High-precision optical lens beam absorber rapid temperature control device and temperature control method thereof
By adopting a fast temperature control device integrated with dual-core TEC in the beam absorber, the problem of low efficiency of traditional water-cooled heat dissipation methods is solved, and the rapid and accurate temperature control of the beam absorber is achieved, which improves the exposure quality and the service life of the equipment.
Patent Information
- Application Number
- CN202411986893.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-31
- Publication Date
- 2025-05-16
AI Technical Summary
The traditional water-cooled heat dissipation method is too slow to control the temperature of the beam absorber within an ideal range in a short time, resulting in thermal deformation of the structure and affecting the uniformity and quality of the exposure process.
The high-precision optical lens beam absorber fast temperature control device based on PID control and dual-core TEC is adopted to achieve rapid refrigeration through the L-type refrigeration module and semiconductor refrigeration sheet, and the temperature is accurately controlled by combining PID algorithm and fuzzy control.
It realizes fast and precise temperature control of the beam absorber, avoids excessive temperature gradient or fluctuations, meets the temperature control needs of the beam absorber during operation, and improves the exposure quality and service life of the equipment.
Smart Images
Figure CN120010581A_ABST
Abstract
Description
Technical Field
[0001] The present invention belongs to the technical field of temperature control, and specifically relates to a high-precision optical lens beam absorber rapid temperature control device and a temperature control method based on PID control and dual-core TEC integration. Background Art
[0002] The LDI exposure machine is an exposure device that uses laser direct imaging (LDI) technology. The beam absorber is part of the optical system of the laser direct imaging system (LDI) and is usually made of highly absorbent materials. When the exposure machine is not in operation, the laser beam will be guided into the absorber to absorb and dissipate the laser energy, convert the laser energy into heat energy, and release the heat through the heat dissipation structure.
[0003] In existing exposure machines, the absorber is generally cooled by water to dissipate heat.
[0004] Technical issues: In the traditional water cooling method, the target parameters for cooling can be set very accurately, but the heat dissipation efficiency is too slow to control the temperature of the beam absorber within the ideal range in a short time. If the temperature of the beam absorber is too high, it will cause thermal deformation of the structure, resulting in unevenness or distortion during the exposure process, thus affecting the quality and accuracy of the printed circuit board. Summary of the invention
[0005] The technical problem to be solved by the present invention is: how to develop a high-precision optical lens beam absorber rapid temperature control device based on PID control and TEC integration to meet the temperature control requirements of the beam absorber during operation and improve the exposure quality of the equipment.
[0006] The technical solution of the present invention is specifically as follows: A high-precision optical lens beam absorber rapid temperature control device comprises at least one refrigeration module, the refrigeration module comprises an L-shaped water cooling head, the cavity inside the water cooling head is a water storage chamber, the water cooling head is provided with a water inlet and an outlet, both of which are connected to a water cooling machine through a water pipe, and an L-shaped metal cooling plate is fixed on the inner wall of the water cooling head; A semiconductor refrigeration sheet is provided between the water cooling head and the metal cold plate, the cold end of the semiconductor refrigeration sheet contacts the metal cold plate, and the hot end of the semiconductor refrigeration sheet contacts the water cooling head; a temperature sensor is provided on the water cooling head, and the temperature sensor is connected to the control box through a data cable, and the control box is connected to the temperature sensor and the semiconductor refrigeration sheet through a power cable to realize power supply to both.
[0007] A heat insulation layer is provided between the water cooling head and the metal cold plate, and the heat insulation layer may be made of thermal insulation cotton or the like.
[0008] The control box is provided with a module power supply and temperature transmission interface connected with a power line and a data line, a main power interface connected with an external power source, and a communication interface for communicating with the outside world.
[0009] There are two semiconductor refrigeration sheets, and one semiconductor refrigeration sheet is arranged on one side of the water cooling head.
[0010] The working surface of the metal cold-conducting plate is provided with flexible heat-conducting material.
[0011] The heat conducting material is evenly applied between the metal cooling plate and the cold end of the semiconductor cooling sheet, and between the water cooling head and the hot end of the semiconductor cooling sheet.
