Cross contamination-free groove type wafer cleaning machine

Abstract

The invention discloses a cross-contamination-free groove type wafer cleaning machine which comprises a base, the top of the base is fixedly connected with a cleaning groove, the side, away from the cleaning groove, of the base is rotationally connected with a transverse lead screw, the outer wall of the transverse lead screw is in threaded connection with a moving frame, the inner side of the moving frame is rotationally connected with a vertical lead screw, and the vertical lead screw is in threaded connection with the outer wall of the transverse lead screw. And the outer wall of the vertical lead screw is in threaded connection with a moving seat. According to the cleaning machine, the gas storage device is arranged, when the connecting pipe moves upwards to make contact with the gas guide assembly, nitrogen in the nitrogen cylinder fixed to the mounting plate through the fixing frame can flow into the connecting pipe from the gas guide assembly, and then the nitrogen in the connecting pipe can flow into the hose through the collecting pipe; and finally, the nitrogen enters the gas spraying pipe through the inner cavity of the arc-shaped limiting frame, at the moment, the nitrogen can be blown to the surface of the wafer after being guided by the gas spraying pipe, the cleaning liquid attached to the surface of the wafer is blown off, and cross infection is avoided.

Description

Technical Field

[0001] The invention relates to the technical field of wafer cleaning machines, and in particular to a cross-contamination-free slot-type wafer cleaning machine. Background Art

[0002] In the field of semiconductor manufacturing, tank-type wafer cleaning machines are key equipment to ensure the cleanliness of wafers. However, existing tank-type wafer cleaning machines have many problems in practical applications and are difficult to meet the growing production needs.

[0003] At present, the connection between the cleaning and drying processes of traditional tank-type wafer cleaning machines is not reasonable. After the cleaning of traditional cleaning machines, the nitrogen purge either needs to be manually turned on, which can easily lead to residual cleaning liquid and increase the risk of cross-infection if the operation is not timely; or the degree of automation is low and the timing of nitrogen supply cannot be accurately controlled. Therefore, it is of great practical significance to develop a tank-type wafer cleaning machine that is free of cross-contamination and can effectively solve the above problems. Summary of the invention

[0004] 1. Technical issues to be solved

[0005] In view of the deficiencies in the prior art, the present invention provides a cross-contamination-free slot-type wafer cleaning machine, which solves the problem of unreasonable connection between the cleaning and drying processes in traditional slot-type wafer cleaning machines.

[0006] (II) Technical solution

[0007] To achieve the above objectives, the present invention is implemented through the following technical solutions: a cross-contamination-free tank-type wafer cleaning machine, comprising: a base, a cleaning tank is fixedly connected to the top of the base, a transverse screw is rotatably connected to the side of the base away from the cleaning tank, a movable frame is threadedly connected to the outer wall of the transverse screw, a vertical screw is rotatably connected to the inner side of the movable frame, a movable seat is threadedly connected to the outer wall of the vertical screw, a receiving device is fixedly connected to the outer side of the movable seat, the receiving device is used to fix the wafer to be cleaned, and after the cleaning is completed, the cleaning liquid attached to the surface of the wafer is blown off by nitrogen, a gas storage device is fixedly connected to the top of the movable frame, and the gas storage device is used to provide the required nitrogen for the receiving device, firstly, a pre-washing liquid, a main washing liquid and a rinsing liquid are added to the cleaning tank in sequence, and then the wafer to be cleaned is placed in the receiving device, and then the movable frame and the movable seat are driven to move by the transverse screw and the vertical screw respectively, so that the receiving device can accurately place the wafer into the cleaning tank for cleaning;

[0008] The gas storage device comprises a mounting plate, a fixing frame is fixedly connected to the top of the mounting plate, a nitrogen bottle is fixedly connected to the inner side of the fixing frame, and a gas guide component is fixedly connected to the bottom of the nitrogen bottle. After the cleaning is completed, the nitrogen provided by the gas storage device can be used to purge the cleaning liquid on the surface of the wafer;

[0009] The receiving device includes a fixed frame, a sliding plate is slidably connected to the inner side of the fixed frame, a pneumatic push rod is fixedly connected to the outer side of the sliding plate, a fixed plate is fixedly connected to the outer side of the sliding plate, telescopic cylinders are fixedly connected to both sides of the fixed plate, the output end of the telescopic cylinder is fixedly connected to a limiting slide, a fixed component is slidably connected to the inner side of the fixed plate, a manifold is fixedly connected to the top of the fixed component, and a connecting pipe is fixedly connected to the top of the manifold, and the pneumatic push rods installed on both sides of the fixed frame drive the two sliding plates inside the fixed frame to approach each other, so that the wafer can be stuck between the fixed components on both sides, thereby wafers of different sizes can be fixed by telescoping the pneumatic push rods.

