Chip sorting machine

Abstract

The invention relates to the technical field of chip manufacturing, and particularly discloses a chip sorting machine which comprises a workbench, a plurality of sorting modules, a material frame and a grabbing module, and the sorting modules are sequentially arranged on the workbench in the first horizontal direction; the sorting module comprises a first supporting mechanism, a chip sorting mechanism and a second supporting mechanism which are arranged in sequence, the first supporting mechanism supports the incoming material disc and enables the chips on the first carrier film to be arranged opposite to the chip sorting mechanism, and the second supporting mechanism supports the empty material disc and enables the second carrier film to be arranged opposite to the chip sorting mechanism; the chip sorting mechanism is used for transferring the chips with the same specification on the first carrier film to the second carrier film; the material frame is arranged on the workbench; the grabbing module comprises a driving mechanism and a clamping jaw, and the driving mechanism drives the clamping jaw to achieve feeding and discharging of the sorting module. The multiple sorting modules cooperate with the grabbing module, and multi-station work of the chip sorting machine is achieved. The occupied area is smaller, and the manufacturing cost and the production cost of an enterprise are reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of chip manufacturing, and in particular to a chip sorting machine. Background Art

[0002] In the chip manufacturing industry, the performance and quality of LED chips directly determine the performance and market competitiveness of the final product. However, since LED chips inevitably have performance differences during the front-end manufacturing process, such as fluctuations in brightness, color consistency, and electrical performance, the chips need to be accurately sorted to ensure that only qualified chips can enter the subsequent packaging process.

[0003] However, the existing LED chip sorting machines still have some deficiencies in performance and function. For example, most of the current chip sorting machines are single-station chip sorting machines. In order to achieve efficient chip sorting, enterprises need to purchase multiple single-station chip sorting machines to work simultaneously. Multiple single-station chip sorting machines not only occupy a large area, but also increase the production cost of enterprises. At the same time, as the market demand for LED products is increasingly diversified and customized, the existing sorting machines also have certain limitations in flexibility and adaptability.

[0004] Therefore, there is an urgent need for a chip sorting machine to solve the above problems. Summary of the invention

[0005] The purpose of the present invention is to provide a chip sorting machine to solve the problem that most of the existing chip sorting machines in the related technology are single-station chip sorting machines. In order to meet the production needs of enterprises, enterprises need to purchase multiple single-station chip sorting machines to work simultaneously. Multiple single-station chip sorting machines not only occupy a large area, but also increase the production cost of the enterprise.

[0006] The present invention provides a chip sorting machine, which is used to transfer chips of the same specification arranged on a first carrier film of an incoming material tray to a second carrier film of an empty material tray, and the chip sorting machine comprises:

[0007] Workbench;

[0008] A sorting module, wherein the sorting modules are provided in plurality, and the plurality of the sorting modules are sequentially arranged on the workbench along a first horizontal direction; the sorting module comprises a first supporting mechanism, a chip sorting mechanism, and a second supporting mechanism which are sequentially arranged, wherein the first supporting mechanism is used to support the incoming material tray, and the chips on the first carrier film are arranged opposite to the chip sorting mechanism, the second supporting mechanism is used to support the empty material tray, and the second carrier film is arranged opposite to the chip sorting mechanism, and the chip sorting mechanism is used to transfer chips of the same specification on the first carrier film to the second carrier film;

[0009] A material frame, arranged on the workbench, including an unsorted material frame and a plurality of sorted material frames, wherein the unsorted material frame is used to place the incoming material tray, and the sorted material frame is used to place the empty material tray;

[0010] A grabbing module, wherein the grabbing module is arranged above the workbench at intervals in the vertical direction, and the grabbing module comprises a driving mechanism and a clamping jaw, wherein the driving mechanism drives the clamping jaw to move along the first horizontal direction or the second horizontal direction or the vertical direction, and the clamping jaw can clamp the incoming material tray or the empty material tray.

[0011] As a preferred technical solution of the chip sorting machine, the chip sorting mechanism includes a first driving component, a suction nozzle and a camera component. The first driving component is arranged on the workbench and drives the suction nozzle to rotate around the vertical rotation axis, so that the suction nozzle can selectively face the first carrier film or the second carrier film. The suction nozzle can suck the chip on the first carrier film or set the sucked chip on the second carrier film. The camera component can identify the specifications and positions of the chips on the first carrier film and the second carrier film.

[0012] The first supporting mechanism is movable along the second horizontal direction or the vertical direction, and the second supporting mechanism is movable along the second horizontal direction or the vertical direction.

[0013] As a preferred technical solution of the chip sorting machine, the sorting module further includes an ejector mechanism, the ejector mechanism includes a second driving assembly, an ejector cap, an ejector and an ejector driving assembly, along the first horizontal direction, the second driving assembly is arranged on the side of the first supporting mechanism away from the chip sorting mechanism, the second driving assembly drives the ejector cap to move along the first horizontal direction so that the ejector cap can abut against or separate from the first carrier film, the ejector cap abuts against the first carrier film, the ejector cap can be adsorbed on the first carrier film, and the suction nozzle opposite to the first carrier film is coaxially arranged with the ejector cap along the first horizontal direction;

[0014] The ejector pin is inserted into the ejector cap along the first horizontal direction, and the ejector pin driving assembly drives the ejector pin to have two states of extending the ejector cap or retracting the ejector cap along the first horizontal direction.