[0012] There are two refrigeration modules, which are arranged face to face on the inner sides of the two water cooling heads.
[0013] A temperature control method, using the above-mentioned high-precision optical lens beam absorber rapid temperature control device, includes a first stage and a second stage: The first stage is also the preparation stage, including: S11, place the beam absorber, attach the metal cooling plate to a ridge of the beam absorber, and make the probe of the temperature sensor contact the outer surface of the beam absorber; S12, the temperature of the metal cooling plate gradually approaches the temperature of the touch beam absorber; S13, inputting the control target temperature T℃ to the water chiller, the water chiller continuously inputs cold water of T℃, the cold water continuously enters the water cooling head and then returns to the water chiller, and the cycle is repeated so that the temperature of the water cooling head is maintained at T℃; The second stage: also the cooling stage, including: When the laser imaging system starts to be shut down, the light beam will be introduced into the beam absorber, and the temperature sensor will start to collect the temperature data of the beam absorber and transmit it to the control module of the control box; the control module receives the temperature information and starts to analyze and judge. When the system determines that the collected temperature is inconsistent with the set target temperature T℃, the control module starts to cool down; after a cooling cycle, the system determines whether the new collected temperature is consistent with the set target temperature T℃. If "Y", it ends, if "N", it continues to cool down; The specific cooling process is as follows: the control box controls the semiconductor refrigeration chip to get powered, the conductor refrigeration chip starts to work, the cold end of the semiconductor refrigeration chip absorbs the heat of the metal cold plate, and the temperature of the metal cold plate and the light beam absorber decreases; the hot end of the semiconductor refrigeration chip inputs heat to the water cooling head, and the temperature of the water cooling head increases; at the same time, the water cooling machine continuously inputs cold water of T℃, so that the temperature of the water cooling head gradually changes to T℃.
[0014] In the above step S11, when there are two refrigeration modules, two water cooling heads are located on two opposite ridges of the beam absorber.
[0015] Compared with the prior art, the technical effect of the present invention is that the L-shaped refrigeration module of the present invention is designed based on the external structure of the beam absorber to perform precise temperature control and realize rapid cooling of the dual-core TEC. The TEC can completely fit the outside of the beam absorber, so it can more accurately control the local or overall temperature and avoid excessive temperature gradients or temperature fluctuations. It can meet the temperature control requirements of the beam absorber during operation and improve the exposure quality of the equipment. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] Figure 1 It is a schematic diagram of the use state of the present invention.
[0017] Figure 2 The schematic diagram of the control box.
[0018] Figure 3 It is a schematic diagram of the refrigeration module. DETAILED DESCRIPTION
[0019] The present invention will be described in detail below with reference to the accompanying drawings and specific embodiments thereof.
[0020] like Figure 1-3 , a high-precision optical lens beam absorber rapid temperature control device, including at least one refrigeration module 20.
[0021] The refrigeration module 20 includes an L-shaped water cooling head 21 , the cavity inside the water cooling head 21 is a water storage chamber, the water cooling head 21 is provided with a water inlet and outlet 22 , the water inlet and outlet 22 are connected to the water cooling machine 10 through a water pipe 11 , and an L-shaped metal cold conduction plate 24 is fixed on the inner wall of the water cooling head 21 .
[0022] A semiconductor refrigeration sheet is provided between the water cooling head 21 and the metal cooling plate 24 . The cold end 26 of the semiconductor refrigeration sheet contacts the metal cooling plate 24 , and the hot end (not shown) of the semiconductor refrigeration sheet contacts the water cooling head 21 .
[0023] The water cooling head 21 is provided with a temperature sensor (not shown in the figure), which is connected to the control box 30 via a data line 31, and the control box 30 is connected to the temperature sensor and the semiconductor cooling sheet via a power line 32 to supply power to both.
[0024] In order to avoid heat exchange between the water-cooled head 21 and the metal cold plate 24 , a heat insulating layer 25 is provided between the water-cooled head 21 and the metal cold plate 24 . The heat insulating layer 25 may be made of thermal insulation cotton or the like.
