Cooling fan module

Abstract

The invention provides a cooling fan module which is used for an electronic device. The electronic device comprises a circuit board, and a plurality of electronic components are configured on the circuit board. The cooling fan module comprises a supporting plate body, a heat conduction plate body, a fan and a heat conduction wall body. The supporting plate body is arranged on the circuit board. The heat conduction plate body is arranged above the supporting plate body. The fan is arranged between the supporting plate body and the heat conduction plate body. The heat conduction wall body surrounds part of the fan, and a flow channel area is defined between the heat conduction wall body and the fan. Part of the circuit board penetrates through the heat conduction wall body and extends into the flow channel area, so that part of the electronic component is located in the flow channel area. According to the structural design of the cooling fan module provided by the invention, the space in the system can be fully utilized.

Description

Technical Field

[0001] The invention relates to a heat dissipation fan module, and in particular to a heat dissipation fan module for an electronic device. Background Art

[0002] As electronic devices become thinner and lighter and their performance continues to improve, the requirements for heat dissipation efficiency of electronic devices are also getting higher and higher. Taking laptops as an example, the heat dissipation structure of laptops currently on the market mainly sets heat pipes around the heat generating components, and conducts heat to the cooling fan through the heat pipe or the heat dissipation module structure of the temperature plate, and then takes the heat out of the laptop through the cold air flow of the fan.

[0003] However, in order to meet the needs of various fields, the space for the cooling fan on the circuit board must be divided during the early design of the notebook computer. However, because there is space required for the circuit wiring and electronic components on the circuit board, the size of the cooling fan is limited and cannot be increased, which greatly reduces the cooling efficiency of the notebook computer.

[0004] Therefore, how to solve the above problems has become the focus of relevant personnel in this field. Summary of the invention

[0005] One aspect of the present invention is to provide a heat dissipation fan module to solve the problems in the prior art.

[0006] The present invention relates to a heat dissipation fan module for an electronic device. The electronic device includes a circuit board, and a plurality of electronic components are arranged on the circuit board. The heat dissipation fan module includes a support plate, a heat conduction plate, a fan and a heat conduction wall. The support plate is arranged on the circuit board. The heat conduction plate is arranged above the support plate. The fan is arranged between the support plate and the heat conduction plate. The heat conduction wall surrounds part of the fan and defines a flow channel area between the fan, and part of the circuit board passes through the heat conduction wall and extends into the flow channel area, so that part of the electronic components are located in the flow channel area.

[0007] According to one or more embodiments of the present invention, the above-mentioned heat conduction wall includes a top surface, a bottom surface and a recessed portion, the top surface and the bottom surface are opposite to each other, the recessed portion is recessed from the bottom surface toward the top surface, the heat conduction plate covers the fan and contacts the top surface of the heat conduction wall, and a portion of the circuit board passes through the recessed portion of the heat conduction wall and extends into the flow channel area.

[0008] According to one or more embodiments of the present invention, the above-mentioned heat conduction wall includes a first section, a second section and a connecting section, the first section and the second section are opposite to each other, the connecting section is connected between the first section and the second section, and an air outlet connected to the flow channel area is defined between the first section and the second section.

[0009] According to one or more embodiments of the present invention, the first section of the heat conducting wall is located between the heat conducting plate and the supporting plate, and the second section and the connecting section are located between the heat conducting plate and the circuit board.

[0010] According to one or more embodiments of the present invention, the heat dissipation fan module further comprises a heat dissipation fin assembly. The heat dissipation fin assembly is disposed outside the air outlet, and the working fluid generated by the fan flows through the flow channel area and the air outlet to the heat dissipation fin assembly.

[0011] According to one or more embodiments of the present invention, the fan is an open centrifugal fan. The open centrifugal fan includes at least one axial air inlet and a plurality of radial air outlets, wherein the axial air inlet is used to introduce working fluid from the outside, and the working fluid flows to the flow channel area along different directions through the radial air outlets.

[0012] According to one or more embodiments of the present invention, the heat conduction plate has an opening, and the axial air inlet of the open centrifugal fan corresponds to the opening of the heat conduction plate.