[0010] Preferably, the bottom of the movable rack is slidably connected to the top of the base, the outer side of the movable seat is slidably connected to the inner side of the movable rack, the receiving device is located directly below the gas storage device, and the outer side of the mounting plate is fixedly connected to the top of the movable rack. The transverse screw is driven by a driving motor installed on the outer side of the base to rotate, so that the movable rack can drive the receiving device to move, so that the wafer can reach above the cleaning tank filled with different cleaning solutions, and then the vertical screw is driven by the adjusting motor on the top of the movable rack to rotate, so that the height of the receiving device can be adjusted.

[0011] Preferably, the air guide assembly includes a ventilation pipe, the inner side of the ventilation pipe is slidably connected to a sliding pipe, the outer side of the sliding pipe is fixedly connected to a compression spring, the bottom of the ventilation pipe is fixedly connected to a guide cover, the inner side of the sliding pipe is fixedly connected to a baffle, the inner side of the ventilation pipe is fixedly connected to an annular baffle, and the outer side of the ventilation pipe is fixedly connected to a bent pipe. As the connecting pipe continues to move upward, the top end of the connecting pipe accurately pushes the sliding pipe upward after being guided by the guide cover, and at this time the compression spring is compressed, and the baffle is separated from the annular baffle. At this time, the nitrogen in the nitrogen bottle can flow downward in the ventilation pipe through the gap between the baffle and the annular baffle.

[0012] Preferably, the top of the vent pipe is fixedly connected to the bottom of the nitrogen bottle, the top of the compression spring is fixedly connected to the inside of the vent pipe, the outside of the baffle plate contacts the top of the annular baffle plate, the bottom of the sliding tube is provided with a vent hole, the side wall of the sliding tube is provided with a rectangular hole, the bottom of the sliding tube contacts the bottom of the connecting tube, and when the connecting tube is separated from the air guide assembly, the compression spring returns to its original state, so that the baffle plate contacts the annular baffle plate again, closing the nitrogen channel. This elastic reset mechanism ensures that the device can automatically return to its initial state after each use, ensuring the reliability and stability of the device.

[0013] Preferably, the outer side of the fixed frame is fixedly connected to the outer side of the movable seat, the two sides of the fixed frame are fixedly connected to the outer side of the pneumatic push rod, the two sides of the limiting slide are slidably connected to the outer side of the fixed plate, and the two sides of the manifold are fixedly connected to the top of the fixed frame. The nitrogen in the nitrogen bottle can flow from the gas guide component to the connecting pipe, and then the nitrogen in the connecting pipe can flow into the hose through the manifold, and finally enter the jet pipe through the inner cavity of the arc-shaped limiting frame. At this time, the nitrogen can be blown onto the surface of the wafer after being guided by the jet pipe.

[0014] Preferably, the fixing assembly includes an arc-shaped limit frame, a V-shaped spring piece is fixedly connected to the outside of the arc-shaped limit frame, a slider is fixedly connected to the outside of the V-shaped spring piece, a hose is fixedly connected to the top of the arc-shaped limit frame, and a jet pipe is fixedly connected to the side of the arc-shaped limit frame away from the V-shaped spring piece, and the V-shaped spring piece can be adaptively adjusted according to the actual shape of the wafer edge. It can fit the irregular part of the wafer edge tightly, ensuring that each arc-shaped limit frame can fully contact the wafer, thereby enhancing the fixing effect on the wafer.

[0015] Preferably, the outer side of the slider is fixedly connected to a limiting column, and the outer side of the limiting column is slidably connected to the inner side of the limiting slide plate through a limiting groove, and the limiting groove is provided in the wall of the limiting slide plate, and the outer side of the slider is slidably connected to the inner side of the fixed plate, and the top end of the hose is fixedly connected to the outer side of the manifold, and the limiting slide plate can slide up and down along the outer side of the fixed plate through the extension and contraction of the telescopic cylinder, so that the limiting column slides in the limiting groove, and during the sliding process of the limiting column, the slider can drive the distance between each two adjacent arc-shaped limiting frames to increase or decrease.

