Resin composition, pellets, and molded article

Abstract

The invention provides a resin composition, a pellet and a molded article. A resin composition comprising (a) a polyphenylene ether resin, (b) a polypropylene homopolymer, (c) a polyolefin copolymer having a load of 2.16 kg measured in accordance with JIS-K7210 and a melt flow rate (MFR) of 0.3-25 g / 10 minutes at a temperature of 230 DEG C, (d) a hollow inorganic filler, and (e) a block copolymer that is a hydride comprising a vinyl aromatic compound block (e1) and an isoprene polymer block (e2), the hollow inorganic filler (d) is contained in an amount of 6-30 parts by mass per 100 parts by mass of the resin composition.

Description

Technical Field

[0001] The present invention relates to a resin composition, a particle and a molded body, and particularly to a resin composition containing a polyphenylene ether resin as a main component. Background Art

[0002] A resin composition based on a polyphenylene ether resin (hereinafter sometimes referred to as a "polyphenylene ether resin composition") has advantages such as heat resistance, electrical properties, dimensional stability, impact resistance, and low specific gravity. Therefore, the polyphenylene ether resin composition has been widely used in various electrical / electronic components, office equipment components, automobile components, building materials, other various exterior materials, industrial products, etc. In addition, a reinforcing filler may be added to reinforce the polyphenylene ether resin composition.

[0003] On the other hand, from the viewpoint of weight reduction, a hollow inorganic filler may be blended into a thermoplastic resin as a reinforcing filler.

[0004] For example, Patent Document 1 discloses a resin composition comprising 20% ​​by mass or more and 99% by mass or less of at least one thermoplastic resin (A), 1% by mass or more and 80% by mass or less of hollow microspheres (B), and 1% by mass or more and 100% by mass or less of organic fibers (C) relative to 100% by mass of the total amount of the thermoplastic resin (A) and the hollow microspheres (B), wherein the melting point and decomposition starting temperature of the organic fibers (C) are higher than the melting point of the thermoplastic resin (A).

[0005] Prior art literature

[0006] Patent Literature

[0007] Patent Document 1: Japanese Patent Application Publication No. 2016-108372 Summary of the invention

[0008] Problems to be solved by the invention

[0009] As mentioned above, when a hollow inorganic filler is used as a reinforcing filler, the resin composition or the molded body obtained from the resin composition can be lightened. However, there is a tendency that the impact resistance of the molded body decreases. In addition, when an impact modifier is used to improve the impact resistance, there is a tendency that the heat resistance decreases.

[0010] The present invention aims to solve the above-mentioned problems and provides a low specific gravity resin composition, particles and a molded body comprising a polyphenylene ether resin and a hollow inorganic filler, wherein the resin composition can provide a molded body having excellent impact resistance while maintaining the heat resistance of the polyphenylene ether resin.

[0011] Solutions to the problem

[0012] The present inventors have conducted studies based on the above problems and have found that the above problems can be solved by blending a predetermined polyolefin and a predetermined block copolymer together with a hollow filler into a polyphenylene ether resin.

[0013] Specifically, the above problems can be solved by the following methods.

[0014] <1> A resin composition comprising:

[0015] (a) polyphenylene ether resin,

[0016] (b) polypropylene homopolymer,

[0017] (c) a polyolefin copolymer having a melt flow rate (MFR) of 0.3 to 25 g / 10 min at a load of 2.16 kg and a temperature of 230° C. as measured in accordance with JIS-K7210,

[0018] (d) hollow inorganic fillers, and

[0019] (e) block copolymers,

[0020] The (e) block copolymer is a hydrogenated product comprising a vinyl aromatic compound block (e1) and an isoprene polymer block (e2),

[0021] The (d) hollow inorganic filler is contained in a ratio of 6 to 30 parts by mass in 100 parts by mass of the resin composition.

[0022] <2> according to <1> The resin composition, wherein

[0023] The (d) hollow inorganic filler is contained in a ratio of 6 to 20 parts by mass in 100 parts by mass of the resin composition.

[0024] <3> according to <1> or <2> The resin composition, wherein

[0025] The compressive failure strength of the (d) hollow inorganic filler is 105 to 130 MPa.

[0026] <4> according to <1> ~ <3> The resin composition described in any one of the preceding claims, wherein

[0027] The (a) polyphenylene ether resin is contained in an amount of 40 to 65% by mass, and the (b) polypropylene homopolymer and the (c) polyolefin copolymer are contained in an amount of 35 to 60% by mass, based on 100% by mass of the total of the (a) polyphenylene ether resin, the (b) polypropylene homopolymer and the (c) polyolefin copolymer.

[0028] <5> according to <1> ~ <4> The resin composition described above further comprises (f) a polystyrene resin having a weight average molecular weight (Mw) of 3,000 to 20,000.

[0029] <6> according to <1> ~ <5> The resin composition described in any one of the preceding claims, wherein

[0030] The content of the vinyl aromatic compound unit in the (e) block copolymer is 50% by mass or more and less than 80% by mass.

[0031] <7> according to <1> ~ <6> The resin composition described in any one of the preceding claims, wherein

[0032] The compressive failure strength of the hollow inorganic filler (d) is 105 to 130 MPa,

[0033] The polyphenylene ether resin (a) is contained in an amount of 40 to 65% by weight, and the polyphenylene ether resin (b) is contained in an amount of 35 to 60% by weight, relative to 100% by weight of the total of the (a) polyphenylene ether resin, the (b) polypropylene homopolymer, and the (c) polyolefin copolymer.

[0034] further comprising (f) a polystyrene resin having a weight average molecular weight (Mw) of 3,000 to 20,000,

[0035] The content of the vinyl aromatic compound unit in the (e) block copolymer is 50% by mass or more and less than 80% by mass.

[0036] <8> A particle which is <1> ~ <7> Pellets of the resin composition described above.

[0037] <9> A molded body comprising <1> ~ <7> The resin composition described above is molded.

[0038] <10> A molded body comprising <8> The particles are formed.

[0039] Effects of the Invention

[0040] The present invention can provide a low-specific-gravity resin composition comprising a polyphenylene ether resin and a hollow inorganic filler, as well as particles and a molded body. The resin composition can provide a molded body having excellent impact resistance while maintaining the heat resistance of the polyphenylene ether resin. DETAILED DESCRIPTION

[0041] Hereinafter, a mode for implementing the present invention (hereinafter referred to as "this embodiment") will be described in detail. It should be noted that the following this embodiment is an example for describing the present invention, and the present invention is not limited to this embodiment.

[0042] In addition, in this specification, "to" is used to mean that the numerical values ​​described before and after it are included as a lower limit and an upper limit.

[0043] In this specification, various physical property values ​​and characteristic values ​​are values ​​at 23° C. unless otherwise specified.

[0044] Unless otherwise specified, when the measurement method and the like described in the standards shown in this specification differ depending on the year, they refer to the standards based on the time of January 1, 2022.

