Grating coupling light engine packaging structure

Abstract

The invention relates to the technical field of optical modules, and discloses a grating coupling optical engine packaging structure, which comprises a substrate, an electric chip, a silicon optical chip, an optical fiber socket, an optical fiber array and a laser, and is characterized in that the electric chip is arranged on the upper side of the substrate, the silicon optical chip is arranged on the upper side of the electric chip, and the silicon optical chip and the electric chip are electrically connected with the substrate; the optical fiber socket is fixed on the upper side of the silicon optical chip, the optical fiber socket is provided with a positioning groove of which the opening direction is vertical to the silicon optical chip, the optical fiber array is inserted into the positioning groove in a guiding manner, and the optical fiber socket is also provided with a locking piece for fixing the optical fiber array; a waveguide group and a grating array are arranged in the silicon optical chip, the waveguide group and the grating array are conducted in the direction parallel to the surface of the silicon optical chip, and a lens and a grating array are further arranged in the optical fiber socket, and the lens and the optical fiber array are conducted in the direction perpendicular to the surface of the silicon optical chip; the lasers are arranged on the substrate and electrically connected with the substrate, the lasers and the silicon optical chips are arranged at intervals, and input optical fibers are connected between the lasers and the silicon optical chips.

Description

Technical Field

[0001] The present invention relates to the technical field of optical modules, and in particular to a grating-coupled optical engine packaging structure. Background Art

[0002] In data centers and 5G communications, silicon photonic engines are core components of optical communications based on silicon-based optoelectronic technology. By integrating optical devices and electronic circuits on the same silicon chip, they have technical advantages such as high integration, high communication rate and low power consumption.

[0003] For example, the Chinese invention patent application with application publication number CN113484961A and application publication date 2021.10.08 discloses a grating-coupled CPO silicon photonic engine, including a circuit substrate and an optical unit; the optical unit includes: an electric chip, a silicon photonic chip, and an optical coupling component; the electric chip and the silicon photonic chip are arranged on the top surface of the circuit substrate, and the electric chip is located on one side of the end face of one end of the silicon photonic chip, and transmits signals with the silicon photonic chip. A grating window is provided on the top surface of the other end of the silicon photonic chip, and the optical coupling component is glued to the silicon photonic chip through an optical matching glue, and is directly coupled to the optical fiber window; the optical coupling component includes: a coupling component body and an optical fiber; the bottom surface of the coupling component body includes: a plane glued to the top surface of the silicon photonic chip and an inclined surface opposite to the grating window, and the optical fiber extends from the inclined surface to the outside.

[0004] In the prior art grating-coupled CPO silicon photonic engines, the optical coupling component is coupled with the grating window of the silicon photonic chip through an inclined angle. However, the optical coupling component is glued and fixed on the silicon photonic chip, and the optical coupling component and the optical fiber cannot meet the requirements of disassembly and replacement. Due to the alignment requirements of the grating window and the optical fiber, the later use and maintenance costs are high; moreover, the optical unit is arranged in a planar manner, the space utilization rate of the substrate surface is low, and the integration of the optical engine is poor. Summary of the invention

[0005] The technical problem to be solved by the present invention is that the optical coupling components and optical fibers cannot meet the requirements of disassembly and replacement, and are subject to the alignment requirements of the grating window and the optical fiber, resulting in high maintenance costs in later use; moreover, the optical unit is arranged in a planar form, the space utilization rate of the substrate surface is low, and the integration of the optical engine is poor.

