Thermoplastic composition, method of making the same, and article comprising the same

By using a specific proportion of polyamide, polyphenylene ether and polyether ester amide, light-colored molded products with good dielectric and mechanical properties in high-frequency environments are prepared, solving the problem that existing materials have difficulty in taking these properties into account.

CN119998402APending Publication Date: 2025-05-13SHPP GLOBAL TECH BV
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Patent Information

Application Number
CN202380070042.X
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Priority Date
2022-10-07
Filing Date
2023-09-18
Publication Date
2025-05-13

AI Technical Summary

Technical Problem

It is difficult for existing plastic materials to balance good dielectric and mechanical properties in high-frequency environments, while maintaining light colors.

Method used

Molded articles are prepared by melt blending or melt kneading techniques using compositions containing from 25 to 77 weight percent polyamide, from 20 to 45 weight percent polyphenylene ether and from 3 to 30 weight percent polyether ester amide.

Benefits of technology

It realizes molded products with good dielectric and mechanical properties in high-frequency environments, while maintaining light colors, suitable for applications such as automotive components.

✦ Generated by Eureka AI based on patent content.

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Patent Text Reader

Abstract

A molded article includes a composition having specific amounts of a polyamide, a polyphenylene ether, and a polyether ester amide. The molded article may be an automotive component. Methods for making the compositions and articles made from the compositions are also disclosed.
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Description

[0001] Citations of Related Applications

[0002] This application claims priority to and the benefit of European patent application No. 22200306.3 filed on October 7, 2022, the contents of which are incorporated herein by reference in their entirety. Background Art

[0003] Dielectric properties are a consideration in selecting plastic materials suitable for electronic and telecommunication applications. It is desirable to provide materials suitable for exposure to high frequency environments (e.g., in the 10-100 GHz range). Polymer materials with higher dielectric constants (Dk) and dissipation factors (Df) will absorb substantially more electromagnetic energy, affecting the intensity and phase of the electromagnetic waves.

[0004] However, in addition to dielectric properties, plastics used for such components should also have certain mechanical performance characteristics, including high modulus and high impact strength. Improved mechanical properties can be imparted to polymer materials by adding fillers such as glass fiber, carbon fiber and ceramics. However, typical fillers tend to improve dielectric properties (Dk and Df) characteristics.

[0005] Therefore, there is a continuing need for new compositions that can address the above-mentioned technical limitations. In particular, it would be particularly useful to provide compositions that have good dielectric properties while also maintaining good mechanical properties and color. Such compositions would be particularly suitable for automotive applications. Summary of the invention

[0006] A molded article comprising a composition comprising the following: 25 to 77 weight percent of a polyamide; 20 to 45 weight percent of a polyphenylene ether; 3 to 30 weight percent of a polyetheresteramide; wherein the weight percent of each component is based on the total weight of the composition; wherein the molded article is an automotive component; and wherein the molded article exhibits: a heat distortion temperature of 120° C. or higher as measured according to ASTM D648; a heat distortion temperature of 10 8 ohm / sq to 10 13 ohm / sq surface resistivity; a dielectric constant of less than 4 as measured using a QWED split-pillar dielectric resonator and an Agilent PNA network analyzer; a flexural modulus of 1200 MPa or greater as measured in accordance with ASTM D790; and a parasitic capacitance of less than or equal to 0.2 pF; measured using a capacitor signal detector at 100 kHz and 1 volt.

[0007] The above described and other features are exemplified by the following detailed description. DETAILED DESCRIPTION

[0008] The present inventors have found that compositions comprising a compatibilized blend of a specific amount of polyamide, polyphenylene ether and polyetheresteramide can advantageously provide a desired combination of light color, low surface resistance, low volume resistance and good mechanical properties, and thus can be particularly useful for preparing molded articles. Exemplary molded articles can include various automotive components. The compositions of the present disclosure can further include a continuous phase containing polyamide and polyetheresteramide and a dispersed phase containing polyphenylene ether.

[0009] Thus, one aspect of the present disclosure is a molded article comprising a composition comprising a polyamide, a polyphenylene ether, and a polyetheresteramide.

[0010] Polyamides, also known as nylons, are characterized by the presence of a plurality of amide (-C(O)NH-) groups and are described in U.S. Pat. No. 4,970,272 to Gallucci. Polyamides may include aliphatic polyamides, aromatic polyamides, semi-aromatic polyamides, polyamide elastomers, and mixtures thereof. In one aspect, the polyamide includes an aromatic polyamide. In one aspect, the polyamide comprises poly(C 1-12 alkylene dicarboxylates). Specific polyamides include polyamide 6, polyamide-6,6, polyamide-4, polyamide-4,6, polyamide-12, polyamide-6,10, polyamide-6,9, polyamide-6,12, amorphous polyamide, polyamide 6 / 6T and polyamide 6,6 / 6T having a triamine content of less than 0.5 weight percent, polyamide-9T, polyamide-10,10, polyphthalamide, and combinations thereof. In one aspect, the polyamide includes polyamide-6, polyamide-6,6, or a mixture thereof. In one aspect, the polyamide comprises polyamide-6,6. In one aspect, the polyamide comprises polyamide-6. In one aspect, the polyamide comprises polyamide-6 and polyamide-6,6. Polyamides are commercially available from a variety of sources.

[0011] The polyamide can have a glass transition temperature (Tg) greater than or equal to 30° C. or greater than or equal to 35° C. Within this range, the Tg can be 30° C. to 60° C. The polyphthalamide can also have a melting temperature (Tm) of 170° C. to 330° C. Within this range, the Tm can be greater than or equal to 175° C. Also within this range, the Tm can be less than or equal to 300° C.

[0012] In one aspect, the polyamide comprises polyphthalamide. The polyphthalamide comprises repeating units having the formula:

[0013]

[0014] Among them, Q 1 is independently at each occurrence a branched or unbranched alicyclic C 4-8 In one aspect, Q1 is independently 1,6-hexyl at each occurrence. Polyphthalamide is a condensation product of terephthalic acid and an amine, isophthalic acid and an amine, or a combination of terephthalic acid, isophthalic acid and an amine. When more than one diamine is used, the ratio of the diamines can affect some physical properties of the resulting polymer, such as the melting temperature. When more than one acid is used, the ratio of the acids can also affect some physical properties of the resulting polymer. The ratio of diamine to dicarboxylic acid is typically equimolar, although an excess of one or the other can be used to determine the end group functionality. In addition, the reaction may further include a monoamine and a monocarboxylic acid, which act as chain terminators and at least partially determine the end group functionality. In some embodiments, it is preferred to have an amine end group content greater than or equal to about 30 milliequivalents / gram (meq / g), or more specifically, greater than or equal to about 40meq / g.

[0015] In one aspect, the polyphthalamide can be a block copolymer or a random copolymer further comprising units of the formula:

[0016]

[0017] Among them, Q 2 and Q 3 is independently at each occurrence a branched or unbranched alicyclic C 4-12 Alkyl. Q 2 and Q 3 The alicyclic C 4-12 alkyl.

[0018] When the polyamide is polyphthalamide, the glass transition temperature (Tg) can be greater than or equal to 80° C., greater than or equal to 100° C., or greater than or equal to 120° C. The polyphthalamide can also have a melting temperature (Tm) of 290° C. to 330° C. Within this range, the Tm can be greater than or equal to 300° C. Also within this range, the Tm can be less than or equal to 325° C.

[0019] The polyamide can be present in an amount of 25 to 77 weight percent, based on the total weight of the composition. Within this range, the amount of the polyamide can be greater than or equal to 27 weight percent, or greater than or equal to 30 weight percent. Also within this range, the amount of the polyamide can be less than or equal to 75 weight percent, less than or equal to 65 weight percent, less than or equal to 60 weight percent, less than or equal to 55 weight percent, or less than or equal to 50 weight percent. In one aspect, the polyamide can be present in an amount of 30 to 60 weight percent, 40 to 60 weight percent, 35 to 45 weight percent, 35 to 42 weight percent, 30 to 55 weight percent, 30 to 50 weight percent, 35 to 50 weight percent, or 40 to 50 weight percent.

