A semi-encapsulated composite inductor
By introducing heat pipes and heat sinks into the combined inductor, and using potting compound, the problems of poor heat dissipation and inconvenient installation of the combined inductor are solved, achieving more efficient heat dissipation and convenient installation.
Patent Information
- Application Number
- CN202510147769.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-11
- Publication Date
- 2025-11-14
- Estimated Expiration
- 2045-02-11
AI Technical Summary
Existing combined inductors suffer from poor heat dissipation, inconvenient installation, and high cost.
The design incorporates a rectangular outer shell containing a magnetic core, heat pipes, and a heat sink bracket. The use of potting compound enhances heat dissipation performance, and the assembly bracket and positioning plate bracket improve ease of installation.
This effectively improves the heat dissipation performance and ease of installation of the combined inductor, reducing the overall cost of the equipment.
Smart Images

Figure CN119993703B_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of combined inductor technology, specifically to a semi-encapsulated combined inductor. Background Technology
[0002] A composite inductor is composed of two or more inductor coils. By connecting them together, the desired inductance value can be obtained. It is mainly used in various circuits and applications, greatly improving the flexibility and adjustability of the circuit. A composite inductor mainly consists of three parts: a coil, a magnetic core, and a housing. Depending on the type of magnetic core, it can be divided into ferrite, alloy, and ceramic types. Ferrite has high permeability but a narrow frequency range; alloys have high permeability and wide bandwidth characteristics; ceramics have advantages such as high frequency, wide bandwidth, and small size. Referring to Chinese patent publication number "CN116564650A" entitled "A Semi-Encapsulated Composite Inductor," the existing composite inductors in this patent suffer from problems such as large size, low efficiency, high cost, poor heat dissipation, and poor EMI filtering effect. Furthermore, this device still has problems with poor heat dissipation and inconvenient installation. Therefore, we propose a semi-encapsulated composite inductor to solve the above problems. Summary of the Invention
[0003] To address the shortcomings of existing technologies, this invention provides a semi-encapsulated composite inductor, which solves the problems mentioned in the background section.
[0004] To achieve the above objectives, the present invention is implemented through the following technical solution: a semi-encapsulated combined inductor, comprising a rectangular outer shell, magnetic core bodies provided on both sides of the inner side of the rectangular outer shell, a positioning base fixedly installed at the bottom of the magnetic core body, and an enameled wire body wound inside the magnetic core body.
[0005] Multiple lead wire bodies are fixedly installed at the bottom of the rectangular outer shell, and the multiple lead wire bodies are respectively connected to the corresponding magnetic core body. The inside of the rectangular outer shell is filled with potting compound.
[0006] The rectangular outer casing contains multiple heat dissipation conduits, all of the same shape and arc-shaped. These conduits are positioned on opposite sides of the corresponding magnetic core body, and their ends penetrate the rectangular outer casing. All conduits are hollow, designed to conduct heat generated during device operation.
[0007] A heat dissipation plate frame is fixedly installed below the positioning base. The heat dissipation plate frame penetrates the bottom of the rectangular outer shell, and a sealing ring frame is fixedly installed on the outer side of the heat dissipation plate frame. The sealing ring frame fits against the inner bottom of the rectangular outer shell. Multiple rectangular slots are symmetrically opened inside the heat dissipation plate frame, and heat dissipation fins are fixedly installed inside each rectangular slot.
[0008] Preferably, the plurality of heat dissipation conduits are respectively attached to the corresponding enameled wire body, and a distance is left between the installation position of the heat dissipation conduit and the inner wall of the rectangular outer shell.
[0009] Preferably, a distance is left between the magnetic core bodies on both sides of the rectangular outer shell for potting and filling adhesive, and a limiting partition is provided between the two magnetic core bodies to block the magnetic core bodies on both sides.
[0010] Preferably, a bottom positioning frame is fixedly installed in the middle of the inner side of the rectangular outer shell, the limiting partition is slidably installed inside the bottom positioning frame, and a plurality of spring bodies are fixedly installed between the limiting partition and the inside of the bottom positioning frame.
