Multilayer ceramic capacitor and combination thereof

Abstract

The application discloses a multilayer ceramic capacitor and a combination thereof. The multilayer ceramic capacitor comprises a ceramic body, the ceramic body comprises a plurality of dielectric layers and internal electrodes which are alternately stacked, the dielectric layers are located between the internal electrodes, and the ceramic body is used for forming at least two sub-capacitors with different capacitances. Each sub-capacitor is provided with an independent external electrode at opposite ends of the ceramic body. The multilayer ceramic capacitor has different placement orientations and is electrically connected with electronic components to form different capacitances. The multilayer ceramic capacitor can form different capacitances to meet the requirements of various capacitances required by electronic components. The application can not only reduce the difficulty of preparation, but also reduce the number of multilayer ceramic capacitors used, thereby reducing the production cost and the space occupied by the multilayer ceramic capacitors, and facilitating the development of miniaturization of electronic components.

Description

Technical Field

[0001] The present invention relates to the technical field of capacitors, and in particular to a multilayer ceramic capacitor and a combination thereof. Background Art

[0002] Multi-layer ceramic capacitors (MLCCs) consist of three parts: an inner electrode, a ceramic dielectric layer, and an outer electrode. The inner electrodes are stacked on the ceramic dielectric layer in an offset manner, then sintered at high temperature to form a complete multi-layer ceramic capacitor. Metal layers, or outer electrodes, are then sealed at both ends to form a complete multi-layer ceramic capacitor. In the prior art, a multi-layer ceramic capacitor typically has a fixed capacitance. When a circuit requires multi-layer ceramic capacitors with different capacitances, multiple multi-layer ceramic capacitors with different capacitances are used. This requires preparing multiple multi-layer ceramic capacitors of different specifications, which increases the difficulty of material preparation. Alternatively, multiple multi-layer ceramic capacitors are connected in series or parallel to form different capacitances, which increases the number of multi-layer ceramic capacitors in the electronic component, increasing manufacturing costs and occupying more space in the electronic component.

[0003] Therefore, existing multilayer ceramic capacitors need to be improved. Summary of the Invention

[0004] The purpose of the present invention is to provide a multilayer ceramic capacitor and a combination thereof, which can form different capacitance values ​​to meet the various capacitance requirements of electronic components. It can not only reduce the difficulty of material preparation, but also reduce the number of multilayer ceramic capacitors used. While reducing production costs, it can also reduce the space occupied by multilayer ceramic capacitors, thereby facilitating the development of miniaturization of electronic components.

[0005] The purpose of the present invention is achieved by the following technical solutions:

[0006] A multilayer ceramic capacitor comprises: a ceramic body comprising a plurality of stacked dielectric layers and alternatingly stacked inner electrodes, wherein the dielectric layers are located between the inner electrodes; the ceramic body is used to form at least two sub-capacitors with different capacitance values, each of the sub-capacitors being provided with independent external electrodes at opposite ends of the ceramic body; wherein the multilayer ceramic capacitors have different placement orientations and are electrically connected to electronic components to form different capacitance values.

[0007] Preferably, two external electrodes of one of the sub-capacitors are electrically connected to a pair of pads on the electronic component respectively; or,

[0008] The external electrodes of at least two of the sub-capacitors are electrically connected to the same pair of pads on the electronic component at the same time, so that the at least two sub-capacitors are arranged in parallel; or,

[0009] The sub-capacitors are arranged in a one-to-one correspondence with the pads on the electronic component, and the external electrodes of each sub-capacitor are electrically connected to the pads on the electronic component.

[0010] Preferably, the plurality of sub-capacitors include a first sub-capacitor and a second sub-capacitor, the first sub-capacitor and the second sub-capacitor are stacked along a stacking direction, and the spacing between the internal electrodes and / or the number of stacked dielectric layers of the first sub-capacitor and the second sub-capacitor are different.

[0011] Preferably, the first sub-capacitor has a first external electrode and a second external electrode arranged opposite to each other, and the second sub-capacitor has a third external electrode and a fourth external electrode arranged corresponding to the first external electrode and the second external electrode, the first external electrode and the third external electrode are located at the same end of the ceramic body and are spaced apart, and the second external electrode and the fourth external electrode are located at the other end of the ceramic body and are spaced apart;

[0012] The first sub-capacitor includes a plurality of stacked first dielectric layers and alternately stacked first inner electrodes and second inner electrodes, the first dielectric layer is located between the first inner electrodes and the second inner electrodes, the first outer electrode is electrically connected to the first inner electrode, and the second outer electrode is electrically connected to the second inner electrode;

[0013] The second sub-capacitor includes a plurality of stacked second dielectric layers and an alternately stacked third inner electrode and a fourth inner electrode, the second dielectric layer is located between the third inner electrode and the fourth inner electrode, the third outer electrode is electrically connected to the third inner electrode, and the fourth outer electrode is electrically connected to the fourth inner electrode.

[0014] Preferably, the ceramic body has a first main surface and a second main surface opposite to each other in a stacking direction, a first end surface and a second end surface opposite to each other in a length direction, and a first side surface and a second side surface opposite to each other in a width direction;

[0015] The first external electrode covers a portion of the first main surface, a portion of the first end surface, a portion of the first side surface, and a portion of the second side surface; the second external electrode covers a portion of the first main surface, a portion of the second end surface, a portion of the first side surface, and a portion of the second side surface;

[0016] The third external electrode covers part of the second main surface, part of the first end surface, part of the first side surface and part of the second side surface, and the fourth external electrode covers part of the second main surface, part of the second end surface, part of the first side surface and part of the second side surface.

[0017] Preferably, heights of the first external electrode, the second external electrode, the third external electrode, and the fourth external electrode along the stacking direction are all smaller than a height of the ceramic body.

[0018] Preferably, a spacer layer is provided between the ceramic bodies corresponding to the first sub-capacitor and the second sub-capacitor, the thickness of the spacer layer is greater than the thickness of the first dielectric layer and the thickness of the second dielectric layer, a first gap is provided between the first external electrode and the third external electrode, and a second gap is provided between the second external electrode and the fourth external electrode, the first gap and the second gap are provided corresponding to the spacer layer, and the height of the first gap and the second gap is less than or equal to the thickness of the spacer layer.

[0019] Preferably, an insulating layer is provided in the first gap and the second gap; and / or,

[0020] The first dielectric layer and the second dielectric layer are made of the same material.

[0021] Preferably, when the second main surface of the ceramic body is disposed toward the electronic component, a pair of pads is provided on the electronic component, and the third external electrode and the fourth external electrode are electrically connected to the pair of pads on the electronic component, respectively, so that the second sub-capacitor is electrically connected to the electronic component;

[0022] When the first main surface of the ceramic body is disposed toward the electronic component, the first external electrode and the second external electrode are electrically connected to a pair of pads on the electronic component, respectively, so that the first sub-capacitor is electrically connected to the electronic component.