[0015] As a preferred technical solution of the chip sorting machine, two suction nozzles are provided, and the two suction nozzles are symmetrically arranged along the rotation axis of the suction nozzle;

[0016] The ejector mechanism further comprises a third driving assembly, and the third driving assembly drives the ejector cap to slide along the vertical direction.

[0017] As a preferred technical solution for the chip sorting machine, the first supporting mechanism includes a fourth driving component, a fifth driving component and a first supporting plate, the fourth driving component is fixed to the workbench and drives the fifth driving component to move along the second horizontal direction, the fifth driving component drives the first supporting plate to move along the vertical direction, the first supporting plate is provided with a first through hole along the first horizontal direction and a first slot along the vertical direction, the first through hole is opposite to the ejector pin cap, and the incoming material tray is inserted in the first slot so that the first carrier film is opposite to the first through hole.

[0018] As a preferred technical solution for the chip sorting machine, the second supporting mechanism includes a sixth driving component, a seventh driving component and a supporting component. The sixth driving component is fixed to the workbench and drives the seventh driving component to move along the second horizontal direction. The seventh driving component drives the supporting component to move along the vertical direction. The supporting component is used to support the second carrier film.

[0019] As a preferred technical solution for the chip sorting machine, the support assembly includes a second support plate, a second plug-in portion and an eighth drive assembly. The seventh drive assembly drives the second support plate to move along the vertical direction. The eighth drive assembly is arranged on the second support plate and drives the second plug-in portion to rotate around the rotating axis in the first horizontal direction. The empty material tray is inserted in the second plug-in portion.

[0020] As a preferred technical solution of the chip sorter, the support assembly further includes a bearing, a support plate, a suction cup and a ninth driving assembly, wherein the outer ring of the bearing is fixedly arranged on the second support plate, the support plate is fixedly connected to the inner ring of the bearing, the ninth driving assembly is arranged on the support plate and drives the suction cup to move along the first horizontal direction, so that the suction cup has two states of supporting the second carrier film and being away from the second carrier film, and the suction cup can be adsorbed on the second carrier film;

[0021] The eighth driving assembly includes a driving group and a driven wheel. The driven wheel is fixedly connected to the inner ring of the bearing coaxially. The driving group drives the driven wheel to rotate. The second plug-in portion is fixedly arranged on the driven wheel.

[0022] As a preferred technical solution for the chip sorting machine, the second plug-in part includes two connectors, the two connectors are arranged at intervals on the driven wheel, the connector has two states of relative fixed and relative sliding relative to the driven wheel along the first horizontal direction, and second slots are respectively recessed on the opposite surfaces of the two connectors, and the two ends of the empty material tray along the spacing direction of the two connectors are respectively inserted into the two second slots.

[0023] As a preferred technical solution of the chip sorter, the driving mechanism includes a bracket, a first driving member, a second driving member and a third driving member, the bracket is arranged on the workbench, the first driving member is fixed to the bracket and is spaced from the workbench along the vertical direction, the first driving member drives the second driving member to move along the first horizontal direction, the third driving member includes a sliding plate and two sliding members, the second driving member drives the sliding plate to move along the second horizontal direction, the two sliding members are arranged on both sides of the sliding plate along the first horizontal direction, and the sliding member is slidably arranged on the sliding plate along the vertical direction;

[0024] The clamping jaws are provided with two, and the two clamping jaws are respectively arranged on two sliding members.

[0025] The beneficial effects of the present invention are:

[0026] The present invention provides a chip sorting machine, which is used to transfer chips of the same specification arranged on a first carrier film of an incoming material tray to a second carrier film of an empty material tray. The chip sorting machine comprises a workbench, a sorting module, a material frame and a grabbing module. A plurality of sorting modules are provided, and the plurality of sorting modules are sequentially arranged on the workbench along a first horizontal direction; the sorting module comprises a first supporting mechanism, a chip sorting mechanism and a second supporting mechanism which are sequentially arranged, the first supporting mechanism is used to support the incoming material tray, and the chips on the first carrier film are arranged opposite to the chip sorting mechanism, and the second supporting mechanism is used to support An empty material tray is arranged, and the second carrier film is arranged opposite to the chip sorting mechanism, the chip sorting mechanism is used to transfer chips of the same specification on the first carrier film to the second carrier film; a material frame is arranged on the workbench, the material frame includes an unsorted material frame and a plurality of sorted material frames, the unsorted material frame is used to place the incoming material tray, and the sorted material frame is used to place the empty material tray; the grasping module is arranged above the workbench at intervals in the vertical direction, the grasping module includes a driving mechanism and a clamp, the driving mechanism drives the clamp to move along the first horizontal direction or the second horizontal direction or the vertical direction, and the clamp can clamp the incoming material tray or the empty material tray. When the chip sorting machine is working, the driving mechanism drives the clamp to move, and then the multiple incoming material trays in the unsorted material frame are respectively set on the first supporting mechanisms of the multiple sorting modules, and the multiple empty material trays in the sorting material frame are respectively set on the second supporting mechanisms of the multiple sorting modules. At this time, multiple chip sorting mechanisms work, and then the chips of the same specification on the corresponding incoming material tray are transferred to the corresponding empty material tray. When the chips of the same specification on the incoming material tray in a sorting module are all transferred to the corresponding empty material tray, the grabbing module grabs the empty material tray and moves the empty material tray to the sorting material frame. Subsequently, the empty material tray without chips in the sorting material frame is set on the second supporting mechanism, and the above operation is repeated to sort the chips of different specifications on the incoming material tray to different empty material trays, until there are no chips on the incoming material tray, the grabbing module grabs the incoming material tray in the unsorted material frame to the first supporting mechanism, and the above operation is repeated. Multiple sorting modules cooperate with the grabbing module to realize the multi-station operation of the chip sorting machine. Compared with single-station chip sorters, this chip sorter has higher integration and occupies smaller area. It uses one grabbing module to complete the loading and unloading of multiple sorting modules, thereby reducing manufacturing costs and corporate production costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 The structure of the chip sorting machine in the embodiment of the present invention is shown in FIG. Figure 1 ;

