Manufacturing method of carbon oil filling hole single-layer metal substrate

Abstract

The invention relates to a method for manufacturing a carbon oil filled single-layer metal substrate, which comprises the following steps of: cutting a metal substrate, and providing the metal substrate with a preset size; performing first-time drilling processing, performing back drilling processing on the metal substrate to form a grounding hole, and synchronously processing a first positioning hole for positioning an outer-layer circuit; filling holes with carbon oil; curing treatment: baking the metal substrate filled with the carbon oil; manufacturing an outer layer circuit pattern; drilling for the second time, namely processing a second positioning hole for carbon oil printing positioning on the metal substrate; carbon oil printing, wherein carbon oil printing operation is carried out based on the second positioning hole; and a post-treatment process: carrying out subsequent treatment on the metal substrate subjected to carbon oil printing to obtain a finished product of the metal-based circuit board. The metal substrate is subjected to processing operations of secondary drilling and secondary carbon oil printing, so that accurate positioning can be realized, and deviation of the circuit board caused by telescopic deformation after circuit manufacturing etching is prevented.

Description

Technical Field

[0001] The invention relates to the field of circuit board manufacturing, and in particular to a method for manufacturing a carbon oil-filled single-layer metal substrate. Background Art

[0002] In the LED industry, aluminum substrates have become the first choice of metal substrates due to their good thermal conductivity and electromagnetic shielding performance. In order to improve the stability and safety of the circuit, and at the same time help dissipate heat and reduce electromagnetic interference, aluminum substrates need to be grounded, usually by adding an additional grounding wire to the assembly, or adding a fixing hole, and designing a conductive position with exposed copper around it, and fixing it to the metal base through metal bolts for grounding. In addition, on the single-layer aluminum substrate of low-frequency and low-power circuits, the method of controlled depth drilling and filling carbon oil in the hole is adopted to achieve the connection between the aluminum base and the circuit, and then the aluminum base is embedded and installed on the metal base, connected through the aluminum base and the metal, and then directly grounded by the base, reducing the design of outer leads and exposed copper. At present, the processing method is usually to complete the carbon oil once after the metal substrate is completed, which is easy to cause deviation, poor contact, and carbon oil falling off. Summary of the invention

[0003] In view of this, the present invention provides a method for manufacturing a carbon oil-filled single-layer metal substrate, which can effectively improve the stability of carbon oil and the stability of conduction between carbon oil and circuits.

[0004] The purpose of the present invention is achieved through the following technical solutions: A method for manufacturing a carbon oil-filled single-layer metal substrate comprises the following steps: S1: Cutting metal substrate and providing metal substrate of predetermined size; S2: a first drilling process, performing back drilling on the metal substrate to form a grounding hole, and simultaneously processing a first positioning hole for positioning the outer layer circuit; S3: Carbon oil filling hole, filling the grounding hole with conductive carbon oil; S4: curing treatment, baking the metal substrate after the carbon oil is poured to fully cure the carbon oil; S5: outer layer circuit pattern production, producing an outer layer circuit with a predetermined pattern on the metal substrate; S6: drilling a second time to form a second positioning hole on the metal substrate for carbon oil printing positioning; S7: Carbon oil printing, performing a carbon oil printing operation based on the second positioning hole; S8: Post-processing step, performing subsequent processing on the metal substrate after carbon oil printing to obtain a finished metal-based circuit board.

[0005] In the above technical solution, a grounding hole is drilled on the metal substrate, and carbon oil is filled in the grounding hole. The carbon oil in the grounding hole can realize the conduction between the metal substrate and the circuit, thereby achieving the purpose of conduction. Among them, the metal substrate of the present invention undergoes secondary drilling and secondary printing of carbon oil. The first positioning hole is used for the production of the outer layer circuit pattern, and the second positioning hole is used for carbon oil printing, that is, drilling is performed again before carbon oil printing, so that precise positioning can be achieved to prevent the circuit board from being misaligned due to expansion and contraction after etching for circuit production. In addition, the secondary printing of carbon oil can further supplement the carbon oil shrinkage caused by the curing treatment after the carbon oil is filled into the hole, thereby effectively avoiding the poor contact between the carbon oil near the upper end of the grounding hole and the outer layer circuit, and ensuring that the carbon oil is in full contact with the circuit layer.

