A welding alignment device for semiconductor processing

Abstract

The present invention discloses a welding alignment device for semiconductor processing, which relates to the technical field of semiconductor processing, and includes a workbench, a rotating table, a feeding mechanism and a welding mechanism. A plurality of placement components and indexing components are circumferentially arranged on the rotating table. The placement component includes a placement table, and a circle of air ports are formed on the periphery of the placement table. Each air port is connected to an air chamber. An empty slot is formed in the middle of the placement table, and a three-way valve is arranged at the bottom of the empty slot. An interface one, an interface two and an interface three are respectively arranged on the three-way valve. The interface one communicates with the empty slot, the interface two communicates with the air chamber, and the interface three is externally connected to an air pump. A telescopic block is arranged in the empty slot, and a first spring is connected between the telescopic block and the empty slot. The present invention improves the convenience and quality of double-sided welding chips on the substrate.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor processing, and particularly to a welding alignment device for semiconductor processing. Background Art

[0002] In semiconductor processing, welding technology is a key process for achieving electrical and mechanical connections between chips and packaging substrates or lead frames. The process flow is roughly as follows: cutting a wafer into individual chips, pasting the chips onto a lead frame or substrate, connecting the chip pads to the lead frame or substrate pads through gold wires, aluminum wires or copper wires, and encapsulating the chips with materials such as resin to protect the chips from the external environment.

[0003] In the processes of semiconductor processing, packaging and welding, "alignment" is a crucial link, which directly affects the performance and reliability of the chips. In the welding process, both the substrate and the chip need to be placed on a flat base to control warping.

[0004] For the existing alignment between a chip and a substrate, first place the substrate on the workbench, and then place the chip at the corresponding position on the substrate through an additional fixture, and perform alignment with the aid of vision detection technology. For chips with dual-sided packaging, after welding the chips on one side of the substrate, it is necessary to perform secondary welding of the chips on the other side of the substrate. Since there are already chips on one side of the substrate, the surface is uneven when placing, which increases the difficulty of aligning the chips on the other side. Summary of the Invention

[0005] The purpose of the present invention is to provide a welding alignment device for semiconductor processing to solve the problems raised in the above background art.

[0006] To solve the above technical problems, the present invention provides the following technical solution: A welding alignment device for semiconductor processing, including a workbench, a rotating table, a feeding mechanism and a welding mechanism. The rotating table is connected to a rotating motor, and the rotating motor is installed on the workbench. The feeding mechanism and the welding mechanism are sequentially arranged around one side of the rotating table for feeding and welding the substrate and the chip.

[0007] According to the above technical solution, several object placing components and indexing components are circumferentially arranged on the rotating table. The object placing components are used for fixing the substrate, and the indexing components are arranged in cooperation with the object placing components for deflecting the substrate.

[0008] According to the above technical solution, the object placing component includes a placing table. A circle of air ports is opened on the periphery of the placing table, and each air port is connected to an air chamber. An empty slot is opened in the middle of the placing table, and a three-way valve is arranged at the bottom of the empty slot. An interface one, an interface two and an interface three are respectively arranged on the three-way valve. The interface one communicates with the empty slot, the interface two communicates with the air chamber, and the interface three is externally connected to an air pump. A telescopic block is arranged in the empty slot, and a first spring is connected between the telescopic block and the empty slot.

[0009] According to the above technical solution, a pair of opposite side surfaces on the inner wall of the empty slot are provided with circular grooves, a second spring is connected inside the circular grooves, the other end of the second spring is connected with a magnetic attraction block, and an electromagnetic cavity is provided at the relative position of the telescopic block.

[0010] According to the above technical solution, a slider is provided on one side of the placement table, a slide rail is provided at the bottom of the rotating table to cooperate with the slider, the bottom of the slide rail is fixed with a mounting plate, a connecting sleeve is fixed at the bottom of the three-way valve, an electric push rod is fixed on the mounting plate, and the driving end of the electric push rod is connected with the connecting sleeve.

[0011] According to the above technical solution, the indexing component includes a hinge seat, a first clamping plate is fixed on one side of the hinge seat facing the placement table, the surface of the first clamping plate is horizontally arranged and at the same height as the surface of the rotating table, a notch is provided on the placement table to cooperate with the first clamping plate, a first micro motor is connected to the other side of the hinge seat, and a second clamping plate is rotatably arranged on the hinge seat.

