Test device, test equipment and test method

Abstract

The invention relates to the technical field of testing equipment, and discloses a testing device, testing equipment and a testing method.The testing device is applied to the testing equipment with a control device, the testing device comprises a mounting frame, a driving assembly, a force measuring assembly, a testing separation blade and a displacement measuring assembly, and the driving assembly is connected to the mounting frame; the force measuring assembly is connected to the driving end of the driving assembly, the testing separation blade is connected to the force measuring assembly, and the driving assembly is suitable for driving the testing separation blade to get close to or away from the outer surface of the to-be-tested object through the force measuring assembly; the to-be-tested object is provided with a vacuum hole which is positioned on the outer surface and is opposite to the test separation blade, and is used for generating suction force to the test separation blade; the displacement measuring assembly is connected to the mounting frame; the force measurement assembly is used for measuring stress data of the test separation blade, and the displacement measurement assembly is used for measuring displacement data of the test separation blade; and the control device is configured to obtain data of the distance between the test separation blade and the outer surface according to the displacement data, so that the suction force of the vacuum hole can be tested and analyzed.

Description

Technical Field

[0001] The present invention relates to the technical field of testing equipment, and in particular to a testing device, testing equipment and a testing method. Background Art

[0002] During the production and testing of semiconductors, semiconductor production or testing equipment usually uses vacuum holes to absorb and fix semiconductor chips (such as wafers or other semiconductor chips) to reduce damage and contamination to the semiconductor chips. Vacuum holes of different sizes, different numbers of vacuum holes, and the distance between the semiconductor chip and the vacuum holes all affect the absorption and fixation effect of the vacuum holes on the semiconductor chip.

[0003] At present, when designing vacuum holes, the designs are mostly based on the experience of R&D personnel, which easily leads to the situation that the designed vacuum holes cannot meet the actual needs. Therefore, there is an urgent need for a testing device to test and analyze the suction of the vacuum holes. Summary of the invention

[0004] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention provides a testing device capable of testing and analyzing the suction force of a vacuum hole.

[0005] The present invention also provides a testing device having the above-mentioned testing apparatus, and a testing method applied to the testing device.

[0006] A test device according to an embodiment of the first aspect of the present invention is applied to a test device, the test device includes a control device communicatively connected to the test device, the test device includes a mounting frame, a drive assembly, a force measuring assembly, a test baffle and a displacement measuring assembly, the drive assembly is connected to the mounting frame; the force measuring assembly is connected to the drive end of the drive assembly, the test baffle is connected to the force measuring assembly, the drive assembly is suitable for driving the test baffle to approach or move away from the outer surface of the object to be tested through the force measuring assembly; the object to be tested is provided with a vacuum hole located on the outer surface, the vacuum hole is opposite to the test baffle, and is used to generate suction for the test baffle; the displacement measuring assembly is connected to the mounting frame; wherein the force measuring assembly is used to measure the force data of the test baffle, and the displacement measuring assembly is used to measure the displacement data of the test baffle; the control device is configured to obtain the spacing data between the test baffle and the outer surface according to the displacement data, and the spacing data and the force data correspond one to one.

[0007] The test device according to the embodiment of the present invention has at least the following beneficial effects: the test baffle is driven by the driving component to approach or move away from the outer surface of the object to be tested, the airflow in the vacuum hole generates suction on the test baffle, the force measurement component can measure the force data, the displacement measurement can measure the displacement data of the test baffle, and the control device can obtain the spacing data between the test baffle and the outer surface according to the displacement data, so as to obtain one-to-one corresponding spacing data and force data, and obtain the suction size of the vacuum hole corresponding to different distances between the test baffle and the vacuum hole, so that R&D personnel can use this as a reference to design the vacuum holes on semiconductor production or testing equipment, such as designing the aperture and number of the vacuum holes on the semiconductor production or testing equipment, the distance between the semiconductor wafer and the vacuum hole (that is, the distance between the semiconductor wafer and the outer surface), etc.

[0008] According to some embodiments of the present invention, the force measurement assembly also includes a bracket and a force sensor, the bracket is connected to the driving end of the driving assembly, and the force sensor is connected between the bracket and the test baffle; the driving assembly is suitable for driving the bracket to move reciprocatingly, and the force sensor is used to measure the force applied to the test baffle.

[0009] According to some embodiments of the present invention, the displacement measurement assembly includes an optical displacement sensor and a reflective element, both of which are connected to a mounting bracket; the reflective element is located in the propagation path of the measuring light emitted by the optical displacement sensor, and is used to reflect the measuring light to a test baffle, and the measuring light reflected by the test baffle is reflected to the optical displacement sensor via the reflective element; the optical displacement sensor is used to measure the displacement data of the test baffle based on the reflected measuring light.

[0010] According to some embodiments of the present invention, the force measurement assembly further includes a reflector, which is connected to the test baffle and located in the propagation path of the measuring light, and is used to reflect the measuring light to the reflective member.

[0011] According to some embodiments of the present invention, the testing device further includes a position adjustment component, the position adjustment component is connected to the mounting frame, the optical displacement sensor is connected to the position adjustment component, and the position adjustment component is used to adjust the distance between the optical displacement sensor and the reflector.

[0012] According to some embodiments of the present invention, the testing device further comprises an aperture measurement assembly, which is connected to the mounting frame and is used to measure aperture data of the vacuum hole.

[0013] According to some embodiments of the present invention, the aperture measurement assembly includes a camera assembly, which is connected to a mounting frame, and the camera assembly, a reflector and a test baffle are distributed in sequence; the test baffle has a transparent portion, and the transparent portion and the camera assembly are arranged relative to each other; the reflector is a transparent structure; the camera assembly is suitable for photographing the vacuum hole through the reflector and the transparent portion to measure the aperture of the vacuum hole.

[0014] According to some embodiments of the present invention, the distribution direction of the camera assembly, the reflector and the test baffle is arranged at an angle to the distribution direction of the reflector and the optical displacement sensor.

[0015] According to the second aspect of the present invention, the testing device comprises a control device and the testing device in any one of the above embodiments, the control device and the testing device are communicatively connected, and the control device is configured to obtain the spacing data between the test baffle and the outer surface according to the displacement data, and to draw a relationship diagram according to the spacing data and the force data.

