Double-layer micro-channel radiator with inclined flow guide structure and radiating method

Abstract

The invention belongs to the technical field of micro-channel heat dissipation, and discloses a double-layer micro-channel radiator with an inclined flow guide structure and a heat dissipation method. The double-layer micro-channel radiator with the inclined flow guide structure comprises a heat sink base, a heat sink middle part and a heat sink top part, the two ends of the heat sink base and the two ends of the heat sink middle part are connected through a plurality of first baffles, and a plurality of lower-layer micro-channels are formed between every two adjacent first baffles; the two ends of the heat sink middle and the two ends of the heat sink top are connected through a plurality of second baffles, a plurality of upper-layer micro-channels are formed between every two adjacent second baffles, a top inlet is formed in the top of each upper-layer micro-channel, inner flow guide structures are installed at the two ends of the bottom of each top inlet respectively, and a side flow guide structure is installed on the heat sink middle. The heat exchange efficiency can be improved, efficient cooling of a heat source is achieved, and the heat dissipation effect of all parts can be more balanced.

Description

Technical Field

[0001] The invention relates to the technical field of microchannel heat dissipation, and in particular to a double-layer microchannel heat sink with an inclined flow-guiding structure and a heat dissipation method. Background Art

[0002] With the complexity and integration of electronic devices and components, the heat generated by electronic devices is growing exponentially, especially military electronic devices, which not only have high power density but also high requirements for temperature control environment. If the problem of waste heat dissipation generated by electronic devices cannot be effectively solved, the temperature of electronic devices will rise, which will greatly reduce the reliability of electronic devices and even cause failure and damage to electronic devices. According to statistics, more than 55% of electronic device failures are caused by excessive temperature. The heat flux density of high-power electronic device modules and array layout structures such as military lasers and radars can reach 100 W / cm 2 Even 1000W / cm 2 It can be seen that the heat dissipation problem has become one of the technical bottlenecks restricting the development of electronic devices. It is urgent to adopt efficient cooling technology to meet the heat dissipation needs of electronic devices to ensure the safe operation of electronic devices.

[0003] Normally, air cooling can handle the low heat generation of electronic devices, but the noise and huge airflow volume will have a significant impact on electronic devices. Compared with traditional air cooling, spray cooling and microchannel cooling have higher heat transfer coefficients and are widely considered by the academic community to be relatively effective heat dissipation technologies for solving the heat dissipation problem of high-power electronic devices. However, in the application of thermal management technology for some high-power device arrays that strictly control weight and space dimensions, due to factors such as nozzle size and atomization space, the volume of the spray cooling device is relatively large, and its application is subject to certain restrictions; compared with spray cooling, microchannel cooling has the advantages of light weight, compact structure, and good integration. However, the current microchannel structure is prone to excessive pressure drop when obtaining enhanced heat transfer, and it is difficult to achieve the coordinated optimization design of thermal resistance and flow resistance. It is urgent to design a new type of microchannel structure to meet the heat dissipation needs of high-power electronic devices. Summary of the invention

[0004] The purpose of the present invention is to provide a double-layer microchannel heat sink and a heat dissipation method with an inclined guide structure to overcome the problems existing in the prior art. The present invention can improve the heat exchange efficiency, achieve efficient cooling of the heat source, and make the heat dissipation effect of each part more balanced, thereby meeting the heat dissipation requirements of high-power electronic devices.

[0005] In order to achieve the above object, the technical solution adopted by the present invention is as follows: In a first aspect, the present invention provides a double-layer microchannel heat sink with an inclined flow guide structure, comprising a heat sink base, a heat sink middle and a heat sink top, wherein the heat sink base and the ends of the heat sink middle are connected by a plurality of first baffles, and a plurality of lower-layer microchannels are formed between two adjacent first baffles; the ends of the heat sink middle and the ends of the heat sink top are connected by a plurality of second baffles, and a plurality of upper-layer microchannels are formed between two adjacent second baffles; A top inlet is provided at the top of each upper microchannel, the top inlet is located at the top of the heat sink, inner flow guide structures are installed at both ends of the bottom of the top inlet, the inner flow guide structure is located at the bottom of the top of the heat sink, a diversion area is formed between the inner flow guide structure and the heat sink base, and a first top outlet and a second top outlet are respectively provided at both ends of the top inlet; a first spoiler structure and a second spoiler structure are symmetrically installed between the top of each upper microchannel and the bottom of the lower microchannel, and the inner flow guide structure is located between the first spoiler structure and the second spoiler structure; Each lower layer microchannel has a first inlet at one end close to the first spoiler structure and a second inlet at one end close to the second spoiler structure; each upper layer microchannel has a first outlet at one end close to the first spoiler structure and a second outlet at one end close to the second spoiler structure; a side guide structure is installed on the middle part of the heat sink, and a confluence area is formed between the side guide structure and the heat sink base; Further, the inner flow guide structure includes vertical flow guide structures installed at both ends of the bottom of the top inlet, the vertical flow guide structure is located at the bottom of the top of the heat sink, a horizontal flow guide structure is installed at the bottom of the vertical flow guide structure, and a first inclined flow guide structure is installed at one end of the horizontal flow guide structure away from the vertical flow guide structure; Furthermore, the angle a between the first inclined flow guiding structure and the vertical plane of the horizontal flow guiding structure is 0° to 60°; Further, the middle portion of the heat sink includes a first middle portion of the heat sink and a second middle portion of the heat sink, and the side guide structure includes a second inclined guide structure and a third inclined guide structure; The middle of the first heat sink is located between the first inlet and the first outlet, the middle of the second heat sink is located between the second inlet and the second outlet, the second inclined flow guiding structure is located at one end of the middle of the first heat sink close to the first spoiler structure, the third inclined flow guiding structure is located at one end of the middle of the second heat sink close to the second spoiler structure, and the second inclined flow guiding structure and the third inclined flow guiding structure respectively form a confluence area with the heat sink base; Furthermore, the angle between the second inclined flow guide structure and the vertical plane in the middle of the first heat sink is 0° to 60°; Furthermore, the angle between the third inclined flow guide structure and the vertical plane in the middle of the second heat sink is 0° to 60°; Furthermore, the angles between the first spoiler structure and the base and the top of the heat sink are both 90°; the angles between the second spoiler structure and the base and the top of the heat sink are both 90°.