[0013] According to one or more embodiments of the present invention, the cooling fan module further comprises a first locking member and a second locking member. The first locking member is disposed through the support plate and the circuit board so that the support plate is fixed on the circuit board, and the second locking member is disposed through the heat-conducting wall and the support plate so that the heat-conducting wall is fixed on the support plate.

[0014] According to one or more embodiments of the present invention, some of the electronic components located in the flow channel area are high-power and high-heat electronic components.

[0015] According to one or more embodiments of the present invention, the heat conducting plate is a vapor chamber, a graphite sheet or a high-conductivity metal.

[0016] In summary, the structural design of the cooling fan module of the embodiment of the present invention can fully utilize the space in the system, that is, the structural design of the cooling fan module is combined with the circuit board of the electronic device, and the planning of the cooling system is freer under the same system space conditions. Furthermore, the cooling fan module of the embodiment of the present invention can increase the area of ​​the flow channel region according to the actual needs. When the area of ​​the flow channel region is increased, in addition to forcibly cooling more high-power and high-heat electronic components, the number of cooling fins in the cooling fin group can be further increased, the area covered by the heat conduction plate body can be increased, and the size of the fan can be increased, thereby greatly improving the overall cooling efficiency. In addition, since the cooling fan module of this embodiment directly uses the circuit board of the electronic device as the lower cover, the overall thickness of the cooling fan module is reduced, thereby making the entire cooling system thinner and lighter. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The drawings illustrate one or more embodiments of the present disclosure and are used together with the written description to explain the principles of the present disclosure. In all drawings, the same figure numerals are used as much as possible to refer to similar or identical components of the embodiments, wherein:

[0018] Figure 1 The figure is a schematic three-dimensional structural diagram of a heat dissipation fan module according to an embodiment of the present invention.

[0019] Figure 2 for Figure 1 The shown schematic top view of the heat dissipation fan module with some components omitted.

[0020] Figure 3 For along Figure 1 A schematic cross-sectional view of the AA line segment is shown.

[0021] Figure 4 for Figure 1 A schematic diagram of the three-dimensional structure of the heat conduction wall of the heat dissipation fan module is shown.

[0022] Figure 5 for Figures 1 to 3 The figure shows a schematic diagram of the configuration of the cooling fan module in the cooling system.

[0023] Component number description

[0024] 1 Cooling fan module

[0025] 2 Electronic devices

[0026] 3 Cooling fan module

[0027] 11 Support plate

[0028] 12 Heat conduction plate

[0029] 13 Fan

[0030] 14 Heat conduction wall

[0031] 15 Cooling fins

[0032] 16 First locking piece

[0033] 17 Second locking piece

[0034] 100 Cooling System

[0035] 120 Opening

[0036] 131 Axial air inlet

[0037] 132 Radial air outlet

[0038] 140 Air outlet

[0039] 141 Top

[0040] 142 Bottom

[0041] 143 recess

[0042] 20 Circuit Board

[0043] 200 Electronic components

[0044] H1 First Heat Source

[0045] H2 Second heat source

[0046] R Runner area

[0047] S1 first segment

[0048] S2 Second Segment

[0049] S3 connection segment DETAILED DESCRIPTION

[0050] The following will disclose multiple embodiments of the present invention through drawings. For the purpose of clear description, many practical details will be described together in the following description. However, those skilled in the art should understand that in some embodiments of the present invention, these practical details are not necessary and therefore do not limit the present invention. In addition, in order to simplify the drawings, some conventional structures and components will be depicted in a simple schematic manner in the drawings. In addition, for the convenience of readers, the sizes of the components in the drawings are not drawn according to the actual scale.

[0051] See also Figures 1 to 4 , Figure 1 The figure is a schematic three-dimensional structural diagram of a heat dissipation fan module according to an embodiment of the present invention. Figure 2 for Figure 1 The shown schematic top view of the heat dissipation fan module with some components omitted. Figure 3 For along Figure 1 A schematic cross-sectional view of the AA line segment is shown. Figure 4 for Figure 1 The three-dimensional structure diagram of the heat conduction wall of the cooling fan module is shown in FIG. It should be noted that in order to clearly see the internal structure, Figure 2 Omitted Figure 1 and Figure 3 The heat conduction plate body 12 is a component.

