for cooling.

[0022] Optionally, step S202 includes: after the wafer is completely cooled, the first robot takes the wafer out of the cooling unit, and then the first robot rotates and lifts the wafer back to the wafer box station.

[0023] Optionally, step S201 includes: when the first wafer is completed by thermal baking, the second robot sends it to the cooling unit for cooling; when the second wafer is completed by thermal baking, the first robot sends it to the cooling unit for cooling; the first robot and the second robot work alternately.

[0024] In a second aspect, a wafer processing device capable of improving productivity includes a memory and a processor that are communicatively connected, wherein the memory is used to store a computer program, and the processor is used to read the computer program and execute a wafer processing method capable of improving productivity as described in any one of the first aspects.

[0025] Compared with the prior art, the beneficial effects achieved by the present invention are as follows:

[0026] (1) In the present invention application, it is determined whether the working status of the first robot and the second robot is idle. The first robot and the second robot will decide which robot will complete the transfer of the wafer from the heating unit to the cooling unit according to their own working status. Under normal circumstances, after the first wafer is baked, it can be sent to the cooling unit for cooling by the second robot. After the second wafer is baked, it can be sent to the cooling unit for cooling by the first robot. In this way, the first robot and the second robot cooperate with each other in division of labor, so that the utilization rate of the first robot and the second robot is maximized. Without increasing the cost, the production capacity of the equipment can be greatly improved.

[0027] (2) In the present invention application, the first robot and the second robot will complete the wafer dispatching to the cooling unit according to the actual working status, so that the first robot and the second robot will not be busy with transmission while the other robot is idle, thereby reducing the travel time of the first robot to the alignment unit, the heating unit, the cooling unit and the wafer box station, and the travel time of the second robot to the glue chamber, the heating unit and the cooling unit, thereby shortening the wafer transmission time of the first robot and the second robot and improving the wafer processing capacity. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 It is a schematic flow chart of a wafer processing method for improving productivity applied by the present invention;

[0029] Figure 2 is a flow chart of step S100 of the present invention;

[0030] Figure 3 is a flow chart of step S200 of the present invention;

[0031] Figure 4 It is a flow chart of step S201 of the present invention;

[0032] Figure 5 The present invention is a schematic diagram of the composition of a wafer processing device that can improve production capacity. Figure 3 ;

[0033] Reference numerals: DETAILED DESCRIPTION

[0034] In the following description, a large number of specific details are provided to provide a more thorough understanding of the present invention. However, it is obvious to those skilled in the art that the present invention can be implemented without one or more of these details. In other examples, in order to avoid confusion with the present invention, some technical features well known in the art are not described.

[0035] First, as Figures 1 to 4 A wafer processing method for improving productivity is shown, comprising:

[0036] Step S100, control the first robot to take out the wafer from the wafer box station and send it to the alignment unit to align the wafer; control the second robot to grab the aligned wafer and send it into the glue-spreading chamber for glue-spreading; after the wafer is glued, control the second robot to take out the wafer from the glue-spreading chamber and send it to the heating unit for heat baking;

[0037] Step S200, when the wafer is finished being heated, the first robot and the second robot are controlled to cooperatively send the wafer to the cooling unit for cooling; after the wafer is finished being cooled, the first robot is controlled to take the wafer out of the cooling unit and send it back to the box station.

[0038] In some embodiments, the wafer box station generally includes a plurality of wafer boxes, each of which includes a wafer storage unit, and the wafer storage unit generally includes a plurality of wafer slots for storing wafers. Each wafer box may have different specifications and capacities, and may also be customized according to the semiconductor process production requirements. The wafer box is used to accommodate a certain number of wafers, provide a safe and stable storage environment for the wafers, and prevent the wafers from being contaminated and damaged by the external environment while waiting for processing or transmission. According to the requirements of the production process, the first robot can accurately transport the wafers from the storage location to the designated processing equipment or the workstation of the next process, thereby realizing the automatic flow of wafers between different equipment. The wafer box station can communicate with other equipment and management systems on the production line to realize real-time transmission and sharing of wafer information, such as recording the batch, quantity, processing status and other information of the wafers, so as to facilitate the monitoring and management of the production process.