[0020] In addition to the polyamide, the composition comprises a polyphenylene ether. Suitable polyphenylene ethers include those containing repeating structural units having the formula:

[0021]

[0022] Among them, each occurrence of Z 1 are independently halogen, unsubstituted or substituted C 1-12 Hydrocarbon, provided that the hydrocarbon is not a tertiary hydrocarbon, C 1-12 Hydrocarbon thio group, C 1-12 Hydroxyl or C 2-12 haloalkyloxy, wherein at least two carbon atoms separate the halogen and oxygen atoms; and each occurrence of Z 2 are independently hydrogen, halogen, unsubstituted or substituted C 1-12 Hydrocarbon, provided that the hydrocarbon is not a tertiary hydrocarbon, C 1-12 Hydrocarbon thio group, C 1-12 Hydroxyl or C 2-12 A haloalkyloxy group wherein at least two carbon atoms separate the halogen and oxygen atoms. 1 It may be a di-n-butylaminomethyl group formed by the reaction of a terminal 3,5-dimethyl-1,4-phenyl group with a di-n-butylamine component of an oxidative polymerization catalyst.

[0023] The polyphenylene ether may include molecules having aminoalkyl-containing end groups, typically located in the ortho position to the hydroxyl group. Tetramethyldiphenoquinone (TMDQ) end groups are also often present, which are usually obtained from a reaction mixture containing 2,6-dimethylphenol in which tetramethyldiphenoquinone byproduct is present. The polyphenylene ether may be in the form of a homopolymer, copolymer, graft copolymer, ionomer or block copolymer, and combinations thereof.

[0024] In one aspect, the polyphenylene ether can have an intrinsic viscosity of 0.25 to 1 deciliter / gram as measured by an Ubbelohde viscometer in chloroform at 25° C. Within this range, the intrinsic viscosity of the polyphenylene ether can be 0.3 to 0.65 deciliter / gram, more specifically 0.35 to 0.5 deciliter / gram, even more specifically 0.4 to 0.5 deciliter / gram.

[0025] In one aspect, the polyphenylene ether may include a homopolymer or copolymer of a monomer selected from the group consisting of 2,6-dimethylphenol, 2,3,6-trimethylphenol, and a combination thereof. In one aspect, the polyphenylene ether may include poly(2,6-dimethyl-1,4-phenylene ether) having an intrinsic viscosity of 0.35 to 0.5 dl / g, specifically 0.4 to 0.5 dl / g, measured in chloroform at 25°C. For example, PPO from SABIC TM640 and 646, and XYRON from Asahi Kasei Chemicals Corporation TM S201A and S202A, suitable polyphenylene ether homopolymers are commercially available.

[0026] Polyphenylene ethers can be prepared by oxidative coupling of monohydroxyaromatic compounds such as 2,6-xylenol and / or 2,3,6-trimethylphenol. Catalyst systems are typically used for this coupling; they may contain heavy metal compounds such as copper, manganese or cobalt compounds, often in combination with various other materials such as secondary amines, tertiary amines, halides, or combinations of two or more of the foregoing.

[0027] The polyphenylene ether may have a number average molecular weight of 3,000 to 40,000 grams per mole (g / mol) and a weight average molecular weight of 5,000 to 80,000 g / mol as determined by gel permeation chromatography using monodisperse polystyrene standards, styrene divinylbenzene gel at 40° C., and a sample having a concentration of 1 mg / ml chloroform.

[0028] The composition can include the polyphenylene ether in an amount of 20 to 45 weight percent based on the total weight of the composition. Within this range, the amount of the polyphenylene ether can be 23 to 40 weight percent, 23 to 35 weight percent, 35 to 45 weight percent, or 25 to 35 weight percent.

[0029] In addition to the polyamide and polyphenylene ether, the composition further comprises a polyetheresteramide. Without wishing to be bound by theory, it is believed that the polyetheresteramide may act as a polymeric antistatic agent and may unexpectedly provide a composition having a conductivity comparable to when a conductive filler (eg, conductive carbon filler) is used.

[0030] Suitable polyetheresteramides can be polyamide elastomers comprising hard segments and soft segments. The hard segments include polyamides, which can be as described above. The soft segments can include polyalkylene oxides, such as polyalkylene glycols. Suitable polyalkylene glycol moieties can include, for example, polyethylene glycol, polypropylene glycol, polytetramethylene glycol, etc. In specific aspects, polyetheresteramides can include polyamide 6 segments and poly (ethylene oxide) segments. Suitable polyetheresteramides include, for example, those commercially available under the trade names PELESTAT (e.g., PELESTAT 6500) or PELECTRON (e.g., PELECTRON AS), each available from Sanyo Chemical Industries, PEBAX MH1657 commercially available from Atofina, and IRGASTAT P18 and P22 commercially available from Ciba-Geigy.

[0031] The polyetheresteramide can be present in the composition in an amount of 3 to 30 weight percent, based on the gross weight of the composition. Within this range, the polyetheresteramide can be present in an amount of 5 to 30 weight percent, 5 to 25 weight percent, 5 to 20 weight percent, 5 to 15 weight percent, 8 to 30 weight percent, 8 to 25 weight percent, 8 to 20 weight percent, 9 to 30 weight percent, 9 to 25 weight percent, 9 to 20 weight percent, 10 to 30 weight percent, 10 to 25 weight percent, 10 to 20 weight percent, 12 to 20 weight percent, 10 to 25 weight percent or 12 to 25 weight percent, each based on the gross weight of the composition.

[0032] In one aspect, the composition can include 30 to 70 weight percent polyamide; 27 to 40 weight percent polyphenylene ether; and 3 to 18 weight percent polyetheresteramide. In one aspect, the composition can include 40 to 60 weight percent polyamide; 35 to 45 weight percent polyphenylene ether; and 5 to 17 weight percent polyetheresteramide.

[0033] The composition may further include various additives that are usually incorporated into this type of polymer composition, provided that the additive is selected so as not to significantly adversely affect the desired properties of the thermoplastic composition. During the mixing of the components for forming the composition, such additives may be mixed at the appropriate time. Additives include impact modifiers, fillers, reinforcing agents, antioxidants, heat stabilizers, light stabilizers, ultraviolet (UV) light stability, plasticizers, lubricants, mold release agents, antistatic agents, colorants (such as titanium dioxide, carbon black and organic dyes), surface effect additives, radiation stabilizers, flame retardants and anti-dripping agents. Typically, additives are used in a known effective amount. For example, based on the gross weight of the polycarbonate composition, the total amount of additives (except any impact modifier, filler or reinforcing agent) may be 0.01wt% to 5wt%.

[0034] In one aspect, the composition may include one or more of a reinforcing filler, a compatibilizer, and an antioxidant.