[0011] Preferably, a plurality of rubber support columns are fixedly installed inside the rectangular outer shell, and the positioning base is placed on top of the corresponding rubber support columns.
[0012] Preferably, both sides of the rectangular outer shell are provided with assembly components, which can be used to assemble the rectangular outer shell into a preset position.
[0013] Preferably, the assembly assembly includes a positioning plate frame and a mounting plate. The mounting plate is fixedly installed on the outer middle of the rectangular outer shell. The positioning plate frame is slidably connected to the corresponding mounting plate. Multiple support springs are fixedly installed between the positioning plate frame and the corresponding mounting plate. Multiple assembly brackets are slidably installed on the outer side of the positioning plate frame.
[0014] Preferably, by cooperating with the mounting frame and the positioning plate frame, the mounting frame can be adjusted to the appropriate position when installing the rectangular outer shell, and then the mounting frame can be locked to the preset position by bolts to complete the assembly operation of the rectangular outer shell. Compared with the traditional installation method, this can improve the installation convenience and applicability of the equipment.
[0015] Preferably, the positioning plate frame has symmetrically provided limit grooves on both the upper and lower sides, and the outer side of the assembly frame is fixedly installed with a slider that matches the limit groove.
[0016] Preferably, multiple protective pads are fixedly installed on the outer side of the mounting plate, and elastic protective plates are fixedly installed between the positioning plate frame and the end of the mounting plate.
[0017] Preferably, assembly holes are symmetrically provided on both sides of the interior of the plurality of assembly racks.
[0018] Preferably, the slider is slidably installed inside the limiting groove, which facilitates the adjustment of the assembly frame position. At the same time, when the assembly frame is installed by inserting the positioning bolt into the assembly hole, the slider and the limiting groove can be subjected to relative force, thus preventing the rectangular outer shell from sliding after installation.
[0019] This invention provides a semi-encapsulated composite inductor. Compared with the prior art, it has the following advantages:
[0020] (1) The semi-encapsulated combined inductor, through the cooperation of heat pipe and heat sink frame, can install heat pipe inside the rectangular shell before encapsulation. After encapsulation, through the setting of heat pipe and heat sink frame, the heat dissipated during the operation of the equipment can be conducted through heat pipe and multiple heat sink fins, further ensuring the heat dissipation effect inside the rectangular shell and improving the heat dissipation performance of the equipment.
[0021] (2) The semi-encapsulated combined inductor, through the cooperation of the mounting frame and the positioning plate frame, can adjust the mounting frame to the appropriate position when installing the rectangular housing, and then lock the mounting frame to the preset position by bolts to complete the assembly operation of the rectangular housing. Compared with the traditional installation method, it can effectively improve the installation convenience and applicability of the equipment. Attached Figure Description
[0022] Figure 1 This is a schematic diagram of the overall structure of the present invention;
[0023] Figure 2 This is a schematic cross-sectional view of the rectangular outer shell structure of the present invention;
[0024] Figure 3 For the present invention Figure 2 Side view;
[0025] Figure 4 For the present invention Figure 2 Top view;
[0026] Figure 5 This is a cross-sectional view of the positioning base of the present invention;
[0027] Figure 6 For the present invention Figure 5 Enlarged structural diagram at point A in the middle;
[0028] Figure 7 This is a cross-sectional view of the positioning plate frame and mounting plate of the present invention;
[0029] Figure 8 For the present invention Figure 7 Enlarged structural diagram at point B.
[0030] In the diagram: 1. Rectangular outer shell; 2. Magnetic core body; 3. Positioning base; 4. Enamelled wire body; 5. Lead wire body; 6. Heat dissipation conduit; 7. Positioning plate frame; 701. Mounting plate; 7011. Protective pad; 7012. Elastic protective sheet; 702. Support spring; 703. Limiting groove; 8. Assembly frame; 801. Assembly hole; 9. Limiting partition; 10. Bottom positioning frame; 11. Rubber support column; 12. Heat dissipation plate frame; 1201. Rectangular groove; 1202. Heat dissipation fins; 1203. Sealing ring frame. Detailed Implementation
[0031] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.