[0016] According to a testing method of an embodiment of the third aspect of the present invention, applied to the testing device in the above-mentioned embodiment, the testing method includes: controlling a driving component to drive a test baffle to move toward an outer surface of an object to be tested according to a first preset displacement through a force measuring component, wherein the object to be tested is provided with a vacuum hole located on the outer surface, the vacuum hole and the test baffle are opposite to each other, and are used to generate suction to the test baffle; when the test baffle moves a first preset displacement, corresponding first force data and first displacement data are obtained; when the test baffle moves a first preset displacement, if the first displacement data remains unchanged and the first force data reaches a preset force threshold, controlling the driving component to drive the test baffle to move according to a second preset displacement The test baffle is moved by an amount of displacement to move away from the outer surface; when the test baffle moves a second preset displacement each time, the corresponding second force data and second displacement data are obtained; according to each first displacement data, the corresponding first spacing data between the test baffle and the outer surface are obtained, and according to each second displacement data, the corresponding second spacing data between the test baffle and the outer surface are obtained; according to the first displacement data, the first force data, the second displacement data, and the second force data, a corresponding relationship diagram is drawn; wherein the first force data and the second force data are both obtained according to the force magnitude of the test baffle measured by the force measurement component, and the first displacement data and the second displacement data are both obtained according to the displacement of the test baffle measured by the displacement measurement component.

[0017] Additional aspects and advantages of the present invention will be given in part in the following description and in part will be obvious from the following description, or will be learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The present invention will be further described below with reference to the accompanying drawings and embodiments, wherein:

[0019] Figure 1 A schematic diagram showing the structure of a testing device and an object to be tested provided by an embodiment of the present invention is shown;

[0020] Figure 2 Shows Figure 1 A schematic diagram of a part of the structure of the object to be tested and the test device;

[0021] Figure 3 Shows Figure 1 A schematic diagram of a part of the structure of the object to be tested and the test device from another perspective;

[0022] Figure 4 Shows Figure 2 A schematic diagram of a part of the structure of the object to be tested and the test device;

[0023] Figure 5 A schematic diagram of a flow chart of a testing method provided by an embodiment of the present invention is shown;

[0024] Figure 6 A schematic diagram of a relationship curve provided by an embodiment of the present invention is shown;

[0025] Figure 7 A schematic diagram of the force-bearing process of the test baffle provided by an embodiment of the present invention is shown.

[0026] Reference numerals:

[0027] Testing device 100;

[0028] Mounting frame 110; first support plate 111; second support plate 113; third support plate 115;

[0029] Driving assembly 130; driving member 131; sliding block 133;

[0030] Force measurement assembly 150; bracket 151; first connection portion 1511; second connection portion 1513; force sensor 153; reflective sheet 155;

[0031] Test baffle 170;

[0032] Displacement measurement assembly 190; optical displacement sensor 191; reflector 193; first limit switch 210; origin switch 230; second limit switch 250;

[0033] Position adjustment assembly 270; fixed block 271; adjustment block 273; adjustment rod 275; elastic member 279;

[0034] Aperture measurement assembly 290; camera assembly 291; camera 2911; lens 2913; light source 2915; housing 310;

[0035] Object to be measured 500; outer surface 510; vacuum hole 530; first direction Y; second direction X. DETAILED DESCRIPTION

[0036] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0037] In the description of the present invention, it should be understood that descriptions involving orientations, such as up, down, front, back, left, right, etc., and orientations or positional relationships indicated are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0038] In the description of the present invention, "several" means more than one, "many" means more than two, "greater than", "less than", "exceed", etc. are understood to exclude the number itself, and "above", "below", "within", etc. are understood to include the number itself. If there is a description of "first" or "second", it is only used for the purpose of distinguishing the technical features, and cannot be understood as indicating or implying the relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0039] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.

[0040] In the description of the present invention, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0041] See also Figure 1 An embodiment of the present application provides a testing device, which includes a testing device 100 and a control device. The control device is communicatively connected to the testing device 100 and is used to control the testing device 100.

[0042] The testing equipment may be used to test the suction force of the vacuum hole 530 .

[0043] The communication connection may refer to a wireless communication connection or a wired communication connection.

[0044] As an example, the control device may be a computer, a control panel or other control devices.

[0045] In some embodiments, the control device may include a controller and a display.

[0046] The controller may be used to control the testing device 100 and the display, and may be used to process various data.

[0047] The controller can be a single chip microcomputer, ARM, MCU or other control devices.

[0048] The display can show test data, charts and other information.

[0049] In some embodiments, the control device may further include a storage unit, which may store data fed back by the testing device 100 and information such as data, charts, etc. processed by the controller.

[0050] See also Figures 2 to 4 In some embodiments, the testing device 100 includes a mounting frame 110 , a driving assembly 130 , a force measurement assembly 150 , a testing baffle 170 , and a displacement measurement assembly 190 .

[0051] The mounting frame 110 may be used to mount and support structures such as the driving assembly 130 , the force measuring assembly 150 , the test baffle 170 , and the displacement measuring assembly 190 .

[0052] The mounting frame 110 can be fixed at a desired position, for example, the mounting frame 110 can be fixed on a pre-set base, or the mounting frame 110 can be fixed on a wall or some other installation positions, so as to stably measure the object 500 to be measured.

[0053] The driving assembly 130 is connected to the mounting frame 110, the force measuring assembly 150 is connected to the driving end of the driving assembly 130, and the test baffle 170 is connected to the force measuring assembly 150. The driving assembly 130 is suitable for driving the test baffle 170 to approach or move away from the outer surface 510 of the object to be tested 500 through the force measuring assembly 150.

[0054] As an example, the driving component 130 may be an electric driving component 130 , which may be communicatively connected to the control device, and the control device may control the driving component 130 to drive the force measurement component 150 to move along the first direction Y to approach or move away from the object to be measured 500 .

[0055] The object to be tested 500 is provided with a vacuum hole 530 on the outer surface 510 . The vacuum hole 530 is opposite to the test baffle 170 and is used to generate suction force on the test baffle 170 .

[0056] As an example, the object to be tested 500 is roughly in a plate-like structure, and the vacuum hole 530 can penetrate the object to be tested 500. The object to be tested 500 can be roughly placed on the support structure in advance, and the position of the object to be tested 500 can be adjusted so that the vacuum hole 530 and the test baffle 170 located above the object to be tested 500 can be opposite. The test device 100 can extract the airflow in the vacuum hole 530 through the vacuum device, so that the airflow in the vacuum hole 530 can generate suction on the test baffle 170, so that the test device 100 can measure the force applied to the test baffle 170.

[0057] The force measurement assembly 150 is used to measure the force data of the test baffle 170 . The force measurement assembly 150 can be communicatively connected with the control device to transmit the force data to the control device for storage and analysis.