[0006] In a second aspect, the present invention further provides a double-layer microchannel heat dissipation method with an inclined flow guide structure, based on the above-mentioned double-layer microchannel heat sink with an inclined flow guide structure, comprising the following steps: Simultaneously introducing a coolant into the top inlet, the first inlet, and the second inlet; After passing through the top inlet, the coolant enters the flow diversion area for diversion under the action of the inner flow guide structure, and then flows out from the first top outlet and the second top outlet respectively under the action of the first spoiler structure, the second spoiler structure and the inner flow guide structure; The coolant enters the lower microchannel through the first inlet and the second inlet at the same time, enters the confluence area under the action of the middle and side guide structures of the heat sink, and then flows out from the first outlet and the second outlet respectively under the action of the first spoiler structure, the second spoiler structure and the side guide structure; Further, the inner flow guide structure includes vertical flow guide structures installed at both ends of the bottom of the top inlet, the vertical flow guide structure is located at the bottom of the top of the heat sink, a horizontal flow guide structure is installed at the bottom of the vertical flow guide structure, and a first inclined flow guide structure is installed at one end of the horizontal flow guide structure away from the vertical flow guide structure; After passing through the top inlet, the coolant enters the diversion area for diversion under the action of the inner flow guide structure, and then flows out from the first top outlet and the second top outlet respectively under the action of the first spoiler structure, the second spoiler structure and the inner flow guide structure, specifically including: After passing through the top inlet, the coolant enters the diversion area for diversion under the action of the vertical guide structure and the horizontal guide structure, flows to the first inclined guide structure, and flows out from the first top outlet and the second top outlet respectively under the action of the first inclined guide structure, the first spoiler structure, the second spoiler structure, the horizontal guide structure and the vertical guide structure; Further, the middle part of the heat sink includes a first middle part of the heat sink and a second middle part of the heat sink, and the side guide structure includes a second inclined guide structure and a third inclined guide structure; the middle part of the first heat sink is located between the first inlet and the first outlet, the middle part of the second heat sink is located between the second inlet and the second outlet, the second inclined guide structure is located at one end of the middle part of the first heat sink close to the first spoiler structure, and the third inclined guide structure is located at one end of the middle part of the second heat sink close to the second spoiler structure; The coolant enters the lower microchannel through the first inlet and the second inlet at the same time, enters the confluence area under the action of the middle and side guide structures of the heat sink, and then flows out from the first outlet and the second outlet respectively under the action of the first spoiler structure, the second spoiler structure and the side guide structure, specifically including: After passing through the first inlet, the coolant flows toward the second inclined flow guiding structure under the action of the middle part of the first heat sink, enters the confluence area, and then flows out from the first outlet under the action of the first spoiler structure, the second inclined flow guiding structure and the middle part of the first heat sink; After passing through the second inlet, the coolant flows toward the third inclined flow guide structure under the action of the middle part of the second heat sink, enters the confluence area, and then flows out from the second outlet under the action of the second spoiler structure, the third inclined flow guide structure and the middle part of the second heat sink.

[0007] The above technical solution has the following advantages or beneficial effects: In the first aspect, the present invention provides a double-layer microchannel radiator with an inclined guide structure. The double-layer structure greatly increases the contact area between the coolant and the inside of the radiator, so that heat can be more fully transferred from the heat source to the coolant; through the internal guide structure, the coolant directly impacts the heat sink base, and the jet impact is used to destroy the thermal boundary layer to improve the heat exchange efficiency, which can achieve efficient cooling of the heat source; through the side guide structure, the cross-sectional area of ​​the lower microchannel is suddenly reduced, and the coolant flow rate is sharply increased. At the same time, due to its proximity to the heat sink base, more heat is taken away, thereby improving the heat exchange efficiency; through the first spoiler structure and the second spoiler structure, the internal guide structure and the side guide structure can be separated, so that the flow of the coolant is more uniform, and the heat dissipation effect of each part is more balanced, which can meet the heat dissipation needs of high-power electronic devices.

[0008] Furthermore, vertical guide structures are installed at both ends of the bottom of the top inlet, and their function is to guide the coolant to directly impact the heat sink base, utilize jet impact to destroy the thermal boundary layer to improve the heat exchange efficiency, and achieve efficient cooling of the heat source; by forming a diversion area between the horizontal guide structure and the heat sink base, the coolant after impacting the heat sink base can be guided to the lower microchannel, and further encounter the first inclined guide structure. The first inclined guide structure causes the cross-sectional area of ​​the lower microchannel to drop sharply, thereby increasing the flow rate of the coolant, enhancing convective heat transfer, and then turns back to the upper microchannel to generate vortices to enhance heat dissipation.

[0009] Furthermore, by setting the included angle between the first inclined flow-guiding structure and the vertical plane of the horizontal flow-guiding structure, the heat exchange effect can be further enhanced and the uniformity of temperature distribution can be improved.

[0010] Furthermore, through the second inclined flow guiding structure and the third inclined flow guiding structure, the cross-sectional area of ​​the lower microchannel is suddenly reduced, and the flow rate of the coolant is sharply increased. At the same time, due to being close to the heat sink base, more heat is taken away, thereby enhancing the heat exchange efficiency.

[0011] Furthermore, by setting the angle between the second inclined flow guide structure and the vertical plane in the middle of the first heat sink to 0°~60°, the coolant generates a lateral velocity component when flowing through the second inclined flow guide structure, thereby enhancing the turbulence intensity and significantly improving the heat exchange efficiency; at the same time, the second inclined flow guide structure can control the flow and velocity of the coolant and improve the uniformity of the temperature distribution.

[0012] Furthermore, by setting the angle between the third inclined flow guide structure and the vertical plane in the middle of the second heat sink to 0°~60°, the coolant generates a lateral velocity component when flowing through the third inclined flow guide structure, thereby enhancing the turbulence intensity and significantly improving the heat exchange efficiency; at the same time, the third inclined flow guide structure can control the flow rate and velocity of the coolant and improve the uniformity of the temperature distribution.

