Circuit board forming automatic processing method and system, storage medium and electronic equipment

Abstract

The invention discloses an automatic processing method for circuit board forming, and the processing method comprises the following steps: S1, receiving a plurality of circuit boards through an all-in-one machine, and processing the plurality of circuit boards to form a laminated circuit board; s2, encapsulating the laminated circuit board according to the all-in-one machine; s3, conveying the pre-processing board to a gong machine temporary storage warehouse through an AGV; s4, taking the pre-processing board in the gong machine temporary storage library through the gong machine, and fixing the pre-processing board through the gong machine; and S5, carrying out milling cutting on the pre-processing plate through a milling machine to form a plurality of finished product units. Automatic processing is realized through the all-in-one machine, and manual PIN nail feeding and rubber coating on laminated plates are not needed, so that the labor intensity of workers is reduced, and the labor cost is saved; the manual control risk is reduced, the error probability is reduced, and the product quality is improved. A plurality of laminated circuit boards are milled by the milling machine at one time, and the operation time of the milling machine is not occupied by adopting the all-in-one machine for laminating and dowel positioning, so that the production capacity bottleneck of the milling machine is broken through, and the processing efficiency of a forming process is improved.

Description

Technical Field

[0001] The present application relates to the technical field of circuit board production, and in particular to a circuit board molding automated processing method, system, storage medium and electronic equipment. Background Art

[0002] The production process of circuit boards includes a forming process, the purpose of which is to cut and remove unnecessary panels from the entire circuit board to form a finished unit that meets the customer's external dimensions. The forming process is usually carried out on a gong machine. There are usually several finished units on a circuit board, which makes it take a long time for the gong machine to cut the finished units.

[0003] In the prior art, circuit boards need to go through a series of processing steps before gong cutting to form pre-processed boards, which are then gong cut by a gong machine to form several finished units. The series of processes to form the pre-processed boards are also carried out on the gong machine. Because gong cutting is time-consuming, the production efficiency of the finished units is low, and the series of processes to form the pre-processed boards mostly require manual intervention, which requires certain labor costs.

[0004] Based on this, it is necessary to propose automated processing methods, systems, storage media and electronic equipment for circuit board forming, which can automatically process circuit boards into pre-processed boards and finished product units with high production efficiency, which has become an important technical problem that needs to be solved urgently. Summary of the invention

[0005] The present application provides an automated processing method for circuit board molding, aiming to solve the problem that the production efficiency of finished product units is low and a series of processes for forming pre-processed boards mostly require manual intervention, which requires certain labor costs.

[0006] To achieve the above-mentioned purpose, the present application proposes an automated processing method for circuit board forming, and the processing method includes the following steps: S1, an all-in-one machine receives a plurality of circuit boards, and processes the plurality of circuit boards to form a laminated circuit board; S2, the laminated circuit board is encapsulated with glue according to the all-in-one machine to form a pre-processed board; S3, the pre-processed board is transported to the temporary storage warehouse of the gong machine by an AGV; S4, the pre-processed board in the temporary storage warehouse of the gong machine is taken by the gong machine, and the pre-processed board is fixed by the gong machine; S5, the pre-processed board is gong-cut by the gong machine to form a plurality of finished product units, and the plurality of finished product units are transported to the next processing equipment.

[0007] In some embodiments, the above S1 specifically includes the following steps: S11, the all-in-one machine receives circuit boards one by one, processes a number of pin holes on the circuit boards, and stacks the circuit boards to form a multi-layer circuit board; S12, the all-in-one machine implants PIN pins in the pin holes of the multi-layer circuit board; S13, drills a number of pin holes on a pad pre-existing in the all-in-one machine; S14, stacks the multi-layer circuit boards with implanted PIN pins on the pad to form a laminated circuit board.

[0008] In some embodiments, the above step S11 specifically includes the following steps: S111. When a circuit board is moved to the drilling area of ​​the all-in-one machine, a photo of the circuit board is obtained through a CCD camera; S112. The position of the circuit board is obtained based on the photo of the circuit board; S113. The position of the circuit board is adjusted by an adjustment mechanism, and a number of pin holes are processed at specific positions of the circuit board; S114. After the pin holes of a circuit board are processed, the circuit board is stacked on top of the circuit board with processed pin holes; S115. Steps S111-S114 are repeated to form a multi-layer circuit board.