[0023] Preferably, when the first side surface or the second side surface of the ceramic body is disposed toward the electronic component, a pair of pads is provided on the electronic component, the first external electrode and the third external electrode are electrically connected to one of the pads on the electronic component at the same time, and the second external electrode and the fourth external electrode are electrically connected to the other pad on the electronic component at the same time, so that the first sub-capacitor and the second sub-capacitor are electrically connected in parallel to the electronic component; or,

[0024] Only the first external electrode and the second external electrode are electrically connected to a pair of pads on the electronic component, so that the first sub-capacitor is electrically connected to the electronic component; or,

[0025] Only the third external electrode and the fourth external electrode are electrically connected to a pair of pads on the electronic component, respectively, so that the second sub-capacitor is electrically connected to the electronic component.

[0026] Preferably, when the first side surface or the second side surface of the ceramic body is arranged toward the electronic component, two pairs of solder pads are provided on the electronic component, the first external electrode and the second external electrode are respectively electrically connected to one pair of solder pads on the electronic component, and the third external electrode and the fourth external electrode are respectively electrically connected to the other pair of solder pads on the electronic component.

[0027] Preferably, the ceramic body includes a first recessed portion and a third recessed portion located at the first end surface, and a first protruding portion located between the first recessed portion and the third recessed portion, the first recessed portion is further formed at the intersection of the first main surface, the first side surface, the second side surface and the first end surface, and the third recessed portion is further formed at the intersection of the second main surface, the first side surface, the second side surface and the first end surface; the first external electrode includes a first external end surface and three first external peripheral surfaces connected to the first external end surface, the first external end surface is flush with the external surface of the first protruding portion, and the three first external peripheral surfaces are respectively flush with the corresponding first main surface, the first side surface and the second side surface; the third external electrode includes a third external end surface and three third external peripheral surfaces connected to the third external end surface, the third external end surface is flush with the external surface of the first protruding portion, and the three third external peripheral surfaces are respectively flush with the corresponding second main surface, the first side surface and the second side surface; the first protruding portion is spaced apart between the first external electrode and the third external electrode;

[0028] The ceramic body includes a second recessed portion and a fourth recessed portion located at the second end face, and a second protruding portion located between the second recessed portion and the fourth recessed portion, the second recessed portion is further formed at the intersection of the first main surface, the first side surface, the second side surface and the second end face, and the fourth recessed portion is further formed at the intersection of the second main surface, the first side surface, the second side surface and the second end face; the second external electrode is provided with a second external end face and three second external peripheral surfaces connected to the second external end face, the second external end face is flush with the outer surface of the second protruding portion, and the three second external peripheral surfaces are respectively flush with the corresponding first main surface, the first side surface and the second side surface; the fourth external electrode is provided with a fourth external end face and three fourth external peripheral surfaces connected to the fourth external end face, the fourth external end face is flush with the outer surface of the second protruding portion, and the three fourth peripheral surfaces are respectively flush with the corresponding second main surface, the first side surface and the second side surface; the second protruding portion is spaced apart between the second external electrode and the fourth external electrode.

[0029] A multilayer ceramic capacitor assembly includes an electronic component and a multilayer ceramic capacitor mounted to the electronic component.

[0030] The electronic component includes a pair of pads;

[0031] The multilayer ceramic capacitor comprises: a ceramic body comprising a plurality of stacked dielectric layers and alternately stacked inner electrodes, wherein the dielectric layers are located between the inner electrodes, the ceramic body being used to form at least two sub-capacitors with different capacitance values, wherein at least two of the sub-capacitors are provided with two external electrodes at opposite ends of the ceramic body, the two pairs of external electrodes being independent of each other and spaced apart and arranged at different positions of the ceramic body;

[0032] The two pairs of external electrodes are selectively electrically connected to the same pair of pads of the electronic component through different placement orientations of the multilayer ceramic capacitor to form different capacitance values.

[0033] Preferably, at least two of the sub-capacitors include a first sub-capacitor and a second sub-capacitor stacked in a stacking direction, the first sub-capacitor having a first external electrode and a second external electrode relatively arranged at two ends of the length direction of the ceramic body, and the second sub-capacitor having a third external electrode and a fourth external electrode relatively arranged at two ends of the length direction of the ceramic body; the first external electrode and the third external electrode are located at the same end of the ceramic body along the length direction and are spaced apart along the stacking direction, the second external electrode and the fourth external electrode are located at the other end of the ceramic body along the length direction and are spaced apart along the stacking direction; the ceramic body has a first main surface and a second main surface opposite to each other in the stacking direction, a first end surface and a second end surface opposite to each other in the length direction, and a first end surface and a fourth end surface opposite to each other in the width direction. a first side surface and a second side surface opposite to each other in the direction of degree; when the first main surface of the ceramic body is arranged toward the electronic component, the first external electrode and the second external electrode are respectively electrically connected to a pair of the soldering pads on the electronic component to enable the capacitance of the first sub-capacitor; when the second main surface of the ceramic body is arranged toward the electronic component, the third external electrode and the fourth external electrode are respectively electrically connected to a pair of the soldering pads on the electronic component to enable the capacitance of the second sub-capacitor; when the first side surface or the second side surface of the ceramic body is arranged toward the electronic component, the first and third external electrodes and the second and fourth external electrodes are respectively electrically connected to a pair of the soldering pads on the electronic component to simultaneously enable the capacitance of the first and second sub-capacitors.

[0034] Compared with the prior art, the beneficial effects of the present invention include at least:

[0035] The multilayer ceramic capacitor and its combination of the present invention form at least two sub-capacitors with different capacitance values ​​by arranging multiple groups of independent external electrodes on the ceramic body. Then, by changing the placement orientation of the multilayer ceramic capacitor, multiple sub-capacitors can be independently arranged in the electronic component. Multiple sub-capacitors can also be arranged in the electronic component in series or parallel, so that the multilayer ceramic capacitor has different capacitance values ​​to meet the various capacitance requirements of the electronic component. In this way, there is no need to prepare multiple multilayer ceramic capacitors of different specifications, which not only reduces the difficulty of material preparation, but also reduces the number of multilayer ceramic capacitors used. While reducing production costs and improving production efficiency, it can also reduce the space occupied by multilayer ceramic capacitors, thereby facilitating the development of miniaturization of electronic components. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] Figure 1 FIG. 1 is a schematic diagram of the three-dimensional structure of a multilayer ceramic capacitor in a first placement orientation according to an embodiment of the present invention.

[0037] Figure 2 FIG. 4 is a schematic diagram of the three-dimensional structure of a multilayer ceramic capacitor in a second placement orientation according to an embodiment of the present invention.

[0038] Figure 3 1 is a schematic diagram of the planar structure of a multilayer ceramic capacitor in the first and second placement orientations according to an embodiment of the present invention.

