Microspur high-speed Mini LED chip transfer device and method

Abstract

The invention discloses a microspur high-speed Mini LED chip transfer device and method, and belongs to the technical field of chip conveying devices and methods.The microspur high-speed Mini LED chip transfer device comprises a workbench, the two ends of the workbench are connected with a chip bearing disc and a conveying line respectively, and the conveying line is installed on a frame, extends in the preset direction and is used for bearing and conveying a circuit board; the needling transferring mechanism comprises a first U-shaped frame arranged on the workbench, a first motor is fixedly installed on the first U-shaped frame, an output shaft of the first motor extends to a lead screw shaft on the side wall of the other end of the first U-shaped frame, and a first sliding block fixed to a movable plate is arranged on the lead screw shaft in a spiral transmission mode; first lifting air cylinders are fixedly mounted on the two sides of the movable plate correspondingly. The invention solves the problems that the existing transfer technology is difficult to realize massive transfer of chips, and the positioning precision is weakened after long-term use; and as the swing arm transfer technology adopts a solder paste backflow mode for welding, the consistency of the light-emitting surface is poor.

Description

Technical Field

[0001] The present invention belongs to the technical field of chip transfer devices and methods, and specifically relates to a micro-pitch and high-speed MiniLED chip transfer device and method. Background Art

[0002] As the next generation of new display technology, MiniLED has the potential to replace the original technology in many fields with its many advantages such as high resolution, high brightness and high contrast, high color saturation, low power consumption, fast response speed, thin thickness and long life, and will bring disruptive changes to display terminals.

[0003] MiniLED refers to an LED display chip with a grain size of about 100 to 200 μm. Combined with flip-chip COB or IMD technology, MiniLED direct display can achieve a dot pitch display below 1MM, with high pixel density and high grayscale display at low brightness. At the same time, MiniLED is used as a backlight source in liquid crystal display screens, which can improve contrast through regional dimming and achieve refined display effects such as HDR. MiniLED display technology is an important technology for achieving high brightness, high contrast, and high color gamut of LCD. It uses a large number of MiniLED chips arranged in an array, with ultra-high brightness, supports local dimming, brings more refined HDR partitions, achieves ultra-high contrast, and uses colored conversion films to achieve ultra-high color gamut. MiniLED display technology mainly includes two types: backlight display technology and direct display technology.

[0004] At present, the mainstream MiniLED chip transfer adopts swing-arm transfer technology. The swing-arm transfer technology uses the suction nozzle at the end of the linear motion device to drive the shaft, pick up the chip by its suction, and drive the suction nozzle to rotate above the target substrate through the rotary motion device, disconnect the gas path and release the chip to the target substrate. The initial yield can reach 99.99%, but the single-arm transfer speed is only 4 to 5 chips / s, which makes it difficult to achieve a large number of chip transfers, and long-term use will reduce its positioning accuracy. Since the swing-arm transfer technology uses solder paste reflow welding, the consistency of the light-emitting surface is not good, so the visual experience is relatively weak. In addition, when the chip is encapsulated on the chip through the shell, it can play a good peripheral protection role for the chip after welding, and the shell needs to be dried during the heat sealing process to ensure that the shell is effectively installed on the outside of the chip. The existing drying structure design is relatively complex and the operation is relatively troublesome. The drying effect of the chip is relatively poor, and the chip cannot be dried evenly, which is not conducive to the removal of the product, and thus affects the drying and molding operation of the product. Summary of the invention

[0005] The purpose of the present invention is to provide a micro-distance and high-speed MiniLED chip transfer device and method to solve the problem that the existing transfer technology is difficult to achieve mass transfer of chips, and long-term use will reduce its positioning accuracy; since the swing arm transfer technology uses solder paste reflow welding, the consistency of the light output surface is poor.

