Partition division method of solar screen, terminal, medium and product

Abstract

The invention discloses a partition division method for a solar screen, a terminal, a medium and a product, and the method comprises the steps: obtaining a layer identifier and screen size information through the recognition of a solar screen layout; partition sizes are calculated based on the range of laser processing equipment, the number of partitions is calculated according to the size of a screen plate, and a layout is divided into corresponding partitions through partition lines perpendicular to each other in the transverse direction and the longitudinal direction. Judging whether the transverse distance and the longitudinal distance between each graph and the nearest parting line meet control requirements or not, if the transverse distance or the longitudinal distance does not reach the standard, adjusting the corresponding size in the partition sizes according to a preset first step length in the equipment processing range, and recalculating the number of the partitions after updating; and if the transverse and longitudinal distances of all the graphs reach the standard, outputting the divided screen layout according to the current partition. In this way, the probability of poor connection at the partition machining position of automatic partition is effectively reduced.

Description

Technical Field

[0001] The invention relates to the field of solar printed screen laser technology, and in particular to a solar screen partitioning method, terminal, medium and product. Background Art

[0002] Solar panels are widely used in the semiconductor field due to their clean, pollution-free, renewable, stable working performance, etc. In order to achieve the connection between solar panels and electrical equipment, grid electrodes need to be set on the surface of solar panels to realize the extraction of current.

[0003] In the current production process, a printed stencil is usually used to print the grid electrode, and the grid pattern on the printed stencil needs to be made using a laser process. When using the laser process to make a high-precision printed stencil, the equipment operates in the form of block processing. In order to improve the poor connection at the processing partition, it is necessary to simulate and calculate the partition range that does not touch the high-precision graphics, and the partition connection must meet the graphics control accuracy requirements. At present, the main method used is artificial simulation calculation of the partition.

[0004] However, this method of manual simulation calculation has obvious defects. Manual simulation calculation is difficult to accurately determine the partition range that does not touch the high-precision graphics and meet the accuracy requirements of the partition connection. Therefore, it is necessary to constantly try and check repeatedly. This process is extremely time-consuming, resulting in low production efficiency and unable to adapt to the growth of high-precision printing screen production demand. Manual calculation of partitions is inefficient and has poor accuracy. It is also easily interfered by subjective factors and is difficult to meet the accuracy requirements, which in turn causes deviations in the grid line pattern and affects the performance of the solar panel. Due to the instability of manual operation and the difficulty in accurately planning the partitions, the probability of poor connection of the partition processing of the automatic partition is greatly increased. Summary of the invention

[0005] The present application provides a solar panel zoning method, terminal, medium and product, which reduces the probability of poor connection at the zoning processing of automatic zoning.

[0006] In a first aspect, the present application provides a method for zoning a solar panel, the method comprising: identifying a solar panel layout of a solar panel imported by a user, and obtaining a layer identifier and a panel size information; wherein the layer corresponding to each layer identifier carries a graphic with corresponding precision requirements; different horizontal control distances and vertical control distances are preset for graphics with different precision requirements; based on a preset processing range of a laser processing device, the partition size is calculated; according to the panel size information and the partition size, the number of partitions is calculated; a plurality of mutually perpendicular horizontal dividing lines and a plurality of vertical dividing lines are generated, and the panel layout is divided into the number of partitions, and the panel size corresponding to each partition is the partition size; for each graphic in the panel layout, the nearest horizontal dividing line and the partition size are determined. Whether the lateral distance of the graphic is greater than the lateral control distance of the graphic, and whether the longitudinal distance between the nearest longitudinal dividing line and the graphic is greater than the longitudinal control distance of the graphic; when the lateral distance or longitudinal distance is not greater than the lateral control distance or longitudinal control distance of the graphic, adjust the lateral size or longitudinal size in the partition size accordingly according to the preset first step length within the processing range of the laser processing equipment to obtain an updated partition size, and jump to execute the step of calculating the number of partitions based on the screen size information and the partition size; if the lateral distances corresponding to all graphics in the screen layout are greater than the lateral control distance of the graphic and the longitudinal distances are greater than the longitudinal control distance of the graphic, then the screen layout is divided according to the currently divided partition output.

[0007] By adopting the above technical solution, when the stencil layout is imported, it is effectively detected and its basic information is identified, and then the partition range that meets the control requirements is divided based on these basic information. The method provided in this embodiment, after the user imports the stencil layout to be calculated in the terminal, the program identifies the stencil layout information, and when the partition divided based on the stencil layout and the processing range value of the processing equipment does not meet the control requirements, the partition size is calculated incrementally; if the size of the partition after the increment exceeds the processing range value of the laser processing equipment, the partition is calculated decrementally; if the size of the partition after the decrement exceeds the minimum range value of the laser processing equipment, the control distance is decremented and the partition is recalculated. This method effectively solves the problem that the manual simulation calculation of the partition in the prior art requires continuous attempts and reliance on visual inspection, the process is extremely cumbersome and prone to omissions, and the manual simulation trial calculation method provided by the prior art is difficult to meet the requirements, and continuous attempts and inspections are required, resulting in low production efficiency. It has successfully simplified the operation process and significantly improved production efficiency, allowing users to easily and quickly calculate the stencil partition splitting plan that meets the management and control requirements, and reduce the probability of poor connection at the partition processing of automatic partitioning.

[0008] In combination with some embodiments of the first aspect, in some embodiments, the partition size is calculated based on the processing range of a preset laser processing equipment, specifically including: based on the maximum and minimum values ​​of the transverse processing range and the longitudinal processing range of the preset laser processing equipment, the middle value of the transverse processing range and the middle value of the longitudinal processing range are calculated as the transverse size and the longitudinal size of the partition size.

[0009] In the above embodiment, by utilizing the maximum and minimum values ​​of the horizontal and vertical processing ranges to determine the middle value as the partition size, it is possible to fully adapt to the capability characteristics of the laser processing equipment, ensure that the divided partitions are within the processable size range of the equipment, and effectively avoid processing failures due to the partition size being too large and exceeding the processing capacity of the equipment, or the partition size being too small and unable to fully utilize the equipment processing area, thereby reducing production efficiency.

[0010] In combination with some embodiments of the first aspect, in some embodiments, when the lateral distance or the longitudinal distance is not greater than the lateral control distance or the longitudinal control distance of the graphic, the lateral size or the longitudinal size in the partition size is adjusted accordingly according to the preset first step length within the processing range of the laser processing equipment to obtain an updated partition size, and the step of calculating the number of partitions according to the screen size information and the partition size is jumped to execute, specifically including: when the lateral distance is not greater than the lateral control distance of the graphic but the longitudinal distance is greater than the longitudinal control distance of the graphic, storing the longitudinal control distance and the corresponding longitudinal dividing line information; adjusting the lateral size in the partition size according to the preset first step length within the processing range of the laser processing equipment to obtain an updated partition size, and jumping to execute the step of calculating according to the screen size information and the partition size. The step of obtaining the number of partitions; when the longitudinal distance is not greater than the longitudinal control distance of the graphic but the lateral distance is greater than the lateral control distance of the graphic, storing the lateral control distance and the corresponding lateral dividing line information; adjusting the longitudinal dimension of the partition size according to the preset first step length within the processing range of the laser processing equipment to obtain the updated partition size, and jumping to execute the step of calculating the number of partitions according to the screen size information and the partition size; when the lateral distance is not greater than the lateral control distance of the graphic and the longitudinal distance is not greater than the longitudinal control distance of the graphic, synchronously adjusting the lateral dimension and the longitudinal dimension of the partition size according to the preset first step length within the processing range of the laser processing equipment to obtain the updated partition size, and jumping to execute the step of calculating the number of partitions according to the screen size information and the partition size.