[0006] In order to solve the above technical problems, the present invention provides a technical solution for a grating-coupled optical engine packaging structure:

[0007] The grating coupled optical engine packaging structure includes a substrate, an electric chip, a silicon photonic chip, an optical fiber socket, an optical fiber array and a laser, wherein the electric chip is arranged on the upper side of the substrate, the silicon photonic chip is arranged on the upper side of the electric chip, and the silicon photonic chip and the electric chip are both electrically connected to the substrate;

[0008] The optical fiber socket is fixedly installed on the upper side of the silicon photonic chip, and is provided with a positioning groove, the opening direction of which is perpendicular to the surface of the silicon photonic chip, and the optical fiber array is inserted into the positioning groove. A locking piece for fixing the optical fiber array is also installed on the outer side of the optical fiber socket;

[0009] A waveguide group and a grating array are provided inside the silicon photonic chip, and the waveguide group and the grating array are light-conducting in a direction parallel to the surface of the silicon photonic chip. A lens is also provided inside the optical fiber socket, and the grating array, the lens and the optical fiber array are light-conducting in a direction perpendicular to the surface of the silicon photonic chip.

[0010] The laser is disposed on the substrate and electrically connected to the substrate. The laser and the silicon photonic chip are arranged at intervals. An input optical fiber is also connected between the laser and the silicon photonic chip. The input optical fiber is optically connected to the waveguide group.

[0011] Furthermore, the optical fiber socket and the lens are an integrated glass structure, and the lens is formed by micro-etching.

[0012] Furthermore, a notch is provided at the upper portion of the optical fiber socket away from the silicon photonic chip, the opening direction of the notch is vertically connected to the opening direction of the positioning groove, and a chamfer is provided on one side of the positioning groove close to the notch, and the chamfer is inclined from top to bottom toward the inner side of the positioning groove.

[0013] Furthermore, a groove is provided on the upper side of the silicon photonic chip corresponding to the grating array, the grating array is embedded in the bottom of the groove, and a boss is provided at the lower part of the optical fiber socket, and the groove and the boss are matched in a concave-convex manner.

[0014] Furthermore, two locking pieces are provided, and the two locking pieces are symmetrically distributed at both ends of the positioning groove. The locking pieces are rotatably installed on the upper side of the optical fiber socket, and the rotation axis of the locking pieces is perpendicular to the surface of the silicon photonic chip. The locking pieces have a locking state cantilevered to the inner side of the positioning groove, and an unlocking state avoiding the positioning groove.

[0015] Furthermore, the silicon photonic chip also integrates a demultiplexer, a modulator, an MPD element and a PD element. The waveguide group includes a transmitting waveguide group and a receiving waveguide group. The demultiplexer is arranged between the input optical fiber and the transmitting waveguide group. The modulator and the MPD element are both arranged in the transmitting waveguide group. The receiving waveguide group is spaced apart from the transmitting waveguide group, and the receiving waveguide group is connected to the PD element.

[0016] Furthermore, the laser is a continuous laser, the optical fiber array and the input optical fiber are arranged in parallel, the input optical fiber guide is inserted in the positioning groove, and a composite waveguide is also provided inside the silicon photonic chip, and the composite waveguide is spaced apart from the transmitting waveguide group and the receiving waveguide group; the grating array is also provided between the composite waveguide and the input optical fiber to couple the input optical signal generated by the laser to the composite waveguide.

[0017] Furthermore, a self-alignment structure is provided inside the optical fiber socket, and the self-alignment structure gradually shrinks in the direction approaching the silicon photonic chip; an alignment through hole is provided at the lower end of the self-alignment structure, and the alignment through hole is opposite to the grating array up and down, and the matching amount between the alignment through hole and the core of the optical fiber array is -0.5μm to +0.5μm.

[0018] Furthermore, the self-alignment structure is in the shape of a flared quadrangular pyramid, and has two V-shaped grooves, which are arranged opposite to each other along the length direction of the positioning groove, and the ratio of the opening width to the length of the V-shaped groove is 1:2 to 1:5.

[0019] Furthermore, the grating array includes a plurality of diffraction grooves, wherein the diffraction grooves are extended parallel to the length direction of the positioning groove, and the plurality of diffraction grooves are equidistantly spaced along the width direction of the positioning groove, and a reflective layer is also provided on the lower side of the diffraction grooves corresponding to the inside of the silicon photonic chip.