[0052] like Figures 1 to 3As shown, the cooling fan module 1 of this embodiment is used for an electronic device 2. The electronic device 2 includes a circuit board 20, and a plurality of electronic components 200 are disposed on the circuit board 20. In this embodiment, the electronic device 2 is, for example, a portable electronic device such as a notebook computer or a palmtop computer, but the present invention is not limited thereto.

[0053] like Figures 1 to 4 As shown, the heat dissipation fan module 1 of the present embodiment includes a support plate 11, a heat conduction plate 12, a fan 13 and a heat conduction wall 14. The support plate 11 is disposed on the circuit board 20 of the electronic device 2. The heat conduction plate 12 is disposed above the support plate 11. The fan 13 is disposed between the support plate 11 and the heat conduction plate 12. The support plate 11 is used to carry the fan 13, and the fan 13 and the support plate 11 are fixed to each other. The heat conduction wall 14 surrounds part of the fan 13, and a flow channel area R is defined between the heat conduction wall 14 and the fan 13. In the present embodiment, part of the circuit board 20 of the electronic device 2 passes through the heat conduction wall 14 and extends into the flow channel area R, so that part of the electronic components 200 disposed on the circuit board 20 are located in the flow channel area R of the heat dissipation fan module 1.

[0054] In this embodiment, the heat conduction plate 12 covers the fan 13 and directly contacts the heat conduction wall 14, and some of the electronic components 200 located in the flow channel area R of the heat dissipation fan module 1 are, for example, high-power high-heat electronic components. Specifically, the flow channel area R is located between the heat conduction plate 12, the fan 13 and the heat conduction wall 14, and the working fluid generated by the fan 13 flows in the flow channel area R and directly takes away the heat generated by these high-power high-heat electronic components located in the flow channel area R. The heat taken away by the working fluid can be absorbed by the heat conduction wall 14 and the heat conduction plate 12 and conducted to the outside of the electronic device 2.

[0055] In this embodiment, the heat conducting plate 12 is a component such as a vapor chamber, a graphite sheet or a high-conductivity metal that can absorb and conduct the heat generated by high-power high-heat electronic components, but the present invention is not limited thereto. It should be particularly noted that the present invention does not limit the appearance shape and size of the heat conducting plate 12. The heat conducting plate 12 can have different appearance shapes and sizes in accordance with the range size and appearance shape of the flow channel area R defined between the heat conducting wall 14 and the fan 13.

[0056] In the present embodiment, the heat conducting wall 14 is, for example, a high-conductivity metal or the like that can absorb and conduct the heat generated by the high-power high-heat electronic component, but the present invention is not limited thereto.

[0057] The following further describes other detailed structures of the heat dissipation fan module 1 of this embodiment.

[0058] like Figures 1 to 4 As shown, the heat conducting wall 14 of this embodiment includes a top surface 141, a bottom surface 142 and a recess 143. The top surface 141 and the bottom surface 142 of the heat conducting wall 14 are opposite to each other, and the recess 143 is recessed from the bottom surface 142 toward the top surface 141. In this embodiment, the heat conducting plate 12 covers the fan 13 and contacts the top surface 141 of the heat conducting wall 14, and a portion of the circuit board 20 of the electronic device 2 passes through the recess 143 of the heat conducting wall 14 and extends into the flow channel region R, so that the high-power high-heat electronic components arranged on the circuit board 20 are located in the flow channel region R at the same time.

[0059] As can be seen from the above, in this embodiment, the circuit board 20 of the electronic device 2 is inserted into the space defined by the heat conducting plate 12, the fan 13 and the heat conducting wall 14 (i.e., the flow channel region R) and directly serves as the lower cover of the heat dissipation fan module 1. At the same time, high-power and high-heat electronic components are planned and arranged on the part of the circuit board 20 inserted into the flow channel region R, so that these high-power and high-heat electronic components can be forced to dissipate heat in the flow channel region R, thereby greatly improving the heat dissipation efficiency.