[0058] It can be understood that when the test baffle 170 and the outer surface 510 are not in contact, the test baffle 170 only bears the suction from the vacuum hole 530, and the force data is only the suction of the vacuum hole 530; when the test baffle 170 and the outer surface 510 are in contact, the test baffle 170 simultaneously bears the suction of the vacuum hole 530 and the resistance of the object to be tested 500, and the force data is the sum of the suction of the vacuum hole 530 and the resistance of the object to be tested 500.

[0059] It should be noted that the suction force of the vacuum hole 530 and the resistance force of the object to be tested 500 are in opposite directions. When the suction force of the vacuum hole 530 on the test baffle 170 is positive, the resistance force of the object to be tested 500 on the test baffle 170 can be negative. In this case, when the test baffle 170 is subjected to the suction force of the vacuum hole 530 and the resistance force of the object to be tested 500 at the same time, the force data measured by the force measurement component 150 is usually smaller than the force data measured by the force measurement component 150 when the test baffle 170 is subjected to only the suction force of the vacuum hole 530.

[0060] The displacement measuring assembly 190 is connected to the mounting frame 110 and is used to measure the displacement data of the test baffle 170 . The displacement data may correspond to the force data one by one.

[0061] As an example, when measuring the displacement data of the test baffle 170 , the displacement measuring component 190 may take the position of the displacement measuring component 190 as the origin to measure the distance of the test baffle 170 relative to the origin as the displacement data.

[0062] It should be noted that, as the test baffle 170 moves, the position of the test baffle 170 and the force applied thereto will change, and each displacement data may correspond to a force data.

[0063] The control device is configured to obtain the spacing data between the test baffle 170 and the outer surface 510 based on the displacement data. The spacing data and the force data correspond one to one, so that the spacing data and the corresponding force data between the test baffle 170 and the outer surface 510 can be obtained. By obtaining multiple sets of spacing data and corresponding force data, it is convenient for R&D personnel to measure and analyze the data, so that the R&D personnel can use this as a reference to design the vacuum hole 530 on the semiconductor production or testing equipment.

[0064] Among them, the semiconductor production or testing equipment can be a probe station, which can facilitate R&D personnel to design the aperture, number, distance between the semiconductor chip (such as a wafer or other semiconductor chip) and the vacuum hole 530 (that is, the distance between the semiconductor chip and the outer surface 510), etc. of the vacuum hole 530 on the probe station.

[0065] The semiconductor production or testing equipment may also be a robot for adsorbing semiconductor wafers or other testing or production equipment.

[0066] As an example, the control device can plot multiple sets of force data and spacing data into a relationship curve graph for storage, the horizontal axis of the relationship curve graph can be the spacing data, and the vertical axis can be the force data. Research and development personnel can analyze the aperture, quantity, distance between the semiconductor wafer and the vacuum hole 530 on the semiconductor production or testing equipment based on the relationship curve graph.

[0067] It should be noted that the size of the vacuum hole 530 on the object to be tested 500 can be measured by the testing device 100, or can be manually measured in advance, so that the aperture, force data and spacing data of the vacuum hole 530 can be matched to facilitate R&D personnel to measure and analyze the data.

[0068] In some embodiments, the mounting frame 110 may include a first support plate 111 , a second support plate 113 , and a third support plate 115 .

[0069] The first support plate 111 and the third support plate 115 are respectively connected to both ends of the second support plate 113 and extend to opposite sides of the second support plate 113. The second support plate 113 can be connected to the first support plate 111 at an angle, and the third support plate 115 can be connected to the second support plate 113 at an angle, for example, the second support plate 113 and the first support plate 111 can be vertically connected, and the third support plate 115 and the second support plate 113 can be vertically connected.

[0070] The testing device 100 can be installed at a desired installation position through the first supporting plate 111 .

[0071] The driving assembly 130 may include a driving member 131 and a slider 133, wherein the driving member 131 may be connected to the third support plate 115, and the slider 133 may be slidably connected to the second support plate 113, and the driving end of the driving member 131 may be transmission-connected to the slider 133 to drive the slider 133 to slide back and forth on the second support plate 113. The driving end of the driving member 131 may adopt a screw rod, a telescopic rod or other structures to drive the slider 133 to slide.

[0072] The sliding direction of the slider 133 may be the distribution direction of the first support plate 111 and the third support plate 115 on the second support plate 113 . For example, the slider 133 may slide back and forth substantially along the first direction Y.

[0073] The force measurement assembly 150 may be connected to the slider 133 , so that the force measurement assembly 150 and the test direction may move synchronously along the first direction Y following the slider 133 to approach or move away from the test baffle 170 .

[0074] In some embodiments, the testing device 100 may also include a first limit switch 210, an origin switch 230, and a second limit switch 250 distributed in sequence along the first direction Y. The first limit switch 210, the origin switch 230, and the second limit switch 250 are all connected to the mounting bracket 110, and can be communicated with the drive assembly 130 or the control device.

[0075] The first limit switch 210 and the second limit switch 250 are used to limit the maximum displacement of the slider 133 along the first direction Y.

[0076] As an example, a trigger portion 1331 may be provided on the slider 133, and the trigger portion 1331 moves back and forth along the first direction Y with the slider 133 to trigger the first limit switch 210, the origin switch 230, and the second limit switch 250, so that a first trigger signal can be sent out when it contacts or moves within the detection range of the first limit switch 210 and the second limit switch 250. The drive component 130 or the control device receives the first trigger signal to control the slider 133 to stop moving or move in the opposite direction, which helps to limit the displacement of the slider 133 and avoid detachment from the mounting frame 110.

[0077] The origin switch 230 can set a zero position for the slider 133, that is, when the trigger part 1331 moves to contact or moves into the detection range of the origin switch 230, a second trigger signal is issued, and when the drive component 130 or the control device receives the second trigger signal, it determines that the slider 133 is at the zero position, that is, it determines that the test baffle 170 is at the zero position, so as to facilitate subsequent drive control.

[0078] The first limit switch 210 , the origin switch 230 , and the second limit switch 250 may all be photoelectric switches.

[0079] In some embodiments, the force measurement assembly 150 may further include a bracket 151 and a force sensor 153 .

[0080] Among them, the bracket 151 can be connected to the driving end of the driving component 130, the force sensor 153 is connected between the bracket 151 and the test baffle 170, the driving component 130 is suitable for driving the bracket 151 to move back and forth, and the force sensor 153 can move back and forth with the bracket 151.

[0081] As an example, the bracket 151 can be connected to the slider 133 to move back and forth synchronously along the first direction Y with the slider 133 .

[0082] The force sensor 153 can be used to measure the force applied to the test baffle 170 to obtain force data of the test baffle 170 , and transmit the force data to the control device for storage and processing.