[0013] Furthermore, by setting the first spoiler structure and the second spoiler structure at 90 degrees vertically, the fluid disturbance is enhanced, the process is simplified, the thermal stress is dispersed, and the heat exchange efficiency and reliability of the double-layer microchannel radiator are significantly improved.

[0014] In the second aspect, the present invention provides a double-layer microchannel heat dissipation method with an inclined guide structure, which increases the flow rate of the coolant through the top inlet, the first inlet and the second inlet, and combines the flow field optimization of the diversion area and the confluence area to greatly improve the heat transfer coefficient; the coolant is directly impacted by the inner guide structure to destroy the thermal boundary layer by jet impact to improve the heat transfer efficiency, and can achieve efficient cooling of the heat source; vortices are formed under the action of the first spoiler structure, the second spoiler structure, the inner guide structure and the side guide structure, further improving the heat transfer efficiency.

[0015] Furthermore, after the coolant enters the upper microchannel through the top inlet, it enters the lower microchannel in the form of an impact jet through the vertical guide structure, directly impacts the heat sink base, and enters the diversion area, achieving the first efficient cooling of the heat source, and utilizing the jet impact to destroy the thermal boundary layer to improve the heat exchange efficiency. Then, under the action of the first inclined guide structure, the cross-sectional area of ​​the lower microchannel is suddenly reduced, and the coolant flow rate is sharply increased. At the same time, due to its proximity to the heat sink base, more heat is taken away, and under the action of the first inclined guide structure, the first spoiler structure, the second spoiler structure, the horizontal guide structure, and the vertical guide structure, it is turned back to the upper microchannel to form a vortex, which significantly enhances the heat exchange efficiency.

[0016] Furthermore, the coolant enters the lower microchannel through the first inlet and the second inlet at the same time. After passing through the first inlet, the coolant flows to the second inclined guide structure under the action of the middle part of the first heat sink. After passing through the second inlet, the coolant flows to the third inclined guide structure under the action of the middle part of the second heat sink. By hitting the second inclined guide structure and the third inclined guide structure, the cross-sectional area of ​​the lower microchannel is suddenly reduced, so that the flow rate of the coolant increases, thereby enhancing the convective heat transfer. Then, the coolant enters the confluence area, and turns back to the upper microchannel under the action of the first spoiler structure, the second inclined guide structure, the middle part of the first heat sink, the second spoiler structure, the third inclined guide structure and the middle part of the second heat sink, thereby forming a vortex, which significantly enhances the heat exchange efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a structural schematic diagram of a double-layer microchannel radiator with an inclined flow-guiding structure according to the present invention; Figure 2 For the present invention Figure 1 A partial schematic diagram of the middle part; Figure 3 is a cross-sectional view of embodiment 1 of the present invention; Figure 4 For the present invention Figure 3 A partial schematic diagram of B in the middle; Figure 5 The heat sink base temperature cloud diagram of Example 1 of the present invention; Figure 6 is a cross-sectional view of embodiment 2 of the present invention; Figure 7 For the present invention Figure 6 A partial schematic diagram of C in the middle; Figure 8 The heat sink base temperature cloud diagram of Example 2 of the present invention; Fig. 9 The velocity cloud diagram of the coolant in the cross section along the y-axis of Example 2 of the present invention; Fig.10 is a cross-sectional view of embodiment 3 of the present invention; Fig.11 For the present invention Fig.10 A partial schematic diagram of D in the middle; Fig.12 The heat sink base temperature cloud diagram of Example 3 of the present invention; In the figure, 1-the middle of the first heat sink; 2-the vertical guide structure; 3-the confluence area; 4-the diversion area; 5-the first spoiler structure; 6-the top inlet; 7-the first inlet; 8-the first outlet; 9-the top of the heat sink; 10-the base of the heat sink; 11-the first baffle; 12-the second baffle; 13-the middle of the second heat sink; 14-the second inclined guide structure; 15-the third inclined guide structure; 21-the horizontal guide structure; 22-the first inclined guide structure; 51-the second spoiler structure; 61-the first top outlet; 62-the second top outlet; 71-the second inlet; 81-the second outlet. DETAILED DESCRIPTION