[0012] According to the above technical solution, the second clamping plate includes a rotating rod, the rotating rod is rotatably matched with the hinge seat, a driven gear is sleeved at one end of the rotating rod, the driven gear is connected with a driving gear in a matching manner, the driving gear is connected with a second micro motor, and the second micro motor is fixed on one side of the hinge seat.

[0013] According to the above technical solution, a bottom plate is connected to the rotating rod, a plurality of third springs are connected to the side of the bottom plate facing the first clamping plate, the other end of the third springs is connected with a pressing plate, clamping blocks are arranged at both ends of the pressing plate, and corresponding card slots are provided on the bottom plate to cooperate with the clamping blocks.

[0014] According to the above technical solution, a pressure sensing module is laid at the connection between the third spring and the bottom plate for detecting the compression state of the third spring.

[0015] According to the above technical solution, the feeding mechanism includes a substrate feeding component and a chip feeding component, the substrate feeding component is used for feeding the substrate, and the chip feeding component is used for feeding the chip.

[0016] According to the above technical solution, the substrate feeding component includes a material conveyor belt, a two-axis driving module I and a first suction nozzle, the two-axis driving module I is arranged on one side of the material conveyor belt, the first suction nozzle is installed at the driving end of the two-axis driving module I and is externally connected with an air extraction device.

[0017] According to the above technical solution, the chip feeding component includes a vibrating disk, a two-axis driving module II, a group of second suction nozzles and a placement table, chips are stacked in the vibrating disk for sorting the chips, the two-axis driving module II is arranged at the discharge port side of the vibrating disk, the second suction nozzles are installed at the driving end of the two-axis driving module II and are externally connected with an air extraction device, and the placement table is arranged on one side of the rotating table for auxiliary alignment before chip feeding.

[0018] According to the above technical solution, the welding mechanism includes a three-axis drive module, a welding head, and a visual monitoring module. The welding head is installed on the three-axis drive module, and the visual monitoring module is arranged in cooperation with the welding head.

[0019] Compared with the prior art, the beneficial effects achieved by the present invention are as follows: In the present invention, by providing a placement component, the substrate can be adsorbed and fixed. At the same time, for a substrate with chips already welded on one side, the telescopic block in the middle of the placement table can move down in cooperation to reserve space for placing chips, ensuring subsequent substrate fixation and improving the stability of welding; by providing a rotation component, it can help the substrate with chips welded on one side to be flipped, avoiding the influence of secondary processing transfer on the connection between the substrate and the chips, and improving convenience and product quality. Description of the Drawings

[0020] The drawings are used to provide a further understanding of the present invention and constitute a part of the specification. They are used together with the embodiments of the present invention to explain the present invention and do not constitute a limitation to the present invention. In the drawings:

[0021] Figure 1 is the overall structural schematic diagram of the welding alignment device of the present invention;

[0022] Figure 2 is the partial schematic diagram of the welding alignment device of the present invention;

[0023] Figure 3 is the structural schematic diagram of the rotating table of the present invention;

[0024] Figure 4 is the structural schematic diagram of the placement table of the present invention;

[0025] Figure 5 is the partial cross-sectional view of the placement component of the present invention;

[0026] Figure 6 is the cross-sectional view of the placement component of the present invention;

[0027] Figure 7 is the partial schematic diagram of the rotating table of the present invention;

[0028] Figure 8 is the structural schematic diagram of the rotation component of the present invention;

[0029] Figure 9 is the partial schematic diagram of the rotation component of the present invention;

[0030] Figure 10 is the structural schematic diagram of the substrate loading component of the present invention;

[0031] Figure 11 is the structural schematic diagram of the chip loading component of the present invention;

[0032] Figure 12 It is a schematic structural diagram of the welding mechanism of the present invention.

