Multilayer electronic component

Abstract

The present disclosure provides a multilayer electronic component, which may include: a body including dielectric layers and internal electrodes, the body having opposing first and second surfaces and opposing third and fourth surfaces; a first external electrode including a first connection portion on the third surface and a first tape portion extending from the first connection portion to the first surface; a second external electrode including a second connection portion on the fourth surface and a second tape portion extending from the second connection portion to the first surface; and an insulating layer disposed on the first surface to extend onto the first tape portion and the second tape portion. The first external electrode and the second external electrode may include an electrode layer and a plating layer on the electrode layer, and the insulating layer may be in contact with the electrode layer in the first tape portion and the second tape portion and may cover an end portion of the electrode layer.

Description

[0001] This application claims the benefit of priority from Korean Patent Application No. 10-2023-0159448 filed in the Korean Intellectual Property Office on November 16, 2023, the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0002] The present disclosure relates to a multi-layer electronic assembly. Background Art

[0003] A multilayer ceramic capacitor (MLCC, a type of multilayer electronic component) may be a chip capacitor mounted on a printed circuit board of any of various electronic products such as an image device (including a liquid crystal display (LCD) or a plasma display panel (PDP)), a computer, a smart phone, or a mobile phone to be charged or discharged therefrom.

[0004] Such a multilayer ceramic capacitor has a small size, achieves high capacitance, and is easily mounted on a circuit board, and thus can be used as a component of various electronic devices. As various electronic devices (such as computers and mobile devices) have smaller sizes and higher outputs, there is an increasing demand for multilayer ceramic capacitors having smaller sizes and higher capacitance.

[0005] Furthermore, with the recent increase in interest in automotive electronic components, multilayer ceramic capacitors used as automotive electronic components require high levels of electrical reliability and impact resistance.

[0006] In particular, it is required to develop a multilayer ceramic capacitor having strong durability against deformation of a substrate on which the multilayer ceramic capacitor is mounted and having excellent bending strength characteristics. Summary of the invention

[0007] An aspect of the present disclosure is to provide a multilayer electronic component having improved reliability.

[0008] An aspect of the present disclosure is to provide a multilayer electronic component having improved bending strength characteristics.

[0009] An aspect of the present disclosure is to provide a multilayer electronic component having excellent bonding force between an external electrode and a body.

[0010] However, the purpose of the present disclosure is not limited to the above contents and may be more easily understood in the process of explaining specific embodiments of the present disclosure.

[0011] According to one aspect of the present disclosure, a multilayer electronic component may include: a body including a dielectric layer and a first inner electrode and a second inner electrode, the first inner electrode and the second inner electrode are alternately arranged and the dielectric layer is interposed between the first inner electrode and the second inner electrode, the body having a first surface and a second surface opposite to each other in a first direction, a third surface and a fourth surface connected to the first surface and the second surface and opposite to each other in a second direction, and a fifth surface and a sixth surface connected to the first surface, the second surface, the third surface and the fourth surface and opposite to each other in a third direction; a first external electrode including a first connection portion arranged on the third surface and a first band portion extending from the first connection portion to a portion of the first surface; a second external electrode including a second connection portion arranged on the fourth surface and a second band portion extending from the second connection portion to a portion of the first surface; and an insulating layer arranged on the first surface to extend onto the first band portion and the second band portion. The first external electrode and the second external electrode may include an electrode layer and a plating layer arranged on the electrode layer, and the insulating layer may be arranged to contact the electrode layer in the first band portion and the second band portion, and may be arranged to cover the end of the electrode layer.

[0012] According to another aspect of the present disclosure, a multilayer electronic component may include: a body including a dielectric layer and a first inner electrode and a second inner electrode, the first inner electrode and the second inner electrode being alternately arranged and the dielectric layer being interposed between the first inner electrode and the second inner electrode, the body having a first surface and a second surface opposite to each other in a first direction, a third surface and a fourth surface connected to the first surface and the second surface and opposite to each other in a second direction, and a fifth surface and a sixth surface connected to the first surface, the second surface, the third surface and the fourth surface and opposite to each other in a third direction; a first outer electrode including a first connection portion arranged on the third surface and a first band portion extending from the first connection portion to a portion of the first surface; a second outer electrode including a second connection portion arranged on the fourth surface and a second band portion extending from the second connection portion to a portion of the first surface; and an insulating layer arranged on the first surface to extend onto the first band portion and the second band portion to partially cover the first band portion and the second band portion. The first outer electrode may include a plating layer extending in a partial region of the first band portion, and the second outer electrode may include a plating layer extending in a partial region of the second band portion. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] The above and other aspects, features and advantages of the present disclosure will be more clearly understood through the following detailed description in conjunction with the accompanying drawings, in which:

[0014] Figure 1 A perspective view of a multilayer electronic assembly according to an embodiment of the present disclosure is schematically shown.

[0015] Figure 2 Schematically shows Figure 1 A perspective view of a multi-layer electronic component when viewed from another direction.

[0016] Figure 3 It is along Figure 1 A cross-sectional view taken along line II'.

[0017] Figure 4 It is along Figure 1 A cross-sectional view taken along line II-II'.

[0018] Figure 5 is a schematic diagram showing the disassembled Figure 2 An exploded perspective view of the subject.

[0019] Figure 6 yes Figure 3 Magnified view of area K1. DETAILED DESCRIPTION

[0020] Hereinafter, embodiments of the present disclosure will be described with reference to the accompanying drawings. However, the present disclosure may be illustrated in many different forms and should not be construed as being limited to the specific embodiments set forth herein. More specifically, these embodiments are provided so that the present disclosure will be comprehensive and complete, and will fully convey the scope of the present disclosure to those skilled in the art. Therefore, for clarity of description, the shapes and sizes of the elements in the accompanying drawings may be exaggerated, and the elements indicated by the same reference numerals in the accompanying drawings are the same elements.

