Circuit board and electronic device

Abstract

The invention relates to a circuit board and an electronic device, which improve versatility and reduce cost. A circuit board on which a connector to which one end of an electronic module is connected is mounted, the circuit board including, on a surface thereof, a ground pad capable of affixing a first or second support member that supports the other end of the electronic module, the ground pad including: a first region formed of a metal pattern; a second region formed of a metal pattern having a smaller area than the first region; and a defect region that separates the first region from the second region by not providing a metal pattern, the ground pad being capable of selectively fixing the first support accommodated in the first region and the second support extending across the first region and the second region beyond the defect region. When the first support is fixed to the first region, the rotation direction of the first support is positioned in a fixed direction.

Description

Technical Field

[0001] The present invention relates to a circuit substrate and an electronic device equipped with the circuit substrate. Background Art

[0002] Electronic devices such as notebook PCs are used by connecting an electronic module such as an SSD to a connector of a circuit board (motherboard) on which a CPU is mounted (see, for example, Patent Document 1).

[0003] Patent Document 1: Japanese Patent Application Publication No. 2020-057737

[0004] As described in Patent Document 1, usually, one end of the electronic module is connected to a connector mounted on a circuit substrate, and the other end is fixed to the circuit substrate with a screw. The screw is fastened to a stud member having a threaded hole. The stud member is fixed to a ground pad formed on the surface of the circuit substrate by welding.

[0005] In addition to the case where an operator installs the electronic module at a factory, there is also a case where the user replaces the module by himself. In this case, the screw may fall into the housing, which may require time and effort to retrieve or may be lost.

[0006] Therefore, it is also considered to use components other than screws as supporting members for supporting the electronic module. As supporting members other than screws, there is, for example, a locking component having a cam-shaped component that rotates relative to the stud component. The locking component is used, for example, by switching between a locked position in which the other end of the electronic module is pressed and an unlocked position in which the other end is not pressed. However, such a locking component needs to control the rotation direction (setting posture) when fixed to the ground pad in a certain direction. This is because when the setting posture is uncertain, the locked position and the unlocked position are mixed when supporting the electronic module in a factory, etc., and the working efficiency is reduced.

[0007] On the other hand, the usual fixing method using screws is also very effective depending on the specifications and uses of the electronic device. However, when the ground pad provided on the circuit substrate is a dedicated component corresponding to only one support member, the versatility of the circuit substrate is reduced, and the product cost of the circuit substrate and the electronic device equipped with the circuit substrate is increased. Summary of the invention

[0008] The present invention has been made in consideration of the above-mentioned problems of the prior art, and an object of the present invention is to provide a circuit board capable of improving versatility and reducing costs, and an electronic device including the circuit board.

[0009] The circuit substrate involved in the first embodiment of the present invention is a circuit substrate for installing a connector connected to one end of an electronic module. The circuit substrate has a grounding pad on the surface, and the grounding pad can fix the first support member or the second support member that supports the other end of the electronic module. The grounding pad has: a first area, formed by a metal pattern; a second area, formed by a metal pattern with a smaller area than the first area; and a defect area, which separates the first area from the second area by not providing a metal pattern. The grounding pad can selectively fix the first support member accommodated in the first area and the second support member that exceeds the defect area and spans the first area and the second area, and when the first support member is fixed to the first area, the rotation direction of the first support member is positioned in a certain direction.

[0010] The electronic device involved in the second embodiment of the present invention is an electronic device having a circuit substrate connected to an electronic module, the circuit substrate comprising: a connector mounted on a surface and connected to one end of the electronic module; a grounding pad arranged on the surface; and a support member fixed to the grounding pad and supporting the other end of the electronic module, the grounding pad having: a first area formed by a metal pattern; a second area formed by a metal pattern with a smaller area than the first area; and a defective area separating the first area from the second area by not providing a metal pattern, the support member having a shape accommodated in the first area, and being fixed to the first area in a state where its rotation direction is positioned in a certain direction.