[0006] In order to achieve the above object, the present invention adopts the following technical solutions:

[0007] The micro-distance and high-speed MiniLED chip transfer device includes:

[0008] A workbench, with chip carriers and conveyor lines connected to both ends of the workbench, respectively. The conveyor lines are mounted on the frame and extend along a preset direction to carry and convey the circuit board;

[0009] Acupuncture transfer mechanism, the acupuncture transfer mechanism includes a first U-shaped frame placed on a workbench, a first motor is fixedly mounted on the first U-shaped frame, an output shaft of the first motor extends to a screw shaft on the side wall of the other end of the first U-shaped frame, a first slider fixed on a moving plate is spirally driven on the screw shaft, first lifting cylinders are fixedly mounted on both sides of the moving plate, and a piston rod of the first lifting cylinder is connected to a second lifting cylinder through a fixed block;

[0010] The bottom of the piston rod on the second lifting cylinder is connected to a needle head matched therewith, and both sides of the piston rod on the second lifting cylinder are connected to second sliders through a first swing rod, both ends of the first swing rod are connected to the second lifting cylinder and the second slider through a rotation connection, the second slider is connected to a slide groove along the length direction of the extension section of the fixed block, and the bottom of the second slider is connected to a cleaning brush that contacts and fits the chip through a bracket;

[0011] A laser welding mechanism comprises a support frame fixed on a workbench, the support frame is symmetrically arranged relative to the center of the lead screw shaft, and a welding head with an opening facing one side of the chip is connected to the support frame through a laser.

[0012] Furthermore, it also includes a heat sealing and drying mechanism, which includes a second U-shaped frame fixed on the workbench, and third lifting cylinders are fixedly installed on both sides of the top of the second U-shaped frame. The piston rod on the third lifting cylinder passes through the second U-shaped frame and extends to an insulation box with a slot at the bottom, and a heater is installed in the height direction of the side wall of the insulation box.

[0013] Furthermore, a second motor is fixedly installed at the center of the top of the incubator, and the output shaft of the second motor extends to the rotating push assembly and the turntable in sequence, the rotating push assembly is placed in the cover body, and the top of the cover body is fixedly connected to the inner wall of the incubator through a column, the rotating push assembly includes a first bevel gear fixed to the output shaft of the second motor, both ends of the outer wall of the first bevel gear are meshed and driven with bidirectional bevel gears fixed to the telescopic member, the outer wall of the bidirectional bevel gear is meshed and driven with a second bevel gear fixed to the first rotating shaft, the first rotating shaft and the telescopic member are kept vertically arranged, and the outer wall of the first rotating shaft is fixedly connected to the first impeller;

[0014] The telescopic member comprises a hollow sleeve and a movable rod movably connected to the inner wall of the sleeve, both ends of the movable rod are fixedly mounted with limiting parts, and the limiting parts are connected with strip grooves along the length direction of the inner wall of the sleeve.

[0015] Furthermore, the outer wall edge of the first rotating shaft is provided with a rolling groove placed on a third slider, the third slider is connected to a baffle along the length direction of the inner wall of the insulation box, the baffle is provided with a limiting groove connected to the third slider, and the first rotating shaft and the protrusion on the turntable are connected by a second swing rod, the first rotating shaft and the turntable are installed at both ends of the second swing rod by a rotating connection, and the second bevel gear and the bidirectional bevel gear are connected at the corner by an L-shaped bending rod.

[0016] Furthermore, a movable opening is connected to the side of the L-shaped bending rod close to the first rotating shaft, and a guide sleeve is provided on the L-shaped bending rod which is connected to the movable rod on the bidirectional bevel gear. A fixing ring is integrally formed on the inner wall edge of the guide sleeve, and the fixing ring is provided with an annular groove which is connected to the outer wall of the movable rod and embedded inward.

[0017] Furthermore, one end of the first bevel gear is meshed with a third bevel gear fixed on the second rotating shaft, one end of the second rotating shaft is fixedly connected to the central shaft at the vent through a reciprocating screw, a ventilation plate is embedded in the vent, a through hole matching the ventilation plate is provided on the ventilation plate, a second impeller in contact with the outer wall of the ventilation plate is fixedly installed on the central shaft, and a fourth slider fixed on the push plate is spirally driven on the reciprocating screw, and a conical portion corresponding to the through hole is connected to the push plate.