[0021] In the accompanying drawings, irrelevant elements will be omitted to clearly describe the present disclosure, and the thickness may be exaggerated to clearly represent multiple layers and multiple regions. The same elements with the same functions within the scope of the same concept will be described using the same reference numerals. Throughout the specification, unless otherwise specifically stated, when an element is referred to as "including" or "comprising" another element, it means that the element may also include other elements without excluding other elements.

[0022] In the drawings, the first direction may refer to a stacking direction or a thickness direction (T direction), the second direction may refer to a length direction (L direction), and the third direction may refer to a width direction (W direction).

[0023] Figure 1 A perspective view of a multilayer electronic assembly according to an embodiment of the present disclosure is schematically shown.

[0024] Figure 2 Schematically shows Figure 1A perspective view of a multi-layer electronic component when viewed from another direction.

[0025] Figure 3 It is along Figure 1 A cross-sectional view taken along line II'.

[0026] Figure 4 It is along Figure 1 A cross-sectional view taken along line II-II'.

[0027] Figure 5 is a schematic diagram showing the disassembled Figure 2 An exploded perspective view of the subject.

[0028] Figure 6 yes Figure 3 Magnified view of area K1.

[0029] In the following, reference will be made to Figures 1 to 6 A multilayer electronic assembly 100 according to an embodiment in the present disclosure is described.

[0030] According to one aspect of the present disclosure, a multilayer electronic component 100 may include: a body 110 including a dielectric layer 111 and a first internal electrode 121 and a second internal electrode 122, the first internal electrode 121 and the second internal electrode 122 being alternately arranged with the dielectric layer 111 interposed therebetween, the body 110 having a first surface 1 and a second surface 2 opposite to each other in a first direction, a third surface 3 and a fourth surface 4 connected to the first surface 1 and the second surface 2 and opposite to each other in the second direction, and a fifth surface 5 and a sixth surface 6 connected to the first surface 1, the second surface 2, the third surface 3 and the fourth surface 4 and opposite to each other in a third direction; a first external electrode 131 including a first connection portion arranged on the third surface 3 and a first band portion B1 extending from the first connection portion to a portion of the first surface 1; a second external electrode 132 including a second connection portion arranged on the fourth surface 4 and a second band portion B2 extending from the second connection portion to a portion of the first surface 1; and an insulating layer 140 arranged on the first surface 1 and arranged to extend to the first band portion B1 and the second band portion B2. The first and second external electrodes may include electrode layers 131a and 132a and plated layers 131b and 132b disposed on the electrode layers 131a and 132a, and the insulating layer 140 may be disposed in contact with the electrode layers 131a and 132a in the first and second band portions B1 and B2 and disposed to cover ends of the electrode layers 131a and 132a.

[0031] The body 110 has dielectric layers 111 and internal electrodes 121 and 122 alternately stacked therein.

[0032] The body 110 is not limited to a specific shape and may be Figure 1The main body 110 may have a hexahedral shape or a shape similar to a hexahedral shape. Since the ceramic powder particles included in the main body 110 shrink in the process of sintering the main body, the main body 110 may not have a hexahedral shape with perfect straight lines. However, the main body 110 may have a substantially hexahedral shape.

[0033] The body 110 may have a first surface 1 and a second surface 2 opposite to each other in a first direction, a third surface 3 and a fourth surface 4 connected to the first surface 1 and the second surface 2 and opposite to each other in the second direction, and a fifth surface 5 and a sixth surface 6 connected to the first surface 1 and the second surface 2, connected to the third surface 3 and the fourth surface 4 and opposite to each other in a third direction.

[0034] In an embodiment, the main body 110 may include a 1-3 corner connecting the first surface 1 and the third surface 3, a 1-4 corner connecting the first surface 1 and the fourth surface 4, a 2-3 corner connecting the second surface 2 and the third surface 3, and a 2-4 corner connecting the second surface 2 and the fourth surface 4, the 1-3 corner and the 2-3 corner may have a form of contraction toward the center of the main body 110 in the first direction based on the third surface 3, and the 1-4 corner and the 2-4 corner may have a form of contraction toward the center of the main body 110 in the first direction based on the fourth surface 4.

[0035] Since the edge regions of the dielectric layer 111 where the internal electrodes 121 and 122 are not provided overlap in the first direction, a step may be formed by the thickness of the internal electrodes 121 and 122, so that when viewed relative to the first surface 1 or the second surface 2, a corner connecting the first surface 1 with the third surface 3 to the sixth surface 6 and / or a corner connecting the second surface 2 with the third surface 3 to the sixth surface 6 may have a shape that shrinks toward the center of the body 110 in the first direction. Alternatively, by a shrinkage behavior during the sintering process of the body, when viewed relative to the first surface 1 or the second surface 2, a corner connecting the first surface 1 with the third surface 3, the fourth surface 4, the fifth surface 5, and the sixth surface 6 and / or a corner connecting the second surface 2 with the third surface 3, the fourth surface 4, the fifth surface 5, and the sixth surface 6 may have a shape that shrinks toward the center of the body 110 in the first direction. Optionally, since the edges connecting the various surfaces of the main body 110 to each other are rounded by performing an additional process to prevent chipping defects, etc., the corners connecting the first surface 1 and the third surface 3 to the sixth surface 6 and / or the corners connecting the second surface 2 and the third surface 3 to the sixth surface 6 may have a rounded shape.