[0006] Optionally, in a possible implementation, before performing step S3, the grounding hole is first roughened, and the roughening includes the following steps: S2.1: Fixing the metal substrate after the first drilling process on the processing tool, so that the grounding hole opening is set downward; S2.2: Covering the surface of the metal substrate with a non-anodic protective film; S2.3: spraying the roughening solution onto the hole wall of the grounding hole; S2.4: washing and drying the metal substrate.

[0007] In the above technical solution, since the metal substrate cannot withstand the corrosion of the roughening solution, the non-anodic protective film can effectively protect and isolate it to prevent unnecessary corrosion or damage to the metal substrate. In addition, the grounding hole opening facing downward can effectively avoid the pool effect and prevent the solution from gathering in the grounding hole, so that the solution can fully exchange and react with the metal substrate to achieve the best roughening effect. In this way, the contact area between the carbon oil filled in the hole and the grounding hole is larger, and the conduction effect is better.

[0008] Optionally, in a possible implementation, in the step S2.3, a spray head is used to perform directionally spraying on the hole wall of the grounding hole, and the roughening solution is sprayed on the hole wall of the grounding hole at an incident angle of 30-45°.

[0009] In the above technical solution, by setting the incident angle of 30-45°, the roughening solution can more effectively penetrate obliquely along the hole wall, reduce the accumulation of the solution at the hole mouth, and ensure that the solution can evenly cover the entire hole wall, especially the hard-to-reach areas deep in the hole wall. This directional spraying method helps to form a more uniform and dense roughening layer and improve the bonding strength between the coating and the substrate.

[0010] Optionally, in a possible implementation, before the carbon oil is poured into the hole, a positioning piece installation is further included, and the positioning piece installation includes the following steps: S3.1: Providing a positioning sheet, wherein the positioning sheet has a first through hole corresponding to the grounding hole, and the aperture of the first through hole is 0.5-1.5 mm smaller than the aperture of the grounding hole on one side; S3.2: accurately aligning the positioning sheet on the metal substrate so that the first through hole covers the grounding hole; S3.3: Fix the positioning sheet so that the positioning sheet is in contact with the surface of the metal substrate.

[0011] In the above technical solution, the design of the positioning piece ensures that the carbon oil can be accurately guided by the positioning piece during the filling process, avoiding the risk of carbon oil overflowing or penetrating into non-target areas. At the same time, the design of a single-side small hole diameter of 0.5-1.5mm not only ensures that the carbon oil can smoothly enter the grounding hole, but also limits the flow range of the carbon oil to a certain extent, improving the accuracy and controllability of the filling.

[0012] Optionally, in a possible implementation, in the step S4, the curing process adopts a gradient curing method, and performs step-by-step temperature curing on the metal substrate after the carbon oil is infused.

[0013] In the above technical solution, gradient curing uses step-by-step temperature increase to allow the carbon oil to gradually adapt to temperature changes during the curing process, avoiding problems such as internal stress concentration and cracking caused by sudden temperature changes. This progressive curing method helps to form a more uniform and dense cured layer, which not only improves the bonding strength between the carbon oil and the metal substrate and the overall mechanical properties, but also enhances the weather resistance and durability of the entire structure.

[0014] Optionally, in a possible implementation, the step-by-step temperature rise curing includes the following four stages: In the first curing stage, the metal substrate is kept at 70-80°C for 30-45 minutes; In the second curing stage, the metal substrate is kept at 90-100°C for 30-45 minutes; In the third curing stage, the metal substrate is kept at 120-140°C for 30-45 minutes; In the fourth curing stage, the metal substrate is kept at 160-180° C. for 60-75 minutes.

[0015] In the above technical solution, a specific temperature range and holding time are set for each curing stage. This precise temperature control ensures that the chemical reaction of carbon oil at different temperatures can proceed smoothly, avoiding problems such as uneven curing or over-curing caused by temperature fluctuations. Starting from the lower temperature of the first curing stage and gradually increasing to the high temperature of the fourth curing stage, this step-by-step heating method helps to gradually release the internal stress of carbon oil.

[0016] Optionally, in a possible implementation, after the curing process is completed, the metal substrate is polished using a non-woven fabric.