[0016] (III) Beneficial effects

[0017] The present invention provides a cross-contamination-free tank-type wafer cleaning machine, which has the following beneficial effects:

[0018] (1) The cleaning machine is provided with a receiving device. When fixing the wafer, the pneumatic push rods installed on both sides of the fixing frame drive the two sliding plates inside the fixing frame to approach each other, so that the wafer can be stuck between the fixing components on both sides. Therefore, wafers of different sizes can be fixed by extending and retracting the pneumatic push rods, thereby improving the use range and versatility of the equipment.

[0019] (ii) The cleaning machine is provided with a V-shaped spring piece. When the arc-shaped limit frame approaches the wafer under the drive of the telescopic cylinder and the limit slide, the V-shaped spring piece can be adaptively adjusted according to the actual shape of the wafer edge. It can fit the irregular part of the wafer edge tightly, ensuring that each arc-shaped limit frame can fully contact the wafer, thereby enhancing the fixation effect on the wafer and preventing the wafer from displacement or shaking during the cleaning and nitrogen purge process. At the same time, the elasticity of the V-shaped spring piece can also absorb and buffer the impact force, so that the arc-shaped limit frame can contact the wafer more gently, disperse and weaken the impact force during the fixation process, and effectively protect the wafer from damage.

[0020] (III) The cleaning machine is provided with a limit slide, and the limit slide can slide up and down along the outer side of the fixed plate by the extension and retraction of the telescopic cylinder, so that the limit column slides in the limit groove. During the sliding of the limit column, the slide can drive the distance between each two adjacent arc-shaped limit frames to increase or decrease, thereby adjusting the distance between two adjacent wafers, ensuring that the cleaning liquid flows smoothly between adjacent wafers, avoiding the formation of cleaning dead corners due to the small spacing causing the cleaning liquid to flow poorly, and affecting the cleaning effect.

[0021] (IV) The cleaning machine is provided with a gas storage device. When the connecting tube moves upward and contacts the gas guide assembly, the nitrogen in the nitrogen bottle fixed on the mounting plate by the fixing frame can flow from the gas guide assembly to the connecting tube. Then the nitrogen in the connecting tube can flow into the hose through the manifold and finally enter the jet pipe through the inner cavity of the arc-shaped limit frame. At this time, the nitrogen can be blown onto the surface of the wafer after being guided by the jet pipe, blowing off the cleaning liquid attached to the surface of the wafer to avoid cross infection.

[0022] (V) The cleaning machine is provided with an air guide component. The top end of the connecting pipe accurately pushes the sliding pipe upward after being guided by the guide cover. At this time, the compression spring is compressed, and the baffle plate is separated from the annular baffle plate. At this time, the nitrogen in the nitrogen bottle can flow downward through the gap between the baffle plate and the annular baffle plate in the ventilation pipe, and enter the bottom of the ventilation pipe through the bent pipe, and then enter the sliding pipe through the rectangular hole, and finally flow into the connecting pipe through the ventilation hole, thereby realizing the seamless connection of the cleaning and drying processes. The nitrogen purge function can be automatically turned on without manual intervention, thereby improving the automation degree and work efficiency of the cleaning machine.

[0023] (VI) The cleaning machine is provided with a baffle and an annular baffle. When the receiving device descends and the connecting tube is separated from the air guide assembly, the compression spring returns to its original state, causing the baffle to contact the annular baffle again and close the nitrogen channel. This elastic reset mechanism ensures that the equipment can automatically return to its initial state after each use, ensuring the reliability and stability of the equipment. The cooperation between the baffle and the annular baffle acts as a switch. The nitrogen channel will only open when the connecting tube pushes the sliding tube upward. This design effectively prevents nitrogen leakage caused by misoperation or equipment failure, ensuring the safety of the operator and the normal operation of the equipment. At the same time, when the nitrogen channel is closed, it can prevent external impurities from entering the ventilation pipe, ensuring the purity of the nitrogen. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0025] Figure 2 It is a structural schematic diagram of another perspective of the present invention;

[0026] Figure 3 It is a structural schematic diagram of the mobile frame of the present invention;

[0027] Figure 4 It is a structural schematic diagram of the gas storage device of the present invention;

[0028] Figure 5 It is a structural schematic diagram of the air guide component of the present invention;

[0029] Figure 6 It is a structural schematic diagram of the sliding tube of the present invention;

[0030] Figure 7 It is a structural schematic diagram of the receiving device of the present invention;

[0031] Figure 8 For the present invention Figure 7 A schematic diagram of the structure at A;

[0032] Fig. 9 It is a structural schematic diagram of the sliding plate of the present invention;

[0033] Fig.10 It is a schematic structural diagram of the fixing assembly of the present invention.