[0011] The electronic device involved in the third embodiment of the present invention is an electronic device having a circuit substrate connected to an electronic module, the circuit substrate comprising: a connector mounted on a surface and connected to one end of the electronic module; a grounding pad arranged on the surface; and a support member fixed to the grounding pad and supporting the other end of the electronic module, the grounding pad having: a first area formed by a metal pattern; a second area formed by a metal pattern with a smaller area than the first area; and a defect area separating the first area from the second area by not providing a metal pattern, the support member having a shape that exceeds the defect area and spans the first area and the second area, and is fixed to the first area and the second area at the same time.

[0012] According to the above aspects of the present invention, it is possible to improve versatility and reduce costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 This is a diagram showing an electronic device according to one embodiment when viewed from above.

[0014] Figure 2It is a top view schematically showing the internal structure of the housing.

[0015] Figure 3 is a schematic top view of a ground pad.

[0016] Figure 4 is a perspective view of the first support member.

[0017] Figure 5 is a perspective view of the second support member.

[0018] Fig. 6A It is a schematic plan view of a state where the first support member is fixed to the ground pad.

[0019] Figure 6B It means to make Fig. 6A A top view showing a state in which the support member is rotated to a locked position.

[0020] Fig. 7A It is a schematic plan view of a state where the stud member of the second support is fixed to the ground pad.

[0021] Figure 7B It means tighten the screws to Fig. 7A A top view of the state of the stud member is shown.

[0022] Figure 8 FIG. 1 is a schematic top view of a ground pad shown in a first modification example.

[0023] Fig. 9 FIG. 1 is a schematic top view of a ground pad shown in a second modification.

[0024] Description of Reference Numerals

[0025] 10…electronic device; 12…housing; 24…circuit substrate; 30…connector; 32, 33…electronic module; 40, 50, 52…ground pad; 40a…first region; 40b…second region; 40c…defective region; 42…first support member; 43…second support member; 44, 46…stud members; 45…support member; 47…screw. DETAILED DESCRIPTION

[0026] Hereinafter, preferred embodiments will be listed and the electronic device and the circuit device according to the present invention will be described in detail with reference to the accompanying drawings.

[0027] Figure 1 1 is a diagram showing an electronic device 10 according to an embodiment of the present invention as viewed from above. Figure 1As shown, the electronic device 10 of this embodiment is a clamshell notebook PC. The electronic device 10 is a structure in which a cover 11 and a housing 12 are connected by a hinge 14 so as to be relatively rotatable. In this embodiment, the electronic device 10 of a notebook PC is exemplified, and the electronic device may be a desktop PC, a tablet PC, a smart phone, or a portable game console, etc. in addition to the notebook PC.

[0028] The cover 11 has a thin flat box-shaped housing. The cover 11 carries a display 16. The display 16 is, for example, an organic EL display or a liquid crystal display.

[0029] The housing 12 is a thin flat box. The keyboard device 18 and the touchpad 19 face the upper surface (surface 12a) of the housing 12. In the following, the housing 12 and the components mounted thereon are described with reference to the posture of the operator operating the keyboard device 18, and the width direction (left and right) of the housing 12 is referred to as the X1 and X2 directions, the depth direction (front and back) of the housing 12 is referred to as the Y1 and Y2 directions, and the thickness direction (up and down) of the housing 12 is referred to as the Z1 and Z2 directions. Sometimes the X1 and X2 directions are collectively referred to as the X direction, and the same is true for the Y1 and Y2 directions and the Z1 and Z2 directions, which are sometimes referred to as the Y direction and the Z direction. These directions are directions specified for the convenience of description, and of course, they may also change depending on the usage status or setting posture of the electronic device 10.

[0030] The shell 12 is a shell formed by overlapping a first cover material 20 and a second cover material 21 in the thickness direction and detachably connecting them to each other. The first cover material 20 forms the upper surface and the surrounding sides of the shell 12, for example, and has a substantially bathtub shape. The second cover material 21 forms the lower surface of the shell 12, for example, and has a substantially flat plate shape. The hinge 14 is provided in a concave hinge configuration groove 12b formed at the rear edge of the shell 12, connecting the shell 12 and the cover body 11.