[0033] In the figure: 1, workbench; 2, rotating table; 3, rotating motor; 4, placement component; 41, placement table; 411, air port; 412, air chamber; 413, empty slot; 414, second spring; 415, magnetic attraction block; 416, notch; 42, three-way valve; 421, first interface; 422, second interface; 423, third interface; 43, telescopic block; 431, electromagnetic cavity; 44, first spring; 45, slider; 46, slide rail; 47, mounting plate; 48, connecting sleeve; 49, electric push rod; 5, indexing component; 51, hinge seat; 52, first clamping plate; 53, first micro motor; 541, rotating rod; 542, driven gear; 543, driving gear; 544, second micro motor; 545, bottom plate; 546, third spring; 547, pressing plate; 548, clamping block; 6, substrate loading component; 61, material conveyor belt; 62, first two-axis driving module; 63, first suction nozzle; 7, chip loading component; 71, vibrating disk; 72, second two-axis driving module; 73, second suction nozzle; 74, placement table; 81, three-axis driving module; 82, welding head. Specific embodiments

[0034] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0035] Please refer to Figure 1 - Figure 2 , the present invention provides a technical solution: a welding alignment device for semiconductor processing, including a workbench 1, a rotating table 2, a loading mechanism, and a welding mechanism. The rotating table 2 is connected to a rotating motor 3, and the rotating motor 3 is installed on the workbench 1. The loading mechanism and the welding mechanism are sequentially arranged around one side of the rotating table 2 for loading and welding of substrates and chips.

[0036] As Figure 3 shown, several placement components 4 and indexing components 5 are circumferentially arranged on the rotating table 2. The placement component 4 is used to fix the substrate, and the indexing component 5 is arranged in cooperation with the placement component 4 for deflecting the substrate.

[0037] As Figure 4 - Figure 6As shown, the storage component 4 includes a placing table 41, a circle of air ports 411 are provided on the periphery of the placing table 41, each air port 411 is connected to an air chamber 412, an empty slot 413 is provided in the middle of the placing table 41, a three-way valve 42 is provided at the bottom of the empty slot 413, and the three-way valve 42 is respectively provided with an interface 1 421, an interface 2 422 and an interface 3 423, the interface 1 421 is connected to the empty slot 413, the interface 2 422 is connected to the air chamber 412, the interface 3 423 is connected to an external air pump, a telescopic block 43 is provided in the empty slot 413, and a spring 1 44 is connected between the telescopic block 43 and the empty slot 413.

[0038] The description based on the above structure is as follows: the air port 411 is used to grab the substrate, and the telescopic block 43 is at the same height as the placement table 41 under the support of the spring 1 44. When the telescopic block 43 is contracted and moved down by the spring 1 44, it can make way for the processing of the other side of the substrate to which the chip is attached, so as to facilitate the adsorption of the substrate when processing the other side of the substrate. Optionally, in order to prevent the surface height of the telescopic block 43 from exceeding the surface height of the placement table 41, a limit block can be set at the connection position between the telescopic block 43 and the placement table 41. Preferably, the three-way valve 42 adopts an electric micro three-way valve. When the three-way valve 42 is switched to the confluence valve state, the interface 1 421 and the interface 2 422 are used as the air inlet, and the interface 3 423 is used as the air outlet; on the contrary, in the diversion valve state, the interface 1 421 and the interface 2 422 are converted into the air outlet, and the interface 3 423 is used as the air inlet.

[0039] Furthermore, a group of opposite side surfaces on the inner wall of the hollow slot 413 are provided with circular grooves, a second spring 414 is connected in the circular groove, a magnetic attraction block 415 is connected to the other end of the second spring 414, and an electromagnetic cavity 431 is provided at the opposite position of the telescopic block 43.

[0040] It should be noted that: in the initial state, the electromagnetic cavity 431 is powered on to generate suction, the magnetic block 415 is attracted to pull the spring 2 414 into the electromagnetic cavity 431, the placement table 41 and the telescopic block 43 are in a connected state, and their surfaces are at a level height. At this time, the airflow of the interface 1 421 will not move the telescopic block 43. When the electromagnetic cavity 431 is powered off and loses suction, the magnetic block 415 is pulled back into the circular groove by the spring 2 414, the placement table 41 and the telescopic block 43 are in a separated state, and the airflow of the interface 1 421 will cause the telescopic block 43 to move.