[0045] The resin composition of the present embodiment comprises: (a) a polyphenylene ether resin, (b) a polypropylene homopolymer, (c) a polyolefin copolymer having a melt flow rate (MFR) of 0.3 to 25 g / 10 min at a load of 2.16 kg and a temperature of 230° C. as measured in accordance with JIS-K7210 (sometimes referred to as “(c) polyolefin copolymer” in this specification), (d) a hollow inorganic filler, and (e) a block copolymer, wherein the (e) block copolymer is a hydrogenated product comprising a vinyl aromatic compound block (e1) and an isoprene polymer block (e2), and the (d) hollow inorganic filler is contained in a ratio of 6 to 30 parts by mass in 100 parts by mass of the resin composition.

[0046] With such a configuration, it is possible to provide a low specific gravity resin composition comprising a polyphenylene ether resin and a hollow inorganic filler, which can provide a molded article having excellent impact resistance while maintaining the heat resistance of the polyphenylene ether resin.

[0047] By adding (d) the hollow inorganic filler to the (a) polyphenylene ether resin, the specific gravity of the resin composition can be reduced. In addition, compared with the (a) polyphenylene ether resin, the (b) polypropylene homopolymer also has a lower specific gravity, so by adding the (b) polypropylene homopolymer, the specific gravity of the resin composition is reduced.

[0048] However, when the hollow inorganic filler (d) is added, the impact resistance tends to be deteriorated. In addition, the polypropylene homopolymer (b) also tends to deteriorate the impact resistance. However, in the present embodiment, it can be inferred that the deterioration of the impact resistance can be suppressed by adding the polyolefin copolymer (c) and the polypropylene homopolymer (b). It can be inferred that this is because the polypropylene homopolymer (b) and the polyolefin copolymer (c) are mixed in one part and dispersed in another part, so that a dispersed structure capable of absorbing greater impact energy can be formed.

[0049] In addition, the resin composition of the present embodiment includes a hydrogenated product of a block copolymer (e), wherein the block copolymer (e) includes a vinyl aromatic compound block (e1) and an isoprene polymer block (e2). It can be inferred that the component (e) itself is an elastomer and is not only easy to absorb impact energy, but also the vinyl aromatic compound block (e1) is similar in structure to the (a) polyphenylene ether resin, and the isoprene polymer block (e2) is similar in structure to the (b) polypropylene homopolymer. Due to the high affinity with each component, it can also act as a compatibilizer to microdisperse the (a) polyphenylene ether resin, thereby improving impact resistance and maintaining heat resistance.

[0050] <(a) Polyphenylene ether resin>

[0051] The resin composition of the present embodiment contains (a) a polyphenylene ether resin.

[0052] The (a) polyphenylene ether resin used in the resin composition of the present embodiment may be a known polyphenylene ether resin, and examples thereof include polymers having a structural unit represented by the following formula in the main chain. The (a) polyphenylene ether resin may be a homopolymer or a copolymer.

[0053] [Chemical formula 1]

[0054]

[0055] (In the formula, 2 R a Each independently represents a hydrogen atom, a halogen atom, a primary or secondary alkyl group, an aryl group, an aminoalkyl group, a halogenated alkyl group, a hydrocarbyloxy group, or a halogenated hydrocarbyloxy group, and the two R b Each independently represents a hydrogen atom, a halogen atom, a primary or secondary alkyl group, an aryl group, a halogenated alkyl group, a hydrocarbyloxy group, or a halogenated hydrocarbyloxy group. a Not all are hydrogen atoms.)

[0056] As R a and R b , preferably each independently represents a hydrogen atom, a primary alkyl group or a secondary alkyl group, or an aryl group. Suitable examples of primary alkyl groups include methyl, ethyl, n-propyl, n-butyl, n-pentyl, isopentyl, 2-methylbutyl, 2,3-dimethylbutyl, 2-, 3- or 4-methylpentyl, or heptyl. Suitable examples of secondary alkyl groups include, for example, isopropyl, sec-butyl, or 1-ethylpropyl. In particular, R is preferably a is a primary or secondary alkyl group having 1 to 4 carbon atoms, or a phenyl group. b Preferred is a hydrogen atom.

[0057] Preferred homopolymers of the polyphenylene ether resin (a) include polymers of 2,6-dialkylphenylene ether such as poly(2,6-dimethyl-1,4-phenylene ether), poly(2,6-diethyl-1,4-phenylene ether), poly(2,6-dipropyl-1,4-phenylene ether), poly(2-ethyl-6-methyl-1,4-phenylene ether) and poly(2-methyl-6-propyl-1,4-phenylene ether). Examples of the copolymer include 2,6-dimethylphenol / 2,3,6-trimethylphenol copolymers, 2,6-dimethylphenol / 2,3,6-triethylphenol copolymers, 2,6-diethylphenol / 2,3,6-trimethylphenol copolymers, 2,6-dipropylphenol / 2,3,6-trimethylphenol copolymers and other 2,6-dialkylphenol / 2,3,6-trialkylphenol copolymers; graft copolymers obtained by graft-polymerizing styrene onto poly(2,6-dimethyl-1,4-phenylene ether); and graft copolymers obtained by graft-polymerizing styrene onto 2,6-dimethylphenol / 2,3,6-trimethylphenol copolymers.

[0058] The polyphenylene ether resin (a) of this embodiment is particularly preferably poly(2,6-dimethyl-1,4-phenylene ether) or a 2,6-dimethylphenol / 2,3,6-trimethylphenol random copolymer. In addition, polyphenylene ether resins with limited terminal group numbers and copper contents as described in Japanese Patent Application Laid-Open No. 2005-344065 may also be used appropriately.

[0059] The intrinsic viscosity of the (a) polyphenylene ether resin at 30°C measured in chloroform is preferably 0.2 to 0.8 dL / g, more preferably 0.3 to 0.6 dL / g. By setting the intrinsic viscosity to 0.2 dL / g or more, the mechanical strength of the resin composition tends to be further improved, and by setting it to 0.8 dL / g or less, the fluidity is further improved, and there is a tendency for molding processing to become easier. In addition, two or more (a) polyphenylene ether resins having different intrinsic viscosities may be used in combination, and the intrinsic viscosity range may be set.

[0060] The method for producing the polyphenylene ether resin (a) used in the present embodiment is not particularly limited, and can be prepared by a known method, for example, by oxidative polymerization of monomers such as 2,6-dimethylphenol in the presence of an amine copper catalyst. In this case, the intrinsic viscosity can be controlled to a desired range by selecting reaction conditions. The intrinsic viscosity can be controlled by selecting conditions such as polymerization temperature, polymerization time, and catalyst amount.