[0083] In some embodiments, the bracket 151 may include a first connecting portion 1511 and a second connecting portion 1513 connected at an angle, the first connecting portion 1511 may be connected to the driving end of the driving assembly 130, and the force sensor 153 may be connected to an end of the second connecting portion 1513 away from the first connecting portion 1511 and extend outward to form a cantilever beam structure.

[0084] The force sensor 153 may include a plurality of strain gauges. The plurality of strain gauges may be connected to the second connection portion 1513 and distributed on opposite sides of the second connection portion 1513 along the moving direction.

[0085] When the test baffle 170 is subjected to force, the second connection portion 1513 is deformed, and the strain gauge is deformed synchronously, so that the force data of the test baffle 170 can be measured. The specific force measurement principle of the strain gauge can refer to the existing technology and will not be repeated here.

[0086] In some embodiments, the first connection portion 1511 and the second connection portion 1513 may be substantially perpendicular.

[0087] In some embodiments, the second connection portion 1513 may be provided with a through hole, which may penetrate the second connection portion 1513 , and the axial direction of the through hole is substantially perpendicular to the first direction Y, so that the second connection portion 1513 is more easily deformed.

[0088] A plurality of strain gauges may be distributed on opposite sides of the through hole along the radial direction and are all connected to the second connection portion 1513 so as to bend up and down along the first direction Y with the second connection portion 1513 , thereby being able to test the magnitude of forces in two directions.

[0089] As an example, the through hole may include a first hole, a second hole and a third hole connected in sequence along the radial direction, wherein the first hole and the third hole may be circular holes, and the second hole may be a rectangular hole. The number of strain gauges may be four, two strain gauges are connected to the opposite sides of the second connecting portion 1513, two opposite strain gauges are distributed on the opposite sides of the first hole along the radial direction, and two opposite strain gauges may also be distributed on the opposite sides of the third hole along the radial direction. In this way, the second connecting portion 1513 has sufficient structural strength and is more likely to deform, which helps the strain gauge to more accurately measure the force data of the test baffle 170.

[0090] In some embodiments, the displacement measurement assembly 190 may include an optical displacement sensor 191 and a reflector 193 .

[0091] The optical displacement sensor 191 and the reflector 193 are both connected to the mounting bracket 110 .

[0092] The reflector 193 may be located in the propagation path of the measuring light emitted by the optical displacement sensor 191, and is used to reflect the measuring light to the test patch 170. The measuring light reflected by the test patch 170 is reflected to the optical displacement sensor 191 via the reflector 193. The optical displacement sensor 191 is used to measure the displacement data of the test patch 170 according to the reflected measuring light, so as to measure the displacement data of the test patch 170. The optical displacement sensor 191 may be communicatively connected to the control device to transmit the displacement data to the control device for storage, and the control device may process and analyze the force data and the displacement data.

[0093] The reflective member 193 may be spaced apart from the slider 133 to avoid interfering with the sliding movement of the slider 133 .

[0094] The optical displacement sensor 191 may be a laser triangulation displacement sensor, a spectral confocal principle displacement sensor, or other displacement sensors. The specific working principle thereof may refer to the prior art and will not be described in detail.

[0095] Taking the displacement sensor based on the spectral confocal principle as an example, the optical displacement sensor 191 may include an optical measuring head and a control device. The optical measuring head may be connected to the control device via an optical fiber. The control device may transmit the measuring light to the optical measuring head via the optical fiber. The optical measuring head then emits the measuring light to the reflector 193, and may receive the measuring light reflected by the test baffle 170 to the reflector 193 and reflected by the reflector 193. The control device receives the reflected measuring light and performs processing and analysis to obtain the displacement data of the test baffle 170. The specific working principle may refer to the prior art and will not be elaborated on herein.

[0096] It should be noted that when measuring the displacement data of the test patch 170, there are multiple ways to measure the displacement data of the test patch 170. Among them, the reflector 193 and the test patch 170 can be distributed along the first direction Y, and the reflector 193 and the optical displacement sensor 191 can be distributed along the second direction X. The first direction Y and the second direction X are substantially perpendicular, the first direction Y is substantially a vertical direction, and the second direction X is substantially a horizontal direction.

[0097] As an example, the testing device 100 can use the position of the optical displacement sensor 191 or the reflector 193 as the coordinate origin to measure the longitudinal coordinate value of the test baffle 170 along the first direction Y relative to the origin, and the longitudinal coordinate value can be the displacement data of the test baffle 170.

[0098] As another example, the testing device 100 can use the position of the test baffle 170 as the coordinate origin when the measurement data of the displacement measurement component 190 remains unchanged, that is, when the test baffle 170 is in contact with the outer surface 510 of the object to be tested 500, to measure the longitudinal coordinate value of the test baffle 170 along the first direction Y relative to the coordinate origin when the test baffle 170 is in different positions. The longitudinal coordinate value can be the displacement data of the test baffle 170.

[0099] In some embodiments, the force measurement component 150 may further include a reflector 155, which is connected to the test baffle 170 and is located in the propagation path of the measuring light, and is used to reflect the measuring light to the reflector 193, thereby reducing light loss and helping the optical displacement sensor 191 to more accurately measure the displacement data of the test baffle 170.

[0100] The reflective sheet 155 may be a reflective but opaque metal film or other reflective but opaque film layers.

[0101] In some embodiments, the reflective sheet 155 is substantially annular, connected to a surface of the test baffle 170 facing the reflective element 193 , and connected around the test baffle 170 .

[0102] In some embodiments, the reflective sheet 155 is substantially rectangular and connected to a surface of the test blocking sheet 170 facing the reflective element 193 .

[0103] In some embodiments, the testing device 100 may further include a position adjustment component 270, which is connected to the mounting bracket 110, and the optical displacement sensor 191 is connected to the position adjustment component 270. The position adjustment component is used to adjust the distance between the optical displacement sensor 191 and the reflector 193, so that the position of the optical displacement sensor 191 relative to the reflector 193 can be flexibly adjusted, which helps to ensure that the optical displacement sensor 191 more accurately measures the displacement data of the test baffle 170.

[0104] The position adjustment component 270 may have a variety of structural configurations.