[0020] Compared with the prior art, the grating-coupled optical engine packaging structure of the present invention has the following beneficial effects: the grating-coupled optical engine packaging structure adopts the design form of a substrate, an electric chip, a silicon photonic chip, an optical fiber socket, an optical fiber array and a laser. The electric chip and the silicon photonic chip are stacked on the substrate and electrically connected to the substrate. The vertical stacking structure can not only shorten the length of the electrical interconnection, but also reduce the plane occupation, so that the substrate surface can fully accommodate the laser and ASIC components, etc., and improve the space utilization rate of the substrate surface. The optical fiber socket is fixedly installed on the upper side of the silicon photonic chip, and the optical fiber socket is provided with a positioning groove with an opening direction perpendicular to the surface of the silicon photonic chip, and the optical fiber array is guided and inserted into the positioning groove. The optical fiber array is installed by a guided plug-in method and mechanically fixed with a locking piece. The physical plug-in structure realizes the detachable installation of the optical fiber array, ensuring that the alignment accuracy of the connection is still guaranteed after plug-in replacement.

[0021] Among them, the grating array, lens and fiber array form a vertical light conduction path. The vertical light path design meets the actual needs of fiber optic connection. The lens has focusing or beam expansion functions to compensate for plug-in tolerance and improve the optical coupling efficiency. In addition, the laser is set on the substrate and electrically connected to the substrate. The laser and the silicon photonic chip are arranged at intervals. The substrate serves as a heat dissipation carrier for the laser, which avoids the heat generated during operation from being transferred to the silicon photonic chip, ensuring the heat dissipation effect of the optical engine packaging structure. In addition, the optical fiber socket is integrated with the silicon photonic chip, and the laser is connected to the silicon photonic chip through the input optical fiber, realizing the physical separation of the light source and the processing unit.

[0022] The optical signal transmission path is: the laser emits an optical signal, which passes through the input optical fiber, waveguide group, grating array, lens and finally enters the optical fiber array. Correspondingly, the optical signal receiving path is: the optical signal in the optical fiber array passes through the lens, grating array, waveguide group and silicon photonic chip. The key is that it is the combination of the vertical optical path, lens and positioning groove guide plug-in design that can meet the requirements of disassembly and replacement, alignment accuracy and coupling efficiency, and reduce the cost of later use and maintenance; the optical, electrical and thermal units are arranged in layers, which reduces the size of the optical engine while ensuring the heat dissipation effect, and improves the integration of the optical engine. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 is a three-dimensional schematic diagram of a grating coupling light engine packaging structure according to an embodiment of the present invention;

[0024] Figure 2 is a schematic front view of a grating-coupled light engine packaging structure according to an embodiment of the present invention;

[0025] Figure 3 is a schematic diagram of the assembly of an electric chip and a silicon photonic chip in an embodiment of the present invention;

[0026] Figure 4 Schematic diagram of the assembly of the electric chip, silicon photonic chip and optical fiber socket in the embodiment of the present invention;

[0027] Figure 5 is a three-dimensional schematic diagram of an optical fiber array and an optical fiber socket in an embodiment of the present invention;

[0028] Figure 6 is a cross-sectional schematic diagram of an optical fiber array and an optical fiber socket in an embodiment of the present invention;

[0029] Figure 7 is a top view schematic diagram of a positioning groove of an optical fiber socket in an embodiment of the present invention;

[0030] Figure 8 is a schematic diagram of the optical path between the grating array and the lens in an embodiment of the present invention;

[0031] Fig. 9Schematic diagram of the internal optical path of the silicon photonic chip in an embodiment of the present invention;

[0032] In the figure: 1-substrate, 2-electric chip, 3-silicon photonic chip, 30-sinking groove, 31-waveguide group, 311-transmitting waveguide group, 312-receiving waveguide group, 313-composite waveguide, 32-grating array, 320-diffraction groove, 33-demultiplexer, 34-modulator, 35-MPD element, 36-PD element, 4-optical fiber socket, 40-boss, 41-positioning groove, 42-locking piece, 43-lens, 44-notch, 45-chamfered portion, 46-self-alignment structure, 460-V-groove, 5-optical fiber array, 6-laser, 60-input optical fiber, 7-ASIC element. DETAILED DESCRIPTION

[0033] The specific implementation of the present invention is further described in detail below in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.