[0061] The content of (a) polyphenylene ether resin in the resin composition of the present embodiment is preferably more than 20.0 mass parts, more preferably more than 25.0 mass parts, more preferably more than 28.0 mass parts, more preferably more than 30.0 mass parts, and more preferably more than 33.0 mass parts. By being set to more than the above-mentioned lower limit, there is a tendency that the heat resistance (particularly load deflection temperature) of the obtained molded body is further improved. In addition, the upper limit of the content of the above-mentioned (a) polyphenylene ether resin is preferably less than 45.0 mass parts, more preferably less than 40.0 mass parts, and more preferably less than 38.0 mass parts in 100 mass parts of resin composition. By being set to less than the above-mentioned upper limit, there is a tendency to further improve the flowability improvement of the resin composition, the improvement of impact resistance, and the decrease effect of the specific gravity of the obtained molded body.

[0062] The resin composition of the present embodiment may contain only one type of (a) polyphenylene ether resin, or may contain two or more types. When containing two or more types, the total amount is preferably within the above range.

[0063] <(b) Polypropylene homopolymer>

[0064] The resin composition of the present embodiment contains (b) a polypropylene homopolymer.

[0065] The (b) polypropylene homopolymer used in the present embodiment is a polymer containing polypropylene as a main component.

[0066] That is, the polypropylene homopolymer (b) of the present embodiment may contain other monomer units within the scope of the present invention. However, the polypropylene homopolymer (b) of the present embodiment preferably has 95% by mass or more (preferably 97% by mass or more, more preferably 99% by mass or more) of propylene units.

[0067] (b) The polypropylene homopolymer may contain a crystal nucleating agent. As the crystal nucleating agent, a known crystal nucleating agent may be used, and examples thereof include metal salts of carboxylic acids, dibenzylidene sorbitol derivatives, and alkali metal salts of phosphoric acid esters.

[0068] Specific examples of the crystal nucleating agent include sodium benzoate, aluminum adipate, aluminum p-tert-butylbenzoate, 1,3,2,4-dibenzylidene sorbitol, 1,3,2,4-bis(p-methylbenzylidene)sorbitol, 1,3,2,4-bis(p-ethylbenzylidene)sorbitol, 1,3,2,4-bis(3,4-dimethylbenzylidene)sorbitol, sodium bis(4-tert-butylphenyl)phosphate, sodium bis(4-tert-methylphenyl)phosphate, potassium bis(4,6-di-tert-butylphenyl)phosphate, sodium 2,2'-methylenebis(4,6-di-tert-butylphenyl)phosphate, and sodium 2,2'-ethylenebis(4,6-di-tert-butylphenyl)phosphate.

[0069] For (b) polypropylene homopolymer, the melt flow rate (MFR) measured at a load of 2.16 kg and a temperature of 230° C. according to JIS-K7210 is preferably 0.1 g / 10 minutes or more, more preferably 0.5 g / 10 minutes or more, further preferably 1.0 g / 10 minutes or more, further preferably 1.5 g / 10 minutes or more, and further more preferably 2.0 g / 10 minutes or more. By setting it to above the lower limit, there is a tendency for the fluidity of the resin composition to be improved. In addition, the above MFR is preferably 10.0 g / 10 minutes or less, more preferably 8.0 g / 10 minutes or less, further preferably 5.0 g / 10 minutes or less, further preferably 4.0 g / 10 minutes or less, and further more preferably 3.0 g / 10 minutes or less. By setting it to below the above upper limit, there is a tendency for the tensile nominal strain and impact resistance of the molded body to be improved.

[0070] When the resin composition of the present embodiment contains two or more (b) polypropylene homopolymers, it is preferred that the MFR of the mixture of (b) polypropylene homopolymers is within the above range.

[0071] The content of the (b) polypropylene homopolymer in the resin composition of the present embodiment is preferably 20.0 parts by mass or more, more preferably 23.0 parts by mass or more, and further preferably 25.0 parts by mass or more in 100 parts by mass of the resin composition. By setting it to above the above lower limit, there is a tendency to further improve the effect of improving the fluidity of the resin composition and reducing the specific gravity of the obtained molded body. In addition, the upper limit of the content of the (b) polypropylene homopolymer is preferably 38.0 parts by mass or less, more preferably 35.0 parts by mass or less, and further preferably 32.0 parts by mass or less in 100 parts by mass of the resin composition. By setting it to below the above upper limit, there is a tendency to suppress the reduction of the impact resistance and heat resistance of the molded body.

[0072] The resin composition of the present embodiment may contain only one type of (b) polypropylene homopolymer, or may contain two or more types. When containing two or more types, the total amount is preferably within the above range.

[0073] <(c) Polyolefin copolymer>

[0074] The resin composition of the present embodiment contains (c) a polyolefin copolymer having a melt flow rate (MFR) of 0.3 to 25 g / 10 min at a load of 2.16 kg and a temperature of 230° C. as measured in accordance with JIS-K7210.

[0075] The above-mentioned MFR is preferably 0.5g / 10 minutes or more, more preferably 1.0g / 10 minutes or more, further preferably 3.0g / 10 minutes or more, further preferably 5.0g / 10 minutes or more, further more preferably 5.5g / 10 minutes or more. By setting it to above the above lower limit, there is a tendency that the fluidity of the resin composition is improved. In addition, the above-mentioned MFR is preferably 20.0g / 10 minutes or less, more preferably 15.0g / 10 minutes or less, further preferably 10.0g / 10 minutes or less, further preferably 8.0g / 10 minutes or less, further more preferably 7.5g / 10 minutes or less. By setting it to below the upper limit, there is a tendency that the impact resistance of the molded body is improved.

[0076] When the resin composition of the present embodiment contains two or more types of (c) polyolefin copolymers, it is preferred that the MFR of the mixture of the (c) polyolefin copolymers is within the above range.

[0077] The (c) polyolefin copolymer used in the present embodiment is a copolymer of two or more olefins. The olefin is preferably an olefin having 2 to 5 carbon atoms, and preferably ethylene, propylene, and butene.

[0078] In the present embodiment, copolymers of two or more of ethylene, propylene and butene are preferred, and specific examples include ethylene-propylene-butene copolymers, ethylene-propylene copolymers, ethylene-butene copolymers, and propylene-butene copolymers. Ethylene-propylene-butene copolymers, ethylene-propylene copolymers, and ethylene-butene copolymers are particularly preferred, and ethylene-propylene-butene copolymers are further preferred.

[0079] It should be noted that the copolymer of two or more olefins in the present embodiment may contain other monomer units within the scope of the present invention. However, the copolymer of two or more olefins in the present embodiment preferably has olefin units at 95% by mass or more (preferably 97% by mass or more, more preferably 99% by mass or more). For copolymers of two or more olefins in ethylene, propylene and butene, the same consideration is also used.