[0018] The present invention is further described in detail below in conjunction with specific embodiments, which are intended to explain the present invention rather than to limit it. In order to enable those skilled in the art to better understand the scheme of the present invention, the technical scheme in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present invention. It should be noted that the terms "first", "second", etc. in the specification and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged where appropriate, so that the embodiments of the present invention described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units that are clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0019] Embodiment 1: See also Figure 1 and Figure 2 The present invention provides a double-layer microchannel heat sink with an inclined flow guide structure, comprising a heat sink base 10, a heat sink middle part, a side flow guide structure, a first spoiler structure 5, an inner flow guide structure, a second spoiler structure 51, a heat sink top 9, a top inlet 6, a first top outlet 61, a second top outlet 62, a first inlet 7, a second inlet 71, a first outlet 8 and a second outlet 81; the inner flow guide structure comprises a vertical flow guide structure 2, a horizontal flow guide structure 21 and a first inclined flow guide structure 22; the heat sink middle part comprises a first heat sink middle part 1 and a second heat sink middle part 13; the side flow guide structure comprises a second inclined flow guide structure 14 and a third inclined flow guide structure 15; The heat sink base 10 and the two ends of the middle part of the heat sink are connected by 26 first baffles 11, and 25 lower microchannels are formed between two adjacent first baffles 11; the heat sink middle part and the two ends of the heat sink top 9 are connected by 26 second baffles 12, and 25 upper microchannels are formed between two adjacent second baffles 12; a top inlet 6 is opened at the top of each upper microchannel, and the top inlet 6 is located at the top 9 of the heat sink. The two ends of the bottom of the top inlet 6 are respectively installed with inner guide structures, and the inner guide structure includes a vertical guide structure 2 installed at the two ends of the bottom of the top inlet 6, the vertical guide structure 2 is located at the bottom of the top 9 of the heat sink, and a horizontal guide structure 21 is installed at the bottom of the vertical guide structure 2. The end of the horizontal guide structure 21 away from the vertical guide structure 2 is installed with a first inclined guide structure 22, and a diversion area 4 is formed between the vertical guide structure 2, the horizontal guide structure 21 and the first inclined guide structure 22 and the heat sink base 10, and a first top outlet 61 and a second top outlet 62 are respectively opened at the two ends of the top inlet 6; A first spoiler structure 5 and a second spoiler structure 51 are symmetrically installed between the top of each upper microchannel and the bottom of the lower microchannel, and the inner guide structure is located between the first spoiler structure 5 and the second spoiler structure 51; each lower microchannel has a first inlet 7 at one end close to the first spoiler structure 5, and a second inlet 71 at one end close to the second spoiler structure 51; each upper microchannel has a first outlet 8 at one end close to the first spoiler structure 5, and a second outlet 81 at one end close to the second spoiler structure 51; a side guide structure is installed on the middle part of the heat sink, the middle part 1 of the first heat sink is located between the first inlet 7 and the first outlet 8, the middle part 13 of the second heat sink is located between the second inlet 71 and the second outlet 81, the second inclined guide structure 14 is located at one end of the middle part 1 of the first heat sink close to the first spoiler structure 5, the third inclined guide structure 15 is located at one end of the middle part 13 of the second heat sink close to the second spoiler structure 51, and the second inclined guide structure 14 and the third inclined guide structure 15 respectively form a confluence area 3 with the heat sink base 10; Preferably, see Figure 3 and Figure 4 , the angle a between the first inclined flow guiding structure 22 and the vertical plane of the horizontal flow guiding structure 21 is 0°, the angle between the second inclined flow guiding structure 14 and the vertical plane of the middle part 1 of the first heat sink is 0°, and the angle between the third inclined flow guiding structure 15 and the vertical plane of the middle part 13 of the second heat sink is 0°; Preferably, the angles between the first spoiler structure 5 and the second spoiler structure 51 and the heat sink base 10 and the heat sink top 9 are all 90°; Preferably, the first inclined flow guiding structure 22, the second inclined flow guiding structure 14 and the third inclined flow guiding structure 15 are hexahedral structures with parallelogram cross sections, and the cross-sectional dimensions are 0.5 mm×0.4 mm×0.2 mm.

[0020] See also Figure 3 The present application also provides a double-layer microchannel heat dissipation method with an inclined guide structure, comprising the following steps: Step 1, introducing coolant into the top inlet 6, the first inlet 7 and the second inlet 71 simultaneously; Step 2: After the coolant enters the upper microchannel through the top inlet 6, it enters the lower microchannel in an impact jet manner through the vertical guide structure 2, directly impacts the heat sink base 10, and enters the diversion area 4 to achieve the first efficient cooling of the heat source. Then, it is diverted under the action of the horizontal guide structure 21 and flows to the first inclined guide structure 22 with a vertical plane angle of 0° with the horizontal guide structure 21. Under the action of the first inclined guide structure 22, the cross-sectional area of ​​the lower microchannel decreases suddenly, and the coolant flow rate increases sharply. At the same time, due to its proximity to the heat sink base, more heat is taken away, achieving the second efficient cooling of the heat source. Under the action of the first inclined guide structure 22, the first spoiler structure 5, the second spoiler structure 51, the horizontal guide structure 21 and the vertical guide structure 2, it turns back to the upper microchannel to form a vortex, and flows out from the first top outlet 61 and the second top outlet 62 respectively; Step 3: The coolant enters the lower microchannel through the first inlet 7 and the second inlet 71 at the same time. After passing through the first inlet 7, the coolant flows to the second inclined guide structure 14 with a vertical plane angle of 0° with the first heat sink middle part 1 under the action of the first heat sink middle part 1. Under the action of the second inclined guide structure 14, the cross-sectional area of ​​the lower microchannel decreases suddenly, so that the flow rate of the coolant increases, and the convective heat transfer is enhanced. Then, the coolant enters the confluence area 3, and returns to the upper microchannel under the action of the first spoiler structure 5, the second inclined guide structure 14 and the first heat sink middle part 1, forming a heat transfer zone. The coolant forms a vortex and flows out from the first outlet 8; after passing through the second inlet 71, the coolant flows to the third inclined guide structure 15 with a vertical plane angle of 0° with the second heat sink middle part 13 under the action of the second heat sink middle part 13. Under the action of the third inclined guide structure 15, the cross-sectional area of ​​the lower microchannel decreases suddenly, which increases the flow rate of the coolant and enhances the convective heat transfer. Then, the coolant enters the confluence area 3 and turns back to the upper microchannel under the action of the second spoiler structure 51, the third inclined guide structure 15 and the second heat sink middle part 13, forming a vortex and flowing out from the second outlet 81.

[0021] See also Figure 5 In this embodiment 1, the temperature of the heat sink base 10 is controlled at 331.5 K.