[0031] Figure 2 It is a plan view schematically showing the internal structure of the housing 12 . Figure 2 This is a diagram in which the second cover material 21 is removed and the interior of the first cover material 20 is viewed from the lower surface side.

[0032] like Figure 2 As shown, a circuit board 24, a cooling module 25, and a battery device 26 are accommodated in the housing 12. Various electronic components, mechanical components, and the like are also provided in the housing 12.

[0033] The circuit substrate 24 is a printed circuit substrate that becomes the motherboard of the electronic device 10. The circuit substrate 24 is arranged on the Y2 side of the housing 12 and extends in the X direction. The circuit substrate 24 is installed with a CPU (Central Processing Unit) 28 and a pair of connectors 30, 30. The CPU 28 is a processing device that performs operations related to the main control and processing of the electronic device 10. The connector 30 is in accordance with a prescribed connection standard, and in this embodiment, it is in accordance with the M.2 (M point two) standard. Electronic modules 32, 33 are connected to each connector 30. The specific structure of the circuit substrate 24, the electronic modules 32, 33 and their peripheral parts will be described later. Various electronic components such as a GPU (Graphics Processing Unit) and a memory can also be installed in the circuit substrate 24. For the circuit substrate 24, for example, the Z1 side surface (first surface 24a) becomes the mounting surface for the first cover material 20, and the Z2 side surface (second surface 24b) becomes the mounting surface for the CPU 28 and the connector 30. Of course, the shape and arrangement of the circuit board 24 and the electronic components mounted thereon are not limited to those described above.

[0034] The cooling module 25 can absorb the heat generated by the CPU 28 and discharge it to the outside of the housing 12. The cooling module 25 includes a heat pipe 34, a pair of heat sinks 35, 35, and a pair of fans 36, 36. The cooling module 25 can transfer the heat of the CPU 28 to each heat sink 35 through the heat pipe 34, and promote the heat dissipation of each heat sink 35 by the air supply from each fan 36.

[0035] The battery device 26 is a rechargeable battery that serves as a power source for the electronic device 10. The battery device 26 is disposed on the Y1 side of the circuit board 24 and extends in the X direction.

[0036] Next, a specific configuration example of the circuit board 24 and the electronic modules 32 and 33 and a support structure of the electronic modules 32 and 33 with respect to the circuit board 24 will be described.

[0037] First, the circuit board 24 is a printed circuit board having a predetermined conductive pattern formed on the second surface 24b of a plate material having insulating properties. The circuit board 24 may also have a structure in which conductive patterns are formed on both surfaces 24a and 24b.

[0038] like Figure 2 As shown, the circuit board 24 includes a connector 30 , a pair of ground pads 40 , 40 , and a pair of supports 42 , 43 .

[0039] The connector 30 is mounted on the second surface 24b. The mounting type of the connector 30 is not limited, and for example, an insertion mounting type (Pcie Gen3: PCI Express 3.0) or a board mounting type (Pcie Gen4: PCI Express 4.0) can be used.

[0040] Figure 3 is a schematic top view of the ground pad 40 .

[0041] The ground pad 40 is a portion of the support members 42 and 43 fixed by welding (see Figure 2 ).like Figure 3 As shown, the ground pad 40 has a first area 40a, a second area 40b and a defective area 40c. The first and second areas 40a, 40b are formed by metal patterns. The metal pattern is, for example, a copper foil formed by screen printing. The defective area 40c separates the areas 40a, 40b by not providing a metal pattern. Therefore, the support members 42, 43 will not be welded to the defective area 40c itself.

[0042] The ground pad 40 is formed by merging the regions 40a to 40c into a circle as a whole. The circle is not limited to a perfect circle, but includes a circle or an ellipse obtained by slightly distorting a perfect circle. The defective region 40c is formed into a strip shape passing through a position deviated from the center O of the circle constituting the ground pad 40.