[0017] In the above technical solution, the non-woven fabric, with its soft and wear-resistant properties, can gently and effectively remove the tiny bumps, burrs or residues that may be generated during the curing process on the surface of the metal substrate, making the surface smoother. It not only improves the appearance quality of the product, but also provides a good base for subsequent electronic component mounting or coating treatment.

[0018] Optionally, in a possible implementation, when the carbon oil printing process is performed, printing is performed through a screen, and a second through hole is provided on the screen, and the second through hole covers the carbon oil in the grounding hole.

[0019] In the above technical solution, the design of the second through hole can ensure that the carbon oil is accurately printed in the grounding hole, so as to supplement the shrinkage of the carbon oil in the grounding hole caused by the curing process, ensure the conductivity of the carbon oil in the grounding hole and the outer layer circuit, and at the same time avoid the problem of carbon oil overflow or misalignment, thereby improving the accuracy and consistency of printing.

[0020] Optionally, in a possible implementation manner, the aperture of the second through hole is larger than the aperture of the grounding hole by 0.2-0.5 mm on one side.

[0021] In the above technical solution, the larger second through hole diameter facilitates the smooth flow of carbon oil during the printing process, reduces the problem of carbon oil blockage or poor flow caused by too small an aperture, and at the same time ensures that the carbon oil can flow into the grounding hole to better compensate for the amount of carbon oil shrinkage in the grounding hole, thereby ensuring the conductivity of the carbon oil in the grounding hole and the outer layer circuit.

[0022] Optionally, in a possible implementation manner, the metal substrate includes a metal base, a metal layer provided on the metal base, and an insulating layer located between the metal base and the metal layer.

[0023] In the above technical solution, the metal substrate serves as a supporting structure, providing good mechanical strength and thermal conductivity. This enables the metal substrate to withstand greater mechanical stress and high temperature environments, ensuring the stability and reliability of electronic components in long-term operation. The metal layer can serve as the outer circuit layer, playing a key role in electrical isolation, ensuring that there is no electrical connection between the metal layer and the metal substrate, thereby protecting the circuit board and components from the threat of short circuit or electric shock. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0025] Figure 1 A schematic diagram of a process of an embodiment DETAILED DESCRIPTION

[0026] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various different configurations.

[0027] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application for which protection is sought, but merely represents selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the present application.

[0028] Please refer to Figure 1 This embodiment provides a method for manufacturing a carbon oil-filled single-layer metal substrate, comprising the following steps: S1: Cutting metal substrates, providing metal substrates of predetermined sizes, such as aluminum substrates; S2: The first drilling process is to perform back drilling on the metal substrate to form a grounding hole and simultaneously process a first positioning hole for positioning the outer layer circuit; S3: Carbon oil filling hole, filling the grounding hole with conductive carbon oil; S4: curing treatment, baking the metal substrate after the carbon oil is poured to fully cure the carbon oil; S5: outer layer circuit pattern production, producing outer layer circuits with predetermined patterns on the metal substrate; S6: a second drilling process is performed to form a second positioning hole on the metal substrate for carbon oil printing positioning; S7: Carbon oil printing, performing carbon oil printing based on the second positioning hole; S8: Post-processing step, performing subsequent processing on the metal substrate after carbon oil printing to obtain a finished metal-based circuit board.

[0029] Among them, the post-processing process includes the following processes: solder mask pre-treatment, solder mask ink printing, pre-baking, exposure, development, high temperature tunnel curing, printing characters, peripheral molding, electrical testing, high voltage testing, final inspection, and packaging. In addition, the electrical test process needs to be tested twice, that is, the copper wire network and the carbon oil network are tested separately to ensure that the resistance caused by the carbon oil to the metal substrate is less than 100 ohms.

[0030] In this embodiment, a grounding hole is drilled on the metal substrate, and carbon oil is filled in the grounding hole. The carbon oil in the grounding hole can realize the conduction between the metal substrate and the circuit, thereby achieving the purpose of conduction. Among them, the metal substrate of this embodiment undergoes secondary drilling and secondary printing of carbon oil. The first drilling simultaneously drills the grounding hole and the first positioning hole. The first positioning hole is used to make the outer circuit pattern. The second drilling drills the second positioning hole. The second positioning hole is used for carbon oil printing. That is, this embodiment performs another drilling before carbon oil printing, so that precise positioning can be achieved to prevent the circuit board from being offset due to expansion and contraction after etching for circuit production. In addition, the secondary printing of carbon oil can further supplement the carbon oil shrinkage caused by the curing treatment after the carbon oil is filled into the hole, thereby effectively avoiding the poor contact between the carbon oil near the upper end of the grounding hole and the outer circuit, and ensuring that the carbon oil is in full contact with the circuit layer.