[0018] Furthermore, the horizontal central axes of the second rotating shaft, the reciprocating screw and the central axis are all maintained on the same axis, and a central hole connected to the central axis is opened at the center of the ventilation plate.

[0019] The micro-distance and high-speed MiniLED chip transfer method includes the following steps:

[0020] S1.1. Start the first lifting cylinder to make the puncture mechanism reach the specified height, cooperate with the second lifting cylinder, puncture the chip with the needle and transfer the chip to the circuit board on the conveyor line, and align the chip with the circuit board bonding point. Under the welding action of the laser, the chip and the circuit board are separated during the needle lifting process;

[0021] S1.2. During the conveying process of the conveyor line, the chip shell is heat-sealed on the chip to obtain corresponding protection treatment;

[0022] S1.3, the third lifting cylinder drives the heat preservation box to cover the chip shell, the heater is started, and the connection between the chip shell and the chip is dried. At the same time, the second motor is started, and under the action of mechanical transmission, the first impeller evenly dissipates heat to the chip;

[0023] S1.3, during step S1.3, when the second motor is started, it can drive the second impeller to rotate, which can discharge the internal heat to a certain extent to prevent the internal temperature of the insulation box from being too high, and at the same time drive the conical part to move back and forth to the through hole, thereby preventing the through hole on the ventilation plate from being blocked.

[0024] In summary, due to the adoption of the above technical solution, the beneficial effects of the present invention are:

[0025] (1) A needle puncture transfer mechanism is set up. The first lifting cylinder cooperates with the spiral transmission action of the lead screw shaft to allow the needle puncture transfer mechanism to be lifted and lowered and moved horizontally, so that the chip connected in the subsequent sequence can be transferred to the circuit board of the conveyor line. The second lifting cylinder is set up. On the one hand, the needle can be inserted into the chip to fix it. On the other hand, the rotation connection action of the first swing rod can drive the cleaning brush to clean the surface of the chip. The chip is transferred to the circuit board by needle puncture, and then aligned with the bonding point on the circuit board. Laser welding is used to peel the chip from the needle to the target circuit board. The transfer speed is 40 to 50 pieces / s. The micro-high-speed transfer technology is used, the mechanical loss is small, and the light-emitting surface after welding is excellent. The visual experience is much better than the swing arm transfer technology, which greatly improves the applicability of the device.

[0026] (2) A laser welding mechanism is set up, and the welding head adopts an inclined design. This can ensure the normal movement of the needle transfer mechanism and avoid interference between the structural parts of the two. At the same time, the circuit board and the chip are welded and fixed. The workpiece's own gravity is used to make it possible to directly pull out the positioning point of the needle and the chip during the needle lifting process, thereby ensuring the normal operation of the device.

[0027] (3) A heat sealing and drying mechanism is provided. The third lifting cylinder drives the heat preservation box to cover the chip shell so that it forms a relatively sealed environment. The temperature inside the heat preservation box is increased by heating through the heater. At this time, the second motor is started. Under the action of mechanical transmission, the first impeller can be rotated to dissipate heat to the chip shell. At the same time, during the start-up of the second motor, the second impeller and the reciprocating screw on the central axis can be driven to rotate. The second impeller can play a certain heat dissipation role, thereby preventing the heat preservation box from overheating during the heating process, so that the temperature rise can be carried out stably. At the same time, during the rotation of the reciprocating screw, the conical part can be driven to penetrate into the through hole of the ventilation plate, thereby preventing the ventilation plate from being blocked and preventing the airflow from not being able to flow normally. In this way, the normal heat dissipation work of the device can be ensured, and the design is reasonable.