[0022] Embodiment 2: See also Figure 1 and Figure 2The present invention provides a double-layer microchannel heat sink with an inclined flow guide structure, comprising a heat sink base 10, a heat sink middle part, a side flow guide structure, a first spoiler structure 5, an inner flow guide structure, a second spoiler structure 51, a heat sink top 9, a top inlet 6, a first top outlet 61, a second top outlet 62, a first inlet 7, a second inlet 71, a first outlet 8 and a second outlet 81; the inner flow guide structure comprises a vertical flow guide structure 2, a horizontal flow guide structure 21 and a first inclined flow guide structure 22; the heat sink middle part comprises a first heat sink middle part 1 and a second heat sink middle part 13; the side flow guide structure comprises a second inclined flow guide structure 14 and a third inclined flow guide structure 15; The heat sink base 10 and the two ends of the middle part of the heat sink are connected by 26 first baffles 11, and 25 lower microchannels are formed between two adjacent first baffles 11; the heat sink middle part and the two ends of the heat sink top 9 are connected by 26 second baffles 12, and 25 upper microchannels are formed between two adjacent second baffles 12; a top inlet 6 is opened at the top of each upper microchannel, and the top inlet 6 is located at the top 9 of the heat sink. The two ends of the bottom of the top inlet 6 are respectively installed with inner guide structures, and the inner guide structure includes a vertical guide structure 2 installed at the two ends of the bottom of the top inlet 6, the vertical guide structure 2 is located at the bottom of the top 9 of the heat sink, and a horizontal guide structure 21 is installed at the bottom of the vertical guide structure 2. The end of the horizontal guide structure 21 away from the vertical guide structure 2 is installed with a first inclined guide structure 22, and a diversion area 4 is formed between the vertical guide structure 2, the horizontal guide structure 21 and the first inclined guide structure 22 and the heat sink base 10, and a first top outlet 61 and a second top outlet 62 are respectively opened at the two ends of the top inlet 6; A first spoiler structure 5 and a second spoiler structure 51 are symmetrically installed between the top of each upper microchannel and the bottom of the lower microchannel, and the inner guide structure is located between the first spoiler structure 5 and the second spoiler structure 51; each lower microchannel has a first inlet 7 at one end close to the first spoiler structure 5, and a second inlet 71 at one end close to the second spoiler structure 51; each upper microchannel has a first outlet 8 at one end close to the first spoiler structure 5, and a second outlet 81 at one end close to the second spoiler structure 51; a side guide structure is installed on the middle part of the heat sink, the middle part 1 of the first heat sink is located between the first inlet 7 and the first outlet 8, the middle part 13 of the second heat sink is located between the second inlet 71 and the second outlet 81, the second inclined guide structure 14 is located at one end of the middle part 1 of the first heat sink close to the first spoiler structure 5, the third inclined guide structure 15 is located at one end of the middle part 13 of the second heat sink close to the second spoiler structure 51, and the second inclined guide structure 14 and the third inclined guide structure 15 respectively form a confluence area 3 with the heat sink base 10; Preferably, see Figure 6 and Figure 7, the angle a between the first inclined flow guiding structure 22 and the vertical plane of the horizontal flow guiding structure 21 is 30°, the angle between the second inclined flow guiding structure 14 and the vertical plane of the middle part 1 of the first heat sink is 30°, and the angle between the third inclined flow guiding structure 15 and the vertical plane of the middle part 13 of the second heat sink is 30°; Preferably, the angles between the first spoiler structure 5 and the second spoiler structure 51 and the heat sink base 10 and the heat sink top 9 are both 90°; Preferably, the first inclined flow guiding structure 22, the second inclined flow guiding structure 14 and the third inclined flow guiding structure 15 are hexahedral structures with parallelogram cross sections, and the cross-sectional dimensions are 0.5 mm×0.4 mm×0.2 mm.

[0023] See also Figure 6 The present application also provides a double-layer microchannel heat dissipation method with an inclined guide structure, comprising the following steps: Step 1, introducing coolant into the top inlet 6, the first inlet 7 and the second inlet 71 simultaneously; Step 2: After the coolant enters the upper microchannel through the top inlet 6, it enters the lower microchannel in an impact jet manner through the vertical guide structure 2, directly impacts the heat sink base 10, and enters the diversion area 4 to achieve the first efficient cooling of the heat source. Then, it is diverted under the action of the horizontal guide structure 21 and flows to the first inclined guide structure 22 with a vertical plane angle of 30° with the horizontal guide structure 21. Under the action of the first inclined guide structure 22, the cross-sectional area of ​​the lower microchannel decreases suddenly, and the coolant flow rate increases sharply. At the same time, due to its proximity to the heat sink base, more heat is taken away, achieving the second efficient cooling of the heat source. Under the action of the first inclined guide structure 22, the first spoiler structure 5, the second spoiler structure 51, the horizontal guide structure 21 and the vertical guide structure 2, it turns back to the upper microchannel to form a vortex, and flows out from the first top outlet 61 and the second top outlet 62 respectively. Step 3: The coolant enters the lower microchannel through the first inlet 7 and the second inlet 71 at the same time. After passing through the first inlet 7, the coolant flows to the second inclined guide structure 14 with a vertical plane angle of 30° with the first heat sink middle part 1 under the action of the first heat sink middle part 1. Under the action of the second inclined guide structure 14, the cross-sectional area of ​​the lower microchannel decreases suddenly, so that the flow rate of the coolant increases, and the convective heat transfer is enhanced. Then, the coolant enters the confluence area 3, and returns to the upper microchannel under the action of the first spoiler structure 5, the second inclined guide structure 14 and the first heat sink middle part 1, forming a The coolant forms a vortex and flows out from the first outlet 8; after passing through the second inlet 71, the coolant flows to the third inclined guide structure 15 with a vertical plane angle of 30° with the second heat sink middle part 13 under the action of the second heat sink middle part 13. Under the action of the third inclined guide structure 15, the cross-sectional area of ​​the lower microchannel decreases suddenly, which increases the flow rate of the coolant and enhances the convective heat transfer. Then, the coolant enters the confluence area 3 and turns back to the upper microchannel under the action of the second spoiler structure 51, the third inclined guide structure 15 and the second heat sink middle part 13, forming a vortex and flowing out from the second outlet 81.

[0024] See also Figure 8 and Fig. 9 By adjusting the angle between the first inclined flow guide structure 22 and the vertical plane of the horizontal flow guide structure 21, the angle between the second inclined flow guide structure 14 and the vertical plane of the middle part 1 of the first heat sink, and the angle between the third inclined flow guide structure 15 and the vertical plane of the middle part 13 of the second heat sink, the temperature distribution in the upper microchannel and the lower microchannel is affected. 30° has a more obvious effect on reducing the temperature of the heat sink base 10. The generation of eddy currents further improves the heat dissipation performance of the radiator of the present invention, takes away more heat, and makes the base temperature rarely reach 331.5 K.

