PCB (Printed Circuit Board) and positioning hole processing method of multi-layer PCB

Abstract

The invention belongs to the technical field of PCB (Printed Circuit Board) processing, and discloses a PCB and a method for processing positioning holes of a multi-layer PCB. The PCB comprises a body, an alignment target, a first blind hole and a second blind hole, and the alignment target is arranged on one side of the body; the first blind hole is formed in the side, away from the alignment target, of the body and corresponds to the alignment target in position, and the depth of the first blind hole is smaller than the thickness of the body; the second blind hole is formed in the same side of the alignment target on the body and corresponds to the preset positioning hole in position, the depth of the second blind hole is smaller than the thickness of the body, and the inner diameter of the second blind hole is larger than the diameter of the preset positioning hole. The first blind hole is formed in the position corresponding to the alignment target, the thickness of the position is reduced, and the alignment target can be conveniently observed and compared under the illumination condition; and the second blind hole is formed in the position of the preset positioning hole, so that the thickness of the position is reduced, the punching operation is convenient to implement, and the quality of the multi-layer PCB lamination process is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of PCB processing, and in particular to a method for processing positioning holes of a PCB board and a multi-layer PCB board. Background Art

[0002] The lamination process of multi-layer PCB is also called N+N board. During production, multiple sub-boards need to be pressed together. According to the alignment targets on the sub-boards, positioning holes are punched on the sub-boards. The positioning holes can be located at the four corners or in the middle, and then the positioning holes are used for positioning. During lamination, it is necessary to ensure that each sub-board is aligned. The alignment standard is that the positioning holes on each sub-board are aligned.

[0003] In the prior art, since the sub-board is relatively thick, the alignment target on the sub-board is not easy to observe and compare under lighting conditions, which can easily lead to deviation in the sub-board comparison and position of the positioning holes, affecting the accuracy of positioning of the multi-layer sub-board; and the processing capacity of the punching equipment is limited, and punching operations cannot be performed when the sub-board is relatively thick. Summary of the invention

[0004] The purpose of the present invention is to provide a method for processing positioning holes of a PCB board and a multi-layer PCB board, so as to solve the problem in the prior art that the sub-board is thick, the alignment target on the sub-board is not easy to observe and compare under lighting conditions, and the sub-board comparison deviation is prone to cause the position deviation of the positioning hole, thereby affecting the accuracy of the positioning of the multi-layer sub-board; and the processing capacity of the punching equipment is limited, and the punching operation cannot be performed when the sub-board is thick, thereby improving the quality of the multi-layer PCB board pressing process.

[0005] To achieve this object, the present invention adopts the following technical solutions:

[0006] On the one hand, a PCB board is provided, comprising:

[0007] ontology;

[0008] An alignment target, the alignment target being arranged on one side of the body;

[0009] a first blind hole, wherein the first blind hole is disposed on a side of the body away from the alignment target and corresponds to a position of the alignment target, and a depth of the first blind hole is less than a thickness of the body;

[0010] The second blind hole is arranged on the same side of the alignment target on the main body and corresponds to the position of the preset positioning hole. The depth of the second blind hole is less than the thickness of the main body and the inner diameter of the second blind hole is greater than the diameter of the preset positioning hole.

[0011] As an optional technical solution for the PCB board, a plurality of alignment targets are provided corresponding to the first blind holes.

[0012] As an optional technical solution for the PCB board, a plurality of the preset positioning holes and the second blind holes are provided correspondingly.

[0013] As an optional technical solution for the PCB board, the body is configured to be square, and there are four preset positioning holes located at the four corners of the body.

[0014] As an optional technical solution for the PCB board, the first blind hole is a square hole or a circular hole.

[0015] As an optional technical solution for the PCB board, the second blind hole is a square hole or a circular hole.

[0016] As an optional technical solution for the PCB board, the inner diameter of the first blind hole is the same as the inner diameter of the second blind hole.

[0017] As an optional technical solution for the PCB board, the depth of the first blind hole is the same as the depth of the second blind hole.

[0018] As an optional technical solution for the PCB board, the depth of the first blind hole and the depth of the second blind hole are both half of the thickness of the body.

[0019] On the other hand, a method for processing positioning holes of a multi-layer PCB board is provided, which is used for pressing a plurality of PCB boards together, and comprises the following steps:

[0020] S1, stacking multiple PCB boards;

[0021] S2, using a light source to illuminate the first blind hole and using a CCD camera to identify the position of the alignment target, so that all the alignment targets are aligned;

[0022] S3, arranging punches in the second blind holes one by one and processing positioning holes in the second blind holes at the same time.