[0105] As an example, the position adjustment assembly 270 may include a fixed block 273, an adjustment block 271, an adjustment rod 275 and an elastic member 279, wherein the fixed block 273 may be fixedly connected to the mounting frame 110, and the adjustment block 271 may be spaced apart from the fixed block 273 along the second direction X. The adjustment rod 275 may be threadedly connected to the adjustment block 271, and partially extend between the adjustment block 271 and the fixed block 273, and abut against the fixed block 273. The elastic member 279 may be connected between the fixed block 273 and the adjustment block 271, and is used to pull the adjustment block 271 close to the fixed block 273. The adjustment rod 275 may also be a finished micrometer screw, a micrometer screw housing and an adjustment block 271, and the adjustment block 271 is further connected to a sliding block that fixes the optical displacement sensor 191.

[0106] As another example, the position adjustment assembly 270 may include a fixed block 271, an adjustment block 273, an adjustment rod 275, and an elastic member 279. The fixed block 271 may be fixedly connected to the mounting frame 110, and the adjustment block 273 may be spaced apart from the fixed block 271 along the second direction X and movably connected to the mounting frame 110. The adjustment rod 275 may be threadedly connected to the adjustment block 273, and partially extend between the adjustment block 273 and the fixed block 271, and abut against the adjustment block 273. The elastic member 279 may be connected between the fixed block 271 and the adjustment block 273, and is used to pull the adjustment block 273 close to the fixed block 271.

[0107] It can be understood that the adjustment rod 275 can be rotated manually or electrically.

[0108] The optical displacement sensor 191 can be connected to the adjustment block 273, and is located on one side of the reflective member 193 along the second direction X. When the adjustment rod 275 rotates, the adjustment block 273 can be pushed away from or close to the fixed block 271, so as to adjust the distance between the optical displacement sensor 191 and the reflective member 193. The elastic member 279 and the adjustment rod 275 can cooperate to more stably position the adjustment block 273 at a desired position, which helps the optical displacement sensor 191 to more stably measure the displacement data of the test baffle 170.

[0109] As another example, the position adjustment component 270 can adopt a screw structure, and an adjustment block 273 can be connected to the screw. The optical displacement sensor 191 can be connected to the adjustment block 273. When the screw rotates, the adjustment block 273 is driven to move back and forth with the screw, thereby adjusting the distance between the optical displacement sensor 191 and the reflector 193.

[0110] It should be noted that the position adjustment component 270 may also adopt other adjustment structures, and the above is only used as an example to facilitate understanding.

[0111] In some embodiments, the testing device 100 may further include an aperture measurement assembly 290, which may be connected to the mounting bracket 110 and used to measure the aperture data of the vacuum hole 530, so that the testing device 100 can measure the aperture of the vacuum hole 530, which helps the control device to directly analyze the aperture data, displacement data, and force data accordingly, without the need to manually measure the aperture of the vacuum hole 530 in advance, thereby reducing recording errors or measurement errors and improving the accuracy of the measurement of the testing equipment.

[0112] As an example, the aperture measurement component 290 may adopt a laser measuring instrument, an ultrasonic measuring instrument, an image measuring instrument or other devices capable of measuring aperture.

[0113] In some embodiments, the aperture measurement assembly 290 may include a camera assembly 291 , which may be connected to the mounting bracket 110 .

[0114] As an example, the camera assembly 291 may be connected to the third support plate 115. The camera assembly 291 may include a camera 2911, a lens 2913, and a light source 2915. The camera 2911 may be connected to the third support plate 115, and the lens 2913 may be connected to the camera 2911 and opposite to the reflector 193. The light source 2915 may be connected to one side of the lens 2913 along the second direction X to provide light for the camera 2911 to shoot.

[0115] The camera assembly 291 , the reflector 193 , and the test patch 170 may be distributed in sequence.

[0116] As an example, the camera assembly 291 , the reflector 193 , and the test patch 170 may be distributed in sequence along the first direction Y.

[0117] The test baffle 170 may have a transparent portion, which may be arranged opposite to the camera assembly 291. The reflector 193 may be a transparent structure. The camera assembly 291 is suitable for photographing the vacuum hole 530 through the reflector 193 and the transparent portion to measure the aperture of the vacuum hole 530, thereby avoiding the reflector 193 from blocking the lens 2913, which helps to take clearer photos of the vacuum hole 530 to better measure the aperture of the vacuum hole 530.

[0118] As an example, the test baffle 170 may be a transparent structure, for example, the test baffle 170 may be made of transparent acrylic or other transparent materials.

[0119] It should be noted that the camera component 291 and the displacement measurement component can work at intervals to avoid the light source 2915 of the camera component 291 affecting the shooting effect of the camera component 291, or to avoid the light source 2915 of the camera component 291 affecting the measurement effect of the measurement light of the displacement measurement component.

[0120] In some embodiments, the camera assembly 291 can be connected to the control device for communication so as to transmit the captured image of the vacuum hole 530 to the control device, and the control device can perform image analysis and processing to obtain the aperture data of the vacuum hole 530 .

[0121] In some embodiments, the distribution direction of the camera assembly 291, the reflector 193 and the test baffle 170 is set at an angle to the distribution direction of the reflector 193 and the optical displacement sensor 191. In this way, the reflector 193 is set between the optical displacement sensor 191 and the camera assembly 291, which helps to make the camera assembly 291 and the optical displacement assembly more compact, helps to make the overall structure of the test device 100 more compact, and reduces the volume of the test device 100.

[0122] As an example, the camera assembly 291 , the reflector 193 , and the test patch 170 may be sequentially distributed along the first direction Y, and the reflector 193 and the optical displacement sensor 191 may be distributed along the second direction X.

[0123] In some embodiments, the reflector 193 may be a semi-transparent and semi-reflective prism, a light-transmitting mirror, or other devices that have both light-transmitting and reflective effects.

[0124] As an example, the semi-transparent and semi-reflective prism may include two triangular prisms connected with opposite bevels, and a semi-transparent and semi-reflective film may be provided on the bevel. The measurement light reflected by the optical displacement sensor 191 may be directed between the two triangular prisms, and reflected to the test patch 170 by the semi-transparent and semi-reflective film provided on the bevel, and the semi-transparent and semi-reflective film may also reflect the measurement light reflected back by the test patch 170 to the optical displacement sensor 191. The camera assembly 291 may take a picture of the vacuum hole 530 through the semi-transparent and semi-reflective film and the transparent part of the test patch 170.

[0125] As another example, the light-transmitting reflector can be arranged obliquely between the camera assembly 291 and the test patch 170, and a metal film inclined toward the optical displacement sensor 191 and the test patch 170 is arranged on the inclined surface, and the metal film has the effects of light transmission and reflection, so as to reflect the measurement light reflected by the optical displacement sensor 191 to the test patch 170, and reflect the measurement light reflected by the test patch 170 to the optical displacement sensor 191. The camera assembly 291 can then take a picture of the vacuum hole 530 through the transparent part of the metal film and the test patch 170.