[0028] (4) A rotating driving assembly is provided. When the first bevel gear rotates, it can drive the first impeller on the first rotating shaft to rotate through the transmission member, and drive the rotation of the turntable. During the rotation of the turntable, due to the rotation connection of the second swing rod, the telescopic member cooperates with the guide sleeve connected to the L-shaped bending rod. The telescopic member ensures that the first rotating shaft can be normally telescopically moved horizontally, and the L-shaped bending rod can connect the bidirectional bevel gear and the second bevel gear to prevent the first rotating shaft from separating during the movement. In this way, the first impeller can be driven to move back and forth on the third slider, so as to achieve the effect of uniformly drying the chip shell and improve the product quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0030] Figure 1 This is a schematic diagram of the structure of the micro-distance high-speed MiniLED chip transfer device of the present invention. Figure 1 ;

[0031] Figure 2 This is a schematic diagram of the structure of the micro-distance high-speed MiniLED chip transfer device of the present invention. Figure 2 ;

[0032] Figure 3 The present invention Figure 1 A magnified image of point A;

[0033] Figure 4 The interior of the heat preservation box of the present invention is schematically shown Figure 1 ;

[0034] Figure 5 The interior of the heat preservation box of the present invention is schematically shown Figure 2 ;

[0035] Figure 6 It is a schematic diagram of the structure of the rotary push assembly of the present invention;

[0036] Figure 7 It is a structural schematic diagram of the guide sleeve of the present invention;

[0037] Figure 8 It is a schematic flow chart of the macro-distance and high-speed MiniLED chip transfer method of the present invention.

[0038] Figure numerals: 1, workbench; 2, chip carrier plate; 3, conveyor line; 4, acupuncture transfer mechanism; 5, first motor; 6, screw shaft; 7, first slider; 8, first lifting cylinder; 9, fixed block; 10, second lifting cylinder; 11, needle; 12, first swing rod; 13, second slider; 14, cleaning brush; 15, laser welding mechanism; 16, welding head; 17, heat sealing and drying mechanism; 18, third lifting cylinder; 19, insulation box; 20, heater; 21, second motor; 22, rotating push assembly; 23, turntable; 24, first conical gear Wheel; 25, telescopic member; 26, bidirectional bevel gear; 27, first rotating shaft; 28, second bevel gear; 29, first impeller; 30, sleeve; 31, movable rod; 32, limit portion; 33, third slider; 34, baffle; 35, second swing rod; 36, L-shaped bending rod; 37, guide sleeve; 38, fixing ring; 39, second rotating shaft; 40, third bevel gear; 41, reciprocating screw; 42, center axis; 43, ventilation plate; 44, through hole; 45, second impeller; 46, push plate; 47, fourth slider; 48, conical portion; 49, cover body. DETAILED DESCRIPTION

[0039] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0040] Reference Manual Attached Figure 1 and attached Figure 2 As shown, a micro-distance high-speed MiniLED chip transfer device comprises: a workbench 1, two ends of the workbench 1 are respectively connected to a chip carrier plate 2 and a conveyor line 3, the conveyor line 3 is installed on a frame and extends along a preset direction to carry and convey a circuit board;

[0041] Acupuncture transfer mechanism 4, the acupuncture transfer mechanism 4 includes a first U-shaped frame placed on the workbench 1, a first motor 5 is fixedly installed on the first U-shaped frame, the output shaft of the first motor 5 extends to the screw shaft 6 on the side wall of the other end of the first U-shaped frame, and the screw shaft 6 is spirally driven with a first slider 7 fixed on the moving plate, and first lifting cylinders 8 are fixedly installed on both sides of the moving plate, and the piston rod of the first lifting cylinder 8 is connected to the second lifting cylinder 10 through a fixed block 9.

[0042] A needle puncture transfer mechanism 4 is provided. The first lifting cylinder 8 cooperates with the spiral transmission action of the lead screw shaft 6 to allow the needle puncture transfer mechanism 4 to be lifted and lowered and moved horizontally, so that the chip connected in the subsequent sequence can be transferred to the circuit board of the conveyor line 3. The second lifting cylinder 10 is provided, on the one hand, the needle 11 can be inserted into the chip for fixing, and on the other hand, the rotation connection action of the first swing rod 12 can drive the cleaning brush 14 to clean the surface of the chip. The chip is transferred to the circuit board by acupuncture, and then aligned with the bonding point on the circuit board. Laser welding is used to peel the chip from the needle 11 to the target circuit board. The transfer speed is 40 to 50 pieces / s. The macro high-speed transfer technology is used, the mechanical loss is small, and the light-emitting surface after welding is excellent. The visual experience is much better than the swing arm transfer technology, which greatly improves the applicability of the device.