[0041] like Figure 7 As shown, a slider 45 is provided on one side of the placement table 41, a slide rail 46 is provided at the bottom of the rotating table 2 to cooperate with the slider 45, a mounting plate 47 is fixed to the bottom of the slide rail 46, a connecting sleeve 48 is fixed to the bottom of the three-way valve 42, an electric push rod 49 is fixed on the mounting plate 47, and the driving end of the electric push rod 49 is connected to the connecting sleeve 48.

[0042] In actual operation, the electric push rod 49 starts to pull the connecting sleeve 48, driving the entire placement table 41 to move downward and separate from the surface of the rotating table 2, leaving a distance for the substrate to be flipped.

[0043] As Figure 8 , Figure 9 shown, the indexing component 5 includes a hinge seat 51. On the side of the hinge seat 51 facing the placement table 41, a first clamping plate 52 is fixed. The surface of the first clamping plate 52 is horizontally arranged and at the same height as the surface of the rotating table 2. The placement table 41 is provided with a notch 416 to cooperate with the first clamping plate 52. On the other side of the hinge seat 51, a first micro motor 53 is connected. A second clamping plate is rotatably arranged on the hinge seat 51.

[0044] Furthermore, the second clamping plate includes a rotating rod 541. The rotating rod 541 is rotatably matched with the hinge seat 51. One end of the rotating rod 541 is sleeved with a driven gear 542. The driven gear 542 is connected and matched with a driving gear 543. The driving gear 543 is connected to a second micro motor 544. The second micro motor 544 is fixed on one side of the hinge seat 51.

[0045] Even further, a bottom plate 545 is connected to the rotating rod 541. On the side of the bottom plate 545 facing the first clamping plate 52, a number of third springs 546 are connected. The other ends of the third springs 546 are connected to a pressing plate 547. Clamping blocks 548 are arranged at both ends of the pressing plate 547. Corresponding card slots are provided on the bottom plate 545 to cooperate with the clamping blocks 548.

[0046] Optionally, a pressure sensing module is laid at the connection between the third spring 546 and the bottom plate 545 for detecting the compression state of the third spring 546.

[0047] In actual operation, the second micro motor 544 starts to drive the driving gear 543 to rotate. The driven gear 542 synchronously drives the rotating rod 541 to rotate, so that the bottom plate 545 drives the pressing plate 547 to deflect towards the first clamping plate 52. When a substrate is covered on the first clamping plate 52, the clamping effect is achieved through the extrusion between the pressing plate 547 and the first clamping plate 52. The first micro motor 53 drives the hinge seat 51 to rotate around the vertical axis to realize the orientation adjustment of the first clamping plate 52 and the second clamping plate.

[0048] As Figure 2 shown, the feeding mechanism includes a substrate feeding component 6 and a chip feeding component 7. The substrate feeding component 6 is used for feeding the substrate, and the chip feeding component 7 is used for feeding the chip.

[0049] As Figure 10 shown, the substrate feeding component 6 includes a material conveyor belt 61, a two-axis driving module 62, and a first suction nozzle 63. The two-axis driving module 62 is erected on one side of the material conveyor belt 61. The first suction nozzle 63 is installed at the driving end of the two-axis driving module 62 and is externally connected to an air extraction device.

[0050] In one embodiment, the material conveyor belt 61 is used to convey the substrate to the first two-axis driving module 62. Preferably, the substrates are placed in the same state when being fed onto the material conveyor belt 61. The first two-axis driving module 62 includes a set of horizontal cylinders and vertical cylinders. The vertical cylinder is used to adjust the height of the first suction nozzle 63 so that it can contact the surface of the substrate. When the externally connected air extraction device is started, the negative pressure generated inside the first suction nozzle 63 can grip the substrate, and the horizontal cylinder is used to cooperate with the first suction nozzle 63 to transfer the substrate to the corresponding placement table 41.

[0051] As Figure 11 shown, the chip loading component 7 includes a vibrating disk 71, a second two-axis driving module 72, a set of second suction nozzles 73, and a placement table 74. The vibrating disk 71 is stacked with chips and is used to sort the chips. The second two-axis driving module 72 is arranged on the discharge port side of the vibrating disk 71. The second suction nozzles 73 are installed at the driving end of the second two-axis driving module 72 and are externally connected with an air extraction device. The placement table 74 is arranged on one side of the rotating table 2 and is used for auxiliary alignment before chip loading.