[0126] In some embodiments, the testing device 100 may further include a housing 310, which is connected to the mounting frame 110 and has a receiving space. The reflector 193, the lens 2913 and the optical displacement sensor 191 are all disposed in the receiving space, thereby reducing the influence of ambient light on the measurement effect.

[0127] The specific structure and working principle of the semi-transparent and semi-reflective prisms and the light-transmitting reflector can refer to the prior art. The above is only used as an example to facilitate understanding.

[0128] Please attach Figure 5 , an embodiment of the present application also provides a testing method, which can be applied by the testing party to the testing device, and the testing method includes steps S010, S020, S030, S040, S050 and S060.

[0129] Step S010: controlling the driving component to drive the test baffle to move toward the outer surface of the object to be tested according to a first preset displacement through the force measurement component.

[0130] The control device can control the driving component to drive the force measurement component to move along the first direction, each time moving a first preset displacement to gradually approach the outer surface of the measured object (i.e., close to the vacuum hole). When the force measurement component moves, the test baffle moves synchronously.

[0131] It should be noted that, in the embodiments of the present application, the movement of the test baffle toward the outer surface of the object to be tested may refer to the movement of the test baffle toward the vacuum hole on the outer surface of the object to be tested.

[0132] The first preset displacement can be set in a variety of ways.

[0133] As an example, the first preset displacement can be a certain value, for example, the first preset displacement can be 1 mm, 2 mm, 4 mm or other values. Taking the first preset displacement as 1 mm as an example, the control device can control the driving component to drive the test baffle to move 1 mm toward the outer surface of the object to be tested each time, so as to gradually approach the outer surface of the object to be tested after multiple movements.

[0134] As another example, the driving component can be started in a single step to drive the test patch to move gradually, that is, the driving component stops after running for a first preset time each time. The first preset time can be 1s, 2s, 5s or other time. Taking the preset time of 1s as an example, the control device can control the driving component to stop after running for 1s each time to drive the test patch to gradually approach the outer surface of the object to be tested. It can be understood that at this time, the test patch still moves by the first preset displacement each time.

[0135] In some embodiments, the testing device may further include a vacuum device, which may draw external airflow through the vacuum hole.

[0136] Before step S010, the testing method may further include the following steps:

[0137] 1) Turn on the vacuum device, extract the external airflow through the vacuum hole, and measure the vacuum value (air pressure value) and flow rate;

[0138] 2) Control the camera assembly to capture image data of the vacuum hole, and obtain the aperture data of the vacuum hole according to the image data.

[0139] Thus, the vacuum value and flow rate of the vacuum pumping device can be obtained and corresponded with the aperture data of the tested vacuum hole. The control device can store the above data to facilitate corresponding analysis with subsequent data.

[0140] Step S020: when the test baffle moves a first preset displacement, corresponding first force data and first displacement data are obtained.

[0141] The first force data is obtained by measuring the force of the test baffle by the force measurement component, and the first displacement data is obtained by measuring the displacement of the test baffle by the displacement measurement component.

[0142] Every time the test baffle moves a first preset displacement, the drive component can stop driving to keep the test baffle at the current position, leaving measurement time for the force measurement component and the displacement measurement component to more accurately measure the first force data and the second displacement data, thereby improving the measurement accuracy.

[0143] As an example, every time the test baffle moves a preset displacement, the test baffle is controlled to remain at the current position for a second preset time period. For example, the second preset time period may be 1s, 2s, 5s or other time periods, which may be set according to requirements.

[0144] Step S030: When the test baffle moves a first preset displacement, if the first displacement data remains unchanged and the first force data reaches a preset force threshold, the driving assembly is controlled to drive the test baffle to move according to a second preset displacement to move away from the outer surface.

[0145] This helps to prevent the test baffle from continuously applying pressure to the outer surface of the object to be tested, causing damage to the test baffle, the object to be tested, or other structural parts, thereby improving test safety and extending the service life of the test device.

[0146] Specifically, when the test baffle is completely attached to and against the outer surface of the object to be tested and covers the vacuum hole, the test baffle is still driven to move toward the object to be tested, and the test baffle blocks the movement of the test baffle, and the first displacement data will remain unchanged. When the test baffle is just in contact with the outer surface of the object to be tested and completely covers the vacuum hole, the suction force from the vacuum hole borne by the test baffle is the largest, and the resistance force of the object to be tested on the test baffle is small. At this time, the first force data reaches the maximum value, and the preset force threshold can be set to the maximum value of the first force data, which can be obtained through experiments.

[0147] It should be noted that the preset force threshold value can also be set to be slightly smaller than the maximum value of the above-mentioned first force data to improve the accuracy of the test and help reduce test errors.

[0148] Specifically, when the first displacement data remains unchanged, the driving component can still drive the test baffle to move a first preset displacement in the direction of the object to be tested. At this time, the resistance force applied by the object to be tested to the test baffle increases, and the first force data will decrease from the maximum value. The preset force threshold can be designed to be this value, thereby providing more complete data to ensure that the force measurement data can measure the force on the test baffle.

[0149] The preset stress threshold can be obtained based on experimental pre-testing.

[0150] Step S040: when the test baffle moves a second preset displacement, corresponding second force data and second displacement data are obtained.

[0151] The second force data is obtained by measuring the force of the test baffle by the force measurement component, and the second displacement data is obtained by measuring the displacement of the test baffle by the displacement measurement component.

[0152] The measurement process of the second force data and the second displacement data is roughly the opposite process of the measurement of the first force data and the second displacement data in the above step S020. The setting method of the second preset displacement can refer to the setting method of the first preset displacement in the above step S020, which will not be repeated here.

[0153] The first preset displacement amount and the second preset displacement amount may be equal or unequal, and may be specifically designed according to requirements.

[0154] It should be noted that, when measuring the first displacement data and the second displacement data, the displacement measurement component may use the reflector or the optical displacement sensor as the origin for measurement to obtain the first displacement data and the second displacement data of the test baffle.

[0155] As an example, when measuring with the reflector or the optical displacement sensor as the origin, the displacement optical sensor can measure the longitudinal coordinate value of the test patch along the first direction relative to the origin each time, thereby obtaining the first displacement data and the second displacement data of the test patch.

[0156] Step S050: obtaining first spacing data corresponding to the test baffle and the outer surface according to each first displacement data, and obtaining second spacing data corresponding to the test baffle and the outer surface according to each second displacement data.

[0157] In this way, the magnitude of the force corresponding to each position of the test baffle can correspond one to one, so as to facilitate subsequent analysis.