[0043] The first region 40a is formed of a metal pattern having a larger area than the second region 40b. The first region 40a has a shape obtained by cutting a portion of a circle, for example, a substantially D shape. That is, the first region 40a has a linear cut line 40a1 at the boundary with the defect region 40c.

[0044] The second region 40b is formed of a metal pattern with a smaller area than the first region 40a. The second region 40b is the remaining cut end portion after cutting a part of a circle, and is a disk shape or a crescent shape with one side formed by a straight line. That is, the second region 40b has a straight cutting line 40b1 at the boundary with the defective region 40c on the opposite side of the arc forming the overall outer shape of the ground pad 40.

[0045] The defective region 40c is a strip-shaped straight portion having a predetermined width. The defective region 40c is a blank portion that is not welded when the first support member 42 is welded to the first region 40a and is used to prevent the first support member 42 from moving to the second region 40b. It is preferred that the width of the defective region 40c, that is, the width of the gap G between the regions 40a and 40b, is set to a distance such that the first support member 42 cannot move beyond the defective region 40c to the second region 40b when the first support member 42 described later is welded. For example, when the diameter of the circle constituting the ground pad 40 is 10 mm, the width of the gap G can be set to about 0.5 to 1.0 mm.

[0046] Figure 4 4 is a three-dimensional diagram of the first support member 42. Figure 2 as well as Figure 4 As shown, the first support member 42 has a stud member 44 and a support member 45. The first support member 42 is a locking component that can be switched between a locked position (closed position) capable of supporting the electronic module 32 and an unlocked position (open position) by reversing the cam-shaped support member 45 by, for example, 180 degrees.

[0047] The stud member 44 is a metal component having a flange 44a and a shaft 44b. The flange 44a is a metal circular plate having a shape obtained by cutting a part of a circle at a cut surface 44a1. The outer shape of the flange 44a is roughly similar to the outer shape of the first region 40a, and is the same as or slightly smaller than the outer shape of the first region 40a. In other words, the flange 44a is a circular plate having a roughly D shape having the same outline as the first region 40a, and is a shape accommodated in the first region 40a. The shaft 44b is a column formed integrally with the flange 44a and rising from the center of the flange 44a in the Z direction.

[0048] The supporting member (locking member) 45 is a metal member having a rotating shaft portion 45a and a locking portion 45b. The rotating shaft portion 45a is a cylindrical body that can be relatively rotatably inserted on the shaft 44b. The locking portion 45b is fixed to the Z2 side end surface of the rotating shaft portion 45a and can rotate around the axis of the shaft 44b together with the rotating shaft portion 45a. The locking portion 45b has, for example, a shape formed by merging two semicircular metal plates of different sizes. More specifically, the locking portion 45b has a roughly cam shape or a roughly mushroom shape when viewed from above. The small diameter portion of the locking portion 45b is fixed to the shaft 44b, and an operating hole 45b1 is formed at its center. The operating hole 45b1 is, for example, a cross hole for a tool such as a cross screw driver to engage for rotational operation. The large diameter portion of the locking portion 45b is formed integrally with the small diameter portion and can rotate around the axis of the shaft 44b.

[0049] The Z-direction height of the shaft 44b, i.e., the distance from the Z2-side surface of the flange 44a to the Z1-side surface of the locking portion 45b, is greater than the plate thickness of the electronic module 32. Thus, the first support member 42 can press and support the locking position of the other end 32a2 of the electronic module 32 described later from the Z2 side through the large diameter portion of the locking portion 45b (see Figure 2 as well as Figure 6B ) and the unlocked position in which the other end 32a2 is opened without pressing the other end 32a2 (refer to Figure 4 as well as Fig. 6A ) to switch.