[0009] In some embodiments, in the above step S113, the method for obtaining the specific position of the processing pin hole on the circuit board is as follows: the circuit board is divided into a process edge and a finished product area according to the graphic data of the circuit board, and the process edge is the specific position of the processing pin hole.

[0010] In some embodiments, the stacking method of the multi-layer circuit board and the pad in the above step S14 is as follows: the PIN pin partially extends out of the multi-layer circuit board, the PIN pin on the multi-layer circuit board is extended into the pin hole on the pad, and the multi-layer circuit board is placed on the pad to form a stacked circuit board.

[0011] In some embodiments, the specific method of the glue encapsulation treatment in the above step S2 is as follows: four corners of the laminated circuit board are glued and fixed.

[0012] In some embodiments, the above step S4 specifically includes the following steps: S41, transporting the pre-processed plate to the gong cutting area; S42, statically press the pin holes on the pre-processed plate in sequence by static pressure equipment; S43, pressing the corners of the pre-processed plate to fix the position of the pre-processed plate.

[0013] Based on another purpose of the present invention, the present invention provides the following technical solutions: an automated processing system for circuit board forming, the processing system is used to implement the processing method as mentioned above, and the processing system includes: an all-in-one stacking module, the all-in-one stacking module is used to receive a plurality of circuit boards, and process multiple circuit boards to form a laminated circuit board; an all-in-one glue coating module, the all-in-one glue coating equipment is used to perform glue coating on the laminated circuit board to form a pre-processed board; an AGV module, the AGV module is used to transport the pre-processed board to the temporary storage warehouse of the gong machine; a gong machine fixing module, the gong machine fixing module is used to take the laminated circuit board in the temporary storage warehouse of the gong machine, and fix the pre-processed board through the gong machine; a gong machine gong cutting module, the gong machine gong cutting module is used to gong cut the pre-processed board to form a plurality of finished product units, and transport the plurality of finished product units to the next processing equipment.

[0014] Based on another purpose of the present invention, the present invention provides the following technical solution: an electronic device, which runs the processing method as described above.

[0015] Based on another purpose of the present invention, the present invention provides the following technical solution: a storage medium, which stores the processing method as described above.

[0016] The technical solution of this application proposes an automated processing method for circuit board molding, and the processing method includes the following steps: S1, an all-in-one machine receives several circuit boards, and processes the multiple circuit boards to form a laminated circuit board; S2, the laminated circuit board is encapsulated with glue according to the all-in-one machine to form a pre-processed board; S3, the pre-processed board is transported to the temporary storage of the gong machine by AGV; S4, the pre-processed board in the temporary storage of the gong machine is taken by the gong machine, and the pre-processed board is fixed by the gong machine; S5, the pre-processed board is gong-cut by the gong machine to form several finished product units, and the several finished product units are transported to the next processing equipment. Through the multiple functional units in the all-in-one machine, a series of processing procedures for the circuit board are realized to finally form a pre-processed board, which is formed by a pad and multiple circuit boards stacked in sequence. Automated processing is realized by the all-in-one machine, and there is no need to manually perform PIN nails and encapsulation on the stacked boards, which reduces the intensity of manual labor and saves labor costs; reduces the risk of manual control, reduces the probability of errors, and improves product quality. The gong machine can realize automatic loading, gong cutting and unloading of pre-processed boards, without the need for manual handling and loading and unloading, reducing labor intensity and saving labor costs; the gong machine can gong cut multiple stacked circuit boards at a time, and use an all-in-one machine for stacking boards and pin positioning without occupying the gong machine's operating time, which is conducive to breaking through the gong machine's production capacity bottleneck and improving the processing efficiency of the forming process. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the prior art descriptions are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative work, among which: Figure 1 A technical roadmap of the automated processing method for circuit board molding in one embodiment of the present application; Figure 2 This is a system structure diagram of a circuit board molding automated processing system in one embodiment of the present application; Figure 3 This is a front view of a circuit board in one embodiment of the present application.