[0032] Please see Figures 1-8 The present invention provides two technical solutions, specifically including the following embodiments: Example
[0033] In this embodiment of the invention, a semi-encapsulated combined inductor includes a rectangular outer shell 1, with magnetic core bodies 2 provided on both sides of the inner side of the rectangular outer shell 1. A positioning base 3 is fixedly installed at the bottom of the magnetic core body 2, and an enameled wire body 4 is wound inside the magnetic core body 2. Both the magnetic core body 2 and the enameled wire body 4 are existing components.
[0034] In this embodiment of the invention, a plurality of lead wire bodies 5 are fixedly installed at the bottom of the rectangular outer shell 1, and the plurality of lead wire bodies 5 are respectively connected to the corresponding magnetic core body 2. The interior of the rectangular outer shell 1 is filled with potting compound.
[0035] Specifically, when potting the equipment, the lead wire body 5 is first connected to the magnetic core body 2. After the magnetic core body 2 is placed, potting glue is poured into the rectangular outer shell 1 to complete the potting operation.
[0036] In this embodiment of the invention, the rectangular outer shell 1 is provided with a plurality of heat dissipation pipes 6. The plurality of heat dissipation pipes 6 have the same shape and are all arc-shaped. The plurality of heat dissipation pipes 6 are installed at the corresponding magnetic core body 2 on both sides. The ends of the plurality of heat dissipation pipes 6 all penetrate the rectangular outer shell 1, and the plurality of heat dissipation pipes 6 are all hollow, used to conduct the heat dissipated by the device during operation.
[0037] In this embodiment of the invention, the heat dissipation conduit 6 is made of existing heat dissipation material. Before potting, the heat dissipation conduit 6 is installed inside the rectangular outer shell 1. After potting, the heat dissipation conduit 6 can conduct the heat generated during the operation of the equipment, further ensuring the heat dissipation effect inside the rectangular outer shell 1.
[0038] In this embodiment of the invention, a heat dissipation plate frame 12 is fixedly installed below the positioning base 3. The heat dissipation plate frame 12 penetrates the bottom of the rectangular outer shell 1, and a sealing ring frame 1203 is fixedly installed on the outer side of the heat dissipation plate frame 12. The sealing ring frame 1203 is in contact with the inner bottom of the rectangular outer shell 1. Multiple rectangular grooves 1201 are symmetrically opened inside the heat dissipation plate frame 12, and heat dissipation fins 1202 are fixedly installed inside each of the rectangular grooves 1201.
[0039] In this embodiment of the invention, specifically, by setting the heat dissipation fins 1202, the heat inside the rectangular outer shell 1 can be conducted outward, further preventing high temperatures inside the rectangular outer shell 1 from affecting the operation of the equipment, and effectively improving the heat dissipation performance of the equipment.
[0040] In this embodiment of the invention, multiple heat dissipation pipes 6 are respectively attached to the corresponding enameled wire body 4, and a distance is left between the installation position of the heat dissipation pipes 6 and the inner wall of the rectangular outer shell 1.
[0041] In this embodiment of the invention, a distance is left between the magnetic core bodies 2 on both sides of the rectangular outer shell 1 for potting and filling adhesive, and a limiting partition 9 is provided between the two magnetic core bodies 2 for blocking the magnetic core bodies 2 on both sides.
[0042] In this embodiment of the invention, specifically, a bottom positioning frame 10 is fixedly installed in the middle of the inner side of the rectangular outer shell 1, a limiting partition 9 is slidably installed inside the bottom positioning frame 10, and a plurality of spring bodies are fixedly installed between the limiting partition 9 and the inside of the bottom positioning frame 10.
[0043] In this embodiment of the invention, specifically, by setting the limiting partition 9 and the bottom positioning frame 10, the limiting partition 9 can be lifted by the cooperation of the spring body during use, further improving the insulation between the magnetic core bodies 2. At the same time, when the equipment is packaged and transported, the limiting partition 9 can be compressed into the bottom positioning frame 10, reducing the space occupied and ensuring convenient transportation.