[0028] Figure 2 The structure of the chip sorting machine in the embodiment of the present invention is shown in FIG. Figure 2 ;

[0029] Figure 3 This is a schematic diagram of the structure of a sorting module in an embodiment of the present invention;

[0030] Figure 4 for Figure 3 A partial enlarged view of the middle A;

[0031] Figure 5 for Figure 3 A partial enlarged view of point B in the middle;

[0032] Figure 6 is a schematic structural diagram of a first supporting mechanism in an embodiment of the present invention;

[0033] Figure 7 Schematic diagram of the assembly of the first driving assembly and the suction nozzle in an embodiment of the present invention;

[0034] Figure 8 A schematic diagram of the structure of a camera assembly in an embodiment of the present invention;

[0035] Fig. 9 is a schematic structural diagram of a second supporting mechanism in an embodiment of the present invention;

[0036] Fig.10 It is a structural schematic diagram of the ejector mechanism in an embodiment of the present invention;

[0037] Fig.11 It is a structural schematic diagram of a material frame in an embodiment of the present invention;

[0038] Fig.12 A schematic diagram of the structure of a grabbing module in an embodiment of the present invention;

[0039] Fig.13 for Fig.12 A partial enlarged view of point B in the middle.

[0040] In the figure:

[0041] X, first horizontal direction; Y, second horizontal direction; Z, vertical direction;

[0042] 100, incoming material tray; 101, first plate; 102, first carrier film; 103, chip; 200, empty material tray;

[0043] 1. Workbench;

[0044] 2. Sorting module; 21. First supporting mechanism; 211. Fourth driving assembly; 212. Fifth driving assembly; 213. First supporting plate; 2131. First plate body; 2132. First plug-in portion; 214. First slide plate;

[0045] 22. Chip sorting mechanism; 221. First driving assembly; 222. Suction nozzle; 223. Camera assembly; 2231. Bin camera; 2232. Prism; 224. Rotating bracket;

[0046] 23. Second supporting mechanism; 231. Sixth driving assembly; 232. Seventh driving assembly; 2331. Second supporting plate; 2332. Connector; 2333. Bearing; 2334. Support plate; 2335. Suction cup; 2336. Ninth driving assembly; 2337. Driven wheel; 2338. Limiting pin; 2339. Limiting groove; 2340. Waist-shaped hole; 235. Second sliding plate;

[0047] 24. Ejector mechanism; 241. Second drive assembly; 242. Ejector cap; 243. Ejector drive assembly; 244. Third drive assembly;

[0048] 3. Material frame; 31. Unsorted material frame; 32. Sorted material frame;

[0049] 4. Grabbing module; 41. Driving mechanism; 411. Bracket; 412. First driving member; 413. Second driving member; 414. Third driving member; 4141. Sliding plate; 4142. Sliding member; 42. Clamping claw.

[0050] 5. Partition panel; 6. Safety door. DETAILED DESCRIPTION

[0051] The technical solution of the present invention will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0052] In the description of the present invention, it should be noted that the orientations or positional relationships indicated by the terms "center", "up", "down", "left", "right", "vertical", "horizontal", "inside", "outside", etc. are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance. Among them, the terms "first position" and "second position" are two different positions, and the first feature "above", "above" and "above" the second feature include the first feature being directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. The first feature "below", "below" and "below" the second feature include the first feature being directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0053] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0054] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0055] like Figures 1 to 13As shown, the present embodiment provides a chip sorting machine, which is used to transfer chips 103 of the same specification arranged on a first carrier film 102 of an incoming material tray 100 to a second carrier film of an empty material tray 200. The chip sorting machine includes a workbench 1, a sorting module 2, a material frame 3 and a grabbing module 4. A plurality of sorting modules 2 are provided, and the plurality of sorting modules 2 are sequentially arranged on the workbench 1 along a first horizontal direction X; the sorting module 2 includes a first supporting mechanism 21, a chip sorting mechanism 22 and a second supporting mechanism 23 which are sequentially arranged. The first supporting mechanism 21 is used to support the incoming material tray 100, and to arrange the chips 103 on the first carrier film 102 opposite to the chip sorting mechanism 22. The second supporting mechanism 23 is used to support the empty material tray 2 00, and the second carrier film is arranged opposite to the chip sorting mechanism 22, the chip sorting mechanism 22 is used to transfer the chips 103 of the same specification on the first carrier film 102 to the second carrier film; the material frame 3 is arranged on the workbench 1, and the material frame 3 includes an unsorted material frame 31 and a plurality of sorted material frames 32, the unsorted material frame 31 is used to place the incoming material tray 100, and the sorting material frame 32 is used to place the empty material tray 200; the grasping module 4 is arranged above the workbench 1 at intervals along the vertical direction Z, the grasping module 4 includes a driving mechanism 41 and a clamp 42, the driving mechanism 41 drives the clamp 42 to move along the first horizontal direction X or the second horizontal direction Y or the vertical direction Z, and the clamp 42 can clamp the incoming material tray 100 or the empty material tray 200. When the chip sorting machine is working, the driving mechanism 41 drives the clamping claw 42 to move, and then the multiple incoming material trays 100 in the unsorted material frame 31 are respectively set on the first supporting mechanisms 21 of the multiple sorting modules 2, and the multiple empty material trays 200 in the sorting material frame 32 are respectively set on the second supporting mechanisms 23 of the multiple sorting modules 2, and the multiple chip sorting mechanisms 22 work, and then the chips 103 of the same specification on the corresponding incoming material trays 100 are transferred to the corresponding empty material trays 200. When the chips 103 of the same specification on the incoming material trays 100 in one sorting module 2 are all transferred, the chips 103 of the same specification on the incoming material trays 100 are transferred to the corresponding empty material trays 200. When it moves to the corresponding empty tray 200, the grabbing module 4 grabs the empty tray 200 and moves the empty tray 200 to the sorting frame 32. Subsequently, the empty tray 200 without the chip 103 in the sorting frame 32 is set on the second support mechanism 23, and the above operation is repeated to sort the chips 103 of different specifications on the incoming tray 100 to different empty trays 200. After there are no chips 103 on the incoming tray 100, the grabbing module 4 grabs the incoming tray 100 in the unsorted frame 31 to the first support mechanism 21, and repeats the above operation. Multiple sorting modules 2 cooperate with the grabbing module 4 to realize the multi-station operation of the chip sorting machine. Compared with the single-station chip sorting machine, the chip sorting machine has a higher degree of integration and a smaller footprint. One grabbing module 4 is used to complete the loading and unloading of multiple sorting modules 2, thereby reducing the manufacturing cost and the production cost of the enterprise.