[0025] Embodiment 3: See also Figure 1 and Figure 2 The present invention provides a double-layer microchannel heat sink with an inclined flow guide structure, comprising a heat sink base 10, a heat sink middle part, a side flow guide structure, a first spoiler structure 5, an inner flow guide structure, a second spoiler structure 51, a heat sink top 9, a top inlet 6, a first top outlet 61, a second top outlet 62, a first inlet 7, a second inlet 71, a first outlet 8 and a second outlet 81; the inner flow guide structure comprises a vertical flow guide structure 2, a horizontal flow guide structure 21 and a first inclined flow guide structure 22; the heat sink middle part comprises a first heat sink middle part 1 and a second heat sink middle part 13; the side flow guide structure comprises a second inclined flow guide structure 14 and a third inclined flow guide structure 15; The heat sink base 10 and the two ends of the middle part of the heat sink are connected by 26 first baffles 11, and 25 lower microchannels are formed between two adjacent first baffles 11; the heat sink middle part and the two ends of the heat sink top 9 are connected by 26 second baffles 12, and 25 upper microchannels are formed between two adjacent second baffles 12; a top inlet 6 is opened at the top of each upper microchannel, and the top inlet 6 is located at the top 9 of the heat sink. The two ends of the bottom of the top inlet 6 are respectively installed with inner guide structures, and the inner guide structure includes a vertical guide structure 2 installed at the two ends of the bottom of the top inlet 6, the vertical guide structure 2 is located at the bottom of the top 9 of the heat sink, and a horizontal guide structure 21 is installed at the bottom of the vertical guide structure 2. The end of the horizontal guide structure 21 away from the vertical guide structure 2 is installed with a first inclined guide structure 22, and a diversion area 4 is formed between the vertical guide structure 2, the horizontal guide structure 21 and the first inclined guide structure 22 and the heat sink base 10, and a first top outlet 61 and a second top outlet 62 are respectively opened at the two ends of the top inlet 6; A first spoiler structure 5 and a second spoiler structure 51 are symmetrically installed between the top of each upper microchannel and the bottom of the lower microchannel, and the inner guide structure is located between the first spoiler structure 5 and the second spoiler structure 51; each lower microchannel has a first inlet 7 at one end close to the first spoiler structure 5, and a second inlet 71 at one end close to the second spoiler structure 51; each upper microchannel has a first outlet 8 at one end close to the first spoiler structure 5, and a second outlet 81 at one end close to the second spoiler structure 51; a side guide structure is installed on the middle part of the heat sink, the middle part 1 of the first heat sink is located between the first inlet 7 and the first outlet 8, the middle part 13 of the second heat sink is located between the second inlet 71 and the second outlet 81, the second inclined guide structure 14 is located at one end of the middle part 1 of the first heat sink close to the first spoiler structure 5, the third inclined guide structure 15 is located at one end of the middle part 13 of the second heat sink close to the second spoiler structure 51, and the second inclined guide structure 14 and the third inclined guide structure 15 respectively form a confluence area 3 with the heat sink base 10; Preferably, see Fig.10 and Fig.11 , the angle a between the first inclined flow guiding structure 22 and the vertical plane of the horizontal flow guiding structure 21 is 60°, the angle between the second inclined flow guiding structure 14 and the vertical plane of the middle part 1 of the first heat sink is 60°, and the angle between the third inclined flow guiding structure 15 and the vertical plane of the middle part 13 of the second heat sink is 60°; Preferably, the angles between the first spoiler structure 5 and the second spoiler structure 51 and the heat sink base 10 and the heat sink top 9 are all 90°; Preferably, the first inclined flow guiding structure 22, the second inclined flow guiding structure 14 and the third inclined flow guiding structure 15 are hexahedral structures with parallelogram cross sections, and the cross-sectional dimensions are 0.5 mm×0.4 mm×0.2 mm.

[0026] See also Fig.10 The present application also provides a double-layer microchannel heat dissipation method with an inclined guide structure, comprising the following steps: Step 1, introducing coolant into the top inlet 6, the first inlet 7 and the second inlet 71 simultaneously; Step 2: After the coolant enters the upper microchannel through the top inlet 6, it enters the lower microchannel in an impact jet manner through the vertical guide structure 2, directly impacts the heat sink base 10, and enters the diversion area 4 to achieve the first efficient cooling of the heat source. Then, it is diverted under the action of the horizontal guide structure 21 and flows to the first inclined guide structure 22 with a plumb plane angle of 60° with the horizontal guide structure 21. Under the action of the first inclined guide structure 22, the cross-sectional area of ​​the lower microchannel decreases suddenly, and the coolant flow rate increases sharply. At the same time, due to its proximity to the heat sink base, more heat is taken away, achieving the second efficient cooling of the heat source. Under the action of the first inclined guide structure 22, the first spoiler structure 5, the second spoiler structure 51, the horizontal guide structure 21 and the vertical guide structure 2, it turns back to the upper microchannel to form a vortex, and flows out from the first top outlet 61 and the second top outlet 62 respectively. Step 3: The coolant enters the lower microchannel through the first inlet 7 and the second inlet 71 at the same time. After passing through the first inlet 7, the coolant flows to the second inclined flow guide structure 14 with a vertical plane angle of 60° with the first heat sink middle part 1 under the action of the first heat sink middle part 1. Under the action of the second inclined flow guide structure 14, the cross-sectional area of ​​the lower microchannel decreases suddenly, so that the flow rate of the coolant increases, and the convective heat transfer is enhanced. Then, the coolant enters the confluence area 3, and returns to the upper microchannel under the action of the first spoiler structure 5, the second inclined flow guide structure 14 and the first heat sink middle part 1, forming a heat transfer device. The coolant forms a vortex and flows out from the first outlet 8; after passing through the second inlet 71, the coolant flows to the third inclined guide structure 15 with a vertical plane angle of 60° with the second heat sink middle part 13 under the action of the second heat sink middle part 13. Under the action of the third inclined guide structure 15, the cross-sectional area of ​​the lower microchannel decreases suddenly, which increases the flow rate of the coolant and enhances the convective heat transfer. Then, the coolant enters the confluence area 3 and turns back to the upper microchannel under the action of the second spoiler structure 51, the third inclined guide structure 15 and the second heat sink middle part 13, forming a vortex and flowing out from the second outlet 81.

[0027] See also Fig.12 By adjusting the angle between the first inclined flow guide structure 22 and the vertical plane of the horizontal flow guide structure 21, the angle between the second inclined flow guide structure 14 and the vertical plane of the middle part 1 of the first heat sink, and the angle between the third inclined flow guide structure 15 and the vertical plane of the middle part 13 of the second heat sink, the temperature distribution in the upper microchannel and the lower microchannel is affected, and the generation of eddy currents further improves the heat dissipation performance of the radiator of the present invention and takes away more heat.