[0158] Specifically, taking the reflector or the optical displacement sensor as the coordinate origin, when the test baffle moves two first preset displacements, and the first force data measured by the force measurement component remains unchanged, it can be understood that at this time, the test baffle is against the outer surface and completely covers the vacuum hole, so that the maximum distance of the object to be tested relative to the origin along the first direction can be roughly obtained. The difference between the maximum distance and the displacement data (the first displacement data and the second displacement data) can be the distance between the test baffle and the outer surface of the object to be tested, so that the distance data (the first distance data and the second distance data) can be obtained.

[0159] Step S060: Draw a corresponding relationship diagram according to the first displacement data, the first force data, the second displacement data, and the second force data.

[0160] Specifically, the relationship diagram may be a curve relationship diagram. Figure 6 As shown, a first relationship curve W can be obtained according to the first displacement data and the first force data, and a first relationship curve P can be obtained according to the second displacement data and the second force data.

[0161] Thus, according to the first relationship curve W and the first relationship curve P, the distance between the test baffle and the vacuum hole under vacuum holes of different sizes can be intuitively obtained ( Figure 6 The suction force of the vacuum hole corresponding to the horizontal axis (i.e., the spacing data in the above embodiment) Figure 6 The vertical axis in the figure, i.e., the force data in the above embodiment), provides relevant information and basis for designing vacuum holes on semiconductor production or testing equipment, so that R&D personnel can better set the size, quantity, etc. of the vacuum holes in the subsequent semiconductor production or testing equipment.

[0162] like Figure 6 and Figure 7 As shown, taking the first relationship curve W as an example, segment A ( Figure 6 The left segment of the middle point a corresponds to Figure 7The block diagram in part A in FIG. 1 shows that the test baffle approaches the vacuum hole (i.e., the outer surface), and the suction force Fp from the vacuum hole gradually increases from 0. The closer the test baffle is to the vacuum hole, the greater the increase in Fp. Due to the effect of Fp, the test baffle is deformed, and the second connecting part and the force sensor are also deformed, so that the value of Fp can be measured. It can be understood that at this time, the first force data F1 measured by the force sensor is equal to Fp.

[0163] Section B Figure 6 Between the middle point a and the point b, corresponding to Figure 7 The block diagram (part B) in FIG. 1 shows that the end of the test baffle away from the second connecting portion abuts against the outer surface of the object to be tested, and the outer surface generates a resistance force Ft on the test baffle.

[0164] Since the test baffle is a cantilever beam structure, when the test baffle gradually moves toward the surface of the vacuum hole, the front end of the test baffle will first contact the outer surface of the object to be tested under the action of suction. At this time, the test baffle is subjected to the resistance force Ft generated by the outer surface on the test baffle. At this time, the first force data F1 measured by the force sensor is Fp+Ft. It should be noted that since the thrust Ft is a reaction force in the opposite direction of the suction Fp, the thrust Ft is a negative value relative to the suction Fp, and thus the suction value F1 measured by the force sensor is reduced. At the same time, the front end of the test baffle will also generate a torque L*Ft. Under the action of the torque, the front end of the test baffle will produce a slight deformation in the reverse direction. As the front end of the test baffle gradually fits the surface of the vacuum hole, the direction of the resistance force Ft gradually shifts to the direction of the second connecting part until it remains in the same direction as the direction of the suction Fp.

[0165] Segment C Figure 6 Between the middle point b and the point d, corresponding to Figure 7 The block diagram C in the figure shows that the test baffle is partially attached to and against the outer surface of the object to be tested, and the test baffle is about to close the vacuum hole. During this period, the force sensor measures that F1 gradually increases, and the torque L*Ft disappears. At this time, the first force data F1 measured by the force sensor is Fp+Ft, and F1 gradually approaches the maximum value.

[0166] D segment Figure 6 Between the middle point c and the point d, corresponding to Figure 7 The block diagram D in FIG. 1 shows that the test baffle is completely attached to and against the outer surface of the object to be tested, and the test baffle completely closes the vacuum hole. At this time, the first force data F1 measured by the force sensor is equal to Fp+Ft.

[0167] At this time, the first displacement data of the test baffle stops changing, and with the driving of the driving component, the test baffle still moves toward the outer surface, and the resistance force Ft continues to increase. At this time, F1 measured by the force sensor decreases. After decreasing to the preset force threshold, the test baffle stops approaching the vacuum hole along the first direction, and the control device controls the driving component to drive the test baffle away from the outer surface of the object to be tested along the first direction. That is, when the first displacement data remains unchanged and the first force data measured by the force sensor reaches the preset force threshold, the control device controls the driving component to drive the test baffle away from the outer surface of the object to be tested.

[0168] It should be noted that when the test baffle is detached and the vacuum hole is fully adsorbed, the force data F1 measured by the force sensor will change suddenly. This is because at the moment when the test baffle is detached from the vacuum hole, a negative pressure closed cavity will be formed between the test baffle and the vacuum hole, thereby maintaining a certain negative pressure state in an environment without a constant negative pressure vacuum, so that the vacuum hole still maintains suction. When the suction of the vacuum hole is cancelled, the original vacuum state needs to be broken to balance the pressure on both sides, so that the value of F1 will be greatly reduced.

[0169] It can be understood that when the test baffle is away from the outer surface of the object to be tested, the change of the curve can also refer to the above-mentioned section A, section B, section C and section D, which will not be repeated.

[0170] After obtaining the relationship curve between the force data and the spacing data, the required information can be obtained from the relationship curve, such as the maximum suction value of the vacuum hole under the corresponding aperture (approximately Figure 6 The maximum suction force value can reflect the maximum adsorption force of the vacuum hole of this size on the object to be tested. Researchers can design the vacuum holes on semiconductor production or testing equipment according to the maximum adsorption force.

[0171] In addition, the relationship curve also reflects the relationship between the suction force of the vacuum hole (force data) and the height between the test baffle and the vacuum hole (i.e., spacing data). For some products, it is necessary to control the distance between them and the vacuum hole so that the vacuum hole and the product are spaced apart to avoid damage to the product when the vacuum hole and the product come into contact. At this time, R&D personnel can obtain the corresponding suction force at different distances between the semiconductor wafer and the vacuum hole based on the relationship curve to select a better distance between the vacuum hole and the semiconductor wafer.

[0172] In addition, R&D personnel can also conduct the above test on multiple vacuum holes to obtain the relationship curve of vacuum holes with different apertures to design the size of the vacuum holes. For example, the aperture and maximum suction force (maximum first force data) of the vacuum hole can be used to establish an aperture maximum suction force comparison table as shown in the following table, so that the appropriate aperture can be selected according to the maximum suction force required by the product, and the maximum suction force that can be achieved by the corresponding vacuum hole can be queried according to the aperture.