[0056] Specifically, the first horizontal direction X and the second horizontal direction Y are perpendicular to each other.

[0057] Optionally, the chip sorting mechanism 22 includes a first driving component 221, a suction nozzle 222 and a camera component 223. The first driving component 221 is arranged on the workbench 1 and drives the suction nozzle 222 to rotate around the rotation axis in the vertical direction Z, so that the suction nozzle 222 can selectively face the first carrier film 102 or the second carrier film, and the suction nozzle 222 can suck the chip 103 on the first carrier film 102, or set the sucked chip 103 on the second carrier film. The camera component 223 can identify the specifications and positions of the chips 103 on the first carrier film 102 and the second carrier film; the first supporting mechanism 21 can move along the second horizontal direction Y or the vertical direction Z, and the second supporting mechanism 23 can move along the second horizontal direction Y or the vertical direction Z. In this embodiment, after the camera component 223 identifies the position of the chip 103 of the same specification on the first carrier 102, the first support mechanism 21 moves along the second horizontal direction Y or the vertical direction Z, so that the chip 103 of the same specification on the first carrier 102 is opposite to the suction nozzle 222. At this time, the suction nozzle 222 can suck the chip 103. Then the first driving component 221 drives the suction nozzle 222 to rotate 180°, so that the suction nozzle 222 is opposite to the second carrier. At this time, the second support mechanism 23 moves along the second horizontal direction Y or the vertical direction Z, so that the suction nozzle 222 sets the adsorbed chip 103 at the preset position of the second carrier.

[0058] Specifically, the camera assembly 223 is a combination of a bin camera 2231 and a prism 2232. This is a prior art and will not be described in detail herein.

[0059] Optionally, the chip sorting machine also includes a negative pressure pump, which provides negative pressure to the suction nozzle 222, so that the chip 103 on the first carrier film 102 can be adsorbed through the suction nozzle 222. When the chip 103 is set on the second carrier film, the negative pressure pump stops providing negative pressure to the suction nozzle 222, and the suction nozzle 222 can be separated from the chip 103.

[0060] Optionally, two suction nozzles 222 are provided, and the two suction nozzles 222 are symmetrically arranged along the rotation axis of the suction nozzle 222. In this embodiment, the chip sorting mechanism 22 further includes a rotating bracket 224, and the rotating bracket 224 is fixed on the rotating shaft of the first driving component 221. The two suction nozzles 222 are respectively fixed on the rotating bracket 224. The two suction nozzles 222 are arranged at 180 degrees, so when the first driving component 221 drives the rotating bracket 224 to rotate 180 degrees, the two suction nozzles 222 are alternately opposite to the first carrier film 102 and the second carrier film. Compared with setting one suction nozzle 222, this arrangement doubles the working efficiency of the sorting module 2.

[0061] Regarding the specific structure of the incoming material tray 100 and the empty material tray 200, optionally, the incoming material tray 100 includes a first plate 101 and a first carrier film 102, a first circular hole is arranged on the first plate 101, the first carrier film 102 is attached to the first plate 101, and chips 103 of different specifications are located on the first carrier film 102 and in the first circular hole; the empty material tray 200 includes a second plate and a second carrier film, a second circular hole is arranged on the second plate, and the second carrier film is attached to the second plate.