[0039] Figure 4 The first placement of multilayer ceramic capacitors along the Figure 3 Schematic diagram of the cross section along line AA.

[0040] Figure 5 The second placement orientation of the multilayer ceramic capacitor is along Figure 3 Schematic diagram of the cross section along line AA.

[0041] Figure 6 FIG. 4 is a schematic diagram of the three-dimensional structure of a multilayer ceramic capacitor in a third placement orientation according to an embodiment of the present invention.

[0042] Figure 7 FIG. 4 is a schematic diagram of the three-dimensional structure of a multilayer ceramic capacitor in a fourth placement orientation according to an embodiment of the present invention.

[0043] Figure 8 1 is a schematic diagram of the planar structure of the multilayer ceramic capacitor in the third and fourth positions according to an embodiment of the present invention.

[0044] Figure 9 The third placement orientation of multilayer ceramic capacitors is along Figure 8 Schematic diagram of the cross section along the BB line.

[0045] Figure 10When the multilayer ceramic capacitor is placed in the fourth position, Figure 8 Schematic diagram of the cross section along the BB line.

[0046] Figure 11 FIG. 4 is a schematic diagram of the three-dimensional structure of a multilayer ceramic capacitor in a second placement orientation according to another embodiment of the present invention.

[0047] Figure 12 FIG. 1 is a schematic planar structural diagram of a multilayer ceramic capacitor in a second placement orientation according to another embodiment of the present invention.

[0048] Figure 13 It is along Figure 12 Schematic cross-section of the CC line.

[0049] Figure 14 It is along Figure 12 Schematic cross-section of the DD line.

[0050] In the figure: 100, multilayer ceramic capacitor; 1, ceramic body; 11, dielectric layer; 111, first dielectric layer; 112, second dielectric layer; 113, spacer layer; 114, first recessed portion; 115, second recessed portion; 116, third recessed portion; 117, fourth recessed portion; 118, first protruding portion; 119, second protruding portion; 12, inner electrode; 121, first inner electrode; 122, second inner electrode; 123, third inner electrode; 124, fourth inner electrode; 13, sub-capacitor; 131, first sub-capacitor; 132, second sub-capacitor; 14, first main surface; 1 5. Second main surface; 16. First end surface; 17. Second end surface; 18. First side surface; 19. Second side surface; 2. External electrode; 21. First external electrode; 211. First external end surface; 212. First peripheral surface; 22. Second external electrode; 221. Second external end surface; 222. Second peripheral surface; 23. Third external electrode; 231. Third external end surface; 232. Third peripheral surface; 24. Fourth external electrode; 241. Fourth external end surface; 242. Fourth peripheral surface; 25. Gap; 251. First gap; 252. Second gap; 200. Electronic component; 210. Pad. DETAILED DESCRIPTION

[0051] Example embodiments will now be described more fully with reference to the accompanying drawings. However, example embodiments can be implemented in many forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concepts of the example embodiments to those skilled in the art. Identical reference numerals in the drawings represent identical or similar structures, and thus repeated descriptions thereof will be omitted.

[0052] The words expressing positions and directions described in the present invention are all explained with reference to the accompanying drawings as examples, but can be modified as needed, and all such modifications are within the scope of protection of the present invention.

[0053] Reference Figures 1 to 14 The present invention provides a multilayer ceramic capacitor 100, comprising: a ceramic body 1 and an external electrode 2. The external electrode 2 can be disposed on the surface of the ceramic body 1. The multilayer ceramic capacitor 100 can be electrically connected to an electronic component 200 via the external electrode 2. The electronic component 200 can be a printed circuit board (PCB), a ceramic board provided with circuits, a base provided with circuits, etc. When the electronic component 200 is a base provided with circuits, the circuits in the base can be metal terminals. The metal terminals have pads 210 connected to the multilayer ceramic capacitor 100. The multilayer ceramic capacitor 100 can be directly connected to the pads of the metal terminals.

[0054] Specifically, refer to Figure 1 、 Figure 4 The ceramic body 1 as a whole can be a hexahedron or other shapes. In this embodiment, the ceramic body 1 as a whole can be a rectangular parallelepiped, and the ceramic body 1 has a first main surface 14 and a second main surface 15 opposite to each other in the stacking direction, a first end surface 16 and a second end surface 17 opposite to each other in the length direction, and a first side surface 18 and a second side surface 19 opposite to each other in the width direction. As a preferred embodiment, the external electrodes 2 can be provided at both ends of the ceramic body 1 in the length direction, and the first main surface 14, the second main surface 15, the first side surface 18 and the second side surface 19 of the ceramic body 1 can all serve as mounting surfaces, that is, the first main surface 14, the second main surface 15, the first side surface 18 and the second side surface 19 of the ceramic body 1 can all serve as mounting surfaces for soldering the multilayer ceramic capacitor 100 on the electronic component 200.

[0055] Reference Figure 4 、 Figure 5 The ceramic body 1 may include a plurality of stacked dielectric layers 11 and alternatingly stacked internal electrodes 12. The stacking direction described below refers to the direction in which the dielectric layer 11 or the internal electrode 12 is stacked. The dielectric layer 11 is located between the internal electrodes 12, that is, the dielectric layer 11 is located between adjacent internal electrodes 12. The dielectric layer 11 can isolate the adjacent internal electrodes 12 to achieve electrical separation, thereby forming a capacitor. The internal electrode 12 can be formed by printing a conductive paste on a ceramic green sheet. The conductive paste contains one or more of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and their alloys. The raw materials of the dielectric layer 11 are not particularly limited, as long as sufficient capacitance can be obtained. Barium titanate-based materials, lead composite perovskite-based materials, strontium titanate-based materials, etc. can be used.

[0056] The ceramic body 1 is used to form at least two sub-capacitors 13 with different capacitance values. The at least two sub-capacitors 13 can be stacked along the stacking direction. A multilayer ceramic capacitor 100 can include two or more sub-capacitors 13. When the number of sub-capacitors 13 is two, the capacitance values ​​of the two sub-capacitors 13 are different. When the number of sub-capacitors 13 is more than two, at least two sub-capacitors 13 with different capacitance values ​​are included, that is, the capacitance values ​​of some sub-capacitors 13 can be the same, or the capacitance values ​​of all sub-capacitors 13 can be different. By changing the placement orientation of the multilayer ceramic capacitor 100, multiple sub-capacitors 13 can be arranged in the electronic component 200 in series or parallel, or by using one sub-capacitor 13 alone, so that the multilayer ceramic capacitor 100 has different capacitance values.

[0057] The capacitance of the sub-capacitor 13 can be changed by changing the spacing between the internal electrodes 12 of the sub-capacitor 13 or the overlapping area of ​​the internal electrodes 12, by changing the number of dielectric layers 11 stacked in the sub-capacitor 13, or by changing the material of the dielectric layer 11. Of course, the capacitance of the sub-capacitor 13 can also be changed by other methods, which are not listed here.