[0043] Among them, the bottom of the piston rod on the second lifting cylinder 10 is connected to a needle 11 that matches it, and both sides of the piston rod on the second lifting cylinder 10 are connected to the second slider 13 through the first swing rod 12, and both ends of the first swing rod 12 are connected to the second lifting cylinder 10 and the second slider 13 through a rotating connection. The second slider 13 is connected with a slide groove along the length direction of the extension section of the fixed block 9, and the bottom of the second slider 13 is connected to a cleaning brush 14 that contacts and fits the chip through a bracket.

[0044] Specifically, the chip is placed on the chip carrier plate 2, and the needle 11 is inserted into the positioning point on the chip. The main part of the chip is the internal integrated circuit, and the positioning point is just an opening on the chip substrate. As long as the needle 11 does not damage the internal circuit of the chip, simply piercing the positioning point will not affect the normal operation of the chip. Moreover, when the needle 11 pierces and fixes the chip and transfers it to the circuit board on the conveyor line 3, it is welded and formed. At the same time, the weight of the circuit board is large, and the needle 11 can be automatically pulled out during the lifting process, thereby helping the needle transfer mechanism 4 to reset and wait for the next process.

[0045] In addition, the cleaning brush 14 is made of polyvinyl alcohol. The polyvinyl alcohol cleaning brush 14 can be effectively applied to the chip processing field due to its advantages such as strong water absorption, softness and elasticity, high cleanliness, chemical resistance and anti-static properties.

[0046] refer to Figure 1and Figure 3 , the laser welding mechanism 15, the laser welding mechanism 15 includes a support frame fixed on the workbench 1, the support frame is symmetrically arranged relative to the center of the screw shaft 6, and the support frame is connected to a welding head 16 with an opening facing the chip side through a laser.

[0047] Specifically, the chip shell mainly connects the contacts on the chip to the pins of the package shell with wires, and these pins are connected to other devices through wires on the printed circuit board, acting as a connection medium with external devices, and are fixed by artificial heat sealing. Therefore, in order to ensure the quality of the product, a heat sealing and drying mechanism 17 is provided for effective drying.

[0048] refer to Figure 1 , Figure 4 and Figure 5 The micro-distance and high-speed MiniLED chip transfer device also includes a heat sealing and drying mechanism 17, which includes a second U-shaped frame fixed on the workbench 1, and third lifting cylinders 18 are fixedly installed on both sides of the top of the second U-shaped frame. The piston rod on the third lifting cylinder 18 passes through the second U-shaped frame and extends to an insulation box 19 with a slot at the bottom. A heater 20 is installed in the height direction of the side wall of the insulation box 19.

[0049] Specifically, the main function of the heat sealing and drying mechanism 17 is to perform back and forth drying operations on the workpiece to ensure the uniformity of drying. At the same time, in order to prevent the temperature inside the insulation box 19 from being too high and to avoid the phenomenon of rapid temperature changes, a certain heat dissipation treatment is performed inside the insulation box 19, so that the temperature inside the insulation box 19 can be stabilized when it rises and prevent it from changing too quickly.

[0050] refer to Figure 1 , Figure 6 and Figure 7 A second motor 21 is fixedly installed at the center of the top of the insulated box 19, and the output shaft of the second motor 21 extends to the rotating pushing assembly 22 and the turntable 23 in sequence. The rotating pushing assembly 22 is placed in the cover body 49, and the top of the cover body 49 is fixedly connected to the inner wall of the insulated box 19 through a column. The rotating pushing assembly 22 includes a first bevel gear 24 fixed on the output shaft of the second motor 21, and both ends of the outer wall of the first bevel gear 24 are meshed and transmitted with a bidirectional bevel gear 26 fixed on the telescopic member 25, and the outer wall of the bidirectional bevel gear 26 is meshed and transmitted with a second bevel gear 28 fixed on the first rotating shaft 27. The first rotating shaft 27 and the telescopic member 25 are kept vertically arranged, and the outer wall of the first rotating shaft 27 is fixedly connected to the first impeller 29; wherein the telescopic member 25 includes a hollow sleeve 30 and a movable rod 31 movably connected to the inner wall of the sleeve 30, and both ends of the movable rod 31 are fixedly installed with a limiting portion 32, and the limiting portion 32 is connected with a strip groove along the length direction of the inner wall of the sleeve 30.