[0036] The corners may include a 1-3 corner connecting the first surface 1 and the third surface 3, a 1-4 corner connecting the first surface 1 and the fourth surface 4, a 2-3 corner connecting the second surface 2 and the third surface 3, and a 2-4 corner connecting the second surface 2 and the fourth surface 4. In addition, the corners may include a 1-5 corner connecting the first surface 1 and the fifth surface 5, a 1-6 corner connecting the first surface 1 and the sixth surface 6, a 2-5 corner connecting the second surface 2 and the fifth surface 5, and a 2-6 corner connecting the second surface 2 and the sixth surface 6. The first surface 1 to the sixth surface 6 of the body 110 may be an overall flat surface, and the non-flat area may be a corner. Hereinafter, the extension line of each surface may refer to a line extending based on the flat portion of each surface.

[0037] In addition, in order to suppress the steps formed by the internal electrodes 121 and 122, the edge portions 114 and 115 can be formed in the following manner so that the portion connecting the first surface 1 to the fifth surface 5 and the sixth surface 6 and the portion connecting the second surface 2 to the fifth surface 5 and the sixth surface 6 may not have a contracted form: after stacking the ceramic green sheets to form a stack including the capacitor forming portion Ac, the stack is cut to expose the internal electrodes to the two side surfaces of the capacitor forming portion Ac in the third direction (width direction), and then a single dielectric layer or two or more dielectric layers are stacked on the two side surfaces of the capacitor forming portion Ac in the third direction (width direction) to form edge portions 114 and 115, thereby forming the fifth surface 5 and the sixth surface.

[0038] The plurality of dielectric layers 111 forming the body 110 may be in a sintered state, and adjacent dielectric layers 111 may be integrated with each other such that it is difficult to identify a boundary therebetween without using a scanning electron microscope (SEM).

[0039] According to an embodiment of the present disclosure, the raw material used to form the dielectric layer 111 is not particularly limited as long as sufficient electrostatic capacitance can be obtained. For example, the raw material used to form the dielectric layer 111 may be a barium titanate (BaTiO3)-based material, a lead composite perovskite-based material, a strontium titanate (SrTiO3)-based material, etc. The barium titanate-based material may include BaTiO3-based ceramic powder particles, and the BaTiO3-based ceramic powder particles may be, for example, BaTiO3 or calcium (Ca), zirconium (Zr), etc. partially dissolved in BaTiO3, etc. (BaTiO3). 1-x Ca x )TiO3(0 <x<1)、Ba(Ti 1-y Ca y )O3(0 <y<1)、(Ba 1-x Ca x )(Ti 1-y Zr y)O3(0 < x < 1, 0 < y < 1) or Ba(Ti 1-y Zr y )O3(0 < y < 1).

[0040] In addition, for the purpose of the present disclosure, the raw materials for forming the dielectric layer 111 may include various ceramic additives, organic solvents, binders, dispersants, etc. added to powder particles such as barium titanate (BaTiO3) powder particles.

[0041] Furthermore, the average thickness td of the dielectric layer 111 is not particularly limited. For example, the average thickness td of the dielectric layer 111 may be 0.2 μm to 3 μm.

[0042] The average thickness td of the dielectric layer 111 may refer to the average dimension in the first direction of the dielectric layer 111 disposed between the first internal electrode 121 and the second internal electrode 122.

[0043] The average thickness of the dielectric layer 111 can be measured from an image obtained by scanning a cross-section of the main body 110 in the length direction and the thickness direction (L direction - T direction) with a scanning electron microscope (SEM) at a magnification of 10,000 times. More specifically, the average value can be measured by measuring the thickness at 30 equally spaced points in the length direction of one dielectric layer from the scanned image. 30 points with equal intervals can be specified in the capacitance forming portion Ac. In addition, if the average value measurement is extended to 10 dielectric layers to measure the average value, the average thickness of the dielectric layer can be further generalized.

[0044] The main body 110 may include a capacitance forming portion Ac and covering portions 112 and 113 formed above and below the capacitance forming portion Ac in the first direction. The capacitance forming portion Ac is disposed in the main body 110 and includes a first internal electrode 121 and a second internal electrode 122 arranged opposite to each other with the dielectric layer 111 interposed therebetween, and a capacitance is formed through the capacitance forming portion Ac.

[0045] In addition, the capacitance forming portion Ac is a portion that contributes to the formation of the capacitance of the capacitor, and may be formed by repeatedly stacking a plurality of first internal electrodes 121 and second internal electrodes 122 with the dielectric layer 111 interposed therebetween.

[0046] The covering portions 112 and 113 may include an upper covering portion 112 disposed above the capacitance forming portion Ac in the first direction and a lower covering portion 113 disposed below the capacitance forming portion Ac in the first direction.

[0047] The upper covering portion 112 and the lower covering portion 113 may be formed by stacking a single dielectric layer or two or more dielectric layers on the upper surface and the lower surface of the capacitor forming portion Ac in the thickness direction, respectively, and the upper covering portion 112 and the lower covering portion 113 may be mainly used to prevent damage to the internal electrode due to physical stress or chemical stress.

[0048] The upper cover 112 and the lower cover 113 do not include an internal electrode, and may include the same material as that of the dielectric layer 111 .

[0049] That is, the upper cover 112 and the lower cover 113 may include a ceramic material, for example, a barium titanate (BaTiO 3 )-based ceramic material.

[0050] In addition, the average thickness of the covering parts 112 and 113 is not particularly limited. However, the average thickness tc of the covering parts 112 and 113 may be equal to or less than 400 μm.

[0051] The average thickness tc of the covering portions 112 and 113 may refer to their dimensions in the first direction, and may be a value obtained by averaging the dimensions of the covering portions 112 and 113 in the first direction measured at five points with equal intervals above or below the capacitor forming portion Ac (for example, five points with equal intervals in the second direction).