[0034] In the figure: 1, base; 2, cleaning tank; 3, horizontal screw rod; 4, moving frame; 5, vertical screw rod; 6, moving seat; 7, gas storage device; 8, receiving device; 71, mounting plate; 72, fixed frame; 73, nitrogen bottle; 74, gas guide assembly; 741, ventilation pipe; 742, sliding pipe; 743, compression spring; 744, guide cover; 745, spoiler; 746, annular baffle; 747, ventilation hole; 748, rectangular hole; 749, bent pipe; 81, fixed frame; 82, sliding plate; 83, pneumatic push rod; 84, fixed plate; 85, telescopic cylinder; 86, limit slide plate; 87, fixed assembly; 88, limit groove; 89, manifold; 80, connecting pipe; 871, arc limit frame; 872, hose; 873, jet pipe; 874, V-shaped spring; 875, slider; 876, limit column. DETAILED DESCRIPTION

[0035] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0036] See also Figure 1-10 The present invention provides a technical solution: a cross-contamination-free tank-type wafer cleaning machine, comprising:

[0037] A base 1, a cleaning tank 2 is fixedly connected to the top of the base 1, a side of the base 1 away from the cleaning tank 2 is rotatably connected to a horizontal screw rod 3, an outer wall of the horizontal screw rod 3 is threadedly connected to a moving frame 4, an inner side of the moving frame 4 is rotatably connected to a vertical screw rod 5, an outer wall of the vertical screw rod 5 is threadedly connected to a moving seat 6, a receiving device 8 is fixedly connected to the outer side of the moving seat 6, the receiving device 8 is used to fix the wafer to be cleaned, and after the cleaning is completed, the cleaning liquid attached to the surface of the wafer is blown off by nitrogen, a gas storage device 7 is fixedly connected to the top of the moving frame 4, and the gas storage device 7 is used to provide the required nitrogen for the receiving device 8; the gas storage device 7 includes a mounting plate 71, a fixed frame 72 is fixedly connected to the top of the mounting plate 71, a nitrogen bottle 73 is fixedly connected to the inner side of the fixed frame 72, and a gas guide component 74 is fixedly connected to the bottom of the nitrogen bottle 73; the bottom of the moving frame 4 is slidably connected to the top of the base 1, the outer side of the moving seat 6 is slidably connected to the inner side of the moving frame 4, the receiving device 8 is located at the storage Directly below the gas device 7, the outer side of the mounting plate 71 is fixedly connected to the top of the movable frame 4. The trough-type wafer cleaning machine mainly relies on the cleaning trough 2 on the base 1 to complete the wafer cleaning operation. First, pre-wash liquid, main wash liquid and rinse liquid are added to the cleaning trough 2 in sequence, and then the wafer to be cleaned is placed in the receiving device 8. The horizontal screw rod 3 and the vertical screw rod 5 are used to drive the movable frame 4 and the movable seat 6 to move respectively, so that the receiving device 8 can accurately place the wafer into the cleaning trough 2 for cleaning, and after the cleaning, the nitrogen provided by the gas storage device 7 is used to purge the cleaning liquid on the surface of the wafer; by driving the horizontal screw rod 3 to rotate through the driving motor installed on the outer side of the base 1, the movable frame 4 can drive the receiving device 8 to move, so that the wafer can reach the top of the cleaning trough 2 filled with different cleaning liquids, and then the adjusting motor on the top of the movable frame 4 drives the vertical screw rod 5 to rotate, so as to adjust the height of the receiving device 8, so that the wafer can be accurately immersed in the cleaning liquid.