[0060] like Figures 1 to 4 As shown, the heat conducting wall 14 of this embodiment includes a first section S1, a second section S2 and a connecting section S3. The first section S1 and the second section S2 of the heat conducting wall 14 are opposite to each other, and the connecting section S3 is connected between the first section S1 and the second section S2. In this embodiment, an air outlet 140 connected to the flow channel region R is defined between the first section S1 and the second section S2 of the heat conducting wall 14, and the working fluid generated by the fan 13 flows out through the air outlet 140 after passing through the flow channel region R.

[0061] In this embodiment, the first section S1 of the heat-conducting wall 14 is located between the heat-conducting plate 12 and the supporting plate 11, and the second section S2 and the connecting section S3 of the heat-conducting wall 14 are located between the heat-conducting plate 12 and the circuit board 20 of the electronic device 2. That is, under the structural design of the heat dissipation fan module 1 of this embodiment, high-power high-heat electronic components can be planned in the flow channel area R between the second section S2 of the heat-conducting wall 14 and the fan 13 and in the flow channel area R between the connecting section S3 and the fan 13, so that these high-power high-heat electronic components can be forced to dissipate heat in the flow channel area R.

[0062] It is worth mentioning that if forced heat dissipation is required for more high-power high-heat electronic components on the circuit board 20, the second section S2 and the connecting section S3 of the heat-conducting wall 14 can be further extended, thereby increasing the area of ​​the flow channel region R between the second section S2 of the heat-conducting wall 14 and the fan 13 and increasing the area of ​​the flow channel region R between the connecting section S3 and the fan 13. When the area of ​​the flow channel region R is increased, the area of ​​the circuit board 20 located in the flow channel region R is also increased. In this way, more high-power high-heat electronic components can be planned to be configured on the circuit board 20 located in the flow channel region R, thereby increasing the number of high-power high-heat electronic components that can be forced to dissipate heat.

[0063] In addition, after the second section S2 and the connecting section S3 of the heat-conducting wall 14 are extended, the space surrounded by the heat-conducting wall 14 becomes larger. In this case, the size of the original fan 13 can be increased, that is, the size of the fan 13 can be increased under the premise that the area of ​​the flow channel region R remains unchanged. The large-sized fan 13 generates a large amount of working fluid to improve the heat dissipation efficiency.

[0064] like Figures 1 to 4 As shown, the heat dissipation fan module 1 of this embodiment further includes a heat dissipation fin group 15. The heat dissipation fin group 15 is disposed outside the air outlet 140 defined between the first section S1 and the second section S2 of the heat conduction wall 14. The working fluid generated by the fan 13 flows out through the air outlet 140 after passing through the flow channel area R and directly blows toward the heat dissipation fin group 15 for heat exchange. After the heat generated by these high-power high-heat electronic components located in the flow channel area R is taken away by the working fluid, the heat is further absorbed by the heat conduction wall 14, the heat conduction plate 12 and the heat dissipation fin group 15 in sequence and conducted to the outside of the electronic device 2.

[0065] It is worth mentioning that, since the area of ​​the flow channel region R defined between the heat conduction wall 14 and the fan 13 of the present embodiment can be increased or decreased according to the actual needs, when the area of ​​the flow channel region R is increased, in addition to being able to force heat dissipation for more high-power high-heat electronic components, the width of the heat dissipation fin group 15 can be further increased, that is, the number of heat dissipation fins in the heat dissipation fin group 15 can be increased, so that the heat dissipation efficiency can be further greatly improved. Specifically, when the area of ​​the flow channel region R increases, the width of the air outlet 140 of the heat conduction wall 14 will also increase at the same time. When the width of the air outlet 140 increases, more heat dissipation fins can be configured on the outside of the air outlet 140, thereby increasing the width of the heat dissipation fin group 15.

[0066] like Figures 1 to 4As shown, the heat dissipation fan module 1 of this embodiment further includes a first fastener 16 and a second fastener 17. The first fastener 16 is disposed through the support plate 11 and the circuit board 20, so that the support plate 11 is fixed on the circuit board 20. The second fastener 17 is disposed through the heat conduction wall 14 and the support plate 11, so that the heat conduction wall 14 is fixed on the support plate 11. In this embodiment, the first fastener 16 and the second fastener 17 are, for example, screws, and the support plate 11, the heat conduction wall 14 and the circuit board 20 respectively have screw holes that match the first fastener 16 and the second fastener 17.

[0067] like Figures 1 to 4 As shown, the fan 13 of this embodiment is an open centrifugal fan. The open centrifugal fan includes at least one axial air inlet 131 and a plurality of radial air outlets 132. The open centrifugal fan introduces cold air from the outside through the axial air inlet 131, and then blows the cold air radially along different air outlet directions to the high-power high-heat electronic components, the heat conduction plate 12 and the heat conduction wall 14 on the circuit board 20 through the radial air outlets 132, thereby forming a continuously flowing working fluid in the flow channel area R. The working fluid directly takes away the heat generated by the high-power high-heat electronic components in the flow channel area R, and the working fluid can also accelerate the heat conduction plate 12 and the heat conduction wall 14 to evenly disperse the absorbed heat to various places.

[0068] like Figures 1 to 4 As shown, the heat conduction plate 12 of this embodiment has an opening 120. When the heat conduction plate 12 covers the open centrifugal fan and contacts the top surface 141 of the heat conduction wall 14, the axial air inlet 131 of the open centrifugal fan will correspond to the opening 120 of the heat conduction plate 12, so that the axial air inlet 131 of the open centrifugal fan can smoothly introduce cold air from the outside.

[0069] See also Figure 5 , which is Figures 1 to 3 The schematic diagram of the configuration of the cooling fan module in the cooling system is shown in FIG. Figure 5 As shown, the heat dissipation system 100 of this embodiment is used for an electronic device 2. The electronic device 2 includes a circuit board 20, and the circuit board 20 is configured with a first heat source H1, a second heat source H2, and a plurality of electronic components 200. In this embodiment, the electronic device 2 is, for example, a portable electronic device such as a notebook computer or a palmtop computer, but the present invention is not limited thereto.

[0070] like Figure 5 As shown, the heat dissipation system 100 of this embodiment includes a cooling fan module 3 and two Figures 1 to 3The cooling fan module 3 is disposed on the circuit board 20 and located between the first heat source H1 and the second heat source H2 , and the cooling fan modules 1 are located at opposite sides of the cooling fan module 3 .

[0071] like Figure 5 As shown, the heat conduction plate 12 covers the cooling fan module 3 and the heat dissipation fan modules 1 at the same time, and the heat conduction plate 12 is in thermal contact with the first heat source H1 and the second heat source H2, that is, the cooling fan module 3 and the heat dissipation fan modules 1 share the same heat conduction plate 12. The working fluid generated by the cooling fan module 3 conducts the heat of the first heat source H1 and the second heat source H2 to other positions of the heat conduction plate 12 in a radial manner along a direction away from the cooling fan module 3, that is, the cooling fan module 3 disperses the heat generated by the first heat source H1 and the second heat source H2, and allows the heat to be more evenly distributed on the heat conduction plate 12. In this embodiment, the first heat source H1 is, for example, a central processing unit (CPU), and the second heat source H2 is, for example, a graphics processing unit (GPU), but the present invention is not limited thereto.

[0072] like Figure 5 As shown, the first heat source H1 is located between the cooling fan module 3 and one of the heat dissipation fan modules 1, and the second heat source H2 is located between the cooling fan module 3 and another of the heat dissipation fan modules 1. In addition to forcibly dissipating the high-power and high-heat electronic components configured on the circuit board 20, these heat dissipation fan modules 1 in the heat dissipation system 100 can also dissipate the first heat source H1 and the second heat source H2 at the same time, thereby greatly improving the heat dissipation efficiency.

[0073] In summary, the structural design of the cooling fan module of the embodiment of the present invention can fully utilize the space in the system, that is, the structural design of the cooling fan module is combined with the circuit board of the electronic device, and the planning of the cooling system is freer under the same system space conditions. Furthermore, the cooling fan module of the embodiment of the present invention can increase the area of ​​the flow channel region according to the actual needs. When the area of ​​the flow channel region is increased, in addition to forcibly cooling more high-power and high-heat electronic components, the number of cooling fins in the cooling fin group can be further increased, the area covered by the heat conduction plate body can be increased, and the size of the fan can be increased, thereby greatly improving the overall cooling efficiency. In addition, since the cooling fan module of this embodiment directly uses the circuit board of the electronic device as the lower cover, the overall thickness of the cooling fan module is reduced, thereby making the entire cooling system thinner and lighter.

[0074] The embodiments selected and described are intended to explain the content of the present disclosure and their practical applications so as to inspire other persons skilled in the art to utilize the present disclosure and various embodiments, and to make various modifications to meet the specific intended use. Alternative embodiments will be apparent to those skilled in the art without departing from the spirit and scope of the present disclosure. Therefore, the scope of the present disclosure is determined according to the scope of the attached invention claims, rather than being limited by the foregoing specification and the exemplary embodiments described therein.

Claims

1. A cooling fan module, characterized in that: Used in an electronic device, the electronic device includes a circuit board, a plurality of electronic components are arranged on the circuit board, and the cooling fan module includes: A supporting plate body, configured on the circuit board; A heat conducting plate body, disposed above the supporting plate body; a fan, disposed between the support plate and the heat conduction plate; and A heat-conducting wall surrounds part of the fan and defines a flow channel area between the fan, and part of the circuit board passes through the heat-conducting wall and extends into the flow channel area, so that part of the electronic components are located in the flow channel area.

2. The heat dissipation fan module according to claim 1, characterized in that: The heat-conducting wall body includes a top surface, a bottom surface and a recessed portion, wherein the top surface and the bottom surface are opposite to each other, and the recessed portion is recessed from the bottom surface toward the top surface. The heat-conducting plate body covers the fan and contacts the top surface of the heat-conducting wall body, and a portion of the circuit board passes through the recessed portion of the heat-conducting wall body and extends into the flow channel area.

3. The heat dissipation fan module according to claim 1, characterized in that: The heat conduction wall includes a first section, a second section and a connecting section. The first section and the second section are opposite to each other. The connecting section is connected between the first section and the second section. An air outlet connected to the flow channel area is defined between the first section and the second section.

4. The heat dissipation fan module according to claim 3, characterized in that: The first section of the heat-conducting wall is located between the heat-conducting plate and the supporting plate, and the second section and the connecting section are located between the heat-conducting plate and the circuit board.

5. The heat dissipation fan module according to claim 3, characterized in that: It also includes a heat sink fin group, which is arranged on the outer side of the air outlet. A working fluid generated by the fan flows through the flow channel area and the air outlet to the heat sink fin group.

6. The heat dissipation fan module according to claim 1, characterized in that: The fan is an open centrifugal fan, which includes at least one axial air inlet and multiple radial air outlets. The at least one axial air inlet is used to introduce a working fluid from the outside, and the working fluid flows to the flow channel area along different directions through the multiple radial air outlets.

7. The heat dissipation fan module according to claim 6, characterized in that: The heat conduction plate has an opening, and the at least one axial air inlet of the open centrifugal fan corresponds to the opening of the heat conduction plate.

8. The heat dissipation fan module according to claim 1, characterized in that: It also includes a first locking piece and a second locking piece. The first locking piece is inserted through the support plate body and the circuit board so that the support plate body is fixed on the circuit board. The second locking piece is inserted through the heat conduction wall body and the support plate body so that the heat conduction wall body is fixed on the support plate body.

9. The heat dissipation fan module according to claim 1, characterized in that: Some of the electronic components located in the flow channel area are high-power and high-heat electronic components.

10. The heat dissipation fan module according to claim 1, characterized in that: The heat conduction plate is a heat spreader, a graphite sheet or a high-conductivity metal.

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