[0052] In one embodiment, the second two-axis driving module 72 includes a set of horizontal cylinders and vertical cylinders. The vertical cylinder is used to adjust the height of the second suction nozzles 73 so that they can contact the surface of the chips. When the externally connected air extraction device is started, the negative pressure generated inside the second suction nozzles 73 can grip the chips. One of the second suction nozzles 73 transfers the chips from the discharge port of the vibrating disk 71 to the placement table 74 to adjust the loading position, and the other second suction nozzle 73 transfers the chips adjusted on the placement table 74 to the rotating table 2 to dock with the substrate. Corresponding slots are provided on the placement table 74 to match the size of the chips.

[0053] As Figure 12 shown, the welding mechanism includes a three-axis driving module 81, a welding head 82, and a visual monitoring module. The welding head 82 is installed on the three-axis driving module 81, and the visual monitoring module is arranged in cooperation with the welding head 82. Optionally, the three-axis driving module 81 includes a set of cylinders in the X-axis, Y-axis, and Z-axis directions respectively, and is used to adjust the welding position of the welding head 82.

[0054] The specific implementation method is as follows:

[0055] Step 1: Substrate loading. The substrate is conveyed to the first two-axis driving module 62 through the material conveyor belt 61, and the first suction nozzle 63 grabs the substrate onto the corresponding placement table 41.

[0056] Step 2: Adsorption. In the initial state, the placement table 41 and the telescopic block 43 are in a connected state, the three-way valve 42 is switched to the confluence valve state, the interface one 421 and the interface two 422 are used as air inlets, and the interface three 423 is used as an air outlet. The interface two 422 creates a negative pressure state through the air chamber 412, so that each air port 411 adsorbs the bottom of the substrate.

[0057] Step 3: Chip feeding. The rotating table 2 drives the substrate to rotate to the chip feeding assembly 7, and the two-axis driving module II 72 transfers the chips with adjusted positions to the corresponding mounting slots on the substrate.

[0058] Step 4: Welding. The rotating table 2 drives the substrate and the chips to rotate to the welding mechanism, and the welding mechanism welds between the chips and the substrate.

[0059] Step 5: Cleaning. The rotating table 2 drives the substrate with one side welded to rotate to the substrate feeding assembly 6, and the impurity cleaning of the welding surface is carried out by means of the blowing mode of the suction nozzle I 63.

[0060] Step 6: Rotation. The micro motor II 544 starts to drive the pressing plate 547 to deflect towards the clamping plate I 52, so that one side of the substrate is clamped between the pressing plate 547 and the clamping plate I 52. The air port 411 releases the adsorption effect, and the electric push rod 49 pulls the placing table 41 to move downward as a whole to separate from the substrate. The micro motor I 53 drives the hinge seat 51 to rotate around the vertical axis, so that the side of the substrate with chips welded faces downward and the other side without chips faces upward.

[0061] Step 7: Re-adsorption. The electromagnetic cavity 431 is powered off, so that the placing table 41 and the telescopic block 43 are in a separated state. At the same time, the interface III 423 extracts air flow, and the interface I 421 serves as the air inlet. The corresponding telescopic block 43 moves downward under the influence of internal negative pressure, leaving a placement space for the chips on the lower side of the substrate. The electric push rod 49 pushes the placing table 41 to reset, the pressing plate 547 resets to release the clamping state, and the edge position of the substrate is re-adsorbed by the air port 411.

[0062] Step 8: Chip feeding. The rotating table 2 drives the substrate to rotate to the chip feeding assembly 7, and the two-axis driving module II 72 transfers the chips with adjusted positions to the corresponding mounting slots on the substrate.

[0063] Step 9: Welding. The rotating table 2 drives the substrate and the chips to rotate to the welding mechanism, and the welding mechanism welds between the chips and the substrate to achieve double-sided chip welding of the substrate.

[0064] Step 10: Discharging. The externally connected material taking mechanism grabs the processed substrate away from the rotating table 2.