[0058] Reference Figure 1 、 Figure 4 , each sub-capacitor 13 is provided with an independent external electrode 2 at the opposite ends of the ceramic body 1, that is, each sub-capacitor 13 has two external electrodes 2, and each sub-capacitor 13 is provided with an external electrode 2 at both ends in the length direction of the ceramic body 1. Each sub-capacitor 13 is provided with an independent external electrode 2, and the external electrodes 2 of adjacent sub-capacitors 13 are insulated from each other. For example, a gap 25 can be provided between the external electrodes 2 of adjacent sub-capacitors 13, and the gap 25 can realize electrical isolation between adjacent external electrodes 2. An insulating layer (not shown) can also be provided in the gap 25. The insulating layer can not only improve the insulation performance between adjacent external electrodes 2, but also prevent foreign matter from entering the gap 25 and causing the adjacent external electrodes 2 to be electrically connected, thereby ensuring that adjacent sub-capacitors 13 are independent of each other.

[0059] The multilayer ceramic capacitor 100 is electrically connected to the electronic component 200 in different placement positions to form different capacitance values. In other words, by adjusting the placement position of the multilayer ceramic capacitor 100, the external electrodes 2 of different sub-capacitors 13 can be electrically connected to the electronic component 200, thereby electrically connecting one or more sub-capacitors 13 to the electronic component 200. When multiple sub-capacitors 13 are electrically connected to the electronic component 200, the multiple sub-capacitors 13 can be arranged in series and / or in parallel with the electronic component 200. The multiple sub-capacitors 13 can also be independently arranged in the electronic component 200 to meet the needs of the circuit for a variety of different capacitance values, thereby achieving the purpose of forming multiple capacitance values ​​with a single multilayer ceramic capacitor 100.

[0060] As an example, see Figure 1 、 Figure 2 、 Figure 4 、 Figure 5 By changing the placement orientation of the multilayer ceramic capacitor 100, the two external electrodes 2 of one of the sub-capacitors 13 can be electrically connected to a pair of pads 210 on the electronic component 200, that is, only one sub-capacitor 13 can be electrically connected to the electronic component 200. At this time, the capacitance of the sub-capacitor 13 is the capacitance of the multilayer ceramic capacitor 100.

[0061] Reference Figure 6 、 Figure 9 By changing the placement orientation of the multilayer ceramic capacitor 100, the external electrodes 2 of at least two sub-capacitors 13 can be electrically connected to the same pair of pads 210 on the electronic component 200 at the same time, so that the at least two sub-capacitors 13 are arranged in parallel, that is, the external electrodes 2 of at least two sub-capacitors 13 are electrically connected to the same pair of pads 210 at the same time, and at least two sub-capacitors 13 are connected in parallel to the electronic component 200. At this time, the capacitance of the at least two sub-capacitors 13 after being connected in parallel is the capacitance of the multilayer ceramic capacitor 100.

[0062] Reference Figure 7 、 Figure 10 By changing the placement of the multilayer ceramic capacitor 100, the external electrodes 2 of the sub-capacitors 13 are arranged in a one-to-one correspondence with the pads 210 on the electronic component 200. That is, the number of sub-capacitors 13 can correspond to the number of pads 210, and the electronic component 200 is provided with multiple pairs of pads 210. The external electrodes 2 of each sub-capacitor 13 are respectively electrically connected to the pads 210 on the electronic component 200. By setting the connection relationship between the circuit on the electronic component 200 and the pads 210, the connection relationship between the multiple sub-capacitors 13 can be changed. In this case, the multiple sub-capacitors 13 can be independently arranged in the electronic component 200, and the multiple sub-capacitors 13 can also be connected in series and / or in parallel, thereby achieving the purpose of forming a multilayer ceramic capacitor 100 with multiple capacitance values.

[0063] In the present application, multiple sets of independent external electrodes 2 are provided on the ceramic body 1 to form at least two sub-capacitors 13 with different capacitance values. By changing the placement of the multilayer ceramic capacitor 100, multiple sub-capacitors 13 can be independently provided in the electronic component 200. Multiple sub-capacitors 13 can also be provided in the electronic component 200 in series or parallel, resulting in the multilayer ceramic capacitor 100 having different capacitance values ​​to meet the various capacitance requirements of the electronic component 200. This eliminates the need to prepare multiple multilayer ceramic capacitors 100 of different specifications, which not only reduces the difficulty of material preparation but also reduces the number of multilayer ceramic capacitors 100 used. This reduces production costs and improves production efficiency while also reducing the space occupied by the multilayer ceramic capacitors 100, thereby facilitating the miniaturization of the electronic component 200. Furthermore, by changing the wiring on the electronic component 200, the multilayer ceramic capacitor 100 can achieve the same capacitance value when placed in different orientations. This allows the multilayer ceramic capacitor 100 to be used in different electronic components 200, further diversifying the wiring design of the electronic component 200.

[0064] In a specific embodiment, referring to Figure 1 The multiple sub-capacitors 13 may include a first sub-capacitor 131 and a second sub-capacitor 132. The first sub-capacitor 131 and the second sub-capacitor 132 may be stacked along a stacking direction, with the first sub-capacitor 131 disposed near the first main surface 14 and the second sub-capacitor 132 disposed near the second main surface 15. The first sub-capacitor 131 and the second sub-capacitor 132 may have different spacing between the inner electrodes 12 and / or the number of stacked dielectric layers 11, thereby achieving different capacitance values ​​for the first sub-capacitor 131 and the second sub-capacitor 132.

[0065] Reference Figure 1 、 Figure 2 、 Figure 6 、 Figure 7 The first sub-capacitor 131 may include a first external electrode 21 and a second external electrode 22 disposed opposite each other, and the second sub-capacitor 132 may include a third external electrode 23 and a fourth external electrode 24 disposed corresponding to the first external electrode 21 and the second external electrode 22. The heights of the first external electrode 21, the second external electrode 22, the third external electrode 23, and the fourth external electrode 24 along the stacking direction are all less than the height of the ceramic body 1.

[0066] The structure and material of the first external electrode 21, the second external electrode 22, the third external electrode 23 and the fourth external electrode 24 can be the same. The first external electrode 21, the second external electrode 22, the third external electrode 23 and the fourth external electrode 24 can be a single-layer or multi-layer structure. The material of the first external electrode 21, the second external electrode 22, the third external electrode 23 and the fourth external electrode 24 can be copper, nickel, tin, etc. When a multi-layer structure is adopted, from the inside to the outside, the first external electrode 21, the second external electrode 22, the third external electrode 23 and the fourth external electrode 24 can include a copper layer, a nickel layer and a tin layer, respectively.

