Novel half-wafer cleaning method

Abstract

The invention discloses a novel half wafer cleaning method, and relates to the technical field of semiconductor silicon wafer cleaning. According to the novel half-piece cleaning method, a base is included, a cleaning box is fixedly connected to the top of the base, a control box body is fixedly connected to the back face of the cleaning box, a moving mechanism is fixedly connected to the interior of the control box body and comprises a supporting beam, and a first supporting plate is fixedly connected to the surface of the supporting beam; the surface of the first supporting plate is fixedly connected with an inclined fixing mechanism. According to the novel half-wafer cleaning method, by arranging the first rotating shaft and the gear on the surface of the bearing block and starting the first motor, micro-nano bubbles can impact the surface of the silicon wafer from different directions, cleaning dead corners are avoided, meanwhile, the utilization rate of the micro-nano bubbles is increased, the bubbles can be broken more sufficiently on the surface of the silicon wafer, and the cleaning efficiency is improved. Stronger microjet and shock waves are generated, the dirt stripping speed is increased, and therefore the cleaning effect of the device is further improved.

Description

Technical Field

[0001] The invention relates to the technical field of semiconductor silicon wafer cleaning, in particular to a novel half-wafer cleaning method. Background Art

[0002] Traditional semiconductor silicon wafer cleaning methods, such as chemical solution immersion cleaning, can remove some surface impurities, but are prone to chemical residues, which have a negative impact on subsequent manufacturing processes. Some physical cleaning methods, such as high-pressure water jet cleaning, can effectively remove particulate contaminants, but may cause mechanical damage such as microcracks on the wafer due to excessive impact force, affecting the product yield and performance. The utility model patent cited in China with publication number "CN220049157U" includes a cleaning machine, a supporting mechanism and a spraying mechanism. A cleaning chamber is opened on the front of the top of the cleaning machine, the supporting mechanism is movably arranged at the bottom of the cleaning chamber, and the spraying mechanism is arranged at the top of the cleaning chamber; the supporting mechanism includes a bracket fixedly connected to the inner wall of the bottom end of the cleaning chamber and a cleaning base rotatably arranged inside the bracket.

[0003] Most existing devices use a spraying method to clean silicon wafers. This does not provide a good cleaning effect on the semiconductor silicon wafers after cleaning, resulting in a large number of residual impurity particles on the surface of some semiconductor silicon wafers, failing to achieve a good cleaning effect. Summary of the invention

[0004] In view of the deficiencies in the prior art, the present invention provides a novel half-wafer cleaning method to solve the problems raised in the above background technology.

[0005] To achieve the above objectives, the present invention is implemented through the following technical solutions: a novel half-sheet cleaning method, comprising a base, a cleaning box is fixedly connected to the top of the base, a control box is fixedly connected to the back of the cleaning box, a moving mechanism is fixedly connected to the inside of the control box, the moving mechanism comprises a support beam, a first support plate is fixedly connected to the surface of the support beam, a tilting fixing mechanism is fixedly connected to the surface of the first support plate, a mud scraping mechanism is fixedly connected to the top of the support beam, a heating device is fixedly connected to the inside of the cleaning box, a thermometer is also fixedly connected to the inside of the cleaning box, and a bubble generating mechanism is fixedly connected to the bottom of the cleaning box; The bubble generating mechanism includes: An air inlet pipe, wherein the air inlet pipe is fixedly connected to the bottom of the cleaning box; The first pipe is fixedly connected to the inside of the cleaning box, and the surface of the air inlet pipe is fixedly connected with the first pipe, the surface of the first pipe is fixedly connected with the second pipe, the surface of the second pipe is fixedly connected with the air outlet device, and the number of the second pipes is seven.

[0006] Preferably, the moving mechanism includes a telescopic machine, which is fixedly connected to the bottom of the cleaning box, a telescopic rod is fixedly connected to the inside of the telescopic machine, a sliding support plate is fixedly connected to the surface of the telescopic rod, and a support beam is fixedly connected to the surface of the sliding support plate, and the sliding support plate is slidably connected to the inside of the control box.

[0007] Preferably, the tilt fixing mechanism includes a first motor, the interior of the first motor is fixedly connected to a first rotating shaft via an output shaft, and the first rotating shaft is rotatably connected to the interior of a first support plate, the top of the first rotating shaft is fixedly connected to an angle tilt measuring device, and the surface of the first rotating shaft is fixedly connected to a bearing block.