[0034] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like used in the present invention to indicate the orientation or position relationship are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention.

[0035] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0036] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected or indirectly connected through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0037] like Figures 1 to 9As shown, the grating-coupled optical engine packaging structure of an embodiment of the present invention includes a substrate 1, an electric chip 2, a silicon photonic chip 3, an optical fiber socket 4, an optical fiber array 5 and a laser 6. The electric chip 2 is arranged on the upper side of the substrate 1, and the silicon photonic chip 3 is arranged on the upper side of the electric chip 2, and the silicon photonic chip 3 and the electric chip 2 are both electrically connected to the substrate 1; the optical fiber socket 4 is fixedly installed on the upper side of the silicon photonic chip 3, and the optical fiber socket 4 is provided with a positioning groove 41, and the opening direction of the positioning groove 41 is perpendicular to the surface of the silicon photonic chip 3, and the optical fiber array 5 is guided and inserted in the positioning groove 41, and a locking piece 42 for fixing the optical fiber array 5 is also installed on the outer side of the optical fiber socket 4.

[0038] A waveguide group 31 and a grating array 32 are provided inside the silicon photonic chip 3. The waveguide group 31 and the grating array 32 are light-conducting in a direction parallel to the surface of the silicon photonic chip 3. A lens 43 is also provided inside the optical fiber socket 4. The grating array 32, the lens 43 and the optical fiber array 5 are light-conducting in a direction perpendicular to the surface of the silicon photonic chip 3. The laser 6 is arranged on the substrate 1 and is electrically connected to the substrate 1. The laser 6 and the silicon photonic chip 3 are arranged at intervals. An input optical fiber 60 is also connected between the laser 6 and the silicon photonic chip 3, and the input optical fiber 60 is light-conducting with the waveguide group 31.

[0039] The grating coupled optical engine packaging structure adopts the design form of substrate 1, electric chip 2, silicon photonic chip 3, optical fiber socket 4, optical fiber array 5 and laser 6. The electric chip 2 and silicon photonic chip 3 are stacked on the substrate 1 and electrically connected to the substrate 1. The vertical stacking structure can not only shorten the length of electrical interconnection, but also reduce the plane occupation, so that the surface of the substrate 1 can fully accommodate the laser 6 and AS IC components 7, etc., and improve the space utilization rate of the surface of the substrate 1. The optical fiber socket 4 is fixedly installed on the upper side of the silicon photonic chip 3. The optical fiber socket 4 is provided with a positioning groove 41 with an opening direction perpendicular to the surface of the silicon photonic chip 3. The optical fiber array 5 is guided and inserted into the positioning groove 41. The optical fiber array 5 is installed by guided insertion and mechanically fixed with the locking piece 42. The physical plug-in structure realizes the detachable installation of the optical fiber array 5, ensuring that the alignment accuracy of the connection is still guaranteed after plug-in replacement.

[0040] Among them, the grating array 32, the lens 43 and the optical fiber array 5 form a light conduction path in a vertical direction. The vertical optical path design meets the actual needs of optical fiber connection. The lens 43 has a focusing or beam expanding function to compensate for the plug-in tolerance and improve the optical coupling efficiency. In addition, the laser 6 is arranged on the substrate 1 and electrically connected to the substrate 1. The laser 6 and the silicon photonic chip 3 are arranged at intervals. The substrate 1 serves as a heat dissipation carrier for the laser 6, which avoids the heat generated during operation from being transferred to the silicon photonic chip 3, thereby ensuring the heat dissipation effect of the optical engine packaging structure. In addition, the optical fiber socket 4 is integrated with the silicon photonic chip 3, and the laser 6 is connected to the silicon photonic chip 3 through the input optical fiber 60, thereby realizing the physical separation of the light source and the processing unit.