[0062] Optionally, the sorting module 2 further comprises an ejector mechanism 24, the ejector mechanism 24 comprises a second driving assembly 241, an ejector cap 242, an ejector and an ejector driving assembly 243, along the first horizontal direction X, the second driving assembly 241 is arranged on a side of the first supporting mechanism 21 away from the chip sorting mechanism 22, the second driving assembly 241 drives the ejector cap 242 to move along the first horizontal direction X, so that the ejector cap 242 can abut against or separate from the first carrier film 102, the ejector cap 242 abuts against the first carrier film 102, the ejector cap 242 can be adsorbed on the first carrier film 102, the suction nozzle 222 opposite to the first carrier film 102 is coaxially arranged with the ejector cap 242 along the first horizontal direction X; the ejector is penetrated through the ejector cap 242 along the first horizontal direction X, and the ejector driving assembly 243 drives the ejector to have two states of extending the ejector cap 242 or retracting the ejector cap 242 along the first horizontal direction X. In the present embodiment, when the suction nozzle 222 is opposite to the chip 103 on the first carrier film 102, the ejector cap 242 absorbs the first carrier film 102 at the position opposite to the suction nozzle 222. Then, the ejector pin extends out of the ejector cap 242, thereby piercing the first carrier film 102 and lifting the chip 103 corresponding to the suction nozzle 222, so as to facilitate the suction of the chip 103 by the suction nozzle 222.

[0063] Optionally, a surface of the ejector cap 242 opposite to the first carrier film 102 is provided with a plurality of negative pressure holes, and the plurality of negative pressure holes are connected to a negative pressure cavity inside the ejector cap 242 . A negative pressure pump can provide negative pressure to the negative pressure cavity of the ejector cap 242 , so that the ejector cap 242 can adsorb the first carrier film 102 .

[0064] Optionally, the ejector cap 242 is provided with a slideway along the axis core of the first horizontal direction X, the ejector is inserted into the slideway, and the ejector drive assembly 243 drives the ejector to slide in the slideway, so that the ejector extends from the ejector cap 242 or retracts into the slideway. Specifically, the ejector drive assembly 243 is a cam structure, and in other embodiments, the ejector drive assembly 243 can also be one of a voice coil motor, a hydraulic cylinder, a linear motor, a lead screw nut, and a gear rack.

[0065] Optionally, the second driving component 241 drives the ejector cap 242 to move along the first horizontal direction X, thereby achieving the abutment and separation of the ejector cap 242 and the first carrier film 102. Specifically, the second driving component 241 is a cylinder. In other embodiments, the second driving component 241 can also be one of a voice coil motor, a hydraulic cylinder, a linear motor, a lead screw nut and a gear rack.

[0066] Optionally, the ejector mechanism 24 further includes a third driving assembly 244, and the third driving assembly 244 drives the ejector cap 242 to slide along the vertical direction Z. In this embodiment, when two suction nozzles 222 are provided, due to production errors and assembly errors of the suction nozzles 222 and the rotating bracket 224, there is a height difference between the two suction nozzles 222 along the vertical direction Z. In order to ensure that the suction nozzle 222 opposite to the first carrier film 102 is coaxially arranged with the ejector cap 242 along the first horizontal direction X, the third driving assembly 244 drives the ejector cap 242 to slide along the vertical direction Z to adapt to the suction nozzles 222 with height differences.

[0067] Optionally, the first support mechanism 21 includes a fourth drive assembly 211, a fifth drive assembly 212 and a first support plate 213, the fourth drive assembly 211 is fixed to the workbench 1 and drives the fifth drive assembly 212 to move along the second horizontal direction Y, the fifth drive assembly 212 drives the first support plate 213 to move along the vertical direction Z, the first support plate 213 is provided with a first perforation along the first horizontal direction X and a first slot along the vertical direction Z, the first perforation is opposite to the ejector cap 242, the incoming material tray 100 is inserted into the first slot so that the first carrier film 102 is opposite to the first perforation. In this embodiment, the first support plate 213 includes a first plate body 2131 and two first plug-in portions 2132 spaced apart along the second horizontal direction Y, the opposite side walls of the two first plug-in portions 2132 are respectively recessed with first slots, the first plate 101 is inserted into the two first slots along the vertical direction Z on both sides along the second horizontal direction Y, thereby realizing the relative fixation of the incoming material tray 100 and the first support plate 213.

[0068] Optionally, the first support mechanism 21 further includes a first slide plate 214, the fourth drive assembly 211 drives the first slide plate 214 to move along the second horizontal direction Y, the fifth drive assembly 212 is fixed on the first slide plate 214, and the fifth drive assembly 212 drives the first support plate 213 to move along the vertical direction Z. Specifically, the fourth drive assembly 211 and the fifth drive assembly 212 are both screw nut structures, and in other embodiments, they may also be one of a cylinder, a hydraulic cylinder, a linear motor, and a gear rack.

[0069] Optionally, the second support mechanism 23 includes a sixth drive assembly 231, a seventh drive assembly 232 and a support assembly, the sixth drive assembly 231 is fixed to the workbench 1 and drives the seventh drive assembly 232 to move along the second horizontal direction Y, the seventh drive assembly 232 drives the support assembly to move along the vertical direction Z, and the support assembly is used to support the second carrier film. In this embodiment, the second support mechanism 23 also includes a second slide plate 235, the sixth drive assembly 231 drives the second slide plate 235 to move along the second horizontal direction Y, the seventh drive assembly 232 is fixed on the second slide plate 235, and the seventh drive assembly 232 drives the support assembly to move along the vertical direction Z. Specifically, the sixth drive assembly 231 and the seventh drive assembly 232 are both screw nut structures, and in other embodiments, they can also be one of a cylinder, a hydraulic cylinder, a linear motor and a gear rack. The support assembly has a supporting effect on the second carrier film along the first horizontal direction X, thereby improving the stability of the nozzle 222 in setting the chip 103 on the second carrier film.