[0011] In the above embodiments, when faced with a situation where the lateral or longitudinal distance does not meet the control distance, the partition size can be accurately adjusted for different situations. This refined adjustment strategy effectively improves the flexibility and adaptability of the partition division. For example, when the lateral distance is not satisfied but the longitudinal distance is satisfied, by storing the longitudinal information and adjusting the lateral size, the lateral partition can be optimized while ensuring the relative stability of the longitudinal layout, and vice versa, so that the partition division is more in line with the actual distribution and control requirements of the graphics, and the adverse effects on the integrity of the graphics and the convenience of processing are minimized. For complex situations where both the lateral and longitudinal distances are not satisfied, the method of synchronously adjusting the size can quickly explore suitable partitioning schemes, avoid falling into local optimal solutions due to single-dimensional adjustments, and improve the overall partition optimization efficiency. After each adjustment, it jumps back to the step of calculating the number of partitions, forming a closed-loop optimization iterative process, which can continuously approach and ultimately determine the optimal partitioning scheme that meets all control requirements, ensuring the accuracy and reliability of the solar panel partition division.

[0012] In combination with some embodiments of the first aspect, in some embodiments, when the lateral distance or longitudinal distance is not greater than the lateral control distance or longitudinal control distance of the graphic, the lateral size or longitudinal size in the partition size is adjusted accordingly according to the preset first step length within the processing range of the laser processing equipment to obtain an updated partition size, and the step of calculating the number of partitions based on the screen size information and the partition size is jumped to execute. The method also includes: after traversing and adjusting within the processing range of the laser processing equipment, if the lateral distance or longitudinal distance is not greater than the lateral control distance or longitudinal control distance of the graphic, the lateral control distance and longitudinal control distance corresponding to the graphic preset of each precision requirement are correspondingly reduced according to the preset second step length, the partition size is reset, and the step of calculating the number of partitions based on the screen size information and the partition size is jumped to execute.

[0013] In the above embodiment, when the partition size is adjusted within the processing range of the laser processing equipment according to the preset first step length, and there is still a situation where the horizontal or vertical distance does not meet the control distance, the horizontal control distance and vertical control distance corresponding to the graphic preset of each precision requirement are reduced according to the preset second step length, and the partition size is reset to recalculate the number of partitions, which can further expand the exploration space of the partition scheme. It is helpful to find feasible solutions within a wider range of parameters, avoid the dilemma of not being able to obtain a suitable partition scheme due to the initial control distance setting being too strict, and improve the robustness of the partition division algorithm.

[0014] In combination with some embodiments of the first aspect, in some embodiments, after traversal and adjustment within the processing range of the laser processing equipment, if the lateral distance or the longitudinal distance is not greater than the lateral control distance or the longitudinal control distance of the graphic, the lateral control distance and the longitudinal control distance corresponding to the graphic preset of each precision requirement are reduced accordingly according to the preset second step length, the partition size is reset, and the step of calculating the number of partitions according to the screen size information and the partition size is jumped to execute. The method also includes: recording in detail all parameter changes during each iterative operation of partition size adjustment, control distance change, and recalculation of the number of partitions; when the partition division process is completed, parsing the key factors that cause repeated adjustment of the partition results to obtain analysis results; based on the analysis results, generating optimization suggestions and strategy reports for improved partition division.

[0015] In the above embodiment, detailed records of parameter changes during each iterative operation of adjusting the partition size, changing the control distance, and recalculating the number of partitions can provide a comprehensive and accurate data basis for subsequent analysis. After the partitioning process is completed, by parsing the key factors that cause repeated adjustments to the partitioning results and obtaining analysis results, we can gain in-depth insights into the root causes of problems in the partitioning process, such as whether the control distance setting for a specific graphic accuracy is unreasonable, or whether there are special difficulties in the adaptability of the stencil size to the equipment processing range. Based on these analysis results, optimization suggestions and strategy reports for improved partitioning are generated, which helps technicians to optimize and improve the partitioning method, parameter settings, and even equipment selection in a targeted manner.

[0016] In combination with some embodiments of the first aspect, in some embodiments, the number of partitions is calculated based on the mesh size information and the partition size, specifically including: calculating the area of ​​the mesh and the area of ​​the partition based on the size of the mesh and the partition size; calculating the number of partitions based on the area of ​​the mesh and the area of ​​the partition.

[0017] In the above embodiment, calculating the number of partitions based on the mesh and the partition area can significantly improve the accuracy and rationality of the partition division. The accurate number of partitions ensures that the layout of each partition on the mesh is uniform and appropriate, laying a solid foundation for subsequent processing links, so that the laser processing equipment can efficiently process each partition with better parameter settings and processing paths, effectively reducing processing errors, improving processing quality and increasing production efficiency, fundamentally ensuring the high quality and high efficiency of solar panel production.

[0018] In combination with some embodiments of the first aspect, in some embodiments, after the identification user imports the solar panel grid layout and obtains the layer identification and grid size information, the method further includes: performing a consistency check on the layer identification and a preset standard layer identification system, and if there is an inconsistency, matching the layer identification with a preset identification association library, and correcting the layer identification to an identification in the preset identification association library that is closest to the layer identification; if the imported grid layout has missing or incorrect size information, calling a historical imported grid layout database, and extracting sample data that is similar to the current grid layout in terms of graphic features and structural layout through a preset data mining and analysis algorithm; based on the sample This data calculates the mean and proportion range of the proportional relationship between it and the current stencil layout in key size parameters; reads the stencil layout data, and calculates the stencil size based on the mean and proportion range of the proportional relationship; compares the stencil size with the original dimension annotation of the stencil layout, and corrects it if the annotation is wrong; adds annotation if it is missing; based on the layer identification, the graphics are divided into low-precision graphics, medium- and high-precision graphics, and high-precision graphics. The low-precision graphics have no control distance requirements with the horizontal dividing lines and vertical dividing lines; the medium- and high-precision graphics have no control distance requirements with the horizontal dividing lines, and need to maintain a control distance with the vertical dividing lines; the high-precision graphics need to maintain a control distance with all horizontal dividing lines and vertical dividing lines.

[0019] In the above embodiment, by checking and correcting the consistency of the layer identification, it is ensured that the layer identification of the screen layout complies with the standard system, which is conducive to the accurate execution of various subsequent processing based on the layer identification, avoiding processing errors or mismatches caused by confusion of identification, and improving the accuracy and stability of the entire processing flow. In terms of the processing method for missing or incorrect size information, historical data mining and analysis are used to effectively supplement and correct the screen size information. Based on the corrected layer identification, the graphics are classified and the control distance requirements with the dividing line are clarified, so that appropriate strategies can be adopted for graphics of different precisions during the zoning and processing process, which not only ensures the processing accuracy and integrity of high-precision graphics, but also reasonably arranges processing in the low-precision graphics area, optimizes the allocation of overall processing resources, further improves the processing quality and efficiency, and ensures the efficient, accurate and stable production of solar panels from multiple dimensions, enhancing the competitiveness and reliability of the products in the market.