[0008] Preferably, a gear is fixedly connected to the surface of the bearing block, and a second fixed block is also fixedly connected to the surface of the bearing block, and a second rotating support block is rotatably connected to the surface of the second fixed block, and an elastic connecting rod is also fixedly connected to the surface of the second fixed block, and a third rotating support block is rotatably connected to the surface of the elastic connecting rod.

[0009] Preferably, the surface of the supporting block is fixedly connected to a first fixed block, the interior of the first fixed block is slidably connected to a slider, the surface of the slider is fixedly connected to a limiting slider, the bottom of the slider is fixedly connected to an arc spring, and the arc spring is fixedly connected to the interior of the first fixed block.

[0010] Preferably, the surface of the sliding block is rotatably connected to a first rotating support block, the gear is rotatably connected to the surface of the first supporting plate, and the gear is meshingly connected to the gear belt.

[0011] Preferably, the scraping mechanism includes a second support plate, the second support plate is fixedly connected to the top of the support beam, the surface of the second support plate is fixedly connected to a second motor, the interior of the second motor is rotatably connected to a belt via an output shaft, the surface of the belt is fixedly connected to a scraper, and the interior of the cleaning box is fixedly connected to a baffle.

[0012] A new half-sheet cleaning method: S1, moving the silicon wafer downward from the first rotating support block, so that the silicon wafer is fixed inside the first fixed block; S2, control to start the telescopic machine, the start of the telescopic machine drives the sliding support plate to move downward, so as to immerse the silicon wafer in the cutting fluid in the cleaning box; S3, controlling the micro-nano bubble generating device to work, and then starting the first motor, which drives the bearing block to rotate after starting, and finally tilts the silicon wafer at a certain angle; S4, control the start of the second motor, after the second motor is started, drive the scraper on the surface of the belt to promptly sweep the impurities generated by cleaning into the side groove of the cleaning box, and finally achieve the cleaning of the semiconductor silicon wafer.

[0013] The present invention provides a novel half-sheet cleaning method, which has the following beneficial effects: 1. This novel half-wafer cleaning method can make the micro-nano bubbles emitted from the outlet of the gas outlet evenly distributed inside the cleaning box by setting seven second pipes, covering all parts of the silicon wafer, avoiding cleaning dead corners, ensuring that the entire surface of the silicon wafer can be fully cleaned, thereby improving the cleaning effect of the device.

[0014] 2. This novel half-wafer cleaning method sets a scraper, and starts a second motor to drive the scraper to work continuously, so as to promptly scrape the cleaned impurities away from the inside of the cleaning box, and then promptly transfer them to the impurity collection position to prevent these impurities from re-attaching to the silicon wafer in the cleaning fluid and causing secondary pollution. At the same time, it accelerates the uniform mixing of the cutting fluid inside the cleaning box, making the temperature distribution of the cleaning fluid inside the cleaning box more uniform, thereby enhancing the cleaning effect of the silicon wafer.

[0015] 3. This novel half-wafer cleaning method effectively limits the shaking and vibration of the silicon wafer by setting up multiple rotating support blocks, preventing the silicon wafer from being displaced or shaken when the cleaning liquid flows or the micro-nano bubbles impact, so that the physical effects such as microjets and shock waves generated by the bubble burst can be evenly applied to the surface of the silicon wafer, ensuring the uniformity of cleaning, thereby improving the cleaning effect of the device.

[0016] 4. This novel half-wafer cleaning method sets a first rotating shaft and a gear on the surface of the supporting block and starts the first motor, so that micro-nano bubbles can impact the surface of the silicon wafer from different directions to avoid cleaning dead corners. At the same time, the utilization rate of micro-nano bubbles is improved, and the bubbles can be more fully broken on the surface of the silicon wafer, generating stronger microjets and shock waves, accelerating the stripping speed of dirt, and further improving the cleaning effect of the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram of the main stereoscopic structure of the present invention; Figure 2 It is a bottom-up three-dimensional structural schematic diagram of the present invention; Figure 3 This is a cross-sectional view of the control box of the present invention; Figure 4 It is a schematic diagram of the mobile mechanism of the present invention; Figure 5 This is a schematic diagram of the tilting and fixing mechanism of the first part of the present invention; Figure 6 This is a schematic diagram of the tilting and fixing mechanism of the second part of the present invention; Figure 7 For the present invention Figure 6 The enlarged schematic diagram at A in the middle; Figure 8 It is a cross-sectional view of the cleaning box of the present invention.