[0070] As for the specific structure of the support assembly, optionally, the support assembly includes a second support plate 2331, a second plug-in portion and an eighth drive assembly, the seventh drive assembly 232 drives the second support plate 2331 to move along the vertical direction Z, the eighth drive assembly is arranged on the second support plate 2331 and drives the second plug-in portion to rotate around the axis of the first horizontal direction X, and the empty material tray 200 is inserted in the second plug-in portion. In this embodiment, when the suction nozzle 222 adsorbs the chip 103, the angle of the chip 103 around the first horizontal direction X may change. In order to make the chip 103 neatly attached to the second carrier film, the eighth drive assembly can drive the second plug-in portion to rotate around the axis of the first horizontal direction X, and then can adjust the angle of the empty material tray 200 around the first horizontal direction X, so that the chip 103 can be neatly attached to the second carrier film.

[0071] Optionally, the support assembly also includes a bearing 2333, a support disc 2334, a suction cup 2335 and a ninth driving assembly 2336, the outer ring of the bearing 2333 is fixedly mounted on the second support plate 2331, the support disc 2334 is fixedly connected to the inner ring of the bearing 2333, the ninth driving assembly 2336 is disposed on the support disc 2334 and drives the suction cup 2335 to move along the first horizontal direction X, so that the suction cup 2335 has two states of supporting the second carrier film and being away from the second carrier film, and the suction cup 2335 can be adsorbed on the second carrier film; the eighth driving assembly includes a driving group and a driven wheel 2337, the driven wheel 2337 is coaxially fixedly connected to the inner ring of the bearing 2333, the driving group drives the driven wheel 2337 to rotate, and the second plug-in portion is fixedly mounted on the driven wheel 2337. In this embodiment, the second support plate 2331 is provided with a mounting hole, the bearing 2333 is arranged in the mounting hole, and the outer ring of the bearing 2333 is fixedly connected to the second support plate 2331, the support plate 2334 and the driven wheel 2337 are respectively arranged on both sides of the bearing 2333 along the first horizontal direction X, the support plate 2334 and the driven wheel 2337 are fixedly connected to clamp the inner ring of the bearing 2333, thereby realizing the rotation of the support plate 2334 and the driven wheel 2337 relative to the second support plate 2331.

[0072] The ninth driving assembly 2336 is disposed on the supporting plate 2334 and drives the suction cup 2335 to move along the first horizontal direction X, thereby realizing that the suction cup 2335 rotates synchronously with the empty material plate 200, and the suction cup 2335 also has the effect of supporting and adsorbing the second carrier film. Preferably, compared with using a negative pressure nozzle to adsorb the part of the second carrier film where the chip 103 is attached, the suction cup 2335 is used here to support the entire second carrier film, so as to avoid the second carrier film from moving relative to the suction cup 2335 during the arrangement of the chip 103, thereby avoiding the problem of poor arrangement accuracy; and avoiding the second carrier film from moving relative to the suction cup 2335 during the arrangement to generate static electricity release, thereby avoiding damage to the chip 103.

[0073] Optionally, the ninth drive assembly 2336 is a cam follower assembly.

[0074] Optionally, the second plug-in portion includes two plug-in components 2332, which are spaced apart on the side of the driven wheel 2337 away from the bearing 2333. The plug-in components 2332 have two states of relative fixation and relative sliding relative to the driven wheel 2337 along the first horizontal direction X. The two plug-in components 2332 have two concave second slots on the opposite surfaces thereof. The two ends of the empty material tray 200 along the spacing direction of the two plug-in components 2332 are respectively inserted into the two second slots, thereby realizing the relative fixation of the empty material tray 200 and the support plate 2334. In this embodiment, by adjusting the position of the two plug-in components 2332 relative to the driven wheel 2337 along the first horizontal direction X, the position of the second carrier film relative to the suction nozzle 222 and the suction cup 2335 along the first horizontal direction X can be adjusted, and when the chips 103 of the same specification are transferred to the second carrier film of the empty material tray 200, the deformation amount of the second carrier film can be effectively improved.

[0075] like Figure 5 As shown, optionally, a waist-shaped hole 2340 extending along the first horizontal direction X is provided on the connector 2332, and a threaded hole is provided on the driven wheel 2337. The bolt passes through the waist-shaped hole 2340 and is screwed into the threaded hole to realize that the connector 2332 has two states of relative fixedness and relative sliding along the first horizontal direction X relative to the driven wheel 2337.

[0076] Optionally, the driving group includes a motor, a driving wheel and a synchronous belt. The driving wheel is rotatably arranged on the second support plate 2331, and the synchronous belt is sleeved on the driving wheel and the driven roller. The motor drives the driving wheel to rotate, and then drives the driven wheel 2337 to rotate through the synchronous belt.

[0077] Optionally, the support assembly further includes a limit pin 2338, a limit slot 2339 is recessed on the peripheral wall of the support plate 2334, one end of the limit pin 2338 is fixedly arranged on the second support plate 2331, and the other end of the limit pin 2338 is inserted into the limit slot 2339. Along the circumference of the support plate, the maximum arc length of the limit pin 2338 in the limit slot 2339 is less than the arc length of the limit slot 2339. In this embodiment, the purpose of this setting is to limit the rotation angle of the support plate 2334. Specifically, the rotation angle of the support plate 2334 relative to the second support plate 2331 is ±15°. When the support plate 2334 rotates so that the second plate can be inserted into the second slot along the vertical direction Z, the support plate 2334 is at the 0° position.