[0051] A rolling groove is provided on the outer wall edge of the first rotating shaft 27, and the third slider 33 is connected with a baffle 34 along the length direction of the inner wall of the insulation box 19. The baffle 34 is provided with a limiting groove connected to the third slider 33, and the first rotating shaft 27 and the protrusion on the turntable 23 are connected by a second swing rod 35, and the first rotating shaft 27 and the turntable 23 are installed at both ends by a rotating connection. The second bevel gear 28 and the bidirectional bevel gear 26 are connected at the corner by an L-shaped bending rod 36.

[0052] A movable opening is connected to the L-shaped bending rod 36 on the side close to the first rotating shaft 27, and a guide sleeve 37 connected to the movable rod 31 on the bidirectional bevel gear 26 is provided on the L-shaped bending rod 36. A fixing ring 38 is integrally formed and connected to the inner wall edge of the guide sleeve 37. The fixing ring 38 is provided with an annular groove connected to the outer wall of the movable rod 31 and embedded inwardly. One end of the first bevel gear 24 is meshed and driven with a third bevel gear 40 fixed on the second rotating shaft 39. One end of the second rotating shaft 39 is fixedly connected to the central shaft 42 at the vent through a reciprocating screw 41. A ventilation plate 43 is embedded at the vent. The ventilation plate 43 is provided with a through hole 44 matched with it. A second impeller 45 that contacts and fits with the outer wall of the ventilation plate 43 is fixedly installed on the central shaft 42, and a fourth slider 47 fixed on the push plate 46 is spirally driven on the reciprocating screw 41. The push plate 46 is connected with a conical portion 48 corresponding to the through hole 44. The horizontal central axes of the second rotating shaft 39 , the reciprocating screw 41 and the central axis 42 are all kept on the same axis, and a central hole connected to the central axis 42 is opened at the center of the ventilation plate 43 .

[0053] A rotating pushing component 22 is set. When the first bevel gear 24 rotates, it can drive the first impeller 29 on the first rotating shaft 27 to rotate through the transmission member, and drive the rotation of the turntable 23. During the rotation of the turntable 23, due to the rotation connection of the second swing rod 35, the guide sleeve 37 connected with the telescopic member 25 and the L-shaped bending rod 36 is cooperated. The telescopic member 25 ensures that the first rotating shaft 27 can be normally telescopically moved horizontally, and the L-shaped bending rod 36 can connect the bidirectional bevel gear 26 and the second bevel gear 28 to prevent the first rotating shaft 27 from separating during the movement. In this way, the first impeller 29 can be driven to move back and forth on the third slider 33, so as to achieve the effect of uniformly drying the chip shell and improve product quality.

[0054] Specifically, the rotating pushing assembly 22 can transmit power to the first impeller 29 on the first rotating shaft 27 to rotate it, and can also drive the first rotating shaft 27 to move horizontally back and forth, thereby evenly dissipating heat to the chip housing. At the same time, the movable opening setting on the L-shaped bending rod 36 can ensure the normal rotation of the first rotating shaft 27. In addition, the guide sleeve 37 cooperates with the fixing ring 38, and the annular groove embedded in the outer wall of the movable rod 31, so that the L-shaped bending rod 36 can drive one end of the bidirectional bevel gear 26 and the second bevel gear 28 to move synchronously, preventing separation between the structural parts, thereby avoiding affecting the normal transmission meshing work between the gears, resulting in the ineffective transmission of the force.