[0025] For easy connection, the control box 30 is provided with a module power supply and temperature transmission interface 33 connected to the power line 32 and the data line 31, a main power interface 34 connected to an external power supply, and a 485 communication interface 35 for communicating with the outside world.
[0026] There are two semiconductor cooling sheets, and one semiconductor cooling sheet is arranged on one side of the water cooling head 21 .
[0027] The working surface of the metal cold plate 24 is provided with a flexible heat-conducting material (not shown in the figure). The flexible heat-conducting material is a new type of material in the form of textile, which has both heating performance and efficient energy conversion, and is called graphene textile flexible heating material.
[0028] The heat conducting material is evenly applied between the metal cold conducting plate 24 and the cold end of the semiconductor refrigeration sheet, and between the water cooling head 21 and the hot end 26 of the semiconductor refrigeration sheet, so as to achieve sufficient heat conduction.
[0029] In order to conduct heat quickly, two refrigeration modules 20 are provided, and the inner sides of the two water cooling heads 21 are arranged face to face.
[0030] Its working principle is: Setting of the beam absorber: Before the laser imaging system is shut down, the control target temperature T°C (eg 22°C) of the beam absorber 90 is first set through the display module or the PC, and the temperature setting is completed. This is the prior art.
[0031] like Figure 1-3 , the temperature control method includes the first stage and the second stage: The first stage is also the preparation stage, including: S11, place the lens barrel 91 and the beam absorber 90, attach the metal cooling plate 24 to a ridge of the beam absorber 90, and make the probe of the temperature sensor contact the outer surface of the beam absorber 90; S12, the temperature of the metal cooling plate 24 gradually approaches the temperature of the contact beam absorber 90; S13, input the control target temperature T℃ to the water chiller 10, the water chiller 10 continuously inputs cold water of T℃, the cold water continuously enters the water cooling head 21 and then returns to the water chiller 10, and the cycle is repeated so that the temperature of the water cooling head 21 is maintained at T℃.
[0032] In the above step S11 , when there are two refrigeration modules 20 , the two water cooling heads 21 are located on two opposite ridges of the beam absorber 90 .
[0033] The second stage: also the cooling stage, including: When the laser imaging system starts to be shut down, the light beam will be introduced into the beam absorber, and the temperature sensor will start to collect the temperature data of the beam absorber and transmit it to the control module of the control box 30; the control module receives the temperature information and starts to analyze and judge. When the system determines that the collected temperature is inconsistent with the set target temperature T℃ (the collected temperature is generally greater than T℃), the control module starts to cool down; after a cooling cycle, the system determines whether the new collected temperature is consistent with the set target temperature T℃. If "Y", it ends, if "N", it continues to cool down.
[0034] The cooling is specifically as follows: the control box 30 controls the semiconductor refrigeration plate to be powered, the conductor refrigeration plate starts to work, the cold end of the semiconductor refrigeration plate absorbs the heat of the metal cold plate 24, and the temperature of the metal cold plate 24 and the light beam absorber 90 decreases; the hot end of the semiconductor refrigeration plate inputs heat to the water cooling head 21, and the temperature of the water cooling head 21 increases; at the same time, the water cooling machine 10 continuously inputs cold water of T℃, so that the temperature of the water cooling head 21 gradually changes to T℃.
[0035] Features of this application: S1. Start to turn off the laser imaging system, the light beam will be introduced into the beam absorber, and the temperature sensor will start to collect the temperature data of the beam absorber and transmit it to the control module; the control module receives the temperature information and starts to analyze and judge. When the system determines that the collected temperature is inconsistent with the set temperature (greater than or less than the set temperature), the control module starts to calculate feedback and will use the "PID self-tuning + fuzzy control" algorithm to automatically adjust the proportional coefficient, integral coefficient, and differential coefficient. The automatic tuning process will take 1 cycle of oscillation, and then the controller will use the PID value after tuning to perform PID control and verify the result; finally, the PID value is input into the non-volatile memory, and then the fuzzy enhanced PID control is started; the temperature collection value of the beam absorber is quickly made consistent with the set value; in addition, the control module has functions such as short circuit protection, overload protection, temperature abnormality alarm, and temperature over-limit alarm.