[0018] In the figure: processing system 10, all-in-one laminating module 101, all-in-one rubber encapsulation module 102, AGV module 103, gong machine fixing module 104, gong machine gong cutting module 105, process edge 2, pin hole 3, finished product unit 4. DETAILED DESCRIPTION

[0019] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0020] It should be noted that all directional indications in the embodiments of the present application (such as up, down, left, right, front, back, etc.) are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0021] It should also be noted that when an element is referred to as being "fixed on" or "disposed on" another element, it may be directly on the other element or there may be an intermediate element at the same time. When an element is referred to as being "connected to" another element, it may be directly connected to the other element or there may be an intermediate element at the same time.

[0022] In addition, the descriptions of "first", "second", etc. in this application are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the technical solutions between the various embodiments can be combined with each other, but they must be based on the ability of ordinary technicians in this field to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by this application.

[0023] See also Figure 1As shown, the present application proposes an automated processing method for circuit board forming, and the processing method includes the following steps: S1, the all-in-one machine receives a plurality of circuit boards, and processes the plurality of circuit boards to form a laminated circuit board; S2, the laminated circuit board is encapsulated with glue according to the all-in-one machine to form a pre-processed board; the all-in-one machine is a multifunctional automated integrated device, and the all-in-one machine has many functional units, and many functional units work together to achieve the purpose of automatically processing the pre-processed board. The functional units of the all-in-one machine are not limited to: an all-in-one machine feeding unit, an all-in-one machine CCD positioning drilling pin hole unit, an all-in-one machine automatic circuit board stacking unit, an all-in-one machine PIN nail unit, an all-in-one machine pad drilling unit, an all-in-one machine pad stacking unit, an all-in-one machine automatic encapsulation unit, an all-in-one machine automatic board collection unit, and an all-in-one machine. The machine receives several circuit boards through the integrated machine feeding unit, and drills pin holes 3 on the circuit boards through the integrated machine CCD positioning and drilling pin hole unit, stacks the circuit boards neatly through the integrated machine automatic circuit board stacking unit, and then implants PIN pins into the multi-layer circuit boards through the integrated machine upper PIN pin unit to achieve positioning between the circuit boards, drills corresponding pin holes 3 on the pads through the integrated machine pad drilling unit, and achieves positioning between the pads and the multi-layer circuit boards through the pin holes 3, stacks the pads under the multi-layer circuit boards through the integrated machine pad stacking unit to form a laminated circuit board, and glues the four corners of the laminated circuit board through the integrated machine automatic glue coating unit, so as to achieve connection and fixation between the pads and the laminated circuit boards, and transports the formed pre-processed boards through the integrated machine automatic board receiving unit. Through the multiple functional units in the integrated machine, a series of processing procedures for the circuit boards are realized to finally form a pre-processed board, which is formed by the pads and multiple circuit boards stacked in sequence. The integrated machine realizes automatic processing, and there is no need to manually stack the PIN pins and glue on the boards, which reduces the labor intensity and saves labor costs; reduces the risk of manual control, reduces the probability of errors, and improves product quality.

[0024] S3. The pre-processed boards are transported to the temporary storage of the gong machine through AGV; the automatic board collecting unit of the integrated machine transports the pre-processed boards to the material frame. The AGV moves to the automatic board collecting unit station of the integrated machine through system signal instructions, and transports the material basket containing the pre-processed boards to the temporary storage of the gong machine.

[0025] S4, take the pre-processed plate in the temporary storage of the gong machine through the gong machine, and fix the pre-processed plate through the gong machine; S5, gong-cut the pre-processed plate through the gong machine to form a number of finished product units 4, and transport the several finished product units 4 to the next processing equipment. The gong machine is a multifunctional automatic gong-cutting equipment, which includes a gong machine loading unit, a gong machine fixing unit, a gong machine gong-cutting unit and a gong machine unloading unit. The gong machine loading unit is used to take the pre-processed plate from the temporary storage of the gong machine, the gong machine fixing unit is used to adjust the position of the pre-processed plate, and press the pre-processed plate to fix the position of the pre-processed plate, the gong machine gong-cutting unit gong-cuts the pre-processed plate to process the finished product unit 4, and the gong machine unloading unit realizes automatic unloading, and moves the finished product unit 4 and the scraps out of the gong-cutting station. After unloading, the finished product unit 4 is transported to the next processing equipment by AGV. The gong machine can realize automatic loading, gong cutting and unloading of pre-processed boards, without the need for manual handling and loading and unloading, reducing labor intensity and saving labor costs; the gong machine can gong cut multiple stacked circuit boards at a time, and use an all-in-one machine for stacking boards and pin positioning without occupying the gong machine's operating time, which is conducive to breaking through the gong machine's production capacity bottleneck and improving the processing efficiency of the forming process.