[0039] In the wafer processing method for improving production capacity applied for by the present invention, firstly, the first robot and the second robot cooperate to closely connect each link and reduce the waiting time of the wafer between each unit. The first robot can take and deliver the wafer and the second robot can perform glue spreading, heat baking and other operations in parallel, which improves the overall efficiency of wafer processing, shortens the production cycle of wafer processing, and can meet large-scale production needs; in addition, the first robot is busy between the wafer box station, the alignment unit and the cooling unit, and the second robot focuses on the glue spreading chamber, the heating unit and the cooling unit, each performing its own duties, giving full play to the efficiency of each unit, avoiding the idleness of each unit, and improving the utilization rate of production resources. The entire wafer processing process is automated, which reduces manual intervention, reduces labor costs, and also reduces errors and losses caused by human factors. The work flow and parameters can be quickly adjusted according to different processes and product requirements to adapt to diversified production tasks and improve the production stability and reliability of wafer processing.

[0040] Optionally, step S100 includes:

[0041] Step S101: controlling the first robot to take out the wafer from the wafer box station and send it to the alignment unit to align the wafer;

[0042] Specifically, step S101 includes: controlling the first robot to take out the wafer from the wafer box station, and the first robot rotates and lifts the wafer to place it into the alignment unit.

[0043] In some embodiments, first, the first robot is equipped with a vacuum adsorption mechanism or a mechanical gripper mechanism, and the first robot smoothly approaches and grasps the wafer to avoid any scratches or physical damage to the wafer surface; then, the first robot moves and rotates the grasped wafer. The purpose of the rotation operation is to adjust the direction of the wafer so that it meets the requirements of the subsequent alignment unit and provides a basis for precise alignment; after the wafer completes the rotation, the first robot adjusts the wafer to a height matching the entrance of the alignment unit through its own lifting mechanism. The lifting mechanism can use a lead screw or a linear motor, which can achieve high-precision height adjustment. The first robot delivers the wafer into the alignment unit at a steady speed. During the delivery process, the sensor is used to monitor the relative position of the wafer and the alignment unit in real time to ensure that the wafer enters the alignment unit accurately and achieves seamless docking with the positioning device of the alignment unit.

[0044] In the present application, the first robot at least rotates and lifts the wafer and places it into the alignment unit. The automated operation of the robot can quickly complete the process of extracting, rotating and placing the wafer into the alignment unit, greatly shortening the waiting time between each process link, improving the overall production efficiency, and meeting the needs of large-scale production; at the same time, the entire operation process of step S101 can be automatically completed by the first robot, avoiding contamination, scratches and operational errors on the wafer caused by human factors, improving the stability and consistency of the production process, and can also adapt to wafers of different sizes, shapes and process requirements, meeting the needs of diversified processing in the semiconductor manufacturing process.

[0045] Step S102: Control the second robot to grab the aligned wafer and send the wafer into the glue-spreading chamber for glue-spreading;

[0046] Specifically, step S102 includes: controlling the second robot to take out the aligned wafer from the alignment unit, and the second robot rotates and lifts the wafer to place it into the adhesive bonding chamber;

[0047] In some embodiments, the second robot at least rotates and lifts the wafer into the glue-spreading chamber. The second robot can also be equipped with a vacuum adsorption mechanism or a mechanical gripper mechanism. The second robot smoothly approaches and grabs the wafer, and the second robot rotates and lifts the wafer into the glue-spreading chamber. During the rotation process, the second robot rotates the wafer to a suitable angle at a precise angular velocity according to a pre-set program, so that the wafer and the glue-spreading chamber can correspond. The lifting operation is achieved through the cylinder mechanism or screw transmission mechanism inside the second robot, ensuring that the wafer enters the glue-spreading chamber smoothly and accurately.

[0048] In the present application, the entire operation process of step S102 is completed by the second robot, which reduces human intervention, reduces errors and risks caused by human factors, and at the same time improves production efficiency to meet the needs of large-scale production. The rotation and lifting operations of the second robot ensure that the posture and position of the wafer when entering the glue-spreading chamber are optimal, providing a good foundation for the subsequent glue-spreading process, so that the thickness of the glue layer on the surface of the wafer after glue-spreading is uniform, thereby improving the performance and quality of the product.

[0049] Step S103: After the wafer is coated with glue, the second robot is controlled to take out the wafer from the coating chamber and send it to the heating unit for thermal drying.

[0050] Specifically, step S103 includes: after the wafer is coated with glue, controlling the second robot to take out the wafer from the coating chamber, and the second robot rotates and lifts the wafer to put the wafer into the heating unit for baking.

[0051] In some embodiments, when the wafer is finished with glue, the second robot responds quickly. When taking out the wafer from the glue chamber, the second robot arm can use the visual recognition system and / or sensor to locate the position of the wafer in the glue chamber to ensure stable grasping of the wafer. During the removal process, the sensor will monitor the distance between the robot arm and the cavity wall and the wafer in real time to avoid collision and ensure the integrity of the wafer.