[0036] S2, control module, and display module mainly realize the start and stop, alarm, equipment operation, and equipment data display and collection functions of the high-precision optical lens beam absorber rapid temperature control device. A separate temperature control module is set on the control box to realize the separate control and display of the temperature of each temperature control module; the temperature of each module can be uploaded to the PC through the 485 communication interface, and the temperature setting of a single module can also be completed through the PC.
[0037] S3. Based on the external structure of the beam absorber, an L-shaped cooling structure is designed for precise temperature control to achieve dual-core TEC cooling. The TEC can completely fit the outside of the beam absorber, so it can more accurately control the local or overall temperature to avoid excessive temperature gradients or temperature fluctuations. The conformal TEC module takes advantage of its matching shape with the beam absorber to provide a more precise and efficient cooling solution.
[0038] S4. Ensure the accuracy of temperature sampling. Through the PID algorithm, optimize the maximum heating rate, average heating rate, maximum cooling rate, average cooling rate and temperature duration accuracy, etc., to ensure the temperature control accuracy and speed of the beam absorber, so that the temperature control accuracy of the beam absorber reaches ±2°C. The product refrigeration module contains two refrigeration plates, which have the characteristics of compact size, flexible structural design, low power, low cost and high temperature control accuracy. The present invention ensures the working temperature of the beam absorber, thereby ensuring the uniformity and stability of the products produced by the exposure machine and extending the service life of the equipment.
[0039] S5, two TECs form an L-shaped dual-core refrigeration module. At the same time, each TEC contains a metal cold plate and a water-cooled radiator on both sides to form two temperature control modules. The water-cooled head mainly dissipates heat and cools the hot surface of the TEC. The water-cooled head is connected to a chiller and uses constant temperature water to dissipate heat. The metal cold plate and the absorber are connected with a flexible thermal interface material. The metal cold plate and the cold end of the refrigeration plate, and the water-cooled head and the hot end of the refrigeration plate are evenly coated with thermal conductive material to achieve sufficient heat conduction. The PID algorithm can effectively control the output power of the TEC module and realize the heating and cooling function of the absorber.
[0040] S6. The hot surface of the EC module is fixedly connected to the water-cooled head, and thermal conductive material is applied to the contact surface of the two; the cold surface of the TEC module is fixedly connected to the upper surface of the cooling block, and thermal conductive material is applied to the contact surface of the two; the temperature measurement point is set at the edge of the lower surface of the cooling block. The temperature sensor mainly realizes the temperature collection function during operation. The device circuit control system and the device control screen mainly realize the temperature control, start and stop, alarm, device operation and device data display and collection functions of the equipment. The controller integrates 485 communication and can be controlled by the host computer. The water-cooled head in the heat dissipation system is connected to the chiller through the water inlet and outlet. The refrigeration module provides a stable heat dissipation and temperature control process for the chip through PID algorithm control, so that the temperature of the beam absorber is maintained within the set temperature ±2°C range. A device usually contains multiple beam absorber modules, so an independent temperature control system is designed in parallel and integrated in the control box.
[0041] For other contents, please refer to the prior art.
[0042] The above description is only the preferred implementation mode of the present invention. It should be pointed out that for those skilled in the art, several changes and improvements can be made without departing from the overall concept of the present invention, which should also be regarded as the protection scope of the present invention.