[0028] The performance of the double-layer microchannel heat sink with an inclined flow guide structure of the present invention is evaluated through simulation and experimental verification. The temperature, flow characteristics and working conditions are systematically analyzed. Nu , inlet Reynolds number , temperature cloud map and speed cloud map as performance evaluation indicators, the specific formula includes: ; ; In the formula, h represents the convective heat transfer coefficient; represents the hydraulic diameter; represents the thermal conductivity of the fluid; represents the average velocity of the coolant at the inlet; Indicates the density of the coolant; Indicates the dynamic viscosity of the coolant; Computational fluid dynamics software was used for three-dimensional numerical simulation. The solid wall material in the model was copper-molybdenum alloy, the coolant was deionized water, the finite volume method was used to discretize the control equations, and the SIMPLEC (Semi-Implicit Method for Pressure Linked Equations) algorithm was used to calculate the pressure and velocity of the coolant. The convection term was spatially discretized using the second-order upwind format, and the diffusion term was discretized using the second-order central difference format. When the residual value of the variable was less than When , the numerical solution is considered to converge; then the selective laser melting technology (SLM) and 3D (Three-Dimensional) high-precision micromachining process are introduced to process the microchannel structure, and the laser 3D printer is selected as the main equipment to realize the integrated molding of the double-layer microchannel heat sink with an inclined guide structure of the present invention.

[0029] The forming principle of selective laser melting technology is laser selective melting, layer-by-layer accumulation and powder bed support. Laser selective melting specifically uses a high-power fiber laser, usually 200 W-1000 W, with a focused spot diameter of about 20-100 Under the protection of inert gas, the metal powder is melted point by point and solidified into a shape. The laser energy completely melts the powder to form a dense metal molten pool, which is metallurgically bonded with the solidified part of the lower layer after cooling. Layer-by-layer stacking is specifically to divide the 3D model into thin layers (the thickness of the thin layer is usually 20-50) through slicing software. ), the laser scans along the contour path of each layer and stacks them layer by layer to form the part; powder bed support specifically uses the unmelted powder as a temporary support, reducing the support requirements for complex structures, but the overhanging part still needs to be designed with a support structure to prevent deformation.

[0030] The forming process of selective laser melting technology is pre-processing, printing process and post-processing. The pre-processing is specifically: model preparation, that is, 3D model design, which needs to consider support structure and thermal deformation compensation; slicing and layering, generating laser scanning paths (common filling strategies are stripe scanning and chessboard scanning); substrate pre-processing, that is, preheating metal substrates (such as titanium alloy and stainless steel substrates) to reduce residual stress; the printing process is specifically powder spreading, that is, using a scraper or roller to evenly spread a thin layer of metal powder (the particle size of the powder is 15-45) on the forming cylinder. ); laser scanning, that is, using laser to selectively melt powder according to the current layer path, the molten pool quickly solidifies to form a solid, and the quality of the melt path is accurately controlled by scanning speed (1-10 m / s), power and spacing; layer-by-layer repetition, that is, the molding cylinder drops one layer, the powder supply cylinder rises, and the powder spreading system re-spreads powder, and the cycle continues until the part is completed. Post-processing is specifically: removing the part, that is, removing the part from the powder bed and removing the unmelted powder (recyclable); removing the support, that is, separating the substrate by wire cutting, and using mechanical or chemical methods to remove the support structure; heat treatment, that is, eliminating internal stress by annealing; surface treatment, that is, improving the surface quality by sandblasting, polishing, machining, etc.

[0031] The experimental system consists of a digital peristaltic pump, a thermometer, a power transformer, a circulating water bath, a data acquisition system, etc., wherein the digital peristaltic pump is responsible for regulating the coolant flow rate of the top inlet 6, the first inlet 7 and the second inlet 71, and the circulating water bath is used to control the temperature of the coolant to achieve fast and accurate temperature control. The present invention verifies the correctness of the simulation results through experiments, and the simulation experimental data is shown in Table 1.

[0032] Table 1 Simulation experiment data table

[0033] In the table, v Indicates the flow rate of the coolant; Re in represents the inlet Reynolds number; R represents the contact thermal resistance; △T Indicates the temperature difference between the highest temperature and the lowest temperature of the heat sink base 10; h represents the convective heat transfer coefficient; Nu represents the Nusselt number; represents the average temperature of the coolant from the first inlet 7 to the first outlet 8 or the average temperature of the coolant from the second inlet 71 to the second outlet 81; It represents the average temperature of the coolant from the top inlet 6 to the first top outlet 61 and the second top outlet 62 .

[0034] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A double-layer microchannel radiator with an inclined flow-guiding structure, characterized in that: The heat sink comprises a heat sink base (10), a heat sink middle portion and a heat sink top portion (9); the heat sink base (10) and the two ends of the heat sink middle portion are connected via a plurality of first baffles (11), and a plurality of lower microchannels are formed between two adjacent first baffles (11); the heat sink middle portion and the two ends of the heat sink top portion (9) are connected via a plurality of second baffles (12), and a plurality of upper microchannels are formed between two adjacent second baffles (12); A top inlet (6) is provided at the top of each upper microchannel, the top inlet (6) is located at the top of the heat sink (9), inner flow guide structures are respectively installed at both ends of the bottom of the top inlet (6), the inner flow guide structure is located at the bottom of the top of the heat sink (9), a flow diversion area (4) is formed between the inner flow guide structure and the heat sink base (10), and a first top outlet (61) and a second top outlet (62) are respectively provided at both ends of the top inlet (6); a first flow spoiler structure (5) and a second flow spoiler structure (51) are symmetrically installed between the top of each upper microchannel and the bottom of the lower microchannel, the inner flow guide structure is located between the first flow spoiler structure (5) and the second flow spoiler structure (51); Each lower layer microchannel has a first inlet (7) at one end close to the first spoiler structure (5), and a second inlet (71) at one end close to the second spoiler structure (51); each upper layer microchannel has a first outlet (8) at one end close to the first spoiler structure (5), and a second outlet (81) at one end close to the second spoiler structure (51); a side guide structure is installed on the middle part of the heat sink, and a confluence area (3) is formed between the side guide structure and the heat sink base (10).