[0041] The optical signal transmission path is: the laser 6 emits an optical signal, which passes through the input optical fiber 60, the waveguide group 31, the grating array 32, and the lens 43 in sequence and finally enters the optical fiber array 5. Correspondingly, the optical signal receiving path is: the optical signal in the optical fiber array 5 passes through the lens 43, the grating array 32, and the waveguide group 31 to the silicon photonic chip 3 in sequence. The key point is that it is the guide plug-in design that combines the vertical optical path, the lens 43, and the positioning groove 41 that can meet the requirements of disassembly and replacement, alignment accuracy, and coupling efficiency, and reduces the cost of later use and maintenance; the optical, electrical, and thermal units are arranged in layers, which reduces the size of the optical engine while ensuring the heat dissipation effect, and improves the integration of the optical engine.

[0042] In this embodiment, the optical fiber socket 4 and the lens 43 are an integrated glass structure, and the lens 43 is formed by micro-etching. The lens 43 and the optical fiber socket 4 have high integrity, and micro-etching can ensure the surface accuracy of the lens 43, avoiding the situation where coupling errors are easily caused during the assembly process. As a further preferred solution, a groove 30 is provided on the upper side of the silicon photonic chip 3 corresponding to the grating array 32, and the grating array 32 is embedded in the bottom of the groove 30. A boss 40 is also provided at the lower part of the optical fiber socket 4, and the groove 30 and the boss 40 are matched in a concave-convex manner. Through the cooperation between the boss 40 and the groove 30, the position accuracy and installation reliability of the optical fiber socket 4 are guaranteed, and the subsequent plugging and unplugging operations may cause position deviations.

[0043] Among them, a notch 44 is further provided at the upper part of the optical fiber socket 4 away from the silicon photonic chip 3, and the opening direction of the notch 44 is vertically connected to the opening direction of the positioning groove 41. A chamfer 45 is further provided on the side of the positioning groove 41 close to the notch 44, and the chamfer 45 is inclined from top to bottom toward the inner side of the positioning groove 41. The notch 44 is provided at the upper part of the optical fiber socket 4, and the optical fiber array 5 can be vertically inserted and horizontally led out for routing. The positioning groove 41 is provided with a chamfer 45 close to the notch 44, so that the optical fiber array 5 can be bent with a large turning radius to prevent the problem of optical fiber breakage caused by excessive bending.

[0044] In this embodiment, two locking pieces 42 are provided, and the two locking pieces 42 are symmetrically distributed at both ends of the positioning groove 41. The locking pieces 42 are rotatably mounted on the upper side of the optical fiber socket 4, and the rotation axis of the locking pieces 42 is perpendicular to the surface of the silicon photonic chip 3. The locking pieces 42 have a locked state in which they are cantilevered to the inner side of the positioning groove 41, and an unlocked state in which they avoid the positioning groove 41. When in use, after inserting the optical fiber array 5, the locking pieces 42 are adjusted to the locked state, which can compress and fix the optical fiber array 5, thereby ensuring the reliability and stability of the plug-in connection.

[0045] like Fig. 9As shown, the silicon photonic chip 3 also integrates a demultiplexer 33, a modulator 34, an MPD element 35 and a PD element 36. The waveguide group 31 includes a transmitting waveguide group 311 and a receiving waveguide group 312. The demultiplexer 33 is arranged between the input optical fiber 60 and the transmitting waveguide group 311. The modulator 34 and the MPD element 35 are both arranged in the transmitting waveguide group 311; the receiving waveguide group 312 is spaced apart from the transmitting waveguide group 311, and the receiving waveguide group 312 is connected to the PD element 36. It should be noted that the demultiplexer 33 adopts wavelength division multiplexing technology to separate multiple optical signals of different wavelengths that are compounded together into separate optical signals, thereby achieving the purpose of high-efficiency and high-capacity data transmission. The optical signal is then modulated by the modulator 3 so that the intensity, frequency, phase, polarization state and other characteristics of the optical signal meet the output requirements, ensuring that it can be smoothly transmitted to the optical fiber array 5 through the transmitting waveguide group 311. The MPD element 35 can monitor the optical signal in the transmitting waveguide group 311 and feedback information so that the power and quality of the output optical signal meet the requirements, thereby ensuring the stability of the modulated output optical signal.