[0080] The content of (c) polyolefin copolymer in the resin composition of the present embodiment is preferably 1.0 mass parts or more, more preferably 2.0 mass parts or more, more preferably 3.0 mass parts or more, more preferably 4.0 mass parts or more, and more preferably 5.0 mass parts or more in 100 mass parts of the resin composition. By setting it to more than the above-mentioned lower limit, there is a tendency that the impact resistance and tensile nominal strain of the molded body are further improved. In addition, the upper limit of the content of the above-mentioned (c) polyolefin copolymer is preferably less than 20.0 mass parts, more preferably less than 15.0 mass parts, more preferably less than 12.0 mass parts, more preferably less than 10.0 mass parts, and can also be less than 5.9 mass parts. By setting it to less than the above-mentioned upper limit, there is a tendency that the heat resistance of the molded body is further improved.

[0081] The resin composition of the present embodiment may contain only one type of (c) polyolefin copolymer, or may contain two or more types. When containing two or more types, the total amount is preferably within the above range.

[0082] <Mixing Ratio of Components (a) to (c)>

[0083] The mixing ratio of the (a) polyphenylene ether resin, the (b) polypropylene homopolymer, and the (c) polyolefin copolymer in the resin composition of the present embodiment will be described.

[0084] The composition of this embodiment preferably contains 40 to 65% by mass of the (a) polyphenylene ether resin and 35 to 60% by mass of the (b) polypropylene homopolymer and (c) polyolefin copolymer, relative to 100% by mass of the total of the components (a) to (c).

[0085] More preferably, the content of (a) polyphenylene ether resin relative to the total 100% by mass of the above-mentioned (a) to (c) components is preferably 45% by mass or more, more preferably 48% by mass or more, further preferably 50% by mass or more, and may be 51% by mass or more. By setting it to above the above lower limit, there is a tendency that the heat resistance of the obtained molded body is further improved. In addition, the content of (a) polyphenylene ether resin relative to the total 100% by mass of the above-mentioned (a) to (c) components is preferably 60% by mass or less, more preferably 57% by mass or less, further preferably 55% by mass or less, and further preferably 53% by mass or less. By setting it to below the above upper limit, there is a tendency that the fluidity of the resin composition is improved and the effect of reducing the specific gravity of the obtained molded body is further improved.

[0086] More preferably, relative to the total of 100% by mass of the above-mentioned (a) to (c) components, the total content of (b) polypropylene homopolymer and (c) polyolefin copolymer is preferably 40% by mass or more, more preferably 43% by mass or more, further preferably 45% by mass or more, and further preferably 47% by mass or more. By setting it to above the above lower limit, there is a tendency that the fluidity of the resin composition is improved and the specific gravity of the molded body is further improved. In addition, relative to the total of 100% by mass of the above-mentioned (a) to (c) components, the total content of (b) polypropylene homopolymer and (c) polyolefin copolymer is preferably 55% by mass or less, more preferably 52% by mass or less, further preferably 50% by mass or less, and further preferably 49% by mass or less. By setting it to below the above upper limit, there is a tendency that the heat resistance of the obtained molded body is further improved.

[0087] In addition, the mass ratio (b) / (c) of the polypropylene homopolymer (b) to the polyolefin copolymer (c) is preferably 1.5 or more, more preferably 2.0 or more, further preferably 2.5 or more, further preferably 3.0 or more, and further more preferably 3.5 or more. In addition, the above (b) / (c) is preferably 14.0 or less, more preferably 10.0 or less, further preferably 7.0 or less, and further preferably 6.0 or less.

[0088] <(d) Hollow Inorganic Filler>

[0089] The resin composition of the present embodiment contains 6 to 30 parts by mass of the (d) hollow inorganic filler in 100 parts by mass of the resin composition. That is, the content of the (d) hollow inorganic filler in 100 parts by mass of the resin composition is 6 to 30% by mass.

[0090] By including the (d) hollow inorganic filler, a resin composition having a low specific gravity can be obtained.

[0091] (d) As the hollow inorganic filler, there can be exemplified hollow silica spheres, hollow alumina spheres, hollow glass particles, hollow ceramic particles, and the like, and hollow glass particles and hollow ceramic particles are preferred.

[0092] (d) The apparent density of the hollow inorganic filler is preferably 0.40 g / cm 3 More preferably, 0.42 g / cm 3 More preferably, 0.44 g / cm 3 More preferably, 0.45 g / cm 3 More preferably, it is 0.46 g / cm 3 The above, depending on the application, can also be 0.47g / cm 3By setting the above lower limit value or more, the shell thickness of the hollow particles becomes thicker, and there is a tendency that the breakage during mixing with the resin is suppressed. In addition, (d) the apparent density of the hollow inorganic filler is preferably 0.65 g / cm 3 Below, more preferably 0.6 g / cm 3 Below, it can also be 0.56g / cm depending on the application, etc. 3 Below, 0.55g / cm 3 By setting it below the said upper limit value, there exists a tendency to be able to reduce the specific gravity of a molded article more effectively.

[0093] (d) The apparent density of the hollow inorganic filler can be obtained by measuring the mass with an electronic balance, and then measuring the volume with a gas pycnometer using helium as a gas medium, thereby performing calculation.

[0094] For above-mentioned (d) hollow inorganic filler, its compression failure strength is preferably more than 105MPa, more preferably more than 108MPa, further preferably more than 110MPa.By being set to more than the above-mentioned lower limit, the crushing when being mixed in resin is suppressed, and there is the tendency that can effectively reduce the specific gravity of molded article.In addition, the compression failure strength of above-mentioned (d) hollow inorganic filler is preferably below 130MPa.When being more than the above-mentioned upper limit, the shell with hollow particle thickens, and there is the tendency that the low specific gravity effect brought by adding deteriorates.

[0095] The compressive failure strength of the hollow inorganic filler (d) is the hydrostatic pressure at which 10% by volume of the hollow inorganic filler is destroyed, and can be measured in a glycerin dispersion using ASTM D3102-72 "Hydrostatic collapse strength of hollow glass microspheres".

[0096] The average particle size of the hollow inorganic filler (d) is preferably 5 μm or more, more preferably 10 μm or more, and further preferably 15 μm or more, and preferably 50 μm or less, more preferably 40 μm or less, and further preferably 30 μm or less, as the value of D50.

[0097] The content of the hollow inorganic filler (d) in the resin combination of the present embodiment is more than 6 mass parts, preferably more than 8 mass parts, or more than 12 mass parts in 100 mass parts of resin combination. By being set to more than the above-mentioned lower limit, there is a tendency that the specific gravity of molded body can be effectively reduced. In addition, the upper limit of the content of the hollow inorganic filler (d) is less than 30 mass parts in 100 mass parts of resin combination, and can be less than 28 mass parts, less than 25 mass parts, less than 20 mass parts, less than 18 mass parts, less than 16 mass parts according to purposes etc. By being set to less than the above-mentioned upper limit, there is a tendency that the impact resistance, mechanical strength reduction of molded body can be suppressed.

[0098] The resin composition of the present embodiment may contain only one type of (d) hollow inorganic filler, or may contain two or more types. When containing two or more types, the total amount is preferably within the above range.