[0018] In the figure: 1, base; 2, cleaning box; 3, control box; 4, moving mechanism; 41, telescopic machine; 42, telescopic rod; 43, sliding support plate; 44, support beam; 45, first support plate; 5, tilting and fixing mechanism; 51, first motor; 52, first rotating shaft; 53, angle tilt measuring device; 54, gear; 55, gear belt; 56, bearing block; 57, first fixing block; 58, arc spring; 59, slider; 510, limit Slider; 511, first rotating support block; 512, second fixed block; 513, second rotating support block; 514, elastic connecting rod; 515, third rotating support block; 6, mud scraping mechanism; 61, second support plate; 62, second motor; 63, belt; 64, scraper; 65, baffle; 7, bubble generating mechanism; 71, air inlet pipe; 72, first pipe; 73, second pipe; 74, air outlet device; 8, heating device; 9, thermometer. DETAILED DESCRIPTION

[0019] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0020] Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and should not be construed as limiting the present invention.

[0021] Example 1: Please refer to Figure 1-6 The present invention provides a technical solution: a novel half-sheet cleaning device, comprising a base 1, a cleaning box 2 is fixedly connected to the top of the base 1, a control box 3 is fixedly connected to the back of the cleaning box 2, a moving mechanism 4 is fixedly connected inside the control box 3, the moving mechanism 4 comprises a support beam 44, a first support plate 45 is fixedly connected to the surface of the support beam 44, a tilting fixing mechanism 5 is fixedly connected to the surface of the first support plate 45, a mud scraping mechanism 6 is fixedly connected to the top of the support beam 44, a heating device 8 is fixedly connected to the inside of the cleaning box 2, a thermometer 9 is also fixedly connected to the inside of the cleaning box 2, and a bubble generating mechanism 7 is fixedly connected to the bottom of the cleaning box 2; The bubble generating mechanism 7 comprises: An air inlet pipe 71, the air inlet pipe 71 is fixedly connected to the bottom of the cleaning box 2; The first pipe 72 is fixedly connected to the inside of the cleaning box 2, and the surface of the air inlet pipe 71 is fixedly connected with the first pipe 72, the surface of the first pipe 72 is fixedly connected with the second pipe 73, the surface of the second pipe 73 is fixedly connected with the air outlet device 74, and the number of the second pipes 73 is seven.

[0022] The moving mechanism 4 includes a telescopic machine 41, which is fixedly connected to the bottom of the cleaning box 2. A telescopic rod 42 is fixedly connected inside the telescopic machine 41, a sliding support plate 43 is fixedly connected to the surface of the telescopic rod 42, and a support beam 44 is fixedly connected to the surface of the sliding support plate 43, and the sliding support plate 43 is slidably connected to the inside of the control box 3.

[0023] The tilt fixing mechanism 5 includes a first motor 51, the interior of the first motor 51 is fixedly connected to a first rotating shaft 52 via an output shaft, and the first rotating shaft 52 is rotatably connected to the interior of the first support plate 45, the top of the first rotating shaft 52 is fixedly connected to an angle tilt measuring device 53, and the surface of the first rotating shaft 52 is fixedly connected to a supporting block 56.

[0024] The surface of the supporting block 56 is fixedly connected to the gear 54, and the surface of the supporting block 56 is also fixedly connected to the second fixed block 512, and the surface of the second fixed block 512 is rotatably connected to the second rotating support block 513, and the surface of the second fixed block 512 is also fixedly connected to the elastic connecting rod 514, and the surface of the elastic connecting rod 514 is rotatably connected to the third rotating support block 515.

[0025] When in use, the silicon wafer to be cleaned is placed on multiple rotating support blocks, and the silicon wafer is inserted from the top of the second rotating support block 513 downward. First, the silicon wafer touches the first rotating support block 511, so that the slider 59 slides inside the first fixed block 57, and then the bottom of the silicon wafer touches the second rotating support block 513 and the third rotating support block 515. At the same time, the slider 59 rebounds to its original position to fix the silicon wafer, and then the telescopic machine 41 is started. The start of the telescopic machine 41 drives the telescopic rod 42 to work, thereby driving the sliding support plate 43 to move downward, and immersing the silicon wafer in the cleaning liquid inside the cleaning box 2.

[0026] By setting up multiple rotating support blocks, the shaking and vibration of the silicon wafer can be effectively limited, and the silicon wafer can be prevented from displacement or shaking when the cleaning liquid flows or the micro-nano bubbles impact. The physical effects such as microjets and shock waves generated by the bubble burst can be evenly applied to the surface of the silicon wafer, ensuring the uniformity of cleaning, thereby improving the cleaning effect of the device.