[0055] refer to Figure 8 , a micro-distance high-speed MiniLED chip transfer method includes the following steps:

[0056] S1.1, start the first lifting cylinder 8, so that the puncture mechanism reaches the specified height, cooperate with the second lifting cylinder 10, puncture the chip with the needle 11 and transfer the chip to the circuit board on the conveyor line 3, and align the chip with the circuit board bonding point. Under the welding action of the laser, the chip and the circuit board are separated during the lifting process of the needle 11;

[0057] S1.2, during the conveying process of the conveying line 3, the chip shell is heat-sealed on the chip so that it is provided with corresponding protection treatment;

[0058] S1.3, the third lifting cylinder 18 drives the heat preservation box 19 to cover the chip shell, the heater 20 is started, and the connection between the chip shell and the chip is dried. At the same time, the second motor 21 is started, and under the action of mechanical transmission, the first impeller 29 evenly dissipates heat to the chip;

[0059] During step S1.4 and step S1.3, when the second motor 21 is started, it can drive the second impeller 45 to rotate, thereby dissipating the internal heat to a certain extent, preventing the internal temperature of the insulation box 19 from being too high, and at the same time driving the conical portion 48 to move back and forth onto the through hole 44, thereby preventing the through hole 44 on the ventilation plate 43 from being blocked.

[0060] The whole chip transfer method has high control accuracy, fast speed, small mechanical loss, and excellent light output surface after welding. The reasonable structural design ensures effective heat sealing and drying of the chip shell and good product quality.

[0061] The above are only preferred specific implementation modes of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical solutions and inventive concepts of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

[0062] The preferred embodiments of the present invention disclosed above are only used to help explain the present invention. The preferred embodiments do not describe all the details in detail, nor do they limit the invention to only specific implementation methods. Obviously, many modifications and changes can be made according to the content of this specification. This specification selects and specifically describes these embodiments in order to better explain the principles and practical applications of the present invention, so that those skilled in the art can understand and use the present invention well. The present invention is limited only by the claims and their full scope and equivalents.

Claims

1. A micro-distance high-speed MiniLED chip transfer device, characterized in that: include: A workbench, with chip carriers and conveyor lines connected to both ends of the workbench, respectively. The conveyor lines are mounted on the frame and extend along a preset direction to carry and convey the circuit board; Acupuncture transfer mechanism, the acupuncture transfer mechanism includes a first U-shaped frame placed on a workbench, a first motor is fixedly mounted on the first U-shaped frame, an output shaft of the first motor extends to a screw shaft on the side wall of the other end of the first U-shaped frame, a first slider fixed on a moving plate is spirally driven on the screw shaft, first lifting cylinders are fixedly mounted on both sides of the moving plate, and a piston rod of the first lifting cylinder is connected to a second lifting cylinder through a fixed block; Among them, the bottom of the piston rod on the second lifting cylinder is connected with a needle head matched with it, and both sides of the piston rod on the second lifting cylinder are connected with second sliders through a first swing rod, both ends of the first swing rod are connected with the second lifting cylinder and the second slider through a rotation connection, the second slider is connected with a slide groove along the length direction of the extension section of the fixed block, and the bottom of the second slider is connected with a cleaning brush that contacts and fits the chip through a bracket.

2. The micro-distance high-speed MiniLED chip transfer device according to claim 1, characterized in that: It also includes a laser welding mechanism, which includes a support frame fixed on a workbench, the support frame is symmetrically arranged relative to the center of the screw shaft, and a welding head with an opening facing one side of the chip is connected to the support frame through a laser.

3. The micro-distance high-speed MiniLED chip transfer device according to claim 2, characterized in that: It also includes a heat sealing and drying mechanism, which includes a second U-shaped frame fixed on a workbench, and third lifting cylinders are fixedly installed on both sides of the top of the second U-shaped frame. The piston rod on the third lifting cylinder passes through the second U-shaped frame and extends to an insulation box with a slot at the bottom, and a heater is installed in the height direction of the side wall of the insulation box.