[0035] Possible fillers or reinforcing agents include, for example, silicate and silica powders such as aluminum silicate (mullite), synthetic calcium silicate, zirconium silicate, fused silica, crystalline silica graphite, natural silica sand, etc.; boron powders such as boron nitride powder, boron silicate powder, etc.; oxides such as TiO2, aluminum oxide, magnesium oxide, etc.; calcium sulfate (as its anhydride, dihydrate or trihydrate); calcium carbonate such as chalk, limestone, marble, synthetic precipitated calcium carbonate, etc.; talc, including fibrous, blocky, needle-shaped, layered talc, etc.; wollastonite; surface-treated wollastonite; glass spheres such as hollow cored and solid glass spheres, silicate spheres, cenospheres, armospheres, and the like; kaolin, including hard kaolin, soft kaolin, calcined kaolin, kaolin containing various coatings known in the art to promote compatibility with the polymer matrix, and the like; single crystal fibers or "whiskers", such as silicon carbide, aluminum oxide, boron carbide, iron, nickel, copper, and the like; fibers (including continuous and chopped fibers), such as asbestos, carbon fibers, glass fibers, such as E, A, C, ECR, R, S, D or NE glass, and the like; sulfides, such as molybdenum sulfide, zinc sulfide, etc.; barium compounds, such as barium titanate, barium ferrite, barium sulfate, barite, etc.; metals and metal oxides, such as granular or fibrous aluminum, bronze, zinc, copper and nickel, etc.; plate-like fillers, such as glass flakes, plate-like silicon carbide, aluminum diboride, aluminum flakes, steel flakes, etc.; fibrous fillers, such as short inorganic fibers, such as those derived from a blend containing at least one of aluminum silicate, aluminum oxide, magnesium oxide and calcium sulfate hemihydrate, etc.; natural fillers and reinforcing materials, such as wood flour obtained by pulverizing wood, fiber products such as cellulose, cotton, sisal, jute, starch , cork powder, lignin, peanut shells, corn, rice husks, etc.; organic fillers, such as polytetrafluoroethylene; reinforced organic fiber fillers, formed by organic polymers capable of forming fibers, such as polyether ketone, polyimide, polybenzoxazole, polyphenylene sulfide, polyester, polyethylene, aromatic polyamide, aromatic polyimide, polyetherimide, polytetrafluoroethylene, acrylic polymer, polyvinyl alcohol, etc.; and other fillers and reinforcing agents, such as mica, clay, feldspar, flue dust, magnesium aluminosilicate, quartz, quartzite, perlite, diatomite, diatomaceous earth, carbon black, etc., or combinations thereof.

[0036] Filler and reinforcing agent can be coated with metal material layer to promote conductivity, or surface treated with silane to improve adhesion and dispersion with polymer matrix. In addition, reinforcing filler can be provided in the form of monofilament or multifilament fiber, and can be used alone or in combination with other types of fibers, such as by co-braiding or core / sheath, parallel, orange segment type (orange-type) or matrix-fibril structure, or by other methods known to technicians in fiber manufacturing field. Co-braided structure includes glass fiber-carbon fiber, carbon fiber-aromatic polyimide (aromatic polyamide) fiber and aromatic polyimide glass fiber, etc. Fiber filler can be provided in the following form, such as roving, woven fiber reinforcement, such as 0-90 degree fabric, etc.; non-woven fiber reinforcement, such as continuous strand mat, chopped strand mat, thin mat (tissues), paper and mat, etc.; or three-dimensional reinforcement, such as braid.

[0037] In one aspect, the reinforcing filler may include glass fiber. In one aspect, the glass fiber may include E, S, AR, T, D or R glass. The glass fiber may be prepared, for example, by steam or air blowing, flame blowing and mechanical stretching. The glass fiber may be sized or unsized. The sized glass fiber may be coated with a sizing composition on its surface, and the sizing composition is selected to be compatible with the composition of the present disclosure. Without wishing to be bound by theory, it is believed that the sizing composition contributes to the wetting of polyamide and polyphenylene ether on the fiber bundle, and contributes to obtaining the desired physical properties in the composition. In one aspect, the glass fiber may be sized with a coating agent. For example, the coating agent may be present in an amount of 0.1wt% to 5wt% based on the weight of the glass fiber, or in an amount of 0.1wt% to 2wt% based on the weight of the glass fiber. When preparing the glass fiber, many filaments may be formed simultaneously, sized with a coating agent, and then bundled into strands. Alternatively, the strand itself may be first formed by filaments and then sized. The amount of sizing used can be an amount sufficient to bond the glass filaments into continuous strands, and can be, for example, 0.1-5 wt%, 0.1-5 wt%, 0.1-2 wt%, or 0.1-2 wt%, each based on the weight of the glass fibers.

[0038] The glass fiber can be continuous or chopped. In one aspect, the glass fiber can be chopped. The glass fiber in the form of chopped strands can have a length of, for example, 0.3 millimeters (mm) to 10 centimeters (cm), 0.5 mm to 5 cm, 0.5 mm to 5 cm, 1.0 mm to 2.5 cm, 0.2 to 20 mm, 0.2 to 10 mm, 0.7 to 7 mm, or 0.7 to 7 mm.

[0039] The glass fiber can have a circular (or round), flat or irregular cross section. In one aspect, the glass fiber can have a circular cross section. In one aspect, the diameter of the glass fiber can be 1 to 20 microns (micrometers, um), 4 to 15um, 1 to 15um, or 7 to 15um.

[0040] When present, reinforcing fillers can be included in the composition in an amount of up to 30 weight percent, e.g., 5 to 30 weight percent, based on the total weight of the composition. Within this range, fillers can be included in an amount of 5 to 25 weight percent, 7 to 23 weight percent, 8 to 22 weight percent, or 10 to 20 weight percent, each based on the total weight of the composition.

[0041] In one aspect, the composition can include 30 to 60 weight percent polyamide; 23 to 35 weight percent polyphenylene ether; 10 to 25 weight percent polyetheresteramide; and 5 to 25 weight percent reinforcing filler.

[0042] In one aspect, the composition can include 30 to 70 weight percent polyamide; 25 to 40 weight percent polyphenylene ether; 5 to 20 weight percent polyetheresteramide; and, optionally, 5 to 25 weight percent reinforcing filler.

[0043] The composition may further include a compatibilizer, also referred to as a compatibilizing agent. Without wishing to be bound by theory, the compatibilizer may improve the miscibility between the polyamide and polyphenylene ether phases of the composition. The term "compatibilizer" as used herein refers to a multifunctional compound that can interact with polyphenylene ether, polyamide or both. This interaction may be chemical (e.g., grafting) or physical (e.g., affecting the surface properties of the dispersed phase). The obtained compatibilized composition may exhibit improved compatibility, particularly as demonstrated by enhanced impact strength, die weld line strength or elongation. In one aspect, the composition of the present disclosure is a compatibilized composition that has been physically and / or chemically compatibilized with a compatibilizer.

[0044] In one aspect, the compatibilizer can include a multifunctional compound having a carbon-carbon double bond and at least one carboxylic acid, anhydride, epoxy, imide, amide or ester group, or their functional equivalents. Examples of such multifunctional compounds can include maleic acid; maleic anhydride; fumaric acid; maleic hydrazide; dichloromaleic anhydride; and unsaturated dicarboxylic acids (e.g., acrylic acid, butenoic acid, methacrylic acid, t-ethylacrylic acid, pentenoic acid, etc.).

[0045] In one aspect, the compatibilizer may include a multifunctional compound having a group of formula (OR), wherein R is hydrogen or C 1-12 Alkyl, C6-20 Aryl, C 2-12 An acyl group or a carbonyl dioxy group, and at least two groups each of which may be the same or different, are selected from carboxylic acids, acyl halides, acid anhydrides, acyl halide acid anhydrides, esters, orthoesters, amides, imido groups, amino groups and their salts. Examples of this type of compatibilizer may include a compound represented by the formula (R I O) m R(COOR II ) n (CONR III R IV ) s Aliphatic polycarboxylic acids, esters and amides, wherein R is a straight chain or branched saturated C 2-20 Aliphatic hydrocarbon; R I is hydrogen or C 1-10 Alkyl, C 6-20 Aryl, C 2-10 acyl or carbonyldioxy; each R II are independently hydrogen or C 1-10 Alkyl or C 6-20 Aryl; each R III and R IV are independently hydrogen or C 1-10 Alkyl or C 6-20 Aryl; m is equal to 1 and (n+s) is greater than or equal to 2, or, more specifically, is equal to 2 or 3, and n and s are each greater than or equal to zero, and wherein (OR) is alpha or beta to a carbonyl, and at least two carbonyls are separated by 2 to 6 carbon atoms.