[0065] Step 11: Resetting. When the three-way valve 42 is switched to the state of a flow dividing valve, the interface I 421 and the interface II 422 are converted into air outlets, and the interface III 423 serves as the air inlet. The telescopic block 43 returns to the state where its surface height is flush with that of the placing table 41. The electromagnetic cavity 431 is powered on, and the magnetic attraction block 415 enters the electromagnetic cavity 431, so that the placing table 41 is connected to the telescopic block 43.

[0066] Step 12: Circulation. Repeat the processes of Step 1 to Step 11 to complete the processing.

[0067] Further, based on Step 6, the description is as follows: When the pressing plate 547 and the first clamping plate 52 drive the substrate to flip, at this time, the first clamping plate 52 is on the upper side and the pressing plate 547 is on the lower side. When releasing the clamping state, the second micro-motor 544 drives the pressing plate 547 to deflect downward away from the first clamping plate 52. The pressing plate 547 is located within the notch 416 without affecting the flatness of the substrate. The height of the first clamping plate 52 is lifted and it is located on the upper side of the substrate at this time. In Step 11, the positions between the pressing plate 547 and the first clamping plate 52 can be reset or not. When not reset, it returns to the original state during the next flipping process.

[0068] It should be noted that in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device comprising a series of elements not only includes those elements but also includes other elements not expressly listed, or further includes elements inherent to such process, method, article or device.

[0069] Finally, it should be noted that the above are only preferred embodiments of the present invention and are not used to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements for some of the technical features. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention shall be included within the protection scope of the present invention.

Claims

1. A welding alignment device for semiconductor processing, comprising a workbench (1), a rotating table (2), a feeding mechanism and a welding mechanism, characterized in that, The rotating table (2) is connected to a rotating motor (3), the rotating motor (3) is installed on the workbench (1), the feeding mechanism and the welding mechanism are sequentially arranged around one side of the rotating table (2), and several placing components (4) and indexing components (5) are arranged circumferentially on the rotating table (2); The placing component (4) includes a placing table (41), a circle of air ports (411) are arranged on the periphery of the placing table (41), each air port (411) is connected to an air chamber (412), a hollow groove (413) is arranged in the middle of the placing table (41), a three-way valve (42) is arranged at the bottom of the hollow groove (413), an interface one (421), an interface two (422) and an interface three (423) are respectively arranged on the three-way valve (42), the interface one (421) communicates with the hollow groove (413), the interface two (422) communicates with the air chamber (412), the interface three (423) is externally connected to an air pump, a telescopic block (43) is arranged in the hollow groove (413), and a first spring (44) is connected between the telescopic block (43) and the hollow groove (413); A set of opposite side walls on the inner wall of the hollow groove (413) are provided with circular grooves, a second spring (414) is connected in the circular grooves, the other end of the second spring (414) is connected with a magnetic attraction block (415), and an electromagnetic cavity (431) is arranged at the relative position of the telescopic block (43); The indexing component (5) includes a hinge seat (51), a first clamping plate (52) is fixed on one side of the hinge seat (51) facing the placing table (41), a second clamping plate is rotatably arranged on the hinge seat (51), the second clamping plate includes a rotating rod (541), the rotating rod (541) is rotatably matched with the hinge seat (51), a driven gear (542) is sleeved at one end of the rotating rod (541), the driven gear (542) is connected with a driving gear (543) in a matching manner, and the driving gear (543) is connected with a second micro motor (544), and the second micro motor (544) is fixed on one side of the hinge seat (51); A bottom plate (545) is connected to the rotating rod (541), a plurality of third springs (546) are connected to one side of the bottom plate (545) facing the first clamping plate (52), and the other ends of the third springs (546) are connected with a pressing plate (547); A sliding block (45) is arranged on one side of the placing table (41), a sliding rail (46) is arranged at the bottom of the rotating table (2) to cooperate with the sliding block (45), a mounting plate (47) is fixed at the bottom of the sliding rail (46), a connecting sleeve (48) is fixed at the bottom of the three-way valve (42), and an electric push rod (49) is fixed on the mounting plate (47), and the driving end of the electric push rod (49) is connected with the connecting sleeve (48); The specific usage method is as follows: Step 1: Feeding the substrate; Step 2: Adsorption. In the initial state, the placement table (41) and the telescopic block (43) are in a connected state. The three-way valve (42) is switched to the confluence valve state. Interface 1 (421) and Interface 2 (422) serve as air inlets, and Interface 3 (423) serves as the air outlet. Negative pressure is created through the air chamber (412) at Interface 2 (422) to make each air port (411) adsorb the bottom of the substrate. Step 3: Chip loading. Step 4: Welding. The rotating table (2) drives the substrate and the chip to rotate to the welding mechanism, and the welding mechanism welds between the chip and the substrate. Step 5: Cleaning. Step 6: Transposition. The second micro-motor (544) starts to drive the pressing plate (547) to deflect towards the first clamping plate (52), so that one side of the substrate is clamped between the pressing plate (547) and the first clamping plate (52). The adsorption effect of the air ports (411) is released, and the electric push rod (49) pulls the placement table (41) to move downward as a whole to separate from the substrate. The first micro-motor (53) drives the hinge seat (51) to rotate around the vertical axis, so that the side of the substrate with the chip faces down and the side without the chip faces up. Step 7: Re-adsorption. The electromagnetic cavity (431) is powered off, so that the placement table (41) and the telescopic block (43) change to a separated state. At the same time, Interface 3 (423) extracts air flow, and Interface 1 (421) serves as the air inlet. The corresponding telescopic block (43) moves downward under the influence of internal negative pressure, leaving a placement space for the chip on the lower side of the substrate. The electric push rod (49) pushes the placement table (41) back to its original position, and the pressing plate (547) returns to its original position to release the clamping state. The edge position of the substrate is re-adsorbed by the air ports (411). Step 8: Chip loading. Step 9: Welding. The rotating table (2) drives the substrate and the chip to rotate to the welding mechanism, and the welding mechanism welds between the chip and the substrate to achieve double-sided chip welding of the substrate. Step 10: Unloading. The externally connected material taking mechanism grabs the processed substrate away from the rotating table (2). Step 11: Reset. When the three-way valve (42) is switched to the shunt valve state, Interface 1 (421) and Interface 2 (422) are changed to air outlets, and Interface 3 (423) serves as the air inlet. The telescopic block (43) returns to the same surface height as the placement table (41). The electromagnetic cavity (431) is powered on, and the magnetic block (415) enters the electromagnetic cavity (431) to connect the placement table (41) and the telescopic block (43). Step 12: Circulation. Repeat the processes of Step 1 to Step 11 to complete the processing.