[0050] Figure 5 43 is a three-dimensional diagram of the second support member 43. Figure 2 as well as Figure 5 As shown, the second support member 43 has a stud member 46 and a screw 47. The second support member 43 is a component that supports the electronic module 33 by fastening the screw 47 to the stud member 46.

[0051] The stud member 46 is a metal component having a flange 46a and a barrel 46b. The flange 46a is a metal circular plate. The outer shape of the flange 46a is a circle that is roughly similar to the outer shape of the whole formed by combining the regions 40a to 40c of the ground pad 40, and is the same as or slightly smaller than the outer shape of the entire ground pad 40. In other words, the flange 46a is a circular plate with the same outline as the outline of the entire ground pad 40, and is a shape that is accommodated in the outline of the entire ground pad 40. The barrel 46b is a cylinder that is formed integrally with the flange 46a and stands up from the center of the flange 46a in the Z direction. The barrel 46b is provided with a threaded hole 46b1 having an internal thread formed on the inner circumferential surface.

[0052] The screw 47 is a metal screw having a head 47a and a threaded portion 47b, wherein the head 47a has an outer shape substantially the same as that of the flange 46a, and the threaded portion 47b can be screwed into the threaded hole 46b1. An operation hole 47a1 is formed at the center of the head 47a. The operation hole 47a1 is a cross hole for a tool such as a cross screwdriver to be engaged for rotational operation.

[0053] The Z-direction height of the cylinder 46b, i.e., the distance from the Z2-side surface of the flange 46a to the Z1-side surface of the head 47a of the screw 47 fastened to the threaded hole 46b1, is greater than the plate thickness of the electronic module 33. Thus, the second support member 43 can press and support the other end 33a2 of the electronic module 33 described later from the Z2 side by the screw 47 (see Figure 2 as well as Figure 7B ).

[0054] Next, the electronic modules 32 and 33 are card-type module components that can be connected to the connector 30 conforming to the M.2 standard as described above.

[0055] The electronic module 32 is, for example, a storage device. The electronic module 32 of this embodiment is an SSD (Solid State Drive). Figure 2 As shown, the electronic module 32 has a module substrate 32a, a terminal 32b formed at one end 32a1 of the module substrate 32a, and a semiconductor chip 32c mounted on the module substrate 32a. The electronic module 32 uses the first support member 42 to press the other end 32a2 of the module substrate 32a in the Z direction in a state where the terminal 32b is connected to the connector 30. As a result, the electronic module 32 is mounted on the circuit substrate 24. A semicircular cutout 32d (see FIG. 32d ) is formed at the center of the other end 32a2 in the long side direction, where the rotating shaft portion 45a of the first support member 42 can be arranged. Figure 4 ).

[0056] The electronic module 33 is, for example, a communication module. The electronic module 33 of this embodiment corresponds to WWAN (Wireless Wide Area Network). The communication standard corresponding to the electronic module 33 may also be, for example, WLAN (Wireless Local Area Network). Figure 2 As shown, the electronic module 33 has a module substrate 33a, a terminal 33b formed at one end 33a1 of the module substrate 33a, and a semiconductor chip 33c mounted on the module substrate 33a. The electronic module 33 uses the second support member 43 to press the other end 33a2 of the module substrate 33a in the Z direction in a state where the terminal 33b is connected to the connector 30. Thus, the electronic module 33 is assembled to the circuit substrate 24. A semicircular cutout 33d is formed at the center of the other end 33a2 in the long side direction, where the cylinder 46b of the second support member 43 can be arranged. The cable 49 from the antenna element 48 provided at various locations of the housing 12 and the cover 11 is appropriately connected to the other end 33a2 of the electronic module 33.

[0057] Next, a method of fixing the support members 42 and 43 to the ground pad 40 and a method of supporting the electronic modules 32 and 33 using the support members 42 and 43 will be described.

[0058] Fig. 6A It is a schematic plan view of a state where the first support member 42 is fixed to the ground pad 40 . Figure 6B It means to make Fig. 6A The support member 45 is shown in a plan view in a state where it is rotated to the locking position.