[0046] Suitable polycarboxylic acids include, for example, citric acid, malic acid, agaric acid; including various commercial forms thereof, such as anhydrous acid and hydrated acid; and combinations comprising one or more of the foregoing. In one aspect, the functionalizing agent comprises citric acid. Exemplary esters that can be used herein include, for example, acetyl citrate and mono- and / or distearyl citrate, etc. Suitable amides that can be used herein may include, for example, N,N-diethyl citrate amide; N-phenyl citrate amide; N-dodecyl citrate amide; N,N-didodecanyl citrate amide and N-dodecyl malic acid. Derivatives include their salts, including salts with amines and alkali metal salts and alkaline earth metal salts. Exemplary suitable salts may include calcium malate, calcium citrate, potassium malate and potassium citrate.

[0047] The above-mentioned compatibilizer can be directly added to the melt blend or pre-reacted with one or more components of the composition (for example, any one or both of the polyphenylene ether and the polyamide). In one aspect, at least a portion of the compatibilizer can be pre-reacted with all or part of the polyphenylene ether in a molten state or in a solution of a suitable solvent. It is believed that this pre-reaction can cause the compatibilizer to react with the polymer, and therefore, the polyphenylene ether is functionalized. For example, the polyphenylene ether can be pre-reacted with maleic anhydride, fumaric acid or citric acid to form anhydride or acid-functionalized polyphenylene ether, which can have improved compatibility with polyamides compared to corresponding non-functionalized polyphenylene ethers.

[0048] The amount of compatibilizer used can depend on the specific compatibilizer selected and the specific polymer system to which it is added. In one aspect, the compatibilizer can be present in the composition in an amount of 0.05 to 2.0 weight percent, based on the gross weight of the composition. Within this range, the amount of compatibilizer can be greater than or equal to 0.1 weight percent, or more specifically, greater than or equal to 0.2 weight percent, or more specifically, greater than or equal to 0.3 weight percent. Also within this range, the amount of compatibilizer can be less than or equal to 1.85 weight percent, or more specifically, less than or equal to 1.5 weight percent, or more specifically, less than or equal to 0.9 weight percent.

[0049] Antioxidant additives include organic phosphites such as tris(nonylphenyl)phosphite, tris(2,4-di-tert-butylphenyl)phosphite, bis(2,4-di-tert-butylphenyl)pentaerythritol diphosphite, distearylpentaerythritol diphosphite; alkylated monophenols or polyphenols; alkylation reaction products of polyphenols with dienes, such as tetrakis[methylene(3,5-di-tert-butyl-4-hydroxyhydrocinnamate)]methane; butylation reaction products of p-cresol or dicyclopentadiene; alkylated hydroquinones; hydroxylated thiodiphenyl ethers; alkylidene-bisphenols; benzyl compounds; β-(3,5-di-tert-butyl- The antioxidant may be used in an amount of 0.01 to 0.1 parts by weight based on 100 parts by weight of the total composition excluding any filler.

[0050] The composition may further include an impact modifier. The impact modifier is preferably a hydrogenated block copolymer of an alkenyl aromatic monomer and a conjugated diene. For simplicity, this component is referred to as a "hydrogenated block copolymer". Based on the weight of the hydrogenated block copolymer, the hydrogenated block copolymer may include 10 to 90 weight percent poly (alkenyl aromatic compound) content and 90 to 10 weight percent hydrogenated poly (conjugated diene) content. In one aspect, the hydrogenated block copolymer may be an oligo (alkenyl aromatic compound content) hydrogenated block copolymer, wherein the poly (alkenyl aromatic compound) content is 10 to less than 40 weight percent, 20 to 35 weight percent or 25 to 35 weight percent, and also or 30 to 35 weight percent, all based on the weight of the oligo (alkenyl aromatic compound) content hydrogenated block copolymer. In one aspect, the hydrogenated block copolymer can be a high poly(alkenyl aromatic content) hydrogenated block copolymer, wherein the poly(alkenyl aromatic) content is 40 to 90 weight percent, 50 to 80 weight percent, or 60 to 70 weight percent, all based on the weight of the high poly(alkenyl aromatic content) hydrogenated block copolymer.

[0051] In one aspect, the hydrogenated block copolymer can have a weight average molecular weight of 40,000 to 400,000 grams per mole. The number average molecular weight and weight average molecular weight can be determined by gel permeation chromatography based on comparison with polystyrene standards. In one aspect, the hydrogenated block copolymer can have a weight average molecular weight of 200,000 to 400,000 grams per mole or 220,000 to 350,000 grams per mole. In one aspect, the hydrogenated block copolymer can have a weight average molecular weight of 40,000 to 200,000 grams per mole, 40,000 to 180,000 grams per mole or 40,000 to 150,000 grams per mole.

[0052] The alkenyl aromatic monomer used to prepare the hydrogenated block copolymer may have the following structure:

[0053]

[0054] Among them, R 1 and R 2 Each independently represents a hydrogen atom, C 1-8 Alkyl or C 2-8 Alkenyl; R 3 and R 7 Each independently represents a hydrogen atom, C 1-8 an alkyl group, a chlorine atom or a bromine atom; and R 4 , R 5 and R 6 Each independently represents a hydrogen atom, C 1-8 Alkyl or C 2-8 Alkenyl, or R4 and R 5 Together with the central aromatic ring, it forms a naphthyl group, or R 5 and R 6 Together with the central aromatic ring, a naphthyl group is formed. Specific alkenyl aromatic monomers include, for example, styrene, chlorostyrene such as p-chlorostyrene, methylstyrene such as α-methylstyrene and p-methylstyrene, and tert-butylstyrene such as 3-tert-butylstyrene and 4-tert-butylstyrene. In some embodiments, the alkenyl aromatic monomer is styrene.

[0055] The conjugated diene used to prepare the hydrogenated block copolymer can be C 4-20 Conjugated diene. Suitable conjugated dienes include, for example, 1,3-butadiene, 2-methyl-1,3-butadiene, 2-chloro-1,3-butadiene, 2,3-dimethyl-1,3-butadiene, 1,3-pentadiene, 1,3-hexadiene, and the like, and combinations thereof. In one aspect, the conjugated diene is 1,3-butadiene, 2-methyl-1,3-butadiene, or a combination thereof. In some embodiments, the conjugated diene is 1,3-butadiene.

[0056] The hydrogenated block copolymer can be a copolymer comprising (A) at least one block derived from an alkenyl aromatic compound and (B) at least one block derived from a conjugated diene, wherein the aliphatic unsaturated group content in the block (B) is at least partially reduced by hydrogenation. In one aspect, the aliphatic unsaturation in the (B) block is reduced by at least 50% or at least 70%. The arrangement of blocks (A) and (B) includes a linear structure, a grafted structure, and a radially distant block structure with or without a branch. Linear block copolymers include tapered linear structures and non-tapered linear structures. In one aspect, the hydrogenated block copolymer has a tapered linear structure. In one aspect, the hydrogenated block copolymer has a non-tapered linear structure. In one aspect, the hydrogenated block copolymer comprises a (B) block, which comprises a random combination of alkenyl aromatic monomers. Linear block copolymer structures include diblock (AB blocks), triblock (ABA blocks or BAB blocks), tetrablock (ABAB blocks) and pentablock (ABABA blocks or BABAB blocks) structures and linear structures containing a total of 6 or more blocks (A) and (B), wherein the molecular weight of each (A) block can be the same or different from the molecular weight of the other (A) blocks, and the molecular weight of each (B) block can be the same or different from the molecular weight of the other (B) blocks. In one aspect, the hydrogenated block copolymer is a diblock copolymer, a triblock copolymer, or a combination thereof.

[0057] In one aspect, the hydrogenated block copolymer does not include monomer residues other than alkenyl aromatic compounds and conjugated dienes. In some embodiments, the hydrogenated block copolymer is composed of blocks derived from alkenyl aromatic compounds and conjugated dienes. It does not include grafting formed by these or any other monomers. It is also composed of carbon and hydrogen atoms, and therefore does not include heteroatoms. In one aspect, the hydrogenated block copolymer includes the residue of one or more acid functionalizing agents such as maleic anhydride. In one aspect, the hydrogenated block copolymer includes polystyrene-poly (ethylene-butylene)-polystyrene triblock copolymer, polystyrene-poly (ethylene-propylene) diblock copolymer or a combination thereof.