[0067] Reference Figure 1 、 Figure 2 、 Figure 6 、 Figure 7 The first external electrode 21 and the third external electrode 23 are located at the same end of the ceramic body 1, and a first gap 251 may be provided between them to separate the first external electrode 21 and the third external electrode 23. The second external electrode 22 and the fourth external electrode 24 are located at the other end of the ceramic body 1, and a second gap 252 may be provided between them to separate the second external electrode 22 and the fourth external electrode 24. This makes the first sub-capacitor 131 and the second sub-capacitor 132 independent of each other. The heights of the first gap 251 and the second gap 252 in the stacking direction are preferably the same or approximately the same. An insulating layer may be provided in the first gap 251 and the second gap 252. The insulating layer may not only improve the insulation performance between the first external electrode 21 and the third external electrode 23 and the insulation performance between the second external electrode 22 and the fourth external electrode 24, but also prevent foreign matter from entering the first gap 251 and causing an electrical connection between the first external electrode 21 and the third external electrode 23, and may also prevent foreign matter from entering the second gap 252 and causing an electrical connection between the second external electrode 22 and the fourth external electrode 24, thereby ensuring that the first sub-capacitor 131 and the second sub-capacitor 132 are independent of each other.

[0068] Reference Figure 4 、 Figure 5 、 Figure 9 、 Figure 10 The first sub-capacitor 131 may include a plurality of stacked first dielectric layers 111 and alternating first and second internal electrodes 121 and 122. The first dielectric layer 111 is located between the first and second internal electrodes 121 and 122. The first dielectric layer 111 can isolate and electrically separate the first and second internal electrodes 121 and 122, thereby forming a capacitor. The first and second internal electrodes 121 and 122 can be exposed from the first and second end surfaces 16 and 17 of the ceramic body 1, respectively. The first external electrode 21 can be electrically connected to the first internal electrode 121, and the second external electrode 22 can be electrically connected to the second internal electrode 122.

[0069] Reference Figure 4 、 Figure 5 、 Figure 9 、 Figure 10 The second sub-capacitor 132 may include a plurality of stacked second dielectric layers 112 and alternating third and fourth internal electrodes 123 and 124. The second dielectric layer 112 is located between the third and fourth internal electrodes 123 and 124. The second dielectric layer 112 may isolate and electrically separate the third and fourth internal electrodes 123 and 124, thereby forming a capacitor. The third and fourth internal electrodes 123 and 124 may be exposed from the first and second end surfaces 16 and 17 of the ceramic body 1, respectively. The third external electrode 23 may be electrically connected to the third internal electrode 123, and the fourth external electrode 24 may be electrically connected to the fourth internal electrode 124.

[0070] The portion of the ceramic body 1 corresponding to the first sub-capacitor 131 and the portion of the ceramic body 1 corresponding to the second sub-capacitor 132 are sintered simultaneously to form a complete ceramic body 1. Specifically, the first sub-capacitor 131 and the second sub-capacitor 132 are preferably formed integrally. The first dielectric layer 111 and the second dielectric layer 112 may be made of the same or different materials. Specifically, the first dielectric layer 111 and the second dielectric layer 112 may be made of the same material or different materials.

[0071] As a preferred method, refer to Figure 1 、 Figure 2 、 Figure 6 、 Figure 7 The first external electrode 21 can cover part of the first main surface 14, part of the first end surface 16, part of the first side surface 18 and part of the second side surface 19, and the second external electrode 22 can cover part of the first main surface 14, part of the second end surface 17, part of the first side surface 18 and part of the second side surface 19.

[0072] Reference Figure 1 、 Figure 2 、 Figure 6 、 Figure 7 The third external electrode 23 can cover part of the second main surface 15, part of the first end surface 16, part of the first side surface 18 and part of the second side surface 19, and the fourth external electrode 24 can cover part of the second main surface 15, part of the second end surface 17, part of the first side surface 18 and part of the second side surface 19.

[0073] As an example, see Figure 1 、 Figure 4When the second main surface 15 of the ceramic body 1 is disposed toward the electronic component 200, a pair of solder pads 210 may be provided on the electronic component 200, and the third external electrode 23 and the fourth external electrode 24 may be electrically connected to the pair of solder pads 210 on the electronic component 200, respectively, so that the second sub-capacitor 132 is electrically connected to the electronic component 200. That is, only the second sub-capacitor 132 is electrically connected to the solder pads 210 on the electronic component 200. At this time, the capacitance of the second sub-capacitor 132 is the capacitance of the multilayer ceramic capacitor 100.

[0074] Reference Figure 2 、 Figure 5 When the first main surface 14 of the ceramic body 1 is set toward the electronic component 200, the first external electrode 21 and the second external electrode 22 can be electrically connected to a pair of pads 210 on the electronic component 200, respectively, so that the first sub-capacitor 131 is electrically connected to the electronic component 200. That is, only the first sub-capacitor 131 is electrically connected to the pads 210 on the electronic component 200. At this time, the capacitance of the first sub-capacitor 131 is the capacitance of the multilayer ceramic capacitor 100.

[0075] Reference Figure 6 、 Figure 9 When the first side surface 18 or the second side surface 19 of the ceramic body 1 is positioned toward the electronic component 200, a pair of pads 210 may be provided on the electronic component 200. The first external electrode 21 and the third external electrode 23 may be electrically connected to one of the pads 210 on the electronic component 200 at the same time, and the second external electrode 22 and the fourth external electrode 24 may be electrically connected to the other pad 210 on the electronic component 200 at the same time, so that the first sub-capacitor 131 and the second sub-capacitor 132 are electrically connected in parallel to the electronic component 200. At this time, the first sub-capacitor 131 and the second sub-capacitor 132 are arranged in parallel in the electronic component 200. At this time, the capacitance of the first sub-capacitor 131 and the second sub-capacitor 132 after being connected in parallel is the capacitance of the multilayer ceramic capacitor 100.

[0076] When the first side surface 18 or the second side surface 19 of the ceramic body 1 is positioned toward the electronic component 200, a pair of solder pads 210 may be provided on the electronic component 200, or only the first external electrode 21 and the second external electrode 22 may be electrically connected to the pair of solder pads 210 on the electronic component 200, respectively, while the third external electrode 23 and the fourth external electrode 24 are not electrically connected to the solder pads 210, so that the first sub-capacitor 131 is electrically connected to the electronic component 200. That is, only the first sub-capacitor 131 is electrically connected to the solder pads 210 on the electronic component 200. In this case, the capacitance of the first sub-capacitor 131 is equal to the capacitance of the multilayer ceramic capacitor 100.