[0038] The air guide assembly 74 includes a vent pipe 741, a sliding pipe 742 is slidably connected to the inner side of the vent pipe 741, a compression spring 743 is fixedly connected to the outer side of the sliding pipe 742, a guide cover 744 is fixedly connected to the bottom of the vent pipe 741, a baffle 745 is fixedly connected to the inner side of the sliding pipe 742, an annular baffle 746 is fixedly connected to the inner side of the vent pipe 741, a bent pipe 749 is fixedly connected to the outer side of the vent pipe 741, the top of the vent pipe 741 is fixedly connected to the bottom of the nitrogen bottle 73, the top of the compression spring 743 is fixedly connected to the inner side of the vent pipe 741, the outer side of the baffle 745 is in contact with the top of the annular baffle 746, a vent hole 747 is opened at the bottom of the sliding pipe 742, and a rectangular hole 74 is opened on the side wall of the sliding pipe 742. 8, the bottom of the sliding tube 742 contacts the bottom of the connecting tube 80. After the cleaning is completed, the adjusting motor drives the vertical screw 5 to rotate in the opposite direction, and drives the receiving device 8 and the wafer to move upward, thereby separating from the cleaning liquid in the cleaning tank 2. In this process, when the connecting tube 80 moves upward and contacts the air guide component 74, the nitrogen in the nitrogen bottle 73 fixed on the mounting plate 71 by the fixing frame 72 can flow from the air guide component 74 to the connecting tube 80, and then the nitrogen in the connecting tube 80 can flow into the hose 872 through the manifold 89, and finally enter the injection pipe 873 through the inner cavity of the arc-shaped limit frame 871. At this time, the nitrogen can be blown onto the surface of the wafer after being guided by the injection pipe 873, and the cleaning liquid attached to the surface of the wafer is blown off to avoid cross infection;

[0039] When the top end of the connecting tube 80 contacts the bottom of the air guide assembly 74, as the connecting tube 80 continues to move upward, the top end of the connecting tube 80 accurately pushes the sliding tube 742 upward after being guided by the guide cover 744. At this time, the compression spring 743 is compressed, and the baffle 745 is separated from the annular baffle 746. At this time, the nitrogen in the nitrogen bottle 73 can flow downward through the gap between the baffle 745 and the annular baffle 746 in the ventilation pipe 741, and enter the bottom of the ventilation pipe 741 through the curved pipe 749, and then enter the sliding tube 742 through the rectangular hole 748, and finally flow into the connecting tube 80 through the ventilation hole 747, thereby realizing a seamless connection between the cleaning and drying processes, and the nitrogen purge function can be automatically turned on without manual intervention, thereby improving the automation degree and working efficiency of the cleaning machine.

[0040] When the receiving device 8 descends and the connecting pipe 80 is separated from the air guide component 74, the compression spring 743 returns to its original state, so that the baffle 745 contacts the annular baffle 746 again and closes the nitrogen channel. This elastic reset mechanism ensures that the device can automatically return to its initial state after each use, ensuring the reliability and stability of the device. The cooperation between the baffle 745 and the annular baffle 746 acts as a switch. The nitrogen channel will only open when the connecting pipe 80 pushes the sliding pipe 742 upward. This design effectively prevents nitrogen leakage caused by misoperation or equipment failure, ensuring the safety of the operator and the normal operation of the equipment. At the same time, when the nitrogen channel is closed, it can prevent external impurities from entering the vent pipe 741, ensuring the purity of the nitrogen.

[0041] The receiving device 8 includes a fixed frame 81, the inner side of the fixed frame 81 is slidably connected with a sliding plate 82, the outer side of the sliding plate 82 is fixedly connected with a pneumatic push rod 83, the outer side of the sliding plate 82 is fixedly connected with a fixed plate 84, both sides of the fixed plate 84 are fixedly connected with telescopic cylinders 85, the output end of the telescopic cylinder 85 is fixedly connected with a limiting slide plate 86, the inner side of the fixed plate 84 is slidably connected with a fixed component 87, the top of the fixed component 87 is fixedly connected with a manifold 89, and the top of the manifold 89 is fixedly connected with a connecting pipe 80; the outer side of the fixed frame 81 is fixedly connected to the outer side of the movable seat 6, the two sides of the fixed frame 81 are fixedly connected to the outer side of the pneumatic push rod 83, the two sides of the limiting slide plate 86 are slidably connected to the outer side of the fixed plate 84, and the two sides of the manifold 89 are fixedly connected to the top of the fixed frame 81. When fixing the wafer, the pneumatic push rods 83 installed on both sides of the fixing frame 81 drive the two sliding plates 82 inside the fixing frame 81 to move closer to each other, so that the wafer can be stuck between the fixing components 87 on both sides. In this way, wafers of different sizes can be fixed by extending and retracting the pneumatic push rods 83, thereby improving the scope of use and versatility of the equipment.