[0020] In a second aspect, an embodiment of the present invention provides a graphics processing terminal, comprising: one or more processors and a memory; the memory is coupled to the one or more processors, the memory is used to store computer program code, the computer program code includes computer instructions, and the one or more processors call the computer instructions to enable the graphics processing terminal to execute the method described in the first aspect or the second aspect, and any possible implementation method of the first aspect or the second aspect.

[0021] In a third aspect, the present invention provides a computer-readable storage medium, comprising instructions, which, when executed on the graphics processing terminal, enable the graphics processing terminal to execute the method described in the first aspect or the second aspect, and any possible implementation of the first aspect or the second aspect.

[0022] In a fourth aspect, the present invention provides a computer program product comprising instructions, which, when the above-mentioned computer program product is run on the above-mentioned graphics processing terminal, enables the above-mentioned graphics processing terminal to execute the method described in the first aspect or the second aspect, and any possible implementation method of the first aspect or the second aspect.

[0023] It can be understood that the graphics processing terminal provided in the second aspect, the storage medium provided in the third aspect, and the computer program product provided in the fourth aspect are all used to execute the method provided by the present invention. Therefore, the beneficial effects that can be achieved can refer to the beneficial effects in the corresponding method, and will not be repeated here.

[0024] In summary, the present application includes at least one of the following beneficial technical effects:

[0025] 1. This application effectively detects and identifies its basic information when the stencil layout is imported, and then divides the partition range that meets the control requirements based on these basic information. The method provided in this embodiment, when the user imports the stencil layout to be calculated in the terminal, the program identifies the stencil layout information, and when the partition divided based on the stencil layout and the processing range value of the processing equipment does not meet the control requirements, the partition size is calculated incrementally; if the partition size exceeds the processing range value of the laser processing equipment after the partition is increased, the partition is calculated incrementally; if the partition size exceeds the minimum processing range value of the laser processing equipment after the partition is decreased, the control distance is decreased and the partition is recalculated. This method effectively solves the problem that the manual simulation calculation of the partition in the prior art requires continuous attempts and relies on visual inspection, the process is extremely cumbersome and prone to omissions, and the manual simulation trial calculation method provided by the prior art is difficult to meet the requirements, and continuous attempts and inspections are required, and the production efficiency is low. The effect of simplifying the operation process and significantly improving the production efficiency is successfully achieved, so that users can easily and quickly calculate the stencil partition splitting plan that meets the control requirements, and reduce the probability of poor connection at the partition processing of the automatic partition.

[0026] 2. This application can further expand the exploration space of the partitioning scheme by reducing the horizontal and vertical control distances corresponding to the graphic presets of each precision requirement according to the preset second step length, and recalculating the number of partitions by resetting the partition size when the horizontal or vertical distance still does not meet the control distance after the partition size is adjusted according to the preset first step length within the processing range of the laser processing equipment. This helps to find feasible solutions within a wider range of parameters, avoid the dilemma of not being able to obtain a suitable partitioning scheme due to the overly strict initial control distance setting, and improve the robustness of the partitioning algorithm.

[0027] 3. This application ensures that the layer identification of the stencil layout complies with the standard system by checking and correcting the consistency of the layer identification, which is conducive to the accurate execution of various subsequent processing based on the layer identification, avoiding processing errors or mismatches caused by confusion in identification, and improving the accuracy and stability of the entire processing flow. In terms of the handling method for missing or incorrect size information, historical data mining and analysis are used to effectively supplement and correct the stencil size information. Based on the corrected layer identification, the graphics are classified and the control distance requirements from the dividing line are clarified, so that appropriate strategies can be adopted for graphics of different precisions during the zoning and processing process, which not only ensures the processing accuracy and integrity of high-precision graphics, but also reasonably arranges processing in low-precision graphics areas, optimizes the allocation of overall processing resources, and further improves processing quality and efficiency. It ensures the efficient, accurate and stable production of solar panels from multiple dimensions, and enhances the competitiveness and reliability of products in the market. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 It is a schematic diagram of an information interaction scenario of the solar panel partitioning method and the graphic processing terminal of the present application.

[0029] Figure 2 It is a schematic diagram of an exemplary scenario of artificial simulation trial calculation partitioning in the related technology of this application.

[0030] Figure 3-7 It is a schematic diagram of an exemplary scenario after the solar panel zoning method is adopted in the embodiment of the present application.

[0031] Figure 8 It is a flow chart of a method for dividing solar panels into zones in an embodiment of the present application. DETAILED DESCRIPTION

[0032] The terms used in the following embodiments of the present application are only for the purpose of describing specific embodiments, and are not intended to be used as limitations to the present application. As used in the specification and appended claims of the present application, the singular expressions "one", "a kind of", "said", "above", "the" and "this" are intended to also include plural expressions, unless there is a clear indication to the contrary in the context. It should also be understood that the term "and / or" used in the present application refers to and includes any or all possible combinations of one or more listed items.

[0033] In the following, the terms "first" and "second" are used for descriptive purposes only and are not to be understood as suggesting or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features, and in the description of the embodiments of the present application, unless otherwise specified, "plurality" means two or more.

[0034] The following is a description of the partitioning method of the solar panel involved in this application:

[0035] It can be understood that in some embodiments, for the convenience of description, the zoning method of the solar panel in the present application can also be referred to as a zoning method, etc., and can also be called other names, which are not limited here.

[0036] like Figure 1 As shown, it is a schematic diagram of an information interaction scenario of the partition division method of the present application. The implementation environment of the method includes a terminal and a laser processing device. The terminal can communicate with the laser device. The laser processing device supports the communication protocol and can respond to instructions from the terminal. The user sets instructions to the terminal according to the manually calculated data, and the terminal sends instructions to the laser processing equipment, and the laser processing equipment performs processing according to the instructions. The communication protocol includes one or two of the protocols such as Modbus TCP protocol, Ethernet / IP protocol, Profibus protocol, CAN bus protocol and RS-232 protocol, which are not limited here.

[0037] It is understandable that the terminal may be an industrial computer, a desktop computer, a portable laptop computer, a server terminal, a professional graphics workstation, or the like, which has computing power, communication capability, and graphics output function, and is not limited here.

[0038] like Figure 2 The figure shows an exemplary scenario diagram of artificial simulation trial partitioning in the related technology of this application.

[0039] like Figure 2As shown in (a) in the figure, the user calculates the size and number based on the imported data, combined with the stencil size and processing equipment parameters. After the result is calculated, the user draws and adjusts the dividing lines in a professional graphic design tool to divide the stencil layout into partitions that meet the corresponding partition size and number in the above calculated result. The user manually determines whether the partitions meet the requirements. If not, the partitions are manually adjusted until the requirements are met. The user sends a command to the terminal such as Figure 2 The laser transmitter shown in (b) sends a command, and the laser transmitter responds to the terminal command as shown in Figure 2 The solar panel shown in (c) is processed.

[0040] However, the method of relying on manual monitoring and manual adjustment has many disadvantages. Its efficiency is extremely low, and it is difficult to ensure that the partitions are accurate after each adjustment. Users have to frequently conduct trial and error and make repeated adjustments, which undoubtedly consumes a lot of time and energy.