[0077] When the first side surface 18 or the second side surface 19 of the ceramic body 1 is positioned toward the electronic component 200, a pair of solder pads 210 may be provided on the electronic component 200, or only the third external electrode 23 and the fourth external electrode 24 may be electrically connected to the pair of solder pads 210 on the electronic component 200, respectively, while the first external electrode 21 and the second external electrode 22 are not electrically connected to the solder pads 210, so that the second sub-capacitor 132 is electrically connected to the electronic component 200. That is, only the second sub-capacitor 132 is electrically connected to the solder pads 210 on the electronic component 200. In this case, the capacitance of the second sub-capacitor 132 is equal to the capacitance of the multilayer ceramic capacitor 100.

[0078] Reference Figure 7 、 Figure 10 When the first side 18 or the second side 19 of the ceramic body 1 is positioned toward the electronic component 200, two pairs of pads 210 may be provided on the electronic component 200. The first external electrode 21 and the second external electrode 22 are respectively electrically connected to one pair of pads 210 on the electronic component 200, and the third external electrode 23 and the fourth external electrode 24 are respectively electrically connected to the other pair of pads 210 on the electronic component 200. The circuitry on the electronic component 200 can be controlled to connect the first sub-capacitor 131 and the second sub-capacitor 132 in series or in parallel, or to operate independently.

[0079] In a specific embodiment, referring to Figure 4 、 Figure 5 、 Figure 9 、 Figure 10 A spacer layer 113 may be provided between the ceramic body 1 corresponding to the first sub-capacitor 131 and the second sub-capacitor 132. The thickness of the spacer layer 113 is preferably greater than the thickness of the first dielectric layer 111 and the thickness of the second dielectric layer 112. The spacer layer 113 can separate the first sub-capacitor 131 and the second sub-capacitor 132 from each other to prevent mutual influence between the first sub-capacitor 131 and the second sub-capacitor 132. In other words, the spacer layer 113 can separate adjacent sub-capacitors 13 so that adjacent sub-capacitors 13 are independent of each other. In some embodiments, there may be multiple spacer layers 113. Multiple spacer layers 113 can enable the multilayer ceramic capacitor 100 to form more sub-capacitors 13.

[0080] The spacer layer 113 can be formed by sintering simultaneously with the portions of the ceramic body 1 corresponding to the first sub-capacitor 131 and the second sub-capacitor 132. That is, the spacer layer 113 and the portions of the ceramic body 1 corresponding to the first sub-capacitor 131 and the second sub-capacitor 132 are preferably formed integrally, thereby forming a complete ceramic body 1. Compared to the first dielectric layer 111 and the second dielectric layer 112, the spacer layer 113 does not have an internal electrode 12 disposed thereon. The spacer layer 113, the first dielectric layer 111, and the second dielectric layer 112 can be formed of the same material, or they can be formed of different materials.

[0081] Reference Figure 4 、 Figure 5 、 Figure 9 、 Figure 10 The first gap 251 and the second gap 252 can be arranged corresponding to the spacer layer 113, that is, the first gap 251 and the second gap 252 are arranged outside the spacer layer 113, and the height of the first gap 251 and the second gap 252 is less than or equal to the thickness of the spacer layer 113. As a preferred embodiment, the first external electrode 21 and the third external electrode 23, respectively, on the side close to the first gap 251, can be arranged close to the spacer layer 113 or cover a portion of the spacer layer 113, and the second external electrode 22 and the fourth external electrode 24, respectively, on the side close to the second gap 252, can be arranged close to the spacer layer 113 or cover a portion of the spacer layer 113. This ensures that the first external electrode 21, the second external electrode 22, the third external electrode 23, and the fourth external electrode 24 are stably electrically connected to the corresponding internal electrode 12.

[0082] In another embodiment, referring to Figure 11 、 Figure 13 、 Figure 14The ceramic body 1 may include a first recessed portion 114 and a third recessed portion 116 located at the first end surface 16, and a first protruding portion 118 located between the first recessed portion 114 and the third recessed portion 116. The first recessed portion 114 may be further formed at the intersection of the first main surface 14, the first side surface 18, the second side surface 19, and the first end surface 16, and the third recessed portion 116 may be further formed at the intersection of the second main surface 15, the first side surface 18, the second side surface 19, and the first end surface 16. The first external electrode 21 may include a first external end surface 211 and three first outer peripheral surfaces 212 connecting the first external end surface 211. The first external end surface 211 is flush with the outer surface of the first protruding portion 118, and the three first outer peripheral surfaces 212 are respectively flush with the corresponding first main surface 14, the first side surface 18, and the second side surface 19. The third external electrode 23 may include a third outer end surface 231 and three third outer peripheral surfaces 232 connected to the third outer end surface 231. The third outer end surface 231 is flush with the outer surface of the first protrusion 118. The three third outer peripheral surfaces 232 may be flush with the corresponding second main surface 15, first side surface 18, and second side surface 19. The first protrusion 118 is disposed between the first external electrode 21 and the third external electrode 23.

[0083] Reference Figure 11 、 Figure 13 、 Figure 14The ceramic body 1 may include a second recessed portion 115 and a fourth recessed portion 117 located at the second end surface 17, and a second protruding portion 119 located between the second recessed portion 115 and the fourth recessed portion 117. The second recessed portion 115 may be further formed at the intersection of the first main surface 14, the first side surface 18, the second side surface 19, and the second end surface 17, and the fourth recessed portion 117 may be further formed at the intersection of the second main surface 15, the first side surface 18, the second side surface 19, and the second end surface 17. The second external electrode 22 may include a second external end surface 221 and three second external peripheral surfaces 222 connecting the second external end surface 221. The second external end surface 221 is flush with the outer surface of the second protruding portion 119, and the three second external peripheral surfaces 222 are respectively flush with the corresponding first main surface 14, the first side surface 18, and the second side surface 19. The fourth external electrode 24 may include a fourth outer end surface 241 and three fourth outer peripheral surfaces 242 connected to the fourth outer end surface 241. The fourth outer end surface 241 is flush with the outer surface of the second protrusion 119. The three fourth outer peripheral surfaces 242 may be flush with the corresponding second main surface 15, first side surface 18, and second side surface 19. The second protrusion 119 is disposed between the second external electrode 22 and the fourth external electrode 24. Therefore, in this embodiment, the first external electrode 21, the second external electrode 22, the third external electrode 23 and the fourth external electrode 24 are respectively arranged at the first recessed portion 114, the second recessed portion 115, the third recessed portion 116 and the fourth recessed portion 117 of the ceramic body 1, thereby forming a regular rectangular multilayer ceramic capacitor 100. The external electrode 2 does not protrude from the ceramic body 1. When any surface of the multilayer ceramic capacitor 100 is directly or indirectly subjected to external force, a large pressure will not be generated on a small contact area, making the external electrode 2 not easy to loosen or fall off, and having a stronger ability to resist deformation; and the first protrusion 118 and the second protrusion 119 directly provided on the ceramic body 1 are spaced apart between the external electrodes 2 corresponding to the same end of the ceramic body 1, which play an insulating isolation function, and can also prevent foreign matter from entering the multilayer ceramic capacitor 100 and causing adjacent external electrodes 2 to be electrically connected, thereby ensuring that adjacent sub-capacitors 13 are independent of each other.