[0027] Example 2: Please refer to Figure 1-8 Based on the first embodiment, the present invention provides a technical solution: The surface of the supporting block 56 is fixedly connected to the first fixed block 57, the interior of the first fixed block 57 is slidably connected to the slider 59, the surface of the slider 59 is fixedly connected to the limiting slider 510, the bottom of the slider 59 is fixedly connected to the arc spring 58, and the arc spring 58 is fixedly connected to the interior of the first fixed block 57.

[0028] The surface of the slider 59 is rotatably connected to the first rotation support block 511 , the gear 54 is rotatably connected to the surface of the first support plate 45 , and the gear 54 is meshedly connected to the gear belt 55 .

[0029] The scraper mechanism 6 includes a second support plate 61, which is fixedly connected to the top of the support beam 44. The surface of the second support plate 61 is fixedly connected to a second motor 62. The interior of the second motor 62 is rotatably connected to a belt 63 via an output shaft. The surface of the belt 63 is fixedly connected to a scraper 64. The interior of the cleaning box 2 is fixedly connected to a baffle 65.

[0030] When in use, after placing the silicon wafer inside the cleaning box 2, the water temperature is controlled at 30°-50° by controlling the feedback of the heating device 8 and the thermometer 9, and then the micro-nano generating device is started. The bubbles generated by it pass through the air inlet pipe 71, the first pipe 72, and the second pipe 73 respectively, and are finally ejected through the air outlet device 74. Then, the first motor 51 is started through the feedback of the angle tilt measuring device 53. The start of the first motor 51 drives the supporting block 56 to rotate, thereby driving the silicon wafer to tilt inside the cleaning box 2. Then, the second motor 62 is started. The start of the second motor 62 drives the belt 63 to rotate. The rotation of the belt 63 drives the scraper 64 to promptly sweep the impurities generated by the cleaning into the collection groove on the side of the cleaning box 2, thereby achieving the cleaning of the silicon wafer.

[0031] By setting up seven second pipes 73, the micro-nano bubbles discharged from the outlet of the gas outlet device 74 can be evenly distributed inside the cleaning box 2, covering all parts of the silicon wafer, avoiding cleaning dead corners, ensuring that the entire surface of the silicon wafer can be fully cleaned, thereby improving the cleaning effect of the device.

[0032] By setting up the scraper 64 and starting the second motor 62 to drive the scraper 64 to work continuously, the cleaned impurities are promptly scraped away from the inside of the cleaning box 2, and then transferred to the position for collecting impurities in time, to prevent these impurities from re-attaching to the silicon wafer in the cleaning liquid and causing secondary pollution. At the same time, the uniform mixing of the cutting fluid inside the cleaning box 2 is accelerated, and the temperature distribution of the cleaning fluid inside the cleaning box 2 is made more uniform, thereby enhancing the cleaning effect of the silicon wafer.

[0033] By arranging a first rotating shaft 52 and a gear 54 on the surface of the supporting block 56 and starting the first motor 51, the micro-nano bubbles can impact the surface of the silicon wafer from different directions to avoid cleaning dead corners. At the same time, the utilization rate of the micro-nano bubbles is improved, and the bubbles can be more fully broken on the surface of the silicon wafer, generating stronger microjets and shock waves, accelerating the stripping speed of dirt, and further improving the cleaning effect of the device.

[0034] Example 3: Please refer to Figure 1-8 Based on the first and second embodiments, the present invention provides a technical solution: A new half-sheet cleaning method: S1, moving the silicon wafer downward from the first rotating support block 511, so that the silicon wafer is fixed inside the first fixing block 57; S2, control to start the telescopic machine 41, the start of the telescopic machine 41 drives the sliding support plate 43 to move downward, so as to immerse the silicon wafer in the cutting fluid in the cleaning box 2; S3, controlling the micro-nano bubble generating device to work, and then starting the first motor 51, which drives the bearing block 56 to rotate after being started, and finally tilts the silicon wafer at a certain angle; S4, control the start of the second motor 62, after the second motor 62 is started, it drives the scraper 64 on the surface of the belt 63 to promptly sweep the impurities generated by cleaning into the side groove of the cleaning box 2, and finally realizes the cleaning of the semiconductor silicon wafer.