[0041] On the one hand, due to the subjectivity of manual operation, different users have different judgment criteria for whether the partitioning is reasonable, and it is difficult to achieve precise control during operation. For example, deviations may occur when determining the partition boundaries. Even if measures such as visual inspection, coordinate comparison, and size comparison using software measurement tools are taken during the inspection process, it is still difficult to completely avoid quality problems caused by unreasonable partitioning. On the other hand, the entire process relies on manual work, from the initial calculation of partition parameters, drawing and adjusting the dividing lines, to subsequent multiple trial and error adjustments, and then to various manual comparison operations during inspection. The steps are cumbersome and time-consuming, resulting in low efficiency, which is seriously unfavorable to large-scale, high-quality production needs.

[0042] It is understandable that during the production of solar printed screens, users have a variety of methods to try to deal with processing problems, including but not limited to this method of constantly trying partition calculation and processing. Each method can be independent and there is no conflict between them.

[0043] The present application provides a method for partitioning solar panels. After the user imports the designed solar panel layout, the terminal will identify the layer identification and the panel size information, calculate the partition size according to the processing range of the preset laser processing equipment, quickly calculate the number of partitions, and generate accurate horizontal and vertical dividing lines to divide the panel layout into reasonable partitions. For graphics of various precisions in the screen layout, the terminal can quickly determine the distance relationship between it and the dividing line. When the control distance requirements are not met, the partition size is efficiently adjusted within the processing range according to the preset rules, and the number of partitions is recalculated. This cycle is repeated until the optimal partitioning scheme is found. It can achieve a significant improvement in the accuracy of the partitions, effectively ensure the high precision and high quality of the solar panel graphics processing, and reduce the probability of poor connection at the partition processing of the automatic partition; it can significantly improve production efficiency, reduce manpower and time costs, and enhance the stability and controllability of the production process.

[0044] like Figures 3 to 7 The figure is a schematic diagram of an exemplary scenario after the solar panel zoning method is adopted in the embodiment of the present application.

[0045] like Figure 3 As shown in (a) in the figure, the user imports the stencil layout on the terminal. After the import is completed, the user clicks Figure 3 Click the button to start identifying the stencil information as shown in (b) in the figure. The page will display as follows: Figure 3 As shown in (c) in the recognition prompt, the program begins to recognize the basic information of the current stencil layout, including the stencil size and the layer identifiers corresponding to different layers in the stencil layout; the layer identifiers are divided into high-precision graphics, medium-high-precision graphics, and low-precision graphics. High-precision graphics refer to graphics that cannot be divided, such as some graphics with precise circuit structures and extremely high circuit continuity requirements, which may cause circuit function failure once divided; medium-high-precision graphics refer to graphics that can be cut by horizontal dividing lines but cannot be cut by vertical dividing lines, such as some graphics that have a certain extension in the horizontal direction and structural continuity requirements in the vertical direction, such as some special electrode wiring graphics, which have little effect on their functions when cut horizontally, but may damage their electrical performance when cut vertically; low-precision graphics refer to graphics that can be cut and are not likely to cause problems such as poor contact at the joints after cutting, such as large areas of non-critical conductive areas or simple pattern identification areas.

[0046] After the recognition is completed, the page displays the currently imported stencil layout and the size of the printing stencil. Figure 3Click the Start Calculating Partitions button shown in (d) in the figure, and the program will start calculating partitions that meet the control distance requirements. The control requirements refer to meeting the corresponding graphics processing accuracy standards, and the partition joints meet the accuracy requirements of graphics control, and will not cause poor connection problems. Specifically, for high-precision graphics areas, the processing accuracy error must be controlled within ±[X] microns, and the gap at the partition joints must not exceed ±[Y] microns; for medium and high-precision graphics areas, the processing accuracy error can be relaxed to ±[A] microns, and the gap at the joints shall not exceed ±[B] microns; for low-precision graphics areas, the processing accuracy error is allowed to be in the range of ±[M] microns, and the gap at the joints shall not exceed ±[N] microns.

[0047] After the terminal receives the user's instruction to start calculation, Figure 4 As shown in (a) in the figure, the horizontal processing range and the vertical processing range of the current laser processing equipment are obtained, such as Figure 4 As shown in (b), the middle value of the horizontal processing range and the middle value of the vertical processing range are calculated based on the horizontal processing range and the vertical processing range of the laser processing equipment, and the middle value of the horizontal processing range and the middle value of the vertical processing range correspond to the horizontal size and the vertical size of the initial partition. Based on the identified stencil size and the initial partition size, the number of partitions is calculated.

[0048] According to Figure 4 The calculated partition size and number of partitions shown in (c) generate multiple mutually perpendicular horizontal dividing lines and multiple vertical dividing lines, and divide the stencil layout into the number of partitions, and the stencil size corresponding to each partition is the partition size; among them, high-precision graphics need to maintain a control distance (ax) from the vertical dividing line and a control distance (by) from the horizontal dividing line; medium and high-precision graphics need to maintain a control distance (ax) from the vertical dividing line, and there is no control distance requirement with the horizontal dividing line; low-precision graphics have no control distance requirements with either the horizontal dividing line or the vertical dividing line.

[0049] Check whether the current partition is larger than the corresponding control distance requirement. If both the horizontal dividing line and the vertical dividing line are larger than the control distance requirement, the following is displayed: Figure 3 (e) shows the divided stencil layout, the number of divided partitions, and the partition size that meets the control requirements;

[0050] like Figure 5 As shown in (a), if both the horizontal dividing line and the vertical dividing line are smaller than the control distance requirement, then the horizontal size and the vertical size based on the initial partition size are respectively increased by 0.01 mm to obtain a new partition size, and the number of partitions is recalculated based on the new partition size. According to the new partition size and the number of partitions, multiple horizontal dividing lines and multiple vertical dividing lines perpendicular to each other are regenerated, and the stencil layout is divided into the number of partitions, and the stencil size corresponding to each partition is the partition size;

[0051] Check again whether the current partition is greater than the corresponding control distance requirement, such as Figure 5 As shown in (b) in , if it is detected that the horizontal dividing line is greater than the control distance requirement, but the vertical dividing line is not greater than the control distance requirement, then the horizontal control distance that currently meets the control distance requirement and the corresponding horizontal dividing line information are stored, based on the current partition size, such as Figure 5 As shown in (c), the longitudinal dimension of the partition is increased by 0.01 mm;

[0052] Check whether the current partition is larger than the corresponding vertical control distance requirement. If the partition is larger than the vertical control distance requirement, the following information is displayed: Figure 3 (e) shows the divided stencil layout, the number of divided partitions, and the partition size that meets the control requirements;

[0053] like Figure 5 As shown in (d), if the current partition is still not larger than the longitudinal control distance requirement, the longitudinal size of the current partition is increased by 0.01 mm until the control distance requirement is met;

[0054] like Figure 6 As shown in (a) in FIG, if the incremental partition size exceeds the maximum processing range of the laser processing equipment, the longitudinal size of the partition that does not meet the control requirements is restored to the longitudinal size corresponding to the initial partition, such as Figure 6 As shown in (b), the initial longitudinal size is reduced by 0.01 mm, the number of partitions is recalculated based on the transverse partition size and the longitudinal partition size that meet the control requirements, and multiple longitudinal dividing lines perpendicular to the transverse dividing lines are regenerated according to the new partition size and the number of partitions, and the stencil layout is divided into the number of partitions, and the stencil size corresponding to each partition is the partition size;

[0055] Check whether the current partition is larger than the corresponding vertical control distance requirement. If the partition is larger than the vertical control distance requirement, the following information is displayed: Figure 3 (e) shows the divided stencil layout, the number of divided partitions, and the partition size that meets the control requirements;

[0056] like Figure 6 As shown in (c), if the current partition is still not larger than the longitudinal control distance requirement, the longitudinal size of the current partition is continued to be reduced by 0.01 mm until the control distance requirement is met;

[0057] like Figure 7As shown in (a) in the figure, if the partition size after decreasing exceeds the minimum processing range of the laser processing equipment, the longitudinal size of the partition that does not meet the control requirements is restored to the longitudinal size corresponding to the initial partition, and the longitudinal control distance corresponding to the partition is reduced by 0.005mm, and the above increasing and decreasing operations are performed again until the following is met. Figure 7 The control distance requirements are shown in (b) above.