[0052] In addition, the edge portions 114 , 115 may be provided on the side surfaces of the capacitance forming portion Ac.

[0053] The edge portions 114 and 115 may include a first edge portion 114 disposed on one side surface of the capacitance forming portion Ac in the third direction and a second edge portion 115 disposed on the other side surface of the capacitance forming portion Ac in the third direction, thereby respectively forming the fifth surface 5 and the sixth surface 6 of the body. That is, the edge portions 114 and 115 may be disposed on both side surfaces of the capacitance forming portion Ac in the width direction.

[0054] like Figure 4 As shown, the edge portions 114 and 115 may refer to regions between both ends of the first and second internal electrodes 121 and 122 and the outer surface of the body 110 in a cross section of the body 110 taken along a width direction-thickness direction (W direction-T direction).

[0055] The edge portions 114 and 115 may mainly serve to prevent the inner electrodes from being damaged due to physical stress or chemical stress.

[0056] The edge portions 114 and 115 may be formed by not coating the conductive paste on regions of the ceramic green sheet except for regions where the internal electrodes are to be formed.

[0057] In addition, in order to suppress the steps caused by the internal electrodes 121 and 122, as described above, the edge portions 114 and 115 can be formed in the following manner: after stacking ceramic green sheets to form a stack including a capacitor forming portion Ac, the stack is cut to expose the internal electrodes to two side surfaces of the capacitor forming portion Ac in a third direction (width direction), and then a single dielectric layer or two or more dielectric layers are stacked on the two side surfaces of the capacitor forming portion Ac in the third direction (width direction).

[0058] In addition, there is no particular limitation on the width of the edge portions 114 and 115. For example, the average width of the edge portions 114 and 115 may be less than or equal to 400 μm.

[0059] The average width of edge portions 114 and 115 may refer to an average size of edge portions 114 and 115 in the third direction, and may be a value obtained by averaging the sizes of edge portions 114 and 115 in the third direction measured at five points spaced apart at equal intervals with respect to capacitor forming portion Ac (for example, five points spaced apart at equal intervals in the first direction).

[0060] The internal electrodes 121 and 122 and the dielectric layers 111 are alternately stacked.

[0061] The internal electrodes 121 and 122 may include first and second internal electrodes 121 and 122. The first and second internal electrodes 121 and 122 may be alternately disposed opposite to each other with the dielectric layer 111 interposed therebetween, and may be exposed to the third and fourth surfaces 3 and 4 of the body 110, respectively.

[0062] Reference Figure 3 , the first internal electrode 121 may be spaced apart from the fourth surface 4 and exposed through the third surface 3, and the second internal electrode 122 may be spaced apart from the third surface 3 and exposed through the fourth surface 4. The first external electrode 131 may be disposed on the third surface 3 of the body and connected to the first internal electrode 121, and the second external electrode 132 may be disposed on the fourth surface 4 of the body and connected to the second internal electrode 122.

[0063] That is, the first inner electrode 121 is not connected to the second outer electrode 132 but to the first outer electrode 131, and the second inner electrode 122 is not connected to the first outer electrode 131 but to the second outer electrode 132. Therefore, the first inner electrode 121 may be formed to be spaced apart from the fourth surface 4 by a predetermined distance, and the second inner electrode 122 may be formed to be spaced apart from the third surface 3 by a predetermined distance.

[0064] In this case, the first and second internal electrodes 121 and 122 may be electrically isolated from each other by the dielectric layer 111 disposed therebetween.

[0065] The body 110 may be formed by alternately stacking ceramic green sheets printed with a conductive paste for the first internal electrode 121 and ceramic green sheets printed with a conductive paste for the second internal electrode 122 and then sintering.

[0066] The material for forming the internal electrodes 121 and 122 is not particularly limited, and a material having excellent conductivity may be used as the material for forming the internal electrodes 121 and 122. For example, the internal electrodes 121 and 122 may include at least one of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof.

[0067] In addition, the internal electrodes 121 and 122 may be formed by printing a conductive paste for internal electrodes (including at least one of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof) on a ceramic green sheet. A method for printing the conductive paste for internal electrodes may be a screen printing method or a gravure printing method, but the present disclosure is not limited thereto.

[0068] In addition, there is no particular limitation on the average thickness te of the internal electrodes 121 and 122. For example, the average thickness te of the internal electrodes 121 and 122 may be 0.2 μm to 2 μm.

[0069] The average thickness te of the internal electrodes 121 and 122 may refer to an average size of the internal electrodes 121 and 122 in the first direction.

[0070] The average thickness of the internal electrodes 121 and 122 can be measured using an image obtained by scanning a cross section of the body 110 in the length direction and the thickness direction (L direction-T direction) with a scanning electron microscope (SEM) at a magnification of 10,000 times. More specifically, the average value can be measured by measuring the thickness of one internal electrode at 30 equally spaced points in the length direction from the scanned image. 30 points with equal intervals can be specified in the capacitor forming portion Ac. In addition, if the average value is measured by extending the average value measurement to 10 internal electrodes, the average thickness of the internal electrode can be further generalized.

[0071] The external electrodes 131 and 132 may be disposed on the third surface 3 and the fourth surface 4 of the body 110. The external electrodes 131 and 132 may include a first external electrode 131 disposed on the third surface 3 of the body 110 and connected to the first internal electrode 121, and a second external electrode 132 disposed on the fourth surface 4 of the body 110 and connected to the second internal electrode 122.