[0052] In some embodiments, the second robot at least rotates and lifts the wafer to place the wafer into the heating unit for baking. When the second robot is rotating, the second robot rotates according to a specific angular velocity, and uses the screw transmission mechanism inside the second robot to smoothly lower the wafer and smoothly move it to a specified position of the heating unit.

[0053] In some embodiments, the heating unit uses heat conduction technology and is provided with a uniformly distributed heating mechanism inside, which can raise the temperature to a predetermined baking temperature in a short time. When the wafer is placed in the heating unit, the heat is evenly transferred to every part of the wafer by heat radiation and / or heat conduction.

[0054] In the present application, the seamless connection between the second robot and the glue spreading process and the heat baking process greatly improves the overall production efficiency. The fast and precise pick-and-place operation of the second robot reduces the waiting time between working procedures, making the production process more compact and efficient. At the same time, the entire process of step S103 is automatically completed by the second robot, reducing the pollution risk and operation errors caused by manual operation, and improving the stability of the production process and the consistency of product quality.

[0055] Optionally, step S200 includes:

[0056] Step S201, when the wafer is baked, the first robot and the second robot cooperate to send the wafer to a cooling unit for cooling;

[0057] Specifically, step S201 includes:

[0058] Step S2011: after the wafer is baked, determine whether the working status of the first robot and the second robot is idle. If the working status of the first robot is idle and the working status of the second robot is not idle, proceed to step S2012; if the working status of the second robot is idle and the working status of the first robot is not idle, proceed to step S2013;

[0059] Step S2012: After the wafer is baked, the first robot sends the wafer to a cooling unit for cooling;

[0060] Step S2013: After the wafer is baked, the second robot sends the wafer to a cooling unit for cooling;

[0061] In some implementations, in step S2011, after the wafer is baked, the judgment mechanism for the working status of the first robot and the second robot is immediately started to accurately judge whether the robots are in an idle state. If the working status of the first robot is idle and the working status of the second robot is not idle, the instruction will be automatically triggered to guide the operation process to enter step S2012; conversely, if the working status of the second robot is idle and the working status of the first robot is not idle, then enter step S2013.

[0062] In some implementations, in step S2012, when it is confirmed that the first robot is in an idle state and meets the conditions for entering this step, the first robot will act quickly, and the first robot will accurately locate the position of the wafer after the heat baking is completed. At the same time, the sensors on the robotic arm will monitor the surrounding environment in real time to ensure that there will be no collision with other equipment or wafers during the grasping process. When grabbing the wafer, the robotic arm will pick up the wafer steadily with a smooth and gentle movement, and the first robot will quickly and accurately deliver the wafer to the cooling unit according to the preset optimal path. During the transportation process, the first robot will adjust the movement speed and direction in real time according to the operating conditions of the surrounding equipment and its own location information to ensure the safety and efficiency of the entire transportation process.

[0063] In some implementations, in step S2013, when it is confirmed that the second robot is in an idle state and meets the requirements for entering this step, its workflow is similar to that of the first robot. The second robot also grabs and positions the wafer after heat baking. During the grabbing process, the force and angle are strictly controlled to prevent physical damage to the wafer or affect the quality of the adhesive layer. Then, the second robot is used to transport the wafer to the cooling unit quickly and smoothly. During transportation, the second robot will also adjust the movement speed and direction in real time according to the operating conditions of the surrounding equipment and its own location information to ensure the safety and efficiency of the entire transportation process.

[0064] In the present invention application, firstly, it is determined whether the working status of the first robot and the second robot is idle. The first robot and the second robot will decide which robot will complete the transfer of the wafer from the heating unit to the cooling unit according to their own working status. Under normal circumstances, after the first wafer is hot-baked, it can be sent to the cooling unit for cooling by the second robot. After the second wafer is hot-baked, it can be sent to the cooling unit for cooling by the first robot. In this way, the first robot and the second robot cooperate with each other to achieve the highest utilization rate of the first robot and the second robot. Without increasing the cost, the production capacity of the equipment can be greatly improved. In addition, the first robot and the second robot will complete the wafer dispatching to the cooling unit according to the actual working status, so that the first robot and the second robot will not have a situation where one robot is busy with the transfer while the other robot is idle. This reduces the travel time of the first robot to the alignment unit, the heating unit, the cooling unit and the wafer box station, and the travel time of the second robot to the glue-dispensing chamber, the heating unit and the cooling unit. This shortens the wafer transfer time of the first robot and the second robot, and improves the wafer processing capacity.

[0065] Step S202: After the wafer is cooled, the first robot is controlled to take the wafer out of the cooling unit and send it back to the box station.