[0026] Specifically, through the multiple functional units in the integrated machine, a series of processing procedures for the circuit board are realized to finally form a pre-processed board. The integrated machine realizes automated processing, and there is no need for manual PIN nailing and encapsulation on the stacked boards, which reduces the intensity of manual labor and saves labor costs; reduces the risk of manual control, reduces the probability of errors, and improves product quality. The gong machine is used to realize automatic loading, gong cutting and unloading of pre-processed boards, without the need for manual handling of loading and unloading, reducing the intensity of manual labor and saving labor costs; the gong machine gong cuts multiple stacked circuit boards at a time, and the use of an integrated machine for stacking boards and pin positioning does not require the operation time of the gong machine, which is conducive to breaking through the bottleneck of gong machine production capacity and improving the processing efficiency of the forming process.

[0027] In some embodiments, the above S1 specifically includes the following steps: S11, the integrated machine receives the circuit boards one by one, processes a plurality of pin holes 3 on the circuit boards, and stacks the circuit boards to form a multi-layer circuit board; the integrated machine feeding unit receives the circuit boards one by one, the integrated machine CCD positioning and drilling pin hole unit processes a plurality of pin holes 3 on the circuit boards one by one, and the integrated machine automatic circuit board stacking unit neatly stacks the circuit boards with the pin holes 3 processed thereon to form a multi-layer circuit board; S12, the integrated machine implants a PIN in the pin hole 3 of the multi-layer circuit board; the PIN unit on the integrated machine implants a PIN on the neatly stacked multi-layer circuit boards, thereby achieving positioning between the circuit boards and ensuring that the plane position of each layer of the multi-layer circuit board remains consistent; S13, drilling a plurality of pin holes 3 on the pad pre-existing in the integrated machine; the integrated machine pad drilling unit drills a plurality of pin holes 3 on the pad to achieve positioning of the multi-layer circuit board and the pad; S14, stacking the multi-layer circuit board with the PIN pins implanted on the pad to form a laminated circuit board. The integrated machine pad stacking unit stacks the multi-layer circuit board on the pad to form a laminated circuit board.

[0028] In this embodiment, the material of the pad is preferably wood, and a plurality of workstations are provided in the integrated machine, such as a circuit board drilling station, a circuit board stacking station and a pad drilling station, and the plurality of workstations are independent and can perform processing independently.

[0029] In some embodiments, the above step S11 specifically includes the following steps: S111. When a circuit board is moved to the drilling area of ​​the integrated machine, a photo of the circuit board is obtained through a CCD camera; S112. The position of the circuit board is obtained according to the photo of the circuit board; a processing unit is provided in the CCD camera, and the processing unit processes the photo obtained by the CCD camera and obtains a set of edge points of the circuit board image by using a canny operator. Since the edges of the circuit board are all right-angled edges, the Douglas-Peucker algorithm is used to remove abnormal points to ensure the accuracy of the set of edge points. The set of edge points can represent the real-time position of the circuit board; S113. The position of the circuit board is adjusted by the adjusting mechanism, and a plurality of pin holes 3 are processed at specific positions of the circuit board. After the real-time position of the circuit board is obtained, the real-time position of the circuit board needs to be compared with the preset position to obtain whether adjustment is required and the corresponding adjustment information. The adjusting mechanism adjusts the position of the circuit board according to the adjustment information, fixes the circuit board after the adjustment, and then drills a plurality of pin holes 3 on the circuit board.

[0030] S114, after the pin hole 3 of one circuit board is processed, stack the circuit board on top of the circuit board with the pin hole 3 processed; S115, repeat steps S111-S114 to form a multi-layer circuit board.