[0078] Optionally, the driving mechanism 41 includes a bracket 411, a first driving member 412, a second driving member 413 and a third driving member 414, the bracket 411 is arranged on the workbench 1, the first driving member 412 is fixed to the bracket 411 and is spaced apart from the workbench 1 along the vertical direction Z, the first driving member 412 drives the second driving member 413 to move along the first horizontal direction X, the third driving member 414 includes a sliding plate 4141 and two sliding members 4142, the second driving member 413 drives the sliding plate 4141 to move along the second horizontal direction Y, the two sliding members 4142 are arranged on both sides of the sliding plate 4141 along the first horizontal direction X, and the sliding member 4142 is slidably arranged on the sliding plate 4141 along the vertical direction Z; two clamps 42 are provided, and the two clamps 42 are respectively provided on the two sliding members 4142. In this embodiment, the unsorted material frame 31 and the multiple sorting material frames 32 are arranged on one side of the multiple sorting modules 2 along the second horizontal direction Y, and the first driving member 412 and the second driving member 413 drive the clamp 42 to move in the first horizontal direction X or the second horizontal direction Y, so that the clamp 42 can slide over each sorting module 2, the unsorted material frame 31 and the multiple sorting material frames 32, thereby realizing the loading and unloading of the multiple sorting modules 2. There are two clamping jaws 42, which are arranged on both sides of the sliding plate 4141 along the first horizontal direction X. When the sliding plate 4141 is located between the first supporting mechanism 21 and the second supporting mechanism 23 of a sorting module 2, the two clamping jaws 42 are arranged opposite to the first supporting mechanism 21 and the second supporting mechanism 23, respectively, so that the clamping jaw 42 opposite to the first supporting mechanism 21 clamps the incoming material tray 100 in the unsorted material frame 31, and sends the incoming material tray 100 to the first supporting mechanism 21, or sends the incoming material tray 100 from the first supporting mechanism 21 back to the unsorted material frame 31; the clamping jaw 42 opposite to the second supporting mechanism 23 clamps the empty material tray 200 in the sorting material frame 32, and sends the empty material tray 200 to the second supporting mechanism 23, or sends the empty material tray 200 from the second supporting mechanism 23 back to the sorting material frame 32. Specifically, the clamping jaw 42 is a clamping jaw cylinder.

[0079] Optionally, it further comprises a plurality of partition plates 5 and a plurality of safety doors 6, both of which are arranged on one side of the workbench 1 along the second horizontal direction Y and close to the sorting module 2, and the plurality of partition plates 5 are arranged at intervals along the first horizontal direction X, and a sorting module 2 is arranged between two adjacent partition plates 5. A safety door 6 is arranged between two adjacent partition plates 5, and the safety door 6 can separate the sorting module 2 from the staff between the two adjacent partition plates 5.

[0080] Exemplarily, the chip sorting machine can be used to sort Micro / Mini LED chips.

[0081] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention. For those skilled in the art, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to list all the embodiments here. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the claims of the present invention.

Claims

1. A chip sorting machine, used for transferring chips (103) of the same specification arranged on a first carrier film (102) of an incoming material tray (100) to a second carrier film of an empty material tray (200), characterized in that: include: Workbench (1); A sorting module (2), wherein a plurality of the sorting modules (2) are provided, and the plurality of the sorting modules (2) are sequentially arranged on the workbench (1) along a first horizontal direction (X); the sorting module (2) comprises a first supporting mechanism (21), a chip sorting mechanism (22) and a second supporting mechanism (23) which are sequentially arranged, wherein the first supporting mechanism (21) is used to support the incoming material tray (100), and enables the chips (103) on the first carrier film (102) to be arranged opposite to the chip sorting mechanism (22), and the second supporting mechanism (23) is used to support the empty material tray (200), and enables the second carrier film to be arranged opposite to the chip sorting mechanism (22), and the chip sorting mechanism (22) is used to transfer chips (103) of the same specification on the first carrier film (102) to the second carrier film; A material frame (3) is arranged on the workbench (1), comprising an unsorted material frame (31) and a plurality of sorted material frames (32), wherein the unsorted material frame (31) is used to place the incoming material tray (100), and the sorted material frame (32) is used to place the empty material tray (200); A gripping module (4), wherein the gripping module (4) is arranged above the workbench (1) at intervals along the vertical direction (Z), and the gripping module (4) comprises a driving mechanism (41) and a clamping claw (42), wherein the driving mechanism (41) drives the clamping claw (42) to move along the first horizontal direction (X) or the second horizontal direction (Y) or the vertical direction (Z), and the clamping claw (42) is capable of clamping the incoming material tray (100) or the empty material tray (200).

2. The chip sorting machine according to claim 1, characterized in that: The chip sorting mechanism (22) comprises a first driving component (221), a suction nozzle (222) and a camera component (223); the first driving component (221) is arranged on the workbench (1) and drives the suction nozzle (222) to rotate around the rotation axis in the vertical direction (Z), so that the suction nozzle (222) can selectively face the first carrier film (102) or the second carrier film; the suction nozzle (222) can suck the chip (103) on the first carrier film (102), or place the sucked chip (103) on the second carrier film; and the camera component (223) can identify the specifications and positions of the chips (103) on the first carrier film (102) and the second carrier film; The first supporting mechanism (21) is movable along the second horizontal direction (Y) or the vertical direction (Z), and the second supporting mechanism (23) is movable along the second horizontal direction (Y) or the vertical direction (Z).