[0031] It should be noted that the grounding hole is processed by back drilling with controlled depth drilling. After back drilling, the carbon oil is filled into the hole to make the carbon oil fully contact with the metal base layer. Since the carbon oil contains resin, it will shrink after the baking board is cured at high temperature. The carbon oil near the top may not have enough (poor) contact with the circuit layer. In addition, since the circuit board circuit production process may cause deformation or expansion, if the first positioning hole originally used for carbon oil filling processing is used to print carbon oil, there will be a risk of deviation. Therefore, by drilling a second positioning hole for printing carbon oil, the printed carbon oil can further supplement the carbon oil inside the original carbon oil filling hole, so that the carbon oil is fully in contact with the circuit layer to achieve the purpose of conductivity.

[0032] Specifically, the first positioning hole can be set in the center of the metal substrate. The metal substrate is fixed on the drilling machine through the first positioning hole drilled. After positioning through the drilling machine calibration program, the subsequent second positioning hole on the edge of the board is drilled. Back drilling is to drill directly on the metal layer of the entire metal substrate without considering precise positioning. The subsequent outer layer circuit, secondary carbon oil, and the second drilling are all based on the first positioning hole drilled during back drilling. The first positioning hole drilled by back drilling is used to complete the pipe position.

[0033] In this embodiment, before performing step S3, the grounding hole is first roughened, and the roughening process includes the following steps: S2.1: Fix the metal substrate that has completed the first drilling process on the processing tooling so that the grounding hole opening is set downward; S2.2: Covering the surface of the metal substrate with a non-anodic protective film, the thickness of the non-anodic protective film is 0.1-0.3 mm; S2.3: Use spraying method to spray the roughening solution onto the hole wall of the grounding hole; S2.4: Wash and dry the metal substrate.

[0034] Since the metal substrate cannot withstand the corrosion of the roughening solution, the non-anodic protective film can effectively protect and isolate it to prevent unnecessary corrosion or damage to the metal substrate. Among them, the roughening solution is mainly a mixture of hydrochloric acid, hydrogen peroxide and stabilizer. Its main function is to roughen the surface of the metal base at the bottom of the grounding hole. In addition, the grounding hole opening facing downward can effectively avoid the pool effect and prevent the solution from gathering in the grounding hole, so that the solution can fully exchange and react with the metal substrate to achieve the best roughening effect. In this way, the contact area between the carbon oil filled in the hole and the grounding hole is larger, and the conduction effect is better.

[0035] In step S2.3, the wall of the grounding hole is sprayed with a spray head, and the roughening solution is sprayed at an incident angle of 30-45° to the wall of the grounding hole. The solution temperature is controlled to be 35-45°C, the spray pressure is 0.15-0.25MPa, and the treatment time is 60-120 seconds.

[0036] By setting the incident angle of 30-45°, the roughening solution can more effectively penetrate along the hole wall obliquely, reducing the accumulation of the solution at the hole mouth, ensuring that the solution can evenly cover the entire hole wall, especially the hard-to-reach areas deep in the hole wall. This directional spraying method helps to form a more uniform and dense roughening layer and improve the bonding strength between the coating and the substrate.

[0037] This embodiment also includes the installation of a positioning piece before the carbon oil is poured into the hole. The installation of the positioning piece includes the following steps: S3.1: Provide a positioning sheet, wherein the positioning sheet has a first through hole corresponding to the grounding hole, and the aperture of the first through hole is 0.5-1.5 mm smaller than the aperture of the grounding hole on one side; S3.2: Accurately align the positioning sheet on the metal substrate so that the first through hole covers the grounding hole; S3.3: Fix the positioning piece so that the positioning piece fits the surface of the metal substrate.