[0058] In one aspect, the hydrogenated block copolymer is a polystyrene-poly(ethylene-butylene)-polystyrene triblock copolymer having a polystyrene content of 25 to 35 weight percent based on the weight of the polystyrene-poly(ethylene-butylene)-polystyrene triblock copolymer. In one aspect, the hydrogenated block copolymer is a polystyrene-poly(ethylene-propylene) diblock copolymer having a polystyrene content of 35 to 55 weight percent based on the weight of the polystyrene-poly(ethylene-propylene) diblock copolymer.

[0059] Methods for preparing hydrogenated block copolymers are known in the art and many hydrogenated block copolymers are commercially available. Exemplary commercially available hydrogenated block copolymers include polystyrene-poly(ethylene-propylene) diblock copolymers, available from Kraton Performance Polymers Inc., such as KRATON G1701 (having 37 weight percent polystyrene) and G1702 (having 28 weight percent polystyrene); polystyrene-poly(ethylene-butylene)-polystyrene triblock copolymers, available from Kraton Performance Polymers Inc., such as KRATON G1641 (having 33 weight percent polystyrene), G1650 (having 30 weight percent polystyrene), G1651 (having 33 weight percent polystyrene), and G1654 (having 31 weight percent polystyrene); and polystyrene-poly(ethylene-ethylene / propylene)-polystyrene triblock copolymers, available from Kuraray, such as SEPTON S4044, S4055, S4077, and S4099. Other commercially available hydrogenated block copolymers include polystyrene-poly(ethylene-butylene)-polystyrene (SEBS) triblock copolymers available from Dynasol as CALPRENE H6140 (having 31 wt % polystyrene), H6170 (having 33 wt % polystyrene), H6171 (having 33 wt % polystyrene), and H6174 (having 33 wt % polystyrene); and available from Kuraray as SEPTON 8006 (having 33 wt % polystyrene) and 8007 (having 30 wt % polystyrene); polystyrene-poly(ethylene-propylene)-polystyrene (SEPS) copolymers available from Kuraray as SEPTON 2006 (having 35 wt % polystyrene) and 2007 (having 30 wt % polystyrene); and oil-extended compounds of these hydrogenated block copolymers available from Kraton Performance Polymers Inc. as KRATON G4609 (containing 45% mineral oil, and the SEBS has 33 weight percent polystyrene) and G4610 (containing 31% mineral oil, and the SEBS has 33 weight percent polystyrene); and TUFTEC H1272 available from Asahi (containing 36% oil, and the SEBS has 35 weight percent polystyrene). A mixture of two or more hydrogenated block copolymers can be used. In some embodiments, the hydrogenated block copolymer comprises a polystyrene poly(ethylene-butylene)-polystyrene triblock copolymer having a weight average molecular weight of at least 100,000 g / mole or 200,000 to 400,000 g / mole.

[0060] When present, the composition comprises the hydrogenated block copolymer in an amount of 0.1 to 10 weight percent based on the total weight of the composition. Within this range, the amount of the hydrogenated block copolymer may be 0.5 to 10 weight percent or 1 to 9 weight percent.

[0061] The composition can optionally minimize or exclude any component not specifically disclosed herein. For example, the composition can optionally minimize or exclude thermoplastic polymers except polyamide, polyphenylene ether and polyether ester amide. For example, the composition can include less than 10 weight percent, less than 5 weight percent, less than 1 weight percent, less than 0.1 weight percent or exclude thermoplastic polymers except polyamide, polyphenylene ether and polyether ester amide. In one aspect, the composition can minimize or exclude reinforcing fillers. For example, the composition can include less than 10 weight percent, less than 5 weight percent, less than 1 weight percent, less than 0.1 weight percent or exclude reinforcing fillers. The composition can exclude reinforcing fillers except glass fiber. In one aspect, when reinforcing fillers are included in the composition, impact modifiers can be minimized or excluded in the composition (for example, with less than 5 weight percent, less than 1 weight percent, less than 0.1 weight percent amount present or exclude impact modifiers). Conversely, in one aspect, when an impact modifier is present in the composition, reinforcing fillers can be minimized or excluded from the composition (e.g., present or exclude reinforcing fillers in an amount less than 5 weight percent, less than 1 weight percent, less than 0.1 weight percent). In one aspect, the composition can minimize or exclude conductive fillers, such as conductive carbon fillers, such as conductive carbon black. In one aspect, the composition can minimize or exclude monomeric or polymeric antistatic agents other than polyetheresteramides. In a specific aspect, the composition can exclude vinyl polymers containing carboxyl, epoxy, amino, hydroxyl, polyoxyalkylene groups, oxazoline groups, or combinations thereof.

[0062] A molded article comprising a composition of the present disclosure may exhibit one or more desired properties. For example, the molded article may exhibit a heat distortion temperature of 120° C. or higher or 150° C. or higher as measured according to ASTM D648. The molded article may exhibit a heat distortion temperature of 100° C. or higher as measured according to ASTM D257. 8 ohm / sq to 10 13 ohm / sq or 10 9 ohm / sq to 10 13ohm / sq surface resistivity. The composition can exhibit good dielectric properties. For example, as further described in the working examples below, the molded article can exhibit a dielectric constant of less than 4 measured using a QWED split-column dielectric resonator and an Agilent PNA network analyzer. The molded article can exhibit a parasitic capacitance of less than or equal to 0.2pF measured using a capacitor signal detector (e.g., model CAN11) at 100kHz and 1 volt. The molded article can advantageously exhibit a light color. As used herein, the term "light color" refers to a molded article having an L* value greater than 50 units, preferably greater than 70 units. In contrast, the term "dark color" refers to a molded article having an L* value less than 50 units. L* refers to the CIELAB color scale, where L* represents the brightness of the color, where L*=0 is black and L*=100 is white. The L* value can be measured using a 10-degree observer and a D65 illumination source and according to ASTMD2244. In one aspect, the molded article can have a desired white color without the use of a colorant or pigment. In one aspect, the molded article can have a heat distortion temperature of 150° C. or greater as measured according to ASTM D648, and can be subjected to in-line electrostatic spraying.

[0063] Mechanical and processing properties of interest include, but are not limited to, notched and unnotched Izod impact strength (tested according to ASTM D256), flexural modulus and flexural strength (tested according to ASTM D790), and tensile modulus / strength / elongation (tested according to ASTM D638), as further described in the working examples below. For example, the composition may exhibit a flexural modulus of 1200 MPa or more as measured according to ASTM D790. The molded article may exhibit a notched Izod impact strength of 30 J / m or more as measured at 23° C. according to ASTM D256. The molded sample of the composition may exhibit one or more of the foregoing properties. In one aspect, the molded article exhibits a heat distortion temperature of 120° C. or more as measured according to ASTM D648; a heat distortion temperature of 100° C. or more as measured according to ASTM D257; a heat distortion temperature of 100° C. or more as measured according to ASTM D257; a heat distortion temperature of 100° C. or more as measured according to ASTM D257. 8 ohm / sq to 10 13 ohm / sq surface resistivity; a dielectric constant of less than 4 as measured using a QWED split-pillar dielectric resonator and an Agilent PNA network analyzer; a flexural modulus of 1200 MPa or more as measured according to ASTM D790; and a parasitic capacitance of less than or equal to 0.2 pF as measured using a capacitor signal detector at 100 kHz and 1 volt. In one aspect, the molded article may exhibit a heat deflection temperature of 160°C or more as measured according to ASTM D648; a heat deflection temperature of 100°C or more as measured according to ASTM D257; and a heat deflection temperature of 100°C or more as measured according to ASTM D648. 9 ohm / sq to 10 13ohm / sq surface resistivity; dielectric constant 2.5 to 3.5 as measured using a QWED split-pillar dielectric resonator and an Agilent PNA network analyzer; flexural modulus 1500 MPa or greater as measured in accordance with ASTM D790; parasitic capacitance less than or equal to 0.2 pF as measured using a capacitor signal detector at 100 kHz and 1 V; light color; and able to withstand in-line electrostatic spraying.