[0072] The external electrodes 131 and 132 may include a first external electrode 131 and a second external electrode 132, the first external electrode 131 including a first connection portion provided on the third surface 3 and a first band portion B1 extending from the first connection portion to a portion of the first surface 1, and the second external electrode 132 including a second connection portion provided on the fourth surface 4 and a second band portion B2 extending from the second connection portion to a portion of the first surface 1. In this case, the first band portion B1 may refer to a region from an extension line E3 of the third surface 3 of the body 110 to a distal end B1e of the first band portion B1, and the second band portion B2 may refer to a region from an extension line E4 of the fourth surface 4 of the body 110 to a distal end B2e of the second band portion B2.

[0073] In addition, the first external electrode 131 may include a third band portion extending from the first connection portion to a portion of the second surface 2, and the second external electrode may include a fourth band portion extending from the second connection portion to a portion of the second surface 2. In addition, the first external electrode 131 may include a first side band portion extending from the first connection portion to a portion of the fifth surface 5 and a portion of the sixth surface 6, and the second external electrode 132 may include a second side band portion extending from the second connection portion to a portion of the fifth surface 5 and a portion of the sixth surface 6.

[0074] However, the third band portion, the fourth band portion, the first side band portion, and the second side band portion may not be necessary components of the present disclosure. The first external electrode 131 and the second external electrode 132 may not be disposed on the second surface 2, and may not be disposed on the fifth surface 5 and the sixth surface 6. Since the first external electrode 131 and the second external electrode 132 are not disposed on the second surface 2, the first external electrode 131 and the second external electrode 132 may be disposed below the extension line of the second surface 2 of the body. In addition, the first connection portion and the second connection portion may be disposed to be spaced apart from the fifth surface 5 and the sixth surface 6, and the first connection portion and the second connection portion may be disposed to be spaced apart from the second surface 2. In addition, the first band portion B1 and the second band portion B2 may also be disposed to be spaced apart from the fifth surface 5 and the sixth surface 6.

[0075] In the present embodiment, a structure is described in which the multilayer electronic component 100 has two external electrodes 131 and 132. However, the number and shape of the external electrodes 131 and 132 may be changed according to the shape of the internal electrodes 121 and 122 or other purposes.

[0076] In addition, the external electrodes 131 and 132 may be formed using any material such as metal as long as it has conductivity, and a specific material may be determined by considering electrical characteristics, structural stability, etc., and the external electrodes 131 and 132 may have a multi-layered structure.

[0077] For example, the external electrodes 131 and 132 may include electrode layers 131 a and 132 a disposed on the body 110 and plating layers 131 b and 132 b formed on the electrode layers 131 a and 132 a .

[0078] For a more specific example of the electrode layers 131 a and 132 a , the electrode layers may be fired electrodes including a conductive metal and glass, or may be resin-based electrodes including a conductive metal and resin.

[0079] In addition, the electrode layers 131a and 132a may be formed by transferring a sheet including a conductive metal onto a body, or may be formed by transferring a sheet including a conductive metal onto a fired electrode.

[0080] A material having excellent electrical conductivity may be used as the conductive metal included in the electrode layers 131a and 132a, and is not particularly limited. The conductive metal may include at least one selected from the group consisting of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof.

[0081] In an embodiment, the electrode layers 131a and 132a may include base electrode layers 131a1 and 132a1 disposed to contact the body 110 and conductive resin layers 131a2 and 132a2 disposed on the base electrode layers and including a conductive metal and a resin.

[0082] By including the conductive resin layers 131a2 and 132a2, the bending strength may be further improved. In addition, since the conductive resin layers 131a2 and 132a2 include resin, the bonding force with the insulating layer 140 including the resin may be excellent, thereby improving the bonding force between the external electrodes 131 and 132 and the body 110.

[0083] In this case, the base electrode layers 131a1 and 132a1 may include glass. Since the base electrode layers 131a1 and 132a1 include glass, the base electrode layers 131a1 and 132a1 may be used to improve the bonding force with the body. However, the present disclosure is not limited thereto, and the base electrode layers 131a1 and 132a1 may be plating layers, may be formed by a deposition method such as a sputtering method or an atomic layer deposition method, and may be formed by transferring a sheet including a conductive metal.

[0084] The conductive metal used in the base electrode layers 131a1 and 132a1 is not particularly limited as long as it is formed by a material that can be electrically connected to the internal electrode to form a capacitor, and may include at least one selected from the group consisting of, for example, nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof. The base electrode layers 131a1 and 132a1 may be formed by coating a conductive paste (prepared by adding glass frit to conductive metal powder particles) and then firing it.

[0085] The conductive metal included in the conductive resin layers 131 a 2 and 132 a 2 serves to electrically connect the base electrode layers 131 a 1 and 132 a 1 .

[0086] The conductive metal included in the conductive resin layers 131a2 and 132a2 is not particularly limited as long as it is a material that can be electrically connected to the base electrode layers 131a1 and 132a1, and the conductive metal included in the conductive resin layers 131a2 and 132a2 may include at least one selected from the group consisting of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti) and their alloys.

[0087] The conductive metal included in the conductive resin layers 131a2 and 132a2 may include at least one of spherical powder particles and flaky powder particles. That is, the conductive metal may be composed only of flaky powder particles, may be composed only of spherical powder particles, or may be a mixture of flaky powder particles and spherical powder particles. Here, the spherical powder particles may also include an incomplete spherical shape (for example, a shape in which the ratio of the length of the major axis to the minor axis (major axis length / minor axis length) is less than or equal to 1.45). Flaky powder particles refer to powder particles having a flat and elongated shape, and are not particularly limited, for example, powder particles having a ratio of the length of the major axis to the minor axis (major axis length / minor axis length) greater than or equal to 1.95. The lengths of the major axis and minor axis of the spherical powder particles and the flaky powder particles may be measured from an image obtained by scanning a cross section (L direction-T direction cross section) of a ceramic electronic component cut from the center of the ceramic electronic component in the third direction using a scanning electron microscope (SEM) in the first direction and the second direction.