[0059] like Fig. 6AAs shown, the first support member 42 is fixed to the first region 40a of the ground pad 40. The first support member 42 can be fixed to the first region 40a by reflow soldering at the bottom surface (Z1 side surface) of the flange 44a. The first support member 42 can be fixed, for example, at the same time as the process of mounting the connector 30 and other mounting components on the circuit board 24 by reflow soldering.

[0060] It is preferred that the first support 42 be in a rotational posture in which the support member 45 (locking portion 45b) is in an unlocked position (see Fig. 6A ) is fixed to the ground pad 40. If the support member 45 is in the unlocked position, the electronic module 32 can be easily installed relative to the first support member 42 fixed to the ground pad 40. On the other hand, when the support member 45 is in the locked position, the operator needs to temporarily operate it to the unlocked position before installing the electronic module 32, which reduces the work efficiency.

[0061] Here, when the flange 44a is fixed to the first region 40a by reflow soldering, the flange 44a tends to rotate on the first region 40a due to the surface tension of the heated and molten solder. Therefore, assuming that the first region 40a and the flange 44a are circular, when the solder solidifies, the support member 45 (locking portion 45b) may also be in the locked position.

[0062] In this regard, the first region 40a of the ground pad 40 of the present embodiment is substantially D-shaped, i.e., rotationally asymmetric, when viewed from above. Furthermore, the flange 44a has a shape that is accommodated in the first region 40a. The planar shape of the flange 44a is substantially D-shaped, i.e., rotationally asymmetric, corresponding to the first region 40a. Therefore, when the flange 44a of the circuit board 24 of the present embodiment is fixed to the first region 40a by reflow soldering, the flange 44a is positioned on the first region 40a by the surface tension of the heated and molten solder. Fig. 6A Specifically, the cut surface 44a1 is arranged along the cutting line 40a1. Thus, the first support member 42 can be always controlled in the fixed position by the locking portion 45b. Fig. 6A The state of the rotational direction of the unlocked position shown is fixed to the ground pad 40 .

[0063] Therefore, when the electronic module 32 is mounted on the circuit board 24 of the present embodiment, after the terminal 32b is connected to the connector 30, the other end 32a2 can be smoothly placed near the first support member 42 in the unlocked position. Figure 6B As a result, the circuit board 24 can easily support the electronic module 32 using the first support member 42, thereby achieving high working efficiency.

[0064] Fig. 7A It is a schematic plan view of a state in which the stud member 46 of the second support 43 is fixed to the ground pad 40 . Figure 7B It means that screw 47 is tightened on Fig. 7A The state of the stud member 46 is shown in a top view.

[0065] like Fig. 7A As shown, the second support member 43 is arranged to straddle the regions 40a to 40c of the ground pad 40 and is fixed simultaneously with the regions 40a and 40b. The second support member 43 can be fixed to the regions 40a and 40b by reflow soldering at the bottom surface (Z1 side surface) of the flange 46a. The fixing of the second support member 43 can be performed simultaneously with the process of mounting the first support member 42, the connector 30, etc. on the circuit board 24 by reflow soldering, for example.

[0066] Here, when the flange 46a of the second support member 43 is fixed to the ground pad 40 by reflow soldering, the flange 46a is also subjected to the surface tension of the heated and molten solder and rotates on the regions 40a to 40c. However, the second support member 43 is structured to support the electronic module 33 using the screw 47. Therefore, the rotational posture of the stud member 46 on the ground pad 40 is not a problem, and it does not need to be controlled in a certain direction when fixed.

[0067] The ground pad 40 of the present embodiment has an overall shape formed by combining the regions 40a to 40c, which is the same as or slightly larger than the flange 46a, and is circular in plan view. On the other hand, the flange 46a has a shape that is accommodated in the regions 40a to 40c, and is circular in plan view. Therefore, when the circuit board 24 of the present embodiment is fixed by reflow soldering so that the flange 46a spans the regions 40a to 40c, the flange 46a rotates on the regions 40a to 40c due to the surface tension of the heated and molten solder, and can be reliably fixed relative to the ground pad 40.