[0064] In one specific aspect, a molded article comprises a composition comprising: 30 to 70 weight percent of a polyamide; 25 to 40 weight percent of a polyphenylene ether; 5 to 20 weight percent of a polyetheresteramide; and optionally, 5 to 25 weight percent of a reinforcing filler; wherein the molded article exhibits: a heat distortion temperature of 160° C. or more as measured according to ASTM D648; a heat distortion temperature of 100° C. or more as measured according to ASTM D257 ... 9 ohm / sq to 10 13 ohm / sq surface resistivity; dielectric constant of 2.5 to 3.5 as measured using a QWED split-pillar dielectric resonator and an Agilent PNA network analyzer; flexural modulus of 1500 MPa or more as measured according to ASTM D790; parasitic capacitance of less than or equal to 0.2 pF, measured at 100 kHz and 1 V using a capacitor signal detector; light color; and able to withstand online electrostatic spraying. In one aspect, the polyamide comprises polyamide 6, polyamide 6,6, or a combination thereof; the polyphenylene ether comprises repeating units derived from 2,6-dimethylphenol; the polyetheresteramide comprises polyamide 6 segments and poly(ethylene oxide) segments; and when present, the reinforcing filler comprises glass fibers.

[0065] The composition can be prepared by melt blending or melt kneading the components of the composition. Common equipment can be used for melt blending or melt kneading, such as a ribbon blender, HENSCHEL TM Mixer, BANBURY TM Mixer, drum, single screw extruder, twin screw extruder, multi-screw extruder, co-kneader, etc. For example, the composition of the present invention can be prepared by melt blending the components in a twin screw extruder at a temperature of 245 to 310° C., 260 to 310° C., or 280 to 300° C. Exemplary methods are further described in the working examples below.

[0066] The molded articles comprising the composition may include automotive, electrical and electronic components. In one aspect, the molded article is a component of a consumer electronic device. In one aspect, the molded article is an automotive component. Suitable methods for forming such articles include single-layer and multi-layer sheet extrusion, injection molding, blow molding, film extrusion, profile extrusion, pultrusion, compression molding, thermoforming, pressure forming, hydroforming, vacuum forming, and the like. Combinations of the foregoing article manufacturing methods may be used.

[0067] In one specific aspect, the article is an automotive component, such as an exterior automotive component. As used herein, an exterior automotive part refers to an automotive part that provides or substantially contributes to the appearance of the vehicle for appearance purposes. For example, exemplary automotive parts may include door covers, exterior trim, charger covers, or fenders. Non-automotive applications are also contemplated, including interior and exterior appliance panels for appliances including refrigerators and freezers; handles for appliances, equipment, or other items; trays for refrigerators, freezers, or other items; and storage bins or shelves.

[0068] The present disclosure is further illustrated by the following examples, which are non-limiting.

[0069] Example

[0070] The materials used in the following examples are described in Table 1.

[0071] Table 1

[0072]

[0073]

[0074] The compositions were compounded using a TEM-37BS compounder. All components were added at the feed throat, except for the polyamide and glass fibers and GMA, which were added downstream using a side feeder. The processing parameters used are summarized in Table 2.

[0075] Table 2

[0076] Screw design L-2-1 Feed (zone 0) temperature. -- Zone 1 temperature. 50℃ Zone 2 temperature. 150℃ Zone 3 temperature. 240℃ Zone 4 temperature. 250℃ Zone 5 temperature. 250℃ Zone 6 temperature. 250℃ Zone 7 temperature. 255℃ Zone 8 temperature. 255℃ Zone 9 temperature. 255℃ Zone 10 temperature. 255℃ Zone 11 temperature. 255℃ Zone 12 temperature. -- Mould temperature. 255℃ Screw speed 350rpm Throughput 30kg / hr vacuum -0.08 bar Side feeder 1 speed 250rpm

[0077] The parts were molded using a UH1000-110 injection molding machine with a temperature setting of 270-275-275-275° C. (from throat to nozzle) and a mold temperature of 75° C. The pellets were pre-dried at 110° C. for 2-4 hours prior to molding.

[0078] The properties of the molded parts were tested according to the following criteria.

[0079] The surface resistance and volume resistance were measured according to ASTM D257 using a 68 mm x 68 mm x 3 mm test specimen and a charge of 100 V.

[0080] The dielectric constant (Dk) and dissipation factor (Df) were tested at 1.1 GHz using a QWED split-pillar dielectric resonator and an Agilent PNA network analyzer with a sample size of 150*150*1.5 mm.

[0081] Heat Deflection Temperature (HDT) was determined according to ASTM D648 using the flat surface of a 3.2 mm thick ASTM bar and a load of 0.45 MPa.

[0082] Notched Izod Impact Strength (NII), expressed in Joules per meter, measured at 23°C and -30°C using a 5.5 Joule hammer and a 3.2 mm test bar according to ASTM D256,

[0083] The flexural properties were measured according to ASTM D790 on molded specimens having a thickness of 3.2 mm.

[0084] Tensile properties were determined according to ASTM D 638. Tensile stress at break (expressed in megapascals (MPa)), tensile strain at break (expressed in percent), and elastic modulus (expressed in MPa) were measured at 23°C using a test speed of 5 mm / min.

[0085] Shrinkage properties were determined by measuring the shrinkage from the mold cavity dimensions to the molded part dimensions using an injection molding disc with a 100 mm diameter and 3.2 mm thickness. Cross-flow (perpendicular to the flow) and inflow (parallel to the flow) shrinkage were measured on 5 discs after conditioning at room temperature for 24 hours in the laboratory. The average shrinkage was reported.

[0086] The water absorption is determined according to ISO 62.

[0087] The appearance of each molded article was further evaluated by visual inspection (eg, by the naked eye).

[0088] Capacitor signal transfer was evaluated by parasitic capacitance. If the composition achieved a parasitic capacitance of less than or equal to 0.2 picofarads (pF), the sample was rated as "pass". If the composition achieved a parasitic capacitance greater than 0.2 pF, the sample was rated as "fail". Parasitic capacitance was measured using a CAN11 model capacitor signal detector at 100 kHz and 1 volt.

[0089] The molded samples of the composition were also tested for their ability to withstand in-line electrostatic painting. If the sample achieved a rating of 5B or better in the cross-hatch adhesion test according to ASTM 3359 and exhibited an HDT of at least 150°C as determined by ASTM D648, the sample was rated as "pass". Testing was performed using the flat side of a 3.2 mm thick ASTM bar and a load of 0.45 MPa. If the sample failed to achieve a rating of at least 5B in the cross-hatch adhesion test according to ASTM 3359, or if the sample exhibited an HDT of less than 150°C as determined by ASTM D648, the sample was rated as "failed".

[0090] The compositions and properties are summarized in Table 3. The amount of each component is provided as weight percent, based on the total weight of the composition.

[0091] Table 3

[0092]

[0093]

[0094] As shown in Table 3, each of Examples E1-E5 exhibits similar conductivity compared to the composition of Comparative Example CE1 including carbon black. As further shown in Table 3, the heat resistance and mechanical strength of the composition can be further improved by adding reinforcing fillers such as glass fibers. In addition, each of Examples E1-E12 achieves a parasitic capacitance less than or equal to 0.2 pF. In other advantageous features, each composition of Examples E2-E6 and E12 exhibits an HDT greater than 150°C and achieves a rating of at least 5B in the cross-hatch adhesion test, and is therefore able to withstand an online electrostatic coating method (i.e., graded as "passed" in Table 3). Therefore, the present disclosure provides significant improvements.

[0095] The present invention further encompasses the following aspects.