[0066] Specifically, step S202 includes: after the wafer is completely cooled, the first robot takes the wafer out of the cooling unit, and then the first robot rotates and lifts the wafer back to the wafer box station.

[0067] In some embodiments, the first robot at least rotates and lifts the wafer back to the wafer box station. When the wafer is cooled in the cooling unit, the first robot responds quickly to perform the task. The first robot can use the visual recognition system to locate the position of the wafer in the cooling unit. When grabbing the wafer, the wafer is picked up smoothly to avoid any physical damage to the cooled wafer or affecting the quality of the adhesive layer on its surface. Subsequently, the first robot rotates the grabbed wafer, and the second robot drives the wafer to rotate according to a pre-set program. The first robot controls the lifting height of the wafer through an internal cylinder mechanism or a screw transmission mechanism. During the descent process, the second robot is preferably able to monitor the height information in real time to ensure that the wafer can fall smoothly and accurately into the designated position of the wafer box station. At the same time, when the wafer approaches the wafer box station, the first robot accurately returns the wafer to the wafer box station to complete the wafer processing process.

[0068] In the present invention application, the rotation operation enables the wafer to be sent back to the wafer box station in the best posture, ensuring the neat arrangement of the wafer in the box, facilitating subsequent storage, transportation and reuse, and improving the logistics efficiency in the production process; the rotation operation and lifting operation can ensure that the wafer can accurately fall into the designated position of the wafer box station, avoiding problems such as wafer damage caused by placement deviation, improving the continuity and overall efficiency of production, and facilitating the realization of large-scale, automated production operations.

[0069] Optionally, in step S200, after the first wafer is baked, the second robot sends it to the cooling unit for cooling; after the second wafer is baked, the first robot sends it to the cooling unit for cooling; the first robot and the second robot work alternately.

[0070] In the present invention application, after the first wafer is completed hot baking, the second robot sends it to the cooling unit for cooling. After the second wafer is completed hot baking, the first robot sends it to the cooling unit for cooling. The first robot and the second robot can work alternately, avoiding the first robot and the second robot from being idle, so that the wafers after hot baking can be sent to the cooling unit in time, greatly shortening the production cycle, improving the overall production efficiency, and realizing the maximum utilization of equipment resources. The alternating work of the first robot and the second robot can disperse the work intensity of the first robot and the second robot, reduce the mechanical wear and failure risks caused by long-term continuous operation of a single robot, make the entire production rhythm smoother, and closely connect each link, which is conducive to achieving large-scale, standardized and efficient production, and improve the competitiveness of enterprises.

[0071] Second, as Figure 5As shown, the present invention application provides a wafer processing device capable of improving productivity, comprising a memory and a processor that are communicatively connected, wherein the memory is used to store a computer program, and the processor is used to read the computer program and execute the steps in a wafer processing method capable of improving productivity as described in any one of the first aspects.

[0072] In some embodiments, a wafer processing device capable of improving productivity comprises: a processor, a memory, and a computer program stored in the memory and executable on the processor, wherein when the processor executes the computer program, the steps of a wafer processing method capable of improving productivity described in any one of the first aspects above are implemented.

[0073] The processor may be a central processing unit (CPU), other general-purpose processors, digital signal processors (DSP), application-specific integrated circuits (ASIC), field-programmable gate arrays (FPGA) or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. The general-purpose processor may be a microprocessor or any conventional processor, etc. The processor is the control center of the terminal device, and various interfaces and lines are used to connect various parts of the entire terminal device.

[0074] The memory can be used to store the computer program and / or module, and the processor realizes various functions of the terminal device by running or executing the computer program and / or module stored in the memory, and calling the data stored in the memory. The memory can mainly include a program storage area and a data storage area, wherein the program storage area can store an operating system, an application required for at least one function (such as a sound playback function, an image playback function, etc.), etc.; the data storage area can store data created according to the use of the mobile phone (such as audio data, a phone book, etc.), etc. In addition, the memory can include a high-speed random access memory, and can also include a non-volatile memory, such as a hard disk, a memory, a plug-in hard disk, a smart memory card (SmartMediaCard, SMC), a secure digital (SecureDigital, SD) card, a flash card (FlashCard), at least one disk storage device, a flash memory device, or other volatile solid-state storage devices.

[0075] Wherein, if the module / unit integrated in the terminal device is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on such an understanding, the present invention implements all or part of the processes in the above-mentioned embodiment method, and can also be completed by instructing the relevant hardware through a computer program. The computer program can be stored in a computer-readable storage medium, and the computer program can implement the steps of the above-mentioned various method embodiments when executed by the processor. Wherein, the computer program includes computer program code, and the computer program code can be in source code form, object code form, executable file or some intermediate form. The computer-readable medium may include: any entity or device capable of carrying the computer program code, recording medium, U disk, mobile hard disk, disk, optical disk, computer memory, read-only memory (ROM, Read-Only Memory), random access memory (RAM, Random Access Memory), electric carrier signal, telecommunication signal and software distribution medium, etc.