Claims
1. A high-precision optical lens beam absorber rapid temperature control device, comprising at least one refrigeration module (20), characterized in that: The refrigeration module (20) comprises an L-shaped water cooling head (21), the cavity inside the water cooling head (21) being a water storage chamber, the water cooling head (21) being provided with a water inlet and outlet (22), both of which are connected to a water cooling machine (10) via a water pipe (11), and an L-shaped metal cold conduction plate (24) being fixed on the inner wall of the water cooling head (21); A semiconductor cooling sheet is provided between the water cooling head (21) and the metal cooling plate (24); the cold end (26) of the semiconductor cooling sheet contacts the metal cooling plate (24), and the hot end of the semiconductor cooling sheet contacts the water cooling head (21); A temperature sensor is provided on the water cooling head (21), and the temperature sensor is connected to the control box (30) via a data line (31). The control box (30) is connected to the temperature sensor and the semiconductor cooling sheet via a power line (32) to supply power to the two.
2. The high-precision optical lens beam absorber rapid temperature control device as claimed in claim 1, characterized in that: A heat insulation layer (25) is provided between the water cooling head (21) and the metal cooling plate (24), and the heat insulation layer (25) may be made of heat preservation cotton or the like.
3. The high-precision optical lens beam absorber rapid temperature control device as claimed in claim 2, characterized in that: The control box (30) is provided with a module power supply and temperature transmission interface (33) connected to a power line (32) and a data line (31), a main power interface (34) connected to an external power source, and a (485) communication interface (35) for communicating with the outside world.
4. The high-precision optical lens beam absorber rapid temperature control device as claimed in claim 3, characterized in that: There are two semiconductor cooling sheets, and one semiconductor cooling sheet is arranged on one side of the water cooling head (21).
5. The high-precision optical lens beam absorber rapid temperature control device as claimed in claim 4, characterized in that: A flexible heat-conducting material is provided on the working surface of the metal cold-conducting plate (24).
6. The high-precision optical lens beam absorber rapid temperature control device as claimed in claim 5, characterized in that: Heat-conducting material is evenly applied between the metal cooling plate (24) and the cold end of the semiconductor cooling sheet, and between the water cooling head (21) and the hot end (26) of the semiconductor cooling sheet.
7. The high-precision optical lens beam absorber rapid temperature control device as claimed in claim 6, characterized in that: Two refrigeration modules (20) are provided, and the inner sides of the two water cooling heads (21) are arranged face to face.
8. A temperature control method, characterized in that: The high-precision optical lens beam absorber rapid temperature control device as claimed in claim 1 comprises a first stage and a second stage: The first stage is also the preparation stage, including: S11, placing the beam absorber (90), attaching the metal cooling plate (24) to a ridge of the beam absorber (90), so that the probe of the temperature sensor contacts the outer surface of the beam absorber (90); S12, the temperature of the metal cooling plate (24) gradually approaches the temperature of the contact light beam absorber (90); S13, inputting the control target temperature T°C into the water chiller (10), the water chiller (10) continuously inputting cold water at T°C, the cold water continuously entering the water cooling head (21) and then returning to the water chiller (10), and the cycle is repeated, so that the temperature of the water cooling head (21) is maintained at T°C; The second stage: also the cooling stage, including: When the laser imaging system starts to be shut down, the light beam is introduced into the light beam absorber, and the temperature sensor starts to collect temperature data of the light beam absorber and transmits it to the control module of the control box (30); the control module receives the temperature information and starts to analyze and judge, and when the system determines that the collected temperature is inconsistent with the set target temperature T°C, the control module starts to cool down; after a cooling cycle, the system determines whether the new collected temperature is consistent with the set target temperature T°C, and if "Y", the process ends, and if "N", the process continues to cool down; The cooling is specifically as follows: the control box (30) controls the semiconductor cooling plate to be powered, the conductor cooling plate starts to work, the cold end of the semiconductor cooling plate absorbs the heat of the metal cooling plate (24), and the temperature of the metal cooling plate (24) and the light beam absorber (90) decreases; the hot end of the semiconductor cooling plate inputs heat to the water cooling head (21), and the temperature of the water cooling head (21) increases; at the same time, the water cooling machine (10) continuously inputs cold water at T°C, so that the temperature of the water cooling head (21) gradually changes to T°C.
9. The temperature control method according to claim 9, characterized in that: In the above step S11, when there are two refrigeration modules (20), the two water cooling heads (21) are located on two opposite ridges of the beam absorber (90).