[0084] Reference Figures 1 to 14 The present invention further provides a multilayer ceramic capacitor assembly including an electronic component 200 and a multilayer ceramic capacitor 100 mounted to the electronic component 200. The electronic component 200 may include a pair of pads 210 for soldering to the multilayer ceramic capacitor 100.

[0085] The multilayer ceramic capacitor 100 includes a ceramic body 1, which may include a plurality of stacked dielectric layers 11 and alternatingly stacked internal electrodes 12. The dielectric layers 11 are located between the internal electrodes 12. The ceramic body 1 is used to form at least two sub-capacitors 13 with different capacitance values. The at least two sub-capacitors 13 are provided with two external electrodes 2 at opposite ends of the ceramic body 1. The two external electrodes 2 are independent of each other and are spaced apart at different positions on the ceramic body 1.

[0086] Among them, the two pairs of external electrodes 2 are selectively electrically connected to the same pair of pads 210 of the electronic component 200 through different placement orientations of the multilayer ceramic capacitor 100 to form different capacitance values, thereby meeting the needs of various different capacitance values ​​required by the circuit, thereby achieving the purpose of forming multiple capacitance values ​​with a multilayer ceramic capacitor 100.

[0087] As a preferred embodiment, at least two sub-capacitors 13 may include a first sub-capacitor 131 and a second sub-capacitor 132 stacked in the stacking direction. The first sub-capacitor 131 has a first external electrode 21 and a second external electrode 22 arranged at opposite ends of the length direction of the ceramic body 1, and the second sub-capacitor 132 has a third external electrode 23 and a fourth external electrode 24 arranged at opposite ends of the length direction of the ceramic body 1. The first external electrode 21 and the third external electrode 23 are located at the same end of the ceramic body 1 along the length direction and are spaced apart along the stacking direction, and the second external electrode 22 and the fourth external electrode 24 are located at the other end of the ceramic body 1 along the length direction and are spaced apart along the stacking direction. The ceramic body 1 has a first main surface 14 and a second main surface 15 opposite to each other in the stacking direction, a first end surface 16 and a second end surface 17 opposite to each other in the length direction, and a first side surface 18 and a second side surface 19 opposite to each other in the width direction. When the first main surface 14 of the ceramic body 1 is positioned toward the electronic component 200, the first external electrode 21 and the second external electrode 22 are respectively electrically connected to a pair of pads 210 on the electronic component 200 to enable the capacitance of the first sub-capacitor 131. When the second main surface 15 of the ceramic body 1 is positioned toward the electronic component 200, the third external electrode 23 and the fourth external electrode 24 are respectively electrically connected to a pair of pads 210 on the electronic component 200 to enable the capacitance of the second sub-capacitor 132. When the first side surface 18 or the second side surface 19 of the ceramic body 1 is positioned toward the electronic component 200, the first external electrode 21, the third external electrode 23, the second external electrode 22, and the fourth external electrode 24 are respectively electrically connected to a pair of pads 210 on the electronic component 200 to simultaneously enable the capacitance of the first sub-capacitor 131 and the second sub-capacitor 132.

[0088] Although the embodiments of the present invention have been shown and described above, it will be understood that the above embodiments are illustrative and are not to be construed as limiting the present invention. A person skilled in the art may change, modify, replace and modify the above embodiments within the scope of the invention without departing from the principles and purpose of the present invention. All such changes shall fall within the scope of protection of the claims of the present invention.

Claims

1. A multilayer ceramic capacitor, characterized in that include: A ceramic body comprising a plurality of stacked dielectric layers and alternating internal electrodes, the dielectric layers being located between the internal electrodes, the ceramic body being configured to form at least two sub-capacitors having different capacitances, each sub-capacitor being provided with independent external electrodes at opposite ends of the ceramic body; The plurality of sub-capacitors include a first sub-capacitor and a second sub-capacitor, the first sub-capacitor and the second sub-capacitor are stacked along a stacking direction, and the first sub-capacitor and the second sub-capacitor have different spacings between internal electrodes and / or different numbers of stacked dielectric layers; The first sub-capacitor comprises a first external electrode and a second external electrode arranged opposite to each other, and the second sub-capacitor comprises a third external electrode and a fourth external electrode arranged corresponding to the first external electrode and the second external electrode, the first external electrode and the third external electrode being located at the same end of the ceramic body and spaced apart, and the second external electrode and the fourth external electrode being located at the other end of the ceramic body and spaced apart; The first sub-capacitor includes a plurality of stacked first dielectric layers and alternately stacked first inner electrodes and second inner electrodes, the first dielectric layer is located between the first inner electrodes and the second inner electrodes, the first outer electrode is electrically connected to the first inner electrode, and the second outer electrode is electrically connected to the second inner electrode; The second sub-capacitor includes a plurality of stacked second dielectric layers and a third inner electrode and a fourth inner electrode that are alternately stacked, the second dielectric layer is located between the third inner electrode and the fourth inner electrode, the third outer electrode is electrically connected to the third inner electrode, and the fourth outer electrode is electrically connected to the fourth inner electrode; The multilayer ceramic capacitor has different placement orientations and is electrically connected to the electronic components to form different capacitance values.

2. The multilayer ceramic capacitor according to claim 1, wherein Two external electrodes of one of the sub-capacitors are electrically connected to a pair of pads on the electronic component respectively; or, The external electrodes of at least two of the sub-capacitors are electrically connected to the same pair of pads on the electronic component at the same time, so that the at least two sub-capacitors are arranged in parallel; or, The sub-capacitors are arranged in a one-to-one correspondence with the pads on the electronic component, and the external electrodes of each sub-capacitor are electrically connected to the pads on the electronic component.

3. The multilayer ceramic capacitor according to claim 1, wherein The ceramic body has a first main surface and a second main surface opposite to each other in a stacking direction, a first end surface and a second end surface opposite to each other in a length direction, and a first side surface and a second side surface opposite to each other in a width direction; The first external electrode covers a portion of the first main surface, a portion of the first end surface, a portion of the first side surface, and a portion of the second side surface; the second external electrode covers a portion of the first main surface, a portion of the second end surface, a portion of the first side surface, and a portion of the second side surface; The third external electrode covers part of the second main surface, part of the first end surface, part of the first side surface and part of the second side surface, and the fourth external electrode covers part of the second main surface, part of the second end surface, part of the first side surface and part of the second side surface.

4. The multilayer ceramic capacitor according to claim 1, wherein The heights of the first external electrode, the second external electrode, the third external electrode, and the fourth external electrode along the stacking direction are all smaller than the height of the ceramic body.