[0023] Beneficial effects of the present invention:

[0024] The present application discloses a method for processing positioning holes of a PCB board and a multi-layer PCB board. The PCB board includes a body, an alignment target, a first blind hole and a second blind hole, wherein the alignment target is arranged on one side of the body; the first blind hole is arranged on the side of the body away from the alignment target and corresponds to the position of the alignment target, and the depth of the first blind hole is less than the thickness of the body; the second blind hole is arranged on the same side of the alignment target on the body and corresponds to the position of the preset positioning hole, the depth of the second blind hole is less than the thickness of the body and the inner diameter of the second blind hole is greater than the diameter of the preset positioning hole. By arranging the first blind hole at the position corresponding to the alignment target, the thickness here is thinned, which is convenient for observing and comparing the alignment target under light conditions; and arranging the second blind hole at the position of the preset positioning hole, the thickness here is thinned, which is convenient for punching operations, thereby improving the quality of the lamination process of the multi-layer PCB board. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments of the present invention. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the contents of the embodiments of the present invention and these drawings without paying any creative work.

[0026] Figure 1 It is a partial structural schematic diagram of a PCB board provided by an embodiment of the present invention;

[0027] Figure 2 Schematic diagram of processing of a PCB board provided by an embodiment of the present invention;

[0028] Figure 3 The figure is a flow chart of a method for machining positioning holes of a multi-layer PCB board provided by an embodiment of the present invention.

[0029] In the figure:

[0030] 1. Preset positioning holes;

[0031] 10. Main body; 20. Alignment target; 30. First blind hole; 40. Second blind hole; 50. Punch needle. DETAILED DESCRIPTION

[0032] The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It is to be understood that the specific embodiments described herein are only used to explain the present invention, rather than to limit the present invention. It should also be noted that, for ease of description, only parts related to the present invention, rather than all structures, are shown in the accompanying drawings.

[0033] In the description of the present invention, unless otherwise clearly specified and limited, the terms "connected", "connected", and "fixed" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0034] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0035] In the description of this embodiment, the terms "upper", "lower", "right", etc., directions or positional relationships are based on the directions or positional relationships shown in the drawings, and are only for the convenience of description and simplification of operation, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as limiting the present invention. In addition, the terms "first" and "second" are only used to distinguish in the description and have no special meaning.

[0036] The lamination process of multi-layer PCB is also called N+N board. During the production, multiple sub-boards need to be pressed together, and the alignment targets on the sub-boards are compared to punch out positioning holes on the sub-boards. In the prior art, since the sub-boards are thick, the alignment targets on the sub-boards are not easy to observe and compare under light conditions, and the sub-board comparison deviation is prone to cause the position deviation of the positioning holes, affecting the accuracy of the positioning of the multi-layer sub-boards; and the processing capacity of the punching equipment is limited, and the punching operation cannot be carried out when the sub-boards are thick.

[0037] To solve the above problems, this embodiment provides a PCB board, see Figure 1 and Figure 2 , including a body 10, an alignment target 20, a first blind hole 30 and a second blind hole 40; the alignment target 20 is arranged on one side of the body 10; the first blind hole 30 is arranged on the side of the body 10 away from the alignment target 20 and corresponds to the position of the alignment target 20, and the depth of the first blind hole 30 is less than the thickness of the body 10; the second blind hole 40 is arranged on the same side of the alignment target 20 on the body 10 and corresponds to the position of the preset positioning hole 1, the depth of the second blind hole 40 is less than the thickness of the body 10 and the inner diameter of the second blind hole 40 is greater than the diameter of the preset positioning hole 1. By arranging the first blind hole 30 at the position corresponding to the alignment target 20, the thickness here is thinned, which is convenient for observing and comparing the alignment target 20 under light conditions; the second blind hole 40 is arranged at the position of the preset positioning hole 1, the thickness here is thinned, which is convenient for punching operations, and the quality of the multi-layer PCB board lamination process is improved.

[0038] Specifically, a plurality of alignment targets 20 are provided corresponding to the first blind holes 30, so that the positioning of the plurality of PCB boards can be more accurate. Specifically, the alignment targets 20 are circular, and a plurality of alignment targets 20 are provided in the middle of the four sides of the body 10 to determine the board position of the body 10. The alignment targets 20 include ordinary targets and electronic targets. The ordinary targets can be aligned by light and shadow recognition, and the electronic targets can be aligned by laser sensing. In this embodiment, there are at least four alignment targets 20.