[0038] Semi-automatic screen printers can use this positioning sheet to fill holes. The design of the positioning sheet ensures that the carbon oil can be accurately guided by the positioning sheet during the filling process, avoiding the risk of carbon oil overflowing or penetrating into non-target areas. At the same time, the design of a small hole diameter of 0.5-1.5mm on one side not only ensures that the carbon oil can smoothly enter the grounding hole, but also limits the flow range of the carbon oil to a certain extent, improving the accuracy and controllability of the filling.

[0039] In step S4 of this embodiment, the curing process adopts a gradient curing method, and the metal substrate after the carbon oil is infused is cured by step-by-step temperature increase. Gradient curing allows the carbon oil to gradually adapt to temperature changes during the curing process through step-by-step temperature increase, avoiding problems such as internal stress concentration and cracking caused by sudden temperature changes. This progressive curing method helps to form a more uniform and dense cured layer, which not only improves the bonding strength between the carbon oil and the metal substrate and the overall mechanical properties, but also enhances the weather resistance and durability of the entire structure.

[0040] Specifically, the step-by-step temperature curing includes the following four stages: in the first curing stage, the metal substrate is kept in an environment of 70-80°C for 30-45 minutes; in the second curing stage, the metal substrate is kept in an environment of 90-100°C for 30-45 minutes; in the third curing stage, the metal substrate is kept in an environment of 120-140°C for 30-45 minutes; in the fourth curing stage, the metal substrate is kept in an environment of 160-180°C for 60-75 minutes.

[0041] This embodiment requires the plate to be put into a cold furnace and the temperature to be raised in stages to avoid oil explosion or carbon oil not being baked dry due to extreme temperature differences. A specific temperature range and holding time are set for each curing stage. This precise temperature control ensures that the chemical reaction of carbon oil at different temperatures can proceed smoothly, avoiding problems such as uneven curing or over-curing due to temperature fluctuations. Starting from the lower temperature of the first curing stage and gradually rising to the high temperature of the fourth curing stage, this step-by-step heating method helps to gradually release the internal stress of the carbon oil.

[0042] After the curing process is completed, the metal substrate is polished with non-woven fabric. Specifically, carbon oil filling is to use ink silk screen printing to pour carbon oil into the roughened grounding hole through the positioning sheet using a squeegee. After high-temperature curing, the metal base layer and the carbon oil are connected together. When the carbon oil is printed on the circuit board through the positioning sheet, it is inevitable that excess carbon oil will adhere to the grounding hole or the board surface. Because the resin content of carbon oil is high, it is not easy to remove after curing, so it is necessary to use non-woven fabric to polish and remove it.

[0043] With its soft and wear-resistant properties, non-woven fabrics can gently and effectively remove tiny bumps, burrs or residues that may be produced during the curing process on the surface of metal substrates, making the surface smoother. It not only improves the appearance quality of the product, but also provides a good base for subsequent electronic component mounting or coating treatment.

[0044] In this embodiment, when the carbon oil printing process is performed, printing is performed through a screen, and a second through hole is provided on the screen, and the second through hole covers the carbon oil in the grounding hole.

[0045] The design of the second through hole can ensure that the carbon oil is accurately printed in the grounding hole, so as to supplement the shrinkage of the carbon oil in the grounding hole caused by the curing process, ensure the conductivity of the carbon oil in the grounding hole and the outer layer circuit, and avoid the problem of carbon oil overflow or misalignment, thereby improving the accuracy and consistency of printing.

[0046] Specifically, the aperture of the second through hole is 0.2-0.5mm larger than the aperture of the grounding hole. The larger aperture of the second through hole helps the carbon oil to flow smoothly during the printing process, reduces the problem of carbon oil blockage or poor flow caused by too small aperture, and ensures that the carbon oil can flow into the grounding hole to better supplement the amount of carbon oil shrinkage in the grounding hole and ensure the conductivity of the carbon oil in the grounding hole and the outer layer circuit.

[0047] It should be noted that the metal substrate of this embodiment includes a metal base, a metal layer disposed on the metal base, and an insulating layer located between the metal base and the metal layer.

[0048] As a supporting structure, the metal substrate provides good mechanical strength and thermal conductivity. This enables the metal substrate to withstand greater mechanical stress and high temperature environments, ensuring the stability and reliability of electronic components in long-term operation. The metal layer can serve as the outer circuit layer, playing a key role in electrical isolation, ensuring that there is no electrical connection between the metal layer and the metal substrate, thereby protecting the circuit board and components from the threat of short circuit or electric shock.