[0173] Serial number Aperture Maximum adsorption force 1 D(1) Fmax(1) 2 D(2) Fmax(2) 3 D(3) Fmax(3) ...... ...... ...... i D(i) Fmax(i)

[0174] It should be noted that if the vacuum hole of the required aperture is not shown in the above table, an estimate can be made based on the adjacent data to obtain a closer maximum suction data. For example, if the aperture D(x) of the vacuum hole is between D(j) and D(j+1), the maximum adsorption force corresponding to the aperture D(x) can be estimated according to the following formula:

[0175]

[0176] In the test device 100, the test equipment and the test method provided in the embodiment of the present application, the driving component 130 drives the test baffle 170 to approach or move away from the outer surface 510 of the object to be tested 500, and the airflow in the vacuum hole 530 generates suction on the test baffle 170. The force measurement component 150 can measure the force data, and the displacement measurement can measure the displacement data of the test baffle 170. The control device can obtain the spacing data between the test baffle 170 and the outer surface 510 according to the displacement data, so as to obtain one-to-one corresponding spacing data and force data, and obtain the suction size of the vacuum hole 530 corresponding to different distances between the test baffle 170 and the vacuum hole 530. In this way, the R&D personnel can use this as a reference to design the vacuum hole 530 on the semiconductor production or testing equipment, such as designing the aperture and number of the vacuum holes 530 on the semiconductor production or testing equipment, the distance between the semiconductor wafer and the vacuum hole 530 (that is, the distance between the semiconductor wafer and the outer surface 510), and the like.

[0177] The embodiments of the present invention are described in detail above in conjunction with the accompanying drawings, but the present invention is not limited to the above embodiments. Various changes can be made within the knowledge of ordinary technicians in the relevant technical field without departing from the purpose of the present invention. In addition, the embodiments of the present invention and the features in the embodiments can be combined with each other without conflict.

Claims

1. A testing device, characterized in that: Applied to a test device, the test device includes a control device communicatively connected to the test device, and the test device includes: Mounting frame; A drive assembly connected to the mounting frame; A force measurement component and a test baffle, wherein the force measurement component is connected to the driving end of the driving component, and the test baffle is connected to the force measurement component, and the driving component is suitable for driving the test baffle to approach or move away from the outer surface of the object to be tested through the force measurement component; the object to be tested is provided with a vacuum hole located on the outer surface, and the vacuum hole is opposite to the test baffle and is used to generate suction to the test baffle; and a displacement measuring assembly connected to the mounting frame; Among them, the force measurement component is used to measure the force data of the test baffle, and the displacement measurement component is used to measure the displacement data of the test baffle; the control device is configured to obtain the spacing data between the test baffle and the outer surface according to the displacement data, and the spacing data corresponds to the force data one by one.

2. The testing device according to claim 1, characterized in that: The force measurement assembly further comprises a bracket and a force sensor, wherein the bracket is connected to the driving end of the driving assembly, and the force sensor is connected between the bracket and the test baffle; The driving assembly is suitable for driving the bracket to move back and forth, and the force sensor is used to measure the force applied to the test baffle.

3. The testing device according to claim 1, characterized in that: The displacement measurement assembly includes an optical displacement sensor and a reflector, and both the optical displacement sensor and the reflector are connected to the mounting frame; The reflector is located in the propagation path of the measuring light emitted by the optical displacement sensor, and is used to reflect the measuring light to the test baffle. The measuring light reflected by the test baffle is reflected by the reflector to the optical displacement sensor. The optical displacement sensor is used to measure the displacement data of the test patch according to the reflected measurement light.

4. The testing device according to claim 3, characterized in that: The force measurement assembly further includes a reflector, which is connected to the test baffle and is located in the propagation path of the measurement light, and is used to reflect the measurement light to the reflection member.

5. The testing device according to claim 3, characterized in that: The testing device also includes a position adjustment component, which is connected to the mounting frame, and the optical displacement sensor is connected to the position adjustment component, and the position adjustment component is used to adjust the distance between the optical displacement sensor and the reflector.

6. The testing device according to claim 3, characterized in that: The testing device also includes an aperture measurement component, which is connected to the mounting frame and is used to measure the aperture data of the vacuum hole.

7. The testing device according to claim 6, characterized in that: The aperture measurement assembly includes a camera assembly, the camera assembly is connected to the mounting frame, and the camera assembly, the reflector and the test baffle are distributed in sequence; The test shield has a transparent portion, and the transparent portion and the camera assembly are arranged opposite to each other; The reflective member is a transparent structure; The camera assembly is suitable for photographing the vacuum hole through the reflective element and the transparent portion to measure the aperture of the vacuum hole.

8. The testing device according to claim 6, characterized in that: The distribution direction of the camera assembly, the reflector and the test baffle is arranged at an angle to the distribution direction of the reflector and the optical displacement sensor.

9. A testing device, characterized in that: include: Control devices; as well as According to the testing device according to any one of claims 1 to 8, the control device is communicatively connected to the testing device, and the control device is configured to obtain spacing data between the test baffle and the outer surface according to the displacement data, and to draw a relationship diagram according to the spacing data and the force data.

10. A testing method, characterized in that: Applied to the test device according to claim 9, the test method comprises: The control driving component drives the test baffle to move toward the outer surface of the object to be tested according to a first preset displacement through the force measuring component, and the object to be tested is provided with a vacuum hole located on the outer surface, and the vacuum hole is opposite to the test baffle and is used to generate suction force on the test baffle; When the test baffle moves by the first preset displacement, corresponding first force data and first displacement data are acquired; When the test blocking piece moves by the first preset displacement, if the first displacement data remains unchanged and the first force data reaches a preset force threshold, controlling the driving component to drive the test blocking piece to move according to a second preset displacement to move away from the outer surface; When the test baffle moves by the second preset displacement amount each time, obtaining corresponding second force data and second displacement data; Obtaining first spacing data corresponding to the test patch and the outer surface according to each of the first displacement data, and obtaining second spacing data corresponding to the test patch and the outer surface according to each of the second displacement data; Draw a corresponding relationship diagram according to the first displacement data, the first force data, the second displacement data, and the second force data; The first force data and the second force data are both obtained by measuring the force magnitude of the test baffle by the force measurement component, and the first displacement data and the second displacement data are both obtained by measuring the displacement of the test baffle by the displacement measurement component.

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