[0046] In addition, the laser 6 is a continuous laser, the optical fiber array 5 and the input optical fiber 60 are arranged in parallel, the input optical fiber 60 is guided and inserted in the positioning groove 41, and a composite waveguide 313 is also provided inside the silicon photonic chip 3, and the composite waveguide 313 is spaced apart from the emission waveguide group 311 and the receiving waveguide group 312; the grating array 32 is also provided between the composite waveguide 313 and the input optical fiber 60 to couple the input optical signal generated by the laser 6 to the composite waveguide 313. The continuous laser can continuously generate different composite optical signals, and the output efficiency of the optical signal is high, which avoids multiple laser elements occupying a large space. The optical signal emission path of the silicon photonic chip 3 is: continuous laser, input optical fiber 60, composite waveguide 313, emission waveguide group 311 to the optical fiber array 5. The optical signal receiving path of the silicon photonic chip 3 is: optical fiber array 5, receiving waveguide group 312 to PD element 36, and PD element 36 converts the received optical signal into an electrical signal through the photoelectric effect, so as to further process the electrical signal to obtain a data signal.

[0047] As a further preferred solution, a self-alignment structure 46 is further provided inside the optical fiber socket 4, and the self-alignment structure 46 gradually shrinks toward the direction close to the silicon photonic chip 3; an alignment through hole is provided at the lower end of the self-alignment structure 46, and the alignment through hole is opposite to the grating array 32 up and down, and the matching amount between the alignment through hole and the core of the optical fiber array 5 is -0.5μm to +0.5μm. Specifically, the shape of the self-alignment structure 46 is a quadrangular pyramid expansion, and the self-alignment structure 46 has two V-grooves 460, and the two V-grooves 460 are arranged oppositely along the length direction of the positioning groove 41, and the ratio of the opening width to the length of the V-grooves 460 is 1:2 to 1:5. The two V-grooves 460 of the self-alignment structure 46 can be used to align and position the core of the fiber array 5 in the length and width directions, ensuring that the cores of the multi-pass optical fibers are evenly spaced along the length direction of the positioning groove 41, and ensuring high-precision coupling between the optical fiber array 5, the lens 43 and the grating array 32.

[0048] In addition, the grating array 32 includes a plurality of diffraction grooves 320, which are extended in parallel to the length direction of the positioning groove 41, and the plurality of diffraction grooves 320 are equally spaced along the width direction of the positioning groove 41, and a reflective layer is also provided on the lower side of the corresponding diffraction grooves 320 inside the silicon photonic chip 3. In the silicon photonic chip 3, the optical signal is transmitted to the grating array 32 along the planar direction, and diffraction and interference effects occur through the diffraction grooves 320, so that the propagation direction of the optical signal is adjusted to a vertical direction, and the reflective layer at the bottom of the diffraction grooves 320 constrains the light field distribution, reduces the crosstalk between adjacent grating units, and improves the stability and coupling efficiency of multi-channel optical communication.

[0049] The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and substitutions can be made without departing from the technical principles of the present invention. These improvements and substitutions should also be regarded as the scope of protection of the present invention.

Claims

1. A grating coupled light engine packaging structure, characterized in that: It includes a substrate, an electric chip, a silicon photonic chip, an optical fiber socket, an optical fiber array and a laser, wherein the electric chip is arranged on the upper side of the substrate, the silicon photonic chip is arranged on the upper side of the electric chip, and the silicon photonic chip and the electric chip are both electrically connected to the substrate; The optical fiber socket is fixedly installed on the upper side of the silicon photonic chip, and is provided with a positioning groove, the opening direction of which is perpendicular to the surface of the silicon photonic chip, and the optical fiber array is inserted into the positioning groove. A locking piece for fixing the optical fiber array is also installed on the outer side of the optical fiber socket; A waveguide group and a grating array are provided inside the silicon photonic chip, and the waveguide group and the grating array are light-conducting in a direction parallel to the surface of the silicon photonic chip. A lens is also provided inside the optical fiber socket, and the grating array, the lens and the optical fiber array are light-conducting in a direction perpendicular to the surface of the silicon photonic chip. The laser is disposed on the substrate and electrically connected to the substrate. The laser and the silicon photonic chip are arranged at intervals. An input optical fiber is also connected between the laser and the silicon photonic chip. The input optical fiber is optically connected to the waveguide group.