[0058] After the calculation is completed, it is displayed as follows Figure 3 (e) shows the divided stencil layout, the number of partitions, and the partition size that meets the management and control requirements.

[0059] It is understandable that the above scenario is only an exemplary scenario. In actual applications, the various information and controls prompted in the page can be displayed as other content and forms, and other triggering methods can also be used, which are not limited here.

[0060] The following is a description of the partitioning method of the solar panel in the embodiment of the present application:

[0061] like Figure 8 The figure is a flow chart of a method for dividing solar panels into zones in an embodiment of the present application.

[0062] S801, detecting that the user has imported a stencil layout, and obtaining layer identification and stencil size information;

[0063] In this embodiment, the user can trigger the file selection dialog box to pop up by selecting the "Import Stencil Layout" option or use file drag and drop operations to import the stencil layout file. The specific import method is not limited to uniqueness.

[0064] In some cases, the user may import the wrong type of file due to operational errors, resulting in the subsequent inability to recognize the stencil layout information. Such erroneous files will result in the subsequent inability to properly recognize the stencil layout information. If the imported file format is incorrect, the program will give a corresponding error prompt and require the user to re-import the stencil layout file in the correct format. Only when the import is successful and the format is correct, proceed to the next step.

[0065] After detecting that the user has imported the stencil layout and confirming that the stencil layout file format is correct, the terminal identifies the successfully imported stencil layout and parses out the stencil size, layer identification and other information. The layer corresponding to the layer identification carries graphics with corresponding precision requirements. Graphic presets with different precision requirements correspond to different horizontal control distances and vertical control distances.

[0066] Specifically, the name of the layer usually contains precision identification information. For example, the layer where the high-precision graphics are located is named "High-PrecisionLayer", the layer where the medium-high-precision graphics are located is named "Medium-High-PrecisionLayer", and the layer where the low-precision graphics are located is named "low-PrecisionLayer". The program determines the graphics precision by recognizing these name keywords, and then ensures that the graphics corresponding to the precision meet the cutting standards.

[0067] After obtaining the layer identification, the terminal immediately performs a consistency check on the layer identification and the preset standard layer identification system. If there is any inconsistency, the layer identification is matched with the preset identification association library, and the layer identification is corrected to the identification in the preset identification association library that is closest to the layer identification.

[0068] At the same time, if the imported stencil layout has missing or wrong size information, the database of historically imported stencil layouts is called, and sample data similar to the current stencil layout in terms of graphic features and structural layout is extracted through a preset data mining and analysis algorithm. The mean and proportional range of the proportional relationship between the sample data and the current stencil layout in key size parameters are calculated based on the sample data, the stencil layout data is read, and the stencil size is calculated based on the mean and proportional range of the proportional relationship. The stencil size is compared with the original size annotation of the stencil layout. If the annotation is wrong, it is corrected; if the annotation is missing, it is added.

[0069] In some embodiments, the size of the stencil determines the overall divisible area range, and the graphic precision information affects the way graphics of different precisions are handled during the partitioning process, ensuring that high-precision graphics are not destroyed during partitioning, and medium and low-precision graphics are divided according to appropriate rules.

[0070] In some embodiments, the stencil layout is designed by a designer using professional design software. Such professional design software includes, but is not limited to, commonly used CAD (Computer-Aided Design) software and specific software specifically designed for solar stencil design, such as SolarCAD, etc., which are not limited here. The key graphic files designed by the designer to guide the graphic printing process in the production and manufacturing process of the solar stencil are based on the functional requirements of the solar stencil, established technical specifications and relevant industry standards.

[0071] It includes the grid electrode pattern planned for effective current conduction between the solar panel and the electrical equipment. Among them, the shape, width, spacing and other parameters of the grid line are set strictly in accordance with the electrical performance requirements. It is also equipped with auxiliary elements such as positioning mark graphics, which are used to ensure that the screen and the solar panel substrate can be accurately aligned during the printing process.

[0072] In addition, the layout is equipped with test graphic areas for detecting the quality and process parameters of the stencil. These test graphic areas can effectively detect the quality indicators such as conductivity and resistance value of the printed circuits, as well as process parameters such as printing accuracy and ink adhesion through specific circuit layout and graphic features, thereby laying a comprehensive and accurate graphical guidance foundation for the high-quality and high-precision production of solar stencils.

[0073] S802, calculating the partition size based on the preset processing range of the laser processing equipment;

[0074] The terminal calculates the middle value of the horizontal processing range and the middle value of the vertical processing range through the initial values ​​of the horizontal processing range and the vertical processing range of the laser processing equipment. The middle value of the horizontal processing range corresponds to the horizontal size of the initial partition size, and the middle value of the vertical processing range corresponds to the vertical size of the initial partition size. The definition of the initial size of the partition can be:

[0075]

[0076] Among them, L 分 and W 分 are the length and width of the partition respectively. The minimum range of the horizontal processing size of the laser processing equipment is L min , the maximum value is L max , the minimum processing range of the longitudinal processing size is set to W min , the maximum value is W max The terminal calculates the initial partition size based on the intermediate value of the horizontal processing range and the vertical processing range of the laser processing equipment.

[0077] It is understandable that when the laser equipment is connected to the terminal for the first time, it is necessary to set the processing range, processing type and corresponding precision requirements of the laser processing equipment. The precision requirements cover at least one aspect such as cutting accuracy, surface flatness and roughness. No further limitation is made on the specific precision requirements. When the terminal and laser processing equipment are used again, the processing type can be modified according to actual needs; if not modified, the processing will be performed according to the default type of the processing range of the laser processing equipment.

[0078] S803, calculating the number of partitions according to the screen size information and the partition size;

[0079] Based on the identified stencil size information and the initial partition size, the number of partitions is calculated. The definition of the number of partitions can be:

[0080]

[0081] Where N is the number of partitions, L 整 and W 整It is the length and width of the whole image. When the program recognizes the stencil layout file, it will accurately obtain the length and width data of the whole image based on a specific parsing algorithm; L 分 and W 分 is the length and width of the partition.

[0082] It is understandable that the calculation process comprehensively considers the compatibility between the actual size of the stencil and the processing capacity of the equipment to ensure that the divided partitions can not only effectively complete the processing within the processing range of the equipment, but also maximize the processing efficiency and ensure the processing quality. For example, for larger stencils, the reasonable number of partitions is calculated in combination with the center value of the equipment processing range to avoid too many or too few partitions having an adverse effect on the processing process.