[0088] The resin included in the conductive resin layers 131a2 and 132a2 is used to ensure adhesion and absorb impact. The resin included in the conductive resin layers 131a2 and 132a2 is not particularly limited as long as it has adhesion and impact absorption and can be mixed with conductive metal powder particles to make a paste, and may include, for example, epoxy resin.

[0089] In addition, the conductive resin layers 131a2 and 132a2 may include a plurality of metal particles, an intermetallic compound, and a resin. Since the conductive resin layers 131a2 and 132a2 include the intermetallic compound, the electrical connectivity with the base electrode layers 131a1 and 132a1 may be further improved. The intermetallic compound may be used to improve electrical connectivity by connecting a plurality of metal particles, and may be used to surround a plurality of metal particles and connect them to each other.

[0090] In this case, the intermetallic compound may include a metal having a melting point lower than the solidification temperature of the resin. That is, since the intermetallic compound includes a metal having a melting point lower than the solidification temperature of the resin, the metal having a melting point lower than the solidification temperature of the resin melts during the drying and solidification process and forms the intermetallic compound with a portion of the metal particles to surround the metal particles. In this case, the intermetallic compound may preferably include a metal having a low melting point (300° C. or lower).

[0091] For example, the intermetallic compound may include Sn having a melting point of 213° C. to 220° C. During drying and solidification, Sn is melted, and the molten Sn wets metal particles having a high melting point (such as Ag, Ni, or Cu) by capillary action and reacts with a portion of the Ag, Ni, or Cu metal particles to form an intermetallic compound (such as Ag3Sn, Ni3Sn4, Cu6Sn5, and Cu3Sn). Ag, Ni, or Cu that does not participate in the reaction remains in the form of metal particles.

[0092] Thus, the plurality of metal particles may include at least one of Ag, Ni, and Cu, and the intermetallic compound may include at least one of Ag3Sn, Ni3Sn4, Cu6Sn5, and Cu3Sn.

[0093] In an embodiment, the conductive resin layers 131a2 and 132a2 may be provided to cover the base electrode layers 131a1 and 132a1. Therefore, when the insulating layer 140 includes the resin, the bonding force with the insulating layer 140 may be further improved.

[0094] However, the present disclosure is not limited to this, and although not shown, the ends of the conductive resin layers 131a2 and 132a2 may be set in the first band portion B1 and the second band portion B2, and may not cover the ends of the base electrode layers 131a1 and 132a1, and therefore, the ends of the insulating layer 140 may be set to contact the base electrode layers 131a1 and 132a1 in the first band portion B1 and the second band portion B2.

[0095] The plating layers 131b and 132b are used to improve mounting characteristics. The type of the plating layers 131b and 132b is not particularly limited, and may be a plating layer including one or more of Ni, Sn, Pd, and alloys thereof, and may be formed of a plurality of layers.

[0096] For a more specific example of the plating layers 131b and 132b, the plating layers 131b and 132b may be a Ni plating layer or a Sn plating layer formed on the electrode layers 131a and 132a, or may be a Ni plating layer and a Sn plating layer sequentially formed on the electrode layers 131a and 132a, or may be a Sn plating layer, a Ni plating layer, and a Sn plating layer sequentially formed on the electrode layers 131a and 132a. In addition, the plating layers 131b and 132b may include a plurality of Ni plating layers and / or a plurality of Sn plating layers.

[0097] The insulating layer 140 may be disposed on the first surface 1 and disposed to extend onto the first and second band portions B1 and B2. In addition, the insulating layer 140 may be disposed to contact the electrode layers 131a and 132a in the first and second band portions B1 and B2 and to cover the ends of the electrode layers 131a and 132a.

[0098] The insulating layer 140 may include a body portion 143 disposed between the first and second external electrodes 131 and 132 , a first extension portion 141 disposed on the first band portion B1 , and a second extension portion 142 disposed on the second band portion B2 .

[0099] The insulating layer 140 may serve to improve bending strength characteristics by alleviating external stress.

[0100] Since the insulating layer 140 includes the main body portion 143 disposed between the first external electrode 131 and the second external electrode 132, the mechanical strength of the multilayer electronic component 100 can be improved to reduce the influence of external impact, etc., and the penetration of moisture can be prevented by filling the micropores existing in the surface of the main body to improve the moisture resistance reliability. In addition, when the insulating layer 140 is only disposed in the area of ​​the first surface 1 of the main body 110 where the first band portion B1 and the second band portion B2 are not disposed, the effect of improving the bending strength characteristics may be insufficient.

[0101] When external stress is applied to the multilayer electronic component 100 mounted on the substrate, the maximum stress is applied to the end of the band portion of the external electrode in contact with the substrate. Therefore, in the present disclosure, the insulating layer 140 may be arranged to contact the electrode layers 131a and 132a in the first band portion B1 and the second band portion B2 and to cover the ends of the electrode layers 131a and 132a to effectively relieve stress when bending deformation occurs. In addition, since the ends of the electrode layers 131a and 132a may become a penetration path for plating solution, moisture, etc., when the insulating layer 140 is arranged to cover the ends of the electrode layers 131a and 132a, the penetration of plating solution, moisture, etc. through the ends of the electrode layers 131a and 132a of the external electrode can be suppressed, thereby improving moisture resistance reliability.

[0102] In an embodiment, the end of the insulating layer 140 may contact the ends of the plating layers 131b and 132b in the first belt portion B1 and the second belt portion B2. That is, the plating layers 131b and 132b may not be provided in the portions of the first belt portion B1 and the second belt portion B2 where the insulating layer 140 is provided.