[0031] See also Figure 3As shown, in some embodiments, in the above step S113, the method for obtaining the specific position of the processing pin hole 3 on the circuit board is as follows: the circuit board is divided into a process edge 2 and a finished product area according to the graphic data of the circuit board, and the process edge 2 is the specific position of the processing pin hole 3. As the circuit board industry continues to develop towards lightness, high frequency, and high density, the circuit design is becoming more and more intensive, and the space for the pin holes in the finished unit 4 is constantly shrinking. For example, large LED light boards often have no space to design pin holes. Setting the pin holes 3 on the process edge 2 can effectively avoid punching holes in the finished unit 4. In addition, due to the different positions of the finished unit 4, the existing molding process uses different pin specifications and different ways of inserting pins, which leads to the inability to unify production and realize automated production. This embodiment provides a method for positioning outside the unit, that is, punching the pin hole 3 on the process edge 2, which is conducive to unifying the specifications of the PIN pins, reducing the complexity of material preparation, and reducing the probability of error; the use of the unit outside positioning method is also conducive to realizing the automation of the molding process.

[0032] In some embodiments, the stacking method of the multi-layer circuit board and the pad in the above step S14 is as follows: the PIN pin partially extends out of the multi-layer circuit board, the PIN pin on the multi-layer circuit board is extended into the pin hole 3 on the pad, and the multi-layer circuit board is placed on the pad to form a stacked circuit board.

[0033] In some embodiments, the specific method of the adhesive coating treatment in the above step S2 is as follows: four corners of the laminated circuit board are glued and fixed. The backing plate and the multilayer circuit board are fixed by glue.

[0034] In some embodiments, the above step S4 specifically includes the following steps: S41, transporting the pre-processed board to the gong cutting area; S42, using static pressure equipment to sequentially statically press the pin holes 3 on the pre-processed board; the pressure head of the static pressure equipment is provided with an avoidance groove adapted to the PIN pin, and sequentially statically pressing the pin holes 3 on the pre-processed board can effectively avoid the circuit board from warping, thereby improving the processing accuracy. In addition, the position accuracy of the pin holes 3 on the circuit board is high, and during the static pressure process, the circuit board is secondary positioned relative to the pin holes 3, which is conducive to improving the position accuracy of the circuit board, thereby improving the processing accuracy.

[0035] S43, pressing the corners of the pre-processed plate to fix the position of the pre-processed plate. The pressing structure is located at the corners of the pre-processed plate, does not affect the gong cutting process, and can effectively fix the pre-processed plate.

[0036] Embodiment 2 In this embodiment, the same parts as those in the first embodiment are given the same figure marks, and the same text descriptions are omitted.

[0037] See also Figure 2As shown, this embodiment discloses a circuit board molding automated processing system, the processing system 10 is used to implement the processing method in the first embodiment, and the processing system includes: An integrated lamination module 101, which is used to receive a plurality of circuit boards and process the plurality of circuit boards to form a laminated circuit board; The integrated machine glue encapsulation module 102, the integrated machine glue encapsulation equipment is used to perform glue encapsulation on the laminated circuit board to form a pre-processed board; AGV module 103, the AGV module is used to transport the pre-processed panels to the temporary storage; A gong machine fixing module 104, which is used to take the laminated circuit boards in the temporary storage and fix the pre-processed boards through the gong machine; The gong cutting module 105 is used to gong cut the pre-processed plate to form a number of finished product units, and transport the several finished product units to the next processing equipment.

[0038] Embodiment 3 In this embodiment, the same parts as those in Embodiment 1 and Embodiment 2 are given the same figure marks, and the same text descriptions are omitted.

[0039] This embodiment discloses an electronic device, and the electronic device runs the processing method in the first embodiment.

[0040] Embodiment 4 In this embodiment, the same parts as those in Embodiment 1, Embodiment 2 and Embodiment 3 are given the same figure marks, and the same text descriptions are omitted.

[0041] This embodiment discloses a storage medium, which stores the processing method in the first embodiment.

[0042] The above description is only a partial or preferred embodiment of the present application. Neither the text nor the drawings can limit the scope of protection of the present application. All equivalent structural changes made using the contents of the present application specification and drawings under the overall concept of the present application, or direct / indirect application in other related technical fields are included in the scope of protection of the present application.