[0083] S804, generating a plurality of mutually perpendicular horizontal dividing lines and a plurality of vertical dividing lines, dividing the stencil layout into a number of partitions, and the stencil size corresponding to each partition is the partition size;

[0084] According to the calculated partition number and partition size information, the terminal automatically generates multiple mutually perpendicular horizontal dividing lines and multiple vertical dividing lines to divide the stencil into the partition number and the divided stencil is the partition size;

[0085] In some embodiments, when generating the horizontal and vertical dividing lines, the positions of the dividing lines are optimized according to the aspect ratio of the partitions and the graphic distribution characteristics, so as to reduce the impact on the graphic integrity and processing convenience.

[0086] S805: for each graphic in the stencil layout, determine whether the horizontal distance between the nearest horizontal dividing line and the graphic is greater than the horizontal control distance of the graphic, and determine whether the vertical distance between the nearest vertical dividing line and the graphic is greater than the vertical control distance of the graphic;

[0087] For each graphic in the stencil layout, determine whether the nearest horizontal dividing line of each graphic is greater than the horizontal control distance requirement of the graphic and whether the nearest vertical dividing line is greater than the vertical control distance requirement of the graphic. If the horizontal distance between the nearest horizontal dividing line and each graphic in the stencil layout is greater than the horizontal control distance of the graphic, and the vertical distance between the nearest vertical dividing line and each graphic is greater than the vertical control distance of the graphic, then execute step S807 and output the divided stencil layout according to the currently divided partitions;

[0088] If the horizontal distance between the nearest horizontal dividing line and the graphic or the nearest vertical dividing line and the vertical dividing line of the graphic in the screen layout does not meet the corresponding control distance, then go to step S806.

[0089] It is understandable that low-precision graphics have no control distance requirements from horizontal and vertical dividing lines; medium and high-precision graphics have no control distance requirements from horizontal dividing lines, but must maintain a control distance from vertical dividing lines; high-precision graphics must maintain a control distance from all horizontal and vertical dividing lines.

[0090] In some embodiments of the present application, the partition size includes the partition size range; in other embodiments of the present application, the partition size also includes multiple factors such as the regularity of the partition shape, the integrity of the graphics, and the stability of the connection between the partitions, which are not limited here. The shape of the partition should be as close to a rectangle as possible to ensure the smoothness of the laser processing path; the graphics integrity requires that there should be no missing or damaged graphics at the partition boundary; the connection stability between the partitions is guaranteed by the specific connection point design and spacing requirements to ensure that the partitions can work together in the overall structure to achieve the normal function of the solar panel.

[0091] It is understandable that the connection relationship between the partitions must also meet the regulations to ensure that the partitions can work together in the overall structure to achieve the normal function of the solar grid. The program uses precise algorithms and logical judgments to test each partition one by one to determine whether it fully meets these control requirements.

[0092] S806. When the horizontal distance or the vertical distance is not greater than the horizontal control distance or the vertical control distance of the graphic, the horizontal size or the vertical size of the partition size is adjusted accordingly according to the preset first step length within the processing range of the laser processing equipment to obtain an updated partition size, and the process jumps to S803.

[0093] In some embodiments, the graphics in the partitions divided by the dividing lines generated based on the partition size and the stencil size may have a horizontal distance or a vertical distance where one of the horizontal distances or the vertical distances is greater than the horizontal control distance or the vertical control distance corresponding to the graphics. The terminal will store the horizontal distance or the vertical distance of the graphics in the partitions divided by the dividing lines generated based on the partition size and the stencil size, which is greater than the horizontal control distance and the vertical control distance corresponding to the graphics, store the corresponding dividing lines and partition sizes, and try again on the other side;

[0094] In some embodiments, if the lateral distance between the nearest lateral dividing line and each graphic in the stencil layout is less than the lateral control distance of the graphic, but the longitudinal distance between the nearest longitudinal dividing line and the graphic is greater than the longitudinal control distance of the graphic, then the longitudinal control distance and the corresponding longitudinal dividing line information are stored, the lateral size of the partition size is incremented by 0.01 mm, and it is determined whether the incremented lateral size exceeds the maximum size of the lateral processing range of the laser processing equipment;

[0095] If not, re-execute step S803;

[0096] If it exceeds, the lateral size of the partition size is reset to the lateral size of the initial partition, the lateral size of the partition size is decreased by 0.01 mm, and it is determined whether the increased lateral size exceeds the minimum size of the lateral processing range of the laser processing equipment;

[0097] If not, re-execute step S803;

[0098] If it exceeds, the horizontal size of the partition size will be reset to the horizontal size of the initial partition, the control distance corresponding to the graphic accuracy will be reduced by 0.005mm, and step S803 will be re-executed. Based on the new control distance requirements, the horizontal size of the partition will be increased or decreased; until the horizontal distance between the nearest horizontal dividing line and the graphic is greater than the horizontal control distance of the graphic, step S807 will be executed.

[0099] In some embodiments, if the lateral distance between the nearest lateral dividing line and each graphic in the stencil layout is greater than the lateral control distance of the graphic, but the longitudinal distance between the nearest longitudinal dividing line and the graphic is less than the longitudinal control distance of the graphic, then the lateral control distance and the corresponding lateral dividing line information are stored, the longitudinal size of the partition size is incremented by 0.01 mm, and it is determined whether the incremented longitudinal size exceeds the maximum size of the lateral processing range of the laser processing equipment;

[0100] If not, re-execute step S803;

[0101] If it exceeds, the longitudinal dimension of the partition size is reset to the longitudinal dimension of the initial partition, the longitudinal dimension of the partition size is decreased by 0.01 mm, and it is determined whether the longitudinal dimension after the increase exceeds the minimum dimension of the longitudinal processing range of the laser processing equipment;

[0102] If not, re-execute step S803;

[0103] If it exceeds, the vertical size of the partition will be reset to the vertical size of the initial partition, the control distance corresponding to the graphic accuracy will be reduced by 0.005mm, and step S803 will be re-executed. Based on the new control distance requirements, the vertical size of the partition will be increased or decreased; until the vertical distance between the nearest vertical dividing line and the graphic is greater than the vertical control distance of the graphic, step S807 will be executed.

[0104] In some embodiments, if the lateral distance between the nearest lateral dividing line and each graphic in the stencil layout is smaller than the lateral control distance of the graphic, and the longitudinal distance between the nearest longitudinal dividing line and the graphic is also smaller than the longitudinal control distance of the graphic, the lateral size and the longitudinal size of the partition size are synchronously increased by 0.01 mm, and it is determined whether the increased lateral size and longitudinal size exceed the maximum size of the lateral processing range and the longitudinal processing range corresponding to the laser processing equipment;

[0105] If neither exceeds the range, execute step S803;

[0106] If the lateral dimension exceeds the maximum dimension of the lateral processing range corresponding to the laser processing equipment, but the longitudinal dimension does not exceed the maximum dimension of the longitudinal processing range corresponding to the laser processing equipment, the lateral dimension of the partition size is reset to the lateral dimension of the initial partition, and the lateral dimension of the initial partition is decremented by 0.01mm to determine whether the updated partition lateral dimension exceeds the minimum processing range of the laser processing equipment; if it exceeds, the lateral control distance corresponding to the graphic accuracy is decremented by 0.005mm, and the lateral dimension of the partition size is reset to the lateral dimension of the initial partition; if it does not exceed, the longitudinal partition size that does not exceed the maximum dimension of the longitudinal processing range corresponding to the laser processing equipment is synchronously increased by 0.01mm, and step S803 is executed;