[0076] It should be noted that the device embodiments described above are merely schematic, wherein the units described as separate components may or may not be physically separated, and the components displayed as units may or may not be physical units, that is, they may be located in one place, or they may be distributed on multiple network units. Some or all of the modules may be selected according to actual needs to achieve the purpose of the scheme of this embodiment. In addition, in the accompanying drawings of the device embodiments provided by the present invention, the connection relationship between the modules indicates that there is a communication connection between them, which may be specifically implemented as one or more communication buses or signal lines. A person of ordinary skill in the art may understand and implement it without paying any creative effort.

[0077] The above is a preferred embodiment of the present invention. It should be pointed out that a person skilled in the art can make several improvements and modifications without departing from the principle of the present invention. These improvements and modifications are also considered to be within the scope of protection of the present invention.

Claims

1. A wafer processing method capable of improving productivity, characterized in that: include: Step S100, controlling the first robot to take out the wafer from the wafer box station and send it to the alignment unit to align the wafer; controlling the second robot to grab the aligned wafer and send the wafer into the glue-spreading chamber for glue-spreading; After the wafer is coated, the second robot is controlled to take out the wafer from the coating chamber and send it to the heating unit for thermal drying; Step S200, after the wafer is baked, the first robot and the second robot are controlled to collaboratively send the wafer to a cooling unit for cooling; After the wafer is completely cooled, the first robot is controlled to take the wafer out of the cooling unit and return it to the box station.

2. A wafer processing method capable of improving productivity according to claim 1, characterized in that: Step S100 includes: Step S101: controlling the first robot to take out the wafer from the wafer box station and send it to the alignment unit to align the wafer; Step S102: Control the second robot to grab the aligned wafer and send the wafer into the glue-spreading chamber for glue-spreading; Step S103: After the wafer is coated with glue, the second robot is controlled to take out the wafer from the coating chamber and send it to the heating unit for thermal drying.

3. A wafer processing method capable of improving productivity according to claim 2, characterized in that: Step S100 includes: Step S201, after the wafer is baked, the first robot and the second robot are controlled to collaboratively send the wafer to a cooling unit for cooling; Step S202: After the wafer is cooled, the first robot is controlled to take the wafer out of the cooling unit and send it back to the box station.

4. A wafer processing method capable of improving productivity according to claim 2, characterized in that: Step S101 includes: controlling the first robot to take out the wafer from the wafer box station, and the first robot rotates and lifts the wafer to place it into the alignment unit.

5. A wafer processing method capable of improving productivity according to claim 2, characterized in that: Step S102 includes: controlling the second robot to take out the aligned wafer from the alignment unit, and the second robot rotates and lifts the wafer to place it in the adhesive bonding chamber.

6. A wafer processing method capable of improving productivity according to claim 2, characterized in that: Step S103 includes: after the wafer is coated, controlling the second robot to take out the wafer from the coating chamber, and the second robot rotates and lifts the wafer to place the wafer into the heating unit for baking.

7. A wafer processing method capable of improving productivity according to claim 2, characterized in that: Step S201 includes: Step S2011: after the wafer is baked, determine whether the first robot and the second robot are idle. If the first robot is idle and the second robot is not idle, proceed to step S2012; if the second robot is idle and the first robot is not idle, proceed to step S2013; Step S2012: After the wafer is baked, the first robot sends the wafer to a cooling unit for cooling; Step S2013: After the wafer has been baked, the second robot sends the wafer to a cooling unit for cooling.

8. A wafer processing method capable of improving productivity according to claim 2, characterized in that: Step S202 includes: after the wafer is completely cooled, the first robot takes the wafer out of the cooling unit, and then the first robot rotates and lifts the wafer back to the wafer box station.

9. A wafer processing method capable of improving productivity according to claim 2, characterized in that: Step S201 includes: when the first wafer is completed by thermal baking, the second robot sends it to the cooling unit for cooling; when the second wafer is completed by thermal baking, the first robot sends it to the cooling unit for cooling; the first robot and the second robot work alternately.

10. A wafer processing device capable of improving productivity, comprising a memory and a processor that are communicatively connected, wherein the memory is used to store a computer program, and the processor is used to read the computer program and execute a wafer processing method capable of improving productivity as described in any one of claims 1-9.

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