Claims

1. A circuit board forming automated processing method, characterized in that: The processing method comprises the following steps: S1, the integrated machine receives a plurality of circuit boards and processes the plurality of circuit boards to form a laminated circuit board; S2, performing a coating process on the laminated circuit board according to the integrated machine to form a pre-processed board; S3, transporting the pre-processed plate to the temporary storage of the gong machine by AGV; S4, taking the pre-processed plate in the temporary storage of the gong machine by the gong machine, and fixing the pre-processed plate by the gong machine; S5. Rouging the pre-processed plate by the rouging machine to form a plurality of finished product units, and transporting the plurality of finished product units to the next processing equipment.

2. The automated processing method for circuit board molding according to claim 1, characterized in that: The above S1 specifically includes the following steps: S11, the integrated machine receives the circuit boards one by one, processes a plurality of pin holes on the circuit boards, and stacks the circuit boards to form a multi-layer circuit board; S12, the all-in-one machine implants a PIN in the pin hole of the multi-layer circuit board; S13, drilling a plurality of pin holes on the backing plate pre-stored in the integrated machine; S14, stacking the multilayer circuit board with the PIN pins implanted therein onto the pad to form the laminated circuit board.

3. The automated processing method for circuit board molding according to claim 2, characterized in that: The above step S11 specifically includes the following steps: S111, when a circuit board is moved to the drilling area of ​​the integrated machine, a photo of the circuit board is obtained by a CCD camera; S112, acquiring the position of the circuit board according to the photo of the circuit board; S113, adjusting the position of the circuit board by means of an adjusting mechanism, and processing a plurality of pin holes at specific positions of the circuit board; S114, after the pin holes of one circuit board are processed, stacking the circuit board on top of the circuit board with the pin holes processed; S115, repeating steps S111-S114 to form the multilayer circuit board.

4. The automated processing method for circuit board molding according to claim 3, characterized in that: In the above step S113, the method for obtaining the specific position of the processing pin hole on the circuit board is as follows: the circuit board is divided into a process edge and a finished product area according to the graphic data of the circuit board, and the process edge is the specific position for processing the pin hole.

5. The circuit board forming automation processing method according to claim 2, characterized in that: The stacking method of the multilayer circuit board and the pad in the above step S14 is as follows: the PIN pin partially extends out of the multilayer circuit board, the PIN pin on the multilayer circuit board is inserted into the pin hole on the pad, and the multilayer circuit board is placed on the pad to form the stacked circuit board.

6. The automated processing method for circuit board molding according to claim 1, characterized in that: The specific method of the glue coating treatment in the above step S2 is as follows: glue is applied to the four corners of the laminated circuit board for fixing.

7. The automated processing method for circuit board molding according to claim 5, characterized in that: The above step S4 specifically includes the following steps: S41, transporting the pre-processed plate to a cutting area; S42, statically pressing the pin holes on the pre-processed plate in sequence by static pressing equipment; S43, pressing the corners of the pre-processed plate to fix the position of the pre-processed plate.

8. Circuit board forming automated processing system, characterized in that: The processing system (10) is used to implement the processing method according to any one of claims 1 to 7, and the processing system (10) comprises: An integrated lamination module (101), the integrated lamination module being used to receive a plurality of circuit boards and process the plurality of circuit boards to form a laminated circuit board; An all-in-one glue encapsulation module (102), the all-in-one glue encapsulation equipment being used to perform glue encapsulation on the laminated circuit board to form a pre-processed board; An AGV module (103), the AGV module being used to transport the pre-processed plate to a temporary storage warehouse for a gong machine; A gong machine fixing module (104), the gong machine fixing module is used to take the laminated circuit board in the temporary storage of the gong machine and fix the pre-processed board through the gong machine; A gong cutting module (105), which is used to gong cut the pre-processed plate to form a plurality of finished product units, and transport the plurality of finished product units to the next processing equipment.

9. An electronic device, characterized in that: The electronic device runs the processing method described in any one of claims 1-7.

10. A storage medium, characterized in that: The storage medium stores the processing method described in any one of claims 1-7.

Images