[0068] Therefore, when the electronic module 33 is mounted on the circuit board 24 of the present embodiment, after the terminal 33b is connected to the connector 30, the other end 33a2 can be smoothly placed near the stud member 46 fixed to the ground pad 40. Therefore, the screw 47 is screwed into the threaded hole 46b1 (see Figure 7B ). Thus, the circuit board 24 can easily support the electronic module 33 using the second support member 43, thereby achieving high working efficiency.

[0069] As described above, the circuit substrate 24 of the present embodiment has a ground pad 40 on the surface (second surface 24b) that can fix the support member 42 or 43 that supports the other end 32a2, 33a2 of the electronic module 32, 33. The ground pad 40 has: a first area 40a formed by a metal pattern, a second area 40b formed by a metal pattern smaller in area than the first area 40a, and a defective area 40c that separates the areas 40a and 40b by not providing a metal pattern. The ground pad 40 can selectively fix the first support member 42 accommodated in the first area 40a and the second support member 43 that exceeds the defective area 40c and spans the areas 40a and 40b. The ground pad 40 positions the rotation direction of the first support member 42 in a certain direction when the first support member 42 is fixed to the first area 40a.

[0070] Therefore, when the first support member 42, which is a locking member that can switch between supporting and not supporting the electronic module 32 by rotating the support member 45, is fixed to the ground pad 40, the circuit substrate 24 of the present embodiment only needs to use the first area 40a. As a result, the first support member 42 can be fixed to the ground pad 40 in a state where it is always controlled in a certain rotation direction. As a result, the efficiency of the loading and unloading operation of the electronic module 32 using the first support member 42 is improved. When the second support member 43 supporting the electronic module 33 using the screw 47 is fixed to the ground pad 40, the circuit substrate 24 can use the areas 40a and 40b at the same time. As a result, the circuit substrate 24 can reliably fix the stud member 46 of the second support member 43 that does not require the control of the rotation direction relative to the ground pad 40. As a result, the circuit substrate 24 can also support the electronic module 33 using the second support member 43.

[0071] Thus, the ground pad 40 has regions 40a to 40c, so that the supports 42 and 43 having different support structures for the electronic module can be selectively fixed. As a result, the circuit substrate 24 can also cope with any case where one or both of the supports 42 and 43 are used, thereby obtaining high versatility and reducing product costs. Therefore, the electronic device 10 having such a circuit substrate 24 can select the supports 42 and 43 flexibly according to its specifications and uses by mounting the circuit substrate 24 provided with the same ground pad 40.

[0072] The first region 40a is preferably rotationally asymmetrical. By forming the flange 44a of the first support member 42 in the same shape, the rotation direction of the first support member 42 can be easily positioned in a certain direction during welding despite the simple structure.

[0073] exist Figure 2, a structure is shown in which the electronic module 32 as a storage device (SSD) is supported by the first support member 42, and the electronic module 33 as a communication module is supported by the second support member 43. However, it is also possible to have a structure in which the electronic module 32 is supported by the second support member 43, and the electronic module 33 is supported by the first support member 42. The circuit substrate 24 may have only the first support member 42 fixed to all the ground pads 40, or only the second support member 43 fixed to all the ground pads 40.

[0074] The shape of the ground pad is not limited to the above, and may be various shapes as long as two or more types of support members can be selectively fixed.

[0075] Figure 8 FIG. 4 is a schematic top view of the ground pad 50 shown in the first modification. Figure 8 In, with Figure 1 to Figure 7B The same reference numerals as shown in the figure indicate the same or similar structure, and thus have the same or similar functions and effects, and detailed descriptions are omitted. Fig. 9 Same here.