5. The multilayer ceramic capacitor according to claim 1, wherein A spacer layer is provided between the ceramic bodies corresponding to the first sub-capacitor and the second sub-capacitor, and the thickness of the spacer layer is greater than the thickness of the first dielectric layer and the thickness of the second dielectric layer. A first gap is provided between the first external electrode and the third external electrode, and a second gap is provided between the second external electrode and the fourth external electrode. The first gap and the second gap are provided corresponding to the spacer layer, and the heights of the first gap and the second gap are less than or equal to the thickness of the spacer layer.

6. The multilayer ceramic capacitor according to claim 5, wherein An insulating layer is provided in the first gap and the second gap; and / or, The first dielectric layer and the second dielectric layer are made of the same material.

7. The multilayer ceramic capacitor according to claim 3, wherein When the second main surface of the ceramic body is disposed toward the electronic component, a pair of pads is disposed on the electronic component, and the third external electrode and the fourth external electrode are electrically connected to the pair of pads on the electronic component, respectively, so that the second sub-capacitor is electrically connected to the electronic component; When the first main surface of the ceramic body is disposed toward the electronic component, the first external electrode and the second external electrode are electrically connected to a pair of pads on the electronic component, respectively, so that the first sub-capacitor is electrically connected to the electronic component.

8. The multilayer ceramic capacitor according to claim 3, wherein When the first side surface or the second side surface of the ceramic body is disposed toward the electronic component, a pair of pads is disposed on the electronic component, the first external electrode and the third external electrode are electrically connected to one of the pads on the electronic component at the same time, and the second external electrode and the fourth external electrode are electrically connected to the other pad on the electronic component at the same time, so that the first sub-capacitor and the second sub-capacitor are electrically connected in parallel to the electronic component; or Only the first external electrode and the second external electrode are electrically connected to a pair of pads on the electronic component, so that the first sub-capacitor is electrically connected to the electronic component; or, Only the third external electrode and the fourth external electrode are electrically connected to a pair of pads on the electronic component, respectively, so that the second sub-capacitor is electrically connected to the electronic component.

9. The multilayer ceramic capacitor according to claim 3, wherein When the first side surface or the second side surface of the ceramic body is set toward the electronic component, two pairs of solder pads are provided on the electronic component, the first external electrode and the second external electrode are respectively electrically connected to one pair of solder pads on the electronic component, and the third external electrode and the fourth external electrode are respectively electrically connected to the other pair of solder pads on the electronic component.

10. The multilayer ceramic capacitor according to claim 3, wherein The ceramic body includes a first recessed portion and a third recessed portion located at the first end surface, and a first protruding portion located between the first recessed portion and the third recessed portion, the first recessed portion being further formed at the intersection of the first main surface, the first side surface, the second side surface and the first end surface, the third recessed portion being further formed at the intersection of the second main surface, the first side surface, the second side surface and the first end surface; the first external electrode includes a first external end surface and three first external peripheral surfaces connected to the first external end surface, the first external end surface is flush with the external surface of the first protruding portion, and the three first external peripheral surfaces are respectively flush with the corresponding first main surface, the first side surface and the second side surface; the third external electrode includes a third external end surface and three third external peripheral surfaces connected to the third external end surface, the third external end surface is flush with the external surface of the first protruding portion, and the three third external peripheral surfaces are respectively flush with the corresponding second main surface, the first side surface and the second side surface; the first protruding portion is spaced apart between the first external electrode and the third external electrode; The ceramic body includes a second recessed portion and a fourth recessed portion located at the second end face, and a second protruding portion located between the second recessed portion and the fourth recessed portion, the second recessed portion is further formed at the intersection of the first main surface, the first side surface, the second side surface and the second end face, and the fourth recessed portion is further formed at the intersection of the second main surface, the first side surface, the second side surface and the second end face; the second external electrode is provided with a second external end face and three second external peripheral surfaces connected to the second external end face, the second external end face is flush with the outer surface of the second protruding portion, and the three second external peripheral surfaces are respectively flush with the corresponding first main surface, the first side surface and the second side surface; the fourth external electrode is provided with a fourth external end face and three fourth external peripheral surfaces connected to the fourth external end face, the fourth external end face is flush with the outer surface of the second protruding portion, and the three fourth peripheral surfaces are respectively flush with the corresponding second main surface, the first side surface and the second side surface; the second protruding portion is spaced apart between the second external electrode and the fourth external electrode.

11. A multilayer ceramic capacitor assembly, characterized in that: comprising an electronic component and a multilayer ceramic capacitor according to any one of claims 1 to 10, wherein the multilayer ceramic capacitor is mounted to the electronic component, The electronic component includes a pair of pads; The multilayer ceramic capacitor comprises: a ceramic body comprising a plurality of stacked dielectric layers and alternately stacked inner electrodes, wherein the dielectric layers are located between the inner electrodes, the ceramic body being used to form at least two sub-capacitors with different capacitance values, wherein at least two of the sub-capacitors are provided with two external electrodes at opposite ends of the ceramic body, the two pairs of external electrodes being independent of each other and spaced apart and arranged at different positions of the ceramic body; The two pairs of external electrodes are selectively electrically connected to the same pair of pads of the electronic component through different placement orientations of the multilayer ceramic capacitor to form different capacitance values.

12. The multilayer ceramic capacitor assembly according to claim 11, wherein: At least two of the sub-capacitors include a first sub-capacitor and a second sub-capacitor stacked in a stacking direction, the first sub-capacitor having a first external electrode and a second external electrode relatively arranged at two ends of the length direction of the ceramic body, and the second sub-capacitor having a third external electrode and a fourth external electrode relatively arranged at two ends of the length direction of the ceramic body; the first external electrode and the third external electrode are located at the same end of the ceramic body along the length direction and are spaced apart along the stacking direction, the second external electrode and the fourth external electrode are located at the other end of the ceramic body along the length direction and are spaced apart along the stacking direction; the ceramic body has a first main surface and a second main surface opposite to each other in the stacking direction, a first end surface and a second end surface opposite to each other in the length direction, and a first end surface and a fourth end surface opposite to each other in the width direction. A first side surface and a second side surface facing upward; when the first main surface of the ceramic body is set toward the electronic component, the first external electrode and the second external electrode are respectively electrically connected to a pair of the solder pads on the electronic component to enable the capacitance of the first sub-capacitor; when the second main surface of the ceramic body is set toward the electronic component, the third external electrode and the fourth external electrode are respectively electrically connected to a pair of the solder pads on the electronic component to enable the capacitance of the second sub-capacitor; when the first side surface or the second side surface of the ceramic body is set toward the electronic component, the first and third external electrodes and the second and fourth external electrodes are respectively electrically connected to a pair of the solder pads on the electronic component to simultaneously enable the capacitance of the first and second sub-capacitors.

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