[0107] If the horizontal dimension does not exceed the maximum dimension of the horizontal processing range corresponding to the laser processing equipment, but the vertical dimension exceeds the maximum dimension of the vertical processing range corresponding to the laser processing equipment, the vertical dimension of the partition size is reset to the vertical dimension of the initial partition, and the vertical dimension of the initial partition is decremented by 0.01mm to determine whether the updated vertical dimension of the partition exceeds the minimum processing range of the laser processing equipment; if it exceeds, the vertical control distance corresponding to the graphic accuracy is decremented by 0.005mm, and the vertical dimension of the partition size is reset to the vertical dimension of the initial partition; if it does not exceed, the horizontal partition size that does not exceed the maximum dimension of the vertical processing range corresponding to the laser processing equipment is synchronously increased by 0.01mm, and step S803 is executed;

[0108] If both the lateral and longitudinal dimensions of the partition exceed the maximum lateral and longitudinal dimensions of the corresponding lateral processing range of the laser processing equipment, the lateral and longitudinal dimensions of the partition are reset to the lateral and longitudinal dimensions corresponding to the initial partition. After the lateral and longitudinal dimensions are synchronously reduced by 0.01mm, it is determined whether the updated lateral and longitudinal dimensions of the partition exceed the minimum lateral processing range and minimum longitudinal processing range corresponding to the laser processing equipment; if exceeded, the lateral and longitudinal control distances corresponding to the graphic accuracy are reduced by 0.005mm respectively, and the lateral dimension of the partition is reset to the longitudinal dimension of the initial partition; if not exceeded, step S803 is executed.

[0109] S807, if the horizontal distances corresponding to all the graphics in the screen layout are greater than the horizontal control distance of the graphics and the vertical distances are greater than the vertical control distance of the graphics, then the screen layout divided according to the current partition output is completed;

[0110] After the program successfully calculates the stencil layout division scheme that fully meets the control requirements, it outputs the stencil layout information after division that meets the control requirements. The stencil layout information includes stencil size, number of partitions, partition size and other information. There is no limitation on the specific display information. At the same time, it provides users with convenient operation options and jump functions to facilitate users to further view or edit partition information. By clicking on the divided stencil layout, you can jump to the detailed graphic preview and property editing interface of the partition. The output information may also include detailed log records of the test process, which are presented in a table, including the test results of each partition (such as "qualified" or "unqualified"), whether there are potential risks (such as "the edge of the partition is close to the key graphics, which may affect the electrical performance"), and corresponding optimization suggestions (such as "adjust the partition boundary to 2mm away from the key graphics"). Users can click the filter button in the log record area to filter and view according to the partition number, test results and other conditions, so that users can refer to and further optimize in subsequent operations. Users are allowed to export the current stencil layout for use in subsequent production and processing links, or users can choose to continue with other stencil layout calculation tasks to improve the continuity and flexibility of the workflow. This is only shown as an example without additional limitations.

[0111] In summary, the method provided in this embodiment can effectively detect and identify the basic information of the stencil layout when it is imported, and then divide the partition range that meets the control requirements based on these basic information. After the user imports the stencil layout to be calculated in the terminal, the program will identify the stencil layout information. If the partition divided based on the stencil layout and the processing range value of the processing equipment does not meet the control requirements, the partition size is first calculated incrementally. If the size of the partition exceeds the processing range value of the laser processing equipment after the partition is increased, the partition is calculated incrementally. If the size of the partition exceeds the minimum processing range value of the laser processing equipment after the partition is decreased, the control distance is decreased and the partition is recalculated. This method effectively solves the problem that the manual simulation calculation of the partition in the prior art requires continuous attempts and relies on visual inspection, the process is extremely cumbersome and prone to omissions, and the manual simulation trial calculation method is difficult to meet the requirements, and continuous attempts and inspections are required, which leads to low production efficiency. It successfully achieves the effect of simplifying the operation process and significantly improving efficiency, so that users can easily and quickly calculate the stencil partition splitting plan that meets the control requirements and improve production efficiency.

[0112] The method provided in the above embodiment can be executed by a computer device, which is a graphics processing terminal.

[0113] In some embodiments, the graphics processing terminal is a computer device, which can be a terminal device. The computer device includes an arithmetic unit, a memory, a graphics processor, a central processing unit, an input device and an output device connected by a terminal bus. Among them, the arithmetic unit of the computer device is used to provide arithmetic calculations and logical calculations. The memory of the computer device includes a non-volatile storage medium and an internal memory. The non-volatile storage medium stores an operation terminal, a computer program and a database. The internal memory provides an environment for the operation of the operation terminal and the computer program in the non-volatile storage medium. The database is used to store data. The graphics processor of the computer device is used to accelerate the display of the mesh design drawing, efficiently process graphics-related operations, and assist in the visualization of the partition division results. The central processing unit of the computer device is used to run the operation terminal and related software, coordinate the work of various hardware devices, and perform complex numerical operations such as calculating the number and size of partitions according to the mesh size and the range of processing equipment, and control the transmission and processing flow of data between various components. The input device of the computer device is used to transmit the solar panel layout into the terminal. The output device of the computer device is used to feedback the partition results in real time, assist in viewing and analyzing the design drawings, and provide an interactive operation interface. When the computer program is executed by the central processing unit, the solar panel partitioning method in the embodiment of the present application is implemented.

[0114] Those skilled in the art will appreciate that the structure introduced above is merely a block diagram of a portion of the structure related to the solution of the present application, and does not constitute a limitation on the computer device to which the solution of the present application is applied. The specific computer device may include more or fewer components than those shown in the figure, or combine certain components, or have a different arrangement of components.

[0115] In some embodiments of the present application, a computer-readable storage medium is also provided, including instructions. When the instructions are executed on the graphics processing terminal, the graphics processing terminal can execute the solar panel zoning method in the embodiments of the present application.

[0116] As described above, the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

[0117] As used in the above embodiments, the term "when..." may be interpreted to mean "if..." or "after..." or "in response to determining..." or "in response to detecting...", depending on the context. Similarly, the phrases "upon determining..." or "if (the stated condition or event) is detected" may be interpreted to mean "if determining..." or "in response to determining..." or "upon detecting (the stated condition or event)" or "in response to detecting (the stated condition or event)", depending on the context.

[0118] In the above embodiments, it can be implemented in whole or in part by software, hardware, firmware or any combination thereof. When implemented using software, it can be implemented in whole or in part in the form of a computer program product. The computer program product includes one or more computer instructions. When the computer program instructions are loaded and executed on a computer, the process or function described in the embodiment of the present application is generated in whole or in part. The computer can be a general-purpose computer, a special-purpose computer, a computer network, or other programmable devices. The computer instructions can be stored in a computer-readable storage medium, or transmitted from one computer-readable storage medium to another computer-readable storage medium. For example, the computer instructions can be transmitted from a website site, computer, server or data center by wired (e.g., coaxial cable, optical fiber, digital subscriber line) or wireless (e.g., infrared, wireless, microwave, etc.) mode to another website site, computer, server or data center. The computer-readable storage medium can be any available medium that a computer can access or a data storage device such as a server or data center that contains one or more available media integration. The available medium can be a magnetic medium, (e.g., a floppy disk, a hard disk, a tape), an optical medium (e.g., a DVD), or a semiconductor medium (e.g., a solid-state hard disk), etc.