[0042] The fixing assembly 87 includes an arc-shaped limit frame 871, the outer side of the arc-shaped limit frame 871 is fixedly connected with a V-shaped spring piece 874, the outer side of the V-shaped spring piece 874 is fixedly connected with a slider 875, the top of the arc-shaped limit frame 871 is fixedly connected with a hose 872, the side of the arc-shaped limit frame 871 away from the V-shaped spring piece 874 is fixedly connected with an injection pipe 873, the outer side of the slider 875 is fixedly connected with a limit column 876, the outer side of the limit column 876 is slidably connected to the inner side of the limit slide 86 through a limit groove 88, and the limit groove 88 is opened in the wall of the limit slide 86, the outer side of the slider 875 is slidably connected to the inner side of the fixed plate 84, the top of the hose 872 is fixedly connected to the outer side of the manifold 89, and when the arc-shaped limit frame 871 approaches the wafer under the drive of the telescopic cylinder 85 and the limit slide 86, the V-shaped spring piece 874 can be adaptively adjusted according to the actual shape of the wafer edge. It can fit the irregular part of the edge of the wafer tightly, ensuring that each arc-shaped limit frame 871 can fully contact the wafer, thereby enhancing the fixing effect on the wafer and preventing the wafer from displacement or shaking during cleaning and nitrogen purging. At the same time, the elasticity of the V-shaped spring 874 can also absorb and buffer this impact force, so that the arc-shaped limit frame 871 can contact the wafer more gently, disperse and weaken the impact force during the fixing process, and effectively protect the wafer from damage. At the same time, through the telescopic cylinder 85, the limit slide plate 86 can slide up and down along the outer side of the fixed plate 84, so that the limit column 876 slides in the limit groove 88. During the sliding process of the limit column 876, the slider 875 can drive the distance between each two adjacent arc-shaped limit frames 871 to increase or decrease, thereby adjusting the distance between two adjacent wafers, ensuring that the cleaning liquid flows smoothly between adjacent wafers, and avoiding the poor flow of the cleaning liquid due to too small a spacing, forming a cleaning dead angle, and affecting the cleaning effect.

[0043] Working principle:

[0044] When in use, the tank-type wafer cleaning machine mainly relies on the cleaning tank 2 on the base 1 to complete the wafer cleaning operation. First, pre-wash liquid, main wash liquid and rinse liquid are added to the cleaning tank 2 in sequence, and then the wafer to be cleaned is placed in the receiving device 8. The horizontal screw 3 and the vertical screw 5 are used to drive the movable frame 4 and the movable seat 6 to move respectively, so that the receiving device 8 can accurately place the wafer into the cleaning tank 2 for cleaning, and after the cleaning is completed, the cleaning liquid on the wafer surface is purged with nitrogen provided by the gas storage device 7.

[0045] The driving motor installed on the outside of the base 1 drives the horizontal screw 3 to rotate, so that the mobile frame 4 drives the receiving device 8 to move, so that the wafer can reach the top of the cleaning tank 2 filled with different cleaning liquids, and then the adjusting motor on the top of the mobile frame 4 drives the vertical screw 5 to rotate, so that the height of the receiving device 8 can be adjusted, so that the wafer can be accurately immersed in the cleaning liquid;

[0046] When fixing the wafer, the pneumatic push rods 83 installed on both sides of the fixing frame 81 drive the two sliding plates 82 inside the fixing frame 81 to move closer to each other, so that the wafer can be stuck between the fixing components 87 on both sides. In this way, wafers of different sizes can be fixed by extending and retracting the pneumatic push rods 83, thereby improving the scope of use and versatility of the equipment.