[0044] In this embodiment of the invention, a plurality of rubber support columns 11 are fixedly installed inside the rectangular outer shell 1, and the positioning base 3 is placed above the corresponding rubber support column 11.
[0045] In this embodiment of the invention, specifically, with the cooperation of the rubber support columns 11, when the positioning base 3 is placed inside the rectangular outer shell 1, it is supported by multiple rubber support columns 11, so that during the potting process, the potting glue can enter between the positioning base 3 and the bottom of the inner side of the rectangular outer shell 1, ensuring the sealing effect.
[0046] Example 2, based on Example 1, in this embodiment of the present invention, a semi-encapsulated combined inductor includes a rectangular shell 1, with magnetic core bodies 2 provided on both sides of the interior of the rectangular shell 1, a positioning base 3 fixedly installed at the bottom of the magnetic core body 2, and an enameled wire body 4 wound inside the magnetic core body 2. Both the magnetic core body 2 and the enameled wire body 4 are existing components.
[0047] In this embodiment of the invention, a plurality of lead wire bodies 5 are fixedly installed at the bottom of the rectangular outer shell 1, and the plurality of lead wire bodies 5 are respectively connected to the corresponding magnetic core body 2. The interior of the rectangular outer shell 1 is filled with potting compound.
[0048] Specifically, when potting the equipment, the lead wire body 5 is first connected to the magnetic core body 2. After the magnetic core body 2 is placed, potting glue is poured into the rectangular outer shell 1 to complete the potting operation.
[0049] In this embodiment of the invention, the rectangular outer shell 1 is provided with a plurality of heat dissipation pipes 6. The plurality of heat dissipation pipes 6 have the same shape and are all arc-shaped. The plurality of heat dissipation pipes 6 are installed at the corresponding magnetic core body 2 on both sides. The ends of the plurality of heat dissipation pipes 6 all penetrate the rectangular outer shell 1, and the plurality of heat dissipation pipes 6 are all hollow, used to conduct the heat dissipated by the device during operation.
[0050] In this embodiment of the invention, the heat dissipation conduit 6 is made of existing heat dissipation material. Before potting, the heat dissipation conduit 6 is installed inside the rectangular outer shell 1. After potting, the heat dissipation conduit 6 can conduct the heat generated during the operation of the equipment, further ensuring the heat dissipation effect inside the rectangular outer shell 1.
[0051] In this embodiment of the invention, a heat dissipation plate frame 12 is fixedly installed below the positioning base 3. The heat dissipation plate frame 12 penetrates the bottom of the rectangular outer shell 1, and a sealing ring frame 1203 is fixedly installed on the outer side of the heat dissipation plate frame 12. The sealing ring frame 1203 is in contact with the inner bottom of the rectangular outer shell 1. Multiple rectangular grooves 1201 are symmetrically opened inside the heat dissipation plate frame 12, and heat dissipation fins 1202 are fixedly installed inside each of the rectangular grooves 1201.
[0052] In this embodiment of the invention, specifically, by setting the heat dissipation fins 1202, the heat inside the rectangular outer shell 1 can be conducted outward, further preventing high temperatures inside the rectangular outer shell 1 from affecting the operation of the equipment, and effectively improving the heat dissipation performance of the equipment.
[0053] In this embodiment of the invention, multiple heat dissipation pipes 6 are respectively attached to the corresponding enameled wire body 4, and a distance is left between the installation position of the heat dissipation pipes 6 and the inner wall of the rectangular outer shell 1.
[0054] In this embodiment of the invention, a distance is left between the magnetic core bodies 2 on both sides of the rectangular outer shell 1 for potting and filling adhesive, and a limiting partition 9 is provided between the two magnetic core bodies 2 for blocking the magnetic core bodies 2 on both sides.