[0103] Since the insulating layer 140 includes an insulating material, the insulating layer 140 has insulating properties, improves bending strength characteristics, and can be used to prevent external moisture or plating solution from penetrating into the main body.

[0104] In an embodiment, the insulating layer 140 may include a resin. Since the insulating layer 140 includes a resin, the bonding force with the conductive resin layers 131a2 and 132a2 can be further strengthened, thereby further improving the bending strength.

[0105] The type of resin included in the insulating layer 140 is not particularly limited. For example, the resin may include at least one of epoxy resin, silicone resin, fluororesin, acrylic resin, and ethyl cellulose.

[0106] In addition, the insulating layer 140 may include the same type of resin as the resin included in the conductive resin layers 131a2 and 132a2. Therefore, the bonding force between the insulating layer 140 and the conductive resin layers 131a2 and 132a2 can be further strengthened, and the bending strength can be further improved.

[0107] However, the present disclosure is not limited to the case where the insulating layer 140 includes a resin, and the insulating layer 140 may include a ceramic material as the insulating material. In this case, the ceramic material included in the insulating layer 140 may be one or more of TiO2, BaTiO3, Al2O3, BaO, (PbZr x Ti 1-x O3)(0 < x < 1), SiC, MgO, and SiO2.

[0108] In addition, the insulating layer 140 may include both a resin and a ceramic material.

[0109] In an embodiment, when the average length from the distal end B1e of the first belt portion to the extension line E3 of the third surface 3 in the second direction is La1 and the average length from the distal end B1e of the first belt portion to the end 140e1 of the insulating layer 140 provided on the first external electrode 131 in the second direction is Lb1, La1 > Lb1 may be satisfied.

[0110] In addition, the above characteristics can also be applied to the end of the insulating layer disposed on the second external electrode 132. That is, when the average length of the extension line E4 from the distal end B2e of the second band portion to the fourth surface 4 in the second direction is La2 and the average length from the distal end B2e of the second band portion to the end of the insulating layer 140 disposed on the second external electrode 132 in the second direction is Lb2, La2>Lb2 can be satisfied.

[0111] In an embodiment, La1 and Lb1 may satisfy 0.2≤Lb1 / La1≤0.8. If Lb1 / La1 is less than 0.2, the improvement effect of bending strength and moisture resistance reliability may be insufficient, and if Lb1 / La1 exceeds 0.8, there is a risk of insufficient adhesive strength when mounted on a board. Therefore, when the multilayer electronic component 100 is mounted on a substrate, adhesive strength can be ensured.

[0112] Likewise, La2 and Lb2 may satisfy 0.2≤Lb2 / La2≤0.8. In an embodiment, an average thickness t1 of the plating layers 131 b and 132 b may be less than an average thickness t2 of the insulating layer 140 .

[0113] The average thickness t1 of the plating layers 131 b and 132 b is not particularly limited, and for example, t1 may be 2 μm to 10 μm.

[0114] The average thickness t2 of the insulating layer 140 is not particularly limited, and for example, t2 may be 2 μm to 10 μm.

[0115] The average thicknesses t1 and t2 may be values ​​obtained by averaging values ​​measured at five equally spaced points in a cross section of the body 110 in the first and second directions cut from the center of the body 110 in the third direction (eg, five equally spaced points in the second direction).

[0116] Ends of the insulating layer 140 may contact ends of the plating layers 131 b and 132 b in the first and second band portions B1 and B2 , and regions where the ends of the insulating layer and the ends of the plating layers contact each other may have a stepped portion.

[0117] As described above, as one of the various effects of the present disclosure, the bending strength characteristics of the multilayer electronic component can be improved by providing an insulating layer on the mounting surface and providing the insulating layer to cover the end of the electrode layer.

[0118] As one of various effects of the present disclosure, a bonding force between the external electrode and the body may be improved.

[0119] Although the embodiments of the present disclosure have been described in detail above, the present disclosure is not limited to the above embodiments and drawings, and is intended to be defined by the appended claims. Therefore, those skilled in the art may make various forms of substitutions, modifications and changes within the scope of the technical spirit of the present disclosure described in the claims, and this also falls within the scope of the present disclosure.

[0120] In addition, the expression "one embodiment" used in the present disclosure does not mean the same embodiment, and is provided to emphasize and describe different unique features. However, it is not excluded that one embodiment presented above is implemented in combination with the features of another embodiment. For example, even if the content described in a specific embodiment is not described in another embodiment, unless there is a description contrary to or contradictory to the content in another embodiment, the content can be understood as a description related to another embodiment.

[0121] The terms used in the present disclosure are only used to describe one embodiment and are not intended to limit the present disclosure. In this case, unless the context clearly indicates otherwise, a singular expression includes a plural expression.

[0122] While example embodiments have been shown and described above, it will be readily apparent to those skilled in the art that modifications and variations may be made without departing from the scope of the invention as defined by the appended claims.

Claims

1. A multilayer electronic component comprising: a body including a dielectric layer and a first inner electrode and a second inner electrode, the first inner electrode and the second inner electrode being alternately arranged with the dielectric layer interposed therebetween, the body having a first surface and a second surface opposite to each other in a first direction, a third surface and a fourth surface connected to the first surface and the second surface and opposite to each other in the second direction, and a fifth surface and a sixth surface connected to the first surface, the second surface, the third surface and the fourth surface and opposite to each other in a third direction; a first external electrode including a first connecting portion disposed on the third surface and a first band portion extending from the first connecting portion to a portion of the first surface; a second external electrode including a second connecting portion disposed on the fourth surface and a second band portion extending from the second connecting portion to a portion of the first surface; as well as an insulating layer disposed on the first surface to extend onto the first belt portion and the second belt portion, Wherein, the first external electrode and the second external electrode include an electrode layer and a plating layer arranged on the electrode layer, and The insulating layer is in contact with the electrode layer in the first belt portion and the second belt portion, and is provided to cover an end portion of the electrode layer.