4. The micro-distance high-speed MiniLED chip transfer device according to claim 3, characterized in that: A second motor is fixedly installed at the center of the top of the incubator, and the output shaft of the second motor extends to the rotating push assembly and the turntable in sequence. The rotating push assembly is placed in the cover body, and the top of the cover body is fixedly connected to the inner wall of the incubator through a column. The rotating push assembly includes a first bevel gear fixed to the output shaft of the second motor, both ends of the outer wall of the first bevel gear are meshed and driven with bidirectional bevel gears fixed to the telescopic member, the outer wall of the bidirectional bevel gear is meshed and driven with a second bevel gear fixed to the first rotating shaft, the first rotating shaft and the telescopic member are kept vertically arranged, and the outer wall of the first rotating shaft is fixedly connected to the first impeller; The telescopic member comprises a hollow sleeve and a movable rod movably connected to the inner wall of the sleeve, both ends of the movable rod are fixedly mounted with limiting parts, and the limiting parts are connected with strip grooves along the length direction of the inner wall of the sleeve.

5. The micro-distance high-speed MiniLED chip transfer device according to claim 4, characterized in that: The outer wall edge of the first rotating shaft is provided with a rolling groove placed on the third slider, the third slider is connected with a baffle along the length direction of the inner wall of the insulation box, the baffle is provided with a limiting groove connected to the third slider, and the first rotating shaft and the protrusion on the turntable are connected by a second swing rod, the first rotating shaft and the turntable are installed at both ends of the second swing rod by a rotating connection, and the second bevel gear and the bidirectional bevel gear are connected at the corner by an L-shaped bending rod.

6. The micro-distance high-speed MiniLED chip transfer device according to claim 5, characterized in that: The L-shaped bending rod is connected to a movable opening on one side close to the first rotating shaft, and the L-shaped bending rod is provided with a guide sleeve connected to the movable rod on the bidirectional bevel gear, the inner wall edge of the guide sleeve is integrally connected with a fixing ring, and the fixing ring is provided with an annular groove connected to the outer wall of the movable rod and embedded inwardly.

7. The micro-distance high-speed MiniLED chip transfer device according to claim 6, characterized in that: One end of the first bevel gear is meshed with a third bevel gear fixed on the second rotating shaft, one end of the second rotating shaft is fixedly connected to the central shaft at the vent through a reciprocating screw, a ventilation plate is embedded in the vent, a through hole matching the ventilation plate is provided on the ventilation plate, a second impeller in contact with the outer wall of the ventilation plate is fixedly installed on the central shaft, and a fourth slider fixed on the push plate is spirally driven on the reciprocating screw, and a conical portion corresponding to the through hole is connected to the push plate.

8. The micro-distance high-speed MiniLED chip transfer device according to claim 7, characterized in that: The horizontal central axis of the second rotating shaft, the reciprocating screw and the central axis are all kept on the same axis, and a central hole connected to the central axis is opened at the center of the ventilation plate.

9. A method for transferring a MiniLED chip at a macro distance and at a high speed, applied to the device for transferring a MiniLED chip at a macro distance and at a high speed according to any one of claims 1 to 8, characterized in that: The steps include: S1.

1. Start the first lifting cylinder to make the puncture mechanism reach the specified height, cooperate with the second lifting cylinder, puncture the chip with the needle and transfer the chip to the circuit board on the conveyor line, and align the chip with the circuit board bonding point. Under the welding action of the laser, the chip and the circuit board are separated during the needle lifting process; S1.

2. During the conveying process of the conveyor line, the chip shell is heat-sealed on the chip to obtain corresponding protection treatment; S1.3, the third lifting cylinder drives the heat preservation box to cover the chip shell, the heater is started, and the connection between the chip shell and the chip is dried. At the same time, the second motor is started, and under the action of mechanical transmission, the first impeller evenly dissipates heat to the chip; S1.4, during step S1.3, when the second motor is started, it can drive the second impeller to rotate, which can discharge the internal heat to a certain extent to prevent the internal temperature of the insulation box from being too high, and at the same time drive the conical part to move back and forth to the through hole, thereby preventing the through hole on the ventilation plate from being blocked.

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