2. The welding alignment device for semiconductor processing according to claim 1, characterized in that, The surface of the first clamping plate (52) is horizontally arranged and at the same surface height as the rotating table (2). The placement table (41) is provided with a notch (416) in cooperation with the first clamping plate (52). The other side of the hinge seat (51) is connected to the first micro-motor (53).

3. The welding alignment device for semiconductor processing according to claim 2, wherein Both ends of the pressing plate (547) are provided with clamping blocks (548), and the bottom plate (545) is provided with corresponding card slots in cooperation with the clamping blocks (548).

4. A welding alignment device for semiconductor processing according to claim 3, characterized in that, The loading mechanism includes a substrate loading component (6) and a chip loading component (7).

5. A welding alignment device for semiconductor processing according to claim 4, characterized in that, The substrate loading component (6) includes a material conveyor belt (61), a two-axis driving module one (62), and a suction nozzle one (63). The two-axis driving module one (62) is installed on one side of the material conveyor belt (61), and the suction nozzle one (63) is installed at the driving end of the two-axis driving module one (62) and is externally connected to an air extraction device; The chip loading component (7) includes a vibrating disk (71), a two-axis driving module two (72), a set of suction nozzles two (73), and a placement table (74). The vibrating disk (71) is stacked with chips. The two-axis driving module two (72) is arranged on the side of the discharge port of the vibrating disk (71). The suction nozzle two (73) is installed at the driving end of the two-axis driving module two (72) and is externally connected to an air extraction device.

6. The welding alignment device for semiconductor processing according to claim 5, wherein, The welding mechanism includes a three-axis driving module (81), a welding head (82), and a visual monitoring module. The welding head (82) is installed on the three-axis driving module (81), and the visual monitoring module is arranged in cooperation with the welding head (82).

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