[0096] Aspect 1: A molded article comprising a composition comprising: 25 to 77 weight percent of a polyamide; 20 to 45 weight percent of a polyphenylene ether; 3 to 30 weight percent of a polyetheresteramide; wherein the weight percent of each component is based on the total weight of the composition; wherein the molded article is an automotive component; and wherein the molded article exhibits: a heat distortion temperature of 120°C or higher as measured according to ASTM D648; a heat distortion temperature of 10 8 ohm / sq to 10 13ohm / sq surface resistivity; a dielectric constant of less than 4 as measured using a QWED split-pillar dielectric resonator and an Agilent PNA network analyzer; a flexural modulus of 1200 MPa or greater as measured in accordance with ASTM D790; and a parasitic capacitance of less than or equal to 0.2 pF as measured using a capacitor signal detector at 100 kHz and 1 volt.

[0097] Aspect 2: The molded article according to aspect 1, wherein the molded article has a light color, preferably wherein the molded article exhibits a CIE lightness value L* value greater than 50 units or greater than 70 units as measured according to ASTM D2244 using a 10 degree observer and a D65 illumination source.

[0098] Aspect 3: The molded article according to aspect 1 or 2, wherein the molded article

[0099] Having a heat distortion temperature of 150°C or higher as measured according to ASTM D648; and being able to withstand an online electrostatic spraying process at a temperature of 150°C or higher.

[0100] Aspect 4: The molded article according to any one of aspects 1 to 3, wherein the polyamide comprises polyamide 6, polyamide 6,6, polyamide 6,10, polyamide 10,10, polyamide 9T, polyamide 6T, polyamide 10T, polyamide 6I, polyamide MXD6, or a combination thereof.

[0101] Aspect 5: The molded article according to any one of aspects 1 to 4, wherein the polyphenylene ether includes a repeating unit derived from 2,6-dimethylphenol.

[0102] Aspect 6: The molded article according to any one of aspects 1 to 5, wherein the polyetheresteramide comprises a hard segment containing polyamide and a soft segment containing polyalkylene oxide, preferably, wherein the polyetheresteramide comprises a polyamide 6 segment and a poly(ethylene oxide) segment.

[0103] Aspect 7: The molded article according to any one of aspects 1 to 6, wherein the composition further comprises 5 to 30 weight percent of a reinforcing filler, preferably, wherein the reinforcing filler comprises glass fiber.

[0104] Aspect 8: The molded article according to any one of aspects 1 to 7, wherein the composition further comprises an additive composition, preferably wherein the additive composition comprises a compatibilizer, an antioxidant, or a combination thereof.

[0105] Aspect 9: The molded article of any one of aspects 1 to 8, wherein the composition comprises 40 to 60 weight percent of the polyamide; 35 to 45 weight percent of the polyphenylene ether; and 5 to 17 weight percent of the polyetheresteramide.

[0106] Aspect 10: The molded article of any one of aspects 1 to 8, wherein the composition comprises 30 to 60 weight percent of the polyamide; 25 to 35 weight percent of the polyphenylene ether; 10 to 25 weight percent of the polyetheresteramide; and 5 to 25 weight percent of the reinforcing filler.

[0107] Aspect 11: A molded article according to any one of aspects 1 to 8, wherein the composition comprises 30 to 70 weight percent of the polyamide; 25 to 40 weight percent of the polyphenylene ether; 5 to 20 weight percent of the polyetheresteramide; and optionally, 5 to 25 weight percent of a reinforcing filler; wherein the molded article exhibits: a heat distortion temperature of 160°C or higher as measured according to ASTM D648; a heat distortion temperature of 100°C or higher as measured according to ASTM D257 ...648; a heat distortion temperature of 100°C or higher as measured according to ASTM D257; a heat distortion temperature of 100°C or 9 ohm / sq to 10 13 ohm / sq surface resistivity; dielectric constant 2.5 to 3.5 as measured using a QWED split-pillar dielectric resonator and an Agilent PNA network analyzer; flexural modulus of 1500 MPa or greater as measured in accordance with ASTM D790; parasitic capacitance less than or equal to 0.2 pF, measured at 100 kHz and 1 V using a capacitor signal detector; CIE lightness value L* value greater than 50 units or greater than 70 units as measured in accordance with ASTM D2244 using a 10 degree observer and D65 illumination source; and the ability to withstand an in-line electrostatic spray process at a temperature of 150°C or greater.

[0108] Aspect 12: A molded article according to aspect 11, wherein the polyamide comprises polyamide 6, polyamide 6,6, or a combination thereof; the polyphenylene ether comprises repeating units derived from 2,6-dimethylphenol; the polyetheresteramide comprises polyamide 6 segments and poly(ethylene oxide) segments; and when present, the reinforcing filler comprises glass fibers.

[0109] Aspect 13: The molded article according to any one of aspects 1 to 12, wherein conductive fillers are excluded from the composition, preferably, wherein carbon black is excluded from the composition.

[0110] Aspect 14: The molded article according to any one of aspects 1 to 13, wherein the composition comprises a continuous phase comprising the polyamide and the polyetheresteramide and a dispersed phase comprising the polyphenylene ether.

[0111] Aspect 15: The molded article according to any one of aspects 1 to 14, wherein the automobile part is a door cover, a charger flap, or a fender.

[0112] Alternatively, the compositions, methods and articles may comprise, consist of or consist essentially of any suitable material, step or component disclosed herein. The compositions, methods and articles may additionally or alternatively be formulated so as to be free of or essentially free of any material (or species), step or component that is otherwise not necessary to achieve the function or purpose of the compositions, methods and articles.

[0113] All ranges disclosed herein include endpoints, and endpoints can be combined independently of each other. "Combination" includes blends, mixtures, alloys, reaction products, etc. The terms "first", "second", etc. do not represent any order, quantity, or importance, but are used to distinguish one element from another. Unless otherwise specified herein or clearly contradictory to the context, the terms "one" and "a kind of" and "the" do not represent the limitation of quantity, but are interpreted as covering the singular and plural. Unless otherwise clearly stated, "or" means "and / or". Throughout the specification, mentioning "an aspect" means that the specific elements described in conjunction with the aspect are included in at least one aspect described herein, and may or may not be present in other aspects. The term "their combination" as used in this article includes one or more listed elements, and is open, allowing one or more unnamed similar elements to exist. In addition, it should be understood that the described elements can be combined in any suitable manner in various aspects.

[0114] Unless specified to the contrary herein, all test standards are the most current standards in effect as of the filing date of this application, or, if priority is claimed, the filing date of the earliest priority application in which the test standards appear.

[0115] Unless otherwise defined, technical and scientific terms used herein have the same meanings as those generally understood by those of ordinary skill in the art to which this application belongs. All cited patents, patent applications, and other references are incorporated herein by reference in their entirety. However, if a term in this application contradicts or conflicts with a term in a combined reference, the term from this application takes precedence over the conflicting term from the combined reference.

[0116] Compounds are described using standard nomenclature. For example, any position not substituted by any indicator group is understood to have its valency filled by a bond or hydrogen atom as indicated. A dash ("-") not between two letters or symbols is used to indicate the point of attachment of a substituent. For example, -CHO is connected through the carbon of a carbonyl group.