[0049] In the description of the present invention, it should be understood that terms such as "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating orientations or positional relationships are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0050] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0051] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A method for manufacturing a carbon oil-filled single-layer metal substrate, characterized in that: The steps include: S1: Cutting metal substrate and providing metal substrate of predetermined size; S2: a first drilling process, performing back drilling on the metal substrate to form a grounding hole, and simultaneously processing a first positioning hole for positioning the outer layer circuit; S3: Carbon oil filling hole, filling the grounding hole with conductive carbon oil; S4: curing treatment, baking the metal substrate after the carbon oil is poured to fully cure the carbon oil; S5: outer layer circuit pattern production, producing an outer layer circuit with a predetermined pattern on the metal substrate; S6: drilling a second time to form a second positioning hole on the metal substrate for carbon oil printing positioning; S7: Carbon oil printing, performing a carbon oil printing operation based on the second positioning hole; S8: Post-processing step, performing subsequent processing on the metal substrate after carbon oil printing to obtain a finished metal-based circuit board.

2. The method for manufacturing a carbon oil-filled single-layer metal substrate according to claim 1, characterized in that: Before performing step S3, the grounding hole is roughened, and the roughening process includes the following steps: S2.1: Fixing the metal substrate after the first drilling process on the processing tool, so that the grounding hole opening is set downward; S2.2: Covering the surface of the metal substrate with a non-anodic protective film; S2.3: spraying the roughening solution onto the hole wall of the grounding hole; S2.4: washing and drying the metal substrate.

3. The method for manufacturing a carbon oil-filled single-layer metal substrate according to claim 2, characterized in that: In the step S2.3, a spray head is used to perform directionally spraying on the hole wall of the grounding hole, and the roughening solution is sprayed on the hole wall of the grounding hole at an incident angle of 30-45 degrees.

4. The method for manufacturing a carbon oil-filled single-layer metal substrate according to claim 1, characterized in that: Before the carbon oil is poured into the hole, the positioning piece is installed, and the positioning piece installation includes the following steps: S3.1: Providing a positioning sheet, wherein the positioning sheet has a first through hole corresponding to the grounding hole, and the aperture of the first through hole is 0.5-1.5 mm smaller than the aperture of the grounding hole on one side; S3.2: accurately aligning the positioning sheet on the metal substrate so that the first through hole covers the grounding hole; S3.3: Fix the positioning sheet so that the positioning sheet is in contact with the surface of the metal substrate.

5. The method for manufacturing a carbon oil-filled single-layer metal substrate according to claim 1, characterized in that: In the step S4, the curing process adopts a gradient curing method to perform step-by-step temperature curing on the metal substrate after the carbon oil is injected.

6. The method for manufacturing a carbon oil-filled single-layer metal substrate according to claim 5, characterized in that: The step-by-step temperature curing includes the following four stages: In the first curing stage, the metal substrate is kept at 70-80°C for 30-45 minutes; In the second curing stage, the metal substrate is kept at 90-100°C for 30-45 minutes; In the third curing stage, the metal substrate is kept at 120-140°C for 30-45 minutes; In the fourth curing stage, the metal substrate is kept at 160-180° C. for 60-75 minutes.

7. The method for manufacturing a carbon oil-filled single-layer metal substrate according to claim 1, characterized in that: After the curing process is completed, the metal substrate is polished using a non-woven fabric.

8. The method for manufacturing a carbon oil-filled single-layer metal substrate according to claim 1, characterized in that: When the carbon oil printing process is performed, printing is performed through a screen, and a second through hole is provided on the screen, and the second through hole covers the carbon oil in the grounding hole.

9. The method for manufacturing a carbon oil-filled single-layer metal substrate according to claim 8, characterized in that: The aperture of the second through hole is 0.2-0.5 mm larger than the aperture of the grounding hole on one side.

10. The method for manufacturing a carbon oil-filled single-layer metal substrate according to any one of claims 1 to 9, characterized in that: The metal substrate includes a metal base, a metal layer disposed on the metal base, and an insulating layer located between the metal base and the metal layer.

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