[0055] In this embodiment of the invention, specifically, a bottom positioning frame 10 is fixedly installed in the middle of the inner side of the rectangular outer shell 1, a limiting partition 9 is slidably installed inside the bottom positioning frame 10, and a plurality of spring bodies are fixedly installed between the limiting partition 9 and the inside of the bottom positioning frame 10.
[0056] In this embodiment of the invention, specifically, by setting the limiting partition 9 and the bottom positioning frame 10, the limiting partition 9 can be lifted by the cooperation of the spring body during use, further improving the insulation between the magnetic core bodies 2. At the same time, when the equipment is packaged and transported, the limiting partition 9 can be compressed into the bottom positioning frame 10, reducing the space occupied and ensuring convenient transportation.
[0057] In this embodiment of the invention, a plurality of rubber support columns 11 are fixedly installed inside the rectangular outer shell 1, and the positioning base 3 is placed above the corresponding rubber support column 11.
[0058] In this embodiment of the invention, specifically, with the cooperation of the rubber support columns 11, when the positioning base 3 is placed inside the rectangular outer shell 1, it is supported by multiple rubber support columns 11, so that during the potting process, the potting glue can enter between the positioning base 3 and the bottom of the inner side of the rectangular outer shell 1, ensuring the sealing effect.
[0059] In this embodiment of the invention, further, both sides of the rectangular outer shell 1 are provided with assembly components, which can be used to assemble the rectangular outer shell 1 to a preset position;
[0060] In this embodiment of the invention, specifically, the assembly component includes a positioning plate frame 7 and a mounting plate 701, with the mounting plate 701 fixedly installed on the outer middle part of the rectangular outer shell 1.
[0061] In this embodiment of the invention, specifically, the positioning plate frame 7 is slidably connected to the corresponding mounting plate 701, a plurality of support springs 702 are fixedly installed between the positioning plate frame 7 and the corresponding mounting plate 701, and a plurality of assembly racks 8 are slidably installed on the outer side of the positioning plate frame 7.
[0062] In this embodiment of the invention, by cooperating with the assembly frame 8 and the positioning plate frame 7, the assembly frame 8 can be adjusted to a suitable position when installing the rectangular outer shell 1, and then the assembly frame 8 can be locked to a preset position by bolts, thus completing the assembly operation of the rectangular outer shell 1.
[0063] In this embodiment of the invention, compared with the traditional installation method, the ease of installation and applicability of the equipment can be effectively improved;
[0064] In this embodiment of the invention, the force on the rectangular outer shell 1 can be buffered by the support spring 702, thereby further improving the protective performance of the equipment.
[0065] In this embodiment of the invention, specifically, the upper and lower sides of the positioning plate frame 7 are symmetrically provided with limiting grooves 703, and the outer side of the assembly frame 8 is fixedly installed with a slider that matches the limiting grooves 703.
[0066] In this embodiment of the invention, the slider is slidably installed inside the limiting groove 703, which facilitates the adjustment of the position of the assembly frame 8. At the same time, when the assembly frame 8 is installed by inserting the positioning bolt into the assembly hole 801, the slider and the limiting groove 703 can be subjected to relative force, thus preventing the rectangular outer shell 1 from sliding after installation.
[0067] In this embodiment of the invention, specifically, a plurality of protective pads 7011 are fixedly installed on the outer side of the mounting plate 701, and elastic protective sheets 7012 are fixedly installed between the positioning plate frame 7 and the end of the mounting plate 701. Through the cooperation of the protective pads 7011 and the elastic protective sheets 7012, the protective effect on the rectangular outer shell 1 is further improved.
[0068] In this embodiment of the invention, specifically, multiple assembly brackets 8 are provided with symmetrical assembly holes 801 on both sides inside, and the assembly holes 801 are threaded holes.
[0069] Furthermore, any content not described in detail in this specification is existing technology known to those skilled in the art.
[0070] The foregoing has provided a detailed description of one embodiment of the present invention, but this description is merely a preferred embodiment and should not be construed as limiting the scope of the invention. All equivalent variations and modifications made within the scope of the present invention should still fall within the scope of the present invention.