[0047] When the arc-shaped limit frame 871 approaches the wafer under the drive of the telescopic cylinder 85 and the limit slide 86, the V-shaped spring piece 874 can be adaptively adjusted according to the actual shape of the wafer edge. It can fit the irregular part of the wafer edge tightly, ensuring that each arc-shaped limit frame 871 can fully contact the wafer, thereby enhancing the fixation effect on the wafer and preventing the wafer from displacement or shaking during the cleaning and nitrogen purge process. At the same time, the elasticity of the V-shaped spring piece 874 can also absorb and buffer this impact force, so that the arc-shaped limit frame 871 can contact the wafer more gently, disperse and weaken the impact force during the fixation process, and effectively protect the wafer from damage;

[0048] At the same time, the telescopic cylinder 85 can be extended and retracted to make the limiting slide plate 86 slide up and down along the outer side of the fixed plate 84, so that the limiting column 876 can slide in the limiting groove 88. During the sliding of the limiting column 876, the slider 875 can drive the distance between each two adjacent arc-shaped limiting frames 871 to increase or decrease, thereby adjusting the distance between two adjacent wafers to ensure that the cleaning liquid flows smoothly between adjacent wafers, avoiding the poor flow of the cleaning liquid due to too small a spacing, forming a cleaning dead corner, and affecting the cleaning effect.

[0049] After the cleaning is completed, the regulating motor drives the vertical screw rod 5 to rotate in the opposite direction, and drives the receiving device 8 and the wafer to move upward, so as to be separated from the cleaning liquid in the cleaning tank 2. In this process, when the connecting tube 80 moves upward and contacts the air guide component 74, the nitrogen in the nitrogen bottle 73 fixed on the mounting plate 71 by the fixing frame 72 can flow from the air guide component 74 to the connecting tube 80, and then the nitrogen in the connecting tube 80 can flow into the hose 872 through the manifold 89, and finally enter the injection pipe 873 through the inner cavity of the arc-shaped limit frame 871. At this time, the nitrogen can be blown onto the surface of the wafer after being guided by the injection pipe 873, and the cleaning liquid attached to the surface of the wafer is blown off to avoid cross infection.

[0050] When the top end of the connecting tube 80 contacts the bottom of the air guide assembly 74, as the connecting tube 80 continues to move upward, the top end of the connecting tube 80 accurately pushes the sliding tube 742 upward after being guided by the guide cover 744. At this time, the compression spring 743 is compressed, and the baffle 745 is separated from the annular baffle 746. At this time, the nitrogen in the nitrogen bottle 73 can flow downward through the gap between the baffle 745 and the annular baffle 746 in the ventilation pipe 741, and enter the bottom of the ventilation pipe 741 through the curved pipe 749, and then enter the sliding tube 742 through the rectangular hole 748, and finally flow into the connecting tube 80 through the ventilation hole 747, thereby realizing a seamless connection between the cleaning and drying processes, and the nitrogen purge function can be automatically turned on without manual intervention, thereby improving the automation degree and working efficiency of the cleaning machine.

[0051] When the receiving device 8 descends and the connecting pipe 80 is separated from the air guide component 74, the compression spring 743 returns to its original state, so that the baffle 745 contacts the annular baffle 746 again and closes the nitrogen channel. This elastic reset mechanism ensures that the device can automatically return to its initial state after each use, ensuring the reliability and stability of the device. The cooperation between the baffle 745 and the annular baffle 746 acts as a switch. The nitrogen channel will only open when the connecting pipe 80 pushes the sliding pipe 742 upward. This design effectively prevents nitrogen leakage caused by misoperation or equipment failure, ensuring the safety of the operator and the normal operation of the equipment. At the same time, when the nitrogen channel is closed, it can prevent external impurities from entering the vent pipe 741, ensuring the purity of the nitrogen.

[0052] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the statement "comprise a ..." do not exclude the presence of other identical elements in the process, method, article or device including the elements.