[0099] <(e) Block Copolymer>

[0100] The resin composition of the present embodiment includes (e) a block copolymer, wherein the block copolymer (e) is a hydrogenated product including a vinyl aromatic compound block (e1) and an isoprene polymer block (e2). By including the block copolymer (e), the impact resistance of the obtained molded body can be improved while also functioning as a compatibilizer. That is, the compatibility of the vinyl aromatic compound block (e1) with the (a) polyphenylene ether resin is improved, and the compatibility of the isoprene polymer block (e2) with the (b) polypropylene homopolymer and the (c) polyolefin copolymer is improved.

[0101] It is presumed that by using a hydrogenated product, the isoprene polymer block becomes an alternating copolymer structure of ethylene and propylene, and has good affinity with a polypropylene homopolymer, thereby achieving various good physical properties.

[0102] Examples of the vinyl aromatic compound constituting the vinyl aromatic compound block (e1) include vinyl aryl compounds, preferably at least one selected from styrene, α-methylstyrene, styrene substituted with an alkoxy group, 2-vinylpyridine, 4-vinylpyridine, vinylnaphthalene, and vinylnaphthalene substituted with an alkyl group, more preferably styrene and α-methylstyrene, and still more preferably styrene. The vinyl aromatic compound may be one type or two or more types.

[0103] The content of the vinyl aromatic compound unit in the (e) block copolymer used in the present embodiment is preferably 50% by mass or more, more preferably 55% by mass or more, further preferably 60% by mass or more, and further preferably 63% by mass or more. By setting it to above the above lower limit, the impact resistance of the obtained molded body can be effectively improved without reducing the heat resistance. In addition, the content of the vinyl aromatic compound unit in the (e) block copolymer is preferably less than 80% by mass, more preferably less than 75% by mass, and further preferably less than 70% by mass. By setting it to below the above upper limit, there is a tendency that the impact resistance and tensile nominal strain of the obtained molded body are improved.

[0104] The content of the isoprene unit in the (e) block copolymer used in the present embodiment is preferably 20% by mass or more, more preferably 25% by mass or more, and further preferably 30% by mass or more. By setting it to above the above lower limit, there is a tendency that the impact resistance and tensile nominal strain of the obtained molded body are further improved. In addition, the content of the isoprene unit in the (e) block copolymer is preferably 50% by mass or less, more preferably 47% by mass or less, further preferably 40% by mass or less, and may also be 35% by mass or less. By setting it to below the above upper limit, there is a tendency to further increase the effect of being able to effectively improve the impact resistance of the obtained molded body without reducing heat resistance.

[0105] In the (e) block copolymer used in the present embodiment, the total content of the vinyl aromatic compound unit and the isoprene unit preferably accounts for 90% by mass or more, 95% by mass or more, or even 99% by mass or more of the (e) block copolymer.

[0106] The (e) block copolymer used in the present embodiment is preferably SEPS. SEPS is represented by the following structural formula, where l, m, and n are numbers greater than 0.

[0107] [Chemical formula 2]

[0108]

[0109] The (e) block copolymer used in the present embodiment is a hydrogenated product, and may be a partially hydrogenated product or a completely hydrogenated product, and is preferably a completely hydrogenated product.

[0110] The content of (e) block copolymer in the resin composition of the present embodiment is preferably 5 mass parts or more, more preferably 7 mass parts or more, more preferably 10 mass parts or more, and more preferably 13 mass parts or more relative to 100 mass parts of resin components.By being set to above-mentioned lower limit value or more, there is the tendency that the impact resistance of molded body is improved.In addition, the upper limit value of the content of the above-mentioned (e) block copolymer is preferably below 25 mass parts, more preferably below 20 mass parts, more preferably below 17 mass parts, and more preferably below 16 mass parts in 100 mass parts of resin composition.By being set to below the above-mentioned upper limit value, there is the tendency that heat resistance can be suppressed to reduce.

[0111] The resin composition of the present embodiment may contain only one type of (e) block copolymer, or may contain two or more types. When containing two or more types, the total amount is preferably within the above range.

[0112] In the present embodiment, it is preferred that (e) block copolymer is flowing when measured at a load of 2.16kg and a temperature of 230°C according to JIS K7210. Specifically, the melt flow rate (MFR) measured at a load of 2.16kg and a temperature of 230°C according to JIS K7210 is preferably 0.1g / 10 minutes or more, more preferably 0.15g / 10 minutes or more, and more preferably 0.3g / 10 minutes or more. By setting it to more than the above lower limit, there is a tendency that the fluidity of the resin composition is improved and the moldability is further improved. In addition, the above MFR is preferably less than 7.0g / 10 minutes, more preferably less than 5.0g / 10 minutes, more preferably less than 3.0g / 10 minutes, more preferably less than 2.0g / 10 minutes, and can also be less than 1.0g / 10 minutes. By setting it to less than the above upper limit, there is a tendency that impact resistance is further improved.

[0113] The difference between the MFR of the (b) polypropylene homopolymer and the MFR of the (e) block copolymer (MFR(b) - MFR(e)) is preferably 1.0 g / 10 min or more and preferably 3.0 g / 10 min or less.

[0114] The difference between the MFR of the (c) polyolefin copolymer and the MFR of the (e) block copolymer (MFR(c)-MFR(e)) is preferably 0.1 g / 10 min or more and preferably 10.0 g / 10 min or less.

[0115] By setting it as such a range, there exists a tendency for the effect of this invention to be exhibited more effectively.

[0116] <(f) Low molecular weight polystyrene resin>

[0117] In addition to the above components, the resin composition of the present embodiment preferably further comprises (f) a polystyrene resin having a weight average molecular weight (Mw) of 3000 to 20000 (hereinafter sometimes referred to as "(f) low molecular weight polystyrene resin"). By including (f) a low molecular weight polystyrene resin, the impact resistance and bending strength of the obtained molded body tend to be improved.

[0118] (f) The weight average molecular weight of the low molecular weight polystyrene resin is 3000 or more, preferably 5000 or more, more preferably 7000 or more, and further preferably 8000 or more. Below the above lower limit, there is a tendency for the mechanical properties of the resin composition as a whole, such as tensile and bending properties, to be reduced. In addition, (f) The weight average molecular weight of the low molecular weight polystyrene resin is 20000 or less, preferably 18000 or less, more preferably 15000 or less, and further preferably 12000 or less. By setting it below the above upper limit, the fluidity of the polyphenylene ether resin can be improved, the dispersibility of the polyphenylene ether domain is improved, and there is a tendency for the impact resistance of the obtained molded body to be improved.

[0119] (f) The weight average molecular weight of the low molecular weight polystyrene resin is a polystyrene equivalent molecular weight measured by gel permeation chromatography (GPC).