3. The chip sorting machine according to claim 2, characterized in that: The sorting module (2) further comprises an ejector mechanism (24), the ejector mechanism (24) comprising a second driving component (241), an ejector cap (242), an ejector and an ejector driving component (243), along the first horizontal direction (X), the second driving component (241) being arranged on a side of the first supporting mechanism (21) away from the chip sorting mechanism (22), the second driving component (241) driving the ejector cap (242) to move along the first horizontal direction (X) so that the ejector cap (242) can abut against or separate from the first carrier film (102), the ejector cap (242) abuts against the first carrier film (102), the ejector cap (242) can be adsorbed on the first carrier film (102), and the suction nozzle (222) opposite to the first carrier film (102) is coaxially arranged with the ejector cap (242) along the first horizontal direction (X); The ejector pin is inserted into the ejector cap (242) along the first horizontal direction (X), and the ejector pin driving component (243) drives the ejector pin to have two states: extending the ejector cap (242) or retracting the ejector cap (242) along the first horizontal direction (X).

4. The chip sorting machine according to claim 3, characterized in that: Two suction nozzles (222) are provided, and the two suction nozzles (222) are symmetrically arranged along the rotation axis of the suction nozzle (222); The ejector mechanism (24) further comprises a third driving assembly (244), wherein the third driving assembly (244) drives the ejector cap (242) to slide along the vertical direction (Z).

5. The chip sorting machine according to claim 3, characterized in that: The first supporting mechanism (21) comprises a fourth driving component (211), a fifth driving component (212) and a first supporting plate (213); the fourth driving component (211) is fixed to the workbench (1) and drives the fifth driving component (212) to move along the second horizontal direction (Y); the fifth driving component (212) drives the first supporting plate (213) to move along the vertical direction (Z); the first supporting plate (213) is provided with a first through hole along the first horizontal direction (X) and a first slot along the vertical direction (Z); the first through hole is opposite to the ejector cap (242); the incoming material tray (100) is inserted into the first slot so that the first carrier film (102) is opposite to the first through hole.

6. The chip sorting machine according to claim 2, characterized in that: The second supporting mechanism (23) comprises a sixth driving component (231), a seventh driving component (232) and a supporting component. The sixth driving component (231) is fixed to the workbench (1) and drives the seventh driving component (232) to move along the second horizontal direction (Y). The seventh driving component (232) drives the supporting component to move along the vertical direction (Z). The supporting component is used to support the second carrier film.

7. The chip sorting machine according to claim 6, characterized in that: The support assembly includes a second support plate (2331), a second plug-in portion and an eighth drive assembly, the seventh drive assembly (232) drives the second support plate (2331) to move along the vertical direction (Z), the eighth drive assembly is arranged on the second support plate (2331) and drives the second plug-in portion to rotate around the rotation axis of the first horizontal direction (X), and the empty material tray (200) is inserted in the second plug-in portion.

8. The chip sorting machine according to claim 7, characterized in that: The support assembly further comprises a bearing (2333), a support disc (2334), a suction cup (2335) and a ninth driving assembly (2336), wherein the outer ring of the bearing (2333) is fixedly arranged on the second support plate (2331), the support disc (2334) is fixedly connected to the inner ring of the bearing (2333), the ninth driving assembly (2336) is arranged on the support disc (2334) and drives the suction cup (2335) to move along the first horizontal direction (X), so that the suction cup (2335) has two states of supporting the second carrier film and being away from the second carrier film, and the suction cup (2335) can be adsorbed on the second carrier film; The eighth driving assembly comprises a driving group and a driven wheel (2337), wherein the driven wheel (2337) is coaxially fixedly connected to the inner ring of the bearing (2333), the driving group drives the driven wheel (2337) to rotate, and the second plug-in portion is arranged on the driven wheel (2337).

9. The chip sorting machine according to claim 8, characterized in that: The second plug-in portion includes two plug-in components (2332), and the two plug-in components (2332) are arranged at intervals on the driven wheel (2337). The plug-in components (2332) have two states of relative fixedness and relative sliding relative to the driven wheel (2337) along the first horizontal direction (X). The opposite surfaces of the two plug-in components (2332) are respectively recessed with second slots, and the two ends of the empty material tray (200) along the spacing direction of the two plug-in components (2332) are respectively inserted into the two second slots.

10. The chip sorting machine according to any one of claims 1 to 9, characterized in that: The driving mechanism (41) comprises a bracket (411), a first driving member (412), a second driving member (413) and a third driving member (414); the bracket (411) is arranged on the workbench (1); the first driving member (412) is fixed to the bracket (411) and is spaced apart from the workbench (1) along the vertical direction (Z); the first driving member (412) drives the second driving member (413) to move along the first horizontal direction (X); the third driving member (414) comprises a sliding plate (4141) and two sliding members (4142); the second driving member (413) drives the sliding plate (4141) to move along the second horizontal direction (Y); the two sliding members (4142) are arranged on both sides of the sliding plate (4141) along the first horizontal direction (X); and the sliding member (4142) is slidably arranged on the sliding plate (4141) along the vertical direction (Z); Two clamping jaws (42) are provided, and the two clamping jaws (42) are respectively provided on two sliding members (4142).

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