[0076] Figure 8 The ground pad 50 shown in the figure is formed into a polygonal shape as a whole by combining the regions 40a to 40c (in Figure 8 In the ground pad 50, the defective region 40c is also formed in a strip shape passing through a position deviated from the center O of the polygon constituting the ground pad 50. Therefore, the ground pad 50 can also selectively fix the first support member 42 having the flange 44a of the shape corresponding to the first region 40a and the second support member 43 having the flange 46a of the shape exceeding the defective region 40c and spanning the regions 40a and 40b.

[0077] Fig. 9 1 is a schematic plan view of a ground pad 52 shown in a second modification. Fig. 9 The ground pad 52 shown in the figure has a circular shape as a whole, which is obtained by combining the regions 40a to 40c. Figure 3 The ground pad 52 is the same as the ground pad 40 shown in FIG. The ground pad 52 is different from the ground pad 40 in that the defect area 40c is not in a straight line, but in a curved strip shape. Fig. 9 As shown, as long as the defective region 40c separates the regions 40a and 40b, the shape is not limited to a straight line, and may be a curved or bent shape.

[0078] In addition, the present invention is not limited to the above-mentioned embodiment, and it is of course possible to freely change it within the scope not departing from the gist of the present invention.

Claims

1. A circuit substrate for mounting a connector at one end of an electronic module, characterized in that: The circuit substrate has a ground pad on the surface, and the ground pad can fix the first support member or the second support member that supports the other end of the electronic module. The above ground pad has: A first region formed by a metal pattern; A second region is formed by a metal pattern having a smaller area than that of the first region; and The defective region separates the first region from the second region by not providing a metal pattern. The grounding pad can selectively fix the first support member accommodated in the first area and the second support member extending beyond the defective area and spanning the first area and the second area, and position the rotation direction of the first support member in a certain direction when the first support member is fixed to the first area.

2. The circuit substrate according to claim 1, characterized in that: The first region has a rotationally asymmetric shape.

3. The circuit substrate according to claim 1 or 2, characterized in that: The ground pad has a shape formed by combining the first region, the defective region, and the second region to form a circle or a polygon as a whole. The defective region is formed in a band shape passing through a position deviated from the center of the circle or polygon.

4. An electronic device comprising a circuit substrate connected to an electronic module, characterized in that: The above-mentioned circuit substrate has: A connector, mounted on a surface and connected to one end of the electronic module; A ground pad is disposed on the surface; and A support member is fixed to the ground pad and supports the other end of the electronic module. The above ground pad has: A first region formed by a metal pattern; A second region is formed by a metal pattern having a smaller area than that of the first region; and The defective region separates the first region from the second region by not providing a metal pattern. The support member has a shape to be accommodated in the first region, and is fixed to the first region in a state where its rotation direction is positioned in a certain direction.

5. The electronic device according to claim 4, characterized in that: The above-mentioned support member has: a stud member having a flange fixed to the ground pad and a shaft rising from a surface of the flange; and The supporting member is supported so as to be relatively rotatable with respect to the shaft and is capable of supporting the other end of the electronic module. The support member is switchable between a locked position in which the support member supports the other end and an unlocked position in which the support member does not support the other end by rotating relative to the shaft.

6. An electronic device comprising a circuit substrate connected to an electronic module, characterized in that: The above-mentioned circuit substrate has: A connector, mounted on a surface and connected to one end of the electronic module; A ground pad is disposed on the surface; and A support member is fixed to the ground pad and supports the other end of the electronic module. The above ground pad has: A first region formed by a metal pattern; A second region is formed by a metal pattern having a smaller area than that of the first region; and The defective region separates the first region from the second region by not providing a metal pattern. The support member has a shape extending beyond the defective region and spanning the first region and the second region, and is fixed to both the first region and the second region.

7. The electronic device according to claim 6, characterized in that: The above-mentioned support member has: a stud member having a flange fixed to the ground pad and a cylindrical body having a threaded hole and rising from the flange; and The screw is screwed into the threaded hole to support the other end of the electronic module.

8. The electronic device according to any one of claims 4 to 7, characterized in that: The first region has a rotationally asymmetric shape.

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