[0120] The (f) low molecular weight polystyrene resin used in this embodiment can be a styrene homopolymer (polystyrene) or a copolymer of styrene and other monomers. In this embodiment, in the (f) low molecular weight polystyrene resin, the styrene unit preferably accounts for 50% by mass or more, more preferably 70% by mass or more, further preferably 90% by mass or more, and can also be 95% by mass or more of all structural units.

[0121] When the (f) low molecular weight polystyrene resin used in the present embodiment is a copolymer of styrene and other monomers, examples thereof include styrene acrylic resin, acrylonitrile butadiene styrene resin, styrene acrylonitrile resin, styrene butadiene resin, and styrene ethylene butadiene styrene resin.

[0122] In the case where the resin composition of the present embodiment includes (f) a low molecular weight polystyrene resin, the content thereof is preferably 0.5 parts by mass or more, more preferably 1.0 parts by mass or more, and further preferably 2.0 parts by mass or more, relative to 100 parts by mass of the resin components (the total of components (a) to (c) and (e)) contained in the resin composition. By setting it to be above the above lower limit, the dispersibility of the polyphenylene ether microregion is improved, and there is a tendency that the impact resistance of the obtained molded body is improved. In addition, the upper limit of the content of the above (f) low molecular weight polystyrene resin is preferably 10.0 parts by mass or less, more preferably 7.0 parts by mass or less, further preferably 6.0 parts by mass or less, further preferably 5.0 parts by mass or less, further more preferably 4.5 parts by mass or less, and further preferably 4.0 parts by mass or less in 100 parts by mass of the resin composition. By setting it to be below the above upper limit, there is a tendency that the reduction of mechanical properties such as heat resistance, tensile properties, and bending properties can be more effectively suppressed.

[0123] The resin composition of the present embodiment may contain only one (f) low molecular weight polystyrene resin or two or more thereof. When containing two or more thereof, the total amount is preferably within the above range.

[0124] <Other ingredients>

[0125] The resin composition of the present embodiment may contain other components besides the above.

[0126] Specifically, thermoplastic resins such as polyamide resins, polyester resins, polyphenylene sulfide resins, liquid crystal polyester resins, polycarbonate resins, polyacetal resins, polyacrylonitrile resins, acrylic resins, and polyethylene resins, and thermosetting resins such as epoxy resins, melamine resins, and silicone resins can be used in combination of two or more of these thermoplastic resins and thermosetting resins.

[0127] In addition, the resin composition of the present embodiment may also include resin additives. Specifically, it may include: stabilizer, colorant, internal lubricant (fatty acid metal salt, polyethylene wax, etc.), heat stabilizer (zinc oxide, etc.), release agent (silicone oil, fatty acid, fatty acid ester, etc.), weathering improver, nucleating agent, impact resistance improver, plasticizer, flow improver, etc. When containing these components, the total content is preferably set to the range of 0.01 to 5% by mass of the resin composition.

[0128] The resin composition of the present embodiment can be adjusted so that the total of (a) polyphenylene ether resin, (b) polypropylene homopolymer, (c) polyolefin copolymer, (d) hollow inorganic filler, (e) block copolymer, and other components blended as needed is 100% by mass.

[0129] In addition, for the resin composition of the present embodiment, the total amount of (a) polyphenylene ether resin, (b) polypropylene homopolymer, (c) polyolefin copolymer, (d) hollow inorganic filler and (e) block copolymer preferably accounts for 92% by mass or more of the resin composition, more preferably 94% by mass or more, and further preferably 96% by mass or more.

[0130] In addition, for the resin composition of the present embodiment, the total amount of (a) polyphenylene ether resin, (b) polypropylene homopolymer, (c) polyolefin copolymer, (d) hollow inorganic filler and (e) block copolymer, and (f) low molecular weight polystyrene resin, stabilizer and pigment mixed as needed preferably accounts for more than 95% by mass of the resin composition, more preferably accounts for more than 97% by mass, and further accounts for more than 99% by mass.

[0131] <<Stabilizer>>

[0132] The resin composition of the present embodiment may contain stabilizers such as a heat stabilizer and an antioxidant.

[0133] As stabilizers, inorganic heat stabilizers such as phenol stabilizers, amine stabilizers, phosphorus stabilizers, thioether stabilizers, zinc oxide, etc. can be cited. Among them, in the present embodiment, phenol stabilizers and zinc oxide are preferred. For stabilizers, reference can be made to paragraph 0036 of International Publication No. 2019 / 026689 and paragraphs 0044 to 0046 of Japanese Patent Publication No. 2022-001624, the contents of which are introduced into this specification.

[0134] As the phenol stabilizer, a hindered phenol stabilizer can be preferably used. Specific examples of the hindered phenol stabilizer include pentaerythritol tetrakis[3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate], octadecyl 3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate, diethylene sulfide bis[3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate], N,N'-hexane-1,6-diylbis[3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionamide], 2,4-dimethyl-6-(1-methylpentadecyl)phenol, diethyl[[3,5-bis(1,1-dimethylethyl)-4-hydroxyphenyl]methyl]phosphate, 3,3',3",5,5',5"-hexa-tert-butyl-a,a',a"-( mesityl-2,4,6-triyl) tri-p-cresol, 4,6-bis(octylthiomethyl)-o-cresol, ethylenebis(oxyethylene)bis[3-(5-tert-butyl-4-hydroxy-m-tolyl)propionate], hexamethylenebis[3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate], 1,3,5-tris(3,5-di-tert-butyl-4-hydroxybenzyl)-1,3,5-triazine-2,4,6(1H,3H,5H)-trione, 2,6-di-tert-butyl-4-(4,6-bis(octylthio)-1,3,5-triazine-2-ylamino)phenol, 2-[1-(2-hydroxy-3,5-di-tert-pentylphenyl)ethyl]-4,6-di-tert-pentylphenyl acrylate, etc.

[0135] Among them, pentaerythritol tetrakis[3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate] and octadecyl 3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate are preferred. Specific examples of such hindered phenol stabilizers include "Irganox (registered trademark, hereinafter the same) 1010" and "Irganox 1076" manufactured by BASF, and "ADEKA STAB AO-50" and "ADEKA STAB AO-60" manufactured by ADEKA.

[0136] The content of the stabilizer in the resin composition of the present embodiment is preferably 0.001 mass parts or more, more preferably 0.005 mass parts or more, further preferably 0.01 mass parts or more, and further preferably 0.08 mass parts or more in 100 mass parts of the resin composition, and is preferably 3 mass parts or less, more preferably 2 mass parts or less, and further preferably 1 mass part or less. By setting the content of the stabilizer to the above range, the addition effect of the stabilizer can be more effectively exerted.

[0137] The resin composition of the present embodiment may use only one type of stabilizer or may contain two or more types. When containing two or more types, the total amount is preferably within the above range.

[0138] <<Colorant>>

[0139] The resin composition of the present embodiment may contain a colorant. By containing a colorant, the obtained molded product can be given a color tone, and there is a tendency that the design properties are improved.