Claims
1. A semi-encapsulated composite inductor, comprising a rectangular housing (1), characterized in that: The rectangular outer shell (1) has a magnetic core body (2) on both sides inside. The bottom of the magnetic core body (2) is fixedly installed with a positioning base (3), and the inside of the magnetic core body (2) is wound with an enameled wire body (4). The bottom of the rectangular outer shell (1) is fixedly installed with multiple lead wire bodies (5), and the multiple lead wire bodies (5) are respectively connected to the corresponding magnetic core body (2). The inside of the rectangular outer shell (1) is filled with potting compound. The rectangular outer shell (1) is provided with multiple heat dissipation pipes (6). The multiple heat dissipation pipes (6) are the same in shape and are all arc-shaped. The multiple heat dissipation pipes (6) are installed on both sides of the corresponding magnetic core body (2). The ends of the multiple heat dissipation pipes (6) penetrate the rectangular outer shell (1). The multiple heat dissipation pipes (6) are all hollow and are used to conduct the heat dissipated by the device during operation. A heat sink frame (12) is fixedly installed below the positioning base (3). The heat sink frame (12) penetrates the bottom of the rectangular outer shell (1), and a sealing ring frame (1203) is fixedly installed on the outside of the heat sink frame (12). The sealing ring frame (1203) is in close contact with the bottom of the inner side of the rectangular outer shell (1). Multiple rectangular slots (1201) are symmetrically opened inside the heat sink frame (12), and heat sink fins (1202) are fixedly installed inside each of the rectangular slots (1201). A distance is left between the magnetic core bodies (2) on both sides of the rectangular outer shell (1) for potting and filling glue, and a limiting partition (9) is provided between the two magnetic core bodies (2) to block the magnetic core bodies (2) on both sides. The rectangular outer shell (1) is provided with assembly components on both sides, and the assembly components can be used to assemble the rectangular outer shell (1) to a preset position; The assembly assembly includes a positioning plate frame (7) and a mounting plate (701). The mounting plate (701) is fixedly installed on the outer middle of the rectangular outer shell (1). The positioning plate frame (7) is slidably connected to the corresponding mounting plate (701). Multiple support springs (702) are fixedly installed between the positioning plate frame (7) and the corresponding mounting plate (701). Multiple assembly racks (8) are slidably installed on the outer side of the positioning plate frame (7).
2. The semi-encapsulated composite inductor according to claim 1, characterized in that: Multiple heat dissipation conduits (6) are respectively attached to the corresponding enameled wire body (4), and a distance is left between the installation position of the heat dissipation conduits (6) and the inner wall of the rectangular outer shell (1).
3. The semi-encapsulated composite inductor according to claim 1, characterized in that: A bottom positioning frame (10) is fixedly installed in the middle of the inner side of the rectangular outer shell (1). The limiting partition (9) is slidably installed inside the bottom positioning frame (10), and multiple spring bodies are fixedly installed between the limiting partition (9) and the inside of the bottom positioning frame (10).
4. A semi-encapsulated composite inductor according to claim 1, characterized in that: Multiple rubber support columns (11) are fixedly installed inside the rectangular outer shell (1), and the positioning base (3) is placed above the corresponding rubber support column (11).
5. A semi-encapsulated composite inductor according to claim 1, characterized in that: The positioning plate frame (7) has symmetrically opened limit grooves (703) on both the upper and lower sides, and the assembly frame (8) has a slider that is compatible with the limit groove (703) fixedly installed on the outer side.
6. A semi-encapsulated composite inductor according to claim 1, characterized in that: Multiple protective pads (7011) are fixedly installed on the outer side of the mounting plate (701), and elastic protective plates (7012) are fixedly installed between the positioning plate frame (7) and the end of the mounting plate (701).
7. A semi-encapsulated composite inductor according to claim 1, characterized in that: Assembly holes (801) are symmetrically opened on both sides of the interior of the multiple assembly racks (8).
Citation Information
Patent Citations
Half-potting type combined inductor
CN116564650A
Encapsulated inductor and preparation method and application thereof
CN115020068A
Inductance component
JP2016157891A