[0035] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A novel half-sheet cleaning device, comprising a base (1), characterized in that: The top of the base (1) is fixedly connected to a cleaning box (2), the back of the cleaning box (2) is fixedly connected to a control box (3), the interior of the control box (3) is fixedly connected to a moving mechanism (4), the moving mechanism (4) comprises a support beam (44), the surface of the support beam (44) is fixedly connected to a first support plate (45), the surface of the first support plate (45) is fixedly connected to a tilting and fixing mechanism (5), the top of the support beam (44) is fixedly connected to a mud scraping mechanism (6), the interior of the cleaning box (2) is fixedly connected to a heating device (8), the interior of the cleaning box (2) is also fixedly connected to a thermometer (9), and the bottom of the cleaning box (2) is fixedly connected to a bubble generating mechanism (7); The bubble generating mechanism (7) comprises: An air inlet pipe (71), wherein the air inlet pipe (71) is fixedly connected to the bottom of the cleaning box (2); A first pipe (72), the first pipe (72) is fixedly connected to the inside of the cleaning box (2), and the surface of the air inlet pipe (71) is fixedly connected to the first pipe (72), the surface of the first pipe (72) is fixedly connected to the second pipe (73), the surface of the second pipe (73) is fixedly connected to the air outlet device (74), and the number of the second pipes (73) is seven.

2. A novel half-sheet cleaning device according to claim 1, characterized in that: The moving mechanism (4) comprises a telescopic machine (41), the telescopic machine (41) being fixedly connected to the bottom of the cleaning box (2), a telescopic rod (42) being fixedly connected inside the telescopic machine (41), a sliding support plate (43) being fixedly connected to the surface of the telescopic rod (42), a support beam (44) being fixedly connected to the surface of the sliding support plate (43), and the sliding support plate (43) being slidably connected to the inside of the control box (3).

3. A novel half-sheet cleaning device according to claim 2, characterized in that: The tilt fixing mechanism (5) comprises a first motor (51), the interior of the first motor (51) being fixedly connected to a first rotating shaft (52) via an output shaft, and the first rotating shaft (52) being rotatably connected to the interior of a first support plate (45), the top of the first rotating shaft (52) being fixedly connected to an angle tilt measuring device (53), and the surface of the first rotating shaft (52) being fixedly connected to a bearing block (56).

4. A novel half-sheet cleaning device according to claim 3, characterized in that: The surface of the bearing block (56) is fixedly connected to a gear (54), the surface of the bearing block (56) is also fixedly connected to a second fixed block (512), the surface of the second fixed block (512) is rotatably connected to a second rotating support block (513), the surface of the second fixed block (512) is also fixedly connected to an elastic connecting rod (514), and the surface of the elastic connecting rod (514) is rotatably connected to a third rotating support block (515).

5. A novel half-sheet cleaning device according to claim 4, characterized in that: The surface of the bearing block (56) is fixedly connected to a first fixed block (57), the interior of the first fixed block (57) is slidably connected to a slider (59), the surface of the slider (59) is fixedly connected to a limit slider (510), the bottom of the slider (59) is fixedly connected to an arc spring (58), and the arc spring (58) is fixedly connected to the interior of the first fixed block (57).

6. A novel half-sheet cleaning device according to claim 5, characterized in that: The surface of the sliding block (59) is rotatably connected to a first rotatable support block (511), the gear (54) is rotatably connected to the surface of the first support plate (45), and the gear (54) is meshingly connected to a gear belt (55).

7. A novel half-wafer cleaning device according to claim 6, characterized in that: The scraper mechanism (6) comprises a second support plate (61), the second support plate (61) being fixedly connected to the top of the support beam (44), a second motor (62) being fixedly connected to the surface of the second support plate (61), a belt (63) being rotatably connected to the interior of the second motor (62) via an output shaft, a scraper (64) being fixedly connected to the surface of the belt (63), and a baffle (65) being fixedly connected to the interior of the cleaning box (2).

8. A novel half-wafer cleaning method, implemented using the novel half-wafer cleaning device according to claim 7, characterized in that: S1, moving the silicon wafer downward from the position of the first rotating support block (511), so that the silicon wafer is fixed inside the first fixed block (57); S2, controlling and starting the telescopic machine (41), wherein the starting of the telescopic machine (41) drives the sliding support plate (43) to move downward so as to immerse the silicon wafer in the cutting fluid in the cleaning box (2); S3, controlling the micro-nano bubble generating device to work, and then starting the first motor (51), after the first motor (51) is started, the bearing block (56) is driven to rotate, and finally the silicon wafer is tilted at a certain angle; S4, controlling and starting the second motor (62), after the second motor (62) is started, drives the scraper (64) on the surface of the belt (63) to promptly sweep the impurities generated by cleaning into the side groove of the cleaning box (2), thereby finally achieving the cleaning of the semiconductor silicon wafer.

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