[0117] As used in this article, the term "alkyl", whether used alone or as a prefix, suffix or fragment of another term, refers to a residue containing only carbon and hydrogen. The residue can be aliphatic or aromatic, straight chain, cyclic, bicyclic, branched, saturated or unsaturated. It can also contain a combination of aliphatic, aromatic, straight chain, cyclic, bicyclic, branched, saturated and unsaturated hydrocarbon parts. However, when the alkyl residue is described as substituted, it can optionally contain heteroatoms on and above the carbon and hydrogen members of the substituent residue. Therefore, when specifically described as substituted, the alkyl residue can also include one or more carbonyls, amino, hydroxyl, etc., or it can include heteroatoms in the main chain of the alkyl residue. The term "alkyl" refers to a branched or straight chain, saturated aliphatic hydrocarbon group, for example, methyl, ethyl, n-propyl, isopropyl, n-butyl, sec-butyl, tert-butyl, n-pentyl, sec-pentyl and n-hexyl and sec-hexyl. "Alkenyl" refers to a straight or branched monovalent hydrocarbon radical having at least one carbon-carbon double bond (e.g., vinyl (-HC=CH2)). "Alkoxy" refers to an alkyl radical attached via an oxygen (i.e., alkyl-O-), such as methoxy, ethoxy, and sec-butoxy. "Alkylene" refers to a straight or branched, saturated, divalent aliphatic hydrocarbon radical (e.g., methylene (-CH2-) or propylene (-(CH2)3-)). "Cycloalkylene" refers to a divalent cyclic alkylene radical, -C n H 2n-x , where x is the number of hydrogens replaced by cyclization. "Cycloalkenyl" refers to a monovalent group having one or more rings and one or more carbon-carbon double bonds in the ring, wherein all ring members are carbon (e.g., cyclopentyl and cyclohexyl). "Aryl" refers to an aromatic hydrocarbon group containing a specified number of carbon atoms, such as phenyl, cycloheptatrienone, indanyl or naphthyl. "Arylene" refers to a divalent aryl group. "Alkylidenearylene" refers to an arylene substituted by an alkyl group. "Arylalkylene" refers to an alkylene substituted by an aryl group (e.g., benzyl). The prefix "halo" refers to a group or compound comprising one or more of fluorine, chlorine, bromine or iodine substituents. There may be a combination of different halogen atoms (e.g., bromine and fluorine) or only chlorine atoms. The prefix "hetero" refers to a compound or group comprising at least one ring member of a heteroatom (e.g., 1, 2 or 3 heteroatoms), wherein the heteroatoms are each independently N, O, S, Si or P. "Substituted" means that the compound or group is substituted with at least one (e.g., 1, 2, 3 or 4) substituents, each of which may be independently C 1-9 Alkoxy, C 1-9 Haloalkoxy, nitro (-NO2), cyano (-CN), C 1-6 Alkylsulfonyl (-S(=O)2-alkyl), C 6-12 Arylsulfonyl (-S(=O)2-aryl), thiol (-SH), thiocyanate (-SCN), tosyl (CH3C6H4SO2-), C3-12 Cycloalkyl, C 2-12 Alkenyl, C 5-12 Cycloalkenyl, C 6-12 Aryl, C 7-13 Arylalkylene, C 4-12 Heterocycloalkyl and C 3-12 A heteroaryl group replaces a hydrogen provided that the normal valence of the substituted atom is not exceeded. The number of carbon atoms indicated in the group does not include any substituents. For example, -CH2CH2CN is a C2 alkyl group substituted with a nitrile.

[0118] Although specific embodiments have been described, alternatives, modifications, variations, improvements, and substantial equivalents that are not currently foreseeable or may not be foreseeable may occur to the applicant or other persons skilled in the art. Therefore, the appended claims as filed and as they may be amended are intended to cover all such alternatives, modifications, variations, improvements, and substantial equivalents.

Claims

1. A molded article comprising a composition comprising: 25 to 77 weight percent polyamide; 20 to 45 weight percent polyphenylene ether; 3 to 30 weight percent of polyetheresteramide; in, The weight percentage of each component is based on the total weight of the composition; wherein the molded article is an automotive component; and Wherein, the molded article exhibits: A heat deflection temperature of 120°C or higher as determined in accordance with ASTM D648; 10 according to ASTM D257 8 ohm / sq to 10 13 Surface resistivity in ohm / sq; A dielectric constant of less than 4 measured using a QWED split-pillar dielectric resonator and an Agilent PNA network analyzer; A flexural modulus of 1200 MPa or greater as measured according to ASTM D790; and Parasitic capacitance less than or equal to 0.2 pF measured using a capacitor signal detector at 100 kHz and 1 volt.

2. The molded article according to claim 1, wherein The molded article has a light color, preferably wherein the molded article exhibits a CIE lightness value L* value greater than 50 units or greater than 70 units measured according to ASTM D2244 using a 10 degree observer and a D65 illumination source.

3. The molded article according to claim 1 or 2, wherein The molded product Having a heat deflection temperature of 150°C or greater as measured in accordance with ASTM D648; and Able to withstand online electrostatic spraying process at temperatures of 150°C or higher.

4. The molded article according to any one of claims 1 to 3, wherein The polyamide includes polyamide 6, polyamide 6,6, polyamide 6,10, polyamide 10,10, polyamide 9T, polyamide 6T, polyamide 10T, polyamide 6I, polyamide MXD6 or a combination thereof.

5. The molded article according to any one of claims 1 to 4, wherein The polyphenylene ether includes repeating units derived from 2,6-dimethylphenol.

6. The molded article according to any one of claims 1 to 5, wherein The polyetheresteramide comprises a hard segment comprising polyamide and a soft segment comprising polyalkylene oxide. Preferably, the polyetheresteramide comprises a polyamide 6 segment and a poly(ethylene oxide) segment.

7. The molded article according to any one of claims 1 to 6, wherein The composition further comprises 5 to 30 weight percent of a reinforcing filler, preferably, wherein the reinforcing filler comprises glass fiber.

8. The molded article according to any one of claims 1 to 7, wherein The composition further comprises an additive composition, preferably wherein the additive composition comprises a compatibilizer, an antioxidant or a combination thereof.

9. The molded article according to any one of claims 1 to 8, wherein The composition comprises 40 to 60 weight percent of said polyamide; 35 to 45 weight percent of said polyphenylene ether; and 5 to 17 weight percent of the polyetheresteramide.

10. The molded article according to any one of claims 1 to 8, wherein The composition comprises 30 to 60 weight percent of said polyamide; 25 to 35 weight percent of the polyphenylene ether; 10 to 25 weight percent of said polyetheresteramide; and 5 to 25 weight percent reinforcing filler.

11. The molded article according to any one of claims 1 to 8, wherein The composition comprises 30 to 70 weight percent of said polyamide; 25 to 40 weight percent of the polyphenylene ether; 5 to 20 weight percent of said polyetheresteramide; and Optionally, 5 to 25 weight percent of a reinforcing filler; Wherein, the molded article exhibits: A heat deflection temperature of 160°C or higher as determined in accordance with ASTM D648; 10 according to ASTM D257 9 ohm / sq to 10 13 Surface resistivity in ohm / sq; Dielectric constants of 2.5 to 3.5 measured using QWED split-pillar dielectric resonators and an Agilent PNA network analyzer; Flexural modulus of 1500 MPa or greater as determined in accordance with ASTM D790; A parasitic capacitance of less than or equal to 0.2 pF measured at 100 kHz and 1 volt using a capacitor signal detector; A CIE lightness L* value greater than 50 units or greater than 70 units as measured according to ASTM D2244 using a 10 degree observer and D65 illumination; and Able to withstand online electrostatic spraying process at temperatures of 150°C or higher.

12. The molded article according to claim 11, wherein The polyamide comprises polyamide 6, polyamide 6,6 or a combination thereof; The polyphenylene ether includes repeating units derived from 2,6-dimethylphenol; The polyetheresteramide comprises a polyamide 6 segment and a poly(ethylene oxide) segment; and When present, the reinforcing filler comprises glass fibers.

13. The molded article according to any one of claims 1 to 12, wherein Conductive fillers are excluded from the composition, preferably wherein carbon black is excluded from the composition.

14. The molded article according to any one of claims 1 to 13, wherein The composition comprises a continuous phase and a dispersed phase, the continuous phase comprises the polyamide and the polyetheresteramide, and the dispersed phase comprises the polyphenylene ether.

15. The molded article according to any one of claims 1 to 14, wherein The vehicle component is a door cover, a charger flap or a fender.

Citation Information

Patent Citations

  • Polyphenylene ether-polyamide compositions

    US4970272A