2. The grating-coupled light engine packaging structure according to claim 1, characterized in that: The optical fiber socket and the lens are an integrated glass structure, and the lens is formed by micro-etching.

3. The grating-coupled light engine packaging structure according to claim 2, characterized in that: A notch is provided at the upper part of the optical fiber socket away from the silicon photonic chip, and the opening direction of the notch is vertically connected to the opening direction of the positioning groove. A chamfered portion is provided on one side of the positioning groove close to the notch, and the chamfered portion is inclined from top to bottom toward the inner side of the positioning groove.

4. The grating-coupled light engine packaging structure according to claim 1, wherein: A groove is provided on the upper side of the silicon photonic chip corresponding to the grating array, and the grating array is embedded in the bottom of the groove. A boss is also provided at the lower part of the optical fiber socket, and the groove and the boss are matched in a concave-convex manner.

5. The grating-coupled light engine packaging structure according to claim 1, characterized in that: The locking members are provided with two, and the two locking members are symmetrically distributed at both ends of the positioning groove. The locking members are rotatably installed on the upper side of the optical fiber socket, and the rotation axis of the locking members is perpendicular to the surface of the silicon photonic chip. The locking members have a locking state cantilevered to the inner side of the positioning groove, and an unlocking state avoiding the positioning groove.

6. The grating-coupled light engine packaging structure according to claim 1, characterized in that: The silicon photonic chip also integrates a demultiplexer, a modulator, an MPD element and a PD element. The waveguide group includes a transmitting waveguide group and a receiving waveguide group. The demultiplexer is arranged between the input optical fiber and the transmitting waveguide group. The modulator and the MPD element are both arranged in the transmitting waveguide group. The receiving waveguide group is spaced apart from the transmitting waveguide group, and the receiving waveguide group is connected to the PD element.

7. The grating-coupled light engine packaging structure according to claim 6, characterized in that: The laser is a continuous laser, the optical fiber array and the input optical fiber are arranged in parallel, the input optical fiber guide is inserted in the positioning groove, and a composite waveguide is also provided inside the silicon photonic chip, and the composite waveguide is spaced apart from the transmitting waveguide group and the receiving waveguide group; the grating array is also arranged between the composite waveguide and the input optical fiber to couple the input optical signal generated by the laser to the composite waveguide.

8. The grating-coupled light engine packaging structure according to claim 1, wherein: A self-alignment structure is also provided inside the optical fiber socket, and the self-alignment structure gradually shrinks towards the direction approaching the silicon photonic chip; an alignment through hole is provided at the lower end of the self-alignment structure, and the alignment through hole is opposite to the grating array up and down, and the matching amount between the alignment through hole and the core of the optical fiber array is -0.5μm to +0.5μm.

9. The grating-coupled light engine packaging structure according to claim 8, characterized in that: The self-aligning structure is in the shape of a quadrangular pyramid expansion, and has two V-shaped grooves, which are arranged opposite to each other along the length direction of the positioning groove, and the ratio of the opening width to the length of the V-shaped groove is 1:2 to 1:

5.

10. The grating-coupled light engine packaging structure according to claim 1, characterized in that: The grating array includes a plurality of diffraction grooves, which extend parallel to the length direction of the positioning groove. The plurality of diffraction grooves are equidistantly spaced along the width direction of the positioning groove, and a reflective layer is also provided on the lower side of the diffraction grooves corresponding to the inside of the silicon photonic chip.

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