2. A double-layer microchannel radiator with an inclined flow-guiding structure according to claim 1, characterized in that: The internal flow guide structure comprises vertical flow guide structures (2) installed at both ends of the bottom of the top inlet (6), the vertical flow guide structure (2) being located at the bottom of the heat sink top (9), a horizontal flow guide structure (21) being installed at the bottom of the vertical flow guide structure (2), and a first inclined flow guide structure (22) being installed at one end of the horizontal flow guide structure (21) away from the vertical flow guide structure (2).

3. A double-layer microchannel radiator with an inclined flow-guiding structure according to claim 2, characterized in that: The included angle a between the first inclined flow guiding structure (22) and the vertical plane of the horizontal flow guiding structure (21) is 0° to 60°.

4. The double-layer microchannel radiator with an inclined flow-guiding structure according to claim 1, characterized in that: The heat sink middle portion comprises a first heat sink middle portion (1) and a second heat sink middle portion (13), and the side flow guide structure comprises a second inclined flow guide structure (14) and a third inclined flow guide structure (15); The middle portion (1) of the first heat sink is located between the first inlet (7) and the first outlet (8), the middle portion (13) of the second heat sink is located between the second inlet (71) and the second outlet (81), the second inclined flow guiding structure (14) is located at one end of the middle portion (1) of the first heat sink close to the first spoiler structure (5), the third inclined flow guiding structure (15) is located at one end of the middle portion (1) of the second heat sink close to the second spoiler structure (51), and the second inclined flow guiding structure (14) and the third inclined flow guiding structure (15) respectively form a confluence area (3) with the heat sink base (10).

5. A double-layer microchannel radiator with an inclined flow-guiding structure according to claim 4, characterized in that: The included angle between the second inclined flow guiding structure (14) and the vertical plane of the middle portion (1) of the first heat sink is 0° to 60°.

6. The double-layer microchannel radiator with an inclined flow-guiding structure according to claim 4, characterized in that: The included angle between the third inclined flow guiding structure (15) and the vertical plane of the middle portion (13) of the second heat sink is 0° to 60°.

7. The double-layer microchannel heat sink with an inclined flow-guiding structure according to claim 1, characterized in that: The included angles between the first spoiler structure (5) and the heat sink base (10) and the heat sink top (9) are both 90°; the included angles between the second spoiler structure (51) and the heat sink base (10) and the heat sink top (9) are both 90°.

8. A double-layer microchannel heat dissipation method with an inclined flow guiding structure, based on the double-layer microchannel heat sink with an inclined flow guiding structure as claimed in any one of claims 1 to 7, characterized in that: The following steps are involved: Simultaneously introducing a coolant into the top inlet (6), the first inlet (7) and the second inlet (71); After passing through the top inlet (6), the coolant enters the flow diversion area (4) for diversion under the action of the inner flow guide structure, and then flows out from the first top outlet (61) and the second top outlet (62) respectively under the action of the first spoiler structure (5), the second spoiler structure (51) and the inner flow guide structure; The coolant enters the lower microchannel through the first inlet (7) and the second inlet (71) at the same time, enters the confluence area (3) under the action of the middle and side guide structures of the heat sink, and then flows out from the first outlet (8) and the second outlet (81) respectively under the action of the first spoiler structure (5), the second spoiler structure (51) and the side guide structure.

9. A double-layer microchannel heat dissipation method with an inclined flow guiding structure according to claim 8, characterized in that: The inner flow guide structure comprises vertical flow guide structures (2) installed at both ends of the bottom of the top inlet (6), the vertical flow guide structure (2) being located at the bottom of the top (9) of the heat sink, a horizontal flow guide structure (21) being installed at the bottom of the vertical flow guide structure (2), and a first inclined flow guide structure (22) being installed at one end of the horizontal flow guide structure (21) away from the vertical flow guide structure (2); After passing through the top inlet (6), the coolant enters the flow diversion area (4) for diversion under the action of the inner flow guide structure, and then flows out from the first top outlet (61) and the second top outlet (62) respectively under the action of the first spoiler structure (5), the second spoiler structure (51) and the inner flow guide structure, specifically comprising: After passing through the top inlet (6), the coolant enters the diversion area (4) for diversion under the action of the vertical flow guide structure (2) and the horizontal flow guide structure (21), flows toward the first inclined flow guide structure (22), and flows out from the first top outlet (61) and the second top outlet (62) respectively under the action of the first inclined flow guide structure (22), the first spoiler structure (5), the second spoiler structure (51), the horizontal flow guide structure (21) and the vertical flow guide structure (2).

10. The double-layer microchannel heat dissipation method with an inclined flow guiding structure according to claim 8, characterized in that: The middle portion of the heat sink comprises a first middle portion of the heat sink (1) and a second middle portion of the heat sink (13), and the side flow guide structure comprises a second inclined flow guide structure (14) and a third inclined flow guide structure (15); the middle portion of the first heat sink (1) is located between the first inlet (7) and the first outlet (8), the middle portion of the second heat sink (13) is located between the second inlet (71) and the second outlet (81), the second inclined flow guide structure (14) is located at one end of the middle portion of the first heat sink (1) close to the first spoiler structure (5), and the third inclined flow guide structure (15) is located at one end of the middle portion of the second heat sink (13) close to the second spoiler structure (51); The coolant enters the lower microchannel through the first inlet (7) and the second inlet (71) at the same time, enters the confluence area (3) under the action of the middle and side guide structures of the heat sink, and then flows out from the first outlet (8) and the second outlet (81) respectively under the action of the first spoiler structure (5), the second spoiler structure (51) and the side guide structure, specifically comprising: After passing through the first inlet (7), the coolant flows toward the second inclined flow guiding structure (14) under the action of the first heat sink middle part (1), enters the confluence area (3), and then flows out from the first outlet (8) under the action of the first spoiler structure (5), the second inclined flow guiding structure (14) and the first heat sink middle part (1); After passing through the second inlet (71), the coolant flows toward the third inclined flow guide structure (15) under the action of the middle part (13) of the second heat sink, enters the confluence area (3), and then flows out from the second outlet (81) under the action of the second spoiler structure (51), the third inclined flow guide structure (15) and the middle part (13) of the second heat sink.

Images