[0140] The colorant may be a pigment or a dye, and is preferably a pigment.

[0141] Pigments include inorganic pigments (black pigments such as carbon black, red pigments such as iron oxide red, orange pigments such as molybdenum chrome orange, white pigments such as titanium oxide), organic pigments (yellow pigments, orange pigments, red pigments, blue pigments, green pigments, etc.), etc., preferably inorganic pigments, preferably carbon black in the case of black pigments, and preferably zinc sulfide in the case of white pigments. Among white pigments, titanium oxide has a high hardness and may cause the (d) hollow inorganic filler to break, so it is preferably substantially not included. Substantially not included means that, for example, in 100 parts by mass of the resin composition, the content of titanium oxide is less than 0.01 parts by mass, preferably less than 0.005 parts by mass, more preferably less than 0.001 parts by mass, and further preferably less than 0.0001 parts by mass.

[0142] When a colorant is blended with the resin composition of the present embodiment, the colorant may be blended in the form of a masterbatch.

[0143] In the case where the resin composition in the present embodiment contains a colorant, the content is preferably 0.01 parts by mass or more, more preferably 0.1 parts by mass or more, further preferably 0.3 parts by mass or more, and further preferably 0.5 parts by mass or more in 100 parts by mass of the resin composition. In the case where white streaks are likely to appear in the molded article, it may also be 0.9 parts by mass or more. In addition, the content of the above-mentioned colorant is preferably 10.0 parts by mass or less, more preferably 5.0 parts by mass or less, and further preferably 3.0 parts by mass or less in 100 parts by mass of the resin composition.

[0144] The resin composition of the present embodiment may contain only one colorant or two or more colorants. When containing two or more colorants, the total amount is preferably within the above range.

[0145] <Method for producing resin composition>

[0146] As a method for producing the resin composition of the present embodiment, any method can be adopted.

[0147] For example, the following method can be cited: using a mixing device such as a V-type blender to mix (a) polyphenylene ether resin, (b) polypropylene homopolymer, (c) polyolefin copolymer, (d) hollow inorganic filler and (e) block copolymer, etc., to prepare a total mixed product, and then melt-kneading it through an extruder with a vent to granulate it. Alternatively, as a two-step mixing method, the following method can be cited: after fully mixing a part of the components in advance, melt-kneading it through an extruder with a vent to produce particles, the particles are mixed with other components and melt-kneaded through an extruder with a vent.

[0148] (d) Hollow inorganic fillers can be side-fed.

[0149] <Characteristics of Resin Composition>

[0150] The resin composition of the present embodiment can particularly satisfy the following properties.

[0151] The resin composition of this embodiment preferably has a small specific gravity. Specifically, the specific gravity of the resin composition of this embodiment is preferably 0.93 g / cm 3 Below, more preferably 0.92 g / cm 3 Below, more preferably 0.91 g / cm 3 Below, more preferably 0.90 g / cm 3 Below, more preferably 0.89 g / cm 3 As the lower limit, it is actually 0.80g / cm 3 Above, even at 0.85g / cm 3 It also fully meets the required performance.

[0152] The resin composition of the present embodiment preferably has excellent impact resistance. Specifically, the resin composition of the present embodiment is molded into an ISO test piece, and the notched Charpy impact strength according to ISO-179-1 and ISO179-2 is preferably 4.9 kJ / m 2 More preferably, 5.0 kJ / m 2 More preferably, 5.3 kJ / m 2 More preferably, 5.6 kJ / m 2 More preferably, 5.8 kJ / m 2 There is no particular upper limit, but it is actually 12.0 kJ / m 2 the following.

[0153] The resin composition of the present embodiment preferably has excellent heat resistance. Specifically, the resin composition of the present embodiment is molded into an ISO test piece, and the load deflection temperature under a load of 1.80 MPa measured according to ISO-75-2 is preferably 61°C or more, more preferably 70°C or more, further preferably 75°C or more, further preferably 78°C or more, and further more preferably 80°C or more. In addition, the upper limit is not particularly limited, and is actually below 110°C.

[0154] The Charpy impact strength and the deflection temperature under load can be measured according to the description in the examples described later.

[0155] <Molding of Resin Composition>

[0156] The resin composition of the present embodiment can be used in the form of pellets. In addition, the molded body of the present embodiment is formed from the resin composition or pellets of the present embodiment.

[0157] The manufacturing method of the molded product of the present embodiment is not particularly limited, and the molding method usually adopted for the resin combination can be arbitrarily adopted. Enumerate its example, and can cite the hollow molding method such as injection molding method, ultra-high speed injection molding method, injection compression molding method, two-color molding method, gas-assisted, the molding method using the insulation mold, the molding method using the rapid heating mold, foam molding (also including supercritical fluid), insert molding, IMC (intermetallic compound molding) molding method, extrusion molding method, sheet molding method, thermoforming method, rotational molding method, stacking molding method, compression molding method, blow molding method etc. In addition, the molding method using the hot runner mode can also be utilized.

[0158] <Applications of resin composition, pellets and molded article>

[0159] The resin composition, pellets, and molded article of the present embodiment can be widely used in applications where a polyphenylene ether resin is generally used, particularly a blend of a polyphenylene ether resin and a styrene-based resin.

[0160] For example, it can be used for automobile exterior / exterior panel parts, automobile interior parts, and automobile engine compartment parts. Specifically, it is suitable for exterior / exterior panel parts such as bumpers, fenders, door panels, decorative strips, logos, engine covers, wheel covers, roof panels, spoilers, engine covers, and interior parts such as engine compartment parts, instrument panels, and console decorative strips.

[0161] In addition, it can also be used as cabinets, bases, refrigerators, air conditioners, LCD projectors, etc. for various computers and their peripherals, other OA equipment, televisions, video recorders, various CD players, etc.

[0162] In addition, it can be used as fuel casings for solid methanol batteries, secondary battery cells, fuel cell water pipes, cold water tanks, boiler casings, ink peripheral parts / components and bases for inkjet printers, as well as molded products such as water pipes and joints.

[0163] In this embodiment, it is particularly preferred as a wearable terminal housing.

[0164] Example

[0165] Below, enumerate embodiment and the present invention is further specifically described.As long as the material, dosage, ratio, processing content, processing step etc. shown in the following embodiment do not depart from the gist of the present invention, just can be appropriately changed.Therefore, the scope of the present invention is not limited to the specific example shown below.

[0166] When the measuring equipment used in the examples is difficult to obtain due to discontinuation of production or the like, other equipment having equivalent performance may be used for the measurement.

[0167] 1. Raw materials

[0168] The following raw materials were used.

[0169]

[0170]

[0171] The above-mentioned MFR refers to a melt flow rate measured at a load of 2.16 kg and a temperature of 230° C. in accordance with JIS-K7210.

[0172] The above-mentioned SEBS is a hydrogenated block copolymer composed of styrene and butadiene.