[0053] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A cross-contamination-free tank-type wafer cleaning machine, characterized in that: include: A base (1), wherein the top of the base (1) is fixedly connected to a cleaning tank (2), a side of the base (1) away from the cleaning tank (2) is rotatably connected to a transverse screw rod (3), the outer wall of the transverse screw rod (3) is threadedly connected to a movable frame (4), the inner side of the movable frame (4) is rotatably connected to a vertical screw rod (5), the outer wall of the vertical screw rod (5) is threadedly connected to a movable seat (6), the outer side of the movable seat (6) is fixedly connected to a receiving device (8), the receiving device (8) is used to fix a wafer to be cleaned, and after cleaning is completed, the cleaning liquid attached to the surface of the wafer is blown off by nitrogen, and the top of the movable frame (4) is fixedly connected to a gas storage device (7), and the gas storage device (7) is used to provide the receiving device (8) with the required nitrogen; The gas storage device (7) comprises a mounting plate (71), the top of the mounting plate (71) is fixedly connected to a fixing frame (72), the inner side of the fixing frame (72) is fixedly connected to a nitrogen bottle (73), and the bottom of the nitrogen bottle (73) is fixedly connected to a gas guide assembly (74); The receiving device (8) comprises a fixed frame (81), the inner side of the fixed frame (81) is slidably connected to a sliding plate (82), the outer side of the sliding plate (82) is fixedly connected to a pneumatic push rod (83), the outer side of the sliding plate (82) is fixedly connected to a fixed plate (84), both sides of the fixed plate (84) are fixedly connected to telescopic cylinders (85), the output end of the telescopic cylinder (85) is fixedly connected to a limiting slide plate (86), the inner side of the fixed plate (84) is slidably connected to a fixed component (87), the top of the fixed component (87) is fixedly connected to a manifold (89), and the top of the manifold (89) is fixedly connected to a connecting pipe (80).

2. A cross-contamination-free tank-type wafer cleaning machine according to claim 1, characterized in that: The bottom of the movable frame (4) is slidably connected to the top of the base (1), the outer side of the movable seat (6) is slidably connected to the inner side of the movable frame (4), the receiving device (8) is located directly below the gas storage device (7), and the outer side of the mounting plate (71) is fixedly connected to the top of the movable frame (4).

3. The cross-contamination-free tank-type wafer cleaning machine according to claim 1, characterized in that: The air guide assembly (74) comprises a vent pipe (741), the inner side of the vent pipe (741) is slidably connected to a sliding pipe (742), the outer side of the sliding pipe (742) is fixedly connected to a compression spring (743), the bottom of the vent pipe (741) is fixedly connected to a guide cover (744), the inner side of the sliding pipe (742) is fixedly connected to a baffle (745), the inner side of the vent pipe (741) is fixedly connected to an annular baffle (746), and the outer side of the vent pipe (741) is fixedly connected to a bent pipe (749).

4. The cross-contamination-free tank-type wafer cleaning machine according to claim 3, characterized in that: The top of the ventilation pipe (741) is fixedly connected to the bottom of the nitrogen bottle (73), the top of the compression spring (743) is fixedly connected to the inner side of the ventilation pipe (741), and the outer side of the baffle (745) is in contact with the top of the annular baffle (746).

5. The cross-contamination-free tank-type wafer cleaning machine according to claim 3, characterized in that: The bottom of the sliding tube (742) is provided with a vent hole (747), the side wall of the sliding tube (742) is provided with a rectangular hole (748), and the bottom of the sliding tube (742) is in contact with the bottom of the connecting tube (80).

6. The cross-contamination-free tank-type wafer cleaning machine according to claim 1, characterized in that: The outer side of the fixed frame (81) is fixedly connected to the outer side of the movable seat (6), the two sides of the fixed frame (81) are fixedly connected to the outer side of the pneumatic push rod (83), the two sides of the limit slide plate (86) are slidably connected to the outer side of the fixed plate (84), and the two sides of the manifold (89) are fixedly connected to the top of the fixed frame (81).

7. The cross-contamination-free tank-type wafer cleaning machine according to claim 1, characterized in that: The fixing assembly (87) comprises an arc-shaped limiting frame (871), a V-shaped spring piece (874) is fixedly connected to the outer side of the arc-shaped limiting frame (871), a sliding block (875) is fixedly connected to the outer side of the V-shaped spring piece (874), a hose (872) is fixedly connected to the top of the arc-shaped limiting frame (871), and a jet pipe (873) is fixedly connected to the side of the arc-shaped limiting frame (871) away from the V-shaped spring piece (874).

8. The cross-contamination-free tank-type wafer cleaning machine according to claim 7, characterized in that: The outer side of the sliding block (875) is fixedly connected to a limiting column (876), and the outer side of the limiting column (876) is slidably connected to the inner side of the limiting slide plate (86) via a limiting groove (88), and the limiting groove (88) is provided in the wall of the limiting slide plate (86).

9. The cross-contamination-free tank-type wafer cleaning machine according to claim 7, characterized in that: The outer side of the sliding block (875) is slidably connected to the inner side of the fixing plate (84), and the top end of the hose (872) is fixedly connected to the outer side of the manifold (89).

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