[0039] Further, a plurality of preset positioning holes 1 are provided corresponding to the second blind hole 40. In this embodiment, the body 10 is provided in a square shape, and there are four preset positioning holes 1 located at the four corners of the body 10. In other embodiments, there may be five preset positioning holes 1 located at the four corners of the body 10 and the middle of the body 10. In other embodiments, there may be two preset positioning holes 1 located at intervals in the middle of the body 10.

[0040] Further, the first blind hole 30 is a square hole or a circular hole, and the second blind hole 40 is a square hole or a circular hole. The shapes of the first blind hole 30 and the second blind hole 40 are not limited here, and different shapes can be processed by using different drilling mechanisms or boring mechanisms.

[0041] Furthermore, in order to save processing costs, the inner diameter of the first blind hole 30 is the same as the inner diameter of the second blind hole 40; the depth of the first blind hole 30 is the same as the depth of the second blind hole 40. That is, the first blind hole 30 and the second blind hole 40 use the same set of processing mechanisms. Specifically, the depth of the first blind hole 30 and the depth of the second blind hole 40 are related to the plate thickness production capabilities of the punching machines of different manufacturers, and can be flexibly set to ensure that the position of the alignment target 20 and the position thickness of the preset positioning hole 1 are appropriate, while taking into account the rigidity of the PCB board. In this embodiment, the depth of the first blind hole 30 and the depth of the second blind hole 40 are both half the thickness of the body 10.

[0042] Further, see Figure 3 This embodiment also provides a method for processing positioning holes of a multi-layer PCB board, which is used for pressing a plurality of PCB boards, and includes the following steps:

[0043] S1, stacking multiple PCB boards;

[0044] S2, using a light source to illuminate the first blind hole 30 and using a CCD camera to identify the position of the alignment target 20, so that all the alignment targets 20 are aligned;

[0045] S3, punching needles 50 are arranged in a one-to-one correspondence in the second blind holes 40 and positioning holes are processed in the second blind holes 40 at the same time.

[0046] By placing the first blind holes 30 of each PCB board in correspondence, and using a CCD camera to identify the position of the alignment target 20 under illumination, the accuracy of the positioning hole position is improved; the second blind holes 40 of each PCB board are placed in correspondence, and positioning holes are processed in the second blind holes 40, which facilitates the punching operation and improves the quality of the multi-layer PCB board pressing process.

[0047] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention. For those skilled in the art, various obvious changes, readjustments and substitutions can be made without departing from the protection scope of the present invention. It is not necessary and impossible to list all the embodiments here. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the claims of the present invention.

Claims

1. A PCB board, characterized in that: include: Ontology(10); An alignment target (20), wherein the alignment target (20) is disposed on one side of the body (10); a first blind hole (30), the first blind hole (30) being arranged on a side of the body (10) away from the alignment target (20) and corresponding to the position of the alignment target (20), the depth of the first blind hole (30) being less than the thickness of the body (10); A second blind hole (40), wherein the second blind hole (40) is arranged on the same side of the alignment target (20) on the body (10) and corresponds to the position of the preset positioning hole (1), the depth of the second blind hole (40) is less than the thickness of the body (10) and the inner diameter of the second blind hole (40) is greater than the diameter of the preset positioning hole (1).

2. The PCB board according to claim 1, characterized in that: A plurality of the alignment targets (20) are provided corresponding to the first blind holes (30).

3. The PCB board according to claim 1, characterized in that: A plurality of the preset positioning holes (1) and the second blind holes (40) are provided correspondingly.

4. The PCB board according to claim 1, characterized in that: The body (10) is configured in a square shape, and there are four preset positioning holes (1) located at the four corners of the body (10).

5. The PCB board according to claim 1, characterized in that: The first blind hole (30) is a square hole or a circular hole.

6. The PCB board according to claim 1, characterized in that: The second blind hole (40) is a square hole or a circular hole.

7. The PCB board according to claim 1, characterized in that: The inner diameter of the first blind hole (30) is the same as the inner diameter of the second blind hole (40).

8. The PCB board according to claim 1, characterized in that: The depth of the first blind hole (30) is the same as the depth of the second blind hole (40).

9. The PCB board according to claim 8, characterized in that: The depth of the first blind hole (30) and the depth of the second blind hole (40) are both half the thickness of the body (10).

10. A method for processing positioning holes of a multi-layer PCB board, used for pressing a plurality of PCB boards according to any one of claims 1 to 9, characterized in that: The following steps are involved: S1, stacking multiple PCB boards; S2, using a light source to illuminate the first blind hole (30) and using a CCD camera to identify the position of the alignment target (20), so that all the alignment targets (20) are aligned; S3, arranging punching needles (50) in a one-to-one correspondence in the second blind holes (40) and processing positioning holes in the second blind holes (40) at the same time.

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