[0173] 2. Examples 1 to 14, Comparative Examples 1 to 5

[0174] The components were mixed in the ratios (parts by mass) shown in Tables 3 to 6 below, and melt-kneaded using a twin-screw extruder (TEM26SX manufactured by Shibaura Machine Co., Ltd.) at a barrel temperature of 280° C. and a screw speed of 200 rpm to obtain a resin composition (pellet).

[0175] The following evaluations were performed using the obtained resin composition (pellets). The results are shown in Tables 3 to 6.

[0176] <Ash content>

[0177] 2 g of the pellets obtained by the above production method were ashed in accordance with JIS7250, Method A, and the ash content was measured.

[0178] The unit of ash content is expressed in mass %.

[0179] <Manufacture of ISO test pieces>

[0180] After drying the particles obtained by the above manufacturing method at 100 °C for 2 hours, they were injection molded into 4-mm-thick ISO 3167:93 Type A test pieces (hereinafter referred to as "ISO test pieces") at a barrel temperature of 270 °C and a mold temperature of 70 °C according to ISO-15103 using an injection molding machine (manufactured by Shibaura Machine Co., Ltd., "EC75SX").

[0181] <Specific gravity>

[0182] Using test pieces obtained by machining the above-obtained ISO test pieces, the specific gravity (g / cm 3 ) was measured by Method A according to JIS K7112.

[0183] <Notched Charpy impact strength>

[0184] According to ISO-179-1 and ISO 179-2, the above-obtained ISO test pieces were machined, the clamping parts at both ends were cut off, and a notch was formed in the center to form notched Charpy impact test pieces. For the obtained notched Charpy impact test pieces, the notched Charpy impact strength at 23 °C (unit: kJ / m 2 ) was measured as an impact resistance evaluation according to ISO-179-1 and ISO 179-2.

[0185] <Deflection temperature under load (DTUL)>

[0186] Using a rectangular test piece of 80 mm × 10 mm × 4 mm t manufactured by machining the parallel part of the above-obtained ISO test piece, the deflection temperature under a load of 1.80 MPa (unit: °C) was measured according to ISO-75-2.

[0187] <Tensile strength and tensile nominal strain>

[0188] Using the above-obtained ISO test pieces, the tensile strength (unit: MPa) and tensile nominal strain (unit: %) were measured according to ISO-527.

[0189] <Flexural strength and flexural modulus>

[0190] Using a rectangular test piece of 80 mm × 10 mm × 4 mm t manufactured by machining the parallel part of the above-obtained ISO test piece, the flexural strength (unit: MPa) and flexural modulus (unit: MPa) were measured in an environment of 23 °C and 50% humidity according to ISO-178.

[0191] [Table 3]

[0192]

[0193] [Table 4]

[0194] [Table 5]

[0195] Element Embodiment 11 Example 12 Embodiment 13 Embodiment 14 (a) 34.85 34.85 34.85 31.57 (b) 25.50 28.90 28.90 23.10 (c-1) 8.50 7.70 (c-2) 5.10 (c-3) 5.10 (c x-1) (d-1) (d-2) (d-3) 15.00 15.00 15.00 23.00 (d-4) (d-5) (d-6) (d-7) (d-8) (e) 12.75 12.75 12.75 11.55 (e×-1) (ex-2) (f) 2.47 2.47 2.47 2.00 (g-1) 0.04 0，04 0.04 0.04 (g-2) 0.04 0.04 0.04 0.04 (h) 0.85 0.85 0.85 1。00 Ash content (mass %) 14.6 14.6 14.6 21.5 <![CDATA[Specific gravity (g / cm 3 )]]> 0.90 0.90 0.90 0.83 <![CDATA[Charpy impact strength with notch (kJ / m 2 )]]> 6.0 6.9 6.2 6.0 Deflection temperature under load(℃) 78 84 85 80 Tensile strength(MPa) 29 30 30 27 Tensile nominal strain (%) 24 10 9 15 Bending strength(MPa) 43 48 49 42 Flexural modulus (MPa) 1623 1906 1977 1790

[0196] [Table 6]

[0197]

[0198] The above results clearly show that the resin composition of the present invention is a low-specific-gravity resin composition comprising a polyphenylene ether resin and a hollow inorganic filler, and can provide a molded body having excellent impact resistance while maintaining heat resistance, and also having excellent tensile properties and flexural properties.

Claims

1. A resin composition comprising: (a) polyphenylene ether resin, (b) Polypropylene homopolymer, (c) a polyolefin copolymer having a melt flow rate (MFR) of 0.3 to 25 g / 10 min at a load of 2.16 kg and a temperature of 230° C. as measured in accordance with JIS-K7210, (d) hollow inorganic fillers, and (e) block copolymers, The (e) block copolymer is a hydrogenated product comprising a vinyl aromatic compound block (e1) and an isoprene polymer block (e2), The (d) hollow inorganic filler is contained in a ratio of 6 to 30 parts by mass in 100 parts by mass of the resin composition.

2. The resin composition according to claim 1, wherein The (d) hollow inorganic filler is contained in a ratio of 6 to 20 parts by mass in 100 parts by mass of the resin composition.

3. The resin composition according to claim 1 or 2, wherein The compressive failure strength of the (d) hollow inorganic filler is 105 to 130 MPa.

4. The resin composition according to claim 1 or 2, wherein The (a) polyphenylene ether resin is contained in an amount of 40 to 65% by mass, and the (b) polypropylene homopolymer and the (c) polyolefin copolymer are contained in an amount of 35 to 60% by mass, based on 100% by mass of the total of the (a) polyphenylene ether resin, the (b) polypropylene homopolymer and the (c) polyolefin copolymer. 5 . The resin composition according to claim 1 , further comprising (f) a polystyrene resin having a weight average molecular weight (Mw) of 3,000 to 20,000.

6. The resin composition according to claim 1 or 2, wherein The content of the vinyl aromatic compound unit in the (e) block copolymer is 50% by mass or more and less than 80% by mass.

7. The resin composition according to claim 1 or 2, wherein The compressive failure strength of the hollow inorganic filler (d) is 105 to 130 MPa, The polyphenylene ether resin (a) is contained in an amount of 40 to 65% by weight, and the polyphenylene ether resin (b) is contained in an amount of 35 to 60% by weight, relative to 100% by weight of the total of the (a) polyphenylene ether resin, the (b) polypropylene homopolymer, and the (c) polyolefin copolymer. further comprising (f) a polystyrene resin having a weight average molecular weight (Mw) of 3,000 to 20,000, The content of the vinyl aromatic compound unit in the (e) block copolymer is 50% by mass or more and less than 80% by mass. 8 . Pellets, which are particles of the resin composition according to claim 1 or 2 . 9 . A molded product formed by molding the resin composition according to claim 1 or 2. 10 . A shaped body formed from the particles according to claim 8 .

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