[0119] Those skilled in the art can understand that to implement all or part of the processes in the above-mentioned embodiments, the processes can be completed by computer programs to instruct related hardware, and the programs can be stored in computer-readable storage media. When the programs are executed, they can include the processes of the above-mentioned method embodiments. The aforementioned storage media include: ROM or random access memory RAM, magnetic disk or optical disk and other media that can store program codes.

Claims

1. A method for partitioning a solar panel, characterized in that: include: Identify the solar panel layout imported by the user, and obtain the layer identification and panel size information; wherein, the layer corresponding to each layer identification carries graphics with corresponding accuracy requirements; graphics presets with different accuracy requirements correspond to different horizontal control distances and vertical control distances; Calculate the partition size based on the preset processing range of the laser processing equipment; Calculating the number of partitions according to the screen size information and the partition size; Generate a plurality of mutually perpendicular horizontal dividing lines and a plurality of vertical dividing lines, divide the stencil layout into the number of partitions, and the stencil size corresponding to each partition is the partition size; For each graphic in the stencil layout, determine whether the lateral distance between the nearest lateral dividing line and the graphic is greater than the lateral control distance of the graphic, and determine whether the longitudinal distance between the nearest longitudinal dividing line and the graphic is greater than the longitudinal control distance of the graphic; When the horizontal distance or the vertical distance is not greater than the horizontal control distance or the vertical control distance of the graphic, the horizontal size or the vertical size in the partition size is adjusted accordingly according to the preset first step length within the processing range of the laser processing equipment to obtain an updated partition size, and the step of calculating the number of partitions according to the stencil size information and the partition size is skipped to execute; If the horizontal distances corresponding to all graphics in the stencil layout are greater than the horizontal control distance of the graphics and the vertical distances are greater than the vertical control distance of the graphics, the divided stencil layout is output according to the current partition.

2. The method according to claim 1, characterized in that The calculation of the partition size based on the preset processing range of the laser processing equipment specifically includes: Based on the maximum and minimum values ​​of the preset transverse processing range and longitudinal processing range of the laser processing equipment, the middle value of the transverse processing range and the middle value of the longitudinal processing range are calculated to serve as the transverse size and the longitudinal size of the partition size.

3. The method according to claim 1, characterized in that In the case where the horizontal distance or the vertical distance is not greater than the horizontal control distance or the vertical control distance of the graphic, the horizontal size or the vertical size in the partition size is adjusted accordingly according to the preset first step length within the processing range of the laser processing equipment to obtain an updated partition size, and the step of calculating the number of partitions according to the stencil size information and the partition size is executed, specifically comprising: When the horizontal distance is not greater than the horizontal control distance of the graphic but the vertical distance is greater than the vertical control distance of the graphic, the vertical control distance and the corresponding vertical dividing line information are stored; Adjust the lateral size of the partition size according to the preset first step length within the processing range of the laser processing equipment to obtain an updated partition size, and jump to execute the step of calculating the number of partitions according to the stencil size information and the partition size; When the longitudinal distance is not greater than the longitudinal control distance of the graphic but the lateral distance is greater than the lateral control distance of the graphic, the lateral control distance and the corresponding lateral dividing line information are stored; Adjust the longitudinal dimension of the updated partition size according to the preset first step length within the processing range of the laser processing equipment to obtain the updated partition size, and jump to execute the step of calculating the number of partitions according to the stencil size information and the partition size; When the lateral distance is not greater than the lateral control distance of the graphic and the longitudinal distance is not greater than the longitudinal control distance of the graphic, the lateral size and the longitudinal size in the updated partition size are synchronously adjusted according to the preset first step length within the processing range of the laser processing equipment to obtain the updated partition size, and the step of calculating the number of partitions according to the screen size information and the partition size is jumped to execute.

4. The method according to claim 1, characterized in that In the case where the horizontal distance or the vertical distance is not greater than the horizontal control distance or the vertical control distance of the graphic, the horizontal size or the vertical size of the partition size is adjusted accordingly according to the preset first step length within the processing range of the laser processing equipment to obtain an updated partition size, and after jumping to execute the step of calculating the number of partitions according to the stencil size information and the partition size, it also includes: After traversing and adjusting within the processing range of the laser processing equipment, if the horizontal distance or the vertical distance is not greater than the horizontal control distance or the vertical control distance of the graphic, the horizontal control distance and the vertical control distance corresponding to the graphic preset of each precision requirement are reduced according to the preset second step length, the partition size is reset, and the step of calculating the number of partitions according to the screen size information and the partition size is jumped to execute.

5. The method according to claim 4, characterized in that After the traversal and adjustment within the processing range of the laser processing equipment is completed, if the horizontal distance or the vertical distance is not greater than the horizontal control distance or the vertical control distance of the graphic, the horizontal control distance and the vertical control distance corresponding to the graphic preset of each precision requirement are correspondingly reduced according to the preset second step length, the partition size is reset, and the execution is jumped to the step of calculating the number of partitions according to the stencil size information and the partition size, and further includes: Record in detail all parameter changes during each iterative operation of adjusting the partition size, changing the control distance, and recalculating the number of partitions; When the partitioning process is completed, the key factors that cause the partitioning results to be repeatedly adjusted are analyzed to obtain the analysis results; Based on the analysis results, optimization suggestions and strategy reports for improved partitioning are generated.

6. The method according to claim 1, characterized in that The calculating the number of partitions according to the screen size information and the partition size specifically includes: Calculating the area of ​​the mesh plate and the area of ​​the partition according to the size of the mesh plate and the size of the partition; The number of partitions is calculated based on the area of ​​the mesh plate and the area of ​​the partitions.

7. The method according to claim 1, characterized in that After identifying the solar panel layout imported by the user and obtaining the layer identification and panel size information, the method further includes: Performing consistency check on the layer identification and a preset standard layer identification system. If there is any inconsistency, matching the layer identification with a preset identification association library is performed, and the layer identification is corrected to an identification in the preset identification association library that is closest to the layer identification; If the size information of the imported stencil layout is missing or wrong, the historical imported stencil layout database is called to extract sample data similar to the current stencil layout in terms of graphic features and structural layout through the preset data mining and analysis algorithm; Based on the sample data, the mean value and the ratio range of the ratio between the sample data and the current stencil layout in terms of key dimension parameters are calculated; Read the stencil layout data, and calculate the stencil size according to the mean value of the proportional relationship and the proportional range; Compare the stencil dimensions with the original dimension markings on the stencil layout, and correct any errors if the markings are incorrect, or add markings if the markings are missing; Based on the layer identification, the graphics are divided into low-precision graphics, medium-high precision graphics, and high-precision graphics. The low-precision graphics have no control distance requirements with the horizontal dividing lines and the vertical dividing lines; the medium-high precision graphics have no control distance requirements with the horizontal dividing lines, but need to maintain a control distance with the vertical dividing lines; the high-precision graphics need to maintain a control distance with all horizontal dividing lines and vertical dividing lines.

8. A graphics processing terminal, characterized in that: including one or more processors and memory; The memory is coupled to the one or more processors, and the memory is used to store computer program codes, where the computer program codes include computer instructions. The one or more processors call the computer instructions to enable the server to execute the method according to any one of claims 1 to 7.

9. A computer-readable storage medium storing computer instructions, characterized in that: When the computer instructions are executed on a graphics processing terminal, the graphics processing terminal is caused to execute the method according to any one of claims 1 to 7.

10. A computer program product, characterized in that When the computer program product is executed on a graphics processing terminal, the graphics processing terminal is caused to execute the method according to any one of claims 1 to 7.

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