2. The multilayer electronic component of claim 1, wherein: Ends of the insulating layer are in contact with ends of the plating layer in the first and second band portions.

3. The multilayer electronic component of claim 1, wherein: The electrode layer includes a base electrode layer disposed in contact with the body and a conductive resin layer, the base electrode layer being disposed on the base electrode layer and including a conductive metal and a resin.

4. The multilayer electronic component of claim 3, wherein: The conductive resin layer is provided to cover the base electrode layer.

5. The multilayer electronic component of claim 3, wherein: The end portions of the insulating layer are arranged to contact the base electrode layer in the first band portion and the second band portion.

6. The multilayer electronic component of claim 3, wherein: Ends of the insulating layer are in contact with ends of the plating layer located on the conductive resin layers of the first and second belt portions.

7. The multilayer electronic component of claim 3, wherein: The base electrode layer includes glass.

8. The multilayer electronic component of claim 3, wherein: The insulating layer includes resin.

9. The multilayer electronic component of claim 8, wherein: The resin included in the insulating layer is at least one of epoxy resin, silicone resin, fluororesin, acrylic resin, and ethyl cellulose.

10. The multilayer electronic component of claim 8, wherein: The resin included in the insulating layer is the same type as the resin included in the conductive resin layer.

11. The multilayer electronic component of claim 1, wherein: The insulating layer includes a ceramic material.

12. The multilayer electronic component of claim 11, wherein: The ceramic material included in the insulating layer is TiO2, BaTiO3, Al2O3, BaO, PbZr x Ti 1-x At least one of O3, SiC, MgO and SiO2 in PbZr x Ti 1-x O3, 0 <x<1。 13. The multilayer electronic component of claim 1, wherein: La1>Lb1 is satisfied, wherein La1 is the average length of an extension line from the distal end of the first band portion to the third surface in the second direction, and Lb1 is the average length from the distal end of the first band portion to the end of the insulating layer disposed on the first external electrode in the second direction.

14. The multilayer electronic component of claim 13, wherein: La1 and Lb1 satisfy 0.2≤Lb1 / La1≤0.

8.

15. The multilayer electronic component of claim 1, wherein: La2>Lb2 is satisfied, wherein La1 is the average length from the distal end of the second band portion to the extension line of the fourth surface in the second direction, and is the average length from the distal end of the second band portion to the end of the insulating layer disposed on the second external electrode in the second direction.

16. The multilayer electronic component of claim 15, wherein: La2 and Lb2 satisfy 0.2≤Lb2 / La2≤0.

8.

17. The multilayer electronic assembly of claim 1, wherein: The average thickness of the plating layer is smaller than the average thickness of the insulating layer.

18. The multilayer electronic component of claim 17, wherein: The plating layer has an average thickness of 2 μm to 10 μm, and the insulating layer has an average thickness of 2 μm to 10 μm.

19. The multilayer electronic assembly of claim 1, wherein: Ends of the insulating layer are in contact with ends of the plating layer in the first and second band portions, and steps are formed in regions where the ends of the insulating layer and the ends of the plating layer are in contact with each other.

20. A multilayer electronic component comprising: a body including a dielectric layer and a first inner electrode and a second inner electrode, the first inner electrode and the second inner electrode being alternately arranged with the dielectric layer interposed therebetween, the body having a first surface and a second surface opposite to each other in a first direction, a third surface and a fourth surface connected to the first surface and the second surface and opposite to each other in the second direction, and a fifth surface and a sixth surface connected to the first surface, the second surface, the third surface and the fourth surface and opposite to each other in a third direction; a first external electrode including a first connecting portion disposed on the third surface and a first band portion extending from the first connecting portion to a portion of the first surface; a second external electrode including a second connecting portion disposed on the fourth surface and a second band portion extending from the second connecting portion to a portion of the first surface; as well as an insulating layer disposed on the first surface and extending onto the first belt portion and the second belt portion to partially cover the first belt portion and the second belt portion, The first external electrode includes a plating layer extending in a partial region of the first band portion, and the second external electrode includes a plating layer extending in a partial region of the second band portion.

21. The multilayer electronic component of claim 20, wherein: Ends of the insulating layer are in contact with ends of the plating layer in the first and second band portions.

22. The multilayer electronic assembly of claim 20, wherein: The insulating layer includes resin.

23. The multilayer electronic assembly of claim 20, wherein: The insulating layer includes a ceramic material.

24. The multilayer electronic component of claim 23, wherein: The ceramic material included in the insulating layer is TiO2, BaTiO3, Al2O3, BaO, PbZr x Ti 1-x At least one of O3, SiC, MgO and SiO2 in PbZr x Ti 1-x Medium, 0 <x<1。 25. The multilayer electronic assembly of claim 20, wherein: La1>Lb1 is satisfied, wherein La1 is the average length of an extension line from the distal end of the first band portion to the third surface in the second direction, and Lb1 is the average length from the distal end of the first band portion to the end of the insulating layer disposed on the first external electrode in the second direction.

26. The multilayer electronic assembly of claim 25, wherein: La1 and Lb1 satisfy 0.2≤Lb1 / La1≤0.

8.

27. The multilayer electronic assembly of claim 18, wherein: The insulating layer and the plating layer in the first belt portion and the